TWM638135U - Smart Wafer Transfer Equipment - Google Patents

Abstract

This model relates to a kind of smart wafer transfer equipment, the main structure includes a device carrier internally defining a storage space, a wafer transfer component movably arranged in the storage space, a gas control device in the storage space, a communication The air purification device in the storage space is equipped with a plurality of first vibration sensors and a first temperature sensor corresponding to the wafer transfer component, and is equipped with a flow sensor and a pressure sensor corresponding to the gas control device. The purification device is equipped with a second vibration sensor and a differential pressure sensor, and uses a monitoring device to collect the data of each sensor during the transportation of the wafer transfer equipment, and judge the wafer transfer components, gas control devices, air purification devices, etc. Whether it is operating abnormally, and monitor its life for preventive repair or maintenance.

Description

Smart Wafer Transfer Equipment

The present invention provides a smart wafer transfer device that uses a large number of sensors to monitor the operating status of each component to determine whether the operating status, setting status, and life status are normal.

According to, in the semiconductor device manufacturing process, the wafer is required to be transported in an environment free of particles and chemical components, and a closed container (Front-Opening Unified Pod, FOUP) is used, and between the processing device The transfer chamber (Equipment Front End Module, EFEM) for receiving and receiving wafers between them. In the transfer room, the fan filter unit (Fun Filter Unit, FFU) installed on the upper part usually sucks the external clean air into the clean room, so that the internal downflow gas is generated and discharged from the ground to the outside, which can make the inside of the transfer room Obtain a certain clean atmosphere steadily.

In addition, before the wafer is cut into chips, the chips on the chip carrier ring are usually tested with a probe, and the chips are classified according to the electrical properties, optical properties, appearance and other characteristics of each chip, and then the chips are divided into The sorter (Chip Mapping-Sorter) neatly picks and arranges the same type of chips on the adhesive film of another chip carrier ring according to the position information of the chips provided by the pin tester, so as to facilitate the operation of subsequent processing equipment.

However, when the above-mentioned transfer chamber (EFEM) and chip sorter (SORTER) are in use, there are the following problems and deficiencies that need to be improved:

First, protection and protection are generally only carried out for the wafers it processes, but not for EFEM and SORTER itself.

Second, EFEM and SORTER generally do not have monitoring equipment that can ensure their own mechanical action frequency behavior, component temperature, air pressure, and static electricity, so as to avoid the quality of the processed wafers being affected by it.

Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the creators of the new model and related manufacturers engaged in this industry want to study and improve urgently.

Therefore, in view of the above deficiencies, the creator of this model has collected relevant information, evaluated and considered in many ways, and based on years of experience accumulated in this industry, through continuous trial and modification, he has designed this kind of monitoring system that uses a large number of sensors. The operating state of each component is used to judge whether the operating state, setting state, and life state are normal. The new patentee of the smart wafer transfer equipment.

The main purpose of this new model is to detect whether the air pressure flow inside the machine and the frequency of mechanical action are normal during the wafer transportation process, so as to ensure the quality of the working environment of the machine, and to carry out preventive maintenance, thereby prolonging the machine life. Taiwan life.

In order to achieve the above purpose, the main structure of the present invention includes: a device carrier, a storage space, a wafer transport assembly, a gas control device, an air purification device, a plurality of first vibration sensors, a first temperature sensor, A flow sensor, a pressure sensor, a second vibration sensor, a differential pressure sensor and a monitoring device, wherein the storage space is defined in the device carrier, and the wafer transport assembly is movably arranged in the storage space , the gas control device is arranged in the accommodation space, the air purification device is arranged on one side of the device carrier and communicates with the accommodation space, the first vibration sensors are arranged on the wafer transfer assembly, and the first temperature sensor The device is set in the wafer transport assembly, the flow sensor is set on the gas control device, the pressure sensor is set on the gas control device, the second vibration sensor is set on the air cleaning device, the pressure sensor is set on the gas control device, The differential sensor is arranged between the air purification device and the device carrier, and the monitoring device information links the first vibration sensor, the first temperature sensor, the flow sensor, the pressure sensor, the second A vibration sensor, and the differential pressure sensor.

By setting various targeted sensors on the wafer transport components, gas control devices, and air purification devices of the device carrier, it is possible to detect the mechanical conditions and temperature rise of the wafer transport components, and the air flow of the gas control devices. Air pressure conditions, temperature rise conditions, and the execution force and static elimination capabilities of the air purification device, thereby ensuring the quality and safety of the wafer delivery process of the device carrier, so as to monitor the device carrier at the same time without affecting the quality of the wafer preventive repair and maintenance.

