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US20100130120A1 - Air conducting device - Google Patents

Air conducting device Download PDF

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Publication number
US20100130120A1
US20100130120A1 US12/464,554 US46455409A US2010130120A1 US 20100130120 A1 US20100130120 A1 US 20100130120A1 US 46455409 A US46455409 A US 46455409A US 2010130120 A1 US2010130120 A1 US 2010130120A1
Authority
US
United States
Prior art keywords
passageway
air conducting
tongues
heat generating
conducting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/464,554
Other languages
English (en)
Inventor
Sheng-Hung Lee
Chia-Yun Tsai
Gong-Jin Fan
Guo-An He
Li-Ping Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD. reassignment HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, LI-PING, FAN, GONG-JIN, HE, Guo-an, LEE, SHENG-HUNG, TSAI, CHIA-YUN
Publication of US20100130120A1 publication Critical patent/US20100130120A1/en
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards

Definitions

  • the present disclosure relates to air conduction, and particularly to an air conducting device in a computer.
  • Air conducting devices are often used in computers coupled with fans for dissipating heat from electronic components.
  • a computer often includes a plurality of different heat generating components, such as CPUs, memories, and others.
  • An airduct covers the heat generating components, and a fan is installed on or near the inlet to generate airflow to dissipate heat from the heat generating components within the airduct.
  • different heat generating components may work at different temperatures, such that one with higher temperature may elevate the overall temperature in the airduct and affect the other components therein. In this way, the temperature of the affected heat generating components may exceed the temperature limit, and may be thereby damaged.
  • generated airflow exceeds the cooling requirements, translating to wasted energy and hardware.
  • FIG. 1 is an exploded, isometric view of an air conducting device, the air conducting device including a first chamber and a second chamber.
  • FIG. 2 is an assembled view of FIG. 1 .
  • an air conducting device 50 is configured to assist the removal of heat from a plurality of first heat generating components, such as memories 20 and a plurality of second heat generating components, such as central processing units (CPUs) 14 by directing airflow flowing therethrough.
  • the memories 20 are installed in a plurality of parallel slots 12 of a motherboard 10 .
  • the memories 20 are optionally installed in the slots 12 .
  • the heat generating components 14 are installed on the motherboard 10 adjacent to the slots 12 .
  • the CPUs 14 may create more heat than the memories 20 .
  • the air conducting device 50 includes a body, baffle 55 , and a plurality of tongues 572 .
  • the body includes a top wall 51 and two parallel sidewalls 53 extending downwardly therefrom.
  • the top wall 51 is parallel to the motherboard 10 .
  • An airflow passageway is defined by the air conducting device 50 for directing the airflow therethrough.
  • the baffle 55 is parallel to the sidewalls 53 and extends downward from the top wall 51 to divide the airflow passageway into a first passageway 57 and a second passageway 58 .
  • the first passageway 57 is capable of receiving the memories 20 therein
  • the second passageway 58 is capable of receiving the CPUs 14 therein.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/464,554 2008-11-26 2009-05-12 Air conducting device Abandoned US20100130120A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200820302932.1 2008-11-26
CNU2008203029321U CN201319174Y (zh) 2008-11-26 2008-11-26 导风装置

Publications (1)

Publication Number Publication Date
US20100130120A1 true US20100130120A1 (en) 2010-05-27

Family

ID=41197936

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/464,554 Abandoned US20100130120A1 (en) 2008-11-26 2009-05-12 Air conducting device

Country Status (2)

Country Link
US (1) US20100130120A1 (zh)
CN (1) CN201319174Y (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100097758A1 (en) * 2008-10-17 2010-04-22 Franz John P Flexible airflow baffle for an electronic system
DE102011117223B3 (de) * 2011-10-28 2013-04-25 Fujitsu Technology Solutions Intellectual Property Gmbh Luftleithaube zur Strömungsführung von Luft in einem elektronischen Gerät und elektronisches Gerät mit einer solchen Luftleithaube
CN106155242A (zh) * 2015-04-22 2016-11-23 华为技术有限公司 导风罩
US11275415B2 (en) * 2019-03-19 2022-03-15 Bull Sas Dissipating interconnection module for M.2 form factor expansion card

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103699192A (zh) * 2012-09-28 2014-04-02 华为技术有限公司 内存风量控制装置
CN106980355A (zh) * 2017-04-21 2017-07-25 广东浪潮大数据研究有限公司 一种提高服务器内存散热效率的装置、系统以及服务器

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030156385A1 (en) * 2002-02-15 2003-08-21 Microsoft Corporation Controlling thermal, acoustic, and/or electromagnetic properties of a computing device
US20040004813A1 (en) * 1999-10-26 2004-01-08 Giovanni Coglitore Computer rack cooling system
US20050122703A1 (en) * 2003-11-14 2005-06-09 Chen-Lu Fan Retaining device for expansion cards
US20050152122A1 (en) * 2004-01-09 2005-07-14 Hon Hai Precision Industry Co., Ltd. Retaining device for expansion cards
US7262964B1 (en) * 2005-04-27 2007-08-28 Hewlett-Packard Development Company, L.P. Airflow control baffle
US7342786B2 (en) * 2005-10-25 2008-03-11 Hewlett-Packard Development Company, L.P. Air duct with airtight seal
US20080068795A1 (en) * 2006-09-14 2008-03-20 Dell Products L.P. Directing Air In A Chassis
US7408773B2 (en) * 2006-11-27 2008-08-05 Dell Products L.P. Reinforced air shroud
US20090027852A1 (en) * 2007-07-26 2009-01-29 Roesner Arlen L Airflow redirction device
US20090233537A1 (en) * 2008-03-14 2009-09-17 Inventec Corporation Air baffle and calculation method of deformational stress thereof
US7595982B2 (en) * 2007-12-04 2009-09-29 Sun Microsystems, Inc. Low airflow impedance PCBA handling device
US7643292B1 (en) * 2008-12-23 2010-01-05 Chenbro Micom Co., Ltd. Adjustable air director
US20100020487A1 (en) * 2008-07-23 2010-01-28 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Airflow conducting apparatus
US7663875B2 (en) * 2008-07-18 2010-02-16 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Computer enclosure with airflow-guiding device
US20100165568A1 (en) * 2008-12-31 2010-07-01 Hon Hai Precision Industry Co., Ltd. Airflow conducting apparatus
US20110014861A1 (en) * 2009-07-20 2011-01-20 Hon Hai Precision Industry Co., Ltd. Air duct assembly and heat dissipating assembly
US20110110028A1 (en) * 2009-11-10 2011-05-12 Hon Hai Precision Industry Co., Ltd. Computer system with frame for disk drive
US20110110030A1 (en) * 2009-11-09 2011-05-12 Hon Hai Precision Industry Co., Ltd. Computer system with heat sink
US20110116227A1 (en) * 2009-11-13 2011-05-19 Hon Hai Precision Industry Co., Ltd. Computer system with heat sink
US7990706B2 (en) * 2008-01-23 2011-08-02 Sony Corporation Cooling duct and electronic apparatus

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040004813A1 (en) * 1999-10-26 2004-01-08 Giovanni Coglitore Computer rack cooling system
US20040070936A1 (en) * 1999-10-26 2004-04-15 Giovanni Coglitore High density computer equipment storage system
US20030156385A1 (en) * 2002-02-15 2003-08-21 Microsoft Corporation Controlling thermal, acoustic, and/or electromagnetic properties of a computing device
US20050122703A1 (en) * 2003-11-14 2005-06-09 Chen-Lu Fan Retaining device for expansion cards
US20050152122A1 (en) * 2004-01-09 2005-07-14 Hon Hai Precision Industry Co., Ltd. Retaining device for expansion cards
US7262964B1 (en) * 2005-04-27 2007-08-28 Hewlett-Packard Development Company, L.P. Airflow control baffle
US7342786B2 (en) * 2005-10-25 2008-03-11 Hewlett-Packard Development Company, L.P. Air duct with airtight seal
US20080068795A1 (en) * 2006-09-14 2008-03-20 Dell Products L.P. Directing Air In A Chassis
US7408773B2 (en) * 2006-11-27 2008-08-05 Dell Products L.P. Reinforced air shroud
US20090027852A1 (en) * 2007-07-26 2009-01-29 Roesner Arlen L Airflow redirction device
US7595982B2 (en) * 2007-12-04 2009-09-29 Sun Microsystems, Inc. Low airflow impedance PCBA handling device
US7990706B2 (en) * 2008-01-23 2011-08-02 Sony Corporation Cooling duct and electronic apparatus
US20090233537A1 (en) * 2008-03-14 2009-09-17 Inventec Corporation Air baffle and calculation method of deformational stress thereof
US7663875B2 (en) * 2008-07-18 2010-02-16 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Computer enclosure with airflow-guiding device
US20100020487A1 (en) * 2008-07-23 2010-01-28 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Airflow conducting apparatus
US7643292B1 (en) * 2008-12-23 2010-01-05 Chenbro Micom Co., Ltd. Adjustable air director
US20100165568A1 (en) * 2008-12-31 2010-07-01 Hon Hai Precision Industry Co., Ltd. Airflow conducting apparatus
US20110014861A1 (en) * 2009-07-20 2011-01-20 Hon Hai Precision Industry Co., Ltd. Air duct assembly and heat dissipating assembly
US20110110030A1 (en) * 2009-11-09 2011-05-12 Hon Hai Precision Industry Co., Ltd. Computer system with heat sink
US20110110028A1 (en) * 2009-11-10 2011-05-12 Hon Hai Precision Industry Co., Ltd. Computer system with frame for disk drive
US20110116227A1 (en) * 2009-11-13 2011-05-19 Hon Hai Precision Industry Co., Ltd. Computer system with heat sink

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100097758A1 (en) * 2008-10-17 2010-04-22 Franz John P Flexible airflow baffle for an electronic system
US7817417B2 (en) * 2008-10-17 2010-10-19 Hewlett-Packard Development Company, L.P. Flexible airflow baffle for an electronic system
DE102011117223B3 (de) * 2011-10-28 2013-04-25 Fujitsu Technology Solutions Intellectual Property Gmbh Luftleithaube zur Strömungsführung von Luft in einem elektronischen Gerät und elektronisches Gerät mit einer solchen Luftleithaube
US9298229B2 (en) 2011-10-28 2016-03-29 Fujitsu Technology Solutions Intellectual Property Gmbh Flow-guiding hood for guiding a flow of air
CN106155242A (zh) * 2015-04-22 2016-11-23 华为技术有限公司 导风罩
US11275415B2 (en) * 2019-03-19 2022-03-15 Bull Sas Dissipating interconnection module for M.2 form factor expansion card

Also Published As

Publication number Publication date
CN201319174Y (zh) 2009-09-30

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, SHENG-HUNG;TSAI, CHIA-YUN;FAN, GONG-JIN;AND OTHERS;REEL/FRAME:022672/0784

Effective date: 20090507

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, SHENG-HUNG;TSAI, CHIA-YUN;FAN, GONG-JIN;AND OTHERS;REEL/FRAME:022672/0784

Effective date: 20090507

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION