US20140070173A1 - Cuttable organic light emitting diode light source device with wireless power transmission - Google Patents
Cuttable organic light emitting diode light source device with wireless power transmission Download PDFInfo
- Publication number
- US20140070173A1 US20140070173A1 US13/707,269 US201213707269A US2014070173A1 US 20140070173 A1 US20140070173 A1 US 20140070173A1 US 201213707269 A US201213707269 A US 201213707269A US 2014070173 A1 US2014070173 A1 US 2014070173A1
- Authority
- US
- United States
- Prior art keywords
- oled
- light source
- electrode layer
- disposed
- cuttable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/221—Static displays, e.g. displaying permanent logos
-
- H01L51/50—
-
- H01L33/08—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/19—Tandem OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
Definitions
- the present disclosure relates to light source devices, and, more particularly, to a cuttable organic light emitting diode (OLED) light source device with wireless power transmission.
- OLED organic light emitting diode
- OLED Organic light emitting diode
- a polymer organic thin film of semiconductor material properties can be used as the transport layers for electrons and holes and the light-emitting layer for electron-hole recombination.
- OLEDs are usually made from the thin-film process, while light emitting diodes (LEDs) require complicated epitaxial process to produce P- and N-type electron and hole transport layers. Accordingly, only rigid opaque substrates (e.g., gallium arsenide, silicon carbide (SiC) or sapphire) can be chosen as the substrate material of the LEDs.
- the substrates of OLEDs can also be selected from transparent glass substrates, and even extended to flexible plastic substrates.
- the OLEDs are self-luminous, and therefore do not require a backlight module and a color filter. This can further reduce the thickness of the diode modules.
- special characteristics such as high color rendering and full spectrum have made OLEDs the focus of attention for the next generation of lighting technology.
- OLED lighting devices have fixed specifications, such as fixed sizes and shapes.
- Light source devices with fixed specifications meet users's needs under certain circumstances, such as in certain corner regions of buildings or spaces with special shapes, or under circumstances in which flexible changes based on indoor spaces are needed. Therefore, the existing lighting equipment cannot provide enough flexibility in the product form factors, resulting in lighting design or application must accommodate the specifications of the existing lighting equipment.
- the present disclosure provides a cuttable organic light emitting diode (OLED) light source device with wireless power transmission, which includes: a lower substrate; a plurality of OLED modules disposed on the lower substrate and arranged in a matrix, each of the OLED modules including a first electrode layer disposed on the lower substrate, an OLED chip disposed on the first electrode layer, a second electrode layer disposed on the OLED chip, and a sensing electrode electrically connected to the first electrode layer or the second electrode layer for sensing an external magnetic field to provide power to the OLED modules; and an upper substrate disposed on the OLED modules and the sensing electrodes.
- OLED organic light emitting diode
- each of the OLED modules includes a package frame structure such that the OLED module has an independent package boundary, so that the service life of each OLED module is not affected after cutting.
- the present disclosure also provides a cuttable OLED light source device with wireless power transmission, which includes: a lower substrate; a plurality of OLED modules disposed on the lower substrate and arranged in a matrix, each of the OLED modules including a first electrode layer disposed on the lower substrate, a first color OLED chip disposed on the first electrode layer, a second electrode layer disposed on the first color OLED chip, a second color OLED chip disposed on the first electrode layer; a third electrode layer disposed on the second color OLED chip, a third color OLED chip disposed on the first electrode layer, a fourth electrode layer disposed on the third color OLED chip, and three sensing electrodes electrically connected to the second electrode layer, the third electrode layer, and the fourth electrode layer for sensing an external magnetic field to provide power to the first color OLED chip, the second color OLED chip, and the third color OLED chip, respectively; and an upper substrate disposed on the OLED modules and the sensing electrodes.
- each of the OLED modules includes a package frame structure such that each OLED module has an independent package boundary, so that the service life of each OLED module is not affected after cutting.
- the present disclosure further provides a cuttable OLED light source device with wireless power transmission, which includes: a lower substrate; a plurality of light source layers disposed on the lower substrate and stacked on one another in a direction perpendicular to a surface of the lower substrate, wherein each of the light source layers includes a plurality of OLED modules arranged in a matrix, and each of the OLED modules includes a first electrode layer disposed on the lower substrate, an OLED chip disposed on the first electrode layer, and a second electrode layer disposed on the OLED chip; a partition substrate disposed between the light source layers to separate and connect adjacent light source layers; a plurality of sensing electrodes disposed on respective OLED modules and electrically connected to the first electrode layer or the second electrode layer for sensing an external magnetic field to provide power to the OLED modules; and an upper substrate joined on top of the plurality of OLED modules and the sensing electrodes.
- each of the OLED modules includes a package frame structure such that the OLED module has an independent package boundary, so that the service life of each OLED module is not affected after cutting.
- FIG. 1A is a schematic diagram depicting a top view of a cuttable OLED light source device with wireless power transmission in accordance with an embodiment of the present disclosure
- FIG. 1B is a cross-sectional schematic diagram along a line A-A′ shown in FIG. 1A ;
- FIGS. 1C to 1E are schematic diagrams illustrating the arrangement of matrices of the cuttable OLED light source device with wireless power transmission in accordance with an embodiment of the present disclosure
- FIGS. 1F to 1H are cross-sectional schematic diagram depicting the cuttable OLED light source device with wireless power transmission of the present disclosure
- FIGS. 1I to 1L are schematic diagrams depicting cutting of the cuttable OLED light source device with wireless power transmission of the present disclosure
- FIG. 1M is a schematic diagram illustrating cutting of the cuttable OLED light source device with wireless power transmission of the present disclosure
- FIG. 2A is a schematic diagram depicting a top view of a cuttable OLED light source device with wireless power transmission in accordance with another embodiment of the present disclosure
- FIG. 2B is a cross-sectional schematic diagram along a line B-B′ shown in FIG. 2A ;
- FIGS. 2C to 2E are schematic diagrams illustrating the arrangement of matrices of the cuttable OLED light source device with wireless power transmission in accordance with an embodiment of the present disclosure.
- FIGS. 3A to 3E are cross-sectional schematic diagrams illustrating a cuttable OLED light source device with wireless power transmission in accordance with still another embodiment of the present disclosure.
- FIG. 1A is a schematic diagram depicting a top view of a cuttable organic light emitting diode (OLED) light source device 1 with wireless power transmission in accordance with a first embodiment of the present disclosure
- FIG. 1B is a cross-sectional schematic diagram along a line A-A′ shown in FIG. 1A .
- the cuttable OLED light source device 1 includes a lower substrate 10 , a plurality of OLED modules 11 , a plurality of sensing electrodes 14 , and an upper substrate 13 .
- the OLED modules 11 are disposed on the lower substrate 10 and are arranged in a matrix.
- Each of the OLED modules 11 includes a first electrode layer 111 disposed on the lower substrate 10 , an OLED chip 112 disposed on the first electrode layer 111 , and a second electrode layer 113 disposed on the OLED chip 112 .
- the cuttable OLED light source device 1 is arranged in other types of matrices, such as those shown in FIGS. 1C to 1E .
- the OLED chip 112 is disposed by sequentially stacking an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, and a hole injection layer together.
- the first electrode layer 111 can be used as the cathode for the OLED modules 11
- the second electrode layer 113 can be used as the anode for the OLED modules 11 .
- Each of the OLED modules 11 may further include a package frame structure 114 so that the OLED module 11 can have an independent package boundary.
- the package frame structure 114 is made of an UV-cured encapsulant or sealant.
- the UV-cured encapsulant or sealant can further bond the lower substrate 10 and the upper substrate 13 .
- the sensing electrodes 14 are disposed on respective OLED modules 11 and electrically connected to the second electrode layer 113 for sensing an external magnetic field 15 in order to provide power to the OLED modules 11 .
- the sensing electrodes 14 are ring-shaped, dot-shaped or lattice-like sensing electrodes, and are made of metals, such as aluminum, copper, gold, silver, iron, cobalt, nickel, titanium, tantalum, molybdenum, platinum, or zinc, or other transparent conductive materials, such as, indium tin oxide (ITO), fluorine-doped tin oxide (FTO), indium zinc oxide (IZO), aluminum doped zinc oxide (AZO) or other types of transparent conductive oxide (TCO).
- ITO indium tin oxide
- FTO fluorine-doped tin oxide
- IZO indium zinc oxide
- AZO aluminum doped zinc oxide
- TCO transparent conductive oxide
- the present disclosure is not limited to these, but can use any materials and shapes of sensing electrodes for wireless power provision.
- the sensing electrodes 14 can be disposed on respective OLED modules 11 and electrically connected to the first electrode layer 111 .
- the cuttable OLED light source device 1 further includes an insulating layer 16 .
- the insulating layer 16 is disposed between the sensing electrodes 14 and the first electrode layer 111 or the second electrode layer 113 , so as to insulate the first electrode layer 111 from the second electrode layer 113 when the sensing electrodes 14 and the first electrode layer 11 or the second electrode layer 113 are made of the same material, so as to increase the electrical characteristics.
- At least one of the upper substrate 13 and the lower substrate 10 is made of glass or plastic, and may have a water-repellent layer and a gas barrier layer, wherein the water-repellent layer and the gas barrier layer may be an aluminum oxide layer (Al 2 O 3 ) deposited by Atomic Layer Deposition (ALD) method.