With the above technology, it is possible to address the problems of conventional chip sorters (SORTER) and transfer chambers (EFEM) that do not have monitoring equipment that can ensure their own mechanical action frequency behavior, component temperature, air pressure, and static electricity. A breakthrough to achieve the practical progress of the above advantages.

1: Device carrier

11: Containment Space

12: translation mechanism

2:Wafer transport assembly

21: Lifting mechanism

22: Mechanical arm

23: End effector

3: Gas control device

4: Air purification device

51: The first vibration sensor

52: The first temperature sensor

53: Flow sensor

541: Pressure sensor

55:Second vibration sensor

56: Differential pressure sensor

57: Static sensor

58: Second temperature sensor

6: Monitoring device

61:Alarm module

The first figure is a three-dimensional perspective view of a preferred embodiment of the present invention.

The second figure is a structural block diagram of a preferred embodiment of the present invention.

The third figure is a schematic diagram of the induction of the wafer transfer component of the preferred embodiment of the present invention.

Figure 4 is a schematic diagram of the induction of the gas control device in a preferred embodiment of the present invention.

The fifth figure is a schematic diagram of the induction of the air cleaning device of the preferred embodiment of the present invention.

Figure 6 is a schematic diagram of vibration monitoring in a preferred embodiment of the present invention.

The seventh figure is a schematic diagram of temperature monitoring in a preferred embodiment of the present invention.

Figure 8 is a schematic diagram of differential pressure monitoring in a preferred embodiment of the present invention.

Figure 9 is a schematic diagram of pressure and flow monitoring in a preferred embodiment of the present invention.

Figure 10 is a schematic diagram of electrostatic induction in yet another preferred embodiment of the present invention.

Fig. 11 is a schematic diagram of static monitoring in yet another preferred embodiment of the present invention.

The twelfth figure is a perspective view of another preferred embodiment of the present invention.

Figure 13 is a perspective view of another preferred embodiment of the present invention.

In order to achieve the above-mentioned purpose and effect, the technical means and the structure adopted by the present invention are hereby illustrated in detail with respect to the preferred embodiments of the present invention. Its features and functions are as follows, so as to fully understand.

Please refer to the first and second figures, which are perspective views and structural block diagrams of preferred embodiments of the present invention. It can be clearly seen from the figures that the wafer transfer equipment of the present invention is a wafer sorter (Chip Mapping-Sorter) or transfer room (Equipment Front End Module, EFEM), this embodiment is an example of the transfer room, and the new system includes:

A device carrier 1, and a receiving space 11 is defined in the device carrier 1, the device carrier 1 of the present embodiment is an example of the skeleton and shell of the transfer chamber;

A wafer transmission assembly 2 is movably arranged in the receiving space 11. The wafer transmission assembly 2 has a lifting mechanism 21, a mechanical arm 22 pivotally arranged on the lifting mechanism 21, and a mechanical arm 22 arranged on the mechanical arm. The end effector 23 on one side of 22;

A gas control device 3 is installed in the containing space 11;

An air cleaning device 4 is located on one side of the device carrier 1 and communicates with the receiving space 11. In this embodiment, a fan filter unit (Fun Filter Unit, FFU) is used as an example;

A plurality of first vibration sensors 51 are arranged on the lifting mechanism 21 and the end effector 23 of the wafer transport assembly 2;

A first temperature sensor 52 is located on the side of the lifting mechanism 21 of the wafer transport assembly 2;

A flow sensor 53 is located on the gas control device 3;

A pressure sensor 54 is located on the gas control device 3;

A second vibration sensor 55 is located on the air cleaning device 4;

A differential pressure sensor 56 is located between the air cleaning device 4 and the device carrier 1; and

A monitoring device 6 is informationally connected to the first vibration sensor 51, the first temperature sensor 52, the flow sensor 53, the pressure sensor 54, the second vibration sensor 55, and the differential pressure sensor Device 56 , this embodiment takes the man-machine interface disposed on the device carrier 1 as an example.

Through the above description, the structure of this technology can already be understood, and according to the corresponding cooperation of this structure, a large number of sensors can be used to monitor the operating status of each component to judge whether the operating status, setting status and life status are normal, and the details The explanation will be explained below.

Please refer to the first figure to the ninth figure at the same time, which are the three-dimensional perspective view to the pressure and flow monitoring schematic diagram of the preferred embodiment of the present invention. The first vibration sensor 51 and the second vibration sensor 55 of this embodiment Taking the relative electric sensor as an example, it is mainly a single free oscillation system composed of springs, dampers and inertial mass blocks. Its main function is to monitor the vibration of rotating machinery. Each device has its own vibration standards. , exceeding the vibration value means that the machine is abnormal; the first temperature sensor 52 of the present embodiment is an example of a resistive contact thermometer, which can achieve thermal balance through conduction or convection, so that the displayed value can directly represent the measured object Within a certain temperature measurement range, the thermometer can also measure the temperature distribution inside the object, so it has high measurement accuracy, but for moving bodies, small targets or objects with small heat capacity, large measurement errors will occur The flow sensor 53 of the present embodiment takes the vortex flowmeter as an example, and it measures the flow rate according to the principle of fluid oscillation. , generating two vortices that alternate up and down and are proportional to the flow velocity. The release frequency is related to the average velocity of the fluid and the width of the vortex generating body, and the average velocity of the fluid is calculated, and then multiplied by the cross-sectional area to obtain the flow rate; in this embodiment The pressure sensor 54 is an air pressure sensor as an example. Its main sensing element is a thin film sensitive to the strength of air pressure and a thimble switch, and a flexible resistor is connected on the circuit. When the pressure of the measured gas decreases or increases, the deformation of the film will drive the thimble, and the resistance of the flexible resistor will change at the same time, and then the gas pressure can be calculated through the change of resistance; the differential pressure sensor 56 of this embodiment is composed of The composition of aluminum alloy casing, threaded interface, cock and tower head structure is taken as an example. Its working principle is that the measured pressure directly acts on the diaphragm, causing the diaphragm to produce a micro-displacement proportional to the water pressure, thereby changing the capacitance value. , and use the circuit to detect this change to output a standard measurement signal corresponding to the pressure.

In actual use, various sensors are arranged on the device carrier 1 to detect the wafer transfer unit 2 , the gas control device 3 , and the air purification device 4 when the wafer transfer device is in operation. Specifically, the number of the first vibration sensors 51 in this embodiment is two, and they are respectively arranged on the lifting mechanism 21 and the end effector 23 of the wafer transport assembly 2, so as to detect the vibration frequency behavior of the two respectively. Change, monitor whether there is any abnormal installation or setting of the components (the frequency is stable and exceeds the standard), whether there is aging of the parts (the frequency gradually exceeds the standard), whether there is an external force collision (the frequency exceeds the standard instantaneously), such as the abnormal operation in Figure 6 (A) , (B) life abnormality, and (C) external force abnormality, similarly, the second vibration sensor 55 is arranged on the air purification device 4, to monitor whether there is installation or setting abnormality of the components, whether there is external force collision, whether Parts aging occurs, thereby ensuring that the air purification device 4 can inhale clean air and discharge internal air. The first temperature sensor 52 is also located on the lifting mechanism 21. By detecting its temperature rise in real time, it can be judged whether the cause of overheating is caused by abnormal environment (abnormal temperature instantaneously) or abnormal overload (continuously abnormal temperature after a certain time point) (As shown in the seventh figure), in order to prevent the accelerated deterioration of lubricating oil quality caused by excessive temperature, and the accuracy variation caused by thermal expansion, thereby avoiding the mechanical arm 22 from being unsmooth or inaccurate in positioning. The differential pressure sensor 56 is used to detect the pressure difference between the storage space 11 in the device carrier 1 and the external space, so as to detect whether the inside of the device carrier 1 maintains a normal positive pressure (as shown in the eighth figure) to prevent dust from flowing into Inside the machine. The flow sensor 53 and the pressure sensor 54 are arranged on the gas control device 3 to detect the gas flow and gas pressure in the storage space 11, as shown in the ninth figure, to determine whether the supply is too high (continuously exceeding the standard) ), the supply is too low (continuously lower than the standard), or the lifespan is abnormal (continuously abnormal after a certain time point), so as to avoid the problems of insufficient execution force of the air cleaning device 4 or a decline in static elimination ability.

Finally, use the monitoring device 6 to collect and record all the sensing data to ensure the quality and safety of the wafer transportation process of the device carrier 1, and to monitor the condition of the device carrier 1 while ensuring that the quality of the wafer is not affected. Preventive repair and maintenance.

Please refer to Figure 10 and Figure 11 at the same time, which are schematic diagrams of electrostatic induction and static monitoring in yet another preferred embodiment of the present invention. It can be clearly seen from the figures that this embodiment is similar to the above-mentioned embodiment with minor differences , only an electrostatic sensor 57 is provided on the device carrier 1. The electrostatic sensor 57 of this embodiment is a charge detector with a piezoresistor as an example. The characteristics of the change, the external charge is induced to make the voltage change the resistance of the element, and the current will take a path with a smaller resistance, so the electrostatic charge of the object under test can determine whether the red light or the green light is on, and then judge whether the electrostatic discharge value (ESD) is Exceeded the standard. Similarly, according to the time change curve of the resistance value recorded by the electrostatic sensor 57, it can also be judged whether there is an abnormal configuration (continuously exceeding the standard) or abnormal life (continuous abnormality after a certain time point), and at the same time, it can monitor the electrostatic strength and prevent the product from occurring. The phenomenon of electrostatic breakdown and the detection result of the electrostatic sensor 57 will also be recorded in the monitoring device 6 .

Please refer to the twelfth figure at the same time, which is a stereoscopic perspective view of another preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is similar to the above-mentioned embodiment, only in the device carrier 1 A translation mechanism 12 is provided inside, which is connected to the wafer transport assembly 2 , and a second temperature sensor 58 is provided on the translation mechanism 12 . The translation mechanism 12 is an example of a sliding platform, and is used to drive the wafer transfer assembly 2 to move horizontally, and the translation mechanism 12 can also be provided with a first vibration sensor 51 and a second temperature sensor 58 to detect Changes in vibration frequency behavior, monitor whether components are installed or set abnormally, whether there is external force impact, and whether parts are aging.

Please refer to the thirteenth figure at the same time, which is a perspective view of another preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is similar to the above-mentioned embodiment, only the monitoring device 6 has a Alarm module 61, the alarm module 61 of this embodiment is based on the three-color warning light arranged on the device carrier 1 as an example, the alarm module 61 cooperates with the sensing data collected by the monitoring device 6, and immediately determines whether there is An abnormality occurs, and the alarm module 61 is activated when the abnormality occurs, so that the user can check the abnormality at the first time.

However, the above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be treated in the same way. Included in the scope of the patent of this model, it is agreed to Chen Ming.

To sum up, the smart wafer transfer equipment of this new model can really achieve its function and purpose when it is used, so this model is a new model with excellent practicability. In order to meet the application requirements of a new model patent, an application is filed in accordance with the law. , I hope that the review committee will approve this model as soon as possible, so as to protect the hard work of the creators, If there is any doubt in the review committee of Junju Bureau, please feel free to send us a letter to instruct, and the creator will try his best to cooperate, and I really appreciate it.

1: Device carrier

11: Containment Space

2:Wafer transport assembly

21: Lifting mechanism

22: Mechanical arm

23: End effector

3: Gas control device

4: Air purification device

51: The first vibration sensor

52: The first temperature sensor

53: Flow sensor

54:Pressure sensor

55:Second vibration sensor

56: Differential pressure sensor

6: Monitoring device

Claims (5)

A smart wafer transfer equipment, which mainly includes: a device carrier, and a storage space is defined in the device carrier; a wafer transfer component is movably arranged in the storage space; a gas control device is installed in the storage space In the space; an air purification device is set on one side of the device carrier and communicates with the receiving space; a plurality of first vibration sensors are set on the wafer transport assembly; a first temperature sensor is set on the In the wafer transport assembly; a flow sensor is set on the gas control device; a pressure sensor is set on the gas control device; a second vibration sensor is set on the air purification device; A differential pressure sensor is installed between the air purification device and the device carrier; and a monitoring device is informationally connected to the first vibration sensor, the first temperature sensor, the flow sensor, the pressure sensor, the second vibration sensor, and the differential pressure sensor. The smart wafer transfer equipment described in item 1 of the scope of the patent application, wherein the wafer transfer unit has a lifting mechanism, a mechanical arm pivoted on the lifting mechanism, and an end on one side of the mechanical arm The actuator, and the first vibration sensors are arranged on the lifting mechanism and the end effector, and the first temperature sensor is arranged on one side of the lifting mechanism. The smart wafer transfer device described in item 1 of the scope of the patent application, wherein the device carrier is provided with an electrostatic sensor. The smart wafer transfer device described in item 1 of the scope of the patent application, wherein a translation mechanism is provided in the device carrier, which is connected to the wafer transfer unit, and a second temperature sensor is provided on the translation mechanism. According to the smart wafer transfer equipment described in item 1 of the scope of the patent application, there is an alarm module on the monitoring device.

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