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US20120325432A1 - Heat dissipation system - Google Patents

Heat dissipation system Download PDF

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Publication number
US20120325432A1
US20120325432A1 US13/303,250 US201113303250A US2012325432A1 US 20120325432 A1 US20120325432 A1 US 20120325432A1 US 201113303250 A US201113303250 A US 201113303250A US 2012325432 A1 US2012325432 A1 US 2012325432A1
Authority
US
United States
Prior art keywords
air inlet
inlet opening
air
heat
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/303,250
Other languages
English (en)
Inventor
Chen-Lu Fan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FAN, CHEN-LU
Publication of US20120325432A1 publication Critical patent/US20120325432A1/en
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present disclosure relates to heat dissipation systems, and particularly to a heat dissipation system for a computer enclosure.
  • Industrial personal computers are used primarily for process control and/or data acquisition.
  • an Industrial PC is simply used as a front-end to another control computer in a distributed processing environment.
  • a subset of industrial PCs is the Panel PC where a display, typically an LCD, is incorporated into a same enclosure as a motherboard and other electronic devices. The displays are typically mounted on panels and are often incorporated with touch screens for user interaction.
  • Industrial PCs are usually placed at different angles according to their working environment. When an Industrial PC is placed at a particular angle, the heat dissipation channel of the Industrial PC may be closed or blocked, which may adversely affect a heat dissipation efficiency of the Industrial PC.
  • FIG. 1 is an isometric and exploded view of an exemplary embodiment of a heat dissipation system with an air guiding device.
  • FIG. 2 is an isometric and exploded view of the air guiding device of FIG. 1 .
  • FIG. 3 is an assembled view of the heat dissipation system of FIG. 1 .
  • an embodiment of a heat dissipation system comprises a computer enclosure 10 , an air guiding device 20 fixed in the computer enclosure 10 .
  • the computer enclosure 10 comprises a base plate 11 , a first side plate 12 , a second side plate 13 , a back plate 14 , and a front plate 15 .
  • the base plate 11 has a motherboard 30 mounted thereon adjacent to the back plate 14 .
  • a first heat-generating component 40 is fixed on the motherboard 30 .
  • a first fan 41 is fixed on the first heat-generating component 40 .
  • a second heat-generating component 50 is mounted on the base plate 11 adjacent to the front plate 15 .
  • the first side plate 12 defines a plurality of first air inlet holes 121 .
  • the back plate 14 defines a plurality of second air inlet holes 141 .
  • the second side plate 13 defines a plurality of third air inlet holes 131 .
  • the front plate 15 defines a second air outlet opening 151 aligned with the first heat-generating component 40 .
  • a second fan (not shown) is fixed in the computer enclosure 10 adjacent to the second air outlet opening 151 .
  • the front plate 15 defines a third air outlet opening 152 aligned with the second heat-generating component 50 .
  • a third fan (not shown) is fixed in the computer enclosure 10 adjacent to the third air outlet opening 152 .
  • the air guiding device 20 comprises a bottom wall 21 , a front wall 22 , and a back wall 23 .
  • the front wall 22 and the back wall 23 are substantially parallel to each other and perpendicular to the bottom wall 21 .
