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TWM624511U - Slim type tactile feedback device - Google Patents

Slim type tactile feedback device Download PDF

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Publication number
TWM624511U
TWM624511U TW110213758U TW110213758U TWM624511U TW M624511 U TWM624511 U TW M624511U TW 110213758 U TW110213758 U TW 110213758U TW 110213758 U TW110213758 U TW 110213758U TW M624511 U TWM624511 U TW M624511U
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Taiwan
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frame
substrate
feedback device
vibration source
fixed
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TW110213758U
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Chinese (zh)
Inventor
劉錦松
簡孝名
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台睿精工股份有限公司
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Priority to TW110213758U priority Critical patent/TWM624511U/en
Publication of TWM624511U publication Critical patent/TWM624511U/en

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Abstract

A slim type tactile feedback device is disclosed, including: a substrate, at least an overlapping plate, a support frame, a plurality of cushions and a vibration source; the overlapping plate being fixed to the substrate in a cantilever manner; the support frame including a frame, a void area, and at least a protruding support, the protruding support being a partial segment of the frame; the plurality of cushions being fixed between the substrate and the frame; the vibration source including a magnet set and a coil set, the magnet set and the coil set being fixed between the protruding support and the overlapping plate and located at outer side the substrate; the coil set and the magnet set being positioned corresponding to each other and separated by a gap, the gap increasing when the substrate being pressed at the touch of a finger, and the substrate moving back-and-forth through the linkage motion by the vibration source; thereby, the size of the location of the vibration source is smaller than the size of the substrate and the support frame stacked together, to achieve the product thinning.

Description

薄型化觸覺回饋裝置Thin haptic feedback device

本創作為一種觸覺回饋裝置的技術領域,尤其指在符合薄型化結構需求下,應用於觸控板、平面鍵盤、平板電腦板等各種電子裝置。The present invention belongs to the technical field of a tactile feedback device, in particular, it is applied to various electronic devices such as touch pads, flat keyboards, tablet computer boards, etc. under the requirement of thin structure.

觸覺回饋是現今電子產品通常的功能,普遍應用於觸控板、平面鍵盤、平板電腦等電子裝置中。觸覺回饋的概念為模擬傳統機械式鍵盤與滑鼠,在進行觸摸操作的過程中對應產生振動回饋。如圖1、圖2所示,為習用觸覺回饋裝置的分解圖及側視圖,該觸覺回饋裝置包括一基板11、一框架12、數個緩衝墊13、以及一振動馬達14。該數個緩衝墊13連接於該基板11與該框架12之間,該振動馬達14安裝於該基板11底面,藉此當該振動馬達14振動,軟質的該緩衝墊13有助於該基板11與該振動馬達14產生共振頻率,於該基板11上操作位置獲得良好的振動回饋。但上述各構件是採堆疊方式配置,如圖2所示,因該振動馬達14尺寸較大,一般會凸出於該框架12底面,增加原本此架構的厚度(Z軸尺寸),且該振動馬達14凸出位置會影響原本此處電子元件的配置,造成相關電路或電子元件必須進行迴避設計,增加廠商設計及製造的困擾,這對產品薄型化的需求也是不利的。Haptic feedback is a common function of today's electronic products, and is commonly used in electronic devices such as touchpads, flat keyboards, and tablet computers. The concept of haptic feedback is to simulate the traditional mechanical keyboard and mouse, and correspondingly generate vibration feedback during the touch operation. As shown in FIGS. 1 and 2 , which are an exploded view and a side view of a conventional haptic feedback device, the haptic feedback device includes a substrate 11 , a frame 12 , a plurality of buffer pads 13 , and a vibration motor 14 . The plurality of buffer pads 13 are connected between the substrate 11 and the frame 12 , and the vibration motor 14 is installed on the bottom surface of the substrate 11 , whereby when the vibration motor 14 vibrates, the soft buffer pads 13 help the substrate 11 A resonance frequency is generated with the vibration motor 14 , and good vibration feedback is obtained at the operating position on the substrate 11 . However, the above-mentioned components are arranged in a stacked manner, as shown in FIG. 2 , due to the large size of the vibration motor 14, it generally protrudes from the bottom surface of the frame 12, increasing the thickness (Z-axis dimension) of the original structure, and the vibration The protruding position of the motor 14 will affect the original configuration of the electronic components, so that the related circuits or electronic components must be designed to be avoided, which increases the troubles of the manufacturer's design and manufacture, which is also unfavorable for the requirement of thinning products.

為解決上述之問題,本創作主要目的係提供一種薄型化觸覺回饋裝置,係將一振動源設置在一框架且位於一基板觸覺有效區域外,藉此減少該振動源所在位置的尺寸,達到產品薄型化的目的。In order to solve the above problems, the main purpose of this creation is to provide a thin tactile feedback device, in which a vibration source is arranged in a frame and located outside the tactile effective area of a substrate, thereby reducing the size of the location where the vibration source is located, so as to achieve product purpose of thinning.

為實現前述目的,本創作採用了如下技術方案:In order to achieve the aforementioned purpose, this creation adopts the following technical solutions:

本創作為一種薄型化觸覺回饋裝置,包括:一基板、至少一搭接平板、一承架、數個緩衝墊及至少一振動源;該搭接平板固定於該基板且呈懸臂狀延伸至該基板外側;該承架包括一框架、由該框架所形成之一鏤空區及至少一凸起架,該凸起架為該框架局部區段,該凸起架呈U型且凸起方向與該框架上設置該基板的方向相同,該凸起架具有一內壁且形成一容置空間;數個該緩衝墊固定於該基板及該框架之間;該振動源包括一磁石組及一線圈組,該磁石組與該線圈組固定於該凸起架與該搭接平板之間且位於該基板外側,該線圈組位置對應該磁石組且相隔一空隙,在觸控操作以手指按壓該基板時該空隙只會增加,並由該振動源運作帶動該基板產生往復振動。The present invention is a thin tactile feedback device, comprising: a base plate, at least one overlapping plate, a support frame, a plurality of buffer pads and at least one vibration source; the overlapping plate is fixed on the base plate and extends to the base plate in a cantilever shape. The outer side of the base plate; the support frame includes a frame, a hollow area formed by the frame and at least one raised frame, the raised frame is a partial section of the frame, the raised frame is U-shaped, and the raised direction is the same as that of the frame. The direction of setting the base plate on the frame is the same, the protruding frame has an inner wall and forms an accommodating space; a plurality of the buffer pads are fixed between the base plate and the frame; the vibration source includes a magnet group and a coil group , the magnet group and the coil group are fixed between the protruding frame and the overlapping plate and are located on the outside of the substrate. The position of the coil group corresponds to the magnet group and is separated by a gap. When the touch operation is performed with a finger, the substrate is pressed The gap only increases, and the vibration source drives the substrate to vibrate back and forth.

作為較佳優選實施方案之一,該凸起架的凸起高度低於該基板頂面,且該振動源所在位置的堆疊尺寸小於該基板與該承架堆疊後的尺寸。As one of the preferred embodiments, the protruding height of the protruding frame is lower than the top surface of the substrate, and the stacking size of the position where the vibration source is located is smaller than the stacking size of the substrate and the support frame.

