TWM609527U - Alignment mechanism of bonding machine - Google Patents

Abstract

The invention provides an alignment mechanism of a bonding machine, especially an alignment mechanism of a wafer bonding machine, which mainly includes a carrier, at least three first alignment pins, and at least three second alignment pins , A first cam and a second cam. When the first cam rotates relative to the carrier, it will drive the first alignment pin to move relative to the carrier to position the first substrate on the carrier. When the second cam rotates relative to the carrier, it drives the second alignment pin to move relative to the carrier to position the second substrate on the first substrate, so that the second substrate is aligned with the first substrate to facilitate the first substrate The bonding with the second substrate overlaps.

Description

Alignment mechanism of bonding machine

The present invention relates to an alignment mechanism of a bonding machine, especially an alignment mechanism of a wafer bonding machine, which can quickly and accurately align wafers and substrates to facilitate subsequent bonding of wafers and substrates. Together.

With the advancement of semiconductor technology, the thickness of wafers is continuously reduced to facilitate subsequent wafer cutting and packaging processes. In addition, the thinning of the wafer is also conducive to reducing the size of the chip, reducing the resistance, accelerating the calculation speed and prolonging the service life. However, the structure of the thinned wafer is very fragile, and the wafer is prone to warp or break in the subsequent manufacturing process, thereby reducing the yield of the product.

In order to avoid the above-mentioned problems, it is generally selected to temporarily bond the wafer to the carrier substrate and support the thinned wafer through the carrier substrate to avoid warping or fracture of the thinned wafer during the manufacturing process.

Specifically, an adhesive can be applied to the surface of the carrier substrate and the wafer, and then the carrier substrate and the wafer can be moved to the bonding machine for alignment, and the temperature of the carrier substrate and the wafer can be increased for bonding. After the bonding is completed, the wafer can be thinned, etched, and metalized, and finally the wafer and the carrier substrate can be peeled off.

Although the bonding of the wafer and the carrier substrate can be completed through the above steps, the alignment mechanism of the general bonding machine still has the problems of poor accuracy and low alignment efficiency, which affects the efficiency and yield of the process Cause a certain impact.

In order to solve the above-mentioned problems, the present invention proposes an alignment mechanism of the bonding machine, which can effectively improve the accuracy and efficiency of the alignment between the wafer and the carrier substrate, thereby helping to improve the efficiency and yield of the process. In addition, through the alignment mechanism of the present invention, the cost of installing multiple detectors on the machine can also be saved.

One purpose of the present invention is to provide an alignment mechanism for a bonding machine, which mainly uses cams to drive alignment pins to locate the wafer and the carrier substrate, which can quickly and accurately complete the alignment and bonding of the wafer and the carrier substrate .

An object of the present invention is to provide an alignment mechanism for a bonding machine, wherein the first cam and the second cam can respectively drive the first alignment pin and the second alignment pin in an open state and a position relative to the carrier. Displacement between aligned states. The distance between the first alignment pin and the second alignment pin in the open state is larger or the largest, and the first substrate and the second substrate can be placed between the first alignment pin and the second alignment pin, respectively. The distance between the first alignment pin and the second alignment pin in the alignment state is small or minimum. When the first alignment pin and the second alignment pin are switched from the open state to the alignment state, the first alignment pin and the second alignment pin are switched from the open state to the alignment state. The alignment pins and the second alignment pins will contact and push the first substrate and the second substrate respectively, and respectively position the first substrate and the second substrate, so that the first substrate and the second substrate overlap, so as to facilitate the subsequent first substrate. Bonding of the substrate and the second substrate.

An object of the present invention is to provide an alignment mechanism for a bonding machine, which mainly includes a carrier, at least three first alignment pins, at least three second alignment pins, a first cam, and a second Cam. The first cam and the second cam are located below the carrier, and are respectively connected to the first alignment pin and the second alignment pin. When the first cam and the second cam rotate relative to the carrier, they will drive the first and second alignment pins to move relative to the carrier, respectively, and position them with the first and second alignment pins, respectively The first substrate and the second substrate allow the first substrate to be aligned with the second substrate, and then the aligned first substrate and the second substrate are overlapped and bonded. Through the alignment mechanism of the present invention, the cost of installing multiple detectors on the stage can be saved, and it is beneficial to reduce the time for alignment and detection.

An object of the present invention is to provide an alignment mechanism for the bonding machine platform, which mainly places the first substrate on the carrier, and drives the first alignment pin protruding out of the carrier through the first cam to move, so that the first The alignment pins push the first substrate between and complete the positioning of the first substrate. Then the second substrate is placed on the first alignment pin, and the second alignment pin of the protruding stage is driven by the second cam to move, so that the second alignment pin pushes the second substrate in between, and completes the second alignment. Positioning of the substrate. The positioned second substrate is aligned with the first substrate, and then the first alignment pin can be driven to descend, so that the first substrate and the second substrate overlap, so as to perform the bonding of the first substrate and the second substrate.

In order to achieve the above objective, the present invention proposes an alignment mechanism for a bonding machine platform, which includes: a carrier, including a carrier surface, for carrying a first substrate, wherein the carrier mask has a placement area; An alignment pin is arranged around the placement area of the carrier surface and used for positioning the first substrate and the second substrate carried by the carrier, wherein the first alignment pin is raised and lowered relative to the carrier surface of the carrier; at least three A second alignment pin, arranged around the placement area of the bearing surface, and used for positioning the second substrate carried by the first alignment pin; a first cam, located under the carrier, and connected to the first alignment pin , Wherein when the first cam rotates relative to the carrier, it will drive the displacement of the first alignment pins and change the distance between the first alignment pins to locate the first substrate carried by the carrier; and a second cam located at The second alignment pin is connected to the bottom of the carrier. When the second cam rotates relative to the carrier, it will drive the displacement of the second alignment pin and change the distance between the second alignment pins to locate the first pair The second substrate carried by the alignment pins makes the second substrate align with the first substrate, and the first alignment pins will descend relative to the carrying surface of the carrier, and place the carried second substrate on the first substrate.

The alignment mechanism of the bonding machine platform includes at least three lifting pins located on the bearing surface of the carrier, and the first alignment pin and the second alignment pin are arranged around the upper lifting pin, and the lifting The pins are used to receive and carry the first substrate, and are raised and lowered relative to the carrying surface of the carrier, so as to place the carried first substrate on the carrying surface of the carrier.

In the alignment mechanism of the bonding machine, the first cam and the second cam are stacked and connected to a rotating shaft.

In the alignment mechanism of the bonding machine, the number of the first alignment pin and the second alignment pin is three, and the angle of action of the first cam and the second cam is 120 degrees.

The alignment mechanism of the bonding machine platform includes a lifting unit connected to the first alignment pin, and drives the first alignment pin to rise and fall relative to the bearing surface of the carrier.

The alignment mechanism of the bonding machine includes at least three first followers and at least three second followers, which are respectively connected to the first cam and the second cam, and the first alignment pin and the second The alignment pins are respectively arranged on the first follower and the second follower.

In the alignment mechanism of the bonding machine table, the first follower and the second follower include a return unit, a sliding seat and a sliding table, the sliding table is arranged on the sliding seat, and one end of the sliding table is connected The first cam or the second cam, and the other end of the sliding table is connected with the recovery unit, and the first alignment pin or the second alignment pin is arranged on the sliding table.

The alignment mechanism of the bonding machine table further includes a plurality of rollers connected to the sliding table and attached to the first cam or the second cam.

Please refer to FIG. 1 and FIG. 2, which are respectively a three-dimensional schematic diagram and a cross-sectional schematic diagram of an embodiment of the alignment mechanism of the new bonding machine. As shown in the figure, the alignment mechanism 10 of the bonding machine mainly includes a carrier 11, at least three first alignment pins 131, at least three second alignment pins 133, a first cam 151, and a second The cam 153, in which the first alignment pin 131 and the second alignment pin 133 are arranged in the area near the edge or the periphery of the carrier 11, for example, a placement area 113 may be defined on a bearing surface 111 of the carrier 11, and the first The alignment pins 131 and the second alignment pins 133 are arranged in a spaced manner. As shown in FIG. 1, the cross-sectional component is the second alignment pin 133 and is arranged around the placement area 113.

The carrying surface 111 of the carrier 11 can be used to carry a first substrate 121, as shown in FIGS. 6 to 8, wherein the first alignment pin 131 is located on the carrying surface 111 of the carrier 11 and can be along the parallel to the carrying surface 111 Directional displacement to position the first substrate 121 placed on the carrying surface 111 of the stage 11. In addition, the first alignment pins 131 can also be used to carry the second substrate 123. The second alignment pin 133 is also located on the bearing surface 111 of the carrier 11 and can be displaced along the direction parallel to the bearing surface 111 to position a second substrate 123 carried by the first alignment pin 131, as shown in FIGS. 10 to 11 Shown. For example, the bearing surface 111 can be circular, and the first alignment pin 131 and the second alignment pin 133 can be displaced along the radial direction of the bearing surface 111.

The first cam 151 and the second cam 153 are located below the carrier 11, wherein the first cam 151 is connected to the first alignment pin 131, and the second cam 153 is connected to the second alignment pin 133. The first cam 151 of the present invention is used to drive the first alignment pin 131 to move relative to the carrier 11, and the second cam 153 is to drive the second alignment pin 133 to move relative to the carrier 11. In practical applications, regardless of whether the first cam 151 and the second cam 153 are directly connected or indirectly connected to the first alignment pin 131 and the second alignment pin 133, they can drive the first alignment pin 131 and the second alignment pin 133 effects.

The first cam 151 and the second cam 153 may be disc cams, wherein the first cam 151 and the second cam 153 are stacked and connected to the same rotating shaft 141. When the rotating shaft 141 rotates, only one of the cams is driven to rotate, and the other cam does not rotate with it. The rotation of the first cam 151 and the second cam 153 are independent.

In an embodiment of the present invention, a first fixing frame 161 and a second fixing frame 163 may be disposed under the carrier 11, wherein the first fixing frame 161 and the second fixing frame 163 are stacked. The first cam 151 and the first follower 171 are arranged on the first fixing frame 161, and the second cam 153 and the second follower 173 are arranged on the second fixing frame 163.

When the rotating shaft 141 rotates, it will drive the second cam 153 to rotate, but will not drive the first cam 151 to rotate. The first cam 151 can be connected to a driving device 145, and the driving device 145 drives the first cam 151 to rotate. When the driving device 145 drives the first cam 151 to rotate, the rotating first cam 151 does not drive the rotating shaft 141 and the second cam 153 to rotate. For example, the rotating shaft 141 can be directly connected to the second cam 153 and connected to the first cam 151 through a bearing 143. In different embodiments, the first cam 151 and the second cam 153 can also be connected to different rotating shafts, and the first cam 151 and the second cam 153 are driven to rotate through the different rotating shafts, respectively.

The alignment mechanism 10 of the bonding machine of the present invention includes at least three first driven members 171 and at least three second driven members 173, and each first alignment pin 131 is respectively arranged on the first driven member 171 , And each second alignment pin 133 is arranged on the second follower 173. The first cam 151 is connected to the first follower 171. When the first cam 151 rotates relative to the carrier 11, it will drive the first follower 171 and the first alignment pin 131 to move relative to the carrier 11 and change each The pitch of the first alignment pins 131 is used to position the first substrate 121. The second cam 153 is connected to the second follower 173. When the second cam 153 rotates relative to the carrier 11, it will drive the second follower 173 and the second alignment pin 133 to move relative to the carrier 11 and change each The pitch of the second alignment pins 133 is used to position the second substrate 123.

