US20020117295A1

US20020117295A1 - Heat dissipating structure

Info

Publication number: US20020117295A1
Application number: US09/791,641
Authority: US
Inventors: Ching-Hang Shen
Original assignee: Individual
Current assignee: Asia Vital Components Co Ltd
Priority date: 2001-02-26
Filing date: 2001-02-26
Publication date: 2002-08-29

Abstract

A heat dissipating structure includes a heat dissipating element which has an upper flange and a lower flange formed respectively at the upper and lower edges thereof, and a convection zone located between the upper and lower flanges. The upper flange has two ends each has a fastening section. The lower flange has one fastening section at the center, two ends extended downwards to form respectively a fastening foot and form an indented zone with the lower flange. Two or more heat dissipating elements may be stacked and engaged through the fastening section to form an assembled element. Two assembled elements may be juxtaposed and bonded at the fastening foot to form a housing chamber therebetween to house a heat dissipating tube thereby to dissipate heat rapidly.

Description

BACKGROUND OF THE INVENTION

(1) Field of the Invention

This invention relates to a heat dissipating structure that has a streamline heat dissipating tube closely attach to heat dissipating plates to increase heat dissipation area and enhance heat dissipation effect for effectively increasing heat dissipating result.

(2) Description of the Prior Art

The rapid technology innovation in recent years has resulted in great progress in computer industry. New and high performance personal computers and related peripheral devices and elements have been constantly developed and introduced to the market in a very shorter time frame. Computer related devices such as hard disk, interface cards, central process unit and the like have greater data capacity and can process at faster speed. As a result, a great amount of heat will be generated inside the computer devices and integrated circuits. Even the interface cards will produce a lot of heat during operation. If the generated heat does not dissipate effectively, the IC chips contained in the computers and related devices could be overheated, and will result in downgrade of performance, decreasing durability or even damaged. To install heat dissipating means at the heat generation source (i.e. IC chips) is a commonly used method to attack this problem. For instance, Taiwan New Utility patent publication No. 416545 discloses a heat dissipating structure equipped with a heat conductive tube. It mainly includes a hollow tube which has heat dissipating fins fixedly mounted thereon and two brackets located at two ends thereof for mounting heat dissipating fans. There is a heat conductive pipe inserted into the tube through one end thereof for a selected length.

The prior art sets forth above uses fans to generate air flow across the fins and tube to increase air convection for accelerating heat exchange. It adapts a conventional round tube which will cause a dead angle area at the down stream side of the tube (shown in FIG. 1, about one quarter of the tube surface area). As a result, heat cannot be dissipated efficiently. Furthermore, the tube also drags air low and reduces the convection effect and heat dissipating area. There is still room for improvement.

SUMMARY OF THE INVENTION

It is therefore an object of this invention to provide a heat dissipating structure that has a streamline heat dissipating tube for increasing heat dissipating efficiency to ensure proper operation of the device elements.

Another object of this invention is to enhance air convection between the heat dissipating plates for achieving optimal heat dissipating effect.

A further object of this invention is to use the stackable property of this invention to closely engage the heat dissipating tube for increasing effective heat dissipating area and preventing air from trapping in the dead angle area thereby to smooth air flow and accelerate heat dissipation.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention, as well as its many advantages, may be further understood by the following detailed description and drawings, in which: [0009]
FIG. 1 is a schematic view of air flow in a conventional heat dissipating structure. [0010]
FIG. 2 is a perspective view of the present invention; [0011]
FIG. 3 is a schematic view of the present invention, at a stacking assembled state; [0012]
FIG. 4 is a schematic of the present invention, at a juxtaposing assembled state; [0013]
FIG. 5 is a perspective view of an embodiment of the present invention; and [0014]
FIG. 6 is a schematic view of another embodiment of the present invention.[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIG. 2, the heat dissipating structure according to this invention includes a plurality of [0016] heat dissipating elements 1 and a corresponding heat dissipating tube 7 (will be described later). Each heat dissipating element 1 has an upper and a lower edge bent to form respectively an upper flange 11 and a lower flange 12, and a convection zone 13 located therebetween. The upper flange 11 has two ends each forms a fastening section 2 which includes an insertion tab 21 and a receiving slot 22 which may be engaged with the insertion tab 21 of an adjacent heat dissipating element 1.
The [0017] lower flange 12 also has a fastening section 2 located at the center and two fastening feet 3 and 4 located at two ends thereof which extend downwards to form an indented zone 5 with the lower flange 12. The heat dissipating element 1 thus formed may be engaged and stacked one upon another.
FIGS. 3 and 4 show respectively this invention being assembled in a stacked and juxtaposed fashion. The [0018] heat dissipating elements 1 may use the fastening section 2 to stack and engage with one another through engaging the insertion tab 21 to a receiving slot 22 of an adjacent heat dissipating element 1 thereby to form a multiple layer assembled element.
One assembled [0019] element 1 then may be turned 180 degree to juxtapose with another assembled element 1′ in an up and down manner with the fastening feet 3 and 4 contacting one another. The fastening feet 3 and 4 then may be bonded by hot melt adhesive (or soldering). The two indented slot 5 and 5′ will be coupled together to form a housing chamber 6.
Referring to FIGS. 5 and 6, when the heat dissipating elements are stacked and assembled, a mating [0020] heat dissipating tube 7 may be disposed in the housing chamber 6. The heat dissipating tube 7 may be shaped in a streamline form (such as a stretched ellipse, rectangle, lozenge, or the like) to engage with the housing chamber 6 closely and contact tightly with the assembled heat dissipating elements 1 and 1′ by means of hot melt adhesive (not shown in the drawings). The structure thus formed will increase relative heat dissipation area of the heat dissipating tube thereby to enhance effective heat dissipation power. Moreover, the streamline nature of the heat dissipating tube 7 will prevent the air from trapping in the dead angle and enable the air to flow more smoothly to disperse heat rapidly. Furthermore, after stacking of the heat dissipating elements, air still may flow through the convection zone 13 and be discharged at the outlet thereof This will enhance the air convection and achieve the optimal heat dissipating effect.
It may thus be seen that the objects of the invention set forth herein, as well as those made apparent from the foregoing description, are efficiently attained. While the preferred embodiment of the invention has been set forth for purpose of disclosure, it would be obvious to those skilled in the art that various other changes and modifications can be made without departing from the spirit and scope of the invention. [0021]

Claims

What is claimed is:

1. A heat dissipating structure, comprising:

a plurality of heat dissipating elements each having an upper flange and a lower flange formed respectively at an upper and lower edge thereof to form a convection zone therebetween, the upper flange having two ends each forming a fastening section, the lower flange having another fastening section located at the center thereof and two fastening feet located respectively at two ends thereof, the fastening feet being extended downwards to form an indented slot with the lower flange; and

a hollow heat dissipating tube;

wherein the heat dissipating elements are stacked one upon another through the fastening sections of the upper and lower flange to form an assembled element, two assembled elements being juxtaposed and bonded at the fastening feet to form a housing chamber therebetween for housing the heat dissipating tube thereby to increase heat dissipating area, enhance heat dissipating efficiency and dissipate heat rapidly.

2. The heat dissipating structure of claim 1, wherein the fastening section has an insertion tab and a receiving slot, the insertion tab of one heat dissipating element being engageable with the receiving slot of an adjacent heat dissipating element so that the heat dissipating elements are capable of stacking one upon another.

3. The heat dissipating structure of claim 1, wherein the heat dissipating tube is shaped in a streamline form.

4. The heat dissipating structure of claim 3, wherein the heat dissipating tube is selectively shaped in a stretched ellipse, rectangle or lozenge.

5. The heat dissipating structure of claim 1, wherein the heat dissipating elements are juxtaposed and boned together by soldering or hot melt adhesive.