作為較佳優選實施方案之一,該磁石組位於該容置空間,該線圈組固定在該搭接平板,該磁石組包括數個並排的磁石,數個該磁石固定在該內壁,該線圈組包括數個線圈及一電路板,數個該線圈並排固定在該電路板,該電路板固定在該搭接平板,使數個該線圈於該基板外側且上方位置對應著數個該磁石。As one of the preferred embodiments, the magnet set is located in the accommodating space, the coil set is fixed on the overlapping flat plate, the magnet set includes a plurality of magnets side by side, a plurality of the magnets are fixed on the inner wall, the coil set The group includes a plurality of coils and a circuit board, the coils are fixed side by side on the circuit board, and the circuit board is fixed on the overlapping plate, so that the coils are on the outside of the substrate and the upper positions correspond to the magnets.

作為較佳優選實施方案之一,該線圈組位於該容置空間,該磁石組固定在該搭接平板,該線圈組包括數個線圈及一電路板,數個該線圈並排且固定在該電路板,該電路板固定在該內壁,該磁石組包括數個並排的磁石,數個該磁石固定在該搭接平板,使數個該磁石於該基板外側且上方位置對應著數個該線圈。As one of the preferred embodiments, the coil set is located in the accommodating space, the magnet set is fixed on the overlapping plate, the coil set includes a plurality of coils and a circuit board, and a plurality of the coils are side by side and fixed on the circuit The circuit board is fixed on the inner wall, the magnet set includes several magnets side by side, and the magnets are fixed on the overlapping plate, so that the magnets are outside the substrate and the upper positions of the magnets correspond to the coils.

作為較佳優選實施方案之一,該磁石的磁極排列方向平行該振動源所在處的該框架,該振動源產生往復振動方向是平行於該框架。As one of the preferred embodiments, the magnetic pole arrangement direction of the magnet is parallel to the frame where the vibration source is located, and the reciprocating vibration direction of the vibration source is parallel to the frame.

作為較佳優選實施方案之一,該磁石的磁極排列方向垂直該振動源所在處的該框架,該振動源產生往復振動方向是垂直於該框架。As one of the preferred embodiments, the magnetic pole arrangement direction of the magnet is perpendicular to the frame where the vibration source is located, and the reciprocating vibration direction of the vibration source is perpendicular to the frame.

作為較佳優選實施方案之一,該框架具有至少一懸臂支架,該懸臂支架局部固著於該基板 ,且該懸臂支架的延伸方向與該振動源的往復振動方向相垂直。As one of the preferred embodiments, the frame has at least one cantilever bracket, the cantilever bracket is partially fixed to the substrate, and the extension direction of the cantilever bracket is perpendicular to the reciprocating vibration direction of the vibration source.

作為較佳優選實施方案之一,該懸臂支架遠離連接該框架的一端為一末端區,並由該末端區固著於該基板。As one of the preferred embodiments, one end of the cantilever bracket away from the connection with the frame is an end region, and is fixed to the substrate by the end region.

作為較佳優選實施方案之一,該懸臂支架還形成寛度較窄的至少一頸區段。As one of the preferred embodiments, the cantilever support also forms at least one neck section with a narrower width.

作為較佳優選實施方案之一,該框架具有至少一對懸臂支架,該對懸臂支架相互平行且位於該鏤空區兩側,該懸臂支架局部固著於該基板,且該懸臂支架的延伸方向與該振動源往復振動方向相垂直。As one of the preferred embodiments, the frame has at least a pair of cantilever brackets, the pair of cantilever brackets are parallel to each other and located on both sides of the hollow area, the cantilever brackets are partially fixed to the base plate, and the extension direction of the cantilever brackets is the same as that of the base plate. The reciprocating vibration direction of the vibration source is vertical.

作為較佳優選實施方案之一,該懸臂支架遠離連接該框架的一端為一末端區,並由該末端區固著於該基板。As one of the preferred embodiments, one end of the cantilever bracket away from the connection with the frame is an end region, and is fixed to the substrate by the end region.

作為較佳優選實施方案之一,該振動源設有數組且位於相對位置及數目的該凸起架與該搭接平板之間,該框架具有至少一懸臂支架,該振動源往復振動方向相互平行且皆垂直該懸臂支架的延伸方向。As one of the preferred embodiments, the vibration source is provided with an array and is located between the protruding frame and the overlapping plate in relative positions and numbers, the frame has at least one cantilever support, and the reciprocating vibration direction of the vibration source is parallel to each other And they are all perpendicular to the extending direction of the cantilever support.

作為較佳優選實施方案之一,該基板為觸控板、平面鍵盤、平板電腦之觸控螢幕等其中一種。As one of the preferred embodiments, the substrate is one of a touch panel, a flat keyboard, a touch screen of a tablet computer, and the like.

與現有技術相比,本創作具有下列具體的功效: 1.振動源所在位置的縱向尺寸小於觸覺回饋裝置的整體尺寸,藉此符合產品薄型化的需求。 2.振動源設置該基板與該框架上,且無向外凸起的結構,不影響原本電子裝置中之各電路或電子元件配置。 3.若要獲得均勻振動的觸覺回饋,本創作可增設至少一個或一對懸臂支架於該框架,且使該振動源振動方向垂直於與該懸臂支架的延伸方向,藉此獲得均勻的振動回饋。 Compared with the prior art, this creation has the following specific effects: 1. The longitudinal dimension of the location where the vibration source is located is smaller than the overall dimension of the tactile feedback device, so as to meet the requirement of product thinning. 2. The vibration source is arranged on the base plate and the frame, and there is no outwardly protruding structure, which does not affect the configuration of various circuits or electronic components in the original electronic device. 3. In order to obtain haptic feedback of uniform vibration, this creation can add at least one or a pair of cantilever supports to the frame, and make the vibration direction of the vibration source perpendicular to the extension direction of the cantilever supports, thereby obtaining uniform vibration feedback .

下面將結合具體實施例和附圖,對本創作的技術方案進行清楚、完整地描述。需要說明的是,當元件被稱為「安裝於或固定於」另一個元件,意指它可以直接在另一個元件上或者也可以存在居中的元件。當一個元件被認為是「連接」另一個元件,意指它可以是直接連接到另一個元件或者可能同時存在居中元件。在所示出的實施例中,方向表示上、下、左、右、前和後等是相對的,用於解釋本案中不同部件的結構和運動是相對的。當部件處於圖中所示的位置時,這些表示是恰當的。但是,如果元件位置的說明發生變化,那麼認為這些表示也將相應地發生變化。The technical solution of the present creation will be clearly and completely described below with reference to the specific embodiments and the accompanying drawings. It should be noted that when an element is referred to as being "mounted or fixed to" another element, it means that it can be directly on the other element or an intervening element may also be present. When an element is referred to as being "connected" to another element, it means that it can be directly connected to the other element or intervening elements may also be present. In the illustrated embodiment, the directions indicated up, down, left, right, front and back, etc. are relative, and are used to explain that the structures and movements of the various components in this case are relative. These representations are appropriate when the components are in the positions shown in the figures. However, if the description of the positions of elements changes, it is believed that these representations will change accordingly.

