CN2605665Y - heat pipe radiator - Google Patents

Abstract

A heat pipe cooling device includes several U-shaped heat pipes, a base, two side plates, a first cooling fin group and a second cooling fin group. The heat pipe has horizontal and vertical sections. A semicircular notch is opened on the base, and the horizontal section of the heat pipe can fit in the notch. The two side plates are perpendicular to the base, and the inner side of each side plate is provided with a semicircular notch matched with the vertical section of the heat pipe. The first heat dissipation fin group is vertically attached to the base; the second heat dissipation fin group is perpendicular to the first heat dissipation fin group, and is attached to the inner side of the side plate; and these heat dissipation fins are equipped with the gap. A fan to assist heat dissipation can be installed on the side of these cooling fins.

Description

heat pipe radiator

【Technical field】

The utility model relates to a heat pipe cooling device, in particular to a heat pipe cooling device which can effectively cool electronic components.

【Background technique】

With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially CPU) are constantly increasing. However, high frequency and high speed will make electronic components generate more and more heat and higher temperature, which seriously threatens the performance of electronic components during operation. In order to ensure the normal operation of electronic components, it is necessary to discharge the heat generated by electronic components in time. Lots of heat.

Traditional cooling devices, such as Taiwan Patent Application No. 89214786, No. 89213022, etc., these patents all include a heat sink, the heat sink includes a heat dissipation base and heat dissipation fins arranged on the base, and the heat dissipation base is solid metal. However, as the size of the CPU becomes smaller and smaller, the heat emitted by it becomes more concentrated. Due to the limited heat transfer performance of metal, the heat at the center of the cooling base is often too concentrated and cannot be effectively transferred to the surroundings of the cooling device, and the heat dissipation speed is slow. Seriously affect the overall heat dissipation effect, causing the performance of the CPU to decline, unable to perform effective calculations, or even burn out.

In addition, the cooling device used by the industry is shown in Figure 1. The heat dissipation device 10 includes two heat dissipation plates 12 , a plurality of heat dissipation fins 14 attached to the heat dissipation plates 12 , and two C-shaped heat pipes 16 penetrating on the heat dissipation plates 12 . The heat pipe 16 is glued or welded on the heat dissipation plate 12 by heat conduction glue. The heat generated by the CPU is transferred to the heat dissipation plate 12 connected to it, and at the same time, the heat is quickly transferred to the heat dissipation plate 12 at the far end by means of the heat pipe 16, and then the heat is dissipated to the surroundings of the heat dissipation device through the heat dissipation fins 14, so as to cool the CPU. Purpose. However, the heat pipe 16 needs to be installed in the hole of the heat dissipation base 12, and it is very inconvenient to weld or glue the heat pipe 16; and the bent section of the heat pipe 16 does not have the heat dissipation fins 14 to assist heat dissipation, and its heat dissipation efficiency should be improved. Patents similar to the above-mentioned technical features include Patent No. 98202990.X of the People's Republic of China and U.S. Patent No. 6,394,175 B1.

【Content of invention】

The purpose of the utility model is to provide a heat pipe cooling device which is easy to assemble and quickly dissipates heat.

The purpose of the utility model is achieved through the following technical proposals: the utility model heat pipe cooling device includes several U-shaped heat pipes, a base, two side plates, a first cooling fin group and a second cooling fin group. The heat pipe has horizontal and vertical sections. A semicircular notch is opened on the base, and the horizontal section of the heat pipe can fit in the notch. The two side plates are perpendicular to the base, and the inner side of each side plate is provided with a semicircular notch matched with the vertical section of the heat pipe. The first radiating fin group is vertically attached to the base; the second radiating fin group is perpendicular to the first radiating fin group and attached to the inner side of the side plate; Fit the notch. A fan for assisting heat dissipation can be installed on the side of these cooling fins.

Since the base and the side plates of the utility model are provided with a semicircular notch, the heat pipe can be conveniently welded or glued into the notch; the horizontal section of the U-shaped heat pipe is provided with several cooling fins perpendicular to the base, and its The vertical section is provided with several heat dissipation fins parallel to the base, so that the heat of the heat pipe can be dissipated through two sets of heat dissipation fins, and because the heat transfer path on the heat dissipation fins is short, the heat can be quickly and effectively dissipated to the heat pipe cooling device surrounding; thus the utility model heat pipe cooling device has the advantages of easy assembly and rapid heat dissipation.

The utility model will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

【Description of drawings】

FIG. 1 is a perspective view of a conventional heat sink.

Fig. 2 is a three-dimensional assembly view of the heat pipe cooling device of the present invention.

Fig. 3 is a three-dimensional exploded view of the heat pipe cooling device of the present invention.

【Detailed ways】

Please refer to FIG. 2 and FIG. 3 , the heat pipe cooling device of the present invention includes several U-shaped heat pipes 20 , a base 40 , two side plates 60 , a first cooling fin set 80 and a second cooling fin set 90 . A fan 30 for assisting heat dissipation can be installed on the side of these cooling fins.

The U-shaped heat pipe 20 can quickly transfer heat, has a horizontal section 22 and two vertical sections 24, and its interior is generally in a vacuum state, and is sealed with working liquid.

One side of the base 40 is close to the heating element (not shown), and the other side is provided with a number of semicircular notches 42. These notches 42 are matched with the horizontal section 22 of the heat pipe 20, and can be welded or glued. The heat pipe 20 is fixed on the base 40 . A plurality of cooling fins vertically extend upward from the base 40 to form a first cooling fin group 80 . The heat dissipation fins define notches 82 matching the heat pipes 20 .

These side plates 60 are vertically arranged with the base 40, and the inside of each side plate 60 is provided with a semicircular notch 62 that matches the vertical section 24 of the heat pipe 20. The vertical section 24 of the heat pipe 20 and the side plate 60 can also be welded or welded. Adhesive and other methods of combination. Each side plate 60 is also provided with a bearing portion 64 on the outer side, which is used to support a buckle (not shown in the figure) so that the entire heat pipe cooling device is closely attached to the surface of the heating element. A blocking piece 66 is bent upwards from the outer edge of the carrying portion 64 to prevent the buckle from slipping off. Between the two side plates 60, a number of heat dissipation fins are arranged perpendicular to the side plates 60 to form a second heat dissipation fin group 90, and these heat dissipation fins are attached to the side plates 60, and each heat dissipation fin is provided with a gap for matching with the heat pipe 20 92, and the first cooling fin group 80 and the second cooling fin group 90 are perpendicular to each other.

The heat dissipation fan 30 can be installed on the side of these heat dissipation fins to perform forced convection heat exchange and improve heat dissipation efficiency.

When the heating element is in operation, the heat generated by it is transferred to the base 40, and part of the heat is rapidly dissipated through the first cooling fin group 80, because the heat transfer path on the first cooling fin group 80 is relatively short, so its heat dissipation is more effective Simultaneously, a part of heat transfers to the heat pipe 20 horizontal section 22, and the working liquid in the heat pipe 20 is heated and vaporized, thereby transferring heat to the heat pipe 20 vertical section 24. At this time, the heat is simultaneously transferred by the side plate 60 and the second cooling fin group 90. Distributed to the surroundings, the gaseous working liquid in the vertical section 24 releases heat and condenses, and flows back to the horizontal section 22 of the heat pipe 20, thereby effectively dissipating the heat generated by the heating element to the surroundings.

For the convenience of assembly, the U-shaped heat pipe 20 of the heat pipe cooling device of the present invention can also be replaced by an L-shaped heat pipe.

Claims (9)

1. A heat pipe cooling device, comprising at least one heat pipe and a base, the base is provided with a first cooling fin group, characterized in that: one section of the heat pipe is attached to the base, and one section is provided with For the second cooling fin group, the base is provided with notches matching with the heat pipes. 2 . The heat pipe cooling device according to claim 1 , wherein the second cooling fins are set on at least one side plate having a notch. 3 . 3 . The heat pipe cooling device according to claim 2 , wherein the side plate is provided with a bearing portion outward, and the bearing portion is bent upward to form a retaining edge. 4 . 4. The heat pipe cooling device according to claim 2, wherein the heat pipe is U-shaped, having a horizontal section and a vertical section. 5. The heat pipe cooling device according to claim 2, characterized in that: the heat pipe is L-shaped with a horizontal section and a vertical section. 6. The heat pipe cooling device according to claim 4 or 5, characterized in that: the horizontal section of the heat pipe fits in the notch of the base. 7. The heat pipe cooling device according to claim 4 or 5, wherein the vertical section of the heat pipe fits in the notch of the side plate. 8 . The heat pipe cooling device according to claim 1 , wherein the heat dissipation fins are provided with notches matching the heat pipes. 9 . 9 . The heat pipe cooling device according to claim 1 , wherein a fan for assisting heat dissipation is installed on the side of the heat dissipation fin. 10 .

Images