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US20090301697A1 - Heat-Transfer Sheet, Heat Transfer System, and Method of Using Heat-Transfer Sheet - Google Patents

Heat-Transfer Sheet, Heat Transfer System, and Method of Using Heat-Transfer Sheet Download PDF

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Publication number
US20090301697A1
US20090301697A1 US11/886,738 US88673806A US2009301697A1 US 20090301697 A1 US20090301697 A1 US 20090301697A1 US 88673806 A US88673806 A US 88673806A US 2009301697 A1 US2009301697 A1 US 2009301697A1
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US
United States
Prior art keywords
heat
transfer sheet
radiator
generator
bulk density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/886,738
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English (en)
Inventor
Yoshiaki Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Tanso Co Ltd
Original Assignee
Toyo Tanso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tanso Co Ltd filed Critical Toyo Tanso Co Ltd
Assigned to TOYO TANSO CO., LTD. reassignment TOYO TANSO CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIROSE, YOSHIAKI
Publication of US20090301697A1 publication Critical patent/US20090301697A1/en
Abandoned legal-status Critical Current

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    • H10W40/25—
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • C01B32/21—After-treatment
    • C01B32/22—Intercalation
    • C01B32/225—Expansion; Exfoliation
    • H10W72/877—

Definitions

  • This invention relates to a heat-transfer sheet.
  • Radiator such as heat sinks is used to cool heat generators such as CPU's of computers, etc. If a radiator does not come into close contact with a heat generator, thermal conductivity from the heat generator to the radiator is low and the heat generator is not cooled sufficiently. Accordingly, usually disposed between such a heat generator and such a radiator is a sheet which has high thermal conductivity and comes into close contact with the heat generator and the radiator.
  • This invention relates to (i) a heat-transfer sheet which is caught between a heat generator and a radiator, (ii) a method of using the heat-transfer sheet, and (iii) a heat transfer system comprising the heat-transfer sheet.
  • Graphite sheets are usually used as heat-transfer sheets which are caught between such heat generators and radiators.
  • a graphite sheet is caught and compressed between a heat generator and a radiator; therefore, the graphite sheet comes into close contact with the heat generator and the radiator, reducing the thermal resistance of contact surfaces and, thereby, raising the cooling efficiency.
  • the pressure applied to the graphite sheet depends on the force securing the heat sink to the heat generator. If large force is applied to a CPU, it may be deformed. Accordingly, force securing heat sinks to heat generators has been reduced from 5 MPa or so to as small as 2 MPa. If force securing a heat sink to a heat generator is small, the graphite sheet therebetween does not come into close contact with the heat generator or the heat sink, raising the thermal resistance and, thereby, reducing the cooling efficiency.
  • the Japanese Unexamined Patent Publication No. 2004-363432 discloses a heat-transfer sheet comprising (i) a substance which is liquid at normal temperature and whose phase does not change at the temperature range wherein it is used and (ii) a graphite sheet. Because the liquid in the graphite sheet can move freely, the graphite sheet is disposed in minute concave areas, or recesses, and the liquid accumulates in relatively large concave areas of 5-100 ⁇ m in the surfaces of the heat generator and the heat sink if the force securing a heat sink to a heat generator is small. Thus, gaps are prevented from being formed between the heat-transfer sheet and the heat generator and between the heat-transfer sheet and the heat sink and, hence, the thermal resistance is minimized and the heat generator is well cooled.
  • the heat-transfer sheet is not compressed very well, namely, it does not come into close contact with the heat generator or the heat sink; therefore, the thermal resistance is not low enough.
  • the production of the heat-transfer sheet requires a step of impregnating the graphite sheet with the liquid. Accordingly, it cannot be produced relatively efficiently, its production cost is relatively high, the liquid may deteriorate, and nearby components may be polluted by liquid coming out of the graphite sheet.
  • the object of the present invention is to provide (i) a heat-transfer sheet which comes into close contact with a heat generator and a radiator when caught therebetween and can be used repeatedly, (ii) a method of using the heat-transfer sheet, and (iii) a heat transfer system comprising the heat-transfer sheet.
  • a heat-transfer sheet which is made of expanded graphite and disposed between a heat generator and a radiator and whose bulk density is less than 1.0 Mg/m 3 .
  • the heat-transfer sheet according to the first feature there is provided the heat-transfer sheet according to the first feature. Its compressibility is 50% or more and its recovery is 5% or more when it is thicknesswise compressed by the pressure of 34.3 MPa.
  • a heat transfer system comprising (i) a radiator and (ii) the heat-transfer sheet according to the first or second feature which is disposed between the radiator and a heat generator.
  • a heat-transfer sheet which is made of expanded graphite, whose bulk density is less than 1.0 Mg/m 3 , and which is disposed between a heat generator and a radiator to be thicknesswise compressed therebetween by the pressure of 2.0 MPa or less.
  • a heat-transfer sheet which is made of expanded graphite, whose bulk density is less than 0.9 Mg/m 3 , and which is disposed between a heat generator and a radiator to be thicknesswise compressed therebetween by the pressure of 1.5 MPa or less.
  • the radiator according to the present invention includes devices with the function of dissipating the heat of heat-transfer sheets to gas, liquid, and other members by radiation, convection, heat transfer, etc., devices with the function of absorbing the heat of heat-transfer sheets, and devices with both the heat-dissipating function and the heat-absorbing function.
  • the advantage offered by the first feature of the present invention is as follows. Because the bulk density of the heat-transfer sheet is low, it is easily compressed between a heat generator and a radiator even under relatively low pressure and, hence, comes into close contact with the heat generator and the radiator. Therefore, the thermal resistance between the heat generator and the radiator is small and, hence, the cooling efficiency is high.
  • the advantage offered by the second feature of the present invention is as follows. Because the recovery of the heat-transfer sheet is high, its bulk density remains below a certain level even after it is used more than once. Therefore, the heat-transfer sheet comes into close contact with a heat generator and a radiator even after it is used more than once, the thermal resistance between the heat generator and the radiator remaining low. Thus, the heat-transfer sheet can be used repeatedly. Because the heat-transfer sheet can be used repeatedly, it contributes toward resources saving.
  • the advantage offered by the third feature of the present invention is as follows. Because the bulk density of the heat-transfer sheet is low, it is easily compressed between a heat generator and a radiator even under relatively low pressure and, hence, comes into close contact with the heat generator and the radiator. Therefore, the thermal resistance between the heat generator and the radiator is small and, hence, the cooling efficiency is high.
  • the advantage offered by the fourth feature of the present invention is as follows. Because its bulk density remains below a certain level even after it is used more than once, it comes into close contact with a heat generator and a radiator even after it is used more than once and, hence, the thermal resistance between the heat generator and the radiator remains low. Thus, the heat-transfer sheet can be used repeatedly. Besides, the force securing a radiator to a heat generator, or the pressure applied to a heat-transfer sheet therebetween, can be reduced compared with the pressure which has been applied to heat-transfer sheets so far; therefore, the load stress on the heat generator is reduced and, hence, damage to the heat generator is prevented.
  • the advantage offered by the fifth feature of the present invention is as follows.
  • the heat-transfer sheet comes into close contact with a heat generator and a radiator and can be used repeatedly.
  • the heat-transfer sheet of the present invention is used to cool such heat generators as CPUs of computers, printed circuit boards of mobile phones, DVD recorders, and servers.
  • the heat-transfer sheet is put between a heat generator and a radiator such as a head sink or a cooling fan.
  • the thermal resistance of the heat-transfer sheet is small when it is caught and compressed between a heat generator and a radiator. Namely, the thermal conductivity of the heat-transfer sheet is high when it is caught and compressed between a heat generator and a radiator.
  • Thermal resistance is the temperature difference between two points separate from each other of a member which is fed with heat from a heat generator divided by the heat-generation rate of the heat generator.
  • the thermal resistance is as follows.
  • the heat-transfer sheet of the present invention is a sheet of expanded graphite which is made by soaking natural or kish graphite in a liquid such as sulfuric or nitric acid and then heat-treating the graphite over 400° C. Its thickness is 0.05-5.0 mm and its bulk density is less than 1.0 Mg/m 3 .
  • the expanded graphite is fibrous or caterpillar-like.
  • the expanded-graphite fibers are, for example, 1.0 mm or so in length and 300 ⁇ m or so in diameter and entangled.
  • the heat-transfer sheet of the present invention may be made of expanded graphite containing a certain amount (for example, 5% or so) of binder such as phenol resin or rubber.
  • Expanded-graphite sheets used as heat-transfer sheets are usually given high bulk density (for example, 1.3 Mg/m 3 or more) for high thermal conductivity.
  • Expanded-graphite sheets used as heat-insulating sheets and electromagnetic-wave shielding sheets for walls, etc. are usually given low bulk density (for example, 1.0 Mg/m 3 or less).
  • the heat-transfer sheet of the present invention is an expended-graphite sheet which has bulk density less than 1.0 Mg/m 3 and is used as heat-insulating sheets and electromagnetic-wave shielding sheets. If an expanded-graphite sheet is given a bulk density of 1.0 Mg/m 3 or more, its flexibility is low and it does not come into close contact with a heat generator or a radiator. Accordingly, the expanded-graphite sheet of the present invention is given a bulk density less than 1.0 Mg/m 3 so that it will come into close contact with a heat generator and a radiator as described later. It is preferable particularly if the expanded-graphite sheet is given a bulk density of 0.9 Mg/M 3 or less for the reason to be described later.
  • FIG. 1 (A) is an illustration of an example of how to use the heat-transfer sheet of the present invention.
  • FIG. 1 (B) shows temperature-measuring points “A” and “B.”
  • the reference sign “H” is a heat generator such as a CPU of a computer; reference sign 2 , a radiator such as a heat sink; reference sign “F.” a cooling fan attached to the heat sink 2 .
  • the heat-transfer sheet 1 of this invention is caught between the heat generator “H” and the heat sink 2 .
  • the heat sink 2 is secured to the heat generator “H” with a fixing part “S” such as a clamp, the heat-transfer sheet 1 is squeezed between the heat generator “H” and the heat sink 2 .
  • the bulk density of the heat-transfer sheet 1 is less than 1.0 Mg/M 3 , it is compressed between the heat generator “H” and the heat sink 2 when pressure is applied to it. Accordingly, as the heat-transfer sheet 1 is compressed, it comes into close contact with the heat generator “H” and the heat sink 2 .
  • the reason for it is that because the bulk density of the heat-transfer sheet 1 is low and there are spaces between graphite fibers, graphite fibers at the surfaces of the heat-transfer sheet 1 enter concave areas, or recesses, in the surfaces of the heat generator “H” and the heat sink 2 .
  • both the thermal resistance between the heat generator “H” and the heat-transfer sheet 1 and that between the heat-transfer sheet 1 and the heat sink 2 decrease. Because the bulk density of the heat-transfer sheet 1 is less than 1.0 Mg/M 3 and its thermal conductivity of perpendicular to surface is about 5 W/m ⁇ k, the thermal resistance between the heat generator “H” and the heat sink 2 is small and, thus, the thermal conductivity therebetween is high. Thus, the heat generator “H” is efficiently cooled down by the heat-transfer sheet 1 and the heat sink 2 .
  • thermal conductivity of parallel to surface of the heat-transfer sheet 1 is about 50-200 W/m ⁇ k which is larger than its thermal conductivity of perpendicular to surface, its temperature distribution of parallel to surface is even; therefore, heat spots do not formed on the surfaces of the heat-transfer sheet 1 , heat generator “H,” or heat sink 2 .
  • the heat-transfer sheet 1 is simply caught between the heat generator “H” and the heat sink 2 , it can be replaced with a new one 1 easily.
  • the heat-transfer sheet 1 may be affixed to the heat sink 2 with adhesive or the like so long as the heat-transfer sheet 1 is disposed between the heat generator “H” and the heat sink 2 .
  • the heat-transfer sheet 1 and the heat sink 2 constitute the radiator described in the claims of the present invention.
  • the heat generator “H” is fitted with the radiator as follows.
  • the heat-transfer sheet 1 is first put on the heat generator “H” and, then, the heat sink 2 is put on the heat-transfer sheet 1 .
  • the heat generator “H.” heat-transfer sheet 1 , and heat sink 2 are caught between a clamp “S” and a printed circuit board if the heat generator “H” is a CPU.
  • the heat generator “H” is fitted with the radiator.
  • the heat sink 2 may be fitted with a cooling fan “F” for larger cooling capacity, the heat transfer system constituted by the heat-transfer sheet 1 , heat sink 2 , and cooling fan “F.”
  • the radiator may be constituted by a heat-transfer sheet 1 and a heat-dissipating component such as a cooling fan “F” or a heat absorbing component such as a cooling-water jacket.
  • the heat-transfer sheet 1 designed to have compressibility of 50% or more and recovery of 5% or more when it is thicknesswise compressed by pressure of 34.3 MPa for the first time, its bulk density remains less than 1.0 Mg/m 3 after it is compressed more than one time and the last pressure is removed. Accordingly, even after the heat-transfer sheet 1 is used more than one time, it comes into close contact with the heat generator “H” and the heat sink 2 when it is compressed therebetween. Therefore, the thermal resistance between the heat generator “H” and the heat sink 2 remains low even after the heat-transfer sheet 1 is used more than one time. Thus, the heat-transfer sheet 1 can be used repeatedly.
  • the heat-transfer sheet 1 designed to have compressibility of 55% or more and recovery of 6% or more when it is thicknesswise compressed by pressure of 34.3 MPa for the first time, its bulk density remains more certainly less than 1.0 Mg/m 3 , for example less than 0.9 Mg/m 3 , after it is compressed more than one time and the last pressure is removed. Accordingly, the heat-transfer sheet 1 can be used more repeatedly.
  • the compressibility of the heat-transfer sheet 1 is less than 50% when it is thicknesswise compressed by pressure of 34.3 MPa for the first time, it is not desirable because the heat-transfer sheet 1 does not come into close contact with the heat generator “H” or the heat sink 2 . If the recovery of the heat-transfer sheet 1 is less than 5% when it is thicknesswise compressed by pressure of 34.3 MPa for the first time, it is not desirable because the heat-transfer sheet 1 does not come into close contact with the heat generator “H” or the heat sink 2 when it is used for the second time and further.
  • the bulk density of the heat-transfer sheet 1 is less than 1.0 Mg/m 3
  • the bulk density of the heat-transfer sheet 1 after the removal of the pressure may be 1.0 Mg/m 3 or more if the pressure is too large when the heat-transfer sheet 1 and the heat sink 2 is secured to the heat generator “H” by a clamp “S.” If the heat-transfer sheet 1 is compressed by pressure over 2.0 MPa, the heat generator “H” is exposed to large load stress and the repetitive usability of the heat-transfer sheet 1 is reduced.
  • the heat generator “H” is fitted with the heat-transfer sheet 1 and the heat sink 2 so as to apply pressure of 2.0 MPa or less, preferably 1.5 MPa or less, to the heat-transfer sheet 1 , the bulk density of the heat-transfer sheet 1 is less than 1.0 Mg/m 3 after the removal of the pressure. Therefore, the heat-transfer sheet 1 can be used repeatedly and no damage is done to the heat generator “H.”
  • the heat-transfer sheet 1 is designed to have bulk density 0.9 Mg/m 3 or less and the heat generator “H” is fitted with the heat-transfer sheet 1 and the heat sink 2 so as to apply pressure of 1.5 MPa or less to the heat-transfer sheet 1 , the bulk density of the heat-transfer sheet 1 is 0.9 Mg/m 3 of less after the removal of the pressure. Therefore, the heat-transfer sheet 1 can be used repeatedly and comes into closer contact with the heat generator “H” and the heat sink 2 , and the thermal resistance between the heat generator “H” and the heat sink 2 is small.
  • the heat-transfer sheet 1 is designed to have bulk density 0.8 Mg/m 3 or less and the heat generator “H” is fitted with the heat-transfer sheet 1 and the heat sink 2 so as to apply pressure of 1.0 MPa or less to the heat-transfer sheet 1 , the bulk density of the heat-transfer sheet 1 is 0.8 Mg/M 3 of less after the removal of the pressure. Therefore, the heat-transfer sheet 1 comes into even closer contact with the heat generator “H” and the heat sink 2 and has enough recovery.
  • the heat-transfer sheet 1 is treated so as to reduce the impurities in it, such as sulfur and iron, to 10 ppm or less, particularly reduce sulfur to 1 ppm or less, components and devices fitted with the heat-transfer sheet 1 are prevented from deteriorating due to impurities.
  • film of resin such as polyethylene terephthalate is laminated between the heat-transfer sheet 1 and the heat generator “H” and/or the heat sink 2 , fragments of expanded-graphite fibers of the heat-transfer sheet 1 are prevented from scattering.
  • Any resin films may be used so long as their thicknesswise thermal conductivity is about the same as that of the heat-transfer sheet 1 and they are resistant to the temperature of about 100° C.
  • the compressibility and recovery of the heat-transfer sheet 1 were measured when it was thicknesswise compressed by pressure of 34.3 MPa.
  • the bulk density-compressibility relation and the bulk density-recovery relation were ascertained by changing the bulk density of the 0.5-millimeter thick heat-transfer sheet 1 from 0.1 Mg/m 3 to 0.5, 0.8, 1.0, 1.2, 1.5 and 1.8 Mg/m 3 .
  • the compressibility of the heat-transfer sheet 1 was calculated by dividing its thickness under the pressure by its thickness before the compression.
  • the recovery of the heat-transfer sheet 1 was calculated by dividing its thickness after the removal of the pressure by its thickness before the compression.
  • the bulk density of the heat-transfer sheet 1 is such that the compressibility is 50% or more, particularly 55-75%, namely, the bulk density is less than 1.0 Mg/m 3 [see FIG. 2 (A)], the compressibility is high and the recovery is kept in a certain range.
  • the distance between the measuring point “A” on the heat sink and the measuring point “B” in the CPU was 20 mm.
  • Small temperature difference means high thermal conductivity, or small thermal resistance, of the heat-transfer sheet 1 .
  • Large temperature difference means low thermal conductivity, or large thermal resistance, of the heat-transfer sheet 1 .
  • the temperature difference shows a tendency to decrease as the pressure increases in any of the four cases of different bulk densities. It is also shown in FIG. 3 that temperature difference becomes constant when the pressure goes beyond a certain level in any cases. Namely, raising the pressure beyond such a certain level does not reduce the temperature difference any more.
  • temperature difference is almost constant in the pressure range over 1.0 MPa, particularly in the range over 1.5 MPa, if the bulk density is 0.8 Mg/m 3 or less.
  • FIG. 1 (B) shows the temperature measuring points “A” on a heat think and “B” in a CPU, the distance between the two points being 20 mm.
  • FIG. 1 (B) shows the temperature measuring points “A” on a heat think and “B” in a CPU, the distance between the two points being 20 mm.
  • the temperature difference is constant regardless of the number of times of compression in any case of the four heat-transfer sheets 1 of different bulk densities.
  • the thermal conductivity of the heat-transfer sheet 1 was determined by (i) its original bulk density before it was first caught between a CPU and a heat sink and (ii) the pressure applied to it therebetween.
  • the heat-transfer sheet of the present invention is suitable for use as a sheet to transfer heat from CPU's of computers, mobile phone, etc., DVD recorders, and so on to radiator such as heat sinks and cooling fans.
  • FIG. 1 (A) is an illustration of an example of how to use the heat-transfer sheet of the present invention.
  • FIG. 1 (B) shows temperature-measuring points “A” and “B.”
  • FIG. 2 (A) shows the relations between the bulk density and the compressibility/recovery of the heat-transfer sheet 1 of FIG. 1 when it was thicknesswise compressed by the pressure of 34.3 MPa.
  • FIG. 2 (B) shows the relation between the compressibility and the recovery.
  • FIG. 3 shows the relation between the pressure thicknesswise applied to the heat-transfer sheet of FIG. 1 and its thermal conductivity. The bulk density of the heat-transfer sheet was varied.
  • FIG. 4 (A) shows the relation between the bulk density and the thermal conductivity of the heat-transfer sheet of FIG. 1 under constant pressure.
  • FIG. 4 (B) shows the relation between the number of times of compression and the thermal conductivity.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Fixing For Electrophotography (AREA)
  • Paper (AREA)
US11/886,738 2005-03-31 2006-03-13 Heat-Transfer Sheet, Heat Transfer System, and Method of Using Heat-Transfer Sheet Abandoned US20090301697A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005-100622 2005-03-31
JP2005100622A JP4299261B2 (ja) 2005-03-31 2005-03-31 伝熱シート、放熱構造体および伝熱シートの使用方法
PCT/JP2006/304865 WO2006112211A1 (ja) 2005-03-31 2006-03-13 伝熱シート、放熱構造体および伝熱シートの使用方法

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US (1) US20090301697A1 (ja)
EP (1) EP1865552B1 (ja)
JP (2) JP4299261B2 (ja)
KR (3) KR101061805B1 (ja)
NO (1) NO20075425L (ja)
TW (1) TWI320844B (ja)
WO (1) WO2006112211A1 (ja)

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US9491890B2 (en) 2012-03-19 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Thermally conductive body and electronic device using same
US9706684B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Exfoliated graphite materials and composite materials and devices for thermal management
US9700968B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Apparatus and methods for processing exfoliated graphite materials
US9807878B2 (en) 2013-09-26 2017-10-31 Kaneka Corporation Graphite sheet, method for producing same, laminated board for wiring, graphite wiring material, and process for producing wiring board
US10090268B2 (en) * 2013-01-28 2018-10-02 Murata Manufacturing Co., Ltd. Method of forming solder bump, and solder bump
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US10626312B2 (en) 2014-12-04 2020-04-21 Kaneka Corporation Thermal interface materials made from graphite sheets under high vacuum condition
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US20220059431A1 (en) * 2019-02-08 2022-02-24 Panasonic Intellectual Property Management Co., Ltd. Heat conducting sheet and electronic device using same
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JP5069861B2 (ja) * 2006-02-15 2012-11-07 株式会社カネカ グラファイトフィルム、およびそれを用いた熱拡散フィルム、ならびにそれを用いた熱拡散方法。
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JP7756301B2 (ja) * 2021-07-29 2025-10-20 パナソニックＩｐマネジメント株式会社 グラファイト複合体及び電子部品
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KR101052752B1 (ko) 2011-07-29
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