除非另有定義,本文所使用的所有技術和科學術語與屬於本創作技術領域的技術人員通常理解的含義相同。本文中所使用的術語只是為了描述具體實施例的目的,不是旨在限制本創作。本文所使用的術語「和/或」包括一個或多個相關的所列項目的任意的和所有的組合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art of the present invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

如圖3及圖4所示,為本創作薄型化觸覺回饋裝置第一實施例之立體圖及分解圖。本創作薄型化觸覺回饋裝置包括一基板20、一承架30、數個緩衝墊40、至少一振動源50、及至少一搭接平板60。該搭接平板固定60於該基板20,該搭接平板20呈懸臂狀延伸於該基板30外側。該承架30包括一框架31、由該框架31所形成之一鏤空區32及至少一凸起架33,該凸起架33為該框架31的局部區段。該振動源50包括一磁石組51及一線圈組52,該磁石組51與該線圈組52固定於該凸起架33與該搭接平板60之間,在本實施例中該磁石組51固定於該凸起架33內,該線圈組52固定於該搭接平板60。該數個緩衝墊40固定於該基板20及該框架31之間,維持該磁石組51與該線圈組52之間存在一空隙;藉此該振動源50運作時會帶動該基板20產生往復振動,讓使用者以手指接觸該基板20可獲得良好的振動觸覺回饋感。本創作因該磁石組51及該線圈組52分別設於該凸起架33及該搭接平板60且位於該基板20外側,讓該振動源50所在位置堆疊的尺寸小於該基板20、該緩衝墊40及該承架30堆疊後的尺寸,以達到產品薄型化的目的。As shown in FIG. 3 and FIG. 4 , a perspective view and an exploded view of the first embodiment of the thinned tactile feedback device of the present creation. The thinned haptic feedback device of the present invention includes a substrate 20 , a support frame 30 , a plurality of buffer pads 40 , at least one vibration source 50 , and at least one overlapping flat plate 60 . The overlapping plate is fixed 60 on the base plate 20 , and the overlapping plate 20 extends outside the base plate 30 in a cantilever shape. The supporting frame 30 includes a frame 31 , a hollow area 32 formed by the frame 31 , and at least one protruding frame 33 , and the protruding frame 33 is a partial section of the frame 31 . The vibration source 50 includes a magnet set 51 and a coil set 52. The magnet set 51 and the coil set 52 are fixed between the protruding frame 33 and the overlapping plate 60. In this embodiment, the magnet set 51 is fixed Inside the protruding frame 33 , the coil assembly 52 is fixed to the overlapping plate 60 . The plurality of buffer pads 40 are fixed between the base plate 20 and the frame 31 to maintain a gap between the magnet set 51 and the coil set 52; thus, the vibration source 50 drives the base plate 20 to generate reciprocating vibration during operation , allowing the user to touch the substrate 20 with fingers to obtain a good vibratory tactile feedback. In the present invention, the magnet set 51 and the coil set 52 are respectively disposed on the protruding frame 33 and the overlapping plate 60 and are located outside the base plate 20 , so that the size of the stack where the vibration source 50 is located is smaller than that of the base plate 20 and the buffer. The size of the stacking pad 40 and the support frame 30 is to achieve the purpose of thinning the product.

接著就各構件作一詳細的說明:該基板20是可提供觸控感應的電子裝置,例如觸控板、平面鍵盤、平板電腦之觸控螢幕等,利用手指、觸控筆或其他接觸介面與之接觸時,產生相對的電子訊號,並能同步驅動該振動源50產生振動,使接觸點的操作位置感受到振動的觸覺回饋效果。Next, a detailed description of each component is made: the substrate 20 is an electronic device that can provide touch sensing, such as a touchpad, a flat keyboard, a touch screen of a tablet computer, etc. When in contact, a relative electronic signal is generated, and the vibration source 50 can be driven to vibrate synchronously, so that the operating position of the contact point can feel the tactile feedback effect of the vibration.

該承架30外形基本為長方形,為了便於後續說明,長邊方向定義為X方向91,短邊方向定義為Y方向92。該承架30主要負責承載該基板20,該承架30包括該框架31、位於中間的該鏤空區32及至少一該凸起架33。該凸起架33於該框架31局部區段,在本實施例中該凸起架33設置於該框架31的該X方向91,該凸起架33呈倒U型且凸起方向與該框架31上設置該基板20的方向相同。該凸起架33具有一內壁331且形成一容置空間332,該磁石組51位於該容置空間332內,該線圈組52固定在該搭接平板60,且位置與上方的該磁石組51相對應,在本實施例中,該磁石組51固定於該框架31為一定子,該線圈組52固定於該基板20為一動子,藉此當手指按壓該基板20時,就能滿足動子及定子互相遠離的原則,即該線圈組52與該磁石組51之間距離只會增加、不會縮小,避免操作上產生不必要的碰撞。另外該振動源50雖設置該框架31且也位於該基板20觸覺有效區域外。The outer shape of the support frame 30 is basically a rectangle. For the convenience of the subsequent description, the long side direction is defined as the X direction 91 , and the short side direction is defined as the Y direction 92 . The supporting frame 30 is mainly responsible for carrying the substrate 20 , and the supporting frame 30 includes the frame 31 , the hollow area 32 in the middle, and at least one protruding frame 33 . The protruding frame 33 is located in a partial section of the frame 31. In this embodiment, the protruding frame 33 is disposed in the X direction 91 of the frame 31. The protruding frame 33 is in an inverted U shape and the protruding direction is the same as that of the frame. The direction in which the substrate 20 is arranged on the 31 is the same. The protruding frame 33 has an inner wall 331 and forms an accommodating space 332. The magnet set 51 is located in the accommodating space 332. The coil set 52 is fixed on the overlapping plate 60, and the position is the same as that of the magnet set above. Corresponding to 51, in this embodiment, the magnet set 51 is fixed on the frame 31 as a stator, and the coil set 52 is fixed on the base plate 20 as a mover, so that when a finger presses the base plate 20, the movement can be satisfied. The principle of keeping the stator and the stator away from each other, that is, the distance between the coil group 52 and the magnet group 51 will only increase and not decrease, so as to avoid unnecessary collisions in operation. In addition, although the vibration source 50 is disposed on the frame 31 , it is also located outside the tactile effective area of the substrate 20 .

該振動源50包括該磁石組51及該線圈組52。該磁石組51包括數個並排的磁石511,數個該磁石511朝下固定於該內壁331。該線圈組52包括數個線圈521及一電路板522,數個該線圈521並排且固定於該電路板522,當該電路板522通電後能讓數個該線圈521產生相對的磁極。該電路板522固定於該搭接平板60,再由該搭接平板60固定於該基板20,藉此讓該搭接平板60呈懸臂狀承載數個該線圈521於該基板20外側。該搭接平板60還具有一窗口61,該窗口61供外部線路經此與該電路板522電性連接。該磁石511依不同方向設置,會使磁極排列方向不同,最終導致該振動源50產生的往復振動方向不同,在本實施例中,該磁石511之N極及S極的磁極方向是平行於該X方向91,因此該振動源50所產生振動方向為X方向91。The vibration source 50 includes the magnet set 51 and the coil set 52 . The magnet set 51 includes a plurality of magnets 511 arranged side by side, and the plurality of magnets 511 are fixed to the inner wall 331 facing downward. The coil set 52 includes a plurality of coils 521 and a circuit board 522. The coils 521 are arranged side by side and fixed to the circuit board 522. When the circuit board 522 is energized, the coils 521 can generate opposite magnetic poles. The circuit board 522 is fixed to the overlapping plate 60 , and then the overlapping plate 60 is fixed to the substrate 20 , so that the overlapping plate 60 cantileveredly carry the coils 521 outside the substrate 20 . The overlapping plate 60 also has a window 61 through which an external circuit can be electrically connected to the circuit board 522 . The magnets 511 are arranged in different directions, so that the arrangement directions of the magnetic poles are different, and finally the reciprocating vibration directions generated by the vibration source 50 are different. The X direction 91 , so the vibration direction generated by the vibration source 50 is the X direction 91 .

該緩衝墊40是由上、下兩端面分別固著於該基板20及該框架31,作為該承架30與該基板20連接的介質,該緩衝墊40材質必須有助於該基板20與該振動源50產生共振頻率,藉此以很小的週期驅動力便可產生巨大的振動,以獲得良好的振動回饋。該緩衝墊40材質可為矽膠、泡棉…等,且平均分佈於該框架31與該基板20之間。The buffer pad 40 is fixed to the substrate 20 and the frame 31 by the upper and lower end surfaces, respectively. As a medium for the connection between the support frame 30 and the substrate 20 , the material of the buffer pad 40 must be conducive to the connection between the substrate 20 and the substrate 20 . The vibration source 50 generates a resonant frequency, whereby a huge vibration can be generated with a small period driving force, so as to obtain a good vibration feedback. The buffer pad 40 can be made of silicone, foam, etc., and is evenly distributed between the frame 31 and the substrate 20 .

如圖5所示,本創作將該磁石組51之數個該磁石511朝下固定於該凸起架33的該內壁331,數個該線圈521固定於由該基板20一側向外延伸的該搭接平板60上,如此讓該振動源50所在位置的堆疊尺寸小於該基板20及該承架30堆疊後的尺寸,藉此達到薄型化的目的。另外該振動源50設置該框架31且位於該基板20觸覺有效區域外,未向下凸出的結構,有助減少影響原本電子元件的配置,更有利於產品薄型化的需求。As shown in FIG. 5 , in the present invention, the magnets 511 of the magnet set 51 are fixed to the inner wall 331 of the protruding frame 33 facing downward, and the coils 521 are fixed to extend outward from one side of the base plate 20 . On the overlapping plate 60 , the stack size at the location of the vibration source 50 is smaller than the stack size of the substrate 20 and the support frame 30 , thereby achieving the purpose of thinning. In addition, the vibration source 50 is disposed on the frame 31 and is located outside the tactile effective area of the substrate 20, and the structure not protruding downward helps reduce the influence on the original configuration of electronic components, and is more conducive to the requirement of product thinning.

本創作的設計能廣泛應用於多種結構中,以下就各種不同實施例作一說明。如圖6所示,為本創作第二實例之仰視角的立體圖。本實施例是改變該振動源50的安裝位置,以滿足不同產品的需求。在本實施例中,該承架30仍包括該框架31、該鏤空區32及該凸起架33,但該凸起架33是設置於該Y方向92,其餘該振動源50、基板20、緩衝墊40及搭接平板60的結構皆與上述實施例相同,此時該振動源50所產生往復振動方向為Y方向92。The design of the present invention can be widely used in various structures, and various embodiments are described below. As shown in FIG. 6 , it is a perspective view of the second example of the present creation from a vertical perspective. In this embodiment, the installation position of the vibration source 50 is changed to meet the requirements of different products. In this embodiment, the support frame 30 still includes the frame 31 , the hollow area 32 and the protruding frame 33 , but the protruding frame 33 is arranged in the Y direction 92 , and the rest of the vibration source 50 , the substrate 20 , the The structures of the buffer pad 40 and the overlapping plate 60 are the same as those of the above-mentioned embodiment, and the direction of the reciprocating vibration generated by the vibration source 50 is the Y direction 92 at this time.

在上實施例中,本創作該振動源50設置位置於偏離該基板20中心,當振動發生時可能讓該基板20在不同的操作位置產生振動回饋不均的情形,為了改善此問題,本創作另提供幾種不同實施例。如圖7、圖8所示,為本創作第三實施圖之分解圖及仰視角的立體圖。本實施主要是改良該承架30的結構,藉此在振動源50振動時能抵消部份旋轉力矩。本實施例中該承架30還包括至少一懸臂支架34,該懸臂支架34連接於該框架31且位於該鏤空區32內,該懸臂支架34局部固著於該基板20。在實施例中是於該懸臂支架34遠離連接該框架31的一端為一末端區341,並由該末端區34與該基板20固著。另外該懸臂支架34還形成寛度較窄的至少一頸區段342,本實施例中具有兩個該頸區段342。另外為了讓振動較為平均,該振動源50產生的振動方向須與該懸臂支架34延伸方向相垂直,在本實施例中,該振動源50產生的振動方向為X方向91,該懸臂支架34則是平行於該Y方向92。In the above embodiment, the position of the vibration source 50 is offset from the center of the substrate 20 in the present invention. When vibration occurs, the substrate 20 may have uneven vibration feedback at different operating positions. In order to improve this problem, the present invention Several different embodiments are also provided. As shown in FIG. 7 and FIG. 8 , it is an exploded view and a perspective view of a bottom view of the third embodiment of the present invention. In this embodiment, the structure of the support frame 30 is mainly improved, so that when the vibration source 50 vibrates, part of the rotational torque can be offset. In this embodiment, the support frame 30 further includes at least one cantilever bracket 34 . The cantilever bracket 34 is connected to the frame 31 and located in the hollow area 32 . The cantilever bracket 34 is partially fixed to the base plate 20 . In the embodiment, one end of the cantilever bracket 34 away from the frame 31 is an end region 341 , and the end region 34 is fixed to the substrate 20 . In addition, the cantilever bracket 34 also forms at least one neck section 342 with a narrow width, and there are two neck sections 342 in this embodiment. In addition, in order to make the vibration more even, the vibration direction generated by the vibration source 50 must be perpendicular to the extension direction of the cantilever bracket 34. In this embodiment, the vibration direction generated by the vibration source 50 is the X direction 91, and the cantilever bracket 34 is is parallel to the Y direction 92 .

如圖9所示,為本創作第四實施例之分解圖。本實施例是與該圖7之實施例相似,不同之處在於:該懸臂支架34的設置方向與該振動源50的設置位置。在本實施例中該振動源50設置該框架31的該Y方向92,該懸臂支架34則呈平行該X方向91連接於該框架31。As shown in FIG. 9 , it is an exploded view of the fourth embodiment of the present invention. This embodiment is similar to the embodiment shown in FIG. 7 , and the difference lies in the disposition direction of the cantilever support 34 and the disposition position of the vibration source 50 . In this embodiment, the vibration source 50 is disposed in the Y direction 92 of the frame 31 , and the cantilever bracket 34 is connected to the frame 31 parallel to the X direction 91 .

如圖10及圖11所示,為本創作第五實施例之分解圖及仰視圖。在本實施例中,該承架30還包括一連板35,該連板35連接於該懸臂支架34且位於該鏤空區32內,正確的說法為:該連板35連接於該末端區341,在本實施例中,亦僅由該末端區341與該基板20相固著。該連板35可在組裝後防止該基板20與該框架31下方的電子元件接觸,讓觸覺回饋裝置在運作時更為安全。在本實施例中該振動源50產生的振動方向為X方向91,該懸臂支架34則平行於該Y方向92。As shown in FIG. 10 and FIG. 11 , it is an exploded view and a bottom view of the fifth embodiment of the present invention. In the present embodiment, the support frame 30 further includes a connecting plate 35, the connecting plate 35 is connected to the cantilever bracket 34 and is located in the hollow area 32. Correctly speaking, the connecting plate 35 is connected to the end area 341, In this embodiment, only the end region 341 is fixed to the substrate 20 . The connecting plate 35 can prevent the substrate 20 from contacting the electronic components under the frame 31 after assembly, so that the haptic feedback device is safer in operation. In this embodiment, the vibration direction generated by the vibration source 50 is the X direction 91 , and the cantilever bracket 34 is parallel to the Y direction 92 .