In an embodiment of the present invention, the structures of the first follower 171 and the second follower 173 are the same or similar, and include a return unit 1711, a sliding seat 1713, and a sliding table 1715, wherein the sliding seat 1713 can be fixed On the first fixing frame 161 or the second fixing frame 163, the sliding table 1715 is disposed on the sliding base 1713 and can be displaced relative to the sliding base 1713, for example, along the sliding rail on the sliding base 1713. The first alignment pin 131 and the second alignment pin 133 are arranged on different sliding tables 1715 and move with the sliding table 1715 relative to the sliding seat 1713.

One end of the sliding table 1715 is connected to the first cam 151 or the second cam 153, and the other end is connected to the return unit 1711. For example, a roller 1719 can be provided at one end of the sliding table 1715, wherein the roller 1719 is attached to the first cam 151 or The surface of the second cam 153. The restoring unit 1711 may be a spring, wherein the restoring force generated by the restoring unit 1711 pushes the sliding table 1715 toward the first cam 151 or the second cam 153, so that the sliding table 1715 is attached to the surface of the first cam 151 or the second cam 153 .

The sliding table 1715 can be connected to a connecting rod 1717, wherein the other end of the connecting rod 1717 can directly contact the first cam 151 or the second cam 153, for example, the end of the connecting rod 1717 contacting the first cam 151 or the second cam 153 is a pointed shape Follower or a flat follower. In addition, a roller 1719, such as a roller, can be connected to the end of the connecting rod 1717 not connected to the sliding table 1715, wherein the roller 1719 is arranged on the connecting rod 1717 to contact the first cam 151 or the second cam 153, for example, the connecting rod 1717 contacts the first cam 151 or the second cam 153. One end of the cam 151 or the second cam 153 is a roller follower.

In an embodiment of the present invention, the first alignment pin 131 can not only be displaced in a direction parallel to the bearing surface 111 of the stage 11, but also can be extended and contracted in a direction perpendicular to the bearing surface 111. For example, the first alignment pin 131 can be connected to an elevating unit 136, and the elevating unit 136 drives the first alignment pin 131 to elevate relative to the bearing surface 111 of the carrier 11. In addition, each first alignment pin 131 can be lowered synchronously or asynchronously. When each first alignment pin 131 is lowered synchronously, the second substrate 123 will be flat on the first substrate 121, and when each first alignment pin 131 is lowered synchronously, When the 131 descends asynchronously, for example, the first alignment pin 131 on the left side descends first, while the first alignment pin 131 on the right side remains stationary, and the second substrate 123 is placed on the first substrate 121 diagonally. The second alignment pin 133 can only move in a direction parallel to the bearing surface 111 of the carrier 11, and cannot move up and down relative to the bearing surface 111 of the carrier 11. Of course, the inability of the second alignment pin 133 to be raised or lowered relative to the carrier 11 is only an embodiment of the present invention, and is not a limitation of the scope of rights of the present invention. In different embodiments, the second alignment pin 133 can also be designed to be liftable relative to the bearing surface 11 of the carrier 11.

In an embodiment of the present invention, as shown in FIGS. 3 and 4, the number of the first alignment pin 131 and the second alignment pin 133 can be three, and the first alignment pin 131 and the second alignment pin 133 133 adjacent and staggered. The action angle a of the first cam 151 and the second cam 153 is 120 degrees, and the included angle between the adjacent first alignment pin 131 and the adjacent second alignment pin 133 is also 120 degrees. The first cam 151 includes three concave portions 1513 and three convex portions 1511, the second cam 153 also includes three concave portions 1533 and three convex portions 1531, of which the convex portion 1511/1531 and the first or second cam 151/153 The distance between the center or the shaft 141 is greater than the distance between the recess 1513/1533 and the center or the shaft 141 of the first or second cam 151/153, and the protrusions 1511/1531 and the recesses 1513/1533 are staggered. The number of the first alignment pin 131 and the second alignment pin 133 is three, and the angle of action of the first cam 151 and the second cam 153 is 120 degrees, which is only an embodiment of the present invention, and is not a limitation of the scope of rights of the present invention. .

