[go: up one dir, main page]

TWI762661B - Nickel electroplating bath for depositing a decorative nickel coating on a substrate - Google Patents

Nickel electroplating bath for depositing a decorative nickel coating on a substrate Download PDF

Info

Publication number
TWI762661B
TWI762661B TW107121396A TW107121396A TWI762661B TW I762661 B TWI762661 B TW I762661B TW 107121396 A TW107121396 A TW 107121396A TW 107121396 A TW107121396 A TW 107121396A TW I762661 B TWI762661 B TW I762661B
Authority
TW
Taiwan
Prior art keywords
acid
nickel
electroplating bath
range
depositing
Prior art date
Application number
TW107121396A
Other languages
Chinese (zh)
Other versions
TW201905243A (en
Inventor
菲利浦 沃琪特
拉賈瑟卡朗 尼拉梅罕
菲利普 哈特曼
克拉斯-戴特 俗茲
Original Assignee
德商德國艾托特克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商德國艾托特克公司 filed Critical 德商德國艾托特克公司
Publication of TW201905243A publication Critical patent/TW201905243A/en
Application granted granted Critical
Publication of TWI762661B publication Critical patent/TWI762661B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16Acetylenic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention is related to a nickel electroplating bath for depositing a decorative nickel coating on a substrate to be treated characterized in that the electroplating bath comprises at least a nickel ion source, at least one amino acid and/or at least one carboxylic acid, which is not an amino acid; wherein the total concentration of the amino acid(s) is ranging from 1 to 10 g/l, wherein the total concentration of carboxylic acid(s), which is/are not an amino acid, is ranging from 10 to 40 g/l; wherein the electroplating bath is free of boric acid; wherein the total concentration of the nickel ions is ranging from 55 to 80 g/l; and wherein the nickel electroplating bath has a chloride content ranging from 7.5 to 40 g/l. The present invention is also related to a method for depositing a nickel coating on a substrate to be treated; and the use of such an inventive nickel electroplating bath for depositing a bright, semi-bright, satin, matte or non-conductive particle containing nickel coating by conducting such a method.

Description

用於在基板上沉積裝飾用鎳塗層之鎳電鍍浴Nickel electroplating bath for depositing decorative nickel coatings on substrates

本發明係關於一種用於在欲處理基板上沈積裝飾用鎳塗層之鎳電鍍浴。本發明亦係關於在欲處理基板上沈積裝飾用鎳塗層之方法。此外,本發明係關於此一本發明鎳電鍍浴之用途,其藉由實施此一方法用於沈積光亮、半光亮、緞光、啞光或含非導電性粒子之鎳塗層。The present invention relates to a nickel electroplating bath for depositing decorative nickel coatings on substrates to be treated. The present invention also relates to a method of depositing a decorative nickel coating on a substrate to be treated. Furthermore, the present invention relates to the use of this inventive nickel electroplating bath for depositing bright, semi-bright, satin, matt or non-conductive particle-containing nickel coatings by implementing such a method.

在鎳電鍍浴中,將pH值保持在界定之範圍內通常極為重要。In nickel electroplating baths it is often extremely important to maintain pH within defined ranges.

因此,過去已將緩衝液系統施加至鎳浴以滿足此目標。Therefore, buffer systems have been applied to nickel baths in the past to meet this goal.

最習用系統係基於所謂的「瓦特電解浴(Watts electrolytic bath)」,其具有以下一般組成:240- 550 g/l 硫酸鎳(NiSO4 · 7 H2 O或NiSO4 · 6 H2 O), 30-150 g/l 氯化鎳(NiCl2 · 6 H2 O),及 30-55 g/l 硼酸(H3 BO3 )。The most conventional systems are based on the so-called "Watts electrolytic bath", which has the following general composition: 240-550 g /l nickel sulfate ( NiSO4.7H2O or NiSO4.6H2O ), 30-150 g/l nickel chloride (NiCl 2 · 6 H 2 O), and 30-55 g/l boric acid (H 3 BO 3 ).

大量硫酸鎳提供必需濃度之鎳離子,同時氯化鎳改良陽極腐蝕並增加導電性。硼酸用作弱緩衝劑以維持pH值。A large amount of nickel sulfate provides the necessary concentration of nickel ions, while nickel chloride improves anode corrosion and increases conductivity. Boric acid acts as a weak buffer to maintain pH.

另外,為達成鎳電鍍塗層之光亮及有光澤外觀,通常將有機及無機試劑(增亮劑)添加至電解質。所添加增亮劑之類型及其濃度決定了鎳塗層之外觀,即,閃亮、光亮、半光亮、緞光、啞光等。Additionally, to achieve the bright and glossy appearance of nickel electroplated coatings, organic and inorganic agents (brighteners) are often added to the electrolyte. The type of brightener added and its concentration determine the appearance of the nickel coating, ie, shiny, bright, semi-gloss, satin, matte, etc.

然而,硼酸同時被歸類為有毒物質且被認為禁止進入世界市場。因此,業內強烈需求由其他無毒物質代替硼酸。However, boric acid is also classified as a toxic substance and is considered banned from the world market. Therefore, there is a strong demand in the industry to replace boric acid with other non-toxic substances.

本發明之目的 鑒於先前技術,因此本發明之目標係提供將不含硼酸之鎳電鍍浴。 OBJECTS OF THE INVENTION In view of the prior art, it is therefore an object of the present invention to provide nickel electroplating baths that will be free of boric acid.

另外,本發明之目標尤其係提供鎳電鍍浴,其將適於作為基礎用於沈積關於其光學外觀及其化學性質之各種類型之不同鎳塗層,例如光亮鎳塗層、半光亮鎳塗層、緞光鎳塗層、啞光鎳塗層或含非導電性粒子之鎳塗層。Furthermore, the object of the present invention is in particular to provide nickel electroplating baths which will be suitable as a basis for depositing various types of different nickel coatings with respect to their optical appearance and their chemical properties, such as bright nickel coatings, semi-bright nickel coatings , satin nickel coating, matt nickel coating or nickel coating with non-conductive particles.

此外,本發明之目標係提供沈積關於其光學外觀及其化學性質之各種類型之不同鎳塗層(例如光亮鎳塗層、半光亮鎳塗層、緞光鎳塗層、啞光鎳塗層或含非導電性粒子之鎳塗層)之方法。Furthermore, the object of the present invention is to provide the deposition of various types of different nickel coatings (eg bright nickel coatings, semi-bright nickel coatings, satin nickel coatings, matte nickel coatings or Nickel Coatings Containing Non-Conductive Particles).