如圖12所示,為本創作第六實施例之仰視圖。本實施例與該圖10之實施例相似,不同之處在於:該懸臂支架34的設置方向與該振動源50的設置位置。在本實施例中該振動源50設置該框架31的Y方向92,該懸臂支架34則呈平行該X方向91連接於該框架31。As shown in FIG. 12, it is a bottom view of the sixth embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 10 , the difference lies in: the setting direction of the cantilever support 34 and the setting position of the vibration source 50 . In this embodiment, the vibration source 50 is disposed in the Y direction 92 of the frame 31 , and the cantilever bracket 34 is connected to the frame 31 parallel to the X direction 91 .

如圖13及圖14所示,為本創作第七實施例之分解圖及仰視圖。在本實施例中該承架30包括至少一對懸臂支架34,該懸臂支架34連接於該框架31,該對懸臂支架34相互平行且位於該鏤空區32兩側,該懸臂支架34局部固定於該基板20。兩個該懸臂支架34分別連接於該框架31位置相對的兩邊,呈反向對稱配置。在本實施例中該懸臂支架34仍由遠離連接該框架31一端的該末端區341與該基板20固著。該振動源50產生的振動方向為X方向91,該懸臂支架34則平行於該Y方向92。在本實施例中,由於設有一對該懸臂支架34,配合該緩衝墊40在該振動源50振動時與該基板20達到共振效果,滿足所須的振動回饋效果,該懸臂支架34增加Y方向92的剛性,抵抗來自於該振動源50因偏離中心振動所產生的Z軸轉動慣量,藉此會讓該基板20在各個操作位置皆能維持均勻的振動回饋。As shown in FIG. 13 and FIG. 14 , it is an exploded view and a bottom view of the seventh embodiment of the present invention. In this embodiment, the support frame 30 includes at least a pair of cantilever brackets 34 , the cantilever brackets 34 are connected to the frame 31 , the pair of cantilever brackets 34 are parallel to each other and are located on both sides of the hollow area 32 , and the cantilever brackets 34 are partially fixed to The substrate 20 . The two cantilever brackets 34 are respectively connected to two opposite sides of the frame 31 in a reverse symmetrical configuration. In this embodiment, the cantilever bracket 34 is still fixed to the base plate 20 by the end region 341 away from one end of the frame 31 . The vibration direction generated by the vibration source 50 is the X direction 91 , and the cantilever bracket 34 is parallel to the Y direction 92 . In this embodiment, since a pair of the cantilever brackets 34 are provided, the buffer pad 40 achieves a resonance effect with the substrate 20 when the vibration source 50 vibrates, so as to satisfy the required vibration feedback effect, the cantilever brackets 34 increase the Y direction The rigidity of 92 resists the Z-axis moment of inertia generated by the vibration source 50 due to off-center vibration, thereby enabling the substrate 20 to maintain a uniform vibration feedback at each operating position.

如圖15所示,為本創作第八實施例的仰視圖,本實施例與該圖13之實施例相似,不同之處在於:兩個該懸臂支架34的設置方向與該振動源50的設置位置。在本實施例中該振動源50設置該框架31的Y方向92,兩個該懸臂支架34呈平行該X方向91連接於該框架31。As shown in FIG. 15 , which is a bottom view of the eighth embodiment of the present invention, this embodiment is similar to the embodiment of FIG. 13 , the difference is that the setting directions of the two cantilever supports 34 and the setting directions of the vibration source 50 are Location. In this embodiment, the vibration source 50 is disposed in the Y direction 92 of the frame 31 , and the two cantilever brackets 34 are connected to the frame 31 parallel to the X direction 91 .

如圖16及圖17所示,為本創作第九實施例之分解圖及仰視圖。在本實施例中,該承框30還包括該連板35,該連板35連接於兩個該懸臂支架34之間且位於該鏤空區32內,該連板35可防止該基板20與該框架31下方的電子元件接觸,讓觸控回饋裝置在運作時更為安全。在本實施例中該振動源50產生的振動方向為X方向91,該懸臂支架34則平行於該Y方向92。As shown in FIG. 16 and FIG. 17 , it is an exploded view and a bottom view of the ninth embodiment of the present invention. In this embodiment, the support frame 30 further includes the connecting plate 35 , the connecting plate 35 is connected between the two cantilever brackets 34 and located in the hollow area 32 , and the connecting plate 35 can prevent the substrate 20 from contacting the The contact of the electronic components under the frame 31 makes the touch feedback device safer during operation. In this embodiment, the vibration direction generated by the vibration source 50 is the X direction 91 , and the cantilever bracket 34 is parallel to the Y direction 92 .

如圖18所示,為本創作第十實施例之仰視圖。本實施例與該圖16之實施例相似,不同之處在於:兩個該懸臂支架34的設置方向與該振動源50的設置位置。在本實施例中該振動源50設置該框架31的Y方向92,該懸臂支架34則呈平行該X方向91連接於該框架31。As shown in FIG. 18 , it is a bottom view of the tenth embodiment of the present invention. This embodiment is similar to the embodiment shown in FIG. 16 , and the difference lies in: the installation direction of the two cantilever supports 34 and the installation position of the vibration source 50 . In this embodiment, the vibration source 50 is disposed in the Y direction 92 of the frame 31 , and the cantilever bracket 34 is connected to the frame 31 parallel to the X direction 91 .

如圖19、圖20,為本創作第十一實施例之分解圖及仰視圖。本實施中是增加該振動源50的數目。該振動源50數目有兩個,分別設置於該框架31相對的兩邊,在本實施例中是設置於該X方向91。該懸臂支架34也設有兩個。本實施例仍滿足該振動源50產生的振動方向須與該懸臂支架34相互垂直的要求。兩個該振動源50雖設置於該框架31的X方向91,但該振動源50的振動方向是平行該X方向91,該懸臂支架34則平行於該Y方向92,由於設有兩組振動源50,本實施例所產生的振動回饋強度較大。Figures 19 and 20 are an exploded view and a bottom view of the eleventh embodiment of the present invention. In this embodiment, the number of the vibration sources 50 is increased. There are two vibration sources 50 , which are respectively disposed on opposite sides of the frame 31 , and are disposed in the X direction 91 in this embodiment. There are also two cantilever supports 34 . This embodiment still satisfies the requirement that the vibration direction generated by the vibration source 50 must be perpendicular to the cantilever support 34 . Although the two vibration sources 50 are arranged in the X direction 91 of the frame 31, the vibration direction of the vibration source 50 is parallel to the X direction 91, and the cantilever bracket 34 is parallel to the Y direction 92. For the source 50, the vibration feedback intensity generated by this embodiment is relatively high.

如圖21為本創作第十二實施例之仰視圖。本實施例與該圖19之實施例相似,不同之處在於:兩個該懸臂支架34的設置方向與兩個該振動源50的設置位置。在本實施例中兩個該振動源50設置該框架31的Y方向92,該懸臂支架34則呈平行該X方向91連接於該框架31。Figure 21 is a bottom view of the twelfth embodiment of the creation. This embodiment is similar to the embodiment shown in FIG. 19 , and the difference lies in the disposition directions of the two cantilever supports 34 and the disposition positions of the two vibration sources 50 . In this embodiment, the two vibration sources 50 are arranged in the Y direction 92 of the frame 31 , and the cantilever bracket 34 is connected to the frame 31 parallel to the X direction 91 .

如圖22、圖23,為本創作第十三實施例之分解圖及仰視圖。本實施例是改變該振動源50往復振動的方向。前述實施例中,該振動源50產生的振動方向皆平行於設置該框架3所在位置的方向,但並不以此為限。在本實施例中,該凸起架33仍於該框架31局部區段,該凸起架33雖設置於該X方向91但長度較上述實施例更長。該磁石組51仍由數個並排的該磁石511所構成,數個該磁石511朝下固定於該內壁331。該線圈組52仍包括數個該線圈521、該電路板522,數個該線圈521並排且固定於該電路板522,該電路板522固定於該搭接平板60,由該搭接接平板60呈懸臂狀連接於該基板20,本實施例中,該磁石511之N極及S極的磁極排列方向是平行於該Y方向92,因此該振動源50所產生振動方向為Y方向92。相對地兩個該懸臂支架34呈平行該X方向91連接於該框架31且位於該鏤空區32兩側。Figures 22 and 23 are an exploded view and a bottom view of the thirteenth embodiment of the present invention. In this embodiment, the direction of the reciprocating vibration of the vibration source 50 is changed. In the aforementioned embodiment, the vibration direction generated by the vibration source 50 is parallel to the direction where the frame 3 is located, but it is not limited thereto. In this embodiment, the protruding frame 33 is still in a partial section of the frame 31 . Although the protruding frame 33 is arranged in the X direction 91 , the length is longer than that in the above-mentioned embodiment. The magnet group 51 is still composed of a plurality of the magnets 511 arranged side by side, and the plurality of the magnets 511 are fixed to the inner wall 331 facing downward. The coil set 52 still includes a plurality of the coils 521 and the circuit board 522 . The coils 521 are arranged side by side and fixed on the circuit board 522 . The circuit board 522 is fixed on the overlapping plate 60 , and the overlapping plate 60 is connected by It is connected to the substrate 20 in a cantilever shape. In this embodiment, the magnetic pole arrangement direction of the N pole and the S pole of the magnet 511 is parallel to the Y direction 92 , so the vibration direction generated by the vibration source 50 is the Y direction 92 . In contrast, the two cantilever brackets 34 are connected to the frame 31 parallel to the X direction 91 and located on both sides of the hollow area 32 .

如圖24為本創作第十四實施例之仰視圖。本實施例與該圖22之實施例相似,不同之處在於:兩個該懸臂支架34的設置方向與該振動源50的設置位置。在本實施例中該振動源50設置該框架31的Y方向92,且產生垂直於Y方向92的振動方向,該懸臂支架34則呈平行該Y方向92連接於該框架31且位於該鏤空區32兩側。綜合以上所述,本創作該振動源50會依該磁石511及該線圈521的排列方式不同,形成不同的磁化方向,讓該振動源50往復振動方向為平行或垂直於所在處之該框架31,但振動方向須與該懸臂支架34延伸方向相垂直。Figure 24 is a bottom view of the fourteenth embodiment of the creation. This embodiment is similar to the embodiment shown in FIG. 22 , and the difference lies in: the installation direction of the two cantilever supports 34 and the installation position of the vibration source 50 . In this embodiment, the vibration source 50 is disposed in the Y direction 92 of the frame 31 and generates a vibration direction perpendicular to the Y direction 92 , and the cantilever bracket 34 is connected to the frame 31 parallel to the Y direction 92 and located in the hollow area 32 sides. Based on the above, in the present invention, the vibration source 50 will form different magnetization directions according to the arrangement of the magnet 511 and the coil 521 , so that the reciprocating vibration direction of the vibration source 50 is parallel or perpendicular to the frame 31 where it is located. , but the vibration direction must be perpendicular to the extension direction of the cantilever support 34 .

如圖25及圖26所示,為本創作第十五實施例之分解圖及側視圖。本實施例主要改變該磁石組51及該線圈組52的設置位置。在本實施例中,該振動源50仍包括該磁石組51及該線圈組52,但改由該線圈組52位於該容置空間332內,該磁石組51固定在該搭接平板60且位於基板20外側,該磁石組51位置對應該線圈組52且相隔一空隙53,當該振動源50運作時會帶動該基板20產生往復振動。具體而言,該線圈組52包括數個該線圈521及該電路板522,數個該線圈521並排且固定於該電路板522,再由該電路板522固定於該內壁331,另外在本實施例中,該電路板522局部為彎曲狀。該磁石組51包括數個該磁石511數個該磁石511則固定於該搭接平板60上,該搭接平板60還具有一窗口61,該窗口61供該電路板522局部的彎曲段延伸至此處,以供外部線路與之連接,如圖26所示,組裝後數個該磁石511位置對應著數個該線圈521且存在該空隙53。在本實施例中,該振動源50是產生振動方向是平行該X方向91,且垂直於該懸臂支架34的延伸方向。As shown in FIG. 25 and FIG. 26, it is an exploded view and a side view of the fifteenth embodiment of the present invention. In this embodiment, the arrangement positions of the magnet group 51 and the coil group 52 are mainly changed. In this embodiment, the vibration source 50 still includes the magnet set 51 and the coil set 52 , but the coil set 52 is located in the accommodating space 332 , and the magnet set 51 is fixed on the overlapping plate 60 and located in the accommodating space 332 . Outside the base plate 20 , the position of the magnet group 51 corresponds to the coil group 52 and is separated by a gap 53 . When the vibration source 50 operates, the base plate 20 is driven to vibrate back and forth. Specifically, the coil set 52 includes a plurality of the coils 521 and the circuit board 522 . The plurality of the coils 521 are arranged side by side and fixed on the circuit board 522 , and then the circuit board 522 is fixed on the inner wall 331 . In an embodiment, the circuit board 522 is partially curved. The magnet set 51 includes a plurality of the magnets 511 and the plurality of the magnets 511 are fixed on the overlapping plate 60 , and the overlapping plate 60 also has a window 61 for the partial bending section of the circuit board 522 to extend here. For connecting with external circuits, as shown in FIG. 26 , after assembly, the positions of the magnets 511 correspond to the coils 521 and the gap 53 exists. In this embodiment, the vibration source 50 generates vibration in a direction parallel to the X direction 91 and perpendicular to the extending direction of the cantilever bracket 34 .

同理,本創作該線圈組52固定於該凸起架33,該磁石組51固定於該搭接平板60的設計也能應用其他各種實施例中,例如此類該振動源50可位於該框架31的不同位置,或於該承架30設有至少一該懸臂支架34、該連板35,或是該框架31設有兩組振動源50等各種不同實施例的結構中。Similarly, in the present invention, the coil set 52 is fixed to the protruding frame 33, and the design of the magnet set 51 to the overlapping plate 60 can also be applied to other various embodiments, for example, the vibration source 50 can be located in the frame 31, or at least one cantilever bracket 34 and the connecting plate 35 are provided on the support frame 30, or the frame 31 is provided with two sets of vibration sources 50 and other structures in various embodiments.

綜合以上所述,本創作一種薄型化觸覺回饋裝置是係將該振動源50設置於該凸起架33與該搭接平板60之間且在該基板20觸覺有效區域外,讓該振動源50所在位置的尺寸小於整體觸覺回饋裝置的尺寸,藉此達到薄型化的目的。To sum up the above, a thin tactile feedback device of the present invention is to set the vibration source 50 between the protruding frame 33 and the overlapping plate 60 and outside the tactile effective area of the substrate 20 , so that the vibration source 50 is The size of the location is smaller than the size of the overall haptic feedback device, thereby achieving the purpose of thinning.

以上所述者,僅為本創作之較佳實施例而已,並非用來限定本創作實施例之範圍。即凡依本創作申請專利範圍所作的均等變化及修飾,皆為本創作之專利範圍所涵蓋。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention embodiments. That is, all equivalent changes and modifications made in accordance with the patented scope of this creation are covered by the patented scope of this creation.

11:基板 12:框架 13:緩衝墊 14:振動馬達 20:基板 30:承架 31:框架 32:鏤空區 33:凸起架 331:內壁 332:容置空間 34:懸臂支架 341:末端區 342:頸區段 35:連板 40:緩衝墊 50:振動源 51:磁石組 511:磁石 52:線圈組 521:線圈 522:電路板 53:空隙 60:搭接平板 61:窗口 91:X方向 92:Y方向 11: Substrate 12: Frame 13: Buffer 14: Vibration Motor 20: Substrate 30: Bracket 31: Frame 32: Hollow area 33: Raised shelf 331: Inner Wall 332: accommodating space 34: Cantilever bracket 341: terminal region 342: neck segment 35: even board 40: Cushion 50: Vibration source 51: Magnet set 511: Magnet 52: Coil set 521: Coil 522: circuit board 53: void 60: Lap plate 61: Window 91: X direction 92: Y direction

圖1為習用觸覺回饋裝置的分解圖;1 is an exploded view of a conventional haptic feedback device;

圖2為習用觸覺回饋裝置的側視圖;2 is a side view of a conventional haptic feedback device;

圖3為本創作薄型化觸覺回饋裝置第一實施例之立體圖;FIG. 3 is a perspective view of the first embodiment of the creation of a thin tactile feedback device;

圖4為本創作薄型化觸覺回饋裝置第一實施例之分解圖;4 is an exploded view of the first embodiment of the creation of a thin tactile feedback device;

圖5為本創作薄型化觸覺回饋裝置第一實施例之振動源所在位置的側面放大圖;FIG. 5 is an enlarged side view of the position of the vibration source of the first embodiment of the thinned haptic feedback device;

圖6為本創作薄型化觸覺回饋裝置第二實施例仰視角的立體圖;6 is a perspective view of a second embodiment of a thin tactile feedback device created from a bottom view;

圖7為本創作薄型化觸覺回饋裝置第三實施例之分解圖;FIG. 7 is an exploded view of the third embodiment of the creation of a thin tactile feedback device;

圖8為本創作薄型化觸覺回饋裝置第三實施例之仰視圖;FIG. 8 is a bottom view of a third embodiment of a thinned tactile feedback device;

圖9為本創作薄型化觸覺回饋裝置第四實施例之仰視圖;FIG. 9 is a bottom view of a fourth embodiment of a thinned tactile feedback device;

圖10為本創作薄型化觸覺回饋裝置第五實施例之分解圖;FIG. 10 is an exploded view of the fifth embodiment of the creation of a thin tactile feedback device;

圖11為本創作薄型化觸覺回饋裝置第五實施例之仰視圖;FIG. 11 is a bottom view of a fifth embodiment of a thinned tactile feedback device;

圖12為本創作薄型化觸覺回饋裝置第六實施例之仰視圖;FIG. 12 is a bottom view of the sixth embodiment of the thinned tactile feedback device;

圖13為本創作薄型化觸覺回饋裝置第七實施例之分解圖;FIG. 13 is an exploded view of the seventh embodiment of the creation of a thinned tactile feedback device;

圖14為本創作薄型化觸覺回饋裝置第七實施例之仰視圖;FIG. 14 is a bottom view of a seventh embodiment of a thinned tactile feedback device;

圖15為本創作薄型化觸覺回饋裝置第八實施例之仰視圖;FIG. 15 is a bottom view of the eighth embodiment of the thinned tactile feedback device;

圖16為本創作薄型化觸覺回饋裝置第九實施例之分解圖;FIG. 16 is an exploded view of a ninth embodiment of the creation of a thin tactile feedback device;

圖17為本創作薄型化觸覺回饋裝置第九實施例之仰視圖;FIG. 17 is a bottom view of a ninth embodiment of a thinned tactile feedback device;

圖18為本創作薄型化觸覺回饋裝置第十實施例之仰視圖;FIG. 18 is a bottom view of a tenth embodiment of a thinned tactile feedback device;

圖19為本創作薄型化觸覺回饋裝置第十一實施例的分解圖;FIG. 19 is an exploded view of an eleventh embodiment of a thinned tactile feedback device;

圖20為本創作薄型化觸覺回饋裝置第十一實施例之仰視圖;FIG. 20 is a bottom view of an eleventh embodiment of a thinned tactile feedback device;

圖21為本創作薄型化觸覺回饋裝置第十二實施例之仰視圖;21 is a bottom view of the twelfth embodiment of the twelfth embodiment of the creation of a thin tactile feedback device;

圖22為本創作薄型化觸覺回饋裝置第十三實施例之分解圖;FIG. 22 is an exploded view of the thirteenth embodiment of the creation of a thin tactile feedback device;

圖23為本創作薄型化觸覺回饋裝置第十三實施例之仰視圖;FIG. 23 is a bottom view of the thirteenth embodiment of the thinned tactile feedback device;

圖24為本創作薄型化觸覺回饋裝置第十四實施例之仰視圖;FIG. 24 is a bottom view of a fourteenth embodiment of a thinned tactile feedback device;

圖25為本創作薄型化觸覺回饋裝置第十五實施例之分解圖;FIG. 25 is an exploded view of a fifteenth embodiment of a thinned tactile feedback device;

圖26為本創作薄型化觸覺回饋裝置第十五實施例之振動源所在位置的側視放大圖。FIG. 26 is an enlarged side view of the position of the vibration source of the fifteenth embodiment of the thinned haptic feedback device.

20:基板 20: Substrate

30:承架 30: Bracket

31:框架 31: Frame

32:鏤空區 32: Hollow area

33:凸起架 33: Raised shelf

331:內壁 331: Inner Wall

40:緩衝墊 40: Cushion

50:振動源 50: Vibration source

51:磁石組 51: Magnet set

511:磁石 511: Magnet

52:線圈組 52: Coil set

521:線圈 521: Coil

522:電路板 522: circuit board

60:搭接平板 60: Lap plate

61:窗口 61: Window

91:X方向 91: X direction

92:Y方向 92: Y direction

Claims (16)

一種薄型化觸覺回饋裝置,包括: 一基板; 至少一搭接平板,該搭接平板固定於該基板且呈懸臂狀延伸至該基板外側; 一承架,包括一框架、由該框架所形成之一鏤空區及至少一凸起架,該凸起架為該框架局部區段,該凸起架呈U型且凸起方向與該框架上設置該基板的方向相同,該凸起架具有一內壁且形成一容置空間; 數個緩衝墊,固定於該基板及該框架之間; 至少一振動源,該振動源包括一磁石組及一線圈組,該磁石組與該線圈組固定於該凸起架與該搭接平板之間且位於該基板外側,該線圈組位置對應該磁石組且相隔一空隙,在觸控操作以手指按壓該基板時該空隙只會增加,並由該振動源運作帶動該基板產生往復振動。 A thin tactile feedback device, comprising: a substrate; at least one overlapping plate, the overlapping plate is fixed on the base plate and extends to the outside of the base plate in a cantilever shape; a support frame, including a frame, a hollow area formed by the frame and at least one raised frame, the raised frame is a partial section of the frame, the raised frame is U-shaped and the raised direction is the same as that on the frame The directions for disposing the base plate are the same, and the protruding frame has an inner wall and forms an accommodating space; a plurality of buffer pads fixed between the base plate and the frame; At least one vibration source, the vibration source includes a magnet group and a coil group, the magnet group and the coil group are fixed between the raised frame and the overlapping plate and are located outside the base plate, the position of the coil group corresponds to the magnet The groups are separated by a gap, and the gap will only increase when the substrate is pressed by a finger in a touch operation, and the vibration source will drive the substrate to vibrate back and forth. 如請求項1所述之薄型化觸覺回饋裝置,該凸起架的凸起高度低於該基板頂面,且該振動源所在位置的堆疊尺寸小於該基板與該承架堆疊後的尺寸。The thin tactile feedback device according to claim 1, wherein the protrusion height of the protruding frame is lower than the top surface of the substrate, and the stack size at the location where the vibration source is located is smaller than the stack size of the substrate and the support frame. 如請求項1所述之薄型化觸覺回饋裝置,該磁石組位於該容置空間,該線圈組固定在該搭接平板,該磁石組包括數個並排的磁石,數個該磁石固定在該內壁,該線圈組包括數個線圈及一電路板,數個該線圈並排固定在該電路板,該電路板固定在該搭接平板,使數個該線圈於該基板外側且上方位置對應著數個該磁石。The thin tactile feedback device according to claim 1, wherein the magnet set is located in the accommodating space, the coil set is fixed on the overlapping plate, the magnet set includes a plurality of magnets side by side, and a plurality of the magnets are fixed in the interior wall, the coil set includes a plurality of coils and a circuit board, a plurality of the coils are fixed on the circuit board side by side, and the circuit board is fixed on the overlapping plate, so that a plurality of the coils are outside the substrate and the upper position corresponds to a plurality of the magnet. 如請求項1所述之薄型化觸覺回饋裝置,該線圈組位於該容置空間,該磁石組固定在該搭接平板,該線圈組包括數個線圈及一電路板,數個該線圈並排且固定在該電路板,該電路板固定在該內壁,該磁石組包括數個並排的磁石,數個該磁石固定在該搭接平板,使數個該磁石於該基板外側且上方位置對應著數個該線圈。The thin tactile feedback device according to claim 1, wherein the coil set is located in the accommodating space, the magnet set is fixed on the overlapping plate, the coil set includes a plurality of coils and a circuit board, and a plurality of the coils are side by side and Fixed on the circuit board, the circuit board is fixed on the inner wall, the magnet group includes several magnets side by side, and several of the magnets are fixed on the overlapping plate, so that several of the magnets are on the outside of the substrate and the upper position corresponds to the number of magnets. this coil. 如請求項3或4所述之薄型化觸覺回饋裝置,該磁石的磁極排列方向平行該振動源所在處的該框架,該振動源產生往復振動方向是平行於該框架。According to the thin tactile feedback device according to claim 3 or 4, the magnetic pole arrangement direction of the magnet is parallel to the frame where the vibration source is located, and the reciprocating vibration direction of the vibration source is parallel to the frame. 如請求項3或4所述之薄型化觸覺回饋裝置,該磁石的磁極排列方向垂直該振動源所在處的該框架,該振動源產生往復振動方向是垂直於該框架。According to the thin tactile feedback device according to claim 3 or 4, the magnetic pole arrangement direction of the magnet is perpendicular to the frame where the vibration source is located, and the reciprocating vibration direction of the vibration source is perpendicular to the frame. 如請求項1所述之薄型化觸覺回饋裝置,該框架具有至少一懸臂支架,該懸臂支架局部固著於該基板 ,且該懸臂支架的延伸方向與該振動源的往復振動方向相垂直。The thin tactile feedback device according to claim 1, wherein the frame has at least one cantilever bracket, the cantilever bracket is partially fixed to the substrate, and the extension direction of the cantilever bracket is perpendicular to the reciprocating vibration direction of the vibration source. 如請求項7所述之薄型化觸覺回饋裝置,該懸臂支架遠離連接該框架的一端為一末端區,並由該末端區固著於該基板。According to the thin tactile feedback device as claimed in claim 7, one end of the cantilever bracket away from connecting with the frame is an end region, and is fixed to the substrate by the end region. 如請求項7所述之薄型化觸覺回饋裝置,該懸臂支架還形成寛度較窄的至少一頸區段。According to the thin tactile feedback device of claim 7, the cantilever bracket further forms at least one neck section with a narrower width. 如請求項7所述之薄型化觸覺回饋裝置,該承架還包括一連板,該連板連接於該懸臂支架且位於該鏤空區內。According to the thin tactile feedback device of claim 7, the support frame further comprises a connecting plate, the connecting plate is connected to the cantilever bracket and is located in the hollow area. 如請求項1所述之薄型化觸覺回饋裝置,該框架具有至少一對懸臂支架,該對懸臂支架相互平行且位於該鏤空區兩側,該懸臂支架局部固著於該基板,且該懸臂支架的延伸方向與該振動源往復振動方向相垂直。The thin tactile feedback device according to claim 1, the frame has at least a pair of cantilever brackets, the pair of cantilever brackets are parallel to each other and are located on both sides of the hollow area, the cantilever brackets are partially fixed to the substrate, and the cantilever brackets The extension direction of the vibration source is perpendicular to the reciprocating vibration direction of the vibration source. 如請求項11所述之薄型化觸覺回饋裝置,該懸臂支架遠離連接該框架的一端為一末端區,並由該末端區固著於該基板。According to the thin tactile feedback device as claimed in claim 11, one end of the cantilever bracket away from connecting with the frame is an end area, and is fixed to the substrate by the end area. 如請求項11所述之薄型化觸覺回饋裝置,該懸臂支架還形成寛度較窄的至少一頸區段。According to the thin tactile feedback device of claim 11, the cantilever bracket further forms at least one neck section with a narrower width. 如請求項11所述之薄型化觸覺回饋裝置,該承架還包括一連板,該連板連接於兩個該懸臂支架且位於該鏤空區內。The thin tactile feedback device according to claim 11, the support frame further comprises a connecting plate, the connecting plate is connected to the two cantilever brackets and is located in the hollow area. 如請求項1所述之薄型化觸覺回饋裝置,該振動源設有數組且位於相對位置及數目的該凸起架與該搭接平板之間,該框架具有至少一懸臂支架,該振動源往復振動方向相互平行且皆垂直該懸臂支架的延伸方向。The thin tactile feedback device according to claim 1, the vibration source is provided with an array and is located between the protruding frame and the overlapping plate in relative positions and numbers, the frame has at least one cantilever support, and the vibration source reciprocates The vibration directions are parallel to each other and are perpendicular to the extending direction of the cantilever support. 如請求項1所述之薄型化觸覺回饋裝置,該基板為觸控板、平面鍵盤、平板電腦之觸控螢幕等其中一種。According to the thin tactile feedback device of claim 1, the substrate is one of a touch panel, a flat keyboard, a touch screen of a tablet computer, and the like.
TW110213758U 2021-11-19 2021-11-19 Slim type tactile feedback device TWM624511U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116954353A (en) * 2022-04-19 2023-10-27 台睿精工股份有限公司 Force sensing module for providing vibration feedback
TWI876452B (en) * 2023-08-02 2025-03-11 台睿精工股份有限公司 A vibration feedback device and control method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116954353A (en) * 2022-04-19 2023-10-27 台睿精工股份有限公司 Force sensing module for providing vibration feedback
TWI876452B (en) * 2023-08-02 2025-03-11 台睿精工股份有限公司 A vibration feedback device and control method thereof

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