TWM613132U - Expansion card assembly and water cooling device - Google Patents

Abstract

An expansion card assembly includes an interface card, a water cooling device and an airflow generator. The water cooling device includes a water cooling head and a water cooling row. The water cooling head is thermally coupled to the heat source of the interface card. The water cooling row is connected with the water cooling head and forms a circulation channel together. The water cooling row includes a first water tank, a second water tank, a first heat dissipation channel structure, and a second heat dissipation channel structure. The opposite sides of the first heat dissipation channel structure and the second heat dissipation channel structure respectively communicate with the first water tank and the second water tank, and are separated from each other to form an accommodating space between the first heat dissipation channel structure and the second heat dissipation channel structure. The air flow generator is located in the accommodating space, and is used to generate air flow to the first heat dissipation channel structure and the second heat dissipation channel structure of the water cooling row.

Description

Expansion card assembly and water cooling heat dissipation device

The present invention relates to an expansion card assembly and a water-cooling heat dissipation device, in particular to an expansion card assembly and a water-cooling heat dissipation device with a cross-blowing heat dissipation method.

With the development and advancement of technology, computers have gradually become an indispensable necessity in people's daily lives. In order to make the computer meet various functional requirements, the motherboard of the computer usually has multiple function expansion slots for installing these expansion cards such as graphics card, sound card, network card, etc. to enhance its additional functions . Since the function expansion card is in operation, the current in the circuit will generate heat energy due to the influence of impedance. If this heat energy cannot be effectively eliminated and accumulates on the electronic components inside the function expansion card, the electronic components may increase due to continuous increase. Temperature and damage.

In order to improve the heat dissipation efficiency of the function expansion card, a heat sink is generally used to quickly take away the heat generated by the function expansion card. However, the current heat dissipation device still has insufficient heat dissipation efficiency for the function expansion card. Therefore, how to further improve the heat dissipation efficiency of the function expansion card by the heat dissipation device has become a major design issue.

The invention provides an expansion card assembly and a water-cooling heat dissipation device, so as to improve the heat dissipation efficiency of the function expansion card by the heat dissipation device.

The expansion card assembly disclosed in an embodiment of the present invention includes an interface card, a water cooling device and an airflow generator. The water cooling device includes a water cooling head and a water cooling row. The water cooling head is thermally coupled to the heat source of the interface card. The water cooling row is connected with the water cooling head and forms a circulation channel together. The water cooling row includes a first water tank, a second water tank, a first heat dissipation channel structure, and a second heat dissipation channel structure. The opposite sides of the first heat dissipation channel structure and the second heat dissipation channel structure respectively communicate with the first water tank and the second water tank, and are separated from each other to form an accommodating space between the first heat dissipation channel structure and the second heat dissipation channel structure. The air flow generator is located in the accommodating space, and is used to generate air flow to the first heat dissipation channel structure and the second heat dissipation channel structure of the water cooling row.

The water cooling device disclosed in another embodiment of the present invention is used for thermally coupling to an interface card. The water cooling device includes a water cooling head and a water cooling row. The water cooling head is thermally coupled to the heat source of the interface card. The water cooling row is connected with the water cooling head and forms a circulation channel together. The water cooling row includes a first water tank, a second water tank, a first heat dissipation channel structure, and a second heat dissipation channel structure. The opposite sides of the first heat dissipation channel structure and the second heat dissipation channel structure respectively communicate with the first water tank and the second water tank, and are separated from each other to form an accommodating space between the first heat dissipation channel structure and the second heat dissipation channel structure.

According to the expansion card assembly and the water-cooled heat dissipation device of the above embodiment, since the first heat dissipation channel structure and the second heat dissipation channel structure of the water cooling row are located on opposite sides of the airflow generator instead of the same side, the first heat dissipation channel structure can be shortened Or the distance between the fluid conveying member farthest from the airflow generator in the second heat dissipation channel structure and the airflow generator, so as to prevent the fluid conveying member farthest from the airflow generator from being blown into by hot air and improve the heat dissipation efficiency.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principles of the present invention and provide a further explanation of the scope of the patent application of the present invention.

10: Expansion card assembly

100: interface card

110: circuit board

111: component setting surface

120: bezel

200: Water-cooled heat sink

210: water block

211: Thermal contact surface

2121: Heat Exchange Chamber

2122: Impeller housing cavity

213: fluid inlet

214: fluid outlet

215: Impeller

216: cooling column

220: water cooling row

221: first water tank

2211: first chamber

2212: second chamber

222: second water tank

2221: Third Chamber

223: first heat dissipation channel structure

2231: fluid conveying parts

2232: heat dissipation structure

224: Second heat dissipation channel structure

2241: fluid conveying parts

2242: heat dissipation structure

225: First fluid connector

226: Second fluid connector

230: first stream pipe

240: second flow tube

300: Airflow generator

A: Side by side direction

N: Normal direction

S: accommodating space

FIG. 1 is a three-dimensional schematic diagram of the expansion card assembly according to the first embodiment of the present invention.

Fig. 2 is an exploded schematic diagram of the water-cooled heat dissipation device of Fig. 1.

3 to 5 are schematic cross-sectional views of the water cooling row of FIG. 1.

6 is a schematic cross-sectional view of the water cooling row according to the second embodiment of the present invention.

Please refer to Figure 1 to Figure 5. FIG. 1 is a three-dimensional schematic diagram of the expansion card assembly according to the first embodiment of the present invention. Fig. 2 is an exploded schematic diagram of the water-cooled heat dissipation device of Fig. 1. 3 to 5 are schematic cross-sectional views of the water cooling row of FIG. 1.

The expansion card assembly 10 of this embodiment is, for example, a display card assembly. The expansion card assembly 10 includes an interface card 100, a water cooling device 200 and an airflow generator 300. The interface card 100 is, for example, a display card. The interface card 100 includes a circuit board 110 and a baffle 120. The baffle 120 is disposed on one side of the circuit board 110. The circuit board 110 is mounted on a casing (not shown), for example, through a baffle 120, and the baffle 120 has a plurality of openings for input and output connectors (not shown) to pass through. The input/output connector is, for example, a signal transmission port.

The water cooling device 200 includes a water cooling head 210 and a water cooling row 220. The water cooling head 210 and the water cooling bank 220 are connected, so that a cooling fluid forms a cooling cycle in the water cooling head 210 and the water cooling bank 220. The cooling fluid is, for example, water or refrigerant. The water cooling head 210 has a thermal contact surface 211. The thermal contact surface 211 is thermally coupled to a heat source of the interface card 100, such as a processor. The water cooling head 210 has a heat exchange chamber 2121, an impeller accommodating cavity 2122, a fluid inlet 213 and a fluid outlet 214. The heat exchange chamber 2121 is connected to the impeller accommodating cavity 2122, and the thermal contact surface 211 corresponds to the heat exchange chamber 2121. The fluid inlet 213 and the fluid outlet 214 respectively communicate with the impeller housing cavity 2122 and the heat exchange chamber 2121. The water cooling head 210 may also include an impeller 215. impeller 215 is located in the impeller accommodating cavity 2122. The impeller 215 can rotate and drive the cooling fluid in the heat exchange chamber 2121 and the impeller accommodating cavity 2122 to flow from the fluid inlet 213 to the fluid outlet 214. In addition, the water block 210 may also include a plurality of heat dissipation pillars 216. These heat dissipation pillars 216 are located in the heat exchange chamber 2121. The heat dissipation column 216 is used to increase the contact area between the water cooling head 210 and the working fluid.

The water cooling row 220 is located on the side of the water cooling head 210 away from the circuit board 110 of the interface card 100. In other words, the water cooling head 210 is located between the circuit board 110 and the water cooling row 220. The water cooling row 220 includes a first water tank 221, a second water tank 222, a first heat dissipation channel structure 223, and a second heat dissipation channel structure 224. The opposite sides of the first heat dissipation channel structure 223 and the second heat dissipation channel structure 224 respectively communicate with the first water tank 221 and the second water tank 222, and the first heat dissipation channel structure 223 is closer to the baffle of the interface card 100 than the second heat dissipation channel structure 224 120. In addition, the first heat dissipation channel structure 223 and the second heat dissipation channel structure 224 are separated from each other to form an accommodating space S therebetween.

The first water tank 221 has a first chamber 2211 and a second chamber 2212 that are not connected. The second water tank 222 has a third cavity 2221. The first heat dissipation channel structure 223 and the second heat dissipation channel structure 224 each include a plurality of fluid conveying members 2231 and 2241 and a plurality of heat dissipation structures 2232 and 2242. The opposite sides of the fluid conveying members 2231 of the first heat dissipation channel structure 223 are respectively connected to the first chamber 2211 of the first water tank 221, the third chamber 2221 of the second water tank 222, and the second heat dissipation channel structure 224. The two opposite sides of the fluid conveying member 2241 are respectively connected to the second cavity 2212 of the first water tank 221 and the third cavity 2221 of the second water tank 222.

In this embodiment, the water cooling device 200 may further include a first flow tube 230 and a second flow tube 240. The water cooling bank 220 may further include a first fluid connector 225 and a second fluid connector 226. The first fluid connector 225 and the second fluid connector 226 are both disposed in the first water tank 221 and communicate with the first chamber 2211 and the second chamber 2212 respectively. The first fluid connector 225 communicates with the water cooling head 210 through the first flow tube 230 The fluid outlet 214. The second fluid connector 226 is connected to the fluid inlet 213 of the water cooling head 210 through the second flow tube 240. In this way, the first chamber 2211 and the second chamber 2212 of the first water tank 221 and the heat exchange chamber 2121 of the water cooling head 210 and the impeller accommodating chamber 2122 are connected to form a circulation channel.

In this embodiment, the circuit board 110 of the interface card 100 has a component mounting surface 111. The component setting surface 111 is used for setting components such as a processor. A side-by-side direction A is defined, which is perpendicular to the normal direction N of the component placement surface 111. These fluid conveying members 2231 and 2241 are divided into multiple groups. The fluid conveying members 2231 and 2241 of each group are arranged along the normal direction N of the element installation surface 111 of the interface card 100, and the groups of the fluid conveying members 2231 and 2241 are arranged at intervals along the side-by-side direction A.

In this embodiment, the fluid conveying members 2231 of the first heat dissipation channel structure 223 are divided into multiple groups and arranged at intervals, but it is not limited to this. In other embodiments, there may be only one set of fluid conveying members of the first heat dissipation channel structure. In the same way, the fluid conveying member of the second heat dissipation channel structure may also have only one set.

The air flow generator 300 is, for example, a centrifugal fan, and is located in the accommodating space S of the water cooling row 220. In other words, the first heat dissipation channel structure 223 and the second heat dissipation channel structure 224 are respectively located on opposite sides of the airflow generator 300. The airflow generator 300 is used to generate lateral airflow, which respectively flow to the first heat dissipation channel structure 223 and the second heat dissipation channel structure 224 of the water cooling row 220, so as to quickly take away the heat generated by the interface card 100 through the opening of the baffle 120.

It should be noted that if the first heat dissipation channel structure and the second heat dissipation channel structure are located on the same side of the airflow generator, the fluid conveying member farthest from the airflow generator in the first heat dissipation channel structure and the second heat dissipation channel structure will be separated from the airflow generator. The airflow generator is too far away. Since the airflow generated by the airflow generator will blow from the fluid conveying part closest to the airflow generator to the farthest fluid conveying part, when the airflow blows to the furthest fluid When conveying the parts, the air flow has been heat exchanged with the fluid conveying parts flowing in front to become hot air. Therefore, the fluid conveying member farthest from the airflow generator will be blown by the hot wind, which will cause the problem of poor heat dissipation efficiency.

On the contrary, in this embodiment, since the first heat dissipation channel structure 223 and the second heat dissipation channel structure 224 of the water cooling row are located on opposite sides of the airflow generator 300 instead of the same side, the first heat dissipation channel structure 223 or The distance between the fluid conveying member 2231, 2241 that is the farthest from the airflow generator 300 in the second heat dissipation channel structure 224 and the airflow generator 300, so as to prevent the fluid conveying member 2231, 2241 farthest from the airflow generator 300 from being hit by hot wind Advance and improve heat dissipation efficiency.

In the above embodiment, the first heat dissipation channel structure 223 and the second heat dissipation channel structure 224 both include the fluid conveying member 2231, 2241 and the heat dissipation structure 2232, 2242, but it is not limited thereto. Refer to Figure 6. 6 is a schematic cross-sectional view of the water cooling row according to the second embodiment of the present invention. In this embodiment, the first heat dissipation channel structure 223 only includes the fluid conveying member instead. In the same way, the second heat dissipation channel structure may also only include the fluid conveying member, but the second heat dissipation channel structure only includes the fluid conveying member. Or, it can be changed that both the first heat dissipation channel structure and the second heat dissipation channel structure only include the fluid conveying member.

According to the expansion card assembly and the water-cooled heat dissipation device of the above embodiment, since the first heat dissipation channel structure and the second heat dissipation channel structure of the water cooling row are located on opposite sides of the airflow generator instead of the same side, the first heat dissipation channel structure can be shortened Or the distance between the fluid conveying member farthest from the airflow generator in the second heat dissipation channel structure and the airflow generator, so as to prevent the fluid conveying member farthest from the airflow generator from being blown into by hot air and improve the heat dissipation efficiency.

Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for new models shall be determined by the scope of patent applications attached to this specification.

100: interface card

110: circuit board

111: component setting surface

120: bezel

210: water block

211: Thermal contact surface

2121: Heat Exchange Chamber

2122: Impeller housing cavity

213: fluid inlet

214: fluid outlet

215: Impeller

216: cooling column

220: water cooling row

223: first heat dissipation channel structure

2231: fluid conveying parts

2232: heat dissipation structure

224: Second heat dissipation channel structure

2241: fluid conveying parts

2242: heat dissipation structure

225: First fluid connector

226: Second fluid connector

230: first stream pipe

240: second flow tube

300: Airflow generator

A: Side by side direction

N: Normal direction

S: accommodating space

Claims (16)

An expansion card assembly, including: An interface card; a water-cooled heat sink, comprising: a water block, a heat source thermally coupled to the interface card; and a water-cooled row, which communicates with the water-cooled head and forms a circulation channel, the water-cooled row includes a first A water tank, a second water tank, a first heat dissipation channel structure, and a second heat dissipation channel structure, and opposite sides of the first heat dissipation channel structure and the second heat dissipation channel structure respectively communicate with the first water tank and the second water tank, And are separated from each other to form an accommodating space between the first heat dissipation channel structure and the second heat dissipation channel structure; and an airflow generator located in the accommodating space and used to generate the first flow to the water cooling row The airflow between the heat dissipation channel structure and the second heat dissipation channel structure. The expansion card assembly according to claim 1, wherein the interface card has a component placement surface defining a side-by-side direction perpendicular to the normal direction of the component placement surface, the first heat dissipation channel structure and the second heat dissipation channel structure Each includes a plurality of fluid conveying parts, the fluid conveying parts are divided into a plurality of groups, the fluid conveying parts of each group are arranged along the normal direction of the element setting surface of the interface card, and each group of the fluid conveying parts Arrange at intervals along this side-by-side direction. The expansion card assembly according to claim 2, wherein the first heat dissipation channel structure and the second heat dissipation channel structure further include a plurality of heat dissipation structures, and any one of the heat dissipation structures is connected to any two adjacent fluid conveying members. The expansion card assembly according to claim 2, wherein the first water tank has a first chamber and a second chamber that are not connected, the second water tank has a third chamber, and the first heat dissipation channel structure The opposite sides of the fluid conveying parts are respectively connected to the first chamber of the first water tank and the third chamber of the second water tank, and the opposite sides of the fluid conveying parts of the second heat dissipation channel structure The two sides are respectively connected to the second chamber of the first water tank and the third chamber of the second water tank, and the first chamber and the second chamber of the first water tank communicate with the water cooling head. Form the circulation channel. The expansion card assembly according to claim 4, wherein the water cooling device further comprises a first flow tube and a second flow tube, the water cooling head has a heat exchange chamber, a fluid inlet and a fluid outlet, the fluid inlet The heat exchange chamber is respectively connected to the fluid outlet, and the water-cooling row further includes a first fluid connector and a second fluid connector. The first fluid connector and the second fluid connector are disposed in the first water tank and are respectively connected to The first chamber communicates with the second chamber, the first fluid connector communicates with the fluid outlet of the water block through the first flow tube, and the second fluid connector communicates with the fluid outlet of the water block through the second flow tube. Fluid inlet. The expansion card assembly according to claim 5, wherein the water cooling head has a thermal contact surface and an impeller accommodating cavity, the thermal contact surface is used to thermally contact the heat source of the interface card, and the impeller accommodating cavity is connected to the A heat exchange chamber, the fluid inlet and the fluid outlet respectively communicate with the heat exchange chamber and the impeller accommodating cavity, the water cooling head includes an impeller, and the impeller is located in the impeller accommodating cavity. The expansion card assembly according to claim 5, wherein the water cooling head includes a plurality of heat dissipation pillars, and the heat dissipation pillars are located in the heat exchange chamber. The expansion card assembly according to claim 1, wherein the interface card includes a circuit board and a baffle, the baffle is disposed on one side of the circuit board, and the first heat dissipation channel structure is between the baffle and the airflow Between generators. The expansion card assembly according to claim 8, wherein the airflow generator is a centrifugal fan. A water-cooling heat dissipation device for thermally coupling to an interface card. The water-cooling heat dissipation device includes: a water-cooling head thermally coupled to a heat source of the interface card; and a water-cooling row connected to the water-cooling head and forming a cycle together Channel, the water cooling row includes a first water tank, a second water tank, a first heat dissipation channel structure, and a second heat dissipation channel structure. The first heat dissipation channel structure and the second heat dissipation channel structure are respectively connected to opposite sides of the The first water tank and the second water tank are separated from each other so that an accommodating space is formed between the first heat dissipation channel structure and the second heat dissipation channel structure. The water-cooled heat dissipation device according to claim 10, wherein the interface card has a component placement surface defining a side-by-side direction perpendicular to the normal direction of the component placement surface, the first heat dissipation channel structure and the second heat dissipation channel structure Each includes a plurality of fluid conveying parts, the fluid conveying parts are divided into a plurality of groups, the fluid conveying parts of each group are arranged along the normal direction of the element setting surface of the interface card, and each group of the fluid conveying parts Arrange at intervals along this side-by-side direction. The water-cooled heat dissipation device according to claim 11, wherein the first heat dissipation channel structure and the second heat dissipation channel structure further include a plurality of heat dissipation structures, and any one of the heat dissipation structures is connected to any two adjacent fluid conveying members. The water cooling device according to claim 11, wherein the first water tank has a first chamber and a second chamber that are not connected, the second water tank has a third chamber, and the first heat dissipation channel structure The opposite sides of the fluid conveying parts are respectively connected to the first chamber of the first water tank and the third chamber of the second water tank, and the opposite sides of the fluid conveying parts of the second heat dissipation channel structure The two sides are respectively connected to the second chamber of the first water tank and the third chamber of the second water tank, and the first chamber and the second chamber of the first water tank communicate with the water cooling head. The circulation channel is formed. The water-cooled heat dissipation device according to claim 13, wherein the water-cooled heat dissipation device further comprises a first flow tube and a second flow tube, the water cooling head has a heat exchange chamber, a fluid inlet and a fluid outlet, the fluid inlet The heat exchange chamber is respectively connected to the fluid outlet, and the water-cooling row further includes a first fluid connector and a second fluid connector. The first fluid connector and the second fluid connector are disposed in the first water tank and are respectively connected to The first chamber communicates with the second chamber, the first fluid connector communicates with the fluid outlet of the water block through the first flow tube, and the second fluid connector communicates with the fluid outlet of the water block through the second flow tube. Fluid inlet. The water cooling device according to claim 14, wherein the water cooling head has a thermal contact surface and an impeller accommodating cavity, the thermal contact surface is used to thermally contact the heat source of the interface card, and the impeller accommodating cavity is connected to the A heat exchange chamber, the fluid inlet and the fluid outlet respectively communicate with the heat exchange chamber and the impeller accommodating cavity, the water cooling head includes an impeller, and the impeller is located in the impeller accommodating cavity. The water cooling device according to claim 14, wherein the water cooling head includes a plurality of heat dissipation pillars, and the heat dissipation pillars are located in the heat exchange chamber.

Images