  • a first air inlet opening 221 is defined between the front wall 22 and the back wall 23 .
  • the first air inlet opening 221 is aligned with the plurality of first air inlet holes 121 .
  • a second air inlet opening 231 is defined on the back wall 23 .
  • the second air inlet opening 231 is aligned with the plurality of second air inlet holes 141 .
  • a third air inlet opening 241 is defined between the front wall 22 and the back wall 23 .
  • the third air inlet opening 241 is aligned with the plurality of third air inlet holes 131 .
  • a first air outlet opening 211 is defined on the bottom wall 21 and is aligned with the first fan 41 .
  • Each of the first air inlet opening 221 , the second air inlet opening 231 , and the third air inlet opening 241 has an air deflecting member 25 fixed therein.
  • the air deflecting member 25 comprises a bracket 251 , and a piece of conductive foam 252 fixed on the bracket 251 .
  • the bracket 251 comprises a first surface and a second surface.
  • a plurality of bending portions 2511 extends from the first surface to accommodate the piece of conductive foam piece 252 therebetween.
  • a handle 2512 extends from the second surface for slidably fixing the bracket 251 into each of the first air inlet opening 221 , the second air inlet opening 231 and the third air inlet opening 241 .
  • a plurality of parallel guiding portions 26 are mounted on two sides of each of the first air inlet opening 221 , the second air inlet opening 231 , and the third air inlet opening 241 .
  • Each of the brackets 251 is slidable into each of the first air inlet opening 221 , the second air inlet opening 231 , and the third air inlet opening 241 along each of the plurality of parallel guiding portions 26 .
  • a distance between two adjacent pluralities of parallel guiding portions 26 is equal to a width of the bracket 251 .
  • the air guiding device 20 is fixed on the computer enclosure 10 by fasteners, such as rivets, or other fixing means.
  • the first fan 41 , the second fan and the third fan start to rotate.
  • the plurality of first air inlet holes 121 are closed.
  • Each of the air deflecting members 25 in the second air inlet opening 231 and the third air inlet opening 241 may be removed by each of the corresponding handles 2512 .
  • Cool air from outside may be drawn into the air guiding device 20 via the plurality of second air inlet holes 141 , the plurality of third air inlet holes 131 , the second air inlet opening 231 , and the third air inlet opening 241 .
  • the cool air flows through the first air outlet opening 211 and displaces warm air from around the first heat-generating component 40 .
  • a first branch of the cooled air from outside displaces warm air around the second heat-generating component 50 and flows through the third fan.
  • the speed of the first branch of the cool air is accelerated when passing through the third fan.
  • Warm air from the second heat-generating component 50 is taken away from the computer enclosure 10 through the third air outlet opening 152 .
  • the second branch of cool air from outside flows through the second fan.
  • the speed of the second branch of cool air is accelerated when passing through the second fan.
  • Warm air from the first heat-generating component 40 is taken away from the computer enclosure 10 through the second air outlet opening 151 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/303,250 2011-06-24 2011-11-23 Heat dissipation system Abandoned US20120325432A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110173105.3 2011-06-24
CN2011101731053A CN102841662A (zh) 2011-06-24 2011-06-24 散热系统

Publications (1)

Publication Number Publication Date
US20120325432A1 true US20120325432A1 (en) 2012-12-27

Family

ID=47360717

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/303,250 Abandoned US20120325432A1 (en) 2011-06-24 2011-11-23 Heat dissipation system

Country Status (3)

Country Link
US (1) US20120325432A1 (zh)
CN (1) CN102841662A (zh)
TW (1) TW201301006A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104375604A (zh) * 2013-08-16 2015-02-25 鸿富锦精密工业（深圳）有限公司 电子装置
US10925183B2 (en) * 2019-02-21 2021-02-16 Adlink Technology Inc. 3D extended cooling mechanism for integrated server

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113944941B (zh) * 2020-07-16 2024-10-01 广东美的厨房电器制造有限公司 微波炉

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781736A (en) * 1986-11-20 1988-11-01 United Air Specialists, Inc. Electrostatically enhanced HEPA filter
US5559673A (en) * 1994-09-01 1996-09-24 Gagnon; Kevin M. Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control panel
US5963424A (en) * 1995-11-07 1999-10-05 Sun Microsystems, Inc. Pulsar desk top system that will produce 500 watts of heat
US6400568B1 (en) * 2001-07-11 2002-06-04 Sun Microsystems, Inc. Method and apparatus for cooling electronic components
US6504718B2 (en) * 2000-11-06 2003-01-07 Giga-Byte Technology Co., Ltd. Server having an air flow guide device
US20040095723A1 (en) * 2002-11-15 2004-05-20 Enlight Corporation Internal heat sink construction for CPU cabinet
US20050041392A1 (en) * 2003-08-22 2005-02-24 Chen Chin Hui Heat dissipation device incorporating fan duct
US20050195568A1 (en) * 2004-03-08 2005-09-08 Daniel Shyr Active convective air scoop cooler
US20060181846A1 (en) * 2005-02-11 2006-08-17 Farnsworth Arthur K Cooling system for a computer environment
US7106586B2 (en) * 2004-09-07 2006-09-12 Shutlle Inc. Computer heat dissipating system
US7573712B2 (en) * 2007-03-20 2009-08-11 Hon Hai Precision Industry Co., Ltd. Electronic device with airflow guiding duct
US7611402B2 (en) * 2007-03-28 2009-11-03 Adc Dsl Systems, Inc. Apparatus for cooling electronics
US7643292B1 (en) * 2008-12-23 2010-01-05 Chenbro Micom Co., Ltd. Adjustable air director
US7990706B2 (en) * 2008-01-23 2011-08-02 Sony Corporation Cooling duct and electronic apparatus
US8081444B2 (en) * 2009-10-14 2011-12-20 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Computer system with airflow guiding duct
US8094451B2 (en) * 2008-08-05 2012-01-10 Thales Onboard computer equipped with a stand-alone aeraulic cooling device
US8619419B2 (en) * 2007-09-18 2013-12-31 Whirlpool S.A. Computer docking station

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781736A (en) * 1986-11-20 1988-11-01 United Air Specialists, Inc. Electrostatically enhanced HEPA filter
US5559673A (en) * 1994-09-01 1996-09-24 Gagnon; Kevin M. Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control panel
US5963424A (en) * 1995-11-07 1999-10-05 Sun Microsystems, Inc. Pulsar desk top system that will produce 500 watts of heat
US6504718B2 (en) * 2000-11-06 2003-01-07 Giga-Byte Technology Co., Ltd. Server having an air flow guide device
US6400568B1 (en) * 2001-07-11 2002-06-04 Sun Microsystems, Inc. Method and apparatus for cooling electronic components
US20040095723A1 (en) * 2002-11-15 2004-05-20 Enlight Corporation Internal heat sink construction for CPU cabinet
US20050041392A1 (en) * 2003-08-22 2005-02-24 Chen Chin Hui Heat dissipation device incorporating fan duct
US20050195568A1 (en) * 2004-03-08 2005-09-08 Daniel Shyr Active convective air scoop cooler
US7106586B2 (en) * 2004-09-07 2006-09-12 Shutlle Inc. Computer heat dissipating system
US20060181846A1 (en) * 2005-02-11 2006-08-17 Farnsworth Arthur K Cooling system for a computer environment
US7573712B2 (en) * 2007-03-20 2009-08-11 Hon Hai Precision Industry Co., Ltd. Electronic device with airflow guiding duct
US7611402B2 (en) * 2007-03-28 2009-11-03 Adc Dsl Systems, Inc. Apparatus for cooling electronics
US8619419B2 (en) * 2007-09-18 2013-12-31 Whirlpool S.A. Computer docking station
US7990706B2 (en) * 2008-01-23 2011-08-02 Sony Corporation Cooling duct and electronic apparatus
US8094451B2 (en) * 2008-08-05 2012-01-10 Thales Onboard computer equipped with a stand-alone aeraulic cooling device
US7643292B1 (en) * 2008-12-23 2010-01-05 Chenbro Micom Co., Ltd. Adjustable air director
US8081444B2 (en) * 2009-10-14 2011-12-20 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Computer system with airflow guiding duct

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104375604A (zh) * 2013-08-16 2015-02-25 鸿富锦精密工业（深圳）有限公司 电子装置
US10925183B2 (en) * 2019-02-21 2021-02-16 Adlink Technology Inc. 3D extended cooling mechanism for integrated server

Also Published As

Publication number Publication date
CN102841662A (zh) 2012-12-26
TW201301006A (zh) 2013-01-01

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FAN, CHEN-LU;REEL/FRAME:027274/0176

Effective date: 20111117

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE