TWM618161U - Low numerical aperture fiber output diode laser module - Google Patents
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- 239000000835 fiber Substances 0.000 title claims abstract description 38
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Abstract
本創作開發一款新型的光纖輸出二極體雷射模組,將數顆獨立的二極體雷射,經由新設計之光束準直及空間合併,耦光進入纖核直徑105um,數值孔徑0.12光纖,相較於一般產品數值孔徑0.22光纖,出光角度降為55%,並用一般藍光雷射二極體進行驗證,先利用光學軟體協助進行光學鏡片參數之設計及優化,在實驗上,將8顆藍光二極體雷射,經由理論設計的光學鏡片組件進行精密組裝,耦光進入纖核直徑105um、數值孔徑0.12的光纖,達到功率30W的藍光雷射輸出,亦成為最小數值孔徑藍光雷射。This creation develops a new type of fiber output diode laser module, which combines several independent diode lasers through the newly designed beam collimation and spatial integration, and the coupling light enters the fiber core with a diameter of 105um and a numerical aperture of 0.12. Compared with the 0.22 NA optical fiber, the optical fiber has a light output angle of 55%. It is verified with a general blue laser diode. The optical software is first used to assist in the design and optimization of the optical lens parameters. In the experiment, 8 A blue diode laser is precisely assembled through a theoretically designed optical lens assembly. The light is coupled into a fiber with a core diameter of 105um and a numerical aperture of 0.12 to achieve a blue laser output with a power of 30W, which becomes the smallest numerical aperture blue laser. .
Description
本創作係有關一種低數值孔徑光纖輸出二極體雷射模組,其光學鏡片組件的準直及空間的光束合併,耦光進入纖核至低數值孔徑。This creation is related to a low numerical aperture fiber output diode laser module. The collimation of the optical lens components and spatial beam combination, couple the light into the fiber core to a low numerical aperture.
高亮度雷射乃今日材料加工、醫療、軍事、立體影視等應用之重要元件。半導體雷射因具可量產性、低成本、小體積及高電光轉換效率等特性,乃成為今日及未來製造高亮度雷射之首選。因此半導體雷射利用光纖輸出光束,獲得較高亮度,行之久已。但半導體雷射在輸出功率越大時,輸出光束品質會變差。若在配合現有一般纖核直徑105um作為輸出端,則光束參數積(Beam Parameter Product, BPP)將大於10mm*mrad,難以呈現高亮度。也因此使半導體雷射的應用,無法擴展至更大的用途。是以,本創作人有鑑於上揭問題點,乃構思一種具有低數值孔徑光纖輸出的高亮度二極體雷射模組,為本創作所欲解決的課題。High-brightness lasers are important components for today's material processing, medical, military, and 3D film and television applications. Semiconductor lasers have become the first choice for manufacturing high-brightness lasers today and in the future because of their mass production, low cost, small size, and high electro-optical conversion efficiency. Therefore, semiconductor lasers use optical fibers to output light beams to obtain higher brightness, which has been used for a long time. However, the higher the output power of the semiconductor laser, the lower the quality of the output beam. If it is used as the output end with the existing general fiber core diameter of 105um, the beam parameter product (BPP) will be greater than 10mm*mrad, which makes it difficult to present high brightness. Therefore, the application of semiconductor lasers cannot be extended to larger uses. Therefore, in view of the above-mentioned problems, the creator conceived a high-brightness diode laser module with a low numerical aperture fiber output, which is the subject of this creation.
緣是,本創作之主要目的,係在提供一種低數值孔徑光纖輸出二極體雷射模組,其採用低數值孔徑之輸出光纖,使光束發散角較小之功效增進。The reason is that the main purpose of this creation is to provide a low numerical aperture fiber output diode laser module, which uses a low numerical aperture output fiber to improve the efficiency of the beam divergence angle.
本創作之另一目的,係在提供一種低數值孔徑光纖輸出二極體雷射模組,其採用高羥值,使光纖對波長<460nm之雷射,具有較佳之穿透率之功效增進。Another purpose of this creation is to provide a low numerical aperture fiber output diode laser module, which uses a high hydroxyl value, so that the fiber has a better penetration rate for lasers with a wavelength of less than 460nm.
本創作之又一目的,係在提供一種低數值孔徑光纖輸出二極體雷射模組,其光纖端面採用光束切割方式,有別於一般研磨拋光,此方法具有快速切割且適於量產之功效增進。Another purpose of this creation is to provide a low numerical aperture fiber output diode laser module. The fiber end face adopts a beam cutting method, which is different from general grinding and polishing. This method has fast cutting and is suitable for mass production. Increased efficacy.
本創作之另一目的,係在提供一種低數值孔徑光纖輸出二極體雷射模組,其雷射晶片封裝於氣密環境,以提升雷射長期的耐用性之功效增進。Another purpose of this creation is to provide a low numerical aperture fiber output diode laser module whose laser chip is packaged in an airtight environment to enhance the efficiency of the long-term durability of the laser.
本創作之再一目的,係在提供一種低數值孔徑光纖輸出二極體雷射模組,其雷射晶片的共振腔鍍上反射膜,採用反射率≧20%的鍍膜,以承受更高的外部反射光之功效增進。Another purpose of this creation is to provide a low numerical aperture fiber output diode laser module, the resonant cavity of the laser chip is coated with a reflective film, and a coating with a reflectivity of ≧20% is used to withstand higher The effect of external reflected light is improved.
為達上述目的,本創作採用之技術手段包含:一外殼;複數雷射二極體,其位在該外殼內,並激發出複數光束;一光學鏡片組件,其位在該外殼內,並將各該光束分別準直後,而在空間合併成一合併光束;以及一光纖,具有一纖核,且該光纖輸出設定一低數值孔徑,並將該光纖結合在該外殼之側面,使該合併光束可耦合於該纖核至該低數值孔徑。To achieve the above purpose, the technical means used in this creation include: a housing; a plurality of laser diodes, which are located in the housing, and excite multiple light beams; an optical lens assembly, which is located in the housing, and After each of the beams are collimated, they are combined into a combined beam in space; and an optical fiber having a core, and the output of the optical fiber is set to a low numerical aperture, and the optical fiber is combined on the side of the housing, so that the combined beam can be Coupled to the core to the low numerical aperture.
依據前揭特徵,該纖核直徑為105um;該低數值孔徑為0.12。According to the aforementioned features, the diameter of the core is 105um; the low numerical aperture is 0.12.
依據前揭特徵,該光纖採用高羥值。According to the features disclosed above, the optical fiber adopts a high hydroxyl value.
依據前揭特徵,該光纖端面採用光束切割方式。According to the features disclosed above, the optical fiber end face adopts a beam cutting method.
依據前揭特徵,該光纖輸出端採用一透明窗鏡,該透明窗鏡配合一氣密焊料。According to the features disclosed above, the optical fiber output end adopts a transparent window mirror, and the transparent window mirror is matched with an air-tight solder.
依據前揭特徵,該雷射二極體包括一雷射晶片,該雷射晶片具有一共振腔,該共振腔端面形成一鏡面而可鍍上一反射膜,該反射膜之反射率≧20%。According to the features disclosed above, the laser diode includes a laser chip having a resonant cavity. The end surface of the resonant cavity forms a mirror surface and can be coated with a reflective film. The reflectivity of the reflective film is ≧20% .
依據前揭特徵,該雷射二極體至少8顆以上。According to the aforementioned features, there are at least 8 laser diodes.
依據前揭特徵,該雷射二極體之波長為450nm。According to the aforementioned features, the wavelength of the laser diode is 450 nm.
依據前揭特徵,該光學鏡片組件包括複數快軸準直鏡、複數慢軸準直鏡、複數反射鏡,且各該光束經過各該快軸準直鏡、各該慢軸準直鏡分別準直後,並經過各該反射鏡後,而在空間合併成一合併光束,該合併光束經由該聚焦鏡可耦合至該纖核。According to the aforementioned features, the optical lens assembly includes a plurality of fast-axis collimators, a plurality of slow-axis collimators, and a complex mirror, and each of the light beams passes through each of the fast-axis collimators and each of the slow-axis collimators. Straight back and after passing through each of the reflecting mirrors, they are spatially combined into a combined light beam, and the combined light beam can be coupled to the core through the focusing mirror.
依據前揭特徵,該外殼包括一座體及一封蓋,該座體設有一凹槽,該凹槽具有一台階,該台階可承放各該雷射二極體,使各該雷射二極體之間可並行排列,且各該快軸準直鏡設在該台階上,而靠近各該雷射二極體之前方,又各該慢軸準直鏡與各該反射鏡設在該凹槽上,而各該慢軸準直鏡設在各該快軸準直鏡之前方、各該反射鏡設在各該慢軸準直鏡之前方,再該聚焦鏡設在各該反射鏡之側邊與該聚焦鏡結合在該凹槽之側面,並配合該聚焦鏡之位置相對應該纖核之位置。According to the features of the foregoing disclosure, the housing includes a base and a cover, the base is provided with a groove, the groove has a step, and the step can hold each of the laser diodes so that each of the laser diodes The bodies can be arranged in parallel, and each of the fast-axis collimating mirrors is arranged on the step, and is close to the front of each of the laser diodes, and each of the slow-axis collimating mirrors and each of the reflecting mirrors are arranged on the concave On the groove, and each of the slow axis collimating mirrors is arranged in front of each of the fast axis collimating mirrors, each of the reflecting mirrors is arranged in front of each of the slow axis collimating mirrors, and then the focusing mirror is arranged on each of the reflecting mirrors The side edge and the focusing lens are combined on the side surface of the groove, and the position of the focusing lens is matched with the position of the fiber core.
藉助上揭技術手段,本創作具有如下的功效增進需再闡明者: 一、在於產生更小角度且耐用性更優的雷射產品,可以讓半導體雷射的應用,擴展至更大的用途,例如雷射焊接及金屬3D列印等。 二、亮度考量上,採用高羥值且數值孔徑為NA0.12之輸出光纖,在相同纖核直徑105um的條件下,其光束品質的光束參數積(Beam Parameter Product, BPP)只有一般NA0.22光纖的55%,且光纖對波長<460nm之雷射,具有較佳之穿透率。 三、光纖端面採用光束切割方式,有別於一般研磨拋光,此方法具有快速切割且於量產。 四、雷射晶片封裝於氣密環境,以提升雷射長期的耐用性。實作上除了用焊接密封上封蓋外,光纖輸出端採用透明窗鏡配合氣密焊料,使雷射可以操作在氣密環境,避免環境空氣對共振腔的鏡面造成汙染。 五、雷射晶片的共振腔鍍上反射膜,採用較高反射率的鍍膜,用以承受較高的反射功率。一般高功率雷射二極體考慮出光效率,鍍膜反射率多設定在 10%以下,可以得到電光轉換效率大於50%的出光效率,但缺點在於對反射光較敏感,特別是對直接半導體雷射加工的用途。實作上將鍍膜反射率提高到 20%以上,可以承受更高的反射光,特別在雷射加工的用途。 With the help of revealing technical means, this creation has the following effects to enhance those who need to be further clarified: 1. Laser products with smaller angles and better durability can expand the application of semiconductor lasers to larger applications, such as laser welding and metal 3D printing. 2. In terms of brightness, the output fiber with high hydroxyl value and NA0.12 numerical aperture is used. Under the condition of the same core diameter of 105um, the beam parameter product (BPP) of its beam quality is only general NA0.22 55% of the optical fiber, and the optical fiber has a better penetration rate for lasers with a wavelength of <460nm. 3. The optical fiber end face adopts the beam cutting method, which is different from general grinding and polishing. This method has fast cutting and is suitable for mass production. 4. The laser chip is packaged in an airtight environment to enhance the long-term durability of the laser. In practice, in addition to sealing the upper cover by welding, the optical fiber output end adopts a transparent window mirror with air-tight solder, so that the laser can be operated in an air-tight environment and avoid environmental air pollution to the mirror surface of the resonant cavity. 5. The resonant cavity of the laser chip is coated with a reflective film, and a coating with a higher reflectivity is used to withstand higher reflected power. Generally, high-power laser diodes take into account the light output efficiency, and the coating reflectivity is mostly set below 10%. The light output efficiency of the electro-optical conversion efficiency is greater than 50%, but the disadvantage is that it is more sensitive to reflected light, especially for direct semiconductor lasers. Processing purpose. In practice, the reflectivity of the coating is increased to more than 20%, which can withstand higher reflected light, especially for laser processing purposes.
