TWM678168U - Light board assembly and backlight module - Google Patents

Abstract

A light board assembly includes a flexible circuit board, a plurality of light-emitting elements and a reinforcement plate. The flexible circuit board has a first side surface and a second side surface opposite to the first side surface. The light-emitting elements are disposed on the first side surface. The reinforcement plate is disposed to the second side surface and overlaps the light-emitting elements. A backlight module having the light board assembly is also provided.

Description

Light panel assembly and backlight module

This invention relates to a light source assembly, and more particularly to a light panel assembly, and a backlight module having the aforementioned light panel assembly.

The structure of a liquid crystal display (LCD) mainly includes components such as a backlight module, a display panel, and a frame. Based on the direction of the light source, backlight modules can be divided into edge-lit backlight modules and direct-lit backlight modules. Direct-lit backlight modules have the advantage of better uniformity of surface light sources and are beneficial for achieving local dimming functionality.

Generally, direct-lit backlight modules use LED panels as the light source. Some direct-lit backlight modules use flexible circuit boards (PCBs) to hold the light-emitting elements, allowing for adaptation to different installation spaces. However, flexible PCBs are more prone to deformation than printed circuit boards (PCBs), causing the light-emitting elements to easily detach from the PCB during manufacturing or experience electrical malfunctions. Therefore, in the prior art, LED panels and backlight modules using flexible PCBs still suffer from poor yield rates.

The "Prior Art" paragraph is only used to help understand the content of this invention. Therefore, the content disclosed in the "Prior Art" paragraph may include some prior art that does not constitute conventional art known to those skilled in the art. The content disclosed in the "Prior Art" paragraph does not imply that the content or the problem to be solved by one or more embodiments of this invention was known or recognized by those skilled in the art prior to this application.

This creation provides a light panel assembly to improve yield.

This creation provides a backlight module to improve yield.

Other purposes and advantages of this invention can be further understood from the technical features disclosed herein.

To achieve one or more of the above objectives or other objectives, one embodiment of the present invention provides a light panel assembly, including a flexible circuit substrate, a plurality of light-emitting elements, and a reinforcing plate. The flexible circuit substrate has opposing first and second side surfaces. The light-emitting elements are disposed on the first side surface. The reinforcing plate is disposed on the second side surface and overlaps the light-emitting elements.

In one embodiment of this invention, the aforementioned flexible circuit substrate includes, for example, a reflective layer. The reflective layer covers a first side surface and surrounds each light-emitting element.

In one embodiment of this invention, the flexible circuit substrate described above may have an insulating portion and multiple electrical connection portions, with the insulating portion exposing the electrical connection portions. Light-emitting elements are respectively electrically connected to the electrical connection portions. The reflective layer may include a first reflective portion and a second reflective portion. The first reflective portion covers the insulating portion, and the second reflective portion covers the electrical connection portions.

In one embodiment of this invention, the first reflective portion and the second reflective portion may be made of different materials.

In one embodiment of this invention, the first side surface may have a first region and a second region spaced apart from each other, with light-emitting elements respectively disposed in the first region and the second region. The reinforcing plate has a first portion and a second portion. The first portion overlaps with the first region, and the second portion overlaps with the second region. The first portion and the second portion may be integral or separate from each other, for example.

In one embodiment of this invention, the reinforcing plate may have a supporting surface, which is fixed to the second side surface. The light-emitting element is located within the orthographic projection range of the outer edge of the supporting surface on the first side surface.

In one embodiment of this invention, the aforementioned light-emitting element may include a plurality of peripheral light-emitting elements and at least one intermediate light-emitting element, with the peripheral light-emitting elements surrounding the at least one intermediate light-emitting element. Each peripheral light-emitting element has a side facing away from the at least one intermediate light-emitting element, and the side faces are arranged to form a distribution boundary of the light-emitting elements. The distance between the outer edge of the reinforcing plate and the distribution boundary is, for example, between 0.1 mm and 1 mm.

In one embodiment of this invention, the thickness of the reinforcing plate may be between 0.1 mm and 2 mm.

In one embodiment of this invention, the aforementioned reinforcing plate may include, for example, a metal plate or a plastic plate.

In one embodiment of this invention, each of the above-described light-emitting elements may have a light-emitting part and a driving part, the driving part being electrically connected to a flexible circuit substrate. The light-emitting part is electrically connected to the driving part and is located on the side of the driving part opposite to the flexible circuit substrate.

In one embodiment of this invention, the aforementioned driving unit may include a complementary metal oxide semiconductor driving circuit.

In one embodiment of this invention, the aforementioned lamp panel assembly may further include protective electronic components. The flexible circuit substrate has an external connection. The light-emitting element is electrically connected to the flexible circuit substrate, and the protective electronic components are electrically connected to the external connection and the light-emitting element.

To achieve one or more of the above objectives or other objectives, an embodiment of this invention provides a backlight module including the aforementioned lamp panel assembly and a backplate. The backplate supports the lamp panel assembly.

In one embodiment of this invention, the back panel described above has, for example, a clearance structure, within which the reinforcing plate is located.

In one embodiment of the invention, the backlight module described above may further include a wavelength conversion layer and a filter layer, with the lamp assembly and the wavelength conversion layer located on opposite sides of the filter layer.

In one embodiment of this invention, the aforementioned backlight module further includes, for example, a diffuser, with the lamp assembly located between the diffuser and the backplate.

In one embodiment of this invention, the interior of the aforementioned diffuser may contain multiple light-scattering particles.

In one embodiment of this invention, the aforementioned diffuser has opposing third and fourth surfaces. The fourth surface faces the lamp assembly, and the third and/or fourth surfaces, for example, have multiple microstructures.

In one embodiment of this invention, the backlight module described above may further include a frame. The backplate has a bottom plate portion and a side plate portion. The bottom plate portion supports the second side surface, and the side plate portions are connected to the bottom plate portion and surround the lamp panel assembly. The frame is disposed between the side plate portions and the lamp panel assembly.

In this invention, the reinforcing plate of the lamp panel assembly is fixed to the second surface of the flexible circuit substrate and overlaps with the light-emitting element, thereby supporting the area of the flexible circuit substrate where the light-emitting element is fixed. In this way, the flexible circuit substrate can be more easily maintained flat due to the support of the reinforcing plate, significantly reducing the problem of the light-emitting element detaching from the flexible circuit substrate or experiencing electrical abnormalities during the manufacturing process. Therefore, the lamp panel assembly of this invention can effectively improve yield. The backlight module of this invention uses the above-described lamp panel assembly, thus effectively improving yield.

To make the above and other purposes, features and advantages of this invention more apparent, specific examples are provided below, along with accompanying diagrams, for detailed explanation.

The foregoing descriptions and other technical contents, features, and effects of this invention will be clearly presented in the detailed description of one of the preferred embodiments with reference to the following reference drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are merely directions for reference to the supplementary drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the invention.

Figure 1 is a cross-sectional schematic view of a lamp panel assembly according to an embodiment of the present invention. Figure 2 is a top schematic view of the lamp panel assembly of Figure 1. Figure 3 is an enlarged schematic view of region Z1 of the lamp panel assembly of Figure 2. Figure 4 is a bottom schematic view of the lamp panel assembly of Figure 1. Referring first to Figures 1 and 2, the lamp panel assembly 100 includes a flexible circuit substrate 110, a plurality of light-emitting elements 120, and a reinforcing plate 130. The flexible circuit substrate 110 has opposing first side surfaces S1 and second side surfaces S2. The light-emitting elements 120 are disposed on the first side surface S1. The reinforcing plate 130 is disposed on the second side surface S2 and overlaps with the light-emitting elements 120.

The flexible circuit substrate 110 provides an electrical connection for the light-emitting element 120. Specifically, the flexible circuit substrate 110 may include an insulating portion 111, a circuit layer 112, and a substrate 113, wherein the circuit layer 112 has multiple electrical connection portions 1121. The insulating portion 111 is located on the substrate 113 and disposed opposite to the reinforcing plate 130. The circuit layer 112 is located between the insulating portion 111 and the substrate 113, and the insulating portion 111 exposes the multiple electrical connection portions 1121 of the circuit layer 112. It should be noted that, in this embodiment, the first side surface S1 may include the surface 1110 of the insulating portion 111 facing away from the reinforcing plate 130 and the surface 1120 of the circuit layer 112 exposed from the insulating portion 111. The light-emitting element 120 is electrically connected to the electrical connection portion 1121 exposed from the insulating portion 111. Furthermore, referring to Figures 1 and 3, the insulating portion 111 may cover the circuit layer 112 of the flexible circuit substrate 110 and has multiple openings O to expose multiple areas of the circuit layer 112 for electrical connection of the light-emitting element 120, wherein the multiple areas are the electrical connection portions 1121. In one embodiment, the flexible circuit substrate 110 may include a flexible printed circuit (FPC), the insulation portion 111 may be made of polyimide (PI), and the electrical connection portion 1121 may be made of copper, but the invention is not limited thereto.