The alignment mechanism 10 of the bonding machine respectively locates the first substrate 121 and the second substrate 123 above the carrier 11 through the first alignment pin 131 and the second alignment pin 133, wherein the first substrate 121 and the second substrate 123 123 overlap.

When the first cam 151 rotates relative to the carrier 11, the first follower 171 will sequentially contact the convex portion 1511 and the concave portion 1513 of the first cam 151. When the first follower 171 contacts the convex portion 1511 of the first cam 151, the return unit 1711 is compressed, as shown in FIG. 4, so that the sliding table 1715 and the first alignment pin 131 are displaced toward the outer edge of the carrier 11 , And away from the placement area 113 of the carrier 11 to increase the distance between the first alignment pins 131. When the distance between the first alignment pins 131 is the largest, it can be defined as an open state, and the first substrate 121 can be placed in the placement area 113 between the first alignment pins 131.

When the first follower 171 contacts the recess 1513 of the first cam 151, the return unit 1711 will extend, as shown in FIG. 3, so that the sliding table 1715 and the first alignment pin 131 are displaced toward the center of the carrier 11, and It is close to the placement area 113 of the carrier 11 to reduce the distance between the first alignment pins 131. When the distance between the first alignment pins 131 is the smallest, it can be defined as an alignment state, and the first substrate 121 can be positioned through the first alignment pins 131.

In addition, when the second cam 153 rotates, the second follower 173 will sequentially contact the convex portion 1531 and the concave portion 1533 of the second cam 153. When the second follower 173 contacts the convex portion 1531 of the second cam 153, it will The compression recovery unit 1711, as shown in FIG. 4, causes the sliding table 1715 and the second alignment pins 133 to move toward the outer edge of the carrier 11 to increase the distance between the respective second alignment pins 133. When the distance between the second alignment pins 133 is the largest, it can be defined as an open state, and the second substrate 123 can be placed in the placement area 113 between the second alignment pins 133.

When the second follower 173 contacts the recess 1533 of the second cam 153, the return unit 1711 will extend, as shown in FIG. 3, so that the sliding table 1715 and the second alignment pin 133 are displaced toward the center of the carrier 11 to The distance between the respective second alignment pins 133 is reduced. When the distance between the second alignment pins 133 is the smallest, it can be defined as an alignment state, and the second substrate 123 between the second alignment pins 133 can be positioned through the second alignment pins 133.

The minimum spacing between the first alignment pins 131 and the minimum spacing between the second alignment pins 133 can be adjusted according to the sizes of the first substrate 121 and the second substrate 123, respectively. Specifically, the first substrate 121 and the second substrate 123 are disc-shaped, and the circle formed by the first alignment pins 131 in the aligned state is similar to the size of the first substrate 121, but in the aligned state The circle formed by the second alignment pins 133 is similar to the size of the second substrate 123.

In an embodiment of the present invention, the alignment mechanism 10 of the bonding machine may include at least three lifting pins 135 arranged on the bearing surface 111 of the carrier 11, wherein the first alignment pin 131 and the second alignment pin 133 It is arranged around the upper lifting pin 135, for example, the upper lifting pin 135 can be arranged in the placement area 113 of the carrier 11. The lifting pin 135 can be raised and lowered relative to the bearing surface 111 of the vertical carrier 11. For example, the lifting pin 135 can be connected to a lifting unit 137, and the lifting pin 135 can be driven relative to the bearing surface 111 of the platform 11 through the lifting unit 137. Lift. The lifting pin 135 can be used to receive and carry the first substrate 121 when it is raised, and the lifting pin 135 can be used to place the loaded first substrate 121 on the bearing surface 111 of the carrier 11 when it is lowered. In addition, the lifting pins 135 can be lowered synchronously or asynchronously, and the first substrate 121 is placed on the supporting surface 111 of the carrier 11 in a flat or inclined manner. The lifting pin 135 is not a necessary component of the present invention. In different embodiments, the first substrate 121 can also be directly placed in the placement area 113 of the carrier 11.

