TWI802505B - Special fluid cooling cooling system for computer case cabinet - Google Patents

Abstract

A special fluid-cooling heat dissipation system for computer cases and cabinets, comprising: a frame, a fluid circulation device, a case distributor, at least one motherboard module, a cold fluid passage and a hot fluid passage. Wherein the frame body can be installed in the accommodating space in a movable drawing manner, the chassis distributor is arranged on the outside of the frame body, and is connected with the fluid circulation device, through the cold fluid passage and the hot fluid passage, the chassis The distributor is connected to the mainboard side module, and the chassis distributor includes a chassis cold exhaust pipe and a chassis heat exhaust pipe so that the working fluid flowing through the mainboard side module can be separated from heat and cold, and finally flows back to the mainboard side module. The fluid circulation device is used to form a circulating flow; accordingly, the frame design can be directly pulled out without shutting down, and its internal pipeline design can also solve the shortcomings of the traditional water cooling that is prone to water leakage when it is disassembled.

Description

Special fluid cooling cooling system for computer case cabinet

This creation belongs to the field of computer cooling devices, especially about a special fluid-cooled cooling system for computer chassis cabinets, which can solve the congenital problems of insufficient heat dissipation space and ventilation rate of products, and improve the multi-module chassis. Pull out, and solve the problems of traditional water cooling disassembly and leakage.

Press, the traditional application such as: the fluid cooling cooling system on the computer chassis cabinet of the industrial server, which is through a pump to a working fluid (including fluid or liquid nitrogen or other atomized gas for cooling purposes, etc. ) to pressurize the working fluid located in the fluid tank through a fluid cooling distributor and divert it to different pipelines to cool and dissipate heat sources in different servers respectively, but because they are connected through connecting pipelines When passing through, the pressure of the working fluid is often affected by the length or diameter of the pipeline, which causes the flow rate to change. For example, when the pipeline distance is long, the relative flow rate will also decrease.

Furthermore, as far as the fluid-cooled heat dissipation system of the common computer case cabinet is concerned, it is often because the pump, the fluid-cooled distributor and most of the pipelines are mostly fixed, so after the erection is completed, It is no longer possible to arbitrarily move the positions of computer case cabinets and different servers, and because most of the pipelines are exposed, the working fluid inside the pipelines cannot be cooled properly during heat exchange, thereby reducing the heat dissipation effect. In the past, the different servers inside the computer case were arranged up and down or vertically. Therefore, the distance between the top and bottom servers is the longest. The flow rate of the working fluid obtained by the two remote servers is different, so the effect of heat dissipation or cooling will be different. The problem of average, if this problem needs to be improved, the power of the pump must be increased. As a result, the installation cost will be increased, so it is necessary to improve it.

In view of this, the author has designed a special fluid-cooled heat dissipation system for computer chassis cabinets. Through the chassis distributor with hot and cold separation, the hot and cold passages of the working fluid are separated, and can be quickly connected to the main board or The motherboard-side module on the heat source module of the device not only solves the congenital problems such as insufficient heat dissipation space and ventilation rate, but also further improves the multi-module chassis host that can be pulled out directly without shutting down, and solves the traditional disassembly For those who have problems such as fluid leakage or air leakage, while improving the heat dissipation efficiency, it also improves the elastic space during use, making this creation have better practicability.

One purpose of this invention is to provide a special fluid cooling cooling system for computer case cabinets, so that it includes a frame, a fluid circulation device, a chassis distributor, at least one motherboard module, a cold fluid channel and a hot fluid channel, the chassis distributor is installed on the frame, and can be used for movable drawing, and the chassis distributor includes a chassis cold exhaust pipe and a chassis heat exhaust pipe, and the working fluid will be transported through the chassis distributor The cold fluid channel and the hot fluid channel are separated, so that the cold and heat are separated, and the heat dissipation efficiency is improved; moreover, the chassis distributor can be quickly connected to the main board side module installed on a main board or a device heat source module , and the chassis distributor is connected with the fluid circulation device, which not only solves the congenital problems such as insufficient heat dissipation space and ventilation rate, but also the design of the rack body that can be pulled out directly without shutting down, and the internal pipeline design can be Solve the disadvantages of easy fluid leakage or air leakage during disassembly, thus greatly improving the heat dissipation efficiency during use and the convenience of installation.

In order to achieve the above-mentioned purpose, the fluid-cooled heat dissipation system dedicated to the computer case of this invention is correspondingly installed in one of the accommodating spaces of the computer case, which includes: a frame body corresponding to the accommodating A load-bearing part is provided in the storage space, and the frame body can be installed in the storage space by pulling; a fluid circulation device is arranged on one side of the computer case cabinet, and the fluid circulation device is provided with a cold fluid input port and A hot fluid outlet; a chassis distributor, located outside the frame, and the chassis distributor includes a chassis cold exhaust pipe and a chassis heat exhaust pipe, the chassis cold exhaust pipe is provided with a first cold fluid inlet and a plurality of A cold fluid joint, and the chassis heat exhaust pipe is provided with a first hot fluid outlet and a plurality of hot fluid joints, so that the first cold fluid inlet is connected to the cold fluid input port, and the first hot fluid outlet is connected to the hot fluid outlet. Fluid output port; at least one main board end module, each main board end module forms an installation space corresponding to a main board or device heat source module, and is installed on the main board or device heat source module through sliding friction On the set, the two sides of the installation space are bent inward so as to wrap the main board or the device heat source module to form a fixation, and the inside of the main board end module is corresponding to the main board or the device heat source module. A flow space is formed, and the flow space is respectively provided with a second cold fluid inlet and a second hot fluid outlet; a cold fluid channel is connected to the cold fluid joint and the second cold fluid inlet to communicate with the flow space; and a The thermal fluid channel connects the thermal fluid joint and the second thermal fluid outlet to communicate with the flow space; accordingly, after the fluid system is pressurized through the fluid circulation device, it is sent to the chassis cold exhaust pipe of the chassis distributor for reduce the temperature to form a cold fluid, and transport the cold fluid to the main board side module through the cold fluid channel, absorb the heat generated by the main board or the device heat source module in the flow space to form a hot fluid, and The heat fluid in the flow space is led out to the heat exhaust pipe of the case, and finally flows back to the fluid circulation device to form a circulation flow.

In one embodiment, the cold fluid joints and the hot fluid joints of the present invention are fixed on the chassis distributor by welding, so as to achieve the purpose of preventing fluid leakage. Furthermore, the chassis cold exhaust pipe and the chassis heat exhaust pipe of the chassis distributor are designed to be separated, so as to separate the hot and cold working fluid without affecting the heat dissipation efficiency. In addition, the installation space of the mainboard side module of this invention is in a concave shape, and a shrapnel is provided corresponding to the mainboard or the heat source module of the device, By virtue of the restoring elastic force of the shrapnel, the main board end module is in frictional sliding contact with the surface of the main board or the heat source module of the device and is fixed.

In another embodiment, since the frame of the present invention has the feature of movable extraction, it can be applied in such as: fixed chassis, pull-out chassis, pull-out blade chassis or other pull-out and related heat dissipation One of them, such as the demand device, greatly increases its usage. And, this fluid circulation device of this creation has the function of distributing fluid flow and controlling fluid pressure, and its embodiment has two: 1, this fluid circulation device of this creation is the control fluid pressure function of feeding fluid pressure and return flow extracting hot fluid , through the size of the cold fluid channel and the diameter of the hot fluid channel to control the flow and pressure distribution to the main board module; 2. The fluid circulation device of this creation uses the natural pressure control fluid pressure function to pass the cold fluid The channel and the diameter of the thermal fluid channel control the flow rate and pressure distribution to the motherboard module. Both of the above two implementations can achieve the function of controlling fluid pressure and improving heat dissipation efficiency.

1: computer case cabinet

11:Accommodating space

12: Motherboard or device heat source module

2: Fluid cooling cooling system

21: frame body

211: bearing part

22: Fluid circulation device

221: cold fluid input port

222: thermal fluid outlet

23: Chassis distributor

231: Chassis cooling pipe

2311: First cold fluid inlet

2312: Cold Fluid Connector

232: Chassis heat exhaust pipe

2321: The first thermal fluid outlet

2322: Thermal Fluid Connector

24: Motherboard module

241: Installation space

2411: Shrapnel

242: Flow space

2421: Second cold fluid inlet

2422: Second thermal fluid outlet

25: Cold Fluid Channel

26: hot fluid channel

Fig. 1 is a schematic structural diagram of a preferred embodiment of the invention.

Fig. 2 is a hardware block diagram of a preferred embodiment of the invention.

Fig. 3 is a schematic diagram (1) of the state when the preferred embodiment of the invention is in use.

Fig. 4 is a schematic diagram (2) of the state when the preferred embodiment of the invention is in use.

Fig. 5 is a schematic diagram (3) of the state when the preferred embodiment of the invention is in use.

In order to enable your review committee to clearly understand the content of this creation, only the following descriptions are provided with diagrams, please refer to them.

Please refer to Fig. 1 and Fig. 2, and Fig. 3 to Fig. 5, which are schematic diagrams of the structure of the preferred embodiment of this creation, its hardware block diagram, and the state schematic diagrams of each in use. As shown in the above figures, the fluid-cooled heat dissipation system 2 of the computer case cabinet 1 of the present creation includes: a frame body 21, a fluid circulation device 22, a chassis distributor 23, a plurality of main board end modules 24, a cooling The fluid channel 25 and a thermal fluid channel 26 are correspondingly installed in the accommodating space 11 of the computer case cabinet 1 .

Wherein the frame body 21 is provided with a bearing portion 211 corresponding to the accommodating space 11 , and the frame body 21 can be installed in the accommodating space 11 through a pulling method. Moreover, the frame body 21 is selected from one of the following: fixed chassis, pull-out chassis, pull-out blade chassis, or other devices that need to be pulled out and have related heat dissipation requirements.

The fluid circulation device 22 is disposed on one side of the computer case cabinet 1 , and the fluid circulation device 22 is provided with a cold fluid input port 221 and a hot fluid output port 222 . Furthermore, the fluid circulation device 22 has the functions of distributing fluid flow and controlling fluid pressure. First, the fluid circulation device 22 is used to feed the fluid pressure and return the fluid to extract the fluid pressure control function, through the cold fluid channel 25 and The pipe diameter of the hot fluid channel 26 controls the flow rate and pressure distribution to the mainboard module 24; secondly, the fluid circulation device 22 uses the natural pressure control fluid pressure function to pass through the cold fluid channel 25 and the hot fluid The pipe diameter of the channel 26 controls the flow and pressure distribution to the mainboard module 24 .

The chassis distributor 23 is located outside the frame body 21, and the chassis distributor 23 includes a chassis cold exhaust pipe 231 and a chassis heat exhaust pipe 232, and the chassis cold exhaust pipe 231 is provided with a first cold fluid inlet 2311 and A plurality of cold fluid joints 2312, and the chassis heat exhaust pipe 232 are provided with a first hot fluid outlet 2321 and a plurality of hot fluid joints 2322, so that the first cold fluid inlet 2311 is connected to the cold fluid inlet 221, and the first cold fluid inlet 2311 A thermal fluid outlet 2321 is connected to the thermal fluid output port 222 . It should be noted that the cold fluid connectors 2312 and the hot fluid connectors 2322 are fixed on the chassis distributor 23 by welding, so there is no problem of fluid leakage due to unstable fixation, and the cooling pipe of the chassis 231 and the chassis heat exhaust pipe 232 are designed separately.

Each mainboard side module 24 is formed with an installation space 241 corresponding to a mainboard or device heat source module 12, and is installed on the mainboard or device heat source module 12 through sliding friction. The installation space 241 The two sides are bent inward to wrap the main board or the device heat source module 12 to be fixed, and a flow is formed inside the main board end module 24 corresponding to the main board or the device heat source module 12. The space 242, the flow space 242 is respectively provided with a second cold fluid inlet 2421 and a second hot fluid outlet 2422. In addition, the installation space 241 of the mainboard side module 24 of the present invention is in a concave shape, and a shrapnel 2411 is provided corresponding to the mainboard or the device heat source module 12, and the recovery force of the shrapnel 2411 is used to make the mainboard The end module 24 is in frictional and sliding contact with the main board or the surface of the device heat source module 12 and is fixed.

The cold fluid channel 25 is connected to the cold fluid joint 2312 and the second cold fluid inlet 2421 to communicate with the flow space 242 .

The thermal fluid channel 26 is connected to the thermal fluid joint 2322 and the second thermal fluid outlet 2422 to communicate with the flow space 242 .

Accordingly, when the fluid-cooled heat dissipation system 2 of the present invention is used, the working fluid system is pressurized through the fluid circulation device 22, and then delivered to the chassis cooling pipe 231 of the chassis distributor 23 to cool down to form A cold fluid, and the cold fluid is transported to the main board end module 24 through the cold fluid passage 25, absorbing the heat generated by the main board or the device heat source module 12 in the flow space 242 to form a hot fluid, And the hot fluid in the flow space 242 is exported to the heat exhaust pipe 232 of the chassis, and finally flows back to the fluid circulation device 22 to form a circulating flow. It can be seen that the fluid transported through the chassis distributor 23 The cold fluid channel 25 and the hot fluid channel 26 are separated, so that the cold and heat are separated, and the heat dissipation efficiency can be improved; moreover, the chassis distributor 23 can be quickly connected to the main board or the heat source module 12 of the device. The motherboard side module 24 connects the chassis distributor 23 with the fluid circulation device 22, which not only solves the problem of heat dissipation space and ventilation rate Insufficient and other congenital problems, the frame body 21 can be directly pulled out without shutting down, so as to achieve the purpose of improving heat dissipation efficiency and installation convenience during use.

However, the above-mentioned ones are only preferred embodiments of this creation, and are not used to limit the scope of implementation of this creation. Therefore, those who have ordinary knowledge in the technical field, or those who are familiar with this technology make equivalent or easy All changes and modifications made without departing from the spirit and scope of this creation shall be covered by the patent scope of this creation.

1: computer case cabinet

11:Accommodating space

12: Motherboard or device heat source module

2: Fluid cooling cooling system

21: frame body

211: bearing part

22: Fluid circulation device

221: cold fluid input port

222: thermal fluid outlet

23: Chassis distributor

231: Chassis cooling pipe

2311: First cold fluid inlet

2312: Cold Fluid Connector

232: Chassis heat exhaust pipe

2321: The first thermal fluid outlet

2322: Thermal Fluid Connector

24: Motherboard module

241: Installation space

2411: Shrapnel

242: Flow space

2421: Second cold fluid inlet

2422: Second thermal fluid outlet

25: Cold Fluid Channel

26: hot fluid channel

Claims (8)

A special fluid-cooled heat dissipation system for computer case cabinets, which is correspondingly installed in one of the accommodating spaces of the computer case cabinets. The drawing method is installed in the accommodating space; a fluid circulation device is arranged on one side of the computer case cabinet, and the fluid circulation device is provided with a cold fluid input port and a hot fluid output port; a chassis distributor is arranged on the computer case outside the frame body, and the chassis distributor includes a chassis cold exhaust pipe and a chassis heat exhaust pipe, the chassis cold exhaust pipe is provided with a first cold fluid inlet and a plurality of cold fluid joints, and the chassis heat exhaust pipe is provided with a first A hot fluid outlet and a plurality of hot fluid joints, so that the first cold fluid inlet is connected to the cold fluid input port, and the first hot fluid outlet is connected to the hot fluid output port; at least one motherboard module, each The motherboard-side module is formed into an installation space corresponding to a motherboard or a device heat source module, and is installed on the motherboard or device heat source module through sliding friction, and the two sides of the installation space are bent inwards It can cover the main board or the device heat source module to form a fixation, and a flow space is formed inside the main board end module corresponding to the main board or the device heat source module, and the flow space is respectively provided with a second cooling a fluid inlet and a second hot fluid outlet; a cold fluid passage connecting the cold fluid joint and the second cold fluid inlet to communicate with the flow space; and a hot fluid passage connecting the hot fluid joint and the second hot fluid Fluid outlet to communicate with the flow space; accordingly, after the fluid system is pressurized through the fluid circulation device, it is sent to the chassis cold exhaust pipe of the chassis distributor to cool down to form a cold fluid, and the cold fluid passes through the chassis The cold fluid channel is sent to the main board side module, absorbs the heat generated by the main board or the heat source module of the device in the flow space to form a hot fluid, and exports the hot fluid in the flow space to the chassis heat In the exhaust pipe, it finally flows back to the fluid circulation device to form a circulating flow. The special fluid-cooling heat dissipation system for computer case cabinets as described in Claim 1, wherein the cold fluid joints and the hot fluid joints are fixed on the case distributor by welding. The special fluid-cooled heat dissipation system for computer case cabinets as described in Claim 1, wherein the case cold exhaust pipe and the chassis heat exhaust pipe of the case distributor are designed separately. The special fluid-cooled heat dissipation system for computer case cabinets as described in claim 1, wherein the installation space of the mainboard module is in a concave shape, and a shrapnel is provided corresponding to the mainboard or the heat source module of the device. The restoring elastic force of the elastic piece makes the main board end module come into frictional sliding contact with the surface of the main board or the heat source module of the device and form a fixation. The special fluid-cooled heat dissipation system for computer case cabinets as described in claim 1, wherein the frame system is selected from, for example: fixed case, pull-out type case, pull-out type blade case or other devices that need to be pulled out and have related heat dissipation requirements Wait for one of them. According to claim 1, the special fluid-cooled heat dissipation system for computer cases and cabinets, wherein the fluid circulation device has the functions of distributing fluid flow and controlling fluid pressure. The special fluid-cooled heat dissipation system for computer chassis cabinets as described in claim 6, wherein the fluid circulation device uses the function of controlling fluid pressure to feed fluid pressure and return fluid to extract hot fluid, through the cold fluid channel and the hot fluid channel The size of the pipe diameter controls the flow and pressure distribution to the mainboard module. The special fluid-cooled heat dissipation system for computer chassis cabinets as described in claim 6, wherein the fluid circulation device controls the flow rate and the diameter of the cold fluid channel and the hot fluid channel through the function of controlling the fluid pressure of the natural pressure. Pressure distribution to the motherboard side module.

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