[go: up one dir, main page]

US20130219947A1 - Heat-exchanged cabinet structure - Google Patents

Heat-exchanged cabinet structure Download PDF

Info

Publication number
US20130219947A1
US20130219947A1 US13/753,090 US201313753090A US2013219947A1 US 20130219947 A1 US20130219947 A1 US 20130219947A1 US 201313753090 A US201313753090 A US 201313753090A US 2013219947 A1 US2013219947 A1 US 2013219947A1
Authority
US
United States
Prior art keywords
heat
heat exchanger
exchanged
exchanger device
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/753,090
Other languages
English (en)
Inventor
Ta-Jung Yang
Pi-Chen LIU
Shen-Feng Chan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHAN, SHEN-FENG, LIU, PI-CHEN, YANG, TA-JUNG
Publication of US20130219947A1 publication Critical patent/US20130219947A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20609—Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger

Definitions

  • the present invention relates to a heat-exchanged cabinet structure and, in particular, to a heat-exchanged cabinet structure with heat exchanger devices.
  • FIG. 1 is a schematic diagram showing a conventional heat-exchanged cabinet structure 1 , which includes a main body 11 and a heat exchanger device 12 .
  • the heat-exchanged cabinet structure 1 is used to carry an electronic equipment A.
  • the main body 11 has an accommodating space 111 , and the electronic equipment A is placed in the accommodating space 111 .
  • the heat exchanger device 12 is installed on the outer surface 112 of the main body 11 and connected to the main body 11 .
  • the heat exchanger device 12 of the heat-exchanged cabinet structure 1 Since the heat exchanger device 12 of the heat-exchanged cabinet structure 1 is installed on the outer surface 112 of the main body 11 , and it can directly contact the exterior environment, the heat exchanger device 12 fails to provide good heat dissipation and air cycling. Besides, the heat exchanger device 12 is easily interfered by the climatic and environmental factors, thereby resulting bad heat dissipation and thus causing the overheating and malfunction of the electronic equipment A. In addition, this configuration not only sufficiently enlarges the total size of the heat-exchanged cabinet structure 1 but also increases the manufacturing cost and time.
  • an objective of the present invention is to provide a heat-exchanged cabinet structure that can improve the air cycling so as to enhance the heat-dissipating performance and reduce the configuration space/size and manufacturing cost.
  • the present invention discloses a heat-exchanged cabinet structure, which is used to accommodate an electronic equipment.
  • the heat-exchanged cabinet structure includes a main body, a first heat exchanger device and a second heat exchanger device.
  • the main body has an accommodated space and a first housing, and the electronic equipment is disposed in the accommodated space.
  • the first heat exchanger device has a condenser and is disposed on the first housing and placed in the accommodated space.
  • the second heat exchanger device has an evaporator and is placed in the accommodated space and adjacent the first heat exchanger.
  • the present invention also discloses a heat-exchanged cabinet structure, which is used to accommodate an electronic equipment.
  • the heat-exchanged cabinet structure includes a main body, a first heat exchanger device and a second heat exchanger device.
  • the main body has an accommodated space, a first housing and a second housing.
  • the first housing is disposed opposite to the second housing, and the electronic equipment is disposed in the accommodated space.
  • the first heat exchanger device has a condenser and is disposed on the first housing and placed in the accommodated space.
  • the second heat exchanger device has an evaporator and is disposed on the second housing and placed in the accommodated space.
  • the present invention also discloses a heat-exchanged cabinet structure, which is used to accommodate an electronic equipment.
  • the main body has an accommodated space, a first housing and a second housing.
  • the first housing is connected to the second housing, and the electronic equipment is disposed in the accommodated space.
  • the first heat exchanger device has a condenser and is disposed on the first housing and placed in the accommodated space.
  • the second heat exchanger device has an evaporator, and is disposed on the second housing and placed in the accommodated space.
  • the first and second heat exchanger devices of the heat-exchanged cabinet structure are disposed in the accommodating space of the main body, and located corresponding to the electronic equipment.
  • the first and second heat exchanger devices have a condenser and an evaporator, respectively, for dissipating the heat generated by the electronic equipment, thereby enhancing the heat-dissipation performance of the heat-exchanged cabinet structure.
  • the installation positions of the first and second exchanger devices can be flexibly modified according to the dimension of the electronic equipment or the heat-exchanged cabinet structure.
  • the first and second exchanger devices are disposed on two opposite or connected housings of the heat-exchanged cabinet structure, respectively. These configurations can also increase the air cycling performance and thus improve the heat-dissipation performance.
  • FIG. 1 is a schematic diagram showing a conventional heat-exchanged cabinet structure
  • FIG. 2 is a schematic diagram showing a heat-exchanged cabinet structure according to a first embodiment of the present invention
  • FIG. 3 is a sectional side view of the heat-exchanged cabinet structure of FIG. 2 ;
  • FIG. 4 is a sectional side view of a heat-exchanged cabinet structure according to a second embodiment of the present invention.
  • FIG. 5 is a sectional side view of a heat-exchanged cabinet structure according to a third embodiment of the present invention.
  • FIG. 2 is a schematic diagram showing a heat-exchanged cabinet structure 2 according to a first embodiment of the present invention.
  • the heat-exchanged cabinet structure 2 is installed at outdoor or in the equipment room for carrying an electronic equipment A.
  • the electronic equipment A is, for example, an electronic communication equipment, a communication station or the likes.
  • the heat-exchanged cabinet structure 2 includes a main body 21 , a first heat exchanger device 22 , and a second heat exchanger device 23 .
  • the first heat exchanger device 22 , the second heat exchanger device 23 and the electronic equipment A are disposed in the main body 21 .
  • the heat-exchanged cabinet structure 2 may further include a heating device 24 and a control device 25 .
  • the heating device 24 is installed on the main body 21 and connected to the first exchanger device 22 or the second heat exchanger device 23 .
  • the control device 25 is connected to the heating device 24 for controlling the operation of the heating device 24 so as to adjust the temperature.
  • the main body 21 has an accommodated space 211 and a first housing 212 .
  • the first housing 212 can be a cap, a rear plate, a side plate, a top plate, or a bottom plate.
  • the first housing 212 is, for example but not limited to, a cap.
  • the electronic equipment A is disposed in the accommodated space 211 , so that the main body 21 can protect the electronic equipment A as well as the components thereof from being damped or damaged by the environment, corrosive gas or external force.
  • the first heat exchanger device 22 is disposed on the first housing 212 and placed in the accommodated space 211
  • the second heat exchanger device 23 is disposed adjacent to (stacked on) the first heat exchanger device 22 and also disposed in the accommodated space 211 .
  • the first heat exchanger device 22 and the second heat exchanger device 23 are all installed inside the main body 21 , so that they can directly perform the heat dissipation of the electronic equipment A. This configuration can reduce the environmental interference, enhance the air cycling and heat-dissipating performance, minimize the assembling dimension of the heat-exchanged cabinet structure 2 , and decrease the manufacturing cost.
  • FIG. 3 is a sectional side view of the heat-exchanged cabinet structure 2 of FIG. 2 .
  • the heating device 24 and the control device 25 are not shown in FIG. 3 for clearly illustrating other components, and the shown components may be not shown in the actual dimensions and are for illustrations only.
  • the first heat exchanger device 22 includes a condenser 221 , a pipe 222 and a fan 223
  • the second heat exchanger device 23 includes an evaporator 231 , a pipe 232 and a fan 233 .
  • the pipes 222 and 232 are connected to the condenser 221 and the evaporator 231 , respectively.
  • the pipe 222 is configured to transfer a fluid (e.g.
  • the pipe 232 is configured to transfer a fluid (e.g. a gas) from the evaporator 231 to the condenser 221 .
  • the lengths of the pipes 222 and 232 are not limited to this invention, and they can be adjusted based on the distance between the condenser 221 and the evaporator 231 .
  • the first heat exchanger device 22 has two pipes 222
  • the second heat exchanger device 23 has two pipes 232 .
  • the configurations of the pipes 222 and 232 are to improve the transmission efficiency of the fluid (liquid or gas) between the condenser 221 and the evaporator 231 .
  • the numbers of the pipes 222 and 232 are not limited to this invention, and they can be adjusted according to the dimensions of the first heat exchanger device 22 or the second heat exchanger device 23 .
  • the first heat exchanger device 22 includes two condensers
  • the second heat exchanger device 23 includes two evaporators, thereby enhancing the performance of heat dissipation and air cycling.
  • the numbers of the condensers and evaporators are not limited in the invention.
  • the fans 223 and 233 of this embodiment are centrifugal fans.
  • the fans 223 and 233 can be selected from other types of fans (e.g. axial flow fans, oblique flow fans, or cross flow fans) based on the positions thereof or the shapes and volumes of the heat-exchanged cabinet structure 2 .
  • the first heat exchanger device 22 and the second heat exchanger device 23 are individually configured, and they are separated by, for example, at least one partition and connected only through the pipes 222 and 232 , which connect the condenser 221 and the evaporator 231 .
  • the first heat exchanger device 22 and the second heat exchanger device 23 respectively include two fans 223 and two fans 233 for increasing the air input quantity.
  • the numbers of the fans 223 and 233 are not limited in this invention.
  • the heating device 24 is connected to at least one of the first heat exchanger device 22 and the second heat exchanger device 23 , and the control device 25 is connected to the heating device 24 .
  • the heating device 24 and the control device 25 are disposed in the first housing 212 .
  • the configurations and positions of the heating device 24 and the control device 25 are not limited in this invention. In other embodiments, the heating device 24 and the control device 25 may be disposed in the same housing or different housings.
  • the control device 25 can control the heating device 24 according to the climate or environmental temperature so as to adjust the temperatures of the first heat exchanger device 22 and the second heat exchanger device 23 . Accordingly, the second heat exchanger device 23 can output cold air to cool down the electronic equipment A.
  • the operation of the first heat exchanger device 22 and the second heat exchanger device 23 and the heat-dissipating process of the electronic equipment A will be described hereinafter with reference to FIG. 3 .
  • the fan 223 sucks the cold air C 1 from the outside into the first heat exchanger device 22 .
  • the cold air C 1 flows to the condenser 221 along the path P 1 in the first heat exchanger device 22 , and then the cold air C 1 carries the heat out from the condenser 221 to form a warm air W 1 , which is outputted through the output side S 1 .
  • the first housing 212 has an opening (not shown) disposed corresponding to the condenser 221 , so that the warm air W 1 can be outputted through the output side S 1 .
  • the condenser 221 can condense the fluid to liquid, and the liquid then flows to the evaporator 231 through the pipe 222 .
  • the fan 233 sucks the warm air W 2 generated by the electronic equipment A into the second heat exchanger device 23 .
  • the warm air W 2 flows to the evaporator 231 along the path P 2 in the second heat exchanger device 23 , and then the evaporator 231 can carry the heat from the warm air W 2 to form a cold air C 2 , which is outputted through the output side S 2 along a path P 2 .
  • the cold air C 2 is sent to the electronic equipment A for dissipating the heat generated by the electronic equipment A.
  • the liquid fluid flowing to the evaporator 231 is evaporated into gas fluid, which then flows to the condenser 221 through the pipe 232 .
  • the established gas cycling can dissipate the heat (generated by the electronic equipment A or the main body 21 ) carried by the warm air W 2 to the outside, thereby enhancing the heat-dissipation efficiency of the main body 21 .
  • the temperatures of the cold airs C 1 and C 2 and the warm airs W 1 and W 2 are not limited to this embodiment. The most important condition is to keep the temperature of the warm air W 1 from the first heat exchanger device 22 to be higher than the temperature of the cold air C 1 flowing into the first heat exchanger device 22 . Similarly, the temperature of the warm air W 2 flowing into the second heat exchanger device 23 to be higher than the temperature of the cold air C 2 from the second heat exchanger device 23 .
  • FIG. 4 is a sectional side view of a heat-exchanged cabinet structure 3 according to a second embodiment of the present invention.
  • the heat-exchanged cabinet structure 3 is installed at outdoor or in the equipment room for carrying an electronic equipment A.
  • the electronic equipment A is, for example, an electronic communication equipment, a network exchanger or a transformer apparatus.
  • the heat-exchanged cabinet structure 3 includes a main body 31 , a first heat exchanger device 32 , and a second heat exchanger device 33 .
  • the first heat exchanger device 32 , the second heat exchanger device 33 , and the electronic equipment A are disposed in the main body 31 .
  • the heat-exchanged cabinet structure 3 may further include a heating device and a control device (not shown).
  • the heating device is installed on the main body 31 and connected to the first exchanger device 32 or the second heat exchanger device 33 .
  • the control device is connected to the heating device for controlling the operation of the heating device so as to adjust the temperature inside the heat-exchanged cabinet structure 3 .
  • the main body 31 has an accommodated space 311 , a first housing 312 and a second housing 313 .
  • the first housing 312 and the second housing 313 are disposed opposite to each other.
  • each of the first housing 312 and the second housing 313 can be a cap, a rear plate, a side plate, a top plate, or a bottom plate.
  • the first housing 312 is, for example but not limited to, a cap
  • the second housing 313 is correspondingly a rear plate.
  • the electronic equipment A is disposed in the accommodated space 311 .
  • the first heat exchanger device 32 is disposed on the first housing 312
  • the second heat exchanger device 33 is disposed on the second housing 313 and located opposite to the first heat exchanger device 32 .
  • the first heat exchanger device 32 is disposed on the first housing 312
  • the second heat exchanger device 33 is disposed on the second housing 313 , which are all installed inside the main body 31 , so that they can directly perform the heat dissipation of the electronic equipment A.
  • This configuration can enhance the air cycling and heat-dissipating performance and prevent the interference of external environmental factors, which can affect the normal operation of the heat exchanger devices.
  • the positions of the first heat exchanger device 32 and the second heat exchanger device 33 can be flexibly changed based on the heat-dissipation requirement of the electronic equipment A. Furthermore, this configuration can minimize the assembling dimension of the heat-exchanged cabinet structure 3 and decrease the manufacturing cost.
  • the first heat exchanger device 32 includes a condenser 321 , a pipe 322 and a fan 323 .
  • the condenser 321 is connected to the pipe 322 , and the pipe 322 is configured to transfer a fluid (e.g. a liquid) from the condenser 321 to an evaporator 331 .
  • the fan 323 and the condenser 321 are disposed in the first housing 312 .
  • the second heat exchanger device 33 includes the evaporator 331 , a pipe 332 and a fan 333 .
  • the evaporator 331 is connected to the pipe 332 , and the pipe 332 is configured to transfer a fluid (e.g.
  • the fan 333 and the evaporator 331 are disposed in the second housing 313 .
  • the fans 323 and 333 are, for example but not limited to, centrifugal fans.
  • the fans 323 and 333 can be any applicable fan such as axial flow fans or oblique flow fans.
  • the first heat exchanger device 32 and the second heat exchanger device 33 are individually configured, and they are connected only through the pipes 322 and 332 , which connect the condenser 321 and the evaporator 331 .
  • the technical features of the evaporator 331 , the condenser 321 , the pipes 322 and 332 , and the fans 323 and 333 are the same as those of the evaporator 231 , the condenser 221 , the pipes 222 and 232 , and the fans 223 and 233 of the first embodiment, so the detailed descriptions thereof will be omitted.
  • FIG. 5 is a sectional side view of a heat-exchanged cabinet structure 4 according to a third embodiment of the present invention.
  • the heat-exchanged cabinet structure 4 is used to carry an electronic equipment A.
  • the heat-exchanged cabinet structure 4 includes a main body 41 , a first heat exchanger device 42 , and a second heat exchanger device 43 .
  • the heat-exchanged cabinet structure 4 may further include a heating device and a control device (not shown).
  • the technical features of the electronic equipment A, heating device and control device of the third embodiment are the same as those of the electronic equipment A, the heating device 24 and the control device 25 of the first embodiment, so the detailed descriptions thereof will be omitted.
  • the main body 41 has an accommodated space 411 , a first housing 412 and a second housing 413 .
  • the first housing 412 and the second housing 413 are connected to each other.
  • each of the first housing 412 and the second housing 413 can be a cap, a rear plate, a side plate, a top plate, or a bottom plate.
  • the first housing 412 is disposed adjacent to and connected to the second housing 413 .
  • the first housing 412 is, for example but not limited to, a cap, and the second housing 413 is correspondingly a top plate.
  • the first housing 412 is a side plate
  • the second housing 413 is a bottom plate connected to the side plate.
  • the first housing 412 is a top plate
  • the second housing 413 is a side plate connected to the top plate.
  • the electronic equipment A is disposed in the accommodated space 411 .
  • the first heat exchanger device 42 is disposed on the second housing 413
  • the second heat exchanger device 43 is disposed on the first housing 412 and located adjacent to the first heat exchanger device 42 .
  • the positions of the first heat exchanger device 42 and the second heat exchanger device 43 can be flexibly changed based on the heat-dissipation requirement of the electronic equipment A.
  • the first heat exchanger device 42 and the second heat exchanger device 43 are both disposed inside the main body, the assembling dimension and volume of the heat-exchanged cabinet structure 4 can minimized, thereby decreasing the manufacturing cost.
  • the first heat exchanger device 42 includes a condenser 421 , a pipe 422 and a fan 423 .
  • the condenser 421 is connected to the pipe 422 , and the pipe 422 is configured to transfer a fluid (e.g. a liquid) from the condenser 421 to an evaporator 431 .
  • the fan 423 and the condenser 421 are disposed in the second housing 413 .
  • the second heat exchanger device 43 includes the evaporator 431 , a pipe 432 and a fan 433 .
  • the evaporator 431 is connected to the pipe 432 , and the pipe 432 is configured to transfer a fluid (e.g.
  • the fan 433 and the evaporator 431 are disposed in the first housing 412 .
  • the fans 423 and 433 are, for example, centrifugal fans.
  • the fans 423 and 433 can be any applicable fan such as axial flow fans or oblique flow fans.
  • the first heat exchanger device 42 and the second heat exchanger device 43 are individually configured, and they are connected only through the pipes 422 and 432 , which connect the condenser 421 and the evaporator 431 .
  • the technical features of the evaporator 431 , the condenser 421 , the pipes 422 and 432 , and the fans 423 and 433 are the same as those of the evaporator 231 , the condenser 221 , the pipes 222 and 232 , and the fans 223 and 233 of the first embodiment, so the detailed descriptions thereof will be omitted.
  • the first and second heat exchanger devices of the heat-exchanged cabinet structure are disposed in the accommodating space of the main body, and located corresponding to the electronic equipment.
  • the first and second heat exchanger devices have a condenser and an evaporator, respectively, for dissipating the heat generated by the electronic equipment, thereby enhancing the heat-dissipation performance of the heat-exchanged cabinet structure.
  • the heat-exchanged cabinet structure of the invention can improve the issues of poor heat-dissipation performance and interference of external environmental factors, and minimize the installation volume and space so as to decrease the manufacturing cost.
  • the installation positions of the first and second exchanger devices can be flexibly modified according to the dimension of the electronic equipment or the heat-exchanged cabinet structure.
  • the first and second exchanger devices are disposed on two opposite or connected housings of the heat-exchanged cabinet structure, respectively. These configurations can also increase the air cycling performance and thus improve the heat-dissipation performance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/753,090 2012-02-24 2013-01-29 Heat-exchanged cabinet structure Abandoned US20130219947A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101106204A TWI461145B (zh) 2012-02-24 2012-02-24 熱交換機箱結構
TW101106204 2012-02-24

Publications (1)

Publication Number Publication Date
US20130219947A1 true US20130219947A1 (en) 2013-08-29

Family

ID=49001358

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/753,090 Abandoned US20130219947A1 (en) 2012-02-24 2013-01-29 Heat-exchanged cabinet structure

Country Status (2)

Country Link
US (1) US20130219947A1 (zh)
TW (1) TWI461145B (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160265835A1 (en) * 2015-03-09 2016-09-15 John Brothers Cryogenic freezer
CN107995835A (zh) * 2017-12-27 2018-05-04 北京天诚同创电气有限公司 电气设备机房散热装置及电气设备机房
CN112895938A (zh) * 2021-03-26 2021-06-04 广州小鹏汽车科技有限公司 一种充电整流柜和直流充电桩
US11178792B1 (en) * 2021-01-28 2021-11-16 Super Micro Computer, Inc. Heat exchange structure of telecommunication cabinet
US11350534B1 (en) * 2020-12-10 2022-05-31 Super Micro Computer, Inc. Telecommunication cabinet with replaceable cabinet door module
US20220225534A1 (en) * 2021-01-14 2022-07-14 Super Micro Computer, Inc. Telecommunication cabinet with hidden anti-theft heat dissipation module
CN116171418A (zh) * 2021-09-24 2023-05-26 华为数字能源技术有限公司 机箱、储能系统及数据系统

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104596333B (zh) * 2013-10-31 2017-09-15 台达电子工业股份有限公司 热交换机
US11473848B2 (en) 2013-10-31 2022-10-18 Delta Electronics, Inc. Thermosiphon heat exchanger

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3807493A (en) * 1971-09-28 1974-04-30 Kooltronic Fan Co Heat exchanger using u-tube heat pipes
US5404938A (en) * 1992-11-17 1995-04-11 Heat Pipe Technology, Inc. Single assembly heat transfer device
US5806583A (en) * 1995-04-14 1998-09-15 Nippondenso Co. Ltd. Easily manufactured cooling apparatus using boiling and condensing refrigerant and method of manufacturing the same
US20010042614A1 (en) * 2000-05-19 2001-11-22 Yoshiyuki Okamoto Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid
US7448439B2 (en) * 2002-07-09 2008-11-11 Fujitsu Limited Heat exchanger
US20090014155A1 (en) * 2007-07-13 2009-01-15 International Business Machines Corporation Thermally pumped liquid/gas heat exchanger for cooling heat-generating devices

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI262048B (en) * 2005-03-09 2006-09-11 Teco Elec & Machinery Co Ltd Air conditioner device for computer
TWM282236U (en) * 2005-06-30 2005-12-01 Yeh Chiang Technology Corp Improved structure of a heat dissipating device using a circulated heat pipe

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3807493A (en) * 1971-09-28 1974-04-30 Kooltronic Fan Co Heat exchanger using u-tube heat pipes
US5404938A (en) * 1992-11-17 1995-04-11 Heat Pipe Technology, Inc. Single assembly heat transfer device
US5806583A (en) * 1995-04-14 1998-09-15 Nippondenso Co. Ltd. Easily manufactured cooling apparatus using boiling and condensing refrigerant and method of manufacturing the same
US20010042614A1 (en) * 2000-05-19 2001-11-22 Yoshiyuki Okamoto Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid
US7448439B2 (en) * 2002-07-09 2008-11-11 Fujitsu Limited Heat exchanger
US20090014155A1 (en) * 2007-07-13 2009-01-15 International Business Machines Corporation Thermally pumped liquid/gas heat exchanger for cooling heat-generating devices

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160265835A1 (en) * 2015-03-09 2016-09-15 John Brothers Cryogenic freezer
CN107995835A (zh) * 2017-12-27 2018-05-04 北京天诚同创电气有限公司 电气设备机房散热装置及电气设备机房
US11350534B1 (en) * 2020-12-10 2022-05-31 Super Micro Computer, Inc. Telecommunication cabinet with replaceable cabinet door module
US20220192040A1 (en) * 2020-12-10 2022-06-16 Super Micro Computer, Inc. Telecommunication cabinet with replaceable cabinet door module
US20220225534A1 (en) * 2021-01-14 2022-07-14 Super Micro Computer, Inc. Telecommunication cabinet with hidden anti-theft heat dissipation module
US11445633B2 (en) * 2021-01-14 2022-09-13 Super Micro Computer, Inc. Telecommunication cabinet with hidden anti-theft heat dissipation module
US11178792B1 (en) * 2021-01-28 2021-11-16 Super Micro Computer, Inc. Heat exchange structure of telecommunication cabinet
CN112895938A (zh) * 2021-03-26 2021-06-04 广州小鹏汽车科技有限公司 一种充电整流柜和直流充电桩
CN116171418A (zh) * 2021-09-24 2023-05-26 华为数字能源技术有限公司 机箱、储能系统及数据系统
EP4383967A4 (en) * 2021-09-24 2024-12-11 Huawei Digital Power Technologies Co., Ltd. MACHINE BOX, ENERGY STORAGE SYSTEM AND DATA SYSTEM

Also Published As

Publication number Publication date
TWI461145B (zh) 2014-11-11
TW201336398A (zh) 2013-09-01

Similar Documents

Publication Publication Date Title
US20130219947A1 (en) Heat-exchanged cabinet structure
US7631687B2 (en) Heat exchanger
AU2013254078B2 (en) Refrigerating apparatus
JP5857964B2 (ja) 電子機器冷却システム
US20090225515A1 (en) Thermal bus or junction for the removal of heat from electronic components
US20030094266A1 (en) Cabinet having heat exchanger integrally installed between roof and solar shield
JP5967089B2 (ja) 冷却装置及びそれを用いた機器収納装置
US20120160448A1 (en) Air-cooled heat exchanger and electronic device with same
US10638639B1 (en) Double sided heat exchanger cooling unit
CN101377392A (zh) 热交换器
US20220146122A1 (en) Passive heat exchanger with single microchannel coil
EP2827691A2 (en) Cabinet for power electronic apparatus
JP7718768B2 (ja) 電気制御ボックス、エアコン室外機及びエアコン
US20230235969A1 (en) Temperature control apparatus with heat exchanging unit divided into evaporator and condenser sections
JP2015127622A (ja) 電装品ユニット
CN103238031B (zh) 冷却装置和具有该冷却装置的空气调节机
US9448001B2 (en) Indirect cooling unit
CN103298313A (zh) 热交换机箱结构
JP5569054B2 (ja) 冷凍装置
CN203704175U (zh) 循环系统一体化的超薄机柜空调器
WO2025112777A1 (zh) 空调及压缩机
WO2012081055A1 (ja) 冷却装置およびそれを備えた空気調和機
CN201388355Y (zh) 散热装置及具备有散热装置的电子零件模组箱、机房
US9057384B2 (en) Integrated fan
CN107421015A (zh) 空调器

Legal Events

Date Code Title Description
AS Assignment

Owner name: DELTA ELECTRONICS, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, TA-JUNG;LIU, PI-CHEN;CHAN, SHEN-FENG;REEL/FRAME:029716/0155

Effective date: 20130123

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION