TWI854761B - Semiconductor automatic loading system - Google Patents

Abstract

An automatic semiconductor loading system includes a plurality of loading ports, a process machine, a robot arm, a carrier, a first sensor, a second sensor and a monitoring system. The robot arm is suitable for transferring semiconductor material between the loading ports and the process machine. The robot arm is connected to the carrier, so that the robot arm moves between the loading ports and the process machine. The first sensor and the second sensor are respectively disposed on adjacent two sides outside an opening of the loading port, and sense a distance between the robot arm and the opening. The monitoring system is electrically connected to the first sensor and the second sensor.

Description

Semiconductor Automatic Loading System

The present invention relates to a loading system, and in particular to a semiconductor automatic loading system.

When using semiconductor equipment to process semiconductor materials (such as wafers or panels), the loading/unloading device that moves the materials from the loading port to the process machine is often not noticed due to aging of the mechanism or dust deposition. As a result, when the mechanism is abnormal or the flow field changes, it is impossible to know it in the first time. On the other hand, due to the need to increase the space utilization rate of the loading port, the distance between the materials in the loading port is usually as small as possible. However, when the loading/unloading device is abnormal and causes a slight deviation, it is easy for the materials to contact or collide. It will not be discovered until the above problems cause the product to be detected abnormally, but it has already caused the product to need to be reworked, resulting in waste of production capacity and increased costs. In severe cases, it may even cause a large number of product scraps.

The present invention provides a semiconductor automatic loading system, which is suitable for monitoring the status of the robot arm in the loading system and preventing the materials in the loading system from being affected, thereby further improving the manufacturing yield of the product.

The semiconductor automatic loading system of the present invention includes multiple loading ports, a process machine, a robot arm, a carrier, a first sensor, a second sensor and a monitoring system. The robot arm is suitable for transferring semiconductor materials between the loading port and the process machine. The robot arm is connected to the carrier so that the robot arm moves between the loading port and the process machine. The first sensor and the second sensor are respectively arranged on the adjacent sides outside the opening of the loading port to sense the distance between the robot arm and the opening. The monitoring system is electrically connected to the first sensor and the second sensor.

Based on the above, the semiconductor automatic loading system of the present invention includes a distance measuring sensor installed at the opening of the loading port. It is possible to monitor the horizontal distance and vertical distance within the error range of the robot arm (such as the fork of the robot arm). When the robot arm ages and the distance offset occurs, it can be predicted in advance and an alarm can be issued to prevent possible collisions between materials or collisions between materials and mechanisms. It avoids continuous chipping or scratching of materials, further improving the product yield.

In order to make the above features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.

10: Semiconductor automatic loading system

11: Floor

12: Ceiling

100: Loading port

101, 121: Opening

101A: First side

101B: Second side

110: Semiconductor materials

120: Processing equipment

130:Robotic arm

131: Tooth fork

132: Base

133: Z-axis belt groove

134: Pillar

135:Transporting arm

136: Support arm

140: Vehicles

141:Guide rails

142: X-axis belt groove

150: Distance sensor

150A: First sensor

150B: Second sensor

160: Monitoring system

161:Transmission converter

162: Server

170: Vacuum sensor

180: Vibration sensor

190: Particle monitor

200:Anemometer

210: Electricity meter

Fin: Intake system

Fout: Exhaust system

AF: airflow

D1: First distance

D2: Second distance

LV1, LV2, LV3, LV4, LV5: Level

S: Storage device

T1: Date

X1, X2, X3, X4: Position

X, Y, Z: direction

Figure 1A is a schematic diagram of the distribution of various devices in the semiconductor automatic loading system of an embodiment of the present invention.

FIG1B is a schematic diagram of data monitoring of the first distance and the second distance by the distance measuring sensor of an embodiment of the present invention.

Figure 2 is a schematic diagram of the electrical connection between each detector and the monitoring system of the semiconductor automatic loading system of the embodiment of the present invention.

Figure 3 is a schematic diagram of the installation positions of the detectors of the present invention on the robot arm and the carrier.

Figure 4 is a schematic diagram of the relative positions of the particle monitor and various devices of the present invention.

Figures 5A and 5B are schematic diagrams of the relative positions and working principles of the anemometer and various devices of the present invention.

Figure 6 is a schematic diagram of the monitoring system of the present invention integrating and analyzing the data of each detector and issuing corresponding alarms.