- Al 2 O 3 aluminum oxide layer
- ALD Atomic Layer Deposition
- At least one of the upper substrate 13 and the lower substrate 10 has cutting lines C thereon.
- the cutting lines C are disposed on the upper substrate 13 and/or lower substrate 10 and correspond in position to the peripheries of the OLED modules 11 and are used as the baseline for cutting.
- the cuttable OLED light source device 1 can be cut arbitrarily along the cutting lines C.
- each of the OLED modules 11 has to be miniaturized to have a smaller area. With this, the tolerance of cutting error also becomes narrower, such that at the time of cutting, some of the OLED modules 11 may be inevitably damaged at the cutting borders. However, the size of the OLED modules 11 has been reduced to an extent that damage to some of the OLED modules 11 is not noticeable to the human eyes, and therefore has no impact on the overall light emitting effect and appearance.
- FIG. 2A is a schematic diagram depicting a top view of a cuttable OLED light source device 2 with wireless power transmission in accordance with a second embodiment of the present disclosure
- FIG. 2B is a cross-sectional schematic diagram along a line B-B′ shown in FIG. 2A
- the cuttable OLED light source device 2 includes the lower substrate 10 , a plurality of OLED modules 11 ′, three sensing electrodes 14 ′, and the upper substrate 13 .
- the second embodiment differs from the first embodiment in that each of the OLED modules 11 ′ includes a first electrode layer 111 ′, a first color OLED chip 112 R, a second color OLED chip 112 G, and a third color OLED chip 112 B.
- the first electrode layer 111 ′ is disposed on the lower substrate 10 .
- the first color OLED chip 112 R is disposed on the first electrode layer 111 ′.
- the second electrode layer 113 ′ is disposed on the first color OLED chip 112 R.
- the second color OLED chip 112 G is disposed on the first electrode layer 111 ′.
- the third electrode layer 115 ′ is disposed on the second color OLED chip 112 E
- the third color OLED chip 112 B is disposed on the first electrode layer 111 ′.
- the fourth electrode layer 116 ′ is disposed on the third color OLED chip 112 B.
- the three sensing electrodes 14 ′ are electrically connected to the second electrode layer 113 ′, the third electrode layer 115 ′, and the fourth electrode layer 116 ′ for sensing an external magnetic field to provide power to the first color OLED chip 112 R, the second color OLED chip 112 G, and the third color OLED chip 112 B, respectively.
- three insulating layers are disposed between the three sensing electrodes 14 ′ and the second electrode layer 113 ′, the third electrode layer 115 ′, and the fourth electrode layer 116 ′, respectively, similar to the first embodiment.
- the first color OLED chip 112 R, the second color OLED chip 112 G, and the third color OLED chip 112 B are a red OLED chip, a green OLED chip, and a blue OLED chip, respectively.
- the OLED module 11 ′ can emit three colors of light, including red light, blue light, and green light, and the intensities of these lights can be individually controlled so that the light emitting module exhibit different shades and color temperatures, wherein the red, green, and blue OLED chips are each disposed by sequentially stacking an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer and a hole injection layer together.
- the electron injection layer of the red OLED chip 112 R is joined with the first electrode layer 111 ′, and the hole injection layer is joined with the second electrode layer 113 ′.
- the electron injection layer of the green OLED chip 112 G is joined with the first electrode layer 111 ′, and the hole injection layer is joined with the third electrode layer 115 ′.
- the electron injection layer of the blue OLED chip 112 B is joined with the first electrode layer 111 ′, and the hole injection layer is joined with the fourth electrode layer 116 ′.
- the cuttable OLED light source device 2 of the second embodiment can be arranged in other types of matrices, such as those shown in FIGS. 2C to 2 E.
- FIG. 3A is a schematic diagram depicting a cross-sectional view of a cuttable OLED light source device 3 with wireless power transmission in accordance with a third embodiment of the present disclosure.
- the cuttable OLED light source device 3 includes the lower substrate 10 , a plurality of light source layers 18 , a partition substrate 17 , the plurality of sensing electrodes 14 , and the upper substrate 13 .
- the third embodiment differs from the first embodiment in that the light source layers 18 are disposed on the lower substrate 10 and are stacked on one another in a direction perpendicular to the surface of the lower substrate 10 .
- Each of the light source layers 18 has the plurality of OLED modules 11 arranged in a matrix, and the partition substrate 17 is disposed between the light source layers 18 to divide and connect adjacent light source layers 18 .
- the OLED modules 11 in the light source layers 18 are in the same or different matrix arrangement and have the same or different shape and size.
- the OLED modules 11 in different light source layers 18 or the OLED modules 11 in some light source layers 18 can be driven by the frequency, the magnitude and the direction of the wireless sensing, such that they exhibit one, two or more types of colors, shapes and distribution densities, so the overall cuttable OLED light source device with wireless power transmission 3 may present different kinds of visual effects (e.g., color, grayscale, etc.).
- the cuttable OLED light source device with wireless power transmission of the present disclosure utilizes the design of sensing electrodes to enable the OLED light source device to be arbitrarily cut into shapes, while preventing the OLED modules from being damaged due to the ingress of moisture, thereby significantly improving the designs and application range of the OLED light source device.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Led Devices (AREA)
Abstract
Description
- This application claimed priority to Taiwanese Patent Application No. 101132670, filed on Sep. 7, 2012. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- 1. Technical Field
- The present disclosure relates to light source devices, and, more particularly, to a cuttable organic light emitting diode (OLED) light source device with wireless power transmission.
- 2. Description of Related Art
- Organic light emitting diode (OLED) releases energy in the form of light through the electron-hole recombination process between the conduction band and the valence band. Therefore, a polymer organic thin film of semiconductor material properties can be used as the transport layers for electrons and holes and the light-emitting layer for electron-hole recombination. OLEDs are usually made from the thin-film process, while light emitting diodes (LEDs) require complicated epitaxial process to produce P- and N-type electron and hole transport layers. Accordingly, only rigid opaque substrates (e.g., gallium arsenide, silicon carbide (SiC) or sapphire) can be chosen as the substrate material of the LEDs. In addition to the generally opaque rigid substrates, the substrates of OLEDs can also be selected from transparent glass substrates, and even extended to flexible plastic substrates. In addition, the OLEDs are self-luminous, and therefore do not require a backlight module and a color filter. This can further reduce the thickness of the diode modules. In addition to being thin and flexible and with low glare, special characteristics such as high color rendering and full spectrum have made OLEDs the focus of attention for the next generation of lighting technology.
- However, most of the OLED lighting devices have fixed specifications, such as fixed sizes and shapes. Light source devices with fixed specifications meet users's needs under certain circumstances, such as in certain corner regions of buildings or spaces with special shapes, or under circumstances in which flexible changes based on indoor spaces are needed. Therefore, the existing lighting equipment cannot provide enough flexibility in the product form factors, resulting in lighting design or application must accommodate the specifications of the existing lighting equipment.
- The present disclosure provides a cuttable organic light emitting diode (OLED) light source device with wireless power transmission, which includes: a lower substrate; a plurality of OLED modules disposed on the lower substrate and arranged in a matrix, each of the OLED modules including a first electrode layer disposed on the lower substrate, an OLED chip disposed on the first electrode layer, a second electrode layer disposed on the OLED chip, and a sensing electrode electrically connected to the first electrode layer or the second electrode layer for sensing an external magnetic field to provide power to the OLED modules; and an upper substrate disposed on the OLED modules and the sensing electrodes.
- In an embodiment, each of the OLED modules includes a package frame structure such that the OLED module has an independent package boundary, so that the service life of each OLED module is not affected after cutting.
- The present disclosure also provides a cuttable OLED light source device with wireless power transmission, which includes: a lower substrate; a plurality of OLED modules disposed on the lower substrate and arranged in a matrix, each of the OLED modules including a first electrode layer disposed on the lower substrate, a first color OLED chip disposed on the first electrode layer, a second electrode layer disposed on the first color OLED chip, a second color OLED chip disposed on the first electrode layer; a third electrode layer disposed on the second color OLED chip, a third color OLED chip disposed on the first electrode layer, a fourth electrode layer disposed on the third color OLED chip, and three sensing electrodes electrically connected to the second electrode layer, the third electrode layer, and the fourth electrode layer for sensing an external magnetic field to provide power to the first color OLED chip, the second color OLED chip, and the third color OLED chip, respectively; and an upper substrate disposed on the OLED modules and the sensing electrodes.
- In an embodiment, each of the OLED modules includes a package frame structure such that each OLED module has an independent package boundary, so that the service life of each OLED module is not affected after cutting.
- The present disclosure further provides a cuttable OLED light source device with wireless power transmission, which includes: a lower substrate; a plurality of light source layers disposed on the lower substrate and stacked on one another in a direction perpendicular to a surface of the lower substrate, wherein each of the light source layers includes a plurality of OLED modules arranged in a matrix, and each of the OLED modules includes a first electrode layer disposed on the lower substrate, an OLED chip disposed on the first electrode layer, and a second electrode layer disposed on the OLED chip; a partition substrate disposed between the light source layers to separate and connect adjacent light source layers; a plurality of sensing electrodes disposed on respective OLED modules and electrically connected to the first electrode layer or the second electrode layer for sensing an external magnetic field to provide power to the OLED modules; and an upper substrate joined on top of the plurality of OLED modules and the sensing electrodes.
- In an embodiment, each of the OLED modules includes a package frame structure such that the OLED module has an independent package boundary, so that the service life of each OLED module is not affected after cutting.
- The present disclosure can be more fully understood by reading the following detailed description of the embodiments, with reference made to the accompanying drawings, wherein:
-
FIG. 1A is a schematic diagram depicting a top view of a cuttable OLED light source device with wireless power transmission in accordance with an embodiment of the present disclosure; -
FIG. 1B is a cross-sectional schematic diagram along a line A-A′ shown inFIG. 1A ; -
FIGS. 1C to 1E are schematic diagrams illustrating the arrangement of matrices of the cuttable OLED light source device with wireless power transmission in accordance with an embodiment of the present disclosure; -
FIGS. 1F to 1H are cross-sectional schematic diagram depicting the cuttable OLED light source device with wireless power transmission of the present disclosure; -
FIGS. 1I to 1L are schematic diagrams depicting cutting of the cuttable OLED light source device with wireless power transmission of the present disclosure; -
FIG. 1M is a schematic diagram illustrating cutting of the cuttable OLED light source device with wireless power transmission of the present disclosure; -
FIG. 2A is a schematic diagram depicting a top view of a cuttable OLED light source device with wireless power transmission in accordance with another embodiment of the present disclosure; -
FIG. 2B is a cross-sectional schematic diagram along a line B-B′ shown inFIG. 2A ; -
FIGS. 2C to 2E are schematic diagrams illustrating the arrangement of matrices of the cuttable OLED light source device with wireless power transmission in accordance with an embodiment of the present disclosure; and -
FIGS. 3A to 3E are cross-sectional schematic diagrams illustrating a cuttable OLED light source device with wireless power transmission in accordance with still another embodiment of the present disclosure. - In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a through understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
-
FIG. 1A is a schematic diagram depicting a top view of a cuttable organic light emitting diode (OLED) light source device 1 with wireless power transmission in accordance with a first embodiment of the present disclosure, andFIG. 1B is a cross-sectional schematic diagram along a line A-A′ shown inFIG. 1A . The cuttable OLED light source device 1 includes alower substrate 10, a plurality ofOLED modules 11, a plurality ofsensing electrodes 14, and anupper substrate 13. - The
OLED modules 11 are disposed on thelower substrate 10 and are arranged in a matrix. Each of theOLED modules 11 includes afirst electrode layer 111 disposed on thelower substrate 10, anOLED chip 112 disposed on thefirst electrode layer 111, and asecond electrode layer 113 disposed on theOLED chip 112. - In an embodiment, the cuttable OLED light source device 1 is arranged in other types of matrices, such as those shown in
FIGS. 1C to 1E . - In an embodiment, the
OLED chip 112 is disposed by sequentially stacking an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, and a hole injection layer together. - The
first electrode layer 111 can be used as the cathode for theOLED modules 11, and thesecond electrode layer 113 can be used as the anode for theOLED modules 11. - Each of the
OLED modules 11 may further include apackage frame structure 114 so that theOLED module 11 can have an independent package boundary. In an embodiment, thepackage frame structure 114 is made of an UV-cured encapsulant or sealant. In addition, the UV-cured encapsulant or sealant can further bond thelower substrate 10 and theupper substrate 13. - The
sensing electrodes 14 are disposed onrespective OLED modules 11 and electrically connected to thesecond electrode layer 113 for sensing an externalmagnetic field 15 in order to provide power to theOLED modules 11. - In an embodiment, the
sensing electrodes 14 are ring-shaped, dot-shaped or lattice-like sensing electrodes, and are made of metals, such as aluminum, copper, gold, silver, iron, cobalt, nickel, titanium, tantalum, molybdenum, platinum, or zinc, or other transparent conductive materials, such as, indium tin oxide (ITO), fluorine-doped tin oxide (FTO), indium zinc oxide (IZO), aluminum doped zinc oxide (AZO) or other types of transparent conductive oxide (TCO). The present disclosure is not limited to these, but can use any materials and shapes of sensing electrodes for wireless power provision. - In another embodiment, as shown in
FIG. 1F , thesensing electrodes 14 can be disposed onrespective OLED modules 11 and electrically connected to thefirst electrode layer 111. - In still another embodiment, as shown in
FIG. 1G and 1H , the cuttable OLED light source device 1 further includes an insulatinglayer 16. The insulatinglayer 16 is disposed between thesensing electrodes 14 and thefirst electrode layer 111 or thesecond electrode layer 113, so as to insulate thefirst electrode layer 111 from thesecond electrode layer 113 when thesensing electrodes 14 and thefirst electrode layer 11 or thesecond electrode layer 113 are made of the same material, so as to increase the electrical characteristics. - In an embodiment, at least one of the
upper substrate 13 and thelower substrate 10 is made of glass or plastic, and may have a water-repellent layer and a gas barrier layer, wherein the water-repellent layer and the gas barrier layer may be an aluminum oxide layer (Al2O3) deposited by Atomic Layer Deposition (ALD) method. - In an embodiment, at least one of the
upper substrate 13 and thelower substrate 10 has cutting lines C thereon. The cutting lines C are disposed on theupper substrate 13 and/orlower substrate 10 and correspond in position to the peripheries of theOLED modules 11 and are used as the baseline for cutting. - As shown in
FIGS. 1I to 1L , the cuttable OLED light source device 1 can be cut arbitrarily along the cutting lines C. - As shown in
FIG. 1M , if a finer pattern is to be cut out, each of theOLED modules 11 has to be miniaturized to have a smaller area. With this, the tolerance of cutting error also becomes narrower, such that at the time of cutting, some of theOLED modules 11 may be inevitably damaged at the cutting borders. However, the size of theOLED modules 11 has been reduced to an extent that damage to some of theOLED modules 11 is not noticeable to the human eyes, and therefore has no impact on the overall light emitting effect and appearance. -
FIG. 2A is a schematic diagram depicting a top view of a cuttable OLED light source device 2 with wireless power transmission in accordance with a second embodiment of the present disclosure, andFIG. 2B is a cross-sectional schematic diagram along a line B-B′ shown inFIG. 2A . The cuttable OLED light source device 2 includes thelower substrate 10, a plurality ofOLED modules 11′, threesensing electrodes 14′, and theupper substrate 13. The second embodiment differs from the first embodiment in that each of theOLED modules 11′ includes afirst electrode layer 111′, a firstcolor OLED chip 112R, a secondcolor OLED chip 112G, and a thirdcolor OLED chip 112B. - The
first electrode layer 111′ is disposed on thelower substrate 10. The firstcolor OLED chip 112R is disposed on thefirst electrode layer 111′. Thesecond electrode layer 113′ is disposed on the firstcolor OLED chip 112R. The secondcolor OLED chip 112G is disposed on thefirst electrode layer 111′. Thethird electrode layer 115′ is disposed on the second color OLED chip 112E The thirdcolor OLED chip 112B is disposed on thefirst electrode layer 111′. Thefourth electrode layer 116′ is disposed on the thirdcolor OLED chip 112B. The threesensing electrodes 14′ are electrically connected to thesecond electrode layer 113′, thethird electrode layer 115′, and thefourth electrode layer 116′ for sensing an external magnetic field to provide power to the firstcolor OLED chip 112R, the secondcolor OLED chip 112G, and the thirdcolor OLED chip 112B, respectively. - In an embodiment, three insulating layers are disposed between the three
sensing electrodes 14′ and thesecond electrode layer 113′, thethird electrode layer 115′, and thefourth electrode layer 116′, respectively, similar to the first embodiment. - In an embodiment, the first
color OLED chip 112R, the secondcolor OLED chip 112G, and the thirdcolor OLED chip 112B are a red OLED chip, a green OLED chip, and a blue OLED chip, respectively. - In an embodiment, the
OLED module 11′ can emit three colors of light, including red light, blue light, and green light, and the intensities of these lights can be individually controlled so that the light emitting module exhibit different shades and color temperatures, wherein the red, green, and blue OLED chips are each disposed by sequentially stacking an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer and a hole injection layer together. The electron injection layer of thered OLED chip 112R is joined with thefirst electrode layer 111′, and the hole injection layer is joined with thesecond electrode layer 113′. The electron injection layer of thegreen OLED chip 112G is joined with thefirst electrode layer 111′, and the hole injection layer is joined with thethird electrode layer 115′. The electron injection layer of theblue OLED chip 112B is joined with thefirst electrode layer 111′, and the hole injection layer is joined with thefourth electrode layer 116′. - Similar to the first embodiment, the cuttable OLED light source device 2 of the second embodiment can be arranged in other types of matrices, such as those shown in
FIGS. 2C to 2E. -
FIG. 3A is a schematic diagram depicting a cross-sectional view of a cuttable OLEDlight source device 3 with wireless power transmission in accordance with a third embodiment of the present disclosure. The cuttable OLEDlight source device 3 includes thelower substrate 10, a plurality of light source layers 18, apartition substrate 17, the plurality ofsensing electrodes 14, and theupper substrate 13. The third embodiment differs from the first embodiment in that the light source layers 18 are disposed on thelower substrate 10 and are stacked on one another in a direction perpendicular to the surface of thelower substrate 10. Each of the light source layers 18 has the plurality ofOLED modules 11 arranged in a matrix, and thepartition substrate 17 is disposed between the light source layers 18 to divide and connect adjacent light source layers 18. - In an embodiment, as shown in
FIGS. 3B to 3E , theOLED modules 11 in the light source layers 18 are in the same or different matrix arrangement and have the same or different shape and size. TheOLED modules 11 in different light source layers 18 or theOLED modules 11 in some light source layers 18 can be driven by the frequency, the magnitude and the direction of the wireless sensing, such that they exhibit one, two or more types of colors, shapes and distribution densities, so the overall cuttable OLED light source device withwireless power transmission 3 may present different kinds of visual effects (e.g., color, grayscale, etc.). - In summary, the cuttable OLED light source device with wireless power transmission of the present disclosure utilizes the design of sensing electrodes to enable the OLED light source device to be arbitrarily cut into shapes, while preventing the OLED modules from being damaged due to the ingress of moisture, thereby significantly improving the designs and application range of the OLED light source device.
Claims (20)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101132670 | 2012-09-07 | ||
| TW101132670A TW201411903A (en) | 2012-09-07 | 2012-09-07 | Cuttable organic light emitting diode light source device for wireless power transmission |
| TW101132670A | 2012-09-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20140070173A1 true US20140070173A1 (en) | 2014-03-13 |
| US8680519B1 US8680519B1 (en) | 2014-03-25 |
Family
ID=50232311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/707,269 Active US8680519B1 (en) | 2012-09-07 | 2012-12-06 | Cuttable organic light emitting diode light source device with wireless power transmission |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8680519B1 (en) |
| CN (1) | CN103681732B (en) |
| TW (1) | TW201411903A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017123235A (en) * | 2016-01-05 | 2017-07-13 | 住友化学株式会社 | Mother substrate, and method for manufacturing illuminating device |
| CN110190090A (en) * | 2019-05-15 | 2019-08-30 | 武汉华星光电半导体显示技术有限公司 | OLED encapsulating structure and display panel |
| CN113630926A (en) * | 2020-05-07 | 2021-11-09 | 固安翌光科技有限公司 | Organic electroluminescent screen and preparation method thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105336828A (en) * | 2014-08-06 | 2016-02-17 | 山东浪潮华光光电子股份有限公司 | LED light-emitting diode applied to electromagnetically induced luminescence and preparation method of LED light-emitting diode |
| CN105576089B (en) * | 2016-01-18 | 2019-04-23 | 华南师范大学 | Magnetic induction LED chip and preparation method thereof |
| US10117305B2 (en) | 2016-05-09 | 2018-10-30 | Industrial Technology Research Institute | Driving system and method for planar organic electroluminescent device |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7576496B2 (en) | 1999-12-22 | 2009-08-18 | General Electric Company | AC powered OLED device |
| US20020190661A1 (en) | 2000-01-27 | 2002-12-19 | General Electric Company | AC powered oled device |
| US6605903B2 (en) | 2000-11-30 | 2003-08-12 | Intel Corporation | Selectively activating display column sections |
| US6791114B2 (en) | 2001-07-12 | 2004-09-14 | Intel Corporation | Fused passive organic light emitting displays |
| JP4473472B2 (en) * | 2001-08-13 | 2010-06-02 | パイオニア株式会社 | Electrostatic induction driven organic electroluminescence display panel |
| TW516248B (en) * | 2001-12-21 | 2003-01-01 | Epitech Technology Corp | Nitride light emitting diode with spiral-shaped metal electrode |
| US7034470B2 (en) | 2002-08-07 | 2006-04-25 | Eastman Kodak Company | Serially connecting OLED devices for area illumination |
| US6870196B2 (en) | 2003-03-19 | 2005-03-22 | Eastman Kodak Company | Series/parallel OLED light source |
| US7012585B2 (en) | 2004-02-06 | 2006-03-14 | Eastman Kodak Company | OLED apparatus having improved fault tolerance |
| US7294961B2 (en) * | 2004-03-29 | 2007-11-13 | Articulated Technologies, Llc | Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix |
| US7288753B2 (en) | 2004-05-05 | 2007-10-30 | Eastman Kodak Company | OLED display with composite photosensor |
| EP2299782B1 (en) | 2004-09-13 | 2016-11-23 | Semiconductor Energy Laboratory Co, Ltd. | Light emitting layer device |
| US20060105493A1 (en) * | 2004-11-15 | 2006-05-18 | Osram Opto Semiconductors Gmbh | Encapsulation of organic devices |
| TW200730004A (en) | 2006-01-19 | 2007-08-01 | Ching-Wu Wang | Planar white light organic light-emitting diode lighting panel device |
| JP5670888B2 (en) * | 2008-06-17 | 2015-02-18 | コーニンクレッカ フィリップス エヌ ヴェ | Light-emitting device for AC drive |
| US8841549B2 (en) * | 2008-10-08 | 2014-09-23 | University Of Utah Research Foundation | Organic spintronic devices and methods for making the same |
| EP2453486A2 (en) * | 2009-07-10 | 2012-05-16 | Industrial Technology Research Institute | Light-emitting device and packaging structure thereof |
| TWI488542B (en) | 2009-07-17 | 2015-06-11 | Au Optronics Corp | Light-emitting element and repairing method thereof |
| CN102484122B (en) * | 2009-09-07 | 2015-05-13 | 皇家飞利浦电子股份有限公司 | Electroluminescent devices, lighting equipment and lighting systems |
| EP2487991A4 (en) * | 2009-10-09 | 2013-04-03 | Idemitsu Kosan Co | ORGANIC ELECTROLUMINESCENT ELEMENT |
| US8115383B2 (en) | 2009-10-29 | 2012-02-14 | Global Oled Technology Llc | Electroluminescent area illumination with integrated mechanical switch |
| US8698166B2 (en) * | 2010-07-16 | 2014-04-15 | Industrial Technology Research Institute | Light emitting chip package module and light emitting chip package structure and manufacturing method thereof |
| JP5016712B2 (en) * | 2010-09-21 | 2012-09-05 | 三井金属鉱業株式会社 | Electrode foil and organic device |
| US8927308B2 (en) | 2011-05-12 | 2015-01-06 | Universal Display Corporation | Method of forming bus line designs for large-area OLED lighting |
| KR20130000218A (en) * | 2011-06-22 | 2013-01-02 | 삼성디스플레이 주식회사 | Electrode including magnetic material and organic light emitting device using the electrode |
-
2012
- 2012-09-07 TW TW101132670A patent/TW201411903A/en unknown
- 2012-10-26 CN CN201210414593.7A patent/CN103681732B/en active Active
- 2012-12-06 US US13/707,269 patent/US8680519B1/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017123235A (en) * | 2016-01-05 | 2017-07-13 | 住友化学株式会社 | Mother substrate, and method for manufacturing illuminating device |
| WO2017119178A1 (en) * | 2016-01-05 | 2017-07-13 | 住友化学株式会社 | Mother board, and method for manufacturing lighting device |
| CN110190090A (en) * | 2019-05-15 | 2019-08-30 | 武汉华星光电半导体显示技术有限公司 | OLED encapsulating structure and display panel |
| WO2020228127A1 (en) * | 2019-05-15 | 2020-11-19 | 武汉华星光电半导体显示技术有限公司 | Oled packaging structure and display panel |
| CN113630926A (en) * | 2020-05-07 | 2021-11-09 | 固安翌光科技有限公司 | Organic electroluminescent screen and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103681732A (en) | 2014-03-26 |
| CN103681732B (en) | 2016-04-20 |
| TW201411903A (en) | 2014-03-16 |
| US8680519B1 (en) | 2014-03-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105247701B (en) | Organic luminescent device and preparation method thereof | |
| EP3190624B1 (en) | Display panel, manufacturing method thereof, and display device | |
| US8680519B1 (en) | Cuttable organic light emitting diode light source device with wireless power transmission | |
| US20060232992A1 (en) | Circuit arrangement for ac driving of organic diodes | |
| US8710522B2 (en) | Organic light emitting diode light source device | |
| TWI524515B (en) | Photovoltaic device array | |
| US8692457B2 (en) | Large area light emitting electrical package with current spreading bus | |
| KR20130135183A (en) | Organic light emitting device and method for preparing the same | |
| KR102652261B1 (en) | Lighting apparatus using organic light emitting diode | |
| US10418571B2 (en) | Lighting apparatus using organic light emitting device and method of fabricating thereof | |
| US11239281B2 (en) | Lighting apparatus | |
| US20230034282A1 (en) | Oled panel for lighting device with moisture intrusion delay effect | |
| KR20160113732A (en) | Light-emitting component and method for producing a light-emitting component | |
| RU2603434C2 (en) | Improved masking for patterns on light-emitting devices | |
| KR102516699B1 (en) | Oled panel for lighting device and method of manufacturing the same | |
| KR20130102798A (en) | An assembly comprising aa light emitting module and a manufacturing method thereof | |
| US20160181326A1 (en) | Radiation-Emitting Apparatus and Method for Producing Same | |
| US10797262B2 (en) | Organic-based lighting device | |
| KR20130135188A (en) | Organic light emitting device and method for preparing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, MING-CHUNG;LI, JUNG-YU;LIN, YI-PING;AND OTHERS;REEL/FRAME:029421/0477 Effective date: 20121203 |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
| MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551) Year of fee payment: 4 |
|
| MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |
|
| FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |