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US20130135599A1 - Dynamic projection method for micro-truss foam fabrication - Google Patents

Dynamic projection method for micro-truss foam fabrication Download PDF

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Publication number
US20130135599A1
US20130135599A1 US13/748,711 US201313748711A US2013135599A1 US 20130135599 A1 US20130135599 A1 US 20130135599A1 US 201313748711 A US201313748711 A US 201313748711A US 2013135599 A1 US2013135599 A1 US 2013135599A1
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United States
Prior art keywords
radiation
sensitive material
directing device
source
radiation source
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Abandoned
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US13/748,711
Inventor
Yeh-Hung Lai
Gerald W. Fly
Jeffrey A. Rock
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GM Global Technology Operations LLC
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GM Global Technology Operations LLC
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Priority to US13/748,711 priority Critical patent/US20130135599A1/en
Assigned to GM Global Technology Operations LLC reassignment GM Global Technology Operations LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FLY, GERALD W., LAI, YEH-HUNG, ROCK, JEFFREY A.
Publication of US20130135599A1 publication Critical patent/US20130135599A1/en
Assigned to WILMINGTON TRUST COMPANY reassignment WILMINGTON TRUST COMPANY SECURITY INTEREST Assignors: GM Global Technology Operations LLC
Assigned to GM Global Technology Operations LLC reassignment GM Global Technology Operations LLC RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: WILMINGTON TRUST COMPANY
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00Fuel cells; Manufacture thereof
    • H01M8/02Details
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00Fuel cells; Manufacture thereof
    • H01M8/02Details
    • H01M8/0202Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204Non-porous and characterised by the material
    • H01M8/0221Organic resins; Organic polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00Fuel cells; Manufacture thereof
    • H01M8/02Details
    • H01M8/0202Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/023Porous and characterised by the material
    • H01M8/0239Organic resins; Organic polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00Fuel cells; Manufacture thereof
    • H01M8/02Details
    • H01M8/0271Sealing or supporting means around electrodes, matrices or membranes
    • H01M8/028Sealing means characterised by their material
    • H01M8/0284Organic resins; Organic polymers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/50Fuel cells

Definitions

  • the present disclosure relates to a fuel cell component and more particularly to a dynamic masking method for fabricating the fuel cell component.
  • a fuel cell has been proposed as a clean, efficient and environmentally responsible power source for electric vehicles and various other applications.
  • Individual fuel cells can be stacked together in series to form a fuel cell stack for various applications.
  • the fuel cell stack is capable of supplying a quantity of electricity sufficient to power a vehicle.
  • the fuel cell stack has been identified as a potential alternative for the traditional internal-combustion engine used in modern automobiles.
  • the PEM fuel cell includes three basic components: an electrolyte membrane; and a pair of electrodes, including a cathode and an anode.
  • the electrolyte membrane is sandwiched between the electrodes to form a membrane-electrode-assembly (MEA).
  • MEA membrane-electrode-assembly
  • DM porous diffusion media
  • the hydrogen is catalytically oxidized in the anode to generate free protons and electrons.
  • the protons pass through the electrolyte to the cathode.
  • the electrons from the anode cannot pass through the electrolyte membrane, and are instead directed as an electric current to the cathode through an electrical load such as an electric motor.
  • the protons react with the oxygen and the electrons in the cathode to generate water.
  • the radiation-cured structures are formed from radiation-sensitive materials such as radiation-curable materials and radiation-dissociable materials.
  • the radiation-cured structure is generally formed by a method including the steps of: providing the radiation-sensitive material; placing a mask between an at least one radiation source and the radiation-sensitive material, the mask having a plurality of substantially radiation-transparent apertures formed therein; and exposing the radiation-sensitive material to a plurality of radiation beams through the radiation-transparent apertures in the mask.
  • the apertures of the mask may be selected to provide different radiation cured structures.
  • different masks having different apertures are generally sequentially applied.
  • masks must be removed following radiation exposure so that further radiation-cured structure may be fabricated. Since masks typically are placed in physical contact with the radiation-sensitive material, the masks must also be cleaned after use in order to remove residual radiation-sensitive material.
  • the system and method provide complex or multi-layered radiation-cured structures without employing costly and inefficient masking techniques, processing steps, and cleaning steps.
  • a system for fabricating a radiation-cured component includes a radiation-sensitive material.
  • the radiation-sensitive material is configured to at least one of initiate, polymerize, and crosslink and dissociate with exposure to radiation.
  • the system further includes at least one radiation source and a radiation directing device.
  • the at least one radiation source is configured to project a radiation beam with a vector that does not intersect the radiation-sensitive material.
  • the radiation directing device is selectively positionable to direct the radiation beam in a desired direction and expose the radiation-sensitive material to the radiation beam.
  • a system for fabricating a radiation-cured component includes a radiation-sensitive material configured to at least one of initiate, polymerize, and crosslink and dissociate with exposure to radiation.
  • a first radiation source is disposed adjacent a first side of the radiation sensitive material and configured to project a first radiation beam with a vector that does not intersect the radiation-sensitive material.
  • a second radiation source is disposed adjacent a second side of the radiation sensitive material and configured to project a second radiation beam with a vector that does not intersect the radiation-sensitive material.
  • the system further includes a digital micromirror device having a plurality of micromirrors arranged in an array. The digital micromirror device is disposed adjacent the first radiation sensitive material. Each of the micromirrors is selectively positionable to reflect one of the first and second radiation beams in a desired direction and expose the radiation-sensitive material to one of the first and second radiation beam.
  • a method for fabricating a radiation-cured component includes the steps of: providing a first radiation-sensitive material configured to at least one of initiate, polymerize, and crosslink and dissociate with exposure to radiation; providing at least one radiation source configured to project a radiation beam with a vector that does not intersect the first radiation-sensitive material; providing a radiation directing device that is selectively positionable; positioning the radiation directing device to direct the radiation beam in a desired direction; exposing the first radiation-sensitive material to the radiation beam directed by the radiation directing device; and forming a first radiation-cured structure of the radiation-cured component.
  • FIG. 1A is a schematic illustration of the system for fabricating radiation-cured structures according to an embodiment the present disclosure, with a radiation directing device shown in an active state;
  • FIG. 1B is a schematic illustration of the system shown in FIG. 1A , with the radiation directing device shown in the inactive state;
  • FIG. 2 is a schematic illustration of the system shown in FIG. 1A , further having a mask disposed between a radiation source and the radiation directing device;
  • FIG. 3 is a schematic illustration of the system for fabricating radiation-cured structures according to another embodiment of the present disclosure, with a pair of radiation sources;
  • FIG. 4 is a schematic illustration of the system for fabricating radiation-cured structures according to a further embodiment of the present disclosure, with a plurality of selectively positionable mirrors.
  • FIGS. 1A and 1B show a system 2 for fabricating radiation-cured structures 4 according to the present disclosure.
  • the radiation-cured structures 4 may illustratively be employed as radiation-cured fuel cell components such as diffusion media, bipolar plates, subgaskets, and the like.
  • the disclosed system 2 and method is not limited to fuel cell components, and may be used for fabrication of radiation-cured structures 4 for other purposes, as desired.
  • the terminology related to the fabrication of radiation-cured structures 4 is further described in Assignee's co-pending U.S. patent application Ser. Nos. 12/339,308, 12/341,062 and 12/341,105, the entire disclosures of which are hereby incorporated herein by reference.
  • the system 2 includes a radiation-sensitive material 6 , at least one radiation source 8 , and a radiation directing device 10 .
  • the radiation-sensitive material 6 is configured to at least one of initiate, polymerize, and crosslink and dissociate with exposure to radiation.
  • the radiation-sensitive material 6 may be disposed on a substrate (not shown), placed in a container or reservoir if liquid, or provided as a free standing film, depending on the type of radiation-sensitive material 6 selected.
  • the at least one radiation source 8 may be disposed adjacent the radiation sensitive material 6 .
  • the radiation directing device 10 may also be disposed adjacent the radiation-sensitive material 6 in a position that facilitates a selective reflection of radiation toward the radiation-sensitive material 6 .
  • the radiation directing device 10 is preferably spaced apart from the radiation-sensitive material 6 and disposed, for example, above a surface 12 of the radiation-sensitive material 6 . It should be appreciated that the radiation directing device 10 may be horizontally offset from the radiation-sensitive material 6 , as desired.
  • the radiation directing device 10 may include at least one of a mirror 16 and a refractor such as a lens, a prism, and the like. Although the radiation directing device 10 is described further herein having the at least one mirror 16 , it should be appreciated that alternate embodiments including the radiation directing device 10 with at least one refractor are within the scope of the instant disclosure.
  • the at least one radiation source 8 is configured to project a radiation beam 14 along a vector that does not intersect the radiation-sensitive material 6 .
  • the at least one radiation source 8 is desirably configured to project the radiation beam 14 along a vector that intersects the at least one mirror 16 of the radiation directing device 10 .
  • the radiation may be collimated or partially collimated, as desired.
  • the radiation is electromagnetic radiation such as ultraviolet (UV) light, although it is understood that other forms of electromagnetic radiation may also be employed within the scope of the disclosure.
  • the radiation source 8 projects the radiation beam 14 along a vector parallel with the surface 12 of the radiation-sensitive material 6 .
  • the radiation source 8 is disposed below a plane formed by the surface 12 of the radiation sensitive material 6 , and may project the radiation beam 14 upward and away from the surface of the radiation-sensitive material 6 . It should be appreciated that the radiation source 8 may be placed in other suitable locations to project the radiation beam 14 along the vector that does not intersect the radiation-sensitive material 6 , as desired.
  • the radiation source 8 is pulsable.
  • the radiation source 8 may be rapidly and readily switched on and off.
  • the pulsability of the radiation source 8 facilitates a controlled non-projection of the radiation beam 14 during the positioning of the mirrors 16 .
  • One of ordinary skill in the art should understand that by turning off the radiation source 8 during the positioning of the mirrors 16 , and turning on the radiation source 8 when the mirrors 16 have been positioned as desired, a formation of undesirable “dragging” radiation-cured structures is militated against.
  • the radiation directing device 10 of the instant disclosure is configured to selectively direct, for example, by reflection or refraction, the radiation beam 14 from the radiation source 8 to the radiation-sensitive material 6 .
  • the radiation directing device 10 has at least one mirror 16 disposed adjacent the radiation sensitive material 6 and selectively positionable to reflect the radiation beam 14 in a desired direction.
  • the mirror 16 may be formed from any material able to reflect the radiation beam 14 projected by the radiation source 8 .
  • the mirror 16 may have a single, substantially continuous surface or a surface with multiple facets to reflect the radiation beam 14 in the desired direction.
  • the desired direction may be one of toward the radiation sensitive material 6 for exposure of the radiation-sensitive material to the radiation beam 14 , and away from the radiation-sensitive material 6 to militate against exposure of the radiation-sensitive material 6 to the radiation beam 14 .
  • the radiation directing device 10 is selectively positionable from an active state to an inactive state.
  • An example of the active state is shown in FIG. 1A and includes a position configured to reflect the radiation beam 14 toward the radiation-sensitive material 6 .
  • An example of the inactive state is shown in FIG. 1B and includes a position configured to reflect the radiation beam away from the radiation sensitive material 6 .
  • the radiation directing device 10 may also be selectively positionable to a plurality of states within the active state, in order to reflect the radiation beam 14 in a plurality of desired directions toward the radiation sensitive material 6 .
  • the radiation directing device 10 may have multiple active states at different angles that reflect the radiation beam 14 at different directions.
  • the radiation directing device 10 may be positionable through the use of at least one programmable controller (not shown) in electrical communication therewith.
  • the controller may provide fine position control of a motor, for example, an electric stepper motor, coupled to the at least one mirror 16 .
  • Other motors or means suitable for providing finely controlled positioning of radiation directing device 10 may also be employed.
  • the positioning of the radiation directing device 10 may include at least one of linear and angular displacement.
  • the mirror 16 may be configured to slide forward and backward to selectively reflect the radiation beam 14 .
  • the mirror 16 is rotatable about an axis 18 to facilitate the selective positioning of the mirror 16 .
  • the mirror 16 is configured to rotate about more than one axis 18 .
  • the axis 18 may be disposed at an end of the radiation directing device 10 , such as in the form of a hinge coupled to the radiation directing device 10 .
  • the axis 18 may be disposed intermediate the ends of the radiation directing device 10 , such as in the form of an axle coupled to the radiation directing device 10 .
  • the mirror 16 is positioned by rotation, it should be understood that the mirror 16 is spaced apart from the surface 12 of the radiation-sensitive material 6 at a distance sufficient to allow the rotation to occur without the mirror 16 contacting the surface 12 .
  • An alignment of the radiation directing device 10 may be tracked and a repositioning of the radiation directing device 10 used to easily correct for drifts in performance of the system 2 over time.
  • a quality control sensor or inspection process may be employed to determine if the angles of the fabricated radiation-cured structures 4 are within acceptable tolerance, and the mirror 16 repositioned as necessary where undesirable drift has occurred.
  • the drift is a result of movement of an underlying substrate or carrier in a continuous operation method, it should be appreciated that the employment of the at least one mirror 16 advantageously allows for real time corrections and minimizes downtime of the system 2 .
  • the system 2 may further include a mask 20 disposed between the at least one radiation source 8 and the radiation directing device 10 .
  • the mask 20 may be directly disposed on radiation directing device 10 or spaced apart from the radiation directing device 10 as shown in FIG. 2 .
  • the mask 20 is spaced between radiation directing device 10 and the radiation-sensitive material 6 , the mask 20 being spaced apart from the radiation-sensitive material 6 .
  • the mask 20 may further be integrally formed with the mirror 16 by providing a selectively reflectable mirrored surface.
  • the mask 20 has a plurality of substantially radiation-transparent apertures 22 or openings formed therein.
  • the apertures may be substantially radiation-transparent apertures 22 formed in an otherwise opaque or radiation-blocking material coated on a surface of the mask 20 , for example.
  • the apertures 22 or openings formed in the mask 20 have shapes that provide radiation beams 14 to form radiation cured structures 4 having desired cross-sectional shapes.
  • the apertures 22 are in the form of substantially circular holes that provide radiation beams 14 to form radiation-cured columns with substantially circular or elliptical cross-sectional shapes.
  • the apertures 22 are elongate slots that provide radiation beams 14 to form radiation-cured walls with substantially rectangular cross-sectional shapes.
  • the mask 20 may be formed from a plane of glass or a Mylar® plastic sheet, for example, and facilitate the formation of a plurality of radiation beams 14 . It should be understood that multiple masks 20 may be employed, and that the masks 20 may be interchanged throughout the fabrication process, as desired.
  • the at least one radiation source 8 may include a first radiation source 8 ′ and a second radiation source 8 ′′.
  • the first radiation source 8 ′ is disposed on a first side of the radiation sensitive material 6 .
  • the second radiation source 8 ′′ is disposed on a second side of the radiation sensitive material 6 .
  • the radiation directing device 10 is disposed between the first and second radiation sources 8 ′, 8 ′′ and is selectively positionable to reflect the first and second radiation beams 14 ′, 14 ′′ from either of the first and second radiation sources 8 ′, 8 ′′. It should be understood that additional radiation sources 8 disposed on additional or same sides of the radiation sensitive material 6 , may be employed as desired.
  • the radiation directing device 10 may also include a plurality of the mirrors 16 .
  • Each of the mirrors is selectively positionable to reflect the radiation beam 14 in the plurality of desired directions.
  • the plurality of mirrors 16 is arranged in an array disposed at least partially above the radiation-sensitive material 6 . Multiple arrays may be employed during the formation of the radiation-cured structure 4 .
  • the radiation directing device 10 may include three different arrays of the mirrors 16 . Each of the three different arrays may be provided with a predetermined tilt in order to facilitate the formation of radiation-cured structures 4 having desired angles and shapes. In another example, the entire array, as well as the individual mirrors 16 , may be positionable as desired.
  • the radiation directing device 10 is a digital micromirror device (also known as “DMD”) and the at least one mirror 16 include a plurality of micromirrors arranged in the array.
  • the digital micromirror device is an optical semiconductor that has on its surface a plurality of microscopic mirrors arranged in a rectangular array, which may correspond to the shape of the desired radiation-cured structure 4 to be formed.
  • the micromirrors can be individually rotated ⁇ 12°, to the active and inactive states. In the active state, the radiation beams 14 from the radiation source 8 are reflected to the radiation-sensitive material 6 . In the inactive state, the radiation beams 14 are directed elsewhere, for example, to a heatsink (not shown) disposed adjacent to the system 2 .
  • the use of the digital micromirror device as the radiation directing device 10 may be particularly advantageous as the digital micromirrors may be toggled on and off very quickly, allowing for a fine control and formation of the radiation-cured structure 4 .
  • the micromirrors may illustratively be formed from aluminum, and may be up to about 20 micrometers in average width.
  • the micromirrors may have other materials and dimensions suitable for use in the digital micromirror device, as desired.
  • each micromirror is hingedly mounted on a yoke which in turn is connected to two support posts by compliant torsion hinges. In this type of hinge, the axle is fixed at both ends and twists in the middle.
  • Two pairs of electrodes may be employed to control the position of the micromirror by electrostatic attraction. Each pair has one electrode on each side of the hinge, with one of the pairs positioned to act on the yoke and the other acting directly on the micromirror.
  • Equal bias charges are applied to both sides simultaneously to hold the micromirror in the desired position.
  • a required state for each micromirror may be first loaded onto a controller which is in electrical communication with the electrodes. Once the required states for each micromirror have been loaded, the bias voltage is removed and the micromirrors are positioned as desired. The micromirror may be again held in position through application of equal bias changes when the desired position is achieved, and until a next positioning of the micromirror is desired.
  • One particular system for fabricating the radiation-cured component includes the radiation-sensitive material 6 , the first radiation source 8 ′ disposed adjacent the first side of the radiation sensitive material 6 and configured to project the first radiation beam 14 ′, the second radiation source 8 ′′ disposed adjacent the second side of the radiation sensitive material 6 and configured to project the second radiation beam 14 ′′, and the radiation directing device 10 .
  • the radiation directing device 10 is the digital micromirror device.
  • the digital micromirror device may be disposed adjacent the radiation sensitive material 6 and each of the micromirrors individually selectively positionable to reflect one of the first and second radiation beams 14 ′, 14 ′′ in a desired direction to selectively expose the radiation-sensitive material 6 to the first and second radiation beams 14 ′, 14 ′′.
  • the present disclosure further includes a method for fabricating the radiation-cured component.
  • the method includes the steps of: providing the radiation-sensitive material 6 ; providing the at least one radiation source 8 , for example, disposed adjacent the radiation sensitive material 6 ; providing the radiation directing device 10 , for example, disposed adjacent the radiation sensitive material 6 ; and positioning the at least one mirror 16 to direct, for example, by reflection or refraction, the radiation beam 14 in a desired direction.
  • the radiation-sensitive material 6 is then exposed to the radiation beam 14 directed by the at least one mirror 16 . It should be appreciated that the exposure time may be lengthened or shortened as desired.
  • the forming of the first radiation-cured structure 4 may include a post-processing step of heating the radiation-sensitive material 6 to complete at least one of polymerization, crosslinking, and dissociation of the radiation sensitive material 6 .
  • a step of removing excess or uncured radiation-sensitive material 6 is also employed. The first radiation-cured structure 4 of the radiation-cured component is thereby formed.
  • the step of positioning the radiation directing device 10 may include the step of rotating the mirror 16 from the active state to the inactive state as described hereinabove.
  • the step of positioning the radiation directing device 10 may include the step of pulsing or switching off the at least one radiation source 8 while the radiation directing device 10 is being positioned.
  • the deactivation of the at least one radiation source 8 while the radiation directing device 10 is moving militates against a formation of dragging structures within the first radiation-cured structure 4 .
  • the method of the present disclosure may further include a step of placing the first mask 20 ′ between the at least one radiation source 8 and the radiation directing device 10 .
  • a second mask 20 ′′ (and additional masks 20 ) may be placed between the at least one radiation source 8 and the radiation directing device 10 , or other suitable locations, following the step of exposing the first radiation-sensitive material 6 ′ to the radiation beam 14 .
  • the second mask 20 ′′ has a plurality of substantially radiation-transparent apertures 22 that are different from the substantially radiation-transparent apertures 22 of the first mask 20 ′. Different radiation-cured elements within the first radiation-cured structure may thereby be formed.
  • the method of the present disclosure can advantageously be employed to form multilayered radiation-cured structures 4 .
  • the method may further include the steps of: providing the first radiation-cured structure 4 ′ as described hereinabove; applying a second radiation-sensitive material 6 ′′ to the first radiation-cured structure 4 ′; positioning the at least one mirror 16 to reflect the radiation beam 14 in another desired direction; and exposing the second radiation-sensitive material 6 ′′ to the plurality of radiation beams 14 , wherein a second radiation-cured structure 4 ′′ different from the first radiation-cured structure 4 ′ is formed.
  • the system 2 may include the plurality of mirrors 16 arranged in an array and disposed above the radiation-sensitive material 6 .
  • the step of positioning the mirrors 16 may include individually positioning a first portion of the mirrors 16 to reflect the radiation beam 14 in the first desired direction and individually positioning a second portion of the plurality of mirrors 16 to reflect the radiation beam 14 in a second desired direction.
  • the method may further comprise the steps of: applying the second radiation-sensitive material 6 ′′ to the first radiation-cured structure 4 ′ following the formation of the first radiation-cured structure 4 ′; positioning the at least one mirror 16 to reflect the first radiation beam 14 in the first desired direction; exposing the second radiation-sensitive material 6 ′′ to the first radiation beam 14 ′; positioning the at least one mirror 16 to reflect the second radiation beam 14 ′′ in a second desired direction different from the first desired direction; and exposing the second radiation-sensitive material 6 ′′ to the second radiation beam 14 ′′, wherein the second radiation-cured structure 4 ′′ different from the first radiation-cured structure 4 ′ is formed.
  • the first and second radiation-sensitive materials 6 ′, 6 ′′ may have different radiation sensitivities, for example, as described in Assignee's co-pending U.S. application Ser. No. 12/339,308, the entire disclosure of which is hereby incorporated herein by reference. It should be understood that, in lieu of applying the second radiation-sensitive material 6 ′′ to the first radiation-cured structure 4 ′ following the formation thereof, the present method may include the steps of applying the second radiation-sensitive material 6 ′′ to the first radiation-sensitive material 6 ′ and selectively exposing the first and second radiation-sensitive materials 6 ′, 6 ′′ to different radiation types to form different radiation-cured structures 4 ′, 4 ′′ in the respective materials.
  • the first and second radiation-sensitive materials 6 ′, 6 ′′ may be configured to form different radiation-cured structures 4 ′, 4 ′′ based on the exposure patterns of the different radiation types directed to the first and second radiation-sensitive materials 6 ′, 6 ′′, for example, by the at least one radiation directing device 10 .
  • the radiation source 8 may be capable of producing different types of radiation. Filters may also be inserted in front of a broad-spectrum radiation source 8 to provide more than one type of radiation.
  • a second set of the mirrors 16 may be used with other radiation sources 8 . Different radiation-cured constructs, having different patterns, may thereby be simultaneously formed in the different first and second radiation-sensitive materials 6 ′, 6 ′′, as desired.
  • system 2 and method of the present disclosure mitigate the need for costly and inefficient masking techniques, processing steps, and related cleaning steps, typically associated fabrication of radiation-cured structures 4 .
  • the masks 20 are employed under the present invention, the masks 20 are spaced apart from the radiation-sensitive material 6 and therefore do not require regular cleaning as with known fabrication methods.
  • the employment of mirrors 16 to direct the radiation beams 14 allows for the rapid and cost-effective formation of desired radiation-cured structures 4 .

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Abstract

A system for fabricating a radiation-cured component is provided. The system includes a radiation-sensitive material configured to at least one of initiate, polymerize, crosslink and dissociate with exposure to radiation, and at least one radiation source configured to project a radiation beam with a vector that does not intersect the radiation-sensitive material. The system further includes a radiation directing device that is selectively positionable to reflect the radiation beam in a desired direction and exposure the radiation-sensitive material to the radiation beam. A method for fabricating the radiation-cured components is also provided.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application is a divisional of U.S. patent application Ser. No. 12/603,147, filed on Oct. 21, 2009, the entire disclosure of which is incorporated herein by reference.
  • FIELD OF THE INVENTION
  • The present disclosure relates to a fuel cell component and more particularly to a dynamic masking method for fabricating the fuel cell component.
  • BACKGROUND OF THE INVENTION
  • A fuel cell has been proposed as a clean, efficient and environmentally responsible power source for electric vehicles and various other applications. Individual fuel cells can be stacked together in series to form a fuel cell stack for various applications. The fuel cell stack is capable of supplying a quantity of electricity sufficient to power a vehicle. In particular, the fuel cell stack has been identified as a potential alternative for the traditional internal-combustion engine used in modern automobiles.
  • One type of fuel cell is the polymer electrolyte membrane (PEM) fuel cell. The PEM fuel cell includes three basic components: an electrolyte membrane; and a pair of electrodes, including a cathode and an anode. The electrolyte membrane is sandwiched between the electrodes to form a membrane-electrode-assembly (MEA). The MEA is typically disposed between porous diffusion media (DM) such as carbon fiber paper, which facilitates a delivery of reactants such as hydrogen to the anode and oxygen to the cathode. In the electrochemical fuel cell reaction, the hydrogen is catalytically oxidized in the anode to generate free protons and electrons. The protons pass through the electrolyte to the cathode. The electrons from the anode cannot pass through the electrolyte membrane, and are instead directed as an electric current to the cathode through an electrical load such as an electric motor. The protons react with the oxygen and the electrons in the cathode to generate water.
  • It has been desirable to fabricate the fuel cell and related fuel cell components from radiation-cured structures. The formation of radiation-cured structures such as microtruss structures are described in Assignee's co-pending U.S. patent application Ser. No. 12/339,308, the entire disclosure of which is hereby incorporated herein by reference. The formation of radiation-cured fuel cell structures are further described in Assignee's co-pending U.S. patent application Ser. Nos. 12/341,062 and 12/341,105, the entire disclosures of which are hereby incorporated herein by reference.
  • Radiation-cured microtruss structures and methodology are described by Jacobsen et al. in “Compression behavior of micro-scale truss structures formed from self-propagating polymer waveguides”, Acta Materialia 55, (2007) 6724-6733, the entire disclosure of which is hereby incorporated herein by reference. One particular method and system of creating radiation-cured structures is disclosed by Jacobsen in U.S. Pat. No. 7,382,959, the entire disclosure of which is hereby incorporated herein by reference. Further radiation-cured structures are disclosed by Jacobsen in U.S. patent application Ser. No. 11/801,908, the entire disclosure of which is hereby incorporated herein by reference.
  • Typically, the radiation-cured structures are formed from radiation-sensitive materials such as radiation-curable materials and radiation-dissociable materials. The radiation-cured structure is generally formed by a method including the steps of: providing the radiation-sensitive material; placing a mask between an at least one radiation source and the radiation-sensitive material, the mask having a plurality of substantially radiation-transparent apertures formed therein; and exposing the radiation-sensitive material to a plurality of radiation beams through the radiation-transparent apertures in the mask. The apertures of the mask may be selected to provide different radiation cured structures. To form complex or multi-layered radiation cured structures, different masks having different apertures are generally sequentially applied. Undesirably, masks must be removed following radiation exposure so that further radiation-cured structure may be fabricated. Since masks typically are placed in physical contact with the radiation-sensitive material, the masks must also be cleaned after use in order to remove residual radiation-sensitive material. Although it is possible to achieve multiple radiation exposures through repeated release and application of masks, this methodology can be quite complicated and costly.
  • There is a continuing need for an efficient and cost effective system and method for fabricating radiation-cured structures. Desirably, the system and method provide complex or multi-layered radiation-cured structures without employing costly and inefficient masking techniques, processing steps, and cleaning steps.
  • SUMMARY OF THE INVENTION
  • In concordance with the instant disclosure, an efficient and cost effective system and method for fabricating radiation-cured structures, and for providing complex or multi-layered radiation-cured structures without employing costly and inefficient masking techniques, processing steps, and cleaning steps, is surprisingly discovered.
  • In a first embodiment, a system for fabricating a radiation-cured component includes a radiation-sensitive material. The radiation-sensitive material is configured to at least one of initiate, polymerize, and crosslink and dissociate with exposure to radiation. The system further includes at least one radiation source and a radiation directing device. The at least one radiation source is configured to project a radiation beam with a vector that does not intersect the radiation-sensitive material. The radiation directing device is selectively positionable to direct the radiation beam in a desired direction and expose the radiation-sensitive material to the radiation beam.
  • In another embodiment, a system for fabricating a radiation-cured component includes a radiation-sensitive material configured to at least one of initiate, polymerize, and crosslink and dissociate with exposure to radiation. A first radiation source is disposed adjacent a first side of the radiation sensitive material and configured to project a first radiation beam with a vector that does not intersect the radiation-sensitive material. A second radiation source is disposed adjacent a second side of the radiation sensitive material and configured to project a second radiation beam with a vector that does not intersect the radiation-sensitive material. The system further includes a digital micromirror device having a plurality of micromirrors arranged in an array. The digital micromirror device is disposed adjacent the first radiation sensitive material. Each of the micromirrors is selectively positionable to reflect one of the first and second radiation beams in a desired direction and expose the radiation-sensitive material to one of the first and second radiation beam.
  • In a further embodiment, a method for fabricating a radiation-cured component includes the steps of: providing a first radiation-sensitive material configured to at least one of initiate, polymerize, and crosslink and dissociate with exposure to radiation; providing at least one radiation source configured to project a radiation beam with a vector that does not intersect the first radiation-sensitive material; providing a radiation directing device that is selectively positionable; positioning the radiation directing device to direct the radiation beam in a desired direction; exposing the first radiation-sensitive material to the radiation beam directed by the radiation directing device; and forming a first radiation-cured structure of the radiation-cured component.
  • DRAWINGS
  • The above, as well as other advantages of the present disclosure, will become readily apparent to those skilled in the art from the following detailed description, particularly when considered in the light of the drawings described herein.
  • FIG. 1A is a schematic illustration of the system for fabricating radiation-cured structures according to an embodiment the present disclosure, with a radiation directing device shown in an active state;
  • FIG. 1B is a schematic illustration of the system shown in FIG. 1A, with the radiation directing device shown in the inactive state;
  • FIG. 2 is a schematic illustration of the system shown in FIG. 1A, further having a mask disposed between a radiation source and the radiation directing device;
  • FIG. 3 is a schematic illustration of the system for fabricating radiation-cured structures according to another embodiment of the present disclosure, with a pair of radiation sources; and
  • FIG. 4 is a schematic illustration of the system for fabricating radiation-cured structures according to a further embodiment of the present disclosure, with a plurality of selectively positionable mirrors.
  • DETAILED DESCRIPTION OF THE INVENTION
  • The following detailed description and appended drawings describe and illustrate various embodiments of the invention. The description and drawings serve to enable one skilled in the art to make and use the invention, and are not intended to limit the scope of the invention in any manner. In respect of the methods disclosed, the steps presented are exemplary in nature, and thus, are not necessary or critical.
  • FIGS. 1A and 1B show a system 2 for fabricating radiation-cured structures 4 according to the present disclosure. The radiation-cured structures 4 may illustratively be employed as radiation-cured fuel cell components such as diffusion media, bipolar plates, subgaskets, and the like. However, it should be appreciated that the disclosed system 2 and method is not limited to fuel cell components, and may be used for fabrication of radiation-cured structures 4 for other purposes, as desired. The terminology related to the fabrication of radiation-cured structures 4, appropriated herein relative to the present system 2 and method, is further described in Assignee's co-pending U.S. patent application Ser. Nos. 12/339,308, 12/341,062 and 12/341,105, the entire disclosures of which are hereby incorporated herein by reference.
  • The system 2 includes a radiation-sensitive material 6, at least one radiation source 8, and a radiation directing device 10. The radiation-sensitive material 6 is configured to at least one of initiate, polymerize, and crosslink and dissociate with exposure to radiation. The radiation-sensitive material 6 may be disposed on a substrate (not shown), placed in a container or reservoir if liquid, or provided as a free standing film, depending on the type of radiation-sensitive material 6 selected. The at least one radiation source 8 may be disposed adjacent the radiation sensitive material 6. The radiation directing device 10 may also be disposed adjacent the radiation-sensitive material 6 in a position that facilitates a selective reflection of radiation toward the radiation-sensitive material 6. The radiation directing device 10 is preferably spaced apart from the radiation-sensitive material 6 and disposed, for example, above a surface 12 of the radiation-sensitive material 6. It should be appreciated that the radiation directing device 10 may be horizontally offset from the radiation-sensitive material 6, as desired.
  • The radiation directing device 10 may include at least one of a mirror 16 and a refractor such as a lens, a prism, and the like. Although the radiation directing device 10 is described further herein having the at least one mirror 16, it should be appreciated that alternate embodiments including the radiation directing device 10 with at least one refractor are within the scope of the instant disclosure.
  • The at least one radiation source 8 is configured to project a radiation beam 14 along a vector that does not intersect the radiation-sensitive material 6. The at least one radiation source 8 is desirably configured to project the radiation beam 14 along a vector that intersects the at least one mirror 16 of the radiation directing device 10. It should be appreciated that the radiation may be collimated or partially collimated, as desired. In particular embodiments, the radiation is electromagnetic radiation such as ultraviolet (UV) light, although it is understood that other forms of electromagnetic radiation may also be employed within the scope of the disclosure. The radiation source 8 projects the radiation beam 14 along a vector parallel with the surface 12 of the radiation-sensitive material 6. In another example, the radiation source 8 is disposed below a plane formed by the surface 12 of the radiation sensitive material 6, and may project the radiation beam 14 upward and away from the surface of the radiation-sensitive material 6. It should be appreciated that the radiation source 8 may be placed in other suitable locations to project the radiation beam 14 along the vector that does not intersect the radiation-sensitive material 6, as desired.
  • In certain examples, the radiation source 8 is pulsable. For example, the radiation source 8 may be rapidly and readily switched on and off. The pulsability of the radiation source 8 facilitates a controlled non-projection of the radiation beam 14 during the positioning of the mirrors 16. One of ordinary skill in the art should understand that by turning off the radiation source 8 during the positioning of the mirrors 16, and turning on the radiation source 8 when the mirrors 16 have been positioned as desired, a formation of undesirable “dragging” radiation-cured structures is militated against.
  • The radiation directing device 10 of the instant disclosure is configured to selectively direct, for example, by reflection or refraction, the radiation beam 14 from the radiation source 8 to the radiation-sensitive material 6. In particular embodiments, the radiation directing device 10 has at least one mirror 16 disposed adjacent the radiation sensitive material 6 and selectively positionable to reflect the radiation beam 14 in a desired direction. The mirror 16 may be formed from any material able to reflect the radiation beam 14 projected by the radiation source 8. The mirror 16 may have a single, substantially continuous surface or a surface with multiple facets to reflect the radiation beam 14 in the desired direction. For example, the desired direction may be one of toward the radiation sensitive material 6 for exposure of the radiation-sensitive material to the radiation beam 14, and away from the radiation-sensitive material 6 to militate against exposure of the radiation-sensitive material 6 to the radiation beam 14.
  • Referring to FIGS. 1A and 1B, the radiation directing device 10 is selectively positionable from an active state to an inactive state. An example of the active state is shown in FIG. 1A and includes a position configured to reflect the radiation beam 14 toward the radiation-sensitive material 6. An example of the inactive state is shown in FIG. 1B and includes a position configured to reflect the radiation beam away from the radiation sensitive material 6. The radiation directing device 10 may also be selectively positionable to a plurality of states within the active state, in order to reflect the radiation beam 14 in a plurality of desired directions toward the radiation sensitive material 6. For example, the radiation directing device 10 may have multiple active states at different angles that reflect the radiation beam 14 at different directions.
  • The radiation directing device 10 may be positionable through the use of at least one programmable controller (not shown) in electrical communication therewith. The controller may provide fine position control of a motor, for example, an electric stepper motor, coupled to the at least one mirror 16. Other motors or means suitable for providing finely controlled positioning of radiation directing device 10 may also be employed.
  • The positioning of the radiation directing device 10 may include at least one of linear and angular displacement. As an example of linear displacement, the mirror 16 may be configured to slide forward and backward to selectively reflect the radiation beam 14. In a particularly illustrative example, the mirror 16 is rotatable about an axis 18 to facilitate the selective positioning of the mirror 16. In another illustrative example, the mirror 16 is configured to rotate about more than one axis 18. The axis 18 may be disposed at an end of the radiation directing device 10, such as in the form of a hinge coupled to the radiation directing device 10. The axis 18 may be disposed intermediate the ends of the radiation directing device 10, such as in the form of an axle coupled to the radiation directing device 10. Where the mirror 16 is positioned by rotation, it should be understood that the mirror 16 is spaced apart from the surface 12 of the radiation-sensitive material 6 at a distance sufficient to allow the rotation to occur without the mirror 16 contacting the surface 12.
  • An alignment of the radiation directing device 10 may be tracked and a repositioning of the radiation directing device 10 used to easily correct for drifts in performance of the system 2 over time. For example, a quality control sensor or inspection process may be employed to determine if the angles of the fabricated radiation-cured structures 4 are within acceptable tolerance, and the mirror 16 repositioned as necessary where undesirable drift has occurred. Where the drift is a result of movement of an underlying substrate or carrier in a continuous operation method, it should be appreciated that the employment of the at least one mirror 16 advantageously allows for real time corrections and minimizes downtime of the system 2.
  • With reference to FIG. 2, the system 2 may further include a mask 20 disposed between the at least one radiation source 8 and the radiation directing device 10. The mask 20 may be directly disposed on radiation directing device 10 or spaced apart from the radiation directing device 10 as shown in FIG. 2. In another embodiment, the mask 20 is spaced between radiation directing device 10 and the radiation-sensitive material 6, the mask 20 being spaced apart from the radiation-sensitive material 6. The mask 20 may further be integrally formed with the mirror 16 by providing a selectively reflectable mirrored surface. In a particular embodiment, the mask 20 has a plurality of substantially radiation-transparent apertures 22 or openings formed therein. The apertures may be substantially radiation-transparent apertures 22 formed in an otherwise opaque or radiation-blocking material coated on a surface of the mask 20, for example. The apertures 22 or openings formed in the mask 20 have shapes that provide radiation beams 14 to form radiation cured structures 4 having desired cross-sectional shapes. In one embodiment, the apertures 22 are in the form of substantially circular holes that provide radiation beams 14 to form radiation-cured columns with substantially circular or elliptical cross-sectional shapes. In another embodiment, the apertures 22 are elongate slots that provide radiation beams 14 to form radiation-cured walls with substantially rectangular cross-sectional shapes. The mask 20 may be formed from a plane of glass or a Mylar® plastic sheet, for example, and facilitate the formation of a plurality of radiation beams 14. It should be understood that multiple masks 20 may be employed, and that the masks 20 may be interchanged throughout the fabrication process, as desired.
  • Referring to FIGS. 3 and 4, like structure repeated from FIGS. 1A, 1B, and 2 have the same reference numeral and a prime (′) or double prime (″) for purpose of clarity. The at least one radiation source 8 may include a first radiation source 8′ and a second radiation source 8″. The first radiation source 8′ is disposed on a first side of the radiation sensitive material 6. The second radiation source 8″ is disposed on a second side of the radiation sensitive material 6. The radiation directing device 10 is disposed between the first and second radiation sources 8′, 8″ and is selectively positionable to reflect the first and second radiation beams 14′, 14″ from either of the first and second radiation sources 8′, 8″. It should be understood that additional radiation sources 8 disposed on additional or same sides of the radiation sensitive material 6, may be employed as desired.
  • As shown in FIG. 4, the radiation directing device 10 may also include a plurality of the mirrors 16. Each of the mirrors is selectively positionable to reflect the radiation beam 14 in the plurality of desired directions. As a nonlimiting example, the plurality of mirrors 16 is arranged in an array disposed at least partially above the radiation-sensitive material 6. Multiple arrays may be employed during the formation of the radiation-cured structure 4. For example, the radiation directing device 10 may include three different arrays of the mirrors 16. Each of the three different arrays may be provided with a predetermined tilt in order to facilitate the formation of radiation-cured structures 4 having desired angles and shapes. In another example, the entire array, as well as the individual mirrors 16, may be positionable as desired.
  • In a particularly illustrative embodiment, the radiation directing device 10 is a digital micromirror device (also known as “DMD”) and the at least one mirror 16 include a plurality of micromirrors arranged in the array. The digital micromirror device is an optical semiconductor that has on its surface a plurality of microscopic mirrors arranged in a rectangular array, which may correspond to the shape of the desired radiation-cured structure 4 to be formed. The micromirrors can be individually rotated ±12°, to the active and inactive states. In the active state, the radiation beams 14 from the radiation source 8 are reflected to the radiation-sensitive material 6. In the inactive state, the radiation beams 14 are directed elsewhere, for example, to a heatsink (not shown) disposed adjacent to the system 2.
  • The use of the digital micromirror device as the radiation directing device 10 may be particularly advantageous as the digital micromirrors may be toggled on and off very quickly, allowing for a fine control and formation of the radiation-cured structure 4.
  • The micromirrors may illustratively be formed from aluminum, and may be up to about 20 micrometers in average width. The micromirrors may have other materials and dimensions suitable for use in the digital micromirror device, as desired. In a particular embodiment, each micromirror is hingedly mounted on a yoke which in turn is connected to two support posts by compliant torsion hinges. In this type of hinge, the axle is fixed at both ends and twists in the middle. Two pairs of electrodes may be employed to control the position of the micromirror by electrostatic attraction. Each pair has one electrode on each side of the hinge, with one of the pairs positioned to act on the yoke and the other acting directly on the micromirror.
  • Equal bias charges are applied to both sides simultaneously to hold the micromirror in the desired position. To position the micromirrors, a required state for each micromirror may be first loaded onto a controller which is in electrical communication with the electrodes. Once the required states for each micromirror have been loaded, the bias voltage is removed and the micromirrors are positioned as desired. The micromirror may be again held in position through application of equal bias changes when the desired position is achieved, and until a next positioning of the micromirror is desired.
  • One particular system for fabricating the radiation-cured component includes the radiation-sensitive material 6, the first radiation source 8′ disposed adjacent the first side of the radiation sensitive material 6 and configured to project the first radiation beam 14′, the second radiation source 8″ disposed adjacent the second side of the radiation sensitive material 6 and configured to project the second radiation beam 14″, and the radiation directing device 10. In this particular system 2, the radiation directing device 10 is the digital micromirror device. The digital micromirror device may be disposed adjacent the radiation sensitive material 6 and each of the micromirrors individually selectively positionable to reflect one of the first and second radiation beams 14′, 14″ in a desired direction to selectively expose the radiation-sensitive material 6 to the first and second radiation beams 14′, 14″.
  • The present disclosure further includes a method for fabricating the radiation-cured component. The method includes the steps of: providing the radiation-sensitive material 6; providing the at least one radiation source 8, for example, disposed adjacent the radiation sensitive material 6; providing the radiation directing device 10, for example, disposed adjacent the radiation sensitive material 6; and positioning the at least one mirror 16 to direct, for example, by reflection or refraction, the radiation beam 14 in a desired direction. The radiation-sensitive material 6 is then exposed to the radiation beam 14 directed by the at least one mirror 16. It should be appreciated that the exposure time may be lengthened or shortened as desired.
  • Where the radiation-sensitive material 6 is only initiated by the exposure to the radiation beam 14, it should be appreciated that the forming of the first radiation-cured structure 4 may include a post-processing step of heating the radiation-sensitive material 6 to complete at least one of polymerization, crosslinking, and dissociation of the radiation sensitive material 6. Where the radiation-sensitive material 6 is one of polymerized, crosslinked, and dissociated by the radiation beam 14, and where post-processing steps such as heating the initiated radiation-sensitive material have occurred, a step of removing excess or uncured radiation-sensitive material 6 is also employed. The first radiation-cured structure 4 of the radiation-cured component is thereby formed.
  • The step of positioning the radiation directing device 10 may include the step of rotating the mirror 16 from the active state to the inactive state as described hereinabove. The step of positioning the radiation directing device 10 may include the step of pulsing or switching off the at least one radiation source 8 while the radiation directing device 10 is being positioned. The deactivation of the at least one radiation source 8 while the radiation directing device 10 is moving militates against a formation of dragging structures within the first radiation-cured structure 4.
  • With renewed reference to FIG. 2, the method of the present disclosure may further include a step of placing the first mask 20′ between the at least one radiation source 8 and the radiation directing device 10. Likewise, a second mask 20″ (and additional masks 20) may be placed between the at least one radiation source 8 and the radiation directing device 10, or other suitable locations, following the step of exposing the first radiation-sensitive material 6′ to the radiation beam 14. Illustratively, the second mask 20″ has a plurality of substantially radiation-transparent apertures 22 that are different from the substantially radiation-transparent apertures 22 of the first mask 20′. Different radiation-cured elements within the first radiation-cured structure may thereby be formed.
  • It should be understood that the method of the present disclosure can advantageously be employed to form multilayered radiation-cured structures 4. For example, the method may further include the steps of: providing the first radiation-cured structure 4′ as described hereinabove; applying a second radiation-sensitive material 6″ to the first radiation-cured structure 4′; positioning the at least one mirror 16 to reflect the radiation beam 14 in another desired direction; and exposing the second radiation-sensitive material 6″ to the plurality of radiation beams 14, wherein a second radiation-cured structure 4″ different from the first radiation-cured structure 4′ is formed.
  • As described hereinabove, the system 2 may include the plurality of mirrors 16 arranged in an array and disposed above the radiation-sensitive material 6. Where the system has such a configuration, the step of positioning the mirrors 16 may include individually positioning a first portion of the mirrors 16 to reflect the radiation beam 14 in the first desired direction and individually positioning a second portion of the plurality of mirrors 16 to reflect the radiation beam 14 in a second desired direction.
  • In a further embodiment where the at least one radiation source 8 includes the first radiation source 8′ and the second radiation source 8″, the method may further comprise the steps of: applying the second radiation-sensitive material 6″ to the first radiation-cured structure 4′ following the formation of the first radiation-cured structure 4′; positioning the at least one mirror 16 to reflect the first radiation beam 14 in the first desired direction; exposing the second radiation-sensitive material 6″ to the first radiation beam 14′; positioning the at least one mirror 16 to reflect the second radiation beam 14″ in a second desired direction different from the first desired direction; and exposing the second radiation-sensitive material 6″ to the second radiation beam 14″, wherein the second radiation-cured structure 4″ different from the first radiation-cured structure 4′ is formed.
  • The first and second radiation-sensitive materials 6′, 6″ may have different radiation sensitivities, for example, as described in Assignee's co-pending U.S. application Ser. No. 12/339,308, the entire disclosure of which is hereby incorporated herein by reference. It should be understood that, in lieu of applying the second radiation-sensitive material 6″ to the first radiation-cured structure 4′ following the formation thereof, the present method may include the steps of applying the second radiation-sensitive material 6″ to the first radiation-sensitive material 6′ and selectively exposing the first and second radiation-sensitive materials 6′, 6″ to different radiation types to form different radiation-cured structures 4′, 4″ in the respective materials. The first and second radiation-sensitive materials 6′, 6″ may be configured to form different radiation-cured structures 4′, 4″ based on the exposure patterns of the different radiation types directed to the first and second radiation-sensitive materials 6′, 6″, for example, by the at least one radiation directing device 10.
  • As certain nonlimiting examples, there can be more than one type of radiation source 8 used with the same set of mirrors 16, either side-by-side or joined with a partially reflective beam splitter set up backwards. The radiation source 8 may be capable of producing different types of radiation. Filters may also be inserted in front of a broad-spectrum radiation source 8 to provide more than one type of radiation. Alternatively, a second set of the mirrors 16 may be used with other radiation sources 8. Different radiation-cured constructs, having different patterns, may thereby be simultaneously formed in the different first and second radiation-sensitive materials 6′, 6″, as desired.
  • One of ordinary skill in the art should appreciate that the system 2 and method of the present disclosure mitigate the need for costly and inefficient masking techniques, processing steps, and related cleaning steps, typically associated fabrication of radiation-cured structures 4. Where masks 20 are employed under the present invention, the masks 20 are spaced apart from the radiation-sensitive material 6 and therefore do not require regular cleaning as with known fabrication methods. Similarly, the employment of mirrors 16 to direct the radiation beams 14 allows for the rapid and cost-effective formation of desired radiation-cured structures 4.
  • While certain representative embodiments and details have been shown for purposes of illustrating the invention, it will be apparent to those skilled in the art that various changes may be made without departing from the scope of the disclosure, which is further described in the following appended claims.

Claims (19)

What is claimed is:
1. A system for fabricating a radiation-cured component, comprising:
a radiation-sensitive material configured to at least one of initiate, polymerize, crosslink and dissociate with exposure to radiation;
at least one radiation source configured to project a radiation beam with a vector that does not intersect the radiation-sensitive material; and
a radiation directing device selectively positionable between an active state to an inactive state, the radiation directing device in the active state configured to receive the radiation beam projected by the at least one radiation source directly from the at least one radiation source and direct the radiation beam toward the radiation-sensitive material, and the radiation directing device in the inactive state configured to receive the radiation beam projected by the at least one radiation source directly from the at least one radiation source and direct the radiation beam away from the radiation-sensitive material.
2. The system of claim 1, wherein the radiation directing device includes at least one of a mirror and a refractor.
3. The system of claim 1, wherein the radiation directing device is rotatable about an axis to facilitate the selective positioning of the radiation directing device.
4. The system of claim 1, wherein the selective positioning of the radiation directing device includes at least one of linear and angular displacement of the radiation directing device.
5. The system of claim 1, further comprising a mask disposed between the at least one radiation source and the radiation directing device, the mask having a plurality of substantially radiation-transparent apertures for providing a desired radiation-cured structure.
6. The system of claim 1, wherein the at least one radiation source includes a first radiation source and a second radiation source.
7. The system of claim 6, wherein the first radiation source is disposed on a first side of the radiation sensitive material and the second radiation source is disposed on a second side of the radiation sensitive material.
8. The system of claim 7, wherein the radiation directing device is disposed between the first radiation source and the second radiation source and is selectively positionable to direct the radiation beams from either of the first radiation source and the second radiation source.
9. The system of claim 1, wherein the radiation directing device includes a plurality of mirrors, each of the mirrors individually selectively positionable to direct the radiation beam in a plurality of desired directions.
10. The system of claim 9, wherein the plurality of mirrors is arranged in an array disposed above the radiation-sensitive material.
11. The system of claim 1, wherein the radiation source is a pulsable radiation source that facilitates a pulsing of the radiation beam when the radiation directing device is positioned.
12. The system of claim 1, wherein the radiation directing device is a digital micromirror device including a plurality of micromirrors arranged in an array.
13. The system of claim 12, wherein each of the micromirrors has an average width of up to about 20 micrometers and each is rotatable between about +/−12 degrees.
14. The system of claim 1, wherein a sensor determines if an angle of a radiation-cured structure is within a desired tolerance.
15. The system of claim 14, wherein the radiation directing device is repositioned in response to the sensor determining that the radiation-cured structure is not within the desired tolerance.
16. A system for fabricating a radiation-cured component, comprising:
a radiation-sensitive material configured to at least one of initiate, polymerize, crosslink and dissociate with exposure to radiation;
a first radiation source disposed adjacent a first side of the radiation sensitive material and configured to project a first radiation beam with a vector that does not intersect the radiation-sensitive material;
a second radiation source disposed adjacent a second side of the radiation sensitive material and configured to project a second radiation beam with a vector that does not intersect the radiation-sensitive material; and
a digital micromirror device having a plurality of micromirrors arranged in an array.
17. The system of claim 16, wherein the digital micromirror device is disposed adjacent the radiation sensitive material and each of the micromirrors is individually selectively positionable to direct one of the first radiation beam and the second radiation beam in a desired direction and expose the radiation-sensitive material to one of the first radiation beam and the second radiation beam.
18. The system of claim 17, wherein each of the micromirrors is positioned by electrostatic attraction.
19. The system of claim 16, wherein each of the micromirrors has an average width of up to about 20 micrometers and each is rotatable between about +/−12 degrees.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150029490A1 (en) * 2013-07-25 2015-01-29 Funai Electric Co., Ltd. Laser scanning device
EP3529204A4 (en) * 2016-10-24 2020-07-22 HRL Laboratories LLC DESIGN OF A DEVICE WITH THE BASE UP FOR THE PRODUCTION OF SELF-SPREADING PHOTOPOLYMER WAVE GUIDES

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8703351B2 (en) * 2011-03-22 2014-04-22 GM Global Technology Operations LLC Plated photopolymer based fuel cell
US8546064B2 (en) 2011-03-22 2013-10-01 GM Global Technology Operations LLC Method to produce a fuel cell flowfield with photopolymer walls
CN106042607A (en) * 2015-04-17 2016-10-26 通用汽车环球科技运作有限责任公司 Method for preparing bent sandwich structure by using reconfigurable UV-source installation element
US11131929B2 (en) 2018-11-07 2021-09-28 Waymo Llc Systems and methods that utilize angled photolithography for manufacturing light guide elements
US11131934B2 (en) 2019-10-29 2021-09-28 Waymo Llc Non-telecentric light guide elements

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020061472A1 (en) * 2000-11-17 2002-05-23 Pixelligent Technologies Llc. Three-dimensional lithography by multiple two-dimensional pattern projection
US6628371B1 (en) * 1999-10-08 2003-09-30 Nikon Corporation Exposure apparatus, method for exposure, and method for manufacturing semiconductor device
US20050057757A1 (en) * 2003-09-15 2005-03-17 Xavier Colonna De Lega Low coherence grazing incidence interferometry systems and methods
US20050099611A1 (en) * 2002-06-20 2005-05-12 Nikon Corporation Minimizing thermal distortion effects on EUV mirror
US20060092393A1 (en) * 2004-10-28 2006-05-04 Asml Holding N.V. Lithographic apparatus having an adjustable projection system and device manufacturing method
US20060103908A1 (en) * 2004-11-12 2006-05-18 Asml Holding N.V. Active faceted mirror system for lithography
US20060109559A1 (en) * 2002-07-17 2006-05-25 Carl Zeiss Semiconductor Manufacturing Technologies Ag Catadioptric multi-mirror systems for projection lithography
US20060169928A1 (en) * 2005-02-02 2006-08-03 Nikon Corporation Radiantly heated cathode for an electron gun and heating assembly
US20070019305A1 (en) * 2005-07-01 2007-01-25 Wilhelm Ulrich Method for correcting a lithography projection objective, and such a projection objective
US20070030948A1 (en) * 1998-05-05 2007-02-08 Carl Zeiss Smt Ag Illumination system with field mirrors for producing uniform scanning energy
US20070064213A1 (en) * 2005-09-16 2007-03-22 Remco Jager Lithography system and projection method
US20070285638A1 (en) * 2006-06-07 2007-12-13 Asml Netherlands B.V. Mirror array for lithography
US20080074726A1 (en) * 2006-09-22 2008-03-27 Stereo Display, Inc. Micromirror array lens with encapsulation of reflective metal layer and method of making the same
US20080118867A1 (en) * 2004-05-12 2008-05-22 Morimasa Sato Pattern Forming Material, Pattern Forming Apparatus, And Pattern Forming Process

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6274288B1 (en) * 1995-06-12 2001-08-14 California Institute Of Technology Self-trapping and self-focusing of optical beams in photopolymers
US6641268B2 (en) * 2001-02-28 2003-11-04 Massachusetts Institute Of Technology Interferometric projection system
AU2002324868A1 (en) * 2002-03-04 2003-09-29 Massachusetts Institute Of Technology A method and system of lithography using masks having gray-tone features
US8110345B2 (en) 2002-12-04 2012-02-07 Taiwan Semiconductor Manufacturing Company, Ltd. High resolution lithography system and method
JP2007503611A (en) 2003-08-27 2007-02-22 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Method and apparatus for forming an optical image
US7561252B2 (en) * 2005-12-29 2009-07-14 Asml Holding N.V. Interferometric lithography system and method used to generate equal path lengths of interfering beams
US7382959B1 (en) * 2006-10-13 2008-06-03 Hrl Laboratories, Llc Optically oriented three-dimensional polymer microstructures

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070030948A1 (en) * 1998-05-05 2007-02-08 Carl Zeiss Smt Ag Illumination system with field mirrors for producing uniform scanning energy
US6628371B1 (en) * 1999-10-08 2003-09-30 Nikon Corporation Exposure apparatus, method for exposure, and method for manufacturing semiconductor device
US20020061472A1 (en) * 2000-11-17 2002-05-23 Pixelligent Technologies Llc. Three-dimensional lithography by multiple two-dimensional pattern projection
US20050099611A1 (en) * 2002-06-20 2005-05-12 Nikon Corporation Minimizing thermal distortion effects on EUV mirror
US20060109559A1 (en) * 2002-07-17 2006-05-25 Carl Zeiss Semiconductor Manufacturing Technologies Ag Catadioptric multi-mirror systems for projection lithography
US20050057757A1 (en) * 2003-09-15 2005-03-17 Xavier Colonna De Lega Low coherence grazing incidence interferometry systems and methods
US20080118867A1 (en) * 2004-05-12 2008-05-22 Morimasa Sato Pattern Forming Material, Pattern Forming Apparatus, And Pattern Forming Process
US20060092393A1 (en) * 2004-10-28 2006-05-04 Asml Holding N.V. Lithographic apparatus having an adjustable projection system and device manufacturing method
US20060103908A1 (en) * 2004-11-12 2006-05-18 Asml Holding N.V. Active faceted mirror system for lithography
US20060169928A1 (en) * 2005-02-02 2006-08-03 Nikon Corporation Radiantly heated cathode for an electron gun and heating assembly
US20070019305A1 (en) * 2005-07-01 2007-01-25 Wilhelm Ulrich Method for correcting a lithography projection objective, and such a projection objective
US20070064213A1 (en) * 2005-09-16 2007-03-22 Remco Jager Lithography system and projection method
US20070285638A1 (en) * 2006-06-07 2007-12-13 Asml Netherlands B.V. Mirror array for lithography
US20080074726A1 (en) * 2006-09-22 2008-03-27 Stereo Display, Inc. Micromirror array lens with encapsulation of reflective metal layer and method of making the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150029490A1 (en) * 2013-07-25 2015-01-29 Funai Electric Co., Ltd. Laser scanning device
EP3529204A4 (en) * 2016-10-24 2020-07-22 HRL Laboratories LLC DESIGN OF A DEVICE WITH THE BASE UP FOR THE PRODUCTION OF SELF-SPREADING PHOTOPOLYMER WAVE GUIDES

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