首先,請參閱圖1~圖5B所示,本創作一種低數值孔徑光纖輸出二極體雷射模組,包括:一外殼10,在本實施例中,該外殼10包括一座體11及一封蓋12,該座體11設有一凹槽111,該凹槽111具有一台階112,該台階112可承放各該雷射二極體20,使各該雷射二極體20之間可並行排列,但不限定於此。此外,該外殼10之形狀與大小不限定於圖式。First of all, please refer to Figures 1 to 5B. This creation of a low numerical aperture fiber output diode laser module includes: a
複數雷射二極體20,其位在該外殼10內,並激發出複數光束21,在本實施例中,該雷射二極體20為藍光雷射二極體、紅色雷射二極體、綠色雷射二極體或UV雷射二極體其中之一所構成,亦可經由此法達成高亮度需求;該雷射二極體20至少8顆以上;該雷射二極體20之波長為400nm~670nm,亦從UV至紅光,但不限定於此。A
一光學鏡片組件30,其位在該外殼10內,並將各該光束21分別準直後,而在空間(S)合併成一合併光束(L),在本實施例中,該光學鏡片組件30包括複數快軸準直鏡31、複數慢軸準直鏡32、複數反射鏡33及一聚焦鏡34,各該快軸準直鏡31設在該台階112上,而靠近各該雷射二極體20之前方,又各該慢軸準直鏡32與各該反射鏡33設在該凹槽111上,而各該慢軸準直鏡32設在各該快軸準直鏡31之前方、各該反射鏡33設在各該慢軸準直鏡32之前方,使各該光束21經過各該快軸準直鏡31、各該慢軸準直鏡32分別準直後,並經過各該反射鏡33後,而在空間(S)合併成一合併光束(L),但不限定於此。An
承上,在本實施例中,如圖2C所示,該雷射二極體20包括一雷射晶片22,該雷射晶片22具有一共振腔221,該共振腔221端面形成一鏡面222而可鍍上一反射膜223,該反射膜223之反射率≧20%,但不限定於此。In addition, in this embodiment, as shown in FIG. 2C, the
一光纖40,具有一纖核(Core Optical Fiber)41,且該光纖40輸出設定一低數值孔徑42,並結合在該外殼10之側面101,使該合併光束(L)可耦合於該纖核41至該低數值孔徑(Numerical Aperture,NA)42,在本實施例中,該聚焦鏡34設在各該反射鏡33之側邊與該聚焦鏡34結合在該凹槽111之側面1111,並配合該聚焦鏡34之位置相對應該纖核41之位置,使該合併光束(L)經由該聚焦鏡34可耦合至該纖核41,但不限定於此。An
承上,在本實施例中,如圖3C所示,其該纖核41直徑(d)為105um,配合該低數值孔徑42為0.12,而數值孔徑定義為NA=sinα,該α為輸出光錐角,且該光纖40採用高羥(Hydroxyl,OH)值與該光纖40端面43採用光束切割,但不限定於此。此外,在另一實施例中,如圖3D所示,該光纖40輸出端44採用一透明窗鏡45,該透明窗鏡45配合一氣密焊料46,但不限定於此。On the other hand, in this embodiment, as shown in Figure 3C, the diameter (d) of the
一光學軟體50,其對該雷射二極體20進行驗證,便於該光學鏡片組件30參數之設計及優化,達到理論耦光效率90%以上,但不限定於此。An
基於如此之構成,採用數值孔徑≦NA0.12之輸出光纖,光束發散角較小,又採用高羥值,使該光纖40對波長<460nm之雷射,具有較佳之穿透率,另該光纖40端面43採用光束切割方式,有別於一般研磨拋光,此方法具有快速切割,適於量產且減少因研磨產生的鏡面損傷,加上該雷射晶片22封裝於氣密環境,以提升雷射長期的耐用性,及該雷射晶片22的該共振腔221鍍上該反射膜223,採用反射率≧20%的鍍膜,以承受更高的外部反射光,特別在雷射加工的用途,並配合圖4所示,其8顆藍光雷射空間光束合併之示意圖;圖5A所示,其為光纖輸出藍光雷射的輸出光功率對電流,而以波長為450nm、該纖核41直徑(d)為105um、數值孔徑≦NA0.12為條件,形成光纖耦合(Fibre Coupled, FC)模組(Module);圖5B所示,其為光纖輸出藍光雷射的輸出光功率轉換效率(power conversion efficiency, PCE),而波長為450nm、該纖核41直徑(d)為105um、數值孔徑≦NA0.12為條件,形成光纖耦合(Fibre Coupled, FC)模組(Module),但不限定於此。Based on such a configuration, the output fiber with a numerical aperture≦NA0.12 is used, the beam divergence angle is small, and the high hydroxyl value is used, so that the
綜上所述,本創作所揭示之技術手段,確具「新穎性」、「進步性」及「可供產業利用」等新型專利要件,祈請 鈞局惠賜專利,以勵創作,無任德感。In summary, the technical means disclosed in this creation do have new patent requirements such as "novelty", "progressiveness" and "available for industrial use". I pray that the Jun Bureau will grant patents to encourage creation without any responsibility. Sense of virtue.
惟,上述所揭露之圖式、說明,僅為本創作之較佳實施例,大凡熟悉此項技藝人士,依本案精神範疇所作之修飾或等效變化,仍應包括在本案申請專利範圍內。However, the above-mentioned diagrams and descriptions are only the preferred embodiments of this creation. Anyone familiar with the art, modifications or equivalent changes made in accordance with the spirit of this case should still be included in the scope of the patent application in this case.
10:外殼 101:外殼之側面 11:座體 111:凹槽 1111:凹槽之側面 112:台階 12:封蓋 20:雷射二極體 21:複數光束 22:雷射晶片 221:共振腔 222:鏡面 223:反射膜 30:光學鏡片組件 31:快軸準直鏡 32:慢軸準直鏡 33:反射鏡 34:聚焦鏡 40:光纖 41:纖核 42:低數值孔徑 43:光纖端面 44:光纖輸出端 45:透明窗鏡 46:氣密焊料 50:光學軟體 S:空間 L:合併光束 d:直徑 α:輸出光錐角10: Shell 101: The side of the shell 11: Seat 111: Groove 1111: The side of the groove 112: steps 12: capping 20: Laser diode 21: Complex beam 22: Laser chip 221: Resonant Cavity 222: Mirror 223: reflective film 30: Optical lens assembly 31: fast axis collimator 32: Slow axis collimator 33: mirror 34: Focusing lens 40: Optical fiber 41: Fiber Nucleus 42: Low numerical aperture 43: fiber end face 44: Fiber output 45: Transparent window mirror 46: hermetic solder 50: optical software S: Space L: combined beam d: diameter α: Output light cone angle
圖1係本創作未封蓋之立體圖。 圖2A係本創作未封蓋之前視圖。 圖2B係圖2A中2B所示之放大圖。 圖2C係本創作雷射晶片之示意圖。 圖3A係本創作已封蓋之立體圖。 圖3B係圖3A中3B-3B之斷面剖視圖。 圖3C係本創作光纖之示意圖。 圖3D係本創作透明窗鏡配合氣密焊料之示意圖。 圖4係本創作8顆藍光雷射空間光束合併之示意圖。 圖5A係本創作光纖輸出藍光雷射的輸出光功率對電流圖。 圖5B係本創作光纖輸出藍光雷射的輸出光功率轉換效率圖。 Figure 1 is an uncovered three-dimensional view of this creation. Figure 2A is an uncovered view of this creation. Fig. 2B is an enlarged view of 2B shown in Fig. 2A. Figure 2C is a schematic diagram of the creative laser chip. Figure 3A is a three-dimensional view of this creation with its cover. Fig. 3B is a cross-sectional view of 3B-3B in Fig. 3A. Figure 3C is a schematic diagram of the creative optical fiber. Figure 3D is a schematic diagram of this creative transparent window mirror with air-tight solder. Figure 4 is a schematic diagram of the spatial beam combining of 8 blue lasers in this creation. Figure 5A is a graph of the output optical power versus current of the optical fiber output blue laser of this invention. Figure 5B is a graph of the output optical power conversion efficiency of the original optical fiber output blue laser.
40:光纖 40: Optical fiber
41:纖核 41: Fiber Nucleus
42:低數值孔徑 42: Low numerical aperture
43:端面 43: end face
d:直徑 d: diameter
α:輸出光錐角 α: Output light cone angle
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