Please refer to FIG. 5 to FIG. 11, which are schematic diagrams of the steps of an embodiment of the alignment method of the new bonding machine. First, the first substrate 121 is transferred to the stage 11, as shown in FIG. 5. In an embodiment of the present invention, please refer to FIG. 1, at least three lifting pins 135 rise to protrude from the carrying surface 111 of the carrier 11, and the first substrate 121 is placed on the protruding carrying surface through a mechanical arm 18 111 on the lift pin 135 on. The lifting pin 135 can be lowered relative to the bearing surface 111 and place the loaded first substrate 121 on the bearing surface 111 of the stage 11, as shown in FIG. 6.

In another embodiment of the present invention, the robot arm 18 can adsorb the upper surface of the first substrate 121 and directly place the first substrate 121 in the placement area 113 of the carrying surface 111 of the stage 11, so that it does not need to be installed. Sale 135. In addition, when the first substrate 121 is placed on the lifting pins 135 and/or the carrier 11, the second alignment pins 133 will protrude from the carrying surface 111 of the carrier 11 and are in an open state. For example, the convex portion 1531 of the second cam 153 will contact the second follower 173, so that the second alignment pin 133 protruding from the bearing surface 111 of the carrier 11 is in an open state.

After the first substrate 121 is placed on the carrying surface 111 of the carrier 11, the first alignment pins 131 will rise and protrude from the carrying surface 111 of the carrier 11, as shown in FIG. 7. At this time, the convex portion 1511 of the first cam 151 will contact the first follower 171, so that the first alignment pins 131 protruding from the bearing surface 111 of the carrier 11 are in an open state. The spacing can be the largest, please refer to Figure 2 and Figure 4 for cooperation.

The first cam 151 rotates relative to the carrier 11 and drives the first alignment pin 131 to move, so that the first alignment pin 131 protruding from the bearing surface 111 of the carrier 11 is in an aligned state, as shown in Figure 8 and please cooperate Refer to Figure 2 and Figure 3. Each of the first alignment pins 131 in the aligned state will form a circle similar in size and shape to the first substrate 121, and the first alignment pins 131 will be positioned when they are switched from the open state to the aligned state. The first substrate 121 carried by the stage 11.

After the positioning of the first substrate 121 is completed, the upper surface of the second substrate 123 can be adsorbed by the robot arm 18, and the second substrate 123 can be transferred to the stage 11, as shown in FIG. 9. Specifically, the robot arm 18 can place the second substrate 123 on the first alignment pins 131 and use the first alignment pins 131 to carry the second substrate 123 while the second alignment pins 133 are in an open state. At this time, the second substrate 123 will not contact the first substrate 121, and there is a gap between the first substrate 121 and the second substrate 123.

The second cam 153 rotates relative to the carrier 11 and drives the second alignment pin 133 to move, so that the second alignment pin 133 protruding from the bearing surface 111 is in an aligned state, as shown in FIG. 10 and please refer to FIGS. 2 and 2 and image 3. Each of the second alignment pins 133 in the aligned state will form a circle similar in size and shape to the second substrate 123, and the second alignment pins 133 will be positioned when they are switched from the open state to the aligned state. The second substrate 123 carried by the first alignment pins 131.

After the positioning of the second substrate 123 is completed, the second substrate 123 will be aligned with the first substrate 121, and the first alignment pins 131 will be lowered relative to the bearing surface 111 of the stage 11, and the loaded second substrate 123 will be placed On the first substrate 121, the alignment of the first substrate 121 and the second substrate 123 is thereby completed, and the bonding of the first substrate 121 and the second substrate 123 is performed, as shown in FIG. 11.

In an embodiment of the present invention, the first substrate 121 includes but is not limited to a wafer or a chip, and the second substrate 123 includes but is not limited to a sapphire carrier substrate.

The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of implementation of the present invention, that is, all the equivalent changes and changes in the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention Modifications should be included in the scope of the patent application for this new model.