As used herein, "about", "approximately", "essentially", or "substantially" include the stated value and the average value within an acceptable range of deviation of a particular value determined by a person of ordinary skill in the art, taking into account the measurement in question and the specific amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or, for example, within ±30%, ±20%, ±15%, ±10%, ±5%. Furthermore, as used herein, "about", "approximately", "essentially", or "substantially" can select a more acceptable range of deviation or standard deviation based on the measured property, cutting property, or other property, and can apply to all properties without one standard deviation.

In the accompanying drawings, the thickness of layers, films, panels, regions, etc., is exaggerated for clarity. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to another element, or intermediate elements may also exist. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intermediate elements. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrical connection" may be the presence of other elements between two elements.

Additionally, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element, as shown in the figures. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is flipped, the elements described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. Thus, the exemplary term "lower" can include both "lower" and "upper" orientations, depending on the particular orientation of the figure. Similarly, if the device in one figure is flipped, the elements described as being "below" or "beneath" the other elements will be oriented as being "above" the other elements. Thus, the exemplary term "above" or "below" can include both above and below orientations.

Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same element symbols are used in the drawings and description to represent the same or similar parts.

FIG1A is a schematic diagram of the distribution of each device in the semiconductor automatic loading system of the embodiment of the present invention. FIG1A also includes an enlarged cross-sectional view of the opening 101 and the tooth fork 131 of the robot arm 130. Referring to FIG1A, the semiconductor automatic loading system 10 of the embodiment of the present invention includes a plurality of loading ports 100, a process machine 120, a robot arm 130, a carrier 140, a distance sensor 150 (including a first sensor 150A and a second sensor 150B) and a monitoring system 160. In order to simply present the setting relationship of each device in the figure, only one loading port 100 and one process machine 120 in the semiconductor automatic loading system 10 are schematically drawn, but the present invention does not limit the number of loading ports 100 and process machines 120.

On the other hand, the semiconductor automatic loading system 10 may include a storage device S for storing semiconductor materials 110 (such as wafers, panel substrates or glass, etc.). During the process stage, the semiconductor materials 110 in the storage device S are stored in multiple loading ports 100 in preparation for transportation, but the present invention is not limited to this. The semiconductor automatic loading system 10 also includes a floor 11 and a ceiling 12, wherein a plurality of air intake systems Fin may be provided at the ceiling 12, suitable for guiding the airflow AF from the outside of the semiconductor automatic loading system 10 to the inside of the semiconductor automatic loading system 10; and the floor 11 may include a plurality of floating holes and an exhaust system Fout, suitable for guiding the airflow AF from the inside of the semiconductor automatic loading system 10 to the outside of the semiconductor automatic loading system 10. The air intake system Fin and the air exhaust system Fout may include, for example, a fan and a filter, so that the concentration of suspended particles in the airflow AF provided to the space of the semiconductor automatic loading system 10 is reduced, and a downward airflow is formed from the ceiling 12 to the floor 11 below, which is conducive to removing the dirt or dust particles of the semiconductor automatic loading system 10 and reducing the dirt deposition in the semiconductor automatic loading system 10.

The loading port 100 may include a plurality of cassettes for loading semiconductor materials 110. The loading port 100 has an opening 101 suitable for storing semiconductor materials 110 from the opening 101. The shape of the opening 101 is, for example, a rectangle, and has a first side 101A and a second side 101B adjacent to each other, and the first side 101A is, for example, a long side of the opening 101, and the second side 101B is, for example, a short side of the opening 101, that is, the angle between the first side 101A and the second side 101B may be substantially 90 degrees. However, the present invention is not limited thereto.

The process machine 120 may include multiple process chambers (not shown) and have corresponding openings 121 of the process machine 120. The semiconductor material 110 is suitable for being placed into the process machine 120 from the opening 121 and being processed. Each process chamber may include multiple process positions (not shown), and the semiconductor materials 110 of multiple process positions may be processed at the same time, but the present invention is not limited thereto.

The robot arm 130 can transfer the semiconductor material 110 between the loading port 100 and the process machine 120. For example, the robot arm 130 can include a fork 131 for carrying the semiconductor material 110, and the robot arm 130 can be moved between the loading port 100 and the process machine 120 via a carrier 140 connected to the robot arm 130. The robot arm 130 can, for example, have a dual robot and include a twin fork, so that two cartridges in the loading port 100 can be picked up or placed at the same time, that is, two semiconductor materials 110 can be picked up or placed at the same time to save the time of transporting the semiconductor materials 110, but the present invention is not limited to this.

On the other hand, the distance measuring sensor 150 can be a laser distance measuring sensor, but the present invention is not limited thereto. Specifically, the first sensor 150A and the second sensor 150B of the distance measuring sensor 150 can be respectively disposed outside the opening 101 of the loading port 100, and further disposed on the first side 101A and the second side 101B of the opening 101. In this way, the distance between the tooth fork 131 of the robot arm 130 and the opening 101 can be respectively sensed.

For example, when the sensing robot arm 130 picks up or stores the semiconductor material 110 in the loading port 100, the first sensor 150A disposed on the first side 101A is suitable for sensing the first distance D1 between the nearest tooth fork 131 in the robot arm 130 and the first side 101A. The direction of the first distance D1 is, for example, the height direction. The second sensor 150B disposed on the second side 101B is suitable for sensing the second distance D2 between the nearest tooth fork 131 in the robot arm 130 and the second side 101B. The direction of the second distance D2 is, for example, the horizontal direction. In other words, the first distance D1 and the second distance D2 are substantially perpendicular to each other, but the present invention is not limited thereto.

On the other hand, the monitoring system 160 is electrically connected to the first sensor 150A and the second sensor 150B. It receives the value of the first distance D1 and the value of the second distance D2, and monitors the above data accordingly to determine whether to issue an alarm to alert the staff. In detail, since the error range of the value of the first distance D1 and the value of the second distance D2 can be monitored, when the robot arm 130 ages and the position shifts, an early alarm can be issued to prevent collisions between materials or between materials and mechanisms, and avoid possible continuous chipping or scratches.

FIG. 1B is a schematic diagram of the data monitoring of the first distance and the second distance by the distance measuring sensor of the embodiment of the present invention. Please refer to FIG. 1A and FIG. 1B at the same time. For example, when the robot arm 130 is abnormal or aged, the monitoring system 160 can detect the drastic change of the first distance D1 and the second distance D2 through monitoring. For example, before date T1, the second distance D2 changes between greater than 55.0 mm and 60.5 mm, and the first distance D1 changes between greater than 2.0 mm and -3.0 mm. Based on this, the monitoring system 160 can issue an alarm to alert the staff to check the robot arm 130, so as to immediately check and improve the machine condition of the robot arm 130. For example, the staff can immediately inspect the robot arm 130 on date T1, so that the first distance D1 and the second distance D2 after date T1 return to normal values or tend to be stable. In other words, the monitoring system 160 can monitor whether the change value of the first distance D1 is within the normal range (for example, within the range of 0.5mm) and whether the change value of the second distance D2 is within the normal range (for example, within the range of 1mm), and judge whether the robot arm 130 is abnormal and issue an alarm accordingly.

In some embodiments, in order to avoid collision of the semiconductor material 110, the safe distance between the semiconductor material 110 and the opening 101 in the horizontal direction may be monitored, for example, 10 mm. Alternatively, the safe distance between the robot arm 130 and the adjacent unloaded semiconductor material 110 in the vertical direction may be controlled, for example, 5 mm. For example, when the value of the first distance D1 is greater than the distance threshold value, or when the value of the second distance D2 is greater than the distance threshold value, it indicates that the robot arm 130 and the semiconductor material 110 are at a safe distance, and the monitoring system 160 may not react and does not need to notify the staff. When the value of the first distance D1 or the value of the second distance D2 is less than or equal to the distance valve value, the monitoring system 160 issues an alarm to notify the staff to conduct monitoring.

Accordingly, the semiconductor automatic loading system 10 can use the distance measuring sensor 150 to monitor and record the working process of the robot arm 130 to prevent the possibility of the semiconductor material 110 being damaged by collision during the transportation process due to the abnormality of the robot arm 130, thereby further improving the manufacturing yield of the semiconductor material 110.

The following will list some other embodiments to illustrate the present invention in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the aforementioned embodiments, and no further description will be given below.

FIG2 is a schematic diagram of the electrical connection between each detector and the monitoring system of the semiconductor automatic loading system of the embodiment of the present invention. Referring to FIG2, for example, the semiconductor automatic loading system 10 of the present invention may also include a plurality of sensors connected to the monitoring system 160, further monitoring the changes of various parameters in the semiconductor automatic loading system 10, so as to immediately determine whether an alarm needs to be issued to notify the staff to handle. For example, the semiconductor automatic loading system 10 may further include a vacuum sensor 170, a vibration sensor 180, a particle monitor 190, an anemometer 200 and an electric meter 210, and the above components are further electrically connected to the monitoring system 160. The monitoring system 160 may include, for example, a transmission converter 161, which can further convert the detection data received by the above-mentioned component and transmit the detection data to a server 162 electrically connected to the transmission converter 161. The server 162 can store the above-mentioned multiple detection data for integrated analysis, and determine whether an alarm needs to be issued to notify the staff to inspect, monitor or determine whether the operation of the semiconductor automatic loading system 10 needs to be stopped.

FIG3 is a schematic diagram of the installation positions of the detectors of the present invention on the robot arm and the carrier. Referring to FIG3, further, the vacuum sensor 170 can be installed on one of the robot arm 130 or the carrier 140, and electrically connected to the monitoring system 160. For example, the robot arm 130 can include a transport arm 135 connected to the tooth fork 131, and the vacuum sensor 170 can be a digital meter and installed on the transport arm 135. However, the present invention is not limited thereto. Compared to general vacuum gauges that can only respond to specific vacuum values, for example, vacuum gauges can only detect abnormal pressure values when the air pressure is lower than the normal air pressure of -50 kPa, which means that the air pipe components of the robot arm 130 have problems or are contaminated. The use of digital gauges can monitor the vacuum value in the robot arm 130 at all times and transmit the vacuum information to the monitoring system 160. When the vacuum inside the robot arm 130 begins to be abnormal (such as air pipe wear), it can be monitored early to detect the problem.

In some embodiments, when the vacuum sensor 170 senses that the vacuum level is greater than the vacuum valve value, the monitoring system 160 does not respond. When the vacuum level is less than or equal to the vacuum valve value, the monitoring system 160 can issue an alarm to notify the staff. This prevents the robot arm 130 from affecting the process of the semiconductor material 110.

Please continue to refer to FIG. 3 . In addition, the vibration sensor 180 may be disposed on one of the robot arm 130 and the carrier 140. For example, the robot arm 130 may include a support column 134. When the robot arm 130 moves on the carrier 140 while carrying the semiconductor material 110, the support column 134 may not move relative to the robot arm 130. The vibration sensor 180 may be disposed on the support column 134 to reduce the possibility of misjudgment. The vibration sensor 180 can be an acceleration sensor, such as a single-axis accelerometer that measures a single direction (such as the height direction of the robot arm 130), or a three-axis accelerometer that measures three mutually perpendicular directions (such as the height direction of the robot arm 130, the direction in which the robot arm 130 picks up the semiconductor material 110, and the moving direction of the robot arm 130 on the carrier 140). The present invention is not limited thereto.

The vibration sensor 180 can monitor the vibration information (such as acceleration value) of the robot arm 130 or the carrier 140, and transmit the vibration information to the monitoring system 160 to establish the required early warning model data to predict the life of the motor or ball screw to increase the machine utilization rate. In some embodiments, when the vibration information is less than the vibration valve value, the monitoring system 160 may not respond. When the vibration information is greater than or equal to the vibration valve value, the monitoring system 160 can issue an alarm to notify the staff. In this way, it can be known in advance whether the mechanism of the robot arm 130 or the carrier 140 is aging, abnormal, or too dusty, so as to avoid the dust particles of the robot arm 130 or the carrier 140 affecting the yield of the process end.

Please continue to refer to Figure 3. The semiconductor automatic loading system 10 may also include an electric meter 210 to monitor the voltage, current and power value of the robot arm 130 or the carrier 140. The above information is transmitted to the monitoring system 160 to establish the required early warning model data. For example, the electric meter 210 can be set on the carrier 140 or other components of the semiconductor automatic loading system 10, but the present invention is not limited thereto.

For example, the electric meter 210 can monitor and record the daily average power of the robot arm 130 or the vehicle 140, and establish the average power value of the robot arm 130 or the vehicle 140 as the power valve value. When the daily average power of the robot arm 130 or the vehicle 140 is less than the above power valve value, the monitoring system 160 may not react. When the daily average power is greater than or equal to the above power valve value, the monitoring system 160 will issue an alarm and notify the staff to monitor or check to ensure that there is no abnormality in the robot arm 130 or the vehicle 140. Of course, the present invention is not limited to this. In other embodiments, the daily power consumption (kWh) of the robot 130 or the vehicle 140 can be recorded and the corresponding average power consumption can be established as the corresponding power valve value to monitor and find out the abnormal energy consumption of the robot 130 or the vehicle 140. In other embodiments, the average power of the robot 130 or the vehicle 140 can be recorded and the corresponding power valve value can be established to monitor the instantaneous power of the robot 130 or the vehicle 140. When the instantaneous power is less than the above power valve value, the monitoring system 160 may not respond. When the instantaneous power is greater than or equal to the above power valve value, the monitoring system 160 will issue an alarm.

FIG4 is a schematic diagram of the relative positions of the particle monitor and each device of the present invention. Referring to FIG4, the particle monitor 190 can be set on one of the robot arm 130 or the carrier 140, and electrically connected to the monitoring system 160 to transmit the sensed suspended particle value to the monitoring system 160. For example, there can be multiple particle monitors 190 (for example, 6) to increase the sensing accuracy and avoid errors. The robot arm 130 can include a base 132, which is connected to the carrier 140 via the base 132, so that the robot arm 130 as a whole can move along the direction of the guide rail 141 of the carrier 140 (for example, the direction X in FIG4). Specifically, the carrier 140 may also include an X-axis belt groove 142 disposed between the guide rails 141, and the base 132 is pulled by the X-axis belt groove 142 to enable the robot 130 to move in the direction X. Since the X-axis belt groove 142 is prone to accumulate dust due to static electricity due to long-term friction, multiple particle monitors 190 may be disposed on the base 132 of the robot 130, and the base 132 moves on the guide rail 141 to monitor the suspended particle value in the entire semiconductor automatic loading system 10 or near the X-axis belt groove 142, so as to avoid excessive suspended particles affecting product production. However, the present invention is not limited to this.

In some embodiments, the robot arm 130 may include a support arm 136 connected to the support column 134, and the support arm 136 may move in the height direction (e.g., direction Z in FIG. 4 ) via the Z-axis belt groove 133 to use the fork 131 to transport the semiconductor material 110 at different heights in the loading port 100. The particle monitor 190 may be disposed on the support column 134 or the support arm 136. The advantage of the particle monitor 190 being disposed on the support arm 136 is that the movement of the support arm 136 in the direction Z may be used to detect the suspended particle values at different heights in the loading port 100, thereby detecting the dust accumulation at various locations in the loading port 100 or the Z-axis belt groove 133, and monitoring it via the monitoring system 160.

For example, the particle monitor 190 can transmit the suspended particle value in the loading port 100, the robot arm 130, the carrier 140 or the semiconductor automatic loading system 10 near the floor 11 to the monitoring system 160, and the suspended particle value data is accumulated to establish a concentration valve. When the suspended particle value of the environment near the above-mentioned components is less than a concentration valve, it can be judged based on the data that the air quality will not pollute the semiconductor material 110, and the monitoring system 160 may not react. When the suspended particle value is greater than or equal to the concentration valve, the monitoring system 160 can issue an alarm to notify the staff to monitor whether it is necessary to stop the machine to ensure that the semiconductor material 110 is not contaminated.

FIG. 5A and FIG. 5B are schematic diagrams of the relative positions and working principles of the anemometer and various devices of the present invention. Please refer to FIG. 5A and FIG. 5B at the same time. The semiconductor automatic loading system 10 may also include a plurality of anemometers 200, which are arranged on the air intake system Fin, the exhaust system Fout, outside the opening 101 of the loading port 100 or outside the opening 121 of the process machine 120, and are electrically connected to the monitoring system 160. The wind speed information and wind direction information of the air intake system Fin, the exhaust system Fout, the opening 101 of the loading port 100 or the opening 121 of the process machine 120 are monitored simultaneously.

