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US20130014919A1 - Heat pipe - Google Patents

Heat pipe Download PDF

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Publication number
US20130014919A1
US20130014919A1 US13/220,642 US201113220642A US2013014919A1 US 20130014919 A1 US20130014919 A1 US 20130014919A1 US 201113220642 A US201113220642 A US 201113220642A US 2013014919 A1 US2013014919 A1 US 2013014919A1
Authority
US
United States
Prior art keywords
wick
layers
heat pipe
casing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/220,642
Other languages
English (en)
Inventor
Sheng-Liang Dai
Yue Liu
Hai-Ping Shen
Wen-Hu Chen
Jia-Hong Wu
Yu-Liang Lo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furui Precise Component Kunshan Co Ltd, Foxconn Technology Co Ltd filed Critical Furui Precise Component Kunshan Co Ltd
Assigned to FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, WEN-HU, DAI, Sheng-liang, LIU, YUE, LO, YU-LIANG, SHEN, Hai-ping, WU, Jia-hong
Publication of US20130014919A1 publication Critical patent/US20130014919A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Definitions

  • the present disclosure relates to heat transfer/dissipating device, and more particularly to a heat pipe.
  • Heat pipes have excellent heat transfer performance due to their low thermal resistance, and therefore are an effective means for heat transfer from heat sources.
  • a heat pipe is usually a vacuum casing containing therein a working fluid, and a wick structure.
  • FIG. 1 is a longitudinally cross-sectional view of a middle part of a heat pipe, in accordance with a first embodiment of the present disclosure.
  • FIG. 2 is a transversely cross-sectional view of the heat pipe, in accordance with the first embodiment of the present disclosure.
  • FIG. 3 is a transversely cross-sectional view of a heat pipe, in accordance with a second embodiment of the present disclosure.
  • FIG. 4 is a transversely cross-sectional view of a heat pipe, in accordance with a third embodiment of the present disclosure.
  • the casing 10 is sealed and has a cylindrical shape.
  • the casing 10 is typically made of high thermally conductive materials such as copper or copper alloys.
  • the casing 10 defines a vacuum sealed chamber 50 , which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from the evaporating section to the condensing section.
  • the wick structure assembly 30 has a multiple layer structure consisting of a plurality of wick layers 32 along a radial direction of the heat pipe 100 .
  • the wick structure assembly 30 includes eight wick layers 32 stacked at an inner surface of the casing 10 in sequence, and the wick layers 32 communicate with each other.
  • the wick layers 32 respectively define a plurality of pores 320 therein. In the present embodiment, diameters of the pores 320 of the wick layers 32 gradually decrease from the inner wall to center of the casing 10 .
  • the wick layers 32 include a first wick layer 32 a adjacent to and connect to the inner wall of the casing 10 , and a second wick layer 32 b near the center of the casing 10 and away from the inner wall of the casing 10 .
  • the heat pipe 100 has a relatively large capillary force and a relatively low flow resistance, so as to effectively and timely bring the condensed working liquid back from the condensing section to the evaporating section.
  • the working liquid 20 is received in the casing 10 , and can flow from the condensing section to the evaporating section via capillary force provided by the wick structure assembly 30 .
  • the working liquid 20 at the evaporating section is heated and vaporized to the condensing section.
  • the vaporized working fluid 20 exchanges heat at the condensing section and is condensed to liquid.
  • the condensed working fluid 20 returns to the evaporating section via the wick structure assembly 30 .
  • the working liquid 20 can be selected from a group consisting of water, alcohol, ammonia and combination thereof.
  • an amount of wick layers 32 can be three, four, five, six or seven, and the second wick layer 32 b is sintered powder wick layer, and the other wick layer 32 are fine-mesh wick layers.
  • a heat pipe 600 according to a second embodiment of the present disclosure is shown.
  • a wick structure assembly 60 of the heat pipe 600 includes a plurality of wick layers 62 , and the wick layers 62 are groove-type wick layers and fine-mesh wick layers alternately stacked together.
  • the wick layers 62 are communicated with each other, and diameters of the pores 620 of each of the wick layers 62 gradually decrease from the inner wall to center of the casing 10 .
  • the wick layers 62 include a first wick layer 621 , a second wick layer 622 , a third wick layer 623 , a fourth wick layer 624 , a fifth wick layer 625 , a sixth wick layer 626 , a seventh wick layer 627 and an eighth wick layer 628 stacked at an inner surface of the casing 10 in sequence, and along directions from the inner wall to center of the casing 10 .
  • the first, third, fifth and seventh wick layers 621 , 623 , 625 , 627 are fine-mesh wick layers
  • the second, fourth, sixth, and eighth wick layers 622 , 624 , 626 , 628 are groove-type wick layers.
  • the wick layer assembly 70 includes a plurality of wick layers 72 , and the wick layers 72 are fine-mesh wick layers and sintered powder wick layers alternately stacked together.
  • the wick layers 72 are communicated with each other, and diameters of the pores 720 of each of the wick layers 72 gradually decrease from the inner wall to center of the casing 10 .
  • the wick layers 72 include a first wick layer 721 , a second wick layer 722 , a third wick layer 723 , a fourth wick layer 724 , a fifth wick layer 725 , and a sixth wick layer 726 stacked at an inner surface of the casing 10 in turn, and along directions from the inner wall to center of the casing 10 .
  • the first, third, and fifth wick layers 721 , 723 , 7257 are fine-mesh wick layers
  • the second, fourth, and sixth wick layers 722 , 724 , 726 , 728 are sintered powder wick layers.
  • the wick layer assembly 70 can be consist of four wick layers 72 , and the four wick layers 72 are fine-mesh wick layers and sintered powder wick layers alternating with each other.
  • the heat pipe 700 has a smaller liquid resistance and greater capillary force than the conventional sintered heat pipe.
  • the heat pipes 100 , 600 , 700 can be elongated plate heat pipe, and the casing 10 can be rectangle shape, and an amount of the wick layers 32 , 62 , 72 can be three, four, five, six, seven or eight.

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/220,642 2011-07-15 2011-08-29 Heat pipe Abandoned US20130014919A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2011101983340A CN102878843A (zh) 2011-07-15 2011-07-15 热管
CN201110198334.0 2011-07-15

Publications (1)

Publication Number Publication Date
US20130014919A1 true US20130014919A1 (en) 2013-01-17

Family

ID=47480267

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/220,642 Abandoned US20130014919A1 (en) 2011-07-15 2011-08-29 Heat pipe

Country Status (3)

Country Link
US (1) US20130014919A1 (zh)
CN (1) CN102878843A (zh)
TW (1) TW201303250A (zh)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150013943A1 (en) * 2012-04-16 2015-01-15 Furukawa Electric Co., Ltd. Heat pipe
US20150311879A1 (en) * 2014-04-25 2015-10-29 Rohm Co., Ltd. Microphone bias circuit
US20190354147A1 (en) * 2014-06-04 2019-11-21 Huawei Technologies Co., Ltd. Electronic Device
US20200326135A1 (en) * 2017-12-28 2020-10-15 Furukawa Electric Co., Ltd. Heat pipe
US20210293488A1 (en) * 2020-03-18 2021-09-23 Kelvin Thermal Technologies, Inc. Deformed Mesh Thermal Ground Plane
CN113597194A (zh) * 2019-06-28 2021-11-02 河南烯力新材料科技有限公司 热传导结构及其制造方法、移动装置
US11445636B2 (en) * 2019-10-31 2022-09-13 Murata Manufacturing Co., Ltd. Vapor chamber, heatsink device, and electronic device
WO2023089858A1 (ja) * 2021-11-17 2023-05-25 株式会社フジクラ ヒートパイプ、およびヒートパイプの製造方法
US20230324091A1 (en) * 2021-04-28 2023-10-12 Furukawa Electric Co., Ltd. Evaporation unit structure and heat transport member including evaporation unit structure
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
US12464679B2 (en) 2020-06-19 2025-11-04 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
US12498181B2 (en) 2018-12-11 2025-12-16 Kelvin Thermal Technologies, Inc. Vapor chamber
US12523431B2 (en) 2014-09-15 2026-01-13 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103925819A (zh) * 2013-02-17 2014-07-16 上海交通大学 具有渐变形貌特征的通孔金属泡沫热管换热装置
CN104422320B (zh) * 2013-08-21 2016-04-20 英业达科技有限公司 热管
CN104251631A (zh) * 2014-09-24 2014-12-31 中国科学院工程热物理研究所 管芯自适应热管
CN104776742A (zh) * 2015-04-17 2015-07-15 广东新创意科技有限公司 超薄热管用复合吸液芯及其制造方法
CN105170982B (zh) * 2015-10-09 2017-05-10 昆山捷桥电子科技有限公司 一种热管毛细结构的加工装置及工艺
CN110044193A (zh) * 2019-04-29 2019-07-23 深圳市尚翼实业有限公司 一种热管
CN110044192A (zh) * 2019-04-29 2019-07-23 深圳市尚翼实业有限公司 一种能增强毛细吸力的热管
CN110044194A (zh) * 2019-04-29 2019-07-23 深圳市尚翼实业有限公司 一种能减小传热阻碍的热管
CN113739607A (zh) * 2020-09-29 2021-12-03 中国科学院长春光学精密机械与物理研究所 一种热管的制造方法及热管
CN115876015A (zh) * 2022-11-29 2023-03-31 广州华钻电子科技有限公司 一种具有复合型毛细结构的高功率热管及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3786861A (en) * 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
US4108239A (en) * 1975-04-10 1978-08-22 Siemens Aktiengesellschaft Heat pipe
US20050051305A1 (en) * 2002-12-06 2005-03-10 Hsu Hul Chun Heat pipe
US20060201655A1 (en) * 2005-03-11 2006-09-14 Chu-Wan Hong Heat pipe suitable for application in electronic device with limited mounting space
US20060219391A1 (en) * 2005-04-01 2006-10-05 Chu-Wan Hong Heat pipe with sintered powder wick
US20070240855A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070240858A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070277963A1 (en) * 2006-06-02 2007-12-06 Foxconn Technology Co., Ltd. Heat pipe
US20100254090A1 (en) * 2009-04-01 2010-10-07 Harris Corporation Multi-layer mesh wicks for heat pipes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2757079Y (zh) * 2004-11-04 2006-02-08 李嘉豪 热管多层毛细组织的支撑结构
CN100473933C (zh) * 2005-01-31 2009-04-01 杨开艳 一种热导管
CN100376857C (zh) * 2005-02-04 2008-03-26 富准精密工业(深圳)有限公司 烧结式热管的制造方法
CN2773601Y (zh) * 2005-02-17 2006-04-19 徐惠群 热管多层毛细组织
TWI289651B (en) * 2005-03-25 2007-11-11 Foxconn Tech Co Ltd Method for making wick structure of heat pipe
CN201407937Y (zh) * 2009-05-12 2010-02-17 苏州聚力电机有限公司 热管毛细组织烧结强化结构
CN101706165A (zh) * 2009-11-10 2010-05-12 南京赫特节能环保有限公司 太阳能热水器横置式内螺纹热管

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3786861A (en) * 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
US4108239A (en) * 1975-04-10 1978-08-22 Siemens Aktiengesellschaft Heat pipe
US20050051305A1 (en) * 2002-12-06 2005-03-10 Hsu Hul Chun Heat pipe
US20060201655A1 (en) * 2005-03-11 2006-09-14 Chu-Wan Hong Heat pipe suitable for application in electronic device with limited mounting space
US20060219391A1 (en) * 2005-04-01 2006-10-05 Chu-Wan Hong Heat pipe with sintered powder wick
US20070240855A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070240858A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070277963A1 (en) * 2006-06-02 2007-12-06 Foxconn Technology Co., Ltd. Heat pipe
US20100254090A1 (en) * 2009-04-01 2010-10-07 Harris Corporation Multi-layer mesh wicks for heat pipes

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150013943A1 (en) * 2012-04-16 2015-01-15 Furukawa Electric Co., Ltd. Heat pipe
US10107561B2 (en) * 2012-04-16 2018-10-23 Furukawa Electric Co., Ltd. Heat pipe
US20150311879A1 (en) * 2014-04-25 2015-10-29 Rohm Co., Ltd. Microphone bias circuit
US9710000B2 (en) * 2014-04-25 2017-07-18 Rohm Co., Ltd. Microphone bias circuit
US11789504B2 (en) 2014-06-04 2023-10-17 Huawei Technologies Co., Ltd. Electronic device
US11144101B2 (en) * 2014-06-04 2021-10-12 Huawei Technologies Co., Ltd. Electronic device
US20190354147A1 (en) * 2014-06-04 2019-11-21 Huawei Technologies Co., Ltd. Electronic Device
US12523431B2 (en) 2014-09-15 2026-01-13 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US20200326135A1 (en) * 2017-12-28 2020-10-15 Furukawa Electric Co., Ltd. Heat pipe
US12498181B2 (en) 2018-12-11 2025-12-16 Kelvin Thermal Technologies, Inc. Vapor chamber
CN113597194A (zh) * 2019-06-28 2021-11-02 河南烯力新材料科技有限公司 热传导结构及其制造方法、移动装置
US11445636B2 (en) * 2019-10-31 2022-09-13 Murata Manufacturing Co., Ltd. Vapor chamber, heatsink device, and electronic device
US20250109910A1 (en) * 2020-03-18 2025-04-03 Kelvin Thermal Technologies, Inc. Deformed Mesh Thermal Ground Plane
US20210293488A1 (en) * 2020-03-18 2021-09-23 Kelvin Thermal Technologies, Inc. Deformed Mesh Thermal Ground Plane
US12464679B2 (en) 2020-06-19 2025-11-04 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
US20230324091A1 (en) * 2021-04-28 2023-10-12 Furukawa Electric Co., Ltd. Evaporation unit structure and heat transport member including evaporation unit structure
WO2023089858A1 (ja) * 2021-11-17 2023-05-25 株式会社フジクラ ヒートパイプ、およびヒートパイプの製造方法

Also Published As

Publication number Publication date
TW201303250A (zh) 2013-01-16
CN102878843A (zh) 2013-01-16

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Legal Events

Date Code Title Description
AS Assignment

Owner name: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DAI, SHENG-LIANG;LIU, YUE;SHEN, HAI-PING;AND OTHERS;REEL/FRAME:026824/0631

Effective date: 20110824

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DAI, SHENG-LIANG;LIU, YUE;SHEN, HAI-PING;AND OTHERS;REEL/FRAME:026824/0631

Effective date: 20110824

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION