US20120298519A1 - Electrolyte and process for depositing a matt metal layer - Google Patents
Electrolyte and process for depositing a matt metal layer Download PDFInfo
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- US20120298519A1 US20120298519A1 US13/487,665 US201213487665A US2012298519A1 US 20120298519 A1 US20120298519 A1 US 20120298519A1 US 201213487665 A US201213487665 A US 201213487665A US 2012298519 A1 US2012298519 A1 US 2012298519A1
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- wetting agent
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Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 35
- 239000002184 metal Substances 0.000 title claims abstract description 35
- 239000003792 electrolyte Substances 0.000 title claims description 47
- 238000000034 method Methods 0.000 title claims description 8
- 238000000151 deposition Methods 0.000 title description 13
- 239000000203 mixture Substances 0.000 claims abstract description 33
- 239000000080 wetting agent Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000006185 dispersion Substances 0.000 claims abstract description 16
- 239000000839 emulsion Substances 0.000 claims abstract description 14
- 229920000233 poly(alkylene oxides) Polymers 0.000 claims abstract description 11
- 230000008021 deposition Effects 0.000 claims abstract description 10
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 10
- 150000003856 quaternary ammonium compounds Chemical class 0.000 claims abstract description 9
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 6
- 239000004530 micro-emulsion Substances 0.000 claims abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 6
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 5
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 229910052738 indium Inorganic materials 0.000 claims abstract description 5
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 5
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 5
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 5
- 229910052702 rhenium Inorganic materials 0.000 claims abstract description 5
- 229910052703 rhodium Inorganic materials 0.000 claims abstract description 5
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims description 14
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 11
- -1 polytetrafluorethylene Polymers 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 150000001450 anions Chemical class 0.000 claims description 5
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 150000004820 halides Chemical class 0.000 claims description 2
- 229920001281 polyalkylene Polymers 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 125000001424 substituent group Chemical group 0.000 claims description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims 3
- 125000006539 C12 alkyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims 1
- 229920001400 block copolymer Polymers 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 abstract description 5
- 238000005137 deposition process Methods 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000011651 chromium Substances 0.000 description 4
- 229920001515 polyalkylene glycol Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 0 [1*][N+]([2*])([3*])[4*].[CH3-] Chemical compound [1*][N+]([2*])([3*])[4*].[CH3-] 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005246 galvanizing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- LMPMFQXUJXPWSL-UHFFFAOYSA-N 3-(3-sulfopropyldisulfanyl)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCSSCCCS(O)(=O)=O LMPMFQXUJXPWSL-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 1
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
- 206010020751 Hypersensitivity Diseases 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 208000026935 allergic disease Diseases 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000003868 ammonium compounds Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- XJMWHXZUIGHOBA-UHFFFAOYSA-N azane;propanoic acid Chemical compound N.CCC(O)=O XJMWHXZUIGHOBA-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Definitions
- the present invention relates to an electrolyte and to a process for depositing a matt metal layer on a substrate from an electrolyte comprising an emulsion and/or dispersion former or a wetting agent.
- the invention is directed to an electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process
- the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.
- an electrolyte for depositing a matt metal layer on a substrate from an electrolyte comprising an emulsion and/or dispersion former or a wetting agent, characterized in that the electrolyte includes for a metal to be deposited a metal from the group consisting of Al, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, As, Se, Mo, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, W, Re, Pt, Au, Tl, Pb, Bi, preferably from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, or an alloy of these metals, that the emulsion and/or dispersion former is a substituted or unsubstituted polyalkylene oxide or its derivative, that the wetting agent includes fluorated or perfluorated hydropho
- the object is solved by a process for electrolytically depositing a matt metal layer on a substrate, wherein the substrate is connected with a voltage source in a galvanizing bath that comprises an electrolyte according to the invention and a counter electrode, and a current which is suitable for depositing a metal layer on the substrate is applied between the substrate and the counter electrode.
- microemulsions in electrolytes is suitable for the matt deposition of the most different metals from the corresponding electrolytes. Further, it has been discovered that for the formation of these microemulsions in electrolytes of most different metals to be deposited both polyalkyleneglycols or their derivatives, wetting agents with fluorated or perfluorated hydrophobic chains, and quaternary ammonium compounds substituted by polyalkylene oxide chains are suited. These compounds can be used in a vast range for the production of emulsions in electrolytes of the most different metals and they can be used individually.
- polyalkyleneglycols are used for the emulsion and/or dispersion formers, especially polymers with different percentages of hydrophilic and hydrophobic structures, preferably consisting of polyethylene and polypropylene glycols turned out to be suitable in addition to homogeneously structured polymers.
- the percentage of hydrophilic and hydrophobic structures which is decisive for the degree of mattness of the deposited metal layer in dependence of the average molecular weight, wherein average molecular weights >200 g/mol, for polymers with a high percentage of hydrophobic structures preferably 200 to 2000 g/mol, and for polymers with a high percentage of hydrophilic structures even more preferably >4000/mol are generally suited.
- the average molecular weight of the fluorated or perfluorated wetting agents is, according to the invention, between about 550 and about 1000 g/mol, preferably between about 700 and about 1000 g/mol. In this case, too the average molecular weight has an influence on the degree of mattness.
- wetting agent suitable for the deposition of metal layers from electrolytes in accordance with the invention is polyalkylene oxide-substituted quaternary ammonium compounds preferably following the general formula
- R 1 , R 2 , R 3 or R 4 is a polyalkylene oxide substituent and the remaining radicals independently are same or different straight-chained or branched saturated or unsaturated C 1 to C 18 alkyl chains and X ⁇ is a halide, a sulfate anion or anion of a C 1 to C 6 carboxylic acid.
- R 1 and R 2 are a C 8 to C 12 , preferably a C 10 alkyl side chain
- R 3 is a C 1 to C 3 , preferably a C 1 alkyl side chain
- X ⁇ is the anion of a C 2 to C 4 carboxylic acid.
- the average molecular weight of the quaternary ammonium compound which is added to the electrolyte, in accordance with the invention is between about 200 to about 1000 g/mol, preferably between 400 and about 500 g/mol and even more preferably between about 450 and about 460 g/mol.
- the medium particle diameter of the added polytetrafluorethylene particles should be within a range of about 10 to about 1000 nm, preferably about 100 to about 300 nm.
- the polytetrafluorethylene particles can be added at a concentration between about 0.1 and 1000 mg/l, preferably between about 0.5 and 5 mg/l.
- the preferred deposition parameters include a working temperature between 50 and 55° C., a current density between about 3 and about 7 A/dm 2 , and an exposure time of the substrate to the electrolyte of between about 5 and about 20 minutes.
- the average molecular weight amounts to 1700 g/mol, with the polyethylene oxide fraction (x+z) being 20% of the molecular mass.
- CF 2 -substituted polyethyleneglycol is replaced by polyethyleneglycol substituted ammonium compounds
- a uniform mattness effect is obtained having a different structure than in example 4.
- a nickel-plated brass sheet with a pearlescent effect can be obtained by the addition of 8 mg/l didecylmethylpoly-(oxethyl)ammonium propionate in a Watts electrolyte analogously with example 4.
- the emulsion of polyethyleneglycol-substituted ammonium salt produced in example was added 1 ml/l PTFE suspension (Zonyl TE3667-N, Dupont), whereby different structures and properties of the layers were obtained.
- the surfaces thus produced exhibit a strongly hydrophobic dirt-repellent effect.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
- This application is a continuation of U.S. Ser. No. 12/168,680, filed Jul. 7, 2008, issued Jun. 5, 2012 as U.S. Pat. No. 8,192,607, which is a continuation-in-part of international application PCT/EP2006/000076, filed 6 Jan. 2006, the entire disclosure of which is hereby incorporated by reference.
- The present invention relates to an electrolyte and to a process for depositing a matt metal layer on a substrate from an electrolyte comprising an emulsion and/or dispersion former or a wetting agent.
- In the production of metallic layers on substrates the aim generally is to obtain preferably smooth and high gloss coats. But depending on the specific application, it is frequently desired to obtain a metal coat which is not glossy but matt. The reason for that may be the optical appearance of this coat, and also the technical properties, i.e. the nonglaring of such coats. Fields of application for matt deposited metal layers on substrates are for instance the jewelry industry, fittings industry, automobile industry, but also the optical and precision industry, where especially the nonglaring of these coats is important. From prior art matt deposited nickel or nickel alloy layers as well as cobalt layers are known. While the deposition of such potentially allergy-causing metals is noncritical in many fields, it is desirable to avoid these metals in the field of the jewelry industry or also in the field of kitchenware and kitchen utensils. Within the field of the optical or precision industries the deposition of matt metal layers of the most different metals is desirable because of the different properties of the respective metals. In addition, it is desirable to be able to adjust the degree of mattness of the deposited metal layer over a vast range. It is an object of the present invention to provide an electrolyte as well as a process for depositing matt metal layers on substrates, by which method a variety of metals can be deposited with different degrees of mattness on the most different substrates.
- Briefly, therefore, the invention is directed to an electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.
- Other objects and features of the invention will be in part apparent and in part pointed out hereinafter.
- The objects of the invention are achieved by an electrolyte for depositing a matt metal layer on a substrate from an electrolyte comprising an emulsion and/or dispersion former or a wetting agent, characterized in that the electrolyte includes for a metal to be deposited a metal from the group consisting of Al, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, As, Se, Mo, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, W, Re, Pt, Au, Tl, Pb, Bi, preferably from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, or an alloy of these metals, that the emulsion and/or dispersion former is a substituted or unsubstituted polyalkylene oxide or its derivative, that the wetting agent includes fluorated or perfluorated hydrophobic chains or is a polyalkylene oxide substituted quaternary ammonium compound, and that the electrolyte, emulsion and/or dispersion formers or wetting agents form a microemulsion and/or dispersion.
- Concerning the process, the object is solved by a process for electrolytically depositing a matt metal layer on a substrate, wherein the substrate is connected with a voltage source in a galvanizing bath that comprises an electrolyte according to the invention and a counter electrode, and a current which is suitable for depositing a metal layer on the substrate is applied between the substrate and the counter electrode.
- It has been discovered that the formation of microemulsions in electrolytes is suitable for the matt deposition of the most different metals from the corresponding electrolytes. Further, it has been discovered that for the formation of these microemulsions in electrolytes of most different metals to be deposited both polyalkyleneglycols or their derivatives, wetting agents with fluorated or perfluorated hydrophobic chains, and quaternary ammonium compounds substituted by polyalkylene oxide chains are suited. These compounds can be used in a vast range for the production of emulsions in electrolytes of the most different metals and they can be used individually.
- If polyalkyleneglycols are used for the emulsion and/or dispersion formers, especially polymers with different percentages of hydrophilic and hydrophobic structures, preferably consisting of polyethylene and polypropylene glycols turned out to be suitable in addition to homogeneously structured polymers. In this case it is among others the percentage of hydrophilic and hydrophobic structures which is decisive for the degree of mattness of the deposited metal layer in dependence of the average molecular weight, wherein average molecular weights >200 g/mol, for polymers with a high percentage of hydrophobic structures preferably 200 to 2000 g/mol, and for polymers with a high percentage of hydrophilic structures even more preferably >4000/mol are generally suited.
- At the use of fluorated or perfluorated wetting agents, wetting agents of the general formula
-
RfCH2CH2O(CH2CH2O)xH (formula 1) - with Rf=F(CF2CF2)n, wherein X=6 to 15 and n=2 to 10, are particularly suited. The average molecular weight of the fluorated or perfluorated wetting agents is, according to the invention, between about 550 and about 1000 g/mol, preferably between about 700 and about 1000 g/mol. In this case, too the average molecular weight has an influence on the degree of mattness.
- Another type of wetting agent suitable for the deposition of metal layers from electrolytes in accordance with the invention is polyalkylene oxide-substituted quaternary ammonium compounds preferably following the general formula
- wherein at least one radical R1, R2, R3 or R4 is a polyalkylene oxide substituent and the remaining radicals independently are same or different straight-chained or branched saturated or unsaturated C1 to C18 alkyl chains and X− is a halide, a sulfate anion or anion of a C1 to C6 carboxylic acid. It turned out that especially quaternary ammonium compounds of the general formula 2 are suited, in which R1 and R2 are a C8 to C12, preferably a C10 alkyl side chain, R3 is a C1 to C3, preferably a C1 alkyl side chain, R4 corresponds to the general formula [CH2—CH2—O]nH with n=1 to 5, and X− is the anion of a C2 to C4 carboxylic acid.
- The average molecular weight of the quaternary ammonium compound which is added to the electrolyte, in accordance with the invention, is between about 200 to about 1000 g/mol, preferably between 400 and about 500 g/mol and even more preferably between about 450 and about 460 g/mol.
- Additionally it turned out that the addition of polytetrafluorethylene particles to the electrolyte according to the invention has an influence on the properties of the deposited matt metal layers. Accordingly, in the deposition of matt metal layers from electrolytes according to the invention which additionally contain polytetrafluorethylene particles a surface appears which is considerably softer concerning tactility and which even exhibits a clearly lower susceptibility to finger prints (touch free) compared to matt surfaces which have been deposited from electrolytes according to the invention without the addition of polytetrafluorethylene particles.
- It has been discovered that the medium particle diameter of the added polytetrafluorethylene particles should be within a range of about 10 to about 1000 nm, preferably about 100 to about 300 nm.
- According to the invention, the polytetrafluorethylene particles can be added at a concentration between about 0.1 and 1000 mg/l, preferably between about 0.5 and 5 mg/l.
- The preferred deposition parameters include a working temperature between 50 and 55° C., a current density between about 3 and about 7 A/dm2, and an exposure time of the substrate to the electrolyte of between about 5 and about 20 minutes.
- The following examples show embodiments of the electrolyte according to the invention as well as of the process according to the invention, but the invention cannot be limited to these exemplary embodiments.
- A Cu electrolyte having the following composition:
- 100 mg/l Cl−
200 mg/l bis-(3-sulfopropyl)-disulfide, disodium salt
are mixed with 2 g/l polypropyleneglycol having a molar mass of 900 g/mol.
Galvanizing takes places on an angular sheet for 10 minutes at 5 A/dm2 and 35° C., with the cathode being moved 2 m/min.
Air movement is not required. Surprisingly, a uniform pearlescent effect is obtained in the high and low current density region. Because of the minimum amount of organic brighteners, there are no adherence problems during a current interruption and thereafter adhering layers can be deposited from an acidic bronze electrolyte or from a trivalent chromium electrolyte. The degree of mattness of the pearlescent effect can be controlled through the concentration of the polymer. By a single filtering over Celite all of the pearlescent brightener is removed. - When using the parameters described in example 1, a stable and uniform pearlescent effect is obtained at 26° C. and with the addition of 300 mg/l of a polyalkyleneglycol having the following block polymer structure instead of the polypropyleneglycole described in example 1:
-
HO—(CH2—CH2—O)x—(CH2—CH(CH3)—O)y—(CH2—CH2—O)z—H - The average molecular weight amounts to 1700 g/mol, with the polyethylene oxide fraction (x+z) being 20% of the molecular mass.
- In a bronze electrolyte having the following composition:
- 100 g/l methanesulfonic acid
2 g/l hydrochinone
there is also obtained a uniform pearlescent effect with 5 mg/l polyalkyleneglycol having the block polymer structure shown in example 2 with a molecular mass of 5000 g/mol and a fraction of 20% of polyethylene oxide at a current density of 2 A/dm2, 25° C. and a cathode movement of 1 m/min. - In a Watts electrolyte having the following composition:
- 440 g/l nickel sulfate
30 g/l boric acid
40 g/l nickel chloride
5 g/l sodium saccharinate
a uniform matt effect is obtained after 10 minutes at a temperature of 52° C., a pH value of 4.2, a current density of 5 A/dm2 and a cathode movement of 2 m/min, through the addition of 10 mg/l of the following CF-substituted polyethyleneglycol having an average molecular weight of 700 g/mol and denoted as a wetting agent, with the main component being characterized by X=5 and Y=10, -
F—(CF2—CF2)x—(CH2—CH2—O)y—H. - If in example 4 the CF2-substituted polyethyleneglycol is replaced by polyethyleneglycol substituted ammonium compounds, a uniform mattness effect is obtained having a different structure than in example 4. For instance, a nickel-plated brass sheet with a pearlescent effect can be obtained by the addition of 8 mg/l didecylmethylpoly-(oxethyl)ammonium propionate in a Watts electrolyte analogously with example 4.
- The emulsion of polyethyleneglycol-substituted ammonium salt produced in example was added 1 ml/l PTFE suspension (Zonyl TE3667-N, Dupont), whereby different structures and properties of the layers were obtained. The surfaces thus produced exhibit a strongly hydrophobic dirt-repellent effect.
Claims (21)
RfCH2CH2O(CH2CH2O)xH
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| US13/487,665 US20120298519A1 (en) | 2006-01-06 | 2012-06-04 | Electrolyte and process for depositing a matt metal layer |
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| PCT/EP2006/000076 WO2007076898A1 (en) | 2006-01-06 | 2006-01-06 | Electrolyte and process for depositing a matt metal layer |
| US12/168,680 US8192607B2 (en) | 2006-01-06 | 2008-07-07 | Electrolyte and process for depositing a matt metal layer |
| US13/487,665 US20120298519A1 (en) | 2006-01-06 | 2012-06-04 | Electrolyte and process for depositing a matt metal layer |
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| US13/487,665 Abandoned US20120298519A1 (en) | 2006-01-06 | 2012-06-04 | Electrolyte and process for depositing a matt metal layer |
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| US (2) | US8192607B2 (en) |
| EP (1) | EP1969160B1 (en) |
| JP (1) | JP4811880B2 (en) |
| KR (1) | KR101234429B1 (en) |
| CN (1) | CN101400830B (en) |
| AT (1) | ATE507327T1 (en) |
| DE (1) | DE502006009414D1 (en) |
| ES (1) | ES2361500T3 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105229204A (en) * | 2013-03-15 | 2016-01-06 | 恩索恩公司 | The galvanic deposit of silver and fluoropolymer nanoparticle |
| CN103382564A (en) * | 2013-07-18 | 2013-11-06 | 华南理工大学 | Super-hydrophobic cobalt plating of metal surface and preparation method for super-hydrophobic cobalt plating |
| GB2534120A (en) * | 2014-11-28 | 2016-07-20 | Daido Ind Bearings Europe Ltd | Bismuth-based composite coating for overlay applications in plain bearings |
| CN109652829A (en) * | 2019-01-04 | 2019-04-19 | 中国计量大学 | A kind of no rare earth Bi base magnetism electroplate liquid and preparation method thereof |
| CN110714212A (en) * | 2019-10-12 | 2020-01-21 | 常州大学 | A method for preparing super-hydrophobic nickel film by one-step method of nickel chloride in an aqueous solution system |
| AT523922A4 (en) * | 2020-09-08 | 2022-01-15 | Iwg Ing W Garhoefer Ges M B H | Electrolyte bath for palladium-ruthenium coatings |
| AT523922B1 (en) * | 2020-09-08 | 2022-01-15 | Iwg Ing W Garhoefer Ges M B H | Electrolyte bath for palladium-ruthenium coatings |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2361500T3 (en) | 2011-06-17 |
| PL1969160T3 (en) | 2011-09-30 |
| JP2009522441A (en) | 2009-06-11 |
| DE502006009414D1 (en) | 2011-06-09 |
| WO2007076898A1 (en) | 2007-07-12 |
| CN101400830A (en) | 2009-04-01 |
| US8192607B2 (en) | 2012-06-05 |
| EP1969160A1 (en) | 2008-09-17 |
| ATE507327T1 (en) | 2011-05-15 |
| KR20080092399A (en) | 2008-10-15 |
| EP1969160B1 (en) | 2011-04-27 |
| KR101234429B1 (en) | 2013-02-18 |
| CN101400830B (en) | 2012-07-04 |
| JP4811880B2 (en) | 2011-11-09 |
| US20080302668A1 (en) | 2008-12-11 |
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