TW201027266A - Ilumination optical system, exposure apparatus and device manufacturing method - Google Patents

Abstract

Illumination distribution in an illumination surface and pupil intensity distribution related to every point of the illumination surface are adjusted to desired distributions. An illumination optical system to illuminate the illumination surface (M; W) with light from a light source (LS) comprises a spatial light modulator (3) having a plurality of optical elements arrayed in two dimension and controlled respectively; a condensing optical system (4) forming a determined optical density distribution on an optical Fourier transform surface (5a) with respect to the array surface of the plurality of the optical elements according to a light passed through the spatial light modulator (3); optical integrator (5) having a plurality of unit wave-front division surface arrayed in two dimension on a Fourier transform surface to be formed; and a control part (CR) to control the spatial light modulator for adjusting the pupil intensity distribution formed on an illumination pupil to desired distributions according to the light from the spatial light modulator, and for adjusting optical density distributions formed in each of unit wave-front division surfaces to desired distributions.

Description

201027266 VI. Description of the invention: [Technical field to which the invention belongs]

The present invention relates to an illumination optical system, an exposure apparatus, and a component manufacturing method. More specifically, the present invention relates to an illumination optical system suitable for an exposure apparatus for manufacturing a semiconductor element, an image pickup element, and a liquid crystal display element 'thin film head' by a lithography process (thin) Film magnetic head ) and other components. [Prior Art] In the typical exposure apparatus, light emitted from a light source is formed by a fly eye lens as an optical integrator, and a plurality of light sources are formed as a substantial surface light source. Secondary light source (generally a defined light intensity distribution in an illumination pupil). Hereinafter, the light intensity distribution in the illumination pupil is referred to as "the pupil intensity distribution". Further, the illumination pupil is defined as a position which is caused by the action of the optical system between the illumination pupil and the illuminated surface (the mask or the wafer in the case of the exposure device) 5 The position of the Fourier transition plane of the illumination pupil. After the light from the secondary light source is condensed by a condenser lens, the reticle forming the predetermined pattern is superimposed and illuminated. Light passing through the reticle is imaged onto the wafer via a projection optical system, and an exposure (transfer) reticle pattern is projected on the wafer. The pattern formed on the reticle is concentrated in the south, and in order to accurately transfer the fine pattern onto the wafer, it is indispensable to obtain a uniform illuminance distribution on the wafer. Moreover, it has been proposed to form a pupil intensity distribution such as a belt-like or multi-pole shape (2-pole shape 4 4 201027266 pole shape, etc.): and to make the depth of focus or resolution of the projection optical system (reso) udonresoh'ing power; (Patent Document 1) In order to faithfully transfer a fine pattern of a photomask onto a wafer, it is necessary to adjust not only the pupil intensity distribution to a desired shape. Moreover, the relevant pupil intensity distribution at each point on the wafer must be adjusted to be approximately uniform. If the uniformity of the pupil intensity distribution at each point on the wafer is different, it will be due to each position on the wafer. The pattern line width is uneven, and it is impossible to transfer the fine pattern of the mask to the wafer at a desired line width throughout the entire exposure area. Thus, in order to accurately transfer the fine pattern of the mask onto the wafer, It is important to adjust the illuminance distribution on the wafer as the final illuminated surface and the relevant pupil intensity distribution at each point on the wafer to a desired distribution. [Invention] The present invention has been made in view of the above problems. The present invention provides an illumination optical system that can adjust the illuminance distribution in the illuminated surface and the associated pupil intensity distribution at each point of the illuminated surface to a desired distribution. Moreover, the present invention provides an exposure apparatus that can be used. The illumination optical system that adjusts the illuminance distribution on the illuminated surface and the relevant pupil intensity distribution at each point on the illuminated surface to a desired distribution, and can perform good exposure based on appropriate illumination conditions. In order to solve the above problems, the present invention A first aspect provides an illumination optical system that illuminates an illuminated surface in accordance with light from a light source, comprising: a spatial light modulator having a plurality of optical elements that are two-dimensionally arranged and individually controlled; The optical system is based on the light of the spatial light modulator described in the above-mentioned 201027266 1 - Uli. OOv, and the surface of the plurality of optical elements arranged on the spatial light modulator is converted to an optical surface. Light intensity distribution: an optical integrator with multiple orders arranged in two dimensions on the face described above as a transition of the Fourier a wavefront pre-segment surface; and the control unit 5 controls the spatial light modulator to form an illumination pupil in accordance with light passing through the concentrating optical system and the optical integrator and from the spatial light modulator The pupil intensity distribution is adjusted to a desired distribution, and the light intensity® distribution formed in each of the plurality of unit wavefront split surfaces is respectively adjusted to a desired distribution. The second aspect of the present invention provides an exposure apparatus including An illumination optical system according to a first aspect of illuminating a predetermined pattern, wherein the predetermined pattern is exposed on a photosensitive substrate. According to a third aspect of the present invention, there is provided a device manufacturing method comprising: an exposure step, using an exposure apparatus according to a second aspect And exposing the predetermined pattern to the photosensitive substrate; and developing a step of developing the photosensitive substrate on which the predetermined pattern is transferred, and forming a mask φ layer corresponding to the predetermined pattern on the photosensitive substrate a surface; and a processing step, wherein the surface of the photosensitive substrate is processed by the mask layer. In the illumination optical system of the present invention, the control unit controls the plurality of optical elements of the spatial light modulator to appropriately change the light intensity distribution formed on each unit wavefront split surface of the optical integrator, thereby forming the optical intensity The illuminance distribution on the illuminated surface is adjusted to a desired distribution (for example, a uniform distribution), and the relevant pupil intensity distribution at each point of the illuminated surface can be adjusted to a desired distribution (for example, a uniform distribution). 201027266 j. -iju.doc In other words, the illumination optical system of the present invention can adjust the distribution of the illumination i in the illuminated surface and the phase 1 optical intensity distribution of each point on the illuminated surface to a desired distribution. As a result, the exposure apparatus of the present invention can use an illumination optical system that can adjust the illuminance distribution in the illuminated surface and the relevant pupil intensity distribution of each point of the illuminated surface to a desired distribution, and performs well based on appropriate lighting conditions. The exposure allows for the manufacture of good components. The above-described features and advantages of the present invention will become more apparent from the following detailed description of the embodiments. [Embodiment] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a view schematically showing the configuration of an exposure apparatus according to an embodiment of the present invention. In FIG. 1, the normal direction of the transfer surface (exposure surface) of the wafer W, which is a photosensitive substrate, is set to the Z axis, and the direction parallel to the paper surface of FIG. 1 in the transfer surface of the wafer W is set to The Y-axis is set to X in the direction perpendicular to the paper surface of FIG. 1 in the transfer surface of the wafer W. Referring to Fig. 1, in an exposure apparatus of this embodiment, exposure light (illumination light) is supplied from a light source LS. As the light source LS, an ArF (Argon-Fluoride) excimer laser light source for supplying light of, for example, 193 nm wavelength or a KrF (Krypton-Fluoride) excimer laser light source for supplying light of 248 nm wavelength can be used. . The light emitted from the light source LS is incident on the spatial light modulation unit SU via the beam transfer unit 1. The beam transmitting portion has a function of converting an incident light beam from the light source LS into a light beam having a cross section of an appropriate size and shape, and guiding it to the spatial light modulation unit SU, and actively correcting the incident light into the spatial light modulation unit SU The position of the beam changes 201027266 n _____ri: .ac)c and the angle changes. The spatial light modulation unit SU includes a spatial light modulator 3 having a plurality of inverted mirror elements arranged in two dimensions and individually controlled: and the light guiding member 2' will be incident via the beam transmitting portion 1 The light of the spatial light modulation unit SU is directed to the spatial light modulator 3 and directs the light via the spatial light modulator 3 to a subsequent relay optical system 4. The specific constitution and function of the spatial light modulation unit SU will be described later. The light emitted from the spatial light modulation unit SU is incident on the micro-integrated ocular lens (or the compound eye frog mirror) 5 via the relay optical system 4. The relay optical system 4 is set such that the front focus position of the relay optical system 4 substantially coincides with the position of the arrangement surface of the plurality of mirror elements of the spatial light modulator 3, and the rear focus position of the relay optical system 4 is The positions of the incident faces 5a of the micro fly's eye lens 5 are substantially the same. Therefore, as described below, a desired light intensity distribution corresponding to the posture of the plurality of mirror elements is formed on the incident surface 5a of the micro-antoscopic lens 5 via the light of the spatial light modulator 3. The micro-overlocular lens 5 is, for example, an optical element composed of a plurality of microlenses having a positive refractive index which are vertically and horizontally arranged in a densely arranged manner, and is formed by performing an etching treatment on a parallel plane plate to form a microlens group. Unlike a compound eye lens composed of mutually isolated lens elements, the micro eye-eye lens integrally forms a plurality of microlenses (micro-refractive surfaces) which are not isolated from each other. However, in terms of the longitudinal and horizontal arrangement of the lens elements, the micro eye lens and the fly eye lens are both wavefront split type optical integrators. The rectangular micro-refractive surface as the unit wavefront splitting surface in the micro-eye lens 5 presents the shape of the illumination field to be formed on the mask (and the wafer W should be shaped 201027266).

j--.i-i.'ii.QOC into the shape of the exposed area) similarly short. Further, as the eye-recovering lens 5, for example, a columnar micro-eye lens fcylind: 丨ca: microfly eye lens can also be used. The constitution and action of the columnar micro fly's eye lens are disclosed, for example, in U.S. Patent No. 6.913,373. The light incident on the main micro-folding eye lens 5 is two-dimensionally divided by a plurality of micro-periscopes, and is formed on the rear side focal plane of the micro-fussy lens 5 or the illumination pupil of the micro-furanic lens 5: having an incident beam The resulting secondary light source (ie, the pupil intensity distribution) of the light intensity distribution having substantially the same illumination field of view. The light beam of the secondary light source formed from the rear focal plane of the micro-fussy lens 5 or the vicinity of the micro fly's eye lens 5 is incident on the aperture stop 6 disposed in the vicinity of the micro fly's eye lens 5. The aperture stop 6 has an opening portion (light transmitting portion) having a shape corresponding to a secondary light source formed in the vicinity of the rear focal plane or the micro menigda lens 5 of the micro fly's eye lens 5. The aperture stop 6 is configured to be detachably attachable to the illumination optical path, and is configured to be switchable to a plurality of aperture stops having openings having different sizes and shapes. As the switching method of the aperture stop, for example, a well-known turret method, a slide method, or the like can be used. The aperture stop 6 is disposed at a position that is substantially optically shared with the incident pupil plane of the projection optical system PL described below, and defines a range of illumination that contributes to the secondary light source. Furthermore, the setting of the aperture stop 6 can also be omitted. The light from the secondary light source limited by the aperture stop 6 is superimposedly illuminated by a concentrating optical system 7 to a mask blind 8. In this way, at the reticle 8 as the illumination field stop, a shape corresponding to the shape of the rectangular micro-refractive surface of the micro-integrated lens 5 and the focal length is formed. 201027266 ... ~ .1 \-J 1. :.cioc Shaped illumination field of view. The luminescence of the rectangular opening (transmission portion:) passing through the diaphragm δ is subjected to the condensing action of the image optical system 9 and the superimposed illumination is performed on the mask 形成 on which the predetermined pattern is formed. That is, the imaging optical system 9 forms an image of the rectangular opening of the mask mask 8 on the mask. The light beam that has passed through the mask 保持 held on the mask stage MS is formed on the wafer (photosensitive substrate) W held on the wafer stage TvVS via the projection optical system PL'. Thus, in a plane (XY plane) orthogonal to the optical axis AX of the projection optical system PL, two-dimensional drive control is performed on the wafer carrier WS, and the wafer W is two-dimensionally driven and controlled. Make a single exposure or scan exposure. Thereby, the pattern of the mask 依次 is sequentially exposed to each exposure region of the wafer W. In the present embodiment, the secondary light source formed by the micro fly's eye lens 5 is used as a light source, and the mask 配置 disposed on the illuminated surface of the illumination optical system is subjected to Kohler illumination. Therefore, the position at which the secondary light source is formed is optically conjugate with the position of the aperture stop A S of the projection optical system PL, so that the surface on which the secondary light source is formed can be referred to as the illumination surface of the illumination optical system. Typically, the illuminated surface (the surface on which the mask 配置 is disposed: or the surface on which the wafer W is disposed in consideration of the illumination optical system including the projection optical system PL) is an optical Fourier conversion surface with respect to the illumination pupil plane. Further, the pupil intensity distribution refers to an illumination pupil plane of the illumination optical system or a light intensity distribution (luminance distribution) in a plane optically shared with the illumination pupil plane. When the number of wavefront divisions of the micro-eye-eye lens 5 is relatively large, the overall light intensity distribution formed on the incident surface of the micro-eye lens 5 is equal to the secondary light source 201027266. The hologram ρκ·α (the overall light intensity distribution of the κ. body (the pupil intensity distribution) shows a high correlation ' correlation ) £ Therefore, the incident surface of the micro fly-eye lens 5 and the optical surface of the human eye can be optically The light intensity distribution in the conjugated face is called the pupil intensity distribution. In the configuration of FIG. 1, the spatial light modulation soap element SU, the relay optical system 4, and the micro fly's eye lens 5 are configured to form a distribution of the pupil intensity distribution in the illumination pupil on the rear side of the micro fly's eye lens 5. Optical system. Referring to Fig. 2, the pilot member 2 in the spatial light modulation unit SU has a triangular prism shape extending in the X direction, for example. The light from the light source LS passing through the light beam transmitting unit 1 is reflected by the first reflecting surface 2a of the light guiding member 2, and then incident on the spatial light modulator 3. The light modulated by the spatial light modulator 3 is reflected by the second reflecting surface 2b of the light guiding member 2 and guided to the relay optical system 4. As shown in FIG. 2 and FIG. 3, the spatial light modulator 3 includes a body 3a having a plurality of mirror elements SE arranged in two dimensions, and a driving unit 3b for individually controlling the driving of the plurality of mirror elements SE. . In order to simplify the description and the illustration, the body 3a of the spatial light modulator 3 shown in FIGS. 2 and 3 includes a configuration example of 4x4=16 mirror elements SE, but actually includes a majority far more than 6 Mirror element SE. Referring to FIG. 2, the light ray L1 is incident on the mirror element SEa of the plurality of mirror elements SE in the ray group incident on the first reflecting surface 2a of the light guiding member 2 in a direction parallel to the optical axis AX. L2 is incident on the mirror element SEb different from the mirror element SEa. Similarly, the light ray L3 enters the mirror element SEc different from the mirror elements SEa and SEb, and the light ray L4 enters the mirror element 201027266 SEd which is different from the mirror elements SEa to SEc. The mirror elements SEa to SEd apply the set spatial modulation to the light L] to L4 in accordance with the position of the mirror elements SE&~SEd. The spatial light modulator 3 is configured such that a reference state (hereinafter referred to as a "reference state") set along a plane (XY plane) of the reflection surface of all the mirror elements SE is along the optical axis AX The light rays incident in the parallel direction are reflected by the respective mirror elements SE of the spatial light modulator 3, and then reflected by the second reflection surface 2b of the light guiding member 2 in a direction substantially parallel to the optical axis AX. Further, the surface of the spatial light modulator 3 in which a plurality of ® mirror elements SE are arranged is positioned at the front focus position of the relay optical system 4 or in the vicinity of the relay optical system 4. Therefore, the light beams of a predetermined angular distribution are reflected by the mirror elements SEa to SEd of the spatial light modulator 3, and the predetermined light intensity distributions SP1 to SP4 are formed on the incident surface 5a of the micro fly's eye lens 5. That is, the relay optical system 4 converts the angle 5 of the emitted light from the mirror elements SEa to SEd of the spatial light modulator 3 to the far-field region (the wave-diffraction region of the spatial light modulator 3). Framiliofer diffraction area )' is the position on the incident surface 5a _. In this manner, the relay optical system 4 constitutes a collecting optical system that becomes optical on the arrangement surface of the plurality of mirror elements SE of the spatial light modulator 3 in accordance with the light passing through the spatial light modulator 3 The surface of the Fourier transform, that is, the incident surface 5a of the micro fly's eye lens 5 forms a predetermined light intensity distribution. The light intensity distribution (the pupil intensity distribution) of the secondary light source formed by the micro fly's eye lens 5 corresponds to the light intensity distribution formed on the incident surface 5a of the spatial light modulator 3 and the relay optical system 4.

201027266 II.—', children. CIOC As shown in Fig. 3, the inter-optical modulator 3 is a movable multi-mirror 51 containing a plurality of micro-mirror elements SE. These micro-mirror elements SE are in the reflecting surface of the surface shape In the state of the upper surface, they are regularly and two-dimensionally arranged along one plane. Each of the mirror elements SE is movable, and the inclination of the reflection surface, that is, the inclination angle and the inclination direction of the reflection surface are independently controlled by the drive unit 3b that is actuated according to the command of the control unit CP, and the respective mirror elements SE can be independently controlled. The two directions parallel to the reflecting surface, that is, the two directions orthogonal to each other (for example, the X direction and the Y direction) are used as the rotating shaft, and the desired rotating angle is rotated only continuously or discretely. That is, the tilt of the reflecting surface of each of the mirror elements SE can be two-dimensionally controlled. Further, when the reflection surface of each of the mirror elements SE is discretely rotated, it is possible to have a plurality of states (for example, *...' -2.5 degrees' - 2.0 degrees, * * * 0 degrees, + 0.5 degrees * * * +2.5 degrees, * * * ) Switch control rotation angle. Fig. 3 shows a mirror element SE having a square shape, but the outer shape of the mirror element SE is not limited to a square. However, from the viewpoint of light use efficiency, it is possible to have a shape (a shape that can be most densely filled) in such a manner that the gap of the mirror element SE becomes small. Further, from the viewpoint of light use efficiency, > 1 suppresses the interval between two adjacent mirror elements SE to a minimum required. In the present embodiment, as the spatial light modulator 3, for example, a spatial light modulator that continuously changes the directions of the plurality of mirror elements SE arranged in two dimensions is used. As such a spatial light modulator, for example, Japanese Patent Laid-Open No. Hei 10-503300, and the corresponding European Patent Publication No. 779530, Japanese Patent Laid-Open No. 2004-78136, 201027266

_______.C1C)C and U.S. Patent No. 6,9C, No. 9i5, No. 5, Patent No. 2006-5243, and corresponding US Patent No. 7.095,546, and Japanese Patent The spatial light modulator disclosed in Japanese Laid-Open Patent Publication No. Hei. No. 13437. Further, the orientation of the plurality of mirror elements SE arranged in two dimensions may be controlled in a manner in which the discreteness has a plurality of stages. In this way, in the spatial light modulator 3, by the action of the driving portion 3b that is actuated according to the control signal from the control portion CR, the plurality of mirrors are separated from each other by the SE. Each mirror element SE is set in a predetermined direction. The light reflected at a predetermined angle by the plurality of mirror elements SE of the spatial light modulator 3 forms a desired light intensity distribution in the incident surface 5a of the micro-surrounded eye lens 5, and further in the micro fly's eye lens 5. At the rear focus surface or the illumination pupil (the position where the aperture stop 6 is disposed) in the vicinity of the micro fly's eye lens 5, a pupil intensity distribution having a desired shape and size is formed. Furthermore, other illumination light pupil positions that are optically conjugate with the aperture stop 6, that is, the pupil position of the imaging optical system 9, and the optical pupil position of the φ projection optical system PL (configured with the aperture stop AS) Position) to form the desired pupil intensity distribution. In the case of the exposure apparatus, in order to transfer the pattern of the mask enamel to the wafer W with high precision and faithfulness, it is important to perform exposure in accordance with appropriate lighting conditions corresponding to the pattern characteristics. In the present embodiment, the spatial light modulator 3 in which the postures of the plurality of mirror elements SE are individually changed is used as a mechanism for variably forming a light intensity distribution in the illumination pupil. Therefore, by the action of the spatial light modulator 3, the pupil intensity distribution (and thus the illumination condition) formed in the illumination pupil 15 201027266" can be freely and rapidly changed. However, when it is not to be final. When the illuminance distribution on the wafer w of the illuminated surface and the pupil intensity distribution associated with each point on the wafer W are adjusted to a desired distribution (for example, a uniform distribution), the micro-town of the mask cannot be s The pattern is accurately transferred onto the crystal garden W. Therefore, the present embodiment includes: the illuminance is divided into the measuring unit i 〇, and the illuminance distribution in the image plane of the projection optical system PL is measured; the pupil intensity distribution measuring unit 丨 15 Measuring the pupil intensity distribution in the pupil plane of the projection optical system PL according to the light passing through the projection optical system PL; and the control unit CR according to the measurement result of the illuminance distribution measuring section 10 and the pupil intensity distribution measuring section 11 The measurement results are controlled to control the posture of the plurality of optical elements SE of the spatial light modulator 3. The illuminance distribution measuring unit 1 monitors the illuminance distribution in the image plane of the projection optical system PL according to a well-known configuration. The pupil intensity distribution measuring unit 11 includes a charge coupled device (CCD) imaging unit, and the charge coupled device imaging unit has an imaging surface, and the imaging surface is disposed optically with, for example, a pupil position of the projection optical system PL. The position of the ί, and the relevant pupil intensity distribution at each point on the image plane (ie, the illuminated surface) of the projection optical system PL (the light incident on each point is formed on the pupil plane of the projection optical system PL) The intensity distribution of the pupil is monitored. For the detailed configuration and function of the pupil intensity distribution measuring unit 11, reference is made to, for example, U.S. Patent Publication No. 2008/0030707. In the following description, in order to make the effect of the present embodiment easy to understand, the rear side focal plane of the micro fly's eye lens 5 or the vicinity of the micro fly's eye lens 5 201027266; an 'i pu.doc' illumination 曈' formation map 4 shows a substantially elliptical solid surface light source (hereinafter referred to as "the two-pole pupil intensity distribution (secondary light source) 20 of the surface light sources 20s and 20b. Moreover, in the following description, In the case of "illumination pupil", it means an illumination pupil that is in the vicinity of the rear focal plane of the micro fly's eye lens 5 or the micro fly-eye lens 5. Referring to Fig. 4, the 2-pole pupil intensity distribution formed in the illumination pupil is 20 A pair of surface light sources 20a and 20b spaced apart in the Z direction with the optical axis AX interposed therebetween. The light forming the 2-pole pupil intensity distribution 20 is as shown in FIG. 5, and 10 is incident on the vertical and horizontal directions of the micro fly's eye lens 5. Among the plurality of rectangular microlenses 5b arranged, that is, a plurality of microlenses 5ba hatched in the figure. However, in FIG. 5, in order to clarify the drawings, the rectangles constituting the micro fly's eye lens 5 are formed. The number of microlenses 5b appears to be much smaller than the actual number. Thus, The fly-eye lens 5 constitutes an optical integrator having a plurality of unit wavefront split faces (incidence faces of the respective microlenses 5b) arranged in two dimensions, and having multiple reflections in the spatial light modulator 3 The arrangement surface of the mirror element SE is the surface of the optical Fourier transform. Further, the plurality of unit wavefront division surfaces of the microscopic eye @ lens 5 are arranged in two dimensions and the mask 作为 (and thus the wafer W) as the illuminated surface. Further, in a range in which the effects of the embodiment are achieved, a plurality of unit wavefront split surfaces in which the micro fly's eye lens 5 is two-dimensionally arranged may be disposed in the self-spaced light modulator 3 The arrangement surface of the plurality of mirror elements SE is a position where the surface of the optical Fourier transform is defoucs. Further, in the range of the effect of the present embodiment, the two-dimensional eye lens 5 may be two-dimensionally Arranged multiple unit wavefront split planes are arranged in: self-contained as being illuminated 17 201027266

The pupils 1 and 4 (wafer W) of the second i jpU.CiCK plane are positions where the optical conjugate surface is out of focus. Fig. 6 is a view for explaining the operation of the embodiment. In order to make the description easy to understand, it is shown that the four microlenses 5ba of the plurality of microlenses 5b constituting the micro fly's eye lens 5 that emit light in accordance with the two-pole pupil intensity distribution 20 are shown. 'and one microlens 5bb that is not incident on the light. Further, the intensity distribution of the light incident on the \Z plane of the light incident on the four microlenses 5ba by the hatched area is indicated by the hatched area. At this point, the intensity of the incident light is larger at the position where the Y-direction of the hatched area is larger. In the present embodiment, the spatial light modulator 3 has a plurality of mirror elements SE which are far larger than the number of microlenses 5b constituting the micro eye lens 5, and the postures of the mirror elements SE can be individually changed. Therefore, the light intensity distribution formed on the incident surface 5a of the micro-antificate eye lens 5 can be freely changed by the operation of the spatial light modulator 3, and the incident of each microlens 5b incident on the micro fly's eye lens 5 can be made. The intensity distribution of the light in the face (ie, the wavefront split face of each unit) is free to change. In the example shown in FIG. 6, the intensity distributions of the light incident on the two microlenses 5ba located in the +Z direction are the same as each other, and the intensity distributions of the light incident on the two microlenses 5ba located in the -Z direction are mutually the same. Further, the intensity distribution of the light incident on the two microlenses 5ba on the +Z direction side and the intensity distribution of the light incident on the two microlenses 5ba on the -Z direction side are symmetrical with respect to the light vehicle by AX. Specifically, in the intensity distribution of the light incident on the two microlenses 5ba in the +Z direction ', the intensity is the largest at the end on the +Z direction side, and the intensity at the center position along the Z direction is the smallest, the self direction One side of the side is facing

201027266 G0C The central position intensity is monotonously reduced by 5 and is increased from the central position toward the -z universal side. At this time, the intensity distribution of the light incident on the four microlenses 5ba is superimposed on the position of the mask mask 8 that is optically conjugate with the light-shielding surface 4 and the wafer (the wafer W). Forming a substantially uniform illuminance in one sentence. The light reaching the center point in the exposure area on the wafer W (the still exposure area in the case of scanning exposure), that is, the center point P1 of the opening reaching the mask mask S The light, as shown by the broken line in Fig. 6, is the light having the smallest intensity passing through the center position of the four micro φ lenses 5ba. Therefore, as shown in the central view of FIG. 7, the 2-pole light intensity distribution formed by the light reaching the center point P1 in the illumination pupil, that is, the pupil intensity distribution 21 associated with the center point P1, the +Z direction The light intensity of the side surface light source 2 a is equal to the light intensity of the surface light source 21 b on the -Z direction side, and the light intensity thereof is relatively small. The light reaching the one peripheral point in the Y direction from the center point in the exposure region on the wafer W, that is, the light reaching the +Z direction side peripheral point P2 of the opening portion of the mask mask 8 is from the +Z direction The φ light of the two microlenses 5ba on the side is light having a relatively large intensity passing through one end on the -Z direction side as shown by a thin solid line in Fig. 6, and light of two microlenses 5ba from the -Z direction side is as The thick solid line in Fig. 6 shows the light having the strongest intensity at one end on the -Z direction side. Therefore, as shown in the left diagram of FIG. 7, the 2-pole light intensity distribution formed on the illumination pupil at the light reaching the peripheral point P2, that is, the pupil intensity distribution 22 associated with the peripheral point P2, +Z The light intensity of the surface light source 223 on the direction side is relatively large, and the light intensity of the surface light source 22b on the -Z direction side is the largest. From the center point in the exposure area on the wafer W along the Y direction to the other 201027266 ^'the light of the pi-.Cd side of the station', that is, the -z side of the opening of the light shielding device s The light from the south side of the point P? is from the light of the 2 偃 microlens 5bs on the -Z direction side. As shown by the thick solid line, the light with the strongest intensity at the end of the universal side is the g-Ζ direction. The light of the two micro-mirrors 5ba on the side is light having a relatively large intensity passing through one end on the +Z direction side as shown by a thin solid line in FIG. Therefore, as shown in the right side view of FIG. 7, the 2-pole light intensity distribution formed by the light reaching the peripheral point P3 in the illumination pupil, that is, the pupil intensity distribution 23 associated with the peripheral point P3 is 5 + Z. The surface light source 23a on the direction side has the largest light intensity, and the surface light source 23b on the -Z direction side has a relatively large light intensity. As described above, in the example shown in FIGS. 6 and 7, the pupil intensity distribution associated with the predetermined one point P2 on the illuminated surface 8 is the first pupil intensity distribution 'and is made on the illuminated surface 8 The pupil intensity distribution associated with the other one point (P1 or P3) different from the predetermined one point P2 is the second pupil intensity distribution. In this way, the light intensity distribution formed in each of the plurality of unit wavefront split surfaces is two or more light intensity distributions. In the example shown in FIG. 6 and FIG. 7 described above, in other words, the first setting step 'sets the pupil intensity distribution target associated with the predetermined one point P 2 that is irradiated back, that is, the first target pupil intensity. In the second setting step, the pupil intensity distribution target related to the other one point (P1 or P3) different from the predetermined one point P2 on the illuminated surface, that is, the second target pupil intensity distribution is set. Here, the pupil intensity distribution associated with the predetermined one point P2 is the first target pupil intensity distribution, and the pupil intensity associated with the other point (P] or P3) is divided into the second target light.瞳Intensity distribution method ・Adjust the pupil intensity distribution formed in the illumination pupil, and adjust the light intensity distribution formed in each of the plurality of unit wavefront division planes according to 201027266. In this case, the method may further include: a first distinguishing step of distinguishing the target pupil intensity distribution according to the plurality of unit wavefront splitting faces, and the i-th light intensity is different from the different ones. The light intensity of the position corresponding to the ί point specified by the above-mentioned target pupil intensity distribution; the second distinguishing step, the second target pupil intensity distribution is distinguished based on the plurality of unit wavefront division surfaces; and the second light intensity calculation step Calculating the light intensity at a position corresponding to the other one point in the second target source pupil intensity distribution, and the calculation step, based on the predetermined 1 calculated by the first and second light intensity calculation steps The light intensity distribution at the position corresponding to the plurality of unit wavefronts is calculated by the light intensity 5 at the position corresponding to the other point (Ρ1 or Ρ3). Next, in the example shown in FIG. 8, the intensity distribution of the light in the two microlenses 5ba incident on the +Ζ direction side in FIG. 6 is the same distribution of light, and the microlens 5ba incident on the -Z direction side is made. The intensity distribution of the light in the two microlenses 5ba incident on the -Z φ direction side in FIG. 6 is the same as that of the light, and is incident on the microlens 5ba on the +Z direction side. In the example shown in FIG. 8, in the same manner as the example shown in FIG. 6, the mask mask 8 which is an optical common vehicle with the mask Μ (and thus the wafer W) as the illuminated surface is also used. The position is such that the intensity distribution of the light incident into the four microlenses 5ba is superimposed to form a substantially uniform illuminance distribution. Further, the light reaching the center point P1 of the opening portion of the mask mask 8 is 201027266 through the center position of the four microlenses 5ba; the light having the highest intensity of jpi:.aoc ^ is shown as a broken line in Fig. 8 . Therefore, the center 匮 of the figure 9 is shown in Fig. 9. The intensity of the pupil light source 21 ε on the side of the 'Z direction' and the surface light source on the side of the -Ζ direction The light intensity of 21 D is equal to each other and its light intensity is relatively small. Among the light reaching the peripheral point Ρ2 of the opening of the mask mask 8, the light from the two microlenses 5ba on the -Ζ direction side is the strongest one passing through the one end in the -Z direction as shown by the thick solid line in FIG. Light, the light from the two microlenses 5ba on the -Z direction side is light having a relatively large intensity passing through one end on the -Z direction side as shown by a thin solid line in Fig. 8, and therefore, as shown in the left side view of Fig. 9, In the pupil intensity distribution 22 associated with the peripheral point P2, the light intensity of the surface light source 22a on the +Z direction side is the largest, and the light intensity of the surface light source 22b on the -Z direction side is relatively large. Among the light reaching the peripheral point P3 of the opening of the mask mask 8, the light from the two microlenses 5ba on the +Z direction side is relatively strong as shown by the thin solid line in Fig. 8 through the one end in the +Z direction side. The light of the large light 5 from the two microlenses 5ba on the -Z direction side is the light having the strongest intensity passing through one end on the +Z direction side as shown by the thick solid line in FIG. Therefore, as shown in the right side view of Fig. 9, in the pupil intensity distribution 23 associated with the peripheral point P3, the light intensity of the surface light source 23a on the direction side is relatively large, and the light intensity of the surface light source 23b on the -Z direction side is the largest. . However, for example, referring to FIG. 6, it can be understood that in the optical ideal state, when the intensity of light incident on the four microlenses 5ba is uniform and equal to each other, the position of the reticle 8 is formed. Uniform illuminance distribution cloth 5 叩 叩 于 作 作 作 作 τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 Further, it can be understood that the pupil intensity distributions 21, 22' 23 associated with the respective points PI, P2, P3 of the opening portion of the mask mask s A · each of the surface light sources 2]a, 2] b, 22a The light intensity of 22b, 23a, and 23b is equal to each other. That is, the distribution of the intensity of the light source associated with each point in the opening of the mask mask 8 is made uniform, and the intensity distribution of the pupils associated with each of the exposed areas on the wafer W is also uniform. However, in the actual optical system, even if the intensity distribution of the light incident into the desired microlens 5ba is set to be uniform and equal to each other, it may not be in the position of the reticle 8 for each of 10 reasons. A uniform illuminance distribution is obtained, and a uniform pupil intensity distribution is obtained at each point in the opening of the reticle 8 . Furthermore, even if a uniform illuminance distribution is obtained in the position of the reticle 8 and a uniform pupil intensity distribution is obtained at each point, it is not necessarily possible to obtain a uniform illuminance distribution on the wafer W, and on the wafer W. A uniform pupil intensity distribution is obtained for each point in the exposed area. This means that in an actual optical system, in order to obtain a uniform illuminance distribution on the wafer W, it is required to adjust, for example, the illuminance distribution in the position φ of the reticle 8 to a desired distribution that is not uniform. Moreover, this case means that, in order to obtain a uniform pupil intensity distribution at each point in the exposed area on the wafer W, it is required to, for example, the pupil intensity associated with each point in the opening of the reticle 8 The distribution is adjusted to the desired distribution that is not uniform. Referring to FIG. 6 to FIG. 9, it can be understood that in the present embodiment, the intensity of light incident on the incident surface of each microlens 5b of the micro-manus lens 5 can be made by using the spatial light modulator 3. The distribution is appropriately changed, and the illuminance distribution formed at the position of the reticle 8 is maintained substantially uniform, and 201027266 ......, _!) u.ck). The pupil intensity distribution associated with the point PI, Ρ2 \ P3 of the opening mask of the reticle-g is independently adjusted. Further, it is easy to estimate that the case where the intensity of the light in each of the unit wavefront splitting planes is appropriately changed by the plane of the respective microlenses 5b can be formed in the mask s The illuminance distribution at the position is adjusted to a desired distribution, and the pupil intensity distribution associated with each point in the opening portion of the reticle 8 is adjusted to a desired distribution. That is, in the present embodiment, the control unit The CR individually controls the postures of the plurality of mirror elements SE of the spatial light modulator 3, and appropriately adjusts the light intensity distribution among the plurality of unit wavefront split surfaces formed in the micro fly's eye lens 5, thereby appropriately changing The illuminance distribution formed in the exposed area on the wafer V, .7 (or the illumination area on the mask) at the position where the position of the optical mask 8 is optically shared can be adjusted to the desired The distribution of the pupil intensity distribution associated with each point in the exposed area on the wafer W (or the illumination area on the mask) is adjusted to the desired distribution. Thus, the control unit CR has the following functions: Performing on the spatial light modulator 3 The light intensity distribution formed in the illumination pupil is adjusted to a desired distribution according to the light from the spatial light modulator 3 via the relay optical system 4 and the micro fly-eye lens 5, and will be formed in the micro compound eye, respectively. The light intensity distribution of each of the plurality of unit wavefront splitting surfaces of the lens 5 is adjusted to a desired distribution. Specifically, in the present embodiment, the control unit CR measures the light intensity distribution according to the illuminance distribution measuring unit 10 and the pupil intensity distribution. The measurement result of the measuring unit 1] controls the posture of the plurality of mirror elements SE of the spatial light modulator 3, and the 201027266 i.QOv crystal garden W located at the image plane position of the projection optical system PL can be controlled. The illuminance distribution formed by the upper exposure region is adjusted to a desired distribution: for example, a uniform distribution) and the light incident on each point in the exposure region on the crystal field W is respectively in the projection optical system PL. The pupil intensity distribution formed by the 瞳 position is adjusted to a desired distribution (for example, uniform thinning) & As described above, the illumination optical system (1 to 1) of the present embodiment can be used as the final Photo W illuminance distribution on the wafer surface, and associated with each point in the exposure area on the wafer W is adjusted to the pupil intensity distribution of the reference distribution desired. Therefore, in the exposure apparatus (1 to)], MS, PL, and WS) of the present embodiment, an illuminance distribution on the wafer W and a pupil associated with each point in the exposure area on the wafer W can be used. The intensity distribution is adjusted to the desired distribution of the illumination optical system (1 to 11), according to appropriate illumination conditions corresponding to the fine pattern of the mask 以 for good exposure, and thus the desired line width throughout the entire exposure area. The fine pattern of the mask 准确 is accurately transferred onto the wafer W. Further, in the above-described embodiment, the relay optical system 4 as a collecting optical system that functions as a Fourier transform lens is disposed in the optical path between the spatial light modulation unit SU and the micro φ fly-eye lens 5. However, the present invention is not limited thereto, and an optical system including an afocal optical system, a conical axicon system, a zoom optical system, or the like may be disposed instead of the relay optical system 4. Such an optical system is disclosed in International Publication No. 2005/076045 A1, and in its corresponding US Patent Application Publication No. 2006/0170901A. Further, in the above description, the illuminating aperture is formed by a deformed illumination in which a 2-pole optical polarization 201027266 ^-:M_:pU.d〇C· degree distribution is formed, that is, a 2-pole illumination is taken as an example. The explanation. However, the present invention is not limited to the two-pole illumination, for example, a belt-shaped illumination in which a wheel-shaped aperture intensity distribution is formed, or a multi-pole illumination in which a multi-pole pupil intensity distribution other than a two-pole shape is formed, and the like. The present invention is applied to obtain the same effects. Further, in the above description, the optical integrator of the wavefront division type is described as an example of the micro-folding eye lens 5 in which the lens elements are arranged vertically and horizontally and two-dimensionally. However, the present invention can be applied similarly to the columnar micro fly's eye lens disclosed in, for example, U.S. Patent No. 6,913,373, to obtain the same effects. In addition, when a columnar micro-multi-eye lens is applied, the columnar micro-multi-eye lens has a plurality of cylindrical surface-shaped refractive surfaces (first lenticular lens group) arranged in parallel in the first direction transverse to the optical axis, and Since the plurality of cylindrical surface-shaped refractive surfaces (second lenticular lens groups) are arranged side by side in the second direction orthogonal to the first direction of the optical axis, the first and second lenticular lens groups are used. Define the unit wavefront split plane. Further, in the above embodiment, the micro fly's eye lens 5 is used as the optical integrator. Instead, an inner reflection type optical integrator (typically a rod integrator) may be used. At this time, on the rear side of the relay optical system 4, the condensing lens is arranged such that the front focus position of the relay optical system 4 coincides with the rear focus position of the relay optical system 4, and is positioned at the incident end. The integrating column is disposed in such a manner as to be in the vicinity of the rear focus position of the condensing lens. At this time, the emitting end of the integrating column is located at the reticle 8 . When an integrating column is used, a position in the 201027266 image forming optical system 9 downstream of the integrating column that is optically compared with the position of the aperture stop AS of the projection optical system PL can be referred to as an illumination face. Moreover, the position of the octagonal surface of the integrating column is brought into a virtual image of the secondary light source that illuminates the surface, so that the position and the position that is optically conjugate with the position can be referred to as illumination 曈surface. Here, the position of the rear focus position passing through the relay optical system 4 coincides with the front focus position of the condensing lens, and the surface 5 perpendicular to the optical axis and the unit wave of the micro fly's eye lens 5 are two-dimensionally arranged. The front face is opposite to the face. Therefore, when the 闬 is integrated, the light intensity distribution in the plane passing through the rear focus position of the relay optical system 4 can be controlled according to the above embodiment, and the same effects as those of the above embodiment can be obtained. Further, 'in the above description; as the spatial light modulator 5 having a plurality of optical elements which are two-dimensionally arranged and individually controlled, the orientation (angle: tilt) of the plurality of reflecting surfaces which are two-dimensionally arranged is individually controlled. Space light modulator. However, the present invention is not limited thereto, and for example, a spatial light modulating variator capable of individually controlling the height (position) of a plurality of two-dimensionally arranged reflecting surfaces can be used. As such a spatial light modulator, for example, Japanese Patent Laid-Open No. Hei 6-281869, and the corresponding US Pat. No. 5,312,513, and Japanese Patent Laid-Open No. 2004-5206, No. 8 and the corresponding The spatial light modulator disclosed in Figure Id of U.S. Patent No. 6,885,493. In these spatial light modulators, the incident light can be applied to the same effect as the diffraction surface by forming a two-dimensional height distribution. Further, the above-described spatial light modulator having a plurality of reflecting surfaces arranged in two dimensions may be, for example, Japanese Patent Publication No. 2006-513442 and 201027266, corresponding to US Patent No. 6, S9L655, Japan. The invention is modified by the disclosure of the Japanese Patent Publication No. 2005-0095749, the entire disclosure of which is incorporated herein by reference. Further, in the above description, a reflective spatial light modulator having a plurality of mirror elements is used, but the present invention is not limited thereto. For example, a transmissive spatial light modulation disclosed in U.S. Patent No. 5,229,872 can also be used. Device. Further, in the above embodiment, a variable pattern forming device which forms a predetermined pattern based on predetermined electronic material may be used instead of the photomask. When such a variable pattern forming apparatus is used, even if the pattern surface is vertically disposed, the influence on the synchronization accuracy can be minimized. Further, as the variable pattern forming device 5, for example, a digital micromirror device (DMD) including a plurality of reflective elements driven based on predetermined electronic data can be used. The use of an exposure apparatus having a DMD is disclosed, for example, in the pamphlet of the International Patent Publication No. 2006/080285, the entire disclosure of which is incorporated herein by reference. Further, in addition to a non-light-emitting reflective spatial light modulator such as a DMD, a transmissive spatial light modulator may be used, or a self-luminous image display element may be used. Further, even when the pattern surface is laterally disposed, a variable pattern forming device can be used. Further, in the above embodiment, the pupil intensity distribution in each point on the surface to be irradiated is substantially uniformly adjusted, but the pupil intensity distribution in each point on the surface to be irradiated may be adjusted to be not uniform. Provision for division. And 201027266 _______.!:.00:' and · can also adjust the intensity distribution of the pupils in each point on the illuminated surface to a different standard for different gardens. For example, in order to correct the line width error caused by the uniformity of the intensity distribution of the exposure apparatus itself, and the photolithography process in combination with the exposure apparatus, the coating development processing apparatus (coating development) The line width error caused by the device other than the exposure device such as the heating/cooling treatment device can adjust the pupil intensity distribution at each point on the illuminated surface to a different predetermined distribution. As described below, the photolithography step in the manufacturing process of the semiconductor device is to expose the circuit pattern on the photoresist film after the film forming photoresist (photosensitive phase material) film of the wafer is processed, and further Development processing is performed, whereby a photoresist pattern is formed. The photolithography process is performed by a coating and developing device (coating and developing machine) and an exposure device integrally provided with the device, and the coating and developing device has a photoresist for photoresist coating on the wafer. A coating processing unit or a development processing unit that develops the exposed wafer. Further, such a coating and developing treatment apparatus includes, for example, a heat treatment device or a cooling treatment device that heats a wafer after heat treatment or cooling treatment after forming a photoresist film on a wafer or before development processing. . Here, when the thickness of the photoresist in the wafer is not uniform, or the temperature distribution in the wafer surface is uneven due to the heat treatment, the uniformity of the line width in the irradiation region may be due to the wafer W. The position of the upper illuminated area is different and presents different characteristics. Further, in the etching apparatus in which the photoresist pattern is used as a mask and the film to be etched under the photoresist pattern is etched, when the temperature distribution in the wafer surface is not uniform, the line in the irradiation region may be seen. The uniformity of the decoration is also due to the location of the irradiated area on the wafer "W same as 201027266

Two: one..d (K and present different characteristics c) such that the position of the irradiation area on the wafer, such as the development processing device or the engraving device, makes the line width of the irradiation area uniform The variation of the sexual distribution has a stable error distribution (systematic error distribution) that does not depend on the irradiation position in the wafer. Therefore, in the exposure apparatus of the above embodiment, The intensity distribution of the pupils in each point on the irradiation surface is adjusted to be different from each other to correct the variation of the uniformity distribution of the line width in the irradiation area. The above-mentioned Japanese-Taiwan optical device is maintained by the predetermined In terms of mechanical precision, electrical precision, and optical precision, various subsystems including the various components listed in the patent application scope of the present application are assembled and manufactured. To ensure the various precisions 5, before the assembly, 5 for various optical systems. Performing adjustments to achieve optical precision, for various mechanical systems to achieve mechanical precision adjustments, for various electrical systems to achieve electricity Adjustment of gas accuracy. The assembly steps from various subsystems to the exposure apparatus include mechanical connection of various subsystems, wiring connection of electrical circuits, piping connection of pneumatic circuits, etc. Of course, the various subsystems are exposed to the exposure apparatus. Before the assembly step, there are assembly steps for each subsystem. After the assembly steps of the various subsystems to the exposure device are completed, comprehensive adjustment is performed to ensure various precisions as the entire exposure device. Further, it is preferable that the exposure device is one. It is produced in a managed clean room such as temperature and cleanliness. Next, a method of manufacturing an element using the exposure apparatus of the above embodiment will be described. Fig. 10 is a flow 30 showing a manufacturing step of a semiconductor element. 201027266 1 .cioc diagram [as shown in the figure] :: The manufacturing step of the vehicle conductor element is to deposit a metal film on the crystal garden W as a substrate of the semiconductor element Du; step S40 · and in the steaming A photoresist as a v-viscosity material is applied onto the plated metal film (step S42). Next, the exposure of the above embodiment is used. The device transfers the pattern formed on the mask (the reticle) to each of the irradiation regions on the wafer W (step S44: exposure step), and develops the wafer W after the transfer is completed, that is, Development of the patterned photoresist is performed (step S46: development step). Then, the photoresist pattern formed on the surface of the wafer W by the step S46 is used as a mask to perform the surface of the wafer W. Processing such as etching (step S48: processing step). Here, the photoresist pattern means a photoresist layer having irregularities having a shape corresponding to the pattern transferred by the exposure apparatus of the above embodiment. The concave portion penetrates the photoresist layer, and in step S48, the surface of the wafer W is processed through the photoresist pattern. The processing performed in step S48 includes, for example, at least one of film formation such as I-insert or metal film on the surface of the wafer W. In the exposure apparatus of the above-described embodiment, the wafer W coated with the photoresist is patterned as a photosensitive substrate, i.e., the flat plate P5. Fig. 11 is a flow chart showing a manufacturing procedure of a liquid crystal element such as a liquid crystal display element. As shown in FIG. 1, in the manufacturing process of the liquid crystal element, a pattern forming step (step S50), a color filter, a light sheet forming step (step S52), a cell assembly step (step S54), and a module assembling step are sequentially performed. (Step S56). In the pattern forming step of step S50, the projection of the above embodiment is used on the glass substrate coated with the photoresist as the flat plate P 201027266

^ . i _ 1 /i - .〇ί K Exposure device to form a prescribed pattern such as a circuit pattern and an electrode round. The pattern forming step includes: an exposure step, a projection exposure apparatus of the above embodiment, a pattern transfer to a photoresist layer, and a development step of 'displaying a pattern of a flat sheet on which a pattern is transferred, that is, glass A photoresist layer on the substrate is formed and a photoresist layer is formed in a pattern corresponding to the pattern; and a processing step is performed; the surface of the glass substrate is processed through the developed photoresist layer. In the color filter forming step of step S52, a color light-emitting sheet is formed in which a plurality of colors (: P, ed, R), green (Green, G), and blue are arranged in a matrix. (B lue, B ) The corresponding three dot groups, or three strips of filter sets of R, G, and B arranged in the horizontal scanning direction. In the unit assembling step of step S54, a liquid crystal panel (liquid crystal cell) is assembled by using a glass substrate having a predetermined pattern formed in step S50 and a color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter. In the module assembly step of step S56, various components such as an electric circuit and a backlight module for performing display operation on the liquid crystal panel are mounted on the liquid crystal panel assembled in step S54. Further, the present invention is not limited to being applied to an exposure apparatus for manufacturing a semiconductor element, and can be widely applied, for example, to an exposure apparatus for manufacturing a liquid crystal display element formed on a square glass plate or a display device such as a plasma display. Or an exposure device of various elements such as an imaging element (CCD or the like), a micromachine, a thin film magnetic head, and a deoxyribonucleic acid (DNA) wafer. Further, the present invention is also applicable to an exposure step (exposure device) in the case where a mask of a mask having a mask pattern of 201027266 ijpii.doc (phoiomask, reticle, etc.) is formed by using a photolithography step. In the above-described actual form, the 甩ArF vehicle laser light "wavelength: 193 nm" or KrF excimer laser light (wavelength: 24 gnm:) is used as the exposure light, but the invention is not limited thereto, and the present invention can be applied to other appropriate a laser light source, for example, a laser light source that supplies laser light having a wavelength of 157 nm, etc. Further, in the above embodiment, a medium having a refractive index greater than 1.1 (typically a liquid) may be suitable. A method of filling into an optical path between the projection optical system® and the photosensitive substrate, that is, a so-called liquid immersion method. At this time, as a method of filling a liquid into an optical path between the projection optical system and the photosensitive substrate, a method may be employed. The method of partially filling a liquid disclosed in the pamphlet of WO99/49504, or the substrate to be exposed as disclosed in Japanese Laid-Open Patent Publication No. Hei. A method of moving a stage in a liquid tank, or a method of forming a liquid tank having a predetermined depth on a stage as disclosed in Japanese Laid-Open Patent Publication No. Hei 10-303114, and holding the substrate in the liquid tank. The above-described embodiment φ can also be applied to a so-called polarized illumination method disclosed in U.S. Patent Publication Nos. 2006/00901 and 2007/0146676. Further, the above embodiment is applicable to the present invention in an exposure apparatus. The illumination optical system that illuminates the mask (or wafer) is not limited thereto, and the present invention can also be applied to a general illumination optical system that illuminates an illuminated surface other than a photomask (or wafer). The above has been disclosed in the above embodiments, but it is not intended to limit the present invention, and any one of ordinary skill in the art, without departing from 201027266] _ipu.doc· The invention and the scope of the invention 当· Change and refinement, so the scope of protection of the present invention is defined as the scope of the patent, and the definition of the scope of the patent is c. [Simple diagram of the drawing] Fig. is a schematic representation of the present invention. Fig. 2 is a view for explaining the operation of the spatial light modulator in the spatial light modulation unit. Fig. 3 is a partial perspective view of a main portion of the spatial light modulator. Fig. 5 is a view schematically showing a configuration of an entrance surface of a micro fly's eye lens and a unit wave corresponding to the pupil intensity distribution of Fig. 4; Fig. 6 is a first view for explaining the operation of the present embodiment. Fig. 7 is a view showing the correlation pupil intensity distribution of points PI, P2, and P3 of Fig. 6. Fig. 8 is a view showing the present embodiment. The role of Figure 2 is illustrated. Fig. 9 is a view showing the correlation pupil intensity distribution at each point P] 'P2 ' P3 of Fig. 8; Fig. 10 is a flow chart showing a manufacturing step of a semiconductor element. Fig. 11 is a flow chart showing a manufacturing procedure of a liquid crystal element such as a liquid crystal display element. [Description of main component symbols] 1 : Beam transmission section 2: Light guiding member 201027266

J1, -.CIOC 2ε : the first reflecting surface 2b: the second reflecting surface 3: the spatial light modulator · i 3 . The body 3b : the driving portion 4 : the relay optical system 5 : the micro fly's eye lens 5a: the ten Surface β 5b ' 5ba, 5bb : microlens 6 : aperture stop 7 : concentrating optical system 8 : reticle 9 : imaging optical system 〇 : illuminance distribution measuring unit · Π: pupil intensity distribution measuring unit 20 : 2 pole-shaped pupil intensity distribution ❹ 20a, 20b: surface light source 2 22, 23: pupil intensity distribution 21a, 21b, 22a, 22b, 23a, 23b: surface light source AS: aperture stop: optical axis L1~ L4: Light LS: Light source SP1 to SP4: Light intensity distribution 201027266 32512nn.doc SU: Space light modulation cover element CR: Control unit Μ: Optical aperture P: Flat panel PL: Projection optical system P1: Center point P2, P3: Peripheral Point SE 'SEa~SEd: Mirror element S40~S56: Step ❹ "W. Wafer WS: Wafer Stage ❿ 36

Claims (1)

201027266, -.一一一一卜/上i · Q Ό, VII, patent application scope: 1. An illumination optical system; illuminating the illuminated surface according to light from a light source. The illumination optical system includes: a plurality of optical elements having a plurality of two-dimensional arrays and controlled by the same; a concentrating and non-learning system, according to the above-mentioned plurality of opticals of the spatial light modulator The arrangement plane of the elements is a surface of the optical Fourier transform, and a predetermined light intensity distribution is formed; the optical integrator has a plurality of unit wavefront split surfaces arranged in two dimensions on the surface as the transition of the passer-leaf; and a control unit; The spatial light modulator is controlled to adjust a pupil intensity distribution formed in the illumination pupil to a desired distribution according to light passing through the concentrating optical system and the optical integrator and from the spatial light modulator And adjusting the light intensity distribution formed in each of the plurality of unit wavefront split surfaces to a desired distribution. 2. The illumination optical system according to claim 1, wherein the plurality of unit wavefront division surfaces are optically co-fortunate with the illuminated surface. 3. The illumination optical system according to claim 1 or 2, further comprising: an illuminance distribution measuring unit that measures an illuminance distribution in the illuminated surface; and a pupil intensity distribution measuring unit, The intensity distribution of the pupils associated with each point on the illuminated surface is measured. 201027266 32512pii.doc The control unit measures the measurement result of the 照 according to the illuminance distribution and the measurement result of the optical 瞳 intensity distribution measurement unit The posture of the plurality of optical elements of the spatial light modulator is controlled. 4. The illumination optical system according to any one of the preceding claims, wherein the spatial light modulator comprises: a plurality of mirror elements of two-dimensional miscellaneous columns; The movement of the elements of the Han Mirror is driven by the drive of the early 彳苟 control. 5. The illumination optical system according to claim 4, wherein the drive unit changes the direction continuity or the dispersibility of the plurality of mirror elements. 6. The illumination optical system according to any one of claims 1 to 5, wherein the illumination optical system is combined with a projection optical system that forms a surface that is optically shared with the illuminated surface. And the illumination pupil is located at a position optically shared with the aperture stop of the projection optical system. 7. The illuminating optical system according to any one of the preceding claims, wherein the optical intensity distribution associated with a predetermined one point on the illuminated surface is used as the first light a 瞳 intensity distribution, and a pupil intensity distribution of another one point different from the predetermined point on the surface to be irradiated is used as the second pupil intensity distribution, and the plurality of unit wavefront split surfaces are formed The light intensity distribution among the respective ones is two or more light intensity distributions. 8. The illumination optical system according to claim 7 of the patent application, further comprising: 38 201027266 !, <TS r pupil intensity distribution measuring section', the pupil intensity distribution associated with each point on the illuminated surface Performing measurement ^ The control unit controls the posture of the plurality of optical elements of the spatial light modulator so as to correlate the predetermined point on the illuminated surface measured by the pupil intensity distribution measuring unit The 瞳 intensity distribution is the first pupil intensity distribution, and the pupil intensity distribution related to the other 1 ® point different from the predetermined one point on the illuminated surface measured by the pupil intensity distribution measuring unit is used as the 2 pupil intensity distribution. An exposure apparatus comprising: the illumination optical system according to any one of claims 1 to 8, wherein the predetermined pattern is exposed on the photosensitive substrate. 10. The exposure apparatus according to claim 9, comprising: the projection optical system 5 forming an image of the predetermined pattern on the photosensitive substrate. The exposure apparatus according to claim 10, wherein the illuminance distribution measuring unit measures an illuminance distribution in an image plane of the projection optical system, and the pupil intensity distribution measuring unit passes the projection The light of the optical system is measured for the pupil intensity distribution in the pupil plane of the projection optical system described above. 12. A method of manufacturing a component, comprising: an exposing step, using any of the claims in the scope of claim 9 to the first item 39 201027266 2: "〇ί::αο: a description of the exposure device' The foot pattern is exposed to the photosensitive substrate 2: a developing step of developing the calender substrate on which the predetermined pattern is transferred, and forming a mask layer having a shape corresponding to the predetermined pattern on a surface of the photosensitive substrate: And a processing step of squeezing the surface of the photosensitive substrate through the mask layer. 13. A control method for controlling a spatial light modulator, wherein the spatial light modulator is assembled to an illumination optical system that illuminates an illuminated surface according to light from a light source, and wherein the spatial light modulator has two Dividing a plurality of optical elements that are individually controlled, the control method comprising: a first adjustment step, based on light passing through the concentrating optical system and the optical integrator and from the spatial light modulator, to be formed in the illumination pupil The pupil intensity distribution is adjusted to a desired distribution, and the concentrating optical system forms a predetermined light intensity distribution on a surface on which the array surface of the plurality of optical elements of the spatial light modulator is optically Fourier-converted. The integrator has a plurality of unit wavefront & split planes arranged two-dimensionally on the surface as the Fourier transform; and a second adjustment step of distributing the light intensity distribution among the plurality of unit wavefront split planes Adjust to the desired distribution separately. 14. The control method according to claim 13, wherein the first adjustment step and the second adjustment step are performed simultaneously. 15. The control method 5 as described in claim 13 or 14 includes: 40 201027266 :··”:, i”ριι· do. In the first setting step, the first target pupil intensity distribution, which is the target of the pupil intensity distribution associated with the predetermined I point on the illuminated surface, and the second setting step are set; the setting and the description are irradiated by I®丄. The other point-dependent pupil intensity distribution target of the above-mentioned point] is the second target pupil intensity distribution; wherein 'the first and second adjustment steps described above' are related to the above-mentioned ί points. The intensity distribution is used as the first target pupil intensity distribution, and the pupil intensity distribution associated with the other point is used as the second target pupil intensity distribution, and the aperture formed in the illumination pupil is adjusted. The intensity distribution is adjusted, and the light intensity distribution formed in each of the plurality of unit wavefront split surfaces is adjusted. 16. The control method according to claim 15, comprising: a first distinguishing step of distinguishing the first target pupil intensity distribution from the plurality of unit wavefront splitting surfaces; and a first light intensity calculating step, Calculating, respectively, a light intensity at a position corresponding to the predetermined one point in the first target pupil intensity distribution; 0. The second dividing step distinguishes the second target pupil based on the plurality of unit wavefront dividing surfaces The intensity distribution; the second light intensity calculation step 'differently different from the light intensity of the position corresponding to the other point in the target pupil intensity distribution of the second division, and the calculation step, according to the first and second light passing through The light intensity calculated by the intensity calculation step and corresponding to the above-mentioned one point and the other one point is calculated as 201027266 ijpii.aoc 'light intensity distribution c π. The illumination optical system 'illuminates the illuminated surface according to the light from the light source. The illumination optical system comprises: a spatial light modulator having a two-dimensional arrangement a plurality of optical elements that are individually controlled: a collecting optical system that is optically Fourier-converted on an arrangement surface of the plurality of optical elements of the spatial light modulator according to light passing through the spatial light modulator Forming a predetermined light intensity distribution; an optical integrator having a plurality of unit wavefront split surfaces having a two-dimensional ❹ arrangement on the surface of the Fourier transform; and a control unit according to items 13 to 16 of the patent application scope The control method according to any of the preceding claims, wherein the spatial light modulator is controlled. ❿ 42