For example, in order to monitor whether the flow field of the airflow AF flowing into the semiconductor automatic loading system 10 is normal to maintain a positive pressure environment, an anemometer 200 may be placed at a position X1 of the air intake system Fin disposed near the ceiling 12 to record and monitor the wind speed information and wind direction information of the airflow AF flowing into the semiconductor automatic loading system 10, and transmit the above information to the monitoring system 160. When the wind speed information is greater than a wind speed threshold value, or the wind direction flows from the outside of the semiconductor automatic loading system 10 to the inside of the semiconductor automatic loading system 10 (as shown in FIG. 5A ), it means that the air intake system Fin is working normally, and the monitoring system 160 may not react. When the wind speed information is less than or equal to the wind speed threshold value, or the wind direction flows from the inside of the semiconductor automatic loading system 10 to the outside of the semiconductor automatic loading system 10 (as shown in FIG. 5B ), it means that the fan of the air intake system Fin may be aged or abnormal, and the monitoring system 160 can issue an alarm to notify the staff to conduct inspection and troubleshooting.

On the other hand, in order to prevent dust accumulation in the loading port 100 from contaminating the stored semiconductor material 110, an anemometer 200 may be placed at a position X2 outside the opening 101 of the loading port 100 to record and monitor the wind speed information and wind direction information of the airflow AF at the opening 101, and transmit the wind direction information and wind speed information of the opening 101 at the loading port 100 to the monitoring system 160 for recording. For example, when the wind direction flows out of the opening 101 of the loading port 100, indicating that the flow field of the airflow AF is normal (as shown in FIG. 5A ), the monitoring system 160 may not react. When the wind direction of the airflow AF flows into the opening 101 of the loading port 100 (as shown in FIG. 5B ), the exhaust system Fout may be abnormal. The monitoring system 160 can issue an alarm to notify the staff to detect or troubleshoot the problem, thereby preventing the dirty particles from flowing back into the loading port 100 and avoiding adverse effects on the yield of the semiconductor material 110.

In addition, in order to monitor the exhaust of the semiconductor automatic loading system 10 to maintain the required positive pressure environment, an anemometer 200 can be placed at the position X3 (e.g., the floating hole) of the exhaust system Fout disposed near the floor 11 to record and monitor the wind speed information and wind direction information of the airflow AF flowing out of the semiconductor automatic loading system 10, and transmit the above information to the monitoring system 160 for recording. When the wind speed information is greater than a wind speed threshold value, or the wind direction flows from the inside of the semiconductor automatic loading system 10 to the outside of the semiconductor automatic loading system 10 (as shown in FIG. 5A ), it means that the airflow AF of the exhaust system Fout has a stable flow field, and the monitoring system 160 may not react. When the wind speed information is less than or equal to the wind speed threshold, or the wind direction flows from the outside of the semiconductor automatic loading system 10 to the inside of the semiconductor automatic loading system 10 (as shown in FIG. 5B ), it means that the fan of the exhaust system Fout may be aged or abnormal. The monitoring system 160 can issue an alarm to notify the staff to conduct inspections and troubleshoot the problem to prevent particles in the external dirty area from flowing back into the semiconductor automatic loading system 10.

Furthermore, in order to ensure that the process gas (such as etching gas or other process reactants) in the process tool 120 does not flow back and pollute the unprocessed or completed semiconductor material 110, an anemometer 200 can be placed at position X4 outside the opening 121 of the process tool 120 to monitor and record the wind speed information and wind direction information of the opening 121 of the process tool 120, and transmit the above information to the monitoring system 160 to ensure that the airflow AF flows from the outside of the process tool 120 into the inside of the process tool 120. For example, when the wind direction of the airflow AF flows into the opening 121 of the process tool 120 (as shown in FIG. 5A ), it means that the flow field of the airflow AF is normal, and the monitoring system 160 does not need to react. When the airflow AF flows out of the opening 121 of the process machine 120 (as shown in FIG. 5B ), the monitoring system 160 can send out an alarm to notify the staff to detect or troubleshoot the problem, thereby preventing the etching gas or reactant particles from contaminating or damaging the semiconductor material 110, the robot arm 130 or the carrier 140.

FIG6 is a schematic diagram of the monitoring system of the present invention integrating and analyzing the data of each detector and issuing corresponding alarms. Please refer to FIG6. Through the data collected by the above detectors, the staff can monitor the current information by experience and hazard level for integrated analysis to achieve the purpose of real-time monitoring of yield. For example, after receiving the data from various detectors, the monitoring system 160 can integrate and compare to determine whether a single situation or multiple situations occur, whether it belongs to the first level LV1, the second level LV2, the third level LV3, the fourth level LV4 or the fifth level LV5. Different treatment methods are adopted for different levels, and standardized operation processes can be established.

For example, when the electric meter 210 detects an abnormality and issues an alarm, the monitoring system 160 can determine that the first level LV1 will not immediately affect the yield rate, and there is no need to shut down the system. The staff can observe outside the semiconductor automatic loading system 10. However, the present invention is not limited to this.

For example, when the vacuum sensor 170 sends out an alarm alone or the vacuum sensor 170 and the electric meter 210 send out an alarm at the same time, the monitoring system 160 can determine that the second level LV2 may cause damage to the product and fragments, and can notify the staff to empty the finished product and shut down the machine to check and eliminate the problem. However, the present invention is not limited to this.

For example, when the opening 121 of the process machine 120 has an abnormal airflow AF as described above, causing the anemometer 200 to sound an alarm, or the vacuum sensor 170 and the anemometer 200 of the opening 121 of the process machine 120 sound an alarm at the same time, the monitoring system 160 can determine that it is the third level LV3, and it is believed that there may be contamination at the end of the process machine 120, thereby notifying the staff to empty the machine in the semiconductor automatic loading system 10 and shut it down to check and eliminate the problem. However, the present invention is not limited to this.

Furthermore, when the anemometer 200 and the particle monitor 190 at the opening 101 of the loading port 100 detect an abnormality and sound an alarm, the monitoring system 160 can be determined as the fourth level LV4, which may indicate that the robot arm 130 is contaminated. At this time, the staff can be notified to empty the finished products and shut down the machine in the semiconductor automatic loading system 10 for further confirmation. However, the present invention is not limited to this.

Similarly, when the anemometer 200 at the floor 11 and the anemometer 200 at the opening 101 of the loading port 100 detect an abnormality and sound an alarm, the monitoring system 160 can be determined as the fifth level LV5, which may mean that the positive pressure environment in the semiconductor automatic loading system 10 is abnormal, causing dirty particles to contaminate the semiconductor material 110. At this time, the staff can be notified to shut down directly and protect the product. However, the present invention is not limited to this.

In summary, by collecting data through various detectors and the monitoring system 160 constantly monitoring the semiconductor automatic loading system 10 and integrating the data, it can be ensured that when the environment in the semiconductor automatic loading system 10 is abnormal, the monitoring system 160 will detect and inform the staff at the first time. In addition, the monitoring system 160 can also cross-check and determine the hazard level of various abnormalities, thereby taking different treatment measures accordingly, which can help the staff to eliminate the problem or avoid unnecessary downtime that affects the product manufacturing schedule, thereby improving the product manufacturing yield and improving the utilization rate of each machine.

In summary, the semiconductor automatic loading system of the present invention includes a distance measuring sensor installed at the opening of the loading port. It can monitor the horizontal distance and vertical distance of the robot arm (such as the fork of the robot arm) within the error range. When the robot arm ages and the distance shifts, it can be predicted in advance and an alarm can be issued to prevent possible collisions between materials or collisions between materials and mechanisms, and avoid continuous chipping or scratching of materials, further improving product yield.

Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the relevant technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of the patent application attached hereto.

10: Semiconductor automatic loading system

11: Floor

12: Ceiling

100: Loading port

101, 121: Opening

101A: First side

101B: Second side

110: Semiconductor materials

120: Processing equipment

130:Robotic arm

131: Tooth fork

140: Vehicles

150: Distance sensor

150A: First sensor

150B: Second sensor

160: Monitoring system

Fin: Intake system

Fout: Exhaust system

AF: airflow

D1: First distance

D2: Second distance

S: Storage device

Claims (15)

A semiconductor automatic loading system includes: a plurality of loading ports having openings suitable for loading semiconductor materials; a process machine suitable for processing the semiconductor materials; a robot arm suitable for transferring the semiconductor materials between the loading ports and the process machine, the robot arm including a base, a support column, a height direction belt groove and a support arm, the support column is connected to the base, the support arm is connected to the support column via the height direction belt groove, wherein the support arm is suitable for moving in the height direction via the height direction belt groove; a carrier, the robot arm is connected to the carrier via the base, and the support arm is suitable for moving in the height direction via the height direction belt groove. The robot arm is configured to move in the plane direction between the loading ports and the process machine; the first sensor and the second sensor are respectively disposed on two adjacent sides outside the opening of each of the loading ports, and are suitable for sensing the first distance and the second distance between the robot arm and the opening, wherein the first distance and the second distance are substantially perpendicular; the monitoring system is electrically connected to the first sensor and the second sensor, and receives the value of the first distance and the value of the second distance; and a plurality of particle monitors are disposed on the base and the support arm, and are electrically connected to the monitoring system. The semiconductor automatic loading system as described in claim 1, wherein when the value of the first distance or the value of the second distance is greater than the distance threshold value, the monitoring system does not respond, and when the value of the first distance or the value of the second distance is less than or equal to the distance threshold value, the monitoring system issues an alarm. The semiconductor automatic loading system as described in claim 1 further includes: a vacuum sensor, which is arranged on one of the robot arm or the carrier and is electrically connected to the monitoring system. The semiconductor automatic loading system as described in claim 3, wherein the vacuum sensor is suitable for sensing the vacuum degree of the semiconductor automatic loading system and transmitting the vacuum degree information to the monitoring system. When the vacuum degree is greater than the vacuum valve value, the monitoring system does not respond, and when the vacuum degree is less than or equal to the vacuum valve value, the monitoring system issues an alarm. The semiconductor automatic loading system as described in claim 1 further includes: a vibration sensor, which is arranged on one of the robot arm or the carrier and is electrically connected to the monitoring system. The semiconductor automatic loading system as described in claim 5, wherein the vibration sensor is suitable for sensing the vibration information of the robot arm or the carrier, and transmitting the vibration information to the monitoring system, when the vibration information is less than the vibration threshold value, the monitoring system does not respond, and when the vibration information is greater than or equal to the vibration threshold value, the monitoring system issues an alarm. The semiconductor automatic loading system as described in claim 1 further comprises: an air intake system for directing airflow from outside the semiconductor automatic loading system to inside the semiconductor automatic loading system; an exhaust system for being arranged on the floor of the semiconductor automatic loading system for directing air from inside the semiconductor automatic loading system to outside the semiconductor automatic loading system; and a plurality of anemometers for being arranged on the air intake system and the exhaust system and connected to the monitoring system. A semiconductor automatic loading system as described in claim 7, wherein one of the anemometers is further disposed outside the openings of the loading ports or outside the process machine. The semiconductor automatic loading system as described in claim 7, wherein the anemometers are suitable for sensing the wind speed information of the semiconductor automatic loading system and transmitting the wind speed information to the monitoring system. When the wind speed information is greater than the wind speed threshold, the monitoring system does not respond, and when the wind speed information is less than or equal to the wind speed threshold, the monitoring system issues an alarm. The semiconductor automatic loading system as described in claim 7, wherein the anemometers are suitable for sensing the wind direction of the air intake system and transmitting the wind direction to the monitoring system. When the wind direction flows from outside the semiconductor automatic loading system to inside the semiconductor automatic loading system, the monitoring system does not respond. When the wind direction flows from inside the semiconductor automatic loading system to outside the semiconductor automatic loading system, the monitoring system issues an alarm. The semiconductor automatic loading system as described in claim 7, wherein the anemometers are suitable for sensing the wind direction of the exhaust system and transmitting the wind direction to the monitoring system. When the wind direction flows from inside the semiconductor automatic loading system to outside the semiconductor automatic loading system, the monitoring system does not respond. When the wind direction flows from outside the semiconductor automatic loading system to inside the semiconductor automatic loading system, the monitoring system issues an alarm. The semiconductor automatic loading system as described in claim 8, wherein the anemometer disposed outside the openings of the loading ports or outside the process machine is adapted to sense the wind direction of the openings of the loading ports or the process machine and transmit the wind direction to the monitoring system. When the wind direction flows out of the openings of the loading ports or flows into the process machine, the monitoring system does not respond. When the wind direction flows into the openings of the loading ports or flows out of the process machine, the monitoring system issues an alarm. The semiconductor automatic loading system as described in claim 1, wherein the particle monitor is suitable for sensing the suspended particle value of the semiconductor automatic loading system and transmitting the suspended particle value to the monitoring system. When the suspended particle value is less than the concentration valve value, the monitoring system does not respond, and when the suspended particle value is greater than or equal to the concentration valve value, the monitoring system issues an alarm. The semiconductor automatic loading system as described in claim 1 further includes: an electric meter suitable for sensing the power of the robot arm or the vehicle and electrically connected to the monitoring system. A semiconductor automatic loading system as described in claim 14, wherein when the power is less than the power threshold value, the monitoring system does not respond, and when the power is greater than or equal to the power threshold value, the monitoring system issues an alarm.

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