該等目標以及未明確指出但可藉助介紹自本文所討論之關係立即推導或辨別出之其他目標係藉由具有技術方案1之所有特質的鎳電鍍浴達成。對本發明浴之適當修改在附屬技術方案2至8中受到保護。此外,技術方案9係關於在欲處理基板上沈積裝飾用鎳塗層之方法,同時技術方案10至14著重於此方案之適當修改。技術方案15係關於此一鎳電鍍浴藉由實施此一方法用於沈積光亮、半光亮、緞光、啞光或含非導電性粒子之鎳塗層之用途。These objectives and others not explicitly stated but immediately derivable or identifiable by means of the introduction of the relationships discussed herein are achieved by a nickel electroplating bath having all the characteristics of Option 1. Appropriate modifications to the baths of the invention are protected in sub-claims 2 to 8. In addition, technical solution 9 relates to a method for depositing a decorative nickel coating on a substrate to be processed, while technical solutions 10 to 14 focus on appropriate modifications of this solution. The technical solution 15 relates to the use of such a nickel electroplating bath for depositing bright, semi-bright, satin, matt or non-conductive particle-containing nickel coatings by implementing such a method.

因此,本發明提供用於在欲處理基板上沈積裝飾用鎳塗層之鎳電鍍浴,其特徵在於該電鍍浴包含至少一種鎳離子源、至少一種胺基酸及/或至少一種不為胺基酸之羧酸;其中該(等)胺基酸之總濃度係在1至10 g/l之範圍內,其中不為胺基酸之羧酸的總濃度係在10至40 g/l之範圍內;其中該電鍍浴不含硼酸;其中該等鎳離子之總濃度係在55至80 g/l之範圍內;且其中該鎳電鍍浴具有在7.5至40 g/l之範圍內之氯含量。Accordingly, the present invention provides a nickel electroplating bath for depositing a decorative nickel coating on a substrate to be treated, characterized in that the electroplating bath comprises at least one source of nickel ions, at least one amino acid and/or at least one non-amine group Carboxylic acids of acids; wherein the total concentration of amino acid(s) is in the range from 1 to 10 g/l, and wherein the total concentration of carboxylic acids other than amino acids is in the range of 10 to 40 g/l wherein the electroplating bath is free of boric acid; wherein the total concentration of the nickel ions is in the range of 55 to 80 g/l; and wherein the nickel electroplating bath has a chlorine content in the range of 7.5 to 40 g/l .

在本文中,至少一種胺基酸及/或至少一種羧酸代表用於錯合各別鎳電鍍浴中之鎳離子之錯合劑。在本文中,先前技術之「經典」錯合劑(即硼酸)應當且已經避免。因此,本發明之鎳電鍍浴係不含硼酸的。Herein, at least one amino acid and/or at least one carboxylic acid represent complexing agents for complexing nickel ions in the respective nickel electroplating baths. In this context, the "classical" complexing agent of the prior art (ie, boronic acid) should and has been avoided. Therefore, the nickel electroplating bath of the present invention is boric acid free.

因此可以不可預見之方式提供鎳電鍍浴,其不含硼酸,對環境造成之影響較少。It is thus possible to provide nickel electroplating baths in an unforeseen manner, which are free of boric acid and have less impact on the environment.

另外,已成功地達成提供鎳電鍍浴,其適於作為基礎用於沈積關於其光學外觀及其化學性質之各種類型之不同鎳塗層,例如光亮鎳塗層、半光亮鎳塗層、緞光鎳塗層、啞光鎳塗層或含非導電性粒子之鎳塗層。該鎳電鍍浴亦顯示良好整平性能且產生充分整平之塗層。In addition, it has been successfully achieved to provide nickel electroplating baths which are suitable as a basis for depositing various types of different nickel coatings with respect to their optical appearance and their chemical properties, such as bright nickel coatings, semi-bright nickel coatings, satin Nickel coating, matt nickel coating or nickel coating with non-conductive particles. The nickel electroplating bath also showed good levelling properties and produced well leveled coatings.

表之簡單說明 在結合表閱讀以下說明後,本發明之目標、特徵及優點也將變得顯而易見,在表中: 1 展現根據本發明之實施例用於光亮鎳塗層之本發明試驗。 2 展現在本發明範圍外之比較實施例之光亮鎳塗層的比較試驗。 3 展現根據本發明之其他實施例之光亮鎳塗層的本發明試驗。 Brief Description of Tables The objects, features and advantages of the present invention will also become apparent upon reading the following description in conjunction with the Tables: Table 1 presents inventive tests for bright nickel coatings according to examples of the invention. Table 2 presents comparative tests of bright nickel coatings of comparative examples outside the scope of the present invention. Table 3 presents inventive tests of bright nickel coatings according to other embodiments of the present invention.

在本發明之較佳實施例中,鎳電鍍浴具有在10至30 g/l之範圍內之氯含量。In a preferred embodiment of the present invention, the nickel electroplating bath has a chlorine content in the range of 10 to 30 g/l.

表述「氯含量」在本發明之上下文中意指氯離子源。The expression "chlorine content" in the context of the present invention means a source of chloride ions.

氯化鎳可部分地由氯化鈉代替。Nickel chloride can be partially replaced by sodium chloride.

此外,電解質中之氯化物可部分地由等量溴化物代替。In addition, the chloride in the electrolyte can be partially replaced by an equivalent amount of bromide.

在本發明之上下文中,鎳離子源可為任何類型之鎳鹽或鎳錯合物,其適於在各別鎳電沈積浴中提供游離鎳離子,例如氯化鎳及/或硫酸鎳。In the context of the present invention, the source of nickel ions may be any type of nickel salt or nickel complex suitable for providing free nickel ions in the respective nickel electrodeposition bath, such as nickel chloride and/or nickel sulfate.

本發明之鎳電鍍浴可用於將裝飾用鎳塗層沈積在欲處理之基於金屬及/或金屬合金、具體而言鋼、銅、黃銅、鋁、青銅、鎂及/或鋅壓鑄件之複數種不同類型之基板上;或於「POP」基板上。「POP」在本發明之意義上意指「於塑膠上電鍍」。因此,POP基板包含合成基板、較佳基於至少一種聚合化合物、更佳基於丙烯腈-丁二烯-苯乙烯(ABS)、聚醯胺、聚丙烯或ABS/PC (聚碳酸酯)。The nickel electroplating bath of the present invention can be used to deposit a decorative nickel coating on a plurality of die castings based on metals and/or metal alloys, in particular steel, copper, brass, aluminum, bronze, magnesium and/or zinc to be treated on different types of substrates; or on "POP" substrates. "POP" in the sense of the present invention means "electroplating on plastic". Thus, the POP substrate comprises a synthetic substrate, preferably based on at least one polymeric compound, more preferably on acrylonitrile-butadiene-styrene (ABS), polyamide, polypropylene or ABS/PC (polycarbonate).

在本發明之較佳實施例中,鎳電鍍浴實質上不含、較佳完全不含可與鎳離子源一起作為鎳合金層電解沈積之任何其他金屬離子(除始終提供於本發明電鍍浴中之鎳離子源以外)。In a preferred embodiment of the present invention, the nickel electroplating bath is substantially free, preferably completely free, of any other metal ions (other than those always provided in the electroplating baths of the present invention) that can be electrolytically deposited as a nickel alloy layer with a source of nickel ions other than the nickel ion source).

具體而言,鎳電鍍浴較佳實質上不含、較佳完全不含鐵、金、銅、鉍、錫、鋅、銀、鉛及鋁離子源。Specifically, the nickel electroplating bath is preferably substantially free, preferably completely free of iron, gold, copper, bismuth, tin, zinc, silver, lead, and aluminum ion sources.

表述「實質上不含」在本發明之上下文中意指各別金屬離子源之濃度小於1 g/l、較佳小於0.1 g/l且更佳小於0.01 g/l。The expression "substantially free" in the context of the present invention means that the concentration of the respective source of metal ions is less than 1 g/l, preferably less than 0.1 g/l and more preferably less than 0.01 g/l.

在一個實施例中,至少一種胺基酸係選自由以下組成之群:β丙胺酸、甘胺酸、麩胺酸、DL-天冬胺酸、蘇胺酸、纈胺酸、麩醯胺酸或L-絲胺酸。In one embodiment, the at least one amino acid is selected from the group consisting of beta alanine, glycine, glutamic acid, DL-aspartic acid, threonine, valine, glutamic acid or L-serine.

在一個實施例中,該至少一種不為胺基酸之羧酸係選自由以下組成之群:單羧酸、二羧酸或三羧酸。In one embodiment, the at least one carboxylic acid that is not an amino acid is selected from the group consisting of: a monocarboxylic acid, a dicarboxylic acid, or a tricarboxylic acid.

在其較佳實施例中,該至少一種不為胺基酸之羧酸係選自由以下組成之群:酒石酸、乙醇酸、蘋果酸、乙酸、乳酸、檸檬酸、琥珀酸、丙酸、甲酸或戊二酸。In its preferred embodiment, the at least one carboxylic acid that is not an amino acid is selected from the group consisting of: tartaric acid, glycolic acid, malic acid, acetic acid, lactic acid, citric acid, succinic acid, propionic acid, formic acid or glutaric acid.

在一個實施例中,電鍍浴包含至少兩種不同羧酸,其二者均不為胺基酸;其中該兩種不同羧酸之總濃度係在10至40 g/l之範圍內。In one embodiment, the electroplating bath comprises at least two different carboxylic acids, neither of which are amino acids; wherein the total concentration of the two different carboxylic acids is in the range of 10 to 40 g/l.

在一個實施例中,電鍍浴包含至少一種胺基酸及一種不為胺基酸之羧酸;其中該胺基酸之總濃度係在1至10 g/l之範圍內,其中不為胺基酸之該羧酸之總濃度係在10至40 g/l之範圍內。In one embodiment, the electroplating bath comprises at least one amino acid and one carboxylic acid other than an amino acid; wherein the total concentration of the amino acids is in the range of 1 to 10 g/l, wherein the amino acids are not The total concentration of the carboxylic acid of the acid is in the range of 10 to 40 g/l.

在較佳實施例中,該等鎳離子之總濃度係在60至75 g/l且較佳62至72 g/l之範圍內。In a preferred embodiment, the total concentration of the nickel ions is in the range of 60 to 75 g/l and preferably 62 to 72 g/l.

在一個實施例中,電鍍浴之pH值在2至6、較佳3至5、更佳3.5至4.7之範圍內。In one embodiment, the pH of the electroplating bath is in the range of 2 to 6, preferably 3 to 5, more preferably 3.5 to 4.7.

此外,鎳電鍍浴在本發明之某些實施例中可包含至少一種潤濕劑,例如2-乙基己基硫酸鹽、二-烷基磺基琥珀酸鹽、聚合萘磺酸鹽、月桂基硫酸鹽或月桂基醚硫酸鹽,其中此一潤濕劑(在使用時)之濃度係在5至500 mg/l之範圍內、較佳10至350 mg/l之範圍內且更佳20至250 mg/l之範圍內。Additionally, the nickel electroplating baths may in certain embodiments of the present invention include at least one wetting agent, such as 2-ethylhexyl sulfate, di-alkylsulfosuccinate, polymeric naphthalene sulfonate, lauryl sulfate salt or lauryl ether sulfate, wherein the concentration of this wetting agent (when used) is in the range of 5 to 500 mg/l, preferably in the range of 10 to 350 mg/l and more preferably in the range of 20 to 250 within the range of mg/l.

電鍍浴可進一步包含濃度在0.005至5 g/l、較佳0.02至2 g/l、更佳0.05至0.5 g/l之範圍內之苯甲酸或鹼金屬苯甲酸鹽。該等添加劑化合物有助於減小所沈積塗層之內應力。The electroplating bath may further comprise benzoic acid or an alkali metal benzoate in a concentration in the range of 0.005 to 5 g/l, preferably 0.02 to 2 g/l, more preferably 0.05 to 0.5 g/l. These additive compounds help reduce internal stress in the deposited coating.

電鍍浴亦可進一步包含濃度在0.1至10 g/l、較佳0.3至6 g/l、更佳0.5至3.5 g/l之範圍內之柳酸。此一添加劑正面地影響所達成塗層之硬度、耐久性及光學性質。The electroplating bath may also further comprise salicylic acid in a concentration in the range of 0.1 to 10 g/l, preferably 0.3 to 6 g/l, more preferably 0.5 to 3.5 g/l. This additive positively affects the hardness, durability and optical properties of the resulting coating.

電鍍浴可進一步包含具體而言濃度在0.005至5 g/l、較佳0.02至2 g/l、更佳0.05至0.5 g/l之範圍內之選自增亮劑、整平劑、內應力降低劑及潤濕劑之額外化合物。The electroplating bath may further comprise selected from brighteners, levelers, internal stressors, specifically in the range of 0.005 to 5 g/l, preferably 0.02 to 2 g/l, more preferably 0.05 to 0.5 g/l Additional compounds for reducing and wetting agents.

作為模範地,在某些實施例中可包含較佳用於光亮鎳塗層之主要增亮劑,例如不飽和、在大多數情形中芳香族磺酸、磺醯胺、磺醯亞胺、N-磺醯基甲醯胺、亞磺酸鹽、二芳基碸或其鹽、具體而言鈉或鉀鹽。Exemplarily, primary brighteners such as unsaturated, in most cases aromatic sulfonic acids, sulfonamides, sulfoimidides, N - Sulfonylcarboxamides, sulfinates, diarylidene or salts thereof, in particular sodium or potassium salts.

最熟悉之化合物係(例如)間苯二磺酸、苯甲酸磺醯亞胺(糖精)、1,3,6-萘三磺酸三鈉、苯單磺酸鈉、二苯磺醯胺、苯單亞磺酸鈉、乙烯基磺酸、烯丙基磺酸、烯丙基磺酸之鈉鹽、對-甲苯磺酸、對-甲苯磺醯胺、炔丙基磺酸鈉、苯甲酸磺醯亞胺、1,3,6-萘三磺酸及苯甲醯基苯磺醯胺。The most familiar compounds are, for example, isophthalic acid, sulfonimide benzoate (saccharin), trisodium 1,3,6-naphthalenetrisulfonate, sodium benzenemonosulfonate, dibenzenesulfonimide, benzene Sodium monosulfinate, vinyl sulfonic acid, allyl sulfonic acid, sodium salt of allyl sulfonic acid, p-toluenesulfonic acid, p-toluenesulfonic acid amide, sodium propargyl sulfonate, benzoic acid sulfonic acid imines, 1,3,6-naphthalenetrisulfonic acid and benzylbenzenesulfonamides.

此外,此一主要增亮劑可包含炔丙醇及/或其衍生物(乙氧基化或丙氧基化)。Furthermore, this primary brightener may comprise propargyl alcohol and/or its derivatives (ethoxylated or propoxylated).

主要增亮劑可以0.001至8 g/l、較佳0.01至2 g/l、更佳0.02至1 g/l之範圍內之濃度添加至電解質浴。亦可同時使用若干種主要增亮劑。The primary brightener may be added to the electrolyte bath at a concentration in the range of 0.001 to 8 g/l, preferably 0.01 to 2 g/l, more preferably 0.02 to 1 g/l. Several primary brighteners can also be used at the same time.

此外,本發明之目標亦藉由用於在欲處理基板上沈積裝飾用鎳塗層之方法解決,該方法包含以下方法步驟:i) 使欲處理基板與此一本發明鎳電鍍浴接觸; ii) 使至少一個陽極與鎳電鍍浴接觸; iii) 將電壓施加至該欲處理基板及該至少一個陽極;及 iv) 在該欲處理基板上電沈積裝飾用鎳塗層。Furthermore, the object of the present invention is also solved by a method for depositing a decorative nickel coating on a substrate to be treated, the method comprising the following method steps: i) bringing the substrate to be treated into contact with the nickel electroplating bath of the present invention; ii ) contacting at least one anode with a nickel electroplating bath; iii) applying a voltage to the substrate to be treated and the at least one anode; and iv) electrodepositing a decorative nickel coating on the substrate to be treated.

在一個實施例中,沈積方法係在30℃至70℃、較佳40℃至65℃且更佳50℃至60℃之工作溫度範圍中執行。In one embodiment, the deposition method is performed in an operating temperature range of 30°C to 70°C, preferably 40°C to 65°C, and more preferably 50°C to 60°C.

在一個實施例中,沈積方法係在1至7安培/dm2 (ASD)、較佳1.5至6 ASD且更佳2至5 ASD之工作電流密度範圍中執行。In one embodiment, the deposition method is performed in an operating current density range of 1 to 7 amps/dm 2 (ASD), preferably 1.5 to 6 ASD, and more preferably 2 to 5 ASD.

在一個實施例中,沈積方法係在5至50分鐘、較佳6至35分鐘且更佳8至25分鐘之範圍內之用於施加電壓並隨後電沈積裝飾用鎳塗層(方法步驟iii)及iv))之工作時間中執行。In one embodiment, the deposition method is in the range of 5 to 50 minutes, preferably 6 to 35 minutes and more preferably 8 to 25 minutes for applying a voltage and then electrodepositing a decorative nickel coating (method step iii) and iv)) during the working hours.

在一個實施例中,電鍍浴進一步包含至少一種糖精及/或呈糖精鹽形式、較佳糖精之鈉鹽形式之糖精衍生物,其濃度在1至10 g/l、較佳1.5至7 g/l、更佳2至6 g/l之範圍內;及至少一種磺酸及/或呈磺酸鹽形式之磺酸衍生物,較佳選自由以下組成之群:烯丙基磺酸、乙烯基磺酸、烯丙基磺酸之鈉鹽、乙烯基磺酸之鈉鹽或其混合物,其總濃度在0.1至5 g/l、較佳0.25至3.5 g/l、更佳0.5至2.0 g/l之範圍內。由此,沈積光亮鎳塗層。上述添加劑之選擇性選擇顯示本發明鎳電鍍浴用於沈積不同光學外觀及化學性質之裝飾用鎳塗層之目的的獨特應用。In one embodiment, the electroplating bath further comprises at least one saccharin and/or saccharin derivative in the form of a saccharin salt, preferably a sodium salt of saccharin, in a concentration of 1 to 10 g/l, preferably 1.5 to 7 g/l l, preferably in the range of 2 to 6 g/l; and at least one sulfonic acid and/or a sulfonic acid derivative in the form of a sulfonate salt, preferably selected from the group consisting of: allylsulfonic acid, vinylsulfonic acid Sulfonic acid, sodium salt of allylsulfonic acid, sodium salt of vinylsulfonic acid or mixtures thereof, in a total concentration of 0.1 to 5 g/l, preferably 0.25 to 3.5 g/l, more preferably 0.5 to 2.0 g/l within the range of l. Thereby, a bright nickel coating is deposited. The selective choice of additives described above shows the unique application of the nickel electroplating baths of the present invention for the purpose of depositing decorative nickel coatings of varying optical appearance and chemical properties.

在前述實施例之另一替代實施例中,電鍍浴進一步包含至少一種較佳選自由2,5己炔二醇及1,4丁炔二醇組成之群之二醇,其濃度在10至300 mg/l、較佳50至250 mg/l、更佳100至220 mg/l之範圍內;或至少一種選自丙基磺基甜菜鹼吡啶鎓(PPS)或其衍生物(例如PPS-OH)之群之添加劑,其總濃度在5至350 mg/l、較佳10至200 mg/l、更佳50至150 mg/l之範圍內。In another alternative to the foregoing embodiment, the electroplating bath further comprises at least one diol, preferably selected from the group consisting of 2,5 hexynediol and 1,4 butynediol, at a concentration of 10 to 300 mg/l, preferably 50 to 250 mg/l, more preferably 100 to 220 mg/l; or at least one selected from the group consisting of pyridinium propylsulfobetaine (PPS) or derivatives thereof (eg PPS-OH ) with a total concentration in the range of 5 to 350 mg/l, preferably 10 to 200 mg/l, more preferably 50 to 150 mg/l.

由此,沈積半光亮鎳塗層。上述添加劑之選擇性選擇再次如上述替代實施例中一樣顯示本發明鎳電鍍浴用於沈積不同光學外觀及化學性質之裝飾用鎳塗層之目的的獨特應用。Thereby, a semi-bright nickel coating is deposited. The selective selection of the above-mentioned additives, again as in the above-mentioned alternative examples, demonstrates the unique application of the nickel electroplating baths of the present invention for the purpose of depositing decorative nickel coatings of different optical appearances and chemistries.

另外,本發明之目標亦藉由利用此一鎳電鍍浴藉由實施此一方法用於沈積光亮、半光亮、緞光、啞光或含非導電性粒子之鎳塗層來解決。In addition, the object of the present invention is also solved by utilizing such a nickel electroplating bath by implementing such a method for depositing bright, semi-bright, satin, matt or non-conductive particle-containing nickel coatings.

因此,本發明解決了提供不含硼酸之鎳電鍍浴用於沈積不同光學外觀及化學性質之裝飾用鎳塗層(例如光亮鎳塗層、半光亮鎳塗層、緞光鎳塗層、啞光鎳塗層或含非導電性粒子之鎳塗層)之問題。Accordingly, the present invention addresses the provision of boric acid-free nickel electroplating baths for depositing decorative nickel coatings of varying optical appearance and chemistries (e.g. bright nickel coatings, semi-bright nickel coatings, satin nickel coatings, matte nickel coatings coatings or nickel coatings containing non-conductive particles).

提供以下非限制性實例以圖解說明本發明之實施例且促進對本發明之理解,但並不意欲限制本發明之範圍,本發明之範圍由本文之隨附申請專利範圍來界定。The following non-limiting examples are provided to illustrate embodiments of the invention and to facilitate an understanding of the invention, but are not intended to limit the scope of the invention, which is defined by the scope of the claims appended hereto.

一般說明: 基板在其用於鎳沈積之前始終以以下方式預處理: i) 藉由熱浸清洗劑去脂 ii) 電解去脂 iii) 沖洗, iv) 用10 vol%硫酸進行酸浸 General Notes: Substrates are always pretreated before they are used for nickel deposition: i) degreased by hot dip cleaner ii) electrolytic degreased iii) rinsed, iv) acid leached with 10 vol% sulfuric acid

樣品基板已經刮擦用於整平之主觀光學判斷。基板上所得鎳塗層之閃光亦以光學方式判斷。樣品基板之大小通常係7 cm × 10 cm (寬度×長度),此使得在一側上欲處理之表面係70 cm2 (表1、2及3)。The sample substrate has been scratched for subjective optical judgment of leveling. The sparkle of the resulting nickel coating on the substrate was also judged optically. The size of the sample substrate is typically 7 cm x 10 cm (width x length), which makes the surface to be treated 70 cm 2 on one side (Tables 1, 2 and 3).

若無不同闡述,則表1、2及3中針對呈酸形式之錯合劑所給出之所有濃度均以g/l列示。All concentrations given in Tables 1, 2 and 3 for the complexing agent in acid form are listed in g/l unless otherwise stated.

表1、2及3中所給出之試驗按順序編號。The tests given in Tables 1, 2 and 3 are numbered sequentially.

現轉向表, 1 顯示根據本發明實施例之光亮鎳塗層之所實施試驗。Turning now to the Table, Table 1 shows the tests performed for bright nickel coatings according to embodiments of the present invention.

對於表1中所列示之所有試驗,鎳沈積係在霍爾槽(Hull cell)中進行,其中在55℃+/- 3℃之溫度施加2.5安培(A)達10分鐘。此外,在鎳沈積期間引入3公升/min壓縮空氣。For all tests listed in Table 1, nickel deposition was performed in a Hull cell with 2.5 amps (A) applied for 10 minutes at a temperature of 55°C +/- 3°C. In addition, 3 liters/min of compressed air was introduced during nickel deposition.

對於表1中所列示之所有試驗,鎳濃度為67 g/l。For all tests listed in Table 1, the nickel concentration was 67 g/l.

清晰地看出,表1中所列示之所有本發明試驗產生均勻光亮且整平之鎳塗層。即使當詳細檢查作為鎳離子之錯合劑之若干不同酸時,該等不含硼酸之浴亦始終有良好的顯著結果。所有酸均以技術方案1中所主張之特定各別濃度範圍使用,此取決於胺基酸或不為胺基酸之羧酸的酸的化學性質。It is clearly seen that all of the inventive tests listed in Table 1 produced uniformly bright and leveled nickel coatings. These boric acid-free baths consistently gave good significant results even when scrutinizing several different acids as complexing agents for nickel ions. All acids are used in the specific respective concentration ranges claimed in solution 1, which depend on the chemical nature of the acid of the amino acid or the carboxylic acid which is not an amino acid.

各別行顯示試驗編號、作為錯合劑使用之酸、作為錯合劑使用之酸之濃度、鎳浴之pH值及在霍爾槽面板上之最高電流密度至最低電流密度之範圍內所達成鎳塗層之結果(總長度視為10 cm) (已自左至右闡述表1之各行)。 1 光亮鎳塗層之試驗

Figure 107121396-A0304-0001
The respective rows show the test number, the acid used as complexing agent, the concentration of acid used as complexing agent, the pH of the nickel bath, and the nickel coating achieved in the range from the highest current density to the lowest current density on the Hall cell panel. Layer results (total length considered 10 cm) (rows of Table 1 have been described from left to right). Table 1 : Testing of Bright Nickel Coatings
Figure 107121396-A0304-0001

表2 展現在本發明範圍外之比較實施例之光亮鎳塗層的比較試驗。 Table 2 presents comparative tests of bright nickel coatings of comparative examples outside the scope of the present invention.

對於表2中所列示之所有試驗,鎳沈積係在霍爾槽中在55℃+/- 3℃之溫度下如表1中所列示之試驗一樣進行。此外,在鎳沈積期間引入3公升/min壓縮空氣。各別行顯示試驗編號、作為錯合劑使用之酸、作為錯合劑使用之酸之濃度、鎳浴之pH值、所施加之電流(以安培(A)表示)、鎳離子濃度(以g/l表示)、電流之施加時間(以分鐘表示)及所達成之鎳塗層結果(已自左至右闡述表2之各行)。 2 光亮鎳塗層之比較試驗

Figure 107121396-A0304-0002
For all tests listed in Table 2, nickel deposition was carried out as for the tests listed in Table 1 in a Hall cell at a temperature of 55°C +/- 3°C. In addition, 3 liters/min of compressed air was introduced during nickel deposition. Each row shows the test number, acid used as complexing agent, concentration of acid used as complexing agent, pH of nickel bath, applied current (expressed in amperes (A)), nickel ion concentration (in g/l ), the time of application of the current (in minutes), and the nickel coating results achieved (the rows of Table 2 have been described from left to right). Table 2 : Comparative Test of Bright Nickel Coatings
Figure 107121396-A0304-0002

試驗30至35顯示利用與表1中之某些試驗相同但具有不同濃度之各別酸作為錯合劑之比較試驗。所有試驗30至35均具有與所主張濃度範圍相比過低或過高之用於鎳離子之錯合劑濃度。Experiments 30 to 35 show comparative experiments using the same acids as some of the experiments in Table 1 but with different concentrations of the respective acids as complexing agents. All runs 30 to 35 had complexing agent concentrations for nickel ions that were too low or too high compared to the claimed concentration range.

試驗36至38顯示比較試驗。在此處,酸係以所主張濃度範圍使用,但具有改變的工作參數,即電流(試驗36)、施加時間(試驗37)及鎳離子濃度(試驗38)。各別值在表2中已經突出並加下劃線用於說明目的。Experiments 36 to 38 show comparative experiments. Here, the acid system was used at the claimed concentration range, but with altered operating parameters, namely current (run 36), application time (run 37), and nickel ion concentration (run 38). Individual values have been highlighted and underlined in Table 2 for illustrative purposes.

清晰地看出,表2中所列示之所有比較試驗均導致較表1試驗差的結果。顯然,選擇適宜的不同參數以沈積均勻光亮鎳塗層係不可預測的。因此,基於所需參數之創造性選擇,所主張浴及方法作為選擇發明係創造性的,其中清晰地看出,即使僅改變一個參數亦導致差的鎳塗層而非光亮且均勻鎳塗層。It is clear that all the comparative tests listed in Table 2 resulted in poorer results than the Table 1 tests. Obviously, the selection of appropriate different parameters to deposit a uniform bright nickel coating is unpredictable. Thus, the claimed bath and method are inventive as selection inventions based on the inventive selection of the required parameters, where it is clearly seen that changing even only one parameter results in a poor nickel coating rather than a bright and uniform nickel coating.

比較試驗30至38亦係不含硼酸的。Comparative Runs 30 to 38 were also boric acid-free.

試驗39至41顯示基於迄今常用硼酸作為鎳離子之錯合劑的比較試驗。因此,此代表常見的現有技術。Experiments 39 to 41 show comparative experiments based on boric acid which has hitherto been commonly used as a complexing agent for nickel ions. Therefore, this represents common prior art.

表3 展現根據本發明之其他實施例之光亮鎳塗層的本發明試驗。 Table 3 presents inventive tests of bright nickel coatings according to other embodiments of the present invention.

表3中所列示之試驗已以與表1中所列示之試驗相同之方式執行。在此處,試驗42至46顯示兩種羧酸之組合,其中二者均不為胺基酸(試驗42及43);及一種胺基酸與一種不為胺基酸之羧酸的組合(試驗44至46)。表3之該等本發明實例的所有結果具有與表1中相同之良好成就。所有均導致均勻光亮鎳塗層。行(濃度)具有兩種酸之濃度。 3 光亮鎳塗層之其他試驗

Figure 107121396-A0304-0003
The tests listed in Table 3 have been carried out in the same manner as those listed in Table 1. Here, runs 42 to 46 show a combination of two carboxylic acids, neither of which are amino acids (runs 42 and 43); and a combination of an amino acid and a carboxylic acid that is not an amino acid ( Trials 44 to 46). All results of these inventive examples in Table 3 have the same good results as in Table 1 . All result in a uniform bright nickel coating. The row (concentration) has the concentrations of the two acids. Table 3 : Other Tests for Bright Nickel Coatings
Figure 107121396-A0304-0003

儘管已關於某些特定實施例而闡釋且出於說明之目的而提供本發明之原則,但應理解,熟習此項技術者將在閱讀本說明書時明瞭對本發明之各種修改。因此,應理解,本文中所揭示之本發明意欲涵蓋屬隨附申請專利範圍之範圍內之此等修改。本發明之範圍僅受隨附申請專利範圍之範圍限制。While the principles of the invention have been illustrated with respect to certain specific embodiments and provided for illustrative purposes, it should be understood that various modifications to the invention will become apparent to those skilled in the art upon reading this specification. Therefore, it is to be understood that the invention disclosed herein is intended to cover such modifications as fall within the scope of the appended claims. The scope of the present invention is limited only by the scope of the appended claims.

Claims (14)

一種用於在欲處理基板上沈積裝飾用鎳塗層之鎳電鍍浴,該電鍍浴包含至少一種鎳離子源、至少一種胺基酸及/或至少一種不為胺基酸之羧酸;其中該(等)胺基酸之總濃度係在1至10g/l之範圍內,其中該(等)不為胺基酸之羧酸的總濃度係在10至40g/l之範圍內;其中該電鍍浴不含硼酸;其中該等鎳離子之總濃度係在55至80g/l之範圍內;且其中該鎳電鍍浴具有在7.5至40g/l之範圍內之氯含量,其特徵在於該鎳電鍍浴進一步包含:- 糖精及/或呈糖精鹽形式之糖精衍生物,其濃度在1.5至10g/l之範圍內,及- 至少一種磺酸及/或呈磺酸鹽形式之磺酸衍生物,其總濃度在0.1至5g/l之範圍內。 A nickel electroplating bath for depositing a decorative nickel coating on a substrate to be treated, the electroplating bath comprising at least one source of nickel ions, at least one amino acid and/or at least one carboxylic acid other than amino acid; wherein the The total concentration of (etc.) amino acids is in the range of 1 to 10 g/l, wherein the total concentration of the (etc.) carboxylic acids that are not amino acids is in the range of 10 to 40 g/l; wherein the electroplating The bath is free of boric acid; wherein the total concentration of the nickel ions is in the range of 55 to 80 g/l; and wherein the nickel electroplating bath has a chlorine content in the range of 7.5 to 40 g/l, characterized in that the nickel electroplating The bath further comprises: - saccharin and/or saccharin derivatives in the form of saccharin salts in a concentration in the range from 1.5 to 10 g/l, and - at least one sulfonic acid and/or sulfonic acid derivatives in the form of sulfonate salts, Its total concentration is in the range of 0.1 to 5 g/l. 如請求項1之鎳電鍍浴,其中該至少一種胺基酸係選自由以下組成之群:β丙胺酸、甘胺酸、麩胺酸、DL-天冬胺酸、蘇胺酸、纈胺酸、麩醯胺酸或L-絲胺酸。 The nickel electroplating bath of claim 1, wherein the at least one amino acid is selected from the group consisting of beta alanine, glycine, glutamic acid, DL-aspartic acid, threonine, valine , glutamic acid or L-serine. 如請求項1或2之鎳電鍍浴,其中該至少一種不為胺基酸之羧酸係選自由以下組成之群:單羧酸、二羧酸或三羧酸。 The nickel electroplating bath of claim 1 or 2, wherein the at least one carboxylic acid that is not an amino acid is selected from the group consisting of: a monocarboxylic acid, a dicarboxylic acid, or a tricarboxylic acid. 如請求項3之鎳電鍍浴,其中該至少一種不為胺基酸之羧酸係選自由以下組成之群:酒石酸、乙醇酸、蘋果酸、乙酸、乳酸、檸檬酸、琥珀 酸、丙酸、甲酸或戊二酸。 The nickel electroplating bath of claim 3, wherein the at least one carboxylic acid that is not an amino acid is selected from the group consisting of: tartaric acid, glycolic acid, malic acid, acetic acid, lactic acid, citric acid, succinic acid acid, propionic acid, formic acid or glutaric acid. 如請求項1或2之鎳電鍍浴,其中該電鍍浴包含至少兩種不同羧酸,其二者均不為胺基酸;其中該兩種不同羧酸之總濃度係在10至40g/l之範圍內。 The nickel electroplating bath of claim 1 or 2, wherein the electroplating bath comprises at least two different carboxylic acids, neither of which are amino acids; wherein the total concentration of the two different carboxylic acids is between 10 and 40 g/l within the range. 如請求項1或2之鎳電鍍浴,其中該電鍍浴包含至少一種胺基酸及一種不為胺基酸之羧酸;其中該胺基酸之總濃度係在1至10g/l之範圍內,其中不為胺基酸之該羧酸之總濃度係在10至40g/l之範圍內。 The nickel electroplating bath of claim 1 or 2, wherein the electroplating bath comprises at least one amino acid and a carboxylic acid other than an amino acid; wherein the total concentration of the amino acids is in the range of 1 to 10 g/l , wherein the total concentration of the carboxylic acids other than amino acids is in the range of 10 to 40 g/l. 如請求項1或2之鎳電鍍浴,其中該等鎳離子之總濃度係在60至75g/l之範圍內。 The nickel electroplating bath of claim 1 or 2, wherein the total concentration of the nickel ions is in the range of 60 to 75 g/l. 如請求項1或2之鎳電鍍浴,其中該電鍍浴之pH值係在2至6之範圍內。 The nickel electroplating bath of claim 1 or 2, wherein the pH of the electroplating bath is in the range of 2 to 6. 一種用於在欲處理基板上沈積裝飾用鎳塗層之方法,其包含以下方法步驟:i)使該欲處理基板與如請求項1至8中任一項之鎳電鍍浴接觸;ii)使至少一個陽極與該鎳電鍍浴接觸;iii)將電壓施加至該欲處理基板及該至少一個陽極;及iv)在該欲處理基板上電沈積裝飾用鎳塗層。 A method for depositing a decorative nickel coating on a substrate to be treated, comprising the method steps of: i) bringing the substrate to be treated in contact with a nickel electroplating bath as claimed in any one of claims 1 to 8; ii) bringing At least one anode is in contact with the nickel electroplating bath; iii) a voltage is applied to the substrate to be treated and the at least one anode; and iv) a decorative nickel coating is electrodeposited on the substrate to be treated. 如請求項9之用於沈積裝飾用鎳塗層之方法,其中該沈積方法係在30℃至70℃之工作溫度範圍中執行。 The method for depositing a decorative nickel coating as claimed in claim 9, wherein the deposition method is performed in an operating temperature range of 30°C to 70°C. 如請求項9或10之用於沈積裝飾用鎳塗層之方法,其中該沈積方法係在1至7安培/dm2(ASD)之工作電流密度範圍中執行。 A method for depositing a decorative nickel coating as claimed in claim 9 or 10, wherein the deposition method is performed in an operating current density range of 1 to 7 ampere/dm2 (ASD). 如請求項9或10之用於沈積裝飾用鎳塗層之方法,其中該沈積方法係在5至50分鐘之範圍內之用於施加該電壓並隨後電沈積該裝飾用鎳塗層(方法步驟iii)及iv))之工作時間中執行。 A method for depositing a decorative nickel coating as claimed in claim 9 or 10, wherein the deposition method is in the range of 5 to 50 minutes for applying the voltage and subsequently electrodepositing the decorative nickel coating (method steps iii) and iv)) during working hours. 如請求項9或10之用於沈積裝飾用鎳塗層之方法,其中該糖精及/或呈糖精鹽形式之糖精衍生物之濃度係在1.5至7g/l之範圍內;及該至少一種磺酸及/或呈磺酸鹽形式之磺酸衍生物之總濃度係在0.25至3.5g/l之範圍內。 The method for depositing a decorative nickel coating as claimed in claim 9 or 10, wherein the concentration of the saccharin and/or saccharin derivatives in the form of saccharin salts is in the range of 1.5 to 7 g/l; and the at least one sulfonic acid The total concentration of acid and/or sulfonic acid derivatives in the form of sulfonates is in the range of 0.25 to 3.5 g/l. 一種如前述請求項1至8中任一項之鎳電鍍浴的用途,其藉由實施如請求項9至13中任一項之方法用於沈積光亮之鎳塗層。 Use of a nickel electroplating bath according to any of the preceding claims 1 to 8 for depositing a bright nickel coating by carrying out the method according to any of the claims 9 to 13.
TW107121396A 2017-06-23 2018-06-22 Nickel electroplating bath for depositing a decorative nickel coating on a substrate TWI762661B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17177732 2017-06-23
EP17177732.9 2017-06-23
??17177732.9 2017-06-23

Publications (2)

Publication Number Publication Date
TW201905243A TW201905243A (en) 2019-02-01
TWI762661B true TWI762661B (en) 2022-05-01

Family

ID=59215623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107121396A TWI762661B (en) 2017-06-23 2018-06-22 Nickel electroplating bath for depositing a decorative nickel coating on a substrate

Country Status (10)

Country Link
EP (2) EP3933072A1 (en)
JP (2) JP7536452B2 (en)
CN (1) CN110785516A (en)
DK (1) DK3642396T3 (en)
ES (1) ES2890664T3 (en)
HU (1) HUE056778T2 (en)
PL (1) PL3642396T3 (en)
PT (1) PT3642396T (en)
TW (1) TWI762661B (en)
WO (1) WO2018234229A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7551647B2 (en) * 2019-04-15 2024-09-17 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー Galvanic nickel or nickel alloy electroplating bath for depositing semi-bright nickel or semi-bright nickel alloy coatings
CN116083987A (en) * 2022-11-25 2023-05-09 盐城吉瓦新材料科技有限公司 Electroplating diamond wire with protective layer and preparation process thereof
US20250137156A1 (en) * 2023-10-26 2025-05-01 Macdermid Enthone Inc. Boric acid-free satin nickel

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060096868A1 (en) * 2004-11-10 2006-05-11 Siona Bunce Nickel electroplating bath designed to replace monovalent copper strike solutions

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1541118A (en) * 1976-12-03 1979-02-21 Bnf Metals Tech Centre Nickel plating
JPS5562188A (en) * 1978-06-19 1980-05-10 Oosakashi Bright black nickel electroplating bath
DD154615B1 (en) * 1980-11-20 1987-11-25 Hans U Galgon ELECTROLYTE FOR GALVANIC ADMINISTRATION OF GLACIATING GOLD ALLOYS
JPS5881988A (en) * 1981-11-06 1983-05-17 C Uyemura & Co Ltd Additive for satin finished plating
JPS61163289A (en) * 1985-01-14 1986-07-23 Nippon Kagaku Sangyo Kk Black electroplating bath by nickel and nickel alloy
JPS63171892A (en) * 1988-01-13 1988-07-15 C Uyemura & Co Ltd Electroplating method
JPH09157884A (en) * 1995-12-12 1997-06-17 Dipsol Chem Co Ltd Nonacidic nickel plating bath and plating method using the bath
DE69607130T2 (en) * 1995-12-29 2000-10-19 At & T Corp., New York Electroplating nickel on nickel ferrite devices
JP4737790B2 (en) * 1999-10-01 2011-08-03 株式会社シミズ Nickel plating bath without boric acid
JP3261676B2 (en) * 1999-12-16 2002-03-04 東京都 Electric nickel plating bath.
JP4455896B2 (en) * 2004-02-05 2010-04-21 学校法人神奈川大学 Plating solution
JP4666134B2 (en) * 2004-09-13 2011-04-06 株式会社村田製作所 Nickel plating bath and electronic parts
TW200934895A (en) * 2008-02-04 2009-08-16 Magtech Technology Co Ltd Nickel plating method with low contamination and high utilization rate
US20110114498A1 (en) * 2009-11-18 2011-05-19 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
JP5675303B2 (en) * 2010-11-30 2015-02-25 日東光学株式会社 Nickel plating bath and electroforming method using the same
JP2012162786A (en) * 2011-02-09 2012-08-30 Kanto Gakuin Nickel electroplating bath, nickel electroplating method, and nickel electroplated product
CN103132114B (en) * 2013-03-21 2016-02-10 湖南特力液压有限公司 Wear-resistant workpiece and manufacturing method of wear-resistant coating thereof
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
JP6195745B2 (en) * 2013-06-19 2017-09-13 地方独立行政法人東京都立産業技術研究センター Electro nickel plating solution, method for producing plating solution and electro plating method
DE102013113129A1 (en) * 2013-11-27 2015-05-28 RIAG Oberflächentechnik AG Process for the galvanic deposition of nickel and corresponding electrolyte
DE102014207778B3 (en) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Use of a mixture for use in a plating bath or plating bath to produce a bright nickel plating, and to a method of making an article having a bright nickel plating
DE102014118614A1 (en) * 2014-12-15 2016-06-16 Harting Kgaa Boric acid-free nickel bath
KR101693514B1 (en) * 2015-12-24 2017-01-06 주식회사 포스코 Fe-Ni-P ALLOY MULTILAYER STEEL SHEET AND METHOD FOR MANUFACTURING THE SAME

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060096868A1 (en) * 2004-11-10 2006-05-11 Siona Bunce Nickel electroplating bath designed to replace monovalent copper strike solutions

Also Published As

Publication number Publication date
DK3642396T3 (en) 2021-10-11
WO2018234229A1 (en) 2018-12-27
EP3642396B1 (en) 2021-07-28
PL3642396T3 (en) 2021-12-27
PT3642396T (en) 2021-09-10
JP2020524746A (en) 2020-08-20
CN110785516A (en) 2020-02-11
HUE056778T2 (en) 2022-03-28
EP3933072A1 (en) 2022-01-05
JP2023090747A (en) 2023-06-29
ES2890664T3 (en) 2022-01-21
EP3642396A1 (en) 2020-04-29
TW201905243A (en) 2019-02-01
JP7536452B2 (en) 2024-08-20
JP7723696B2 (en) 2025-08-14

Similar Documents

Publication Publication Date Title
JP7723696B2 (en) Nickel electroplating bath for depositing decorative nickel coatings on substrates
JP6062010B2 (en) Cyanide-free electroplating bath for white bronze based on copper(I) ions
JP5882540B2 (en) Nickel or nickel alloy direct current electroplating bath for depositing semi-bright nickel or nickel alloy, method for electroplating, and use of the bath and compound therefor
US10889907B2 (en) Cyanide-free acidic matte silver electroplating compositions and methods
TW200949021A (en) Pyrophosphate-based bath for plating of tin alloy layers
JP6606573B2 (en) Nickel electroplating composition containing cationic polymer and method for electroplating nickel
KR102418723B1 (en) Acidic aqueous silver-nickel alloy electroplating compositions and methods
CA2236933A1 (en) Electroplating of low-stress nickel
US11434577B2 (en) Acid aqueous binary silver-bismuth alloy electroplating compositions and methods
CN107787378A (en) Bronze Plating on Polymer Sheets
US11408085B2 (en) Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating
JP2009149978A (en) Copper-zinc alloy electroplating bath and plating method using the same
KR102819001B1 (en) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
KR102215209B1 (en) Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel
JP2012136753A (en) Copper-zinc alloy plating method, and copper-zinc alloy plating bath used therefor