10: Alignment mechanism of the bonding machine 11: Stage 111: bearing surface 113: drop zone 121: first substrate 123: second substrate 131: first alignment pin 133: second alignment pin 135: Upsell 136: Lifting unit 137: Lifting unit 141: Hinge 143: Bearing 145: Drive 151: The First Cam 1511: convex 1513: recess 153: The second cam 1531: convex 1533: recess 161: The first fixing frame 163: second fixing frame 171: first follower 1711: Reply Unit 1713: sliding seat 1715: sliding table 1717: connecting rod 1719: roller 173: second follower 18: Robotic arm

[Figure 1] is a three-dimensional schematic diagram of an embodiment of the alignment mechanism of the new bonding machine.

[Figure 2] is a schematic cross-sectional view of an embodiment of the alignment mechanism of the new bonding machine.

[Fig. 3] is a top view of an embodiment of the cam, the alignment pin and the follower of the alignment mechanism of the new bonding machine in the alignment state.

[Figure 4] is a top view of an embodiment of the cam, the alignment pin and the follower of the alignment mechanism of the new bonding machine in an open state.

[Fig. 5] to [Fig. 11] are schematic diagrams of the steps of an embodiment of the alignment method of the new bonding machine.

10: Alignment mechanism of the bonding machine

11: Stage

111: bearing surface

113: drop zone

131: first alignment pin

133: second alignment pin

135: Upsell

Claims (10)

An alignment mechanism of a bonding machine includes: At least three first alignment pins are located on a bearing surface of a carrier and used to position the first substrate and a second substrate carried by the carrier, wherein the first alignment pins are relative to the carrier The bearing surface is lifted; At least three second alignment pins located on the carrying surface and used for positioning the second substrate carried by the first alignment pins; A first cam connected to the first alignment pin, wherein when the first cam rotates, the distance between the first alignment pins is changed to position the first substrate carried by the carrier; and A second cam is connected to the second alignment pin. When the second cam rotates, the distance between the second alignment pins is changed to position the second substrate carried by the first alignment pin, so that The second substrate is aligned with the first substrate. The alignment mechanism of the bonding machine platform according to claim 1, including at least three lifting pins located on the bearing surface of the carrier, and the first alignment pin and the second alignment pin are arranged around Around the lifting pin, the lifting pin is used for receiving and carrying the first substrate, and is raised and lowered relative to the carrying surface of the carrier, so as to place the carried first substrate on the carrying surface of the carrier on. The alignment mechanism of the bonding machine according to claim 1, wherein the first cam and the second cam are stacked and connected to a rotating shaft. The alignment mechanism of the bonding machine according to claim 1, wherein the number of the first alignment pin and the second alignment pin is three, and the angle of action of the first cam and the second cam is 120 degrees. The alignment mechanism of the bonding machine platform according to claim 1 includes a lifting unit connected to the first alignment pin, and drives the first alignment pin to rise and fall relative to the bearing surface of the carrier. The alignment mechanism of the bonding machine according to claim 1, including at least three first followers and at least three second followers, respectively connected to the first cam and the second cam, and the second cam An alignment pin and a second alignment pin are respectively arranged on the first follower and the second follower. The alignment mechanism of the bonding machine according to claim 6, wherein the first follower and the second follower include a return unit, a sliding seat and a sliding table, and the sliding table is arranged on the sliding table. Seat, one end of the sliding table is connected to the first cam or the second cam, and the other end of the sliding table is connected to the return unit, and the first alignment pin or the second pair is provided on the sliding table Quasi-sale. The alignment mechanism of the bonding machine table according to claim 7, further comprising a plurality of rollers connected to the sliding table and attached to the first cam or the second cam. The alignment mechanism of the bonding machine stage according to claim 1, wherein the first alignment pin is displaced relative to the bearing surface of the stage, and the loaded second substrate is placed on the first substrate . The alignment mechanism of the bonding machine according to claim 1, wherein the first alignment pin and the second alignment pin are adjacent and staggered.

Images