Please refer to Figures 1 and 2 again. The light-emitting element 120 of this embodiment includes, for example, a light-emitting diode (LED), but other embodiments are not limited to this. Incidentally, the light-emitting element 120 may be arranged in an array on the flexible circuit substrate 110, but this invention does not impose many restrictions on the specific arrangement.

The reinforcing plate 130 can be disposed and fixed to the second side surface S2 of the flexible circuit substrate 110, and can overlap all the light-emitting elements 120 in the normal direction N of surfaces 1110 and 1120, wherein surfaces 1110 and 1120 can be substantially parallel. Thus, the reinforcing plate 130 can support the area of the flexible circuit substrate 110 where all the light-emitting elements 120 are fixed, thereby keeping the area of the flexible circuit substrate 110 where the light-emitting elements 120 are fixed flat. Specifically, the reinforcing plate 130 can have a supporting surface 131, and the supporting surface 131 can be disposed and fixed to the second side surface S2. All the light-emitting elements 120 are located within the range of the outer edge E of the supporting surface 131 within the orthographic projection P of the first side surface S1. In other words, the reinforcing plate 130 can substantially overlap all the light-emitting elements 120 in the normal direction N. In this way, in addition to providing stronger support for the area of the flexible circuit board 110 that fixes the light-emitting elements 120, it can also leave a margin to allow for errors in the installation position of the reinforcing plate 130, thereby further improving the yield of the lamp board assembly 100.

Furthermore, referring to Figures 2 and 4, the light-emitting element 120 may include a plurality of peripheral light-emitting elements 121 and at least one intermediate light-emitting element 122. This embodiment exemplifies nine intermediate light-emitting elements 122, with the peripheral light-emitting elements 121 surrounding the nine intermediate light-emitting elements 122. Each peripheral light-emitting element 121 has a side face S facing away from the intermediate light-emitting element 122, and the side faces S are arranged to form the distribution boundary B of the light-emitting element 120. For example, each peripheral light-emitting element 121 located at a corner may have two side faces S, while each peripheral light-emitting element 121 located between two said corners may have one side face S. The distance G between the outer edge E and the distribution boundary B is, for example, between 0.1 mm and 1 mm. In short, the outer edge E of the supporting surface 131 may extend beyond the distribution boundary B of the light-emitting element 120 by approximately 0.1 mm to 1 mm. In one embodiment, the spacing G may be approximately 0.5 mm to 1 mm, but this invention does not impose further limitations on this. In another embodiment, the thickness T of the reinforcing plate 130 may be between 0.1 mm and 2 mm to further strengthen the support of the reinforcing plate 130 for the flexible circuit substrate 110. Incidentally, the reinforcing plate 130 of this embodiment may include, for example, a metal plate or a plastic plate, wherein the metal plate may include, for example, a stainless steel plate or an aluminum plate, and the plastic plate may include a polyimide (PI) plate or a polyethylene terephthalate (PET) plate, but this invention does not impose further limitations on the specific materials.

Compared to conventional technology, in this embodiment, the reinforcing plate 130 of the lamp panel assembly 100 is fixed to the second side surface S2 of the flexible circuit substrate 110 and overlaps with the light-emitting element 120, so that the area of the flexible circuit substrate 110 for fixing the light-emitting element 120 is supported by the reinforcing plate 130. Thus, the flexible circuit substrate 110 can be more easily kept flat by the support of the reinforcing plate 130, significantly reducing the problem of the light-emitting element 120 detaching from the flexible circuit substrate 110 or experiencing electrical abnormalities during the manufacturing process. Therefore, the lamp panel assembly 100 of this embodiment can effectively improve the yield.

For example, in the prior art, a flexible circuit substrate is fixed to a glass stage by an adhesive to maintain flatness, and the light-emitting element is bonded to the flexible circuit substrate through mass transfer. However, during the mass transfer process, the high temperature generated by the laser changes the material properties of the adhesive, making it impossible to remove the flexible circuit substrate from the glass stage. In this case, forcibly detaching the flexible circuit substrate from the glass stage will cause the light-emitting element to detach from the flexible circuit substrate or cause electrical abnormalities, resulting in poor yield of the conventional lamp panel assembly. However, in an embodiment of the present invention, the lamp panel assembly 100 uses a reinforcing plate 130 to maintain the flatness of the area of the flexible circuit substrate 110 where the light-emitting element 120 is fixed, and transfers the light-emitting element onto the flexible circuit substrate 110 through a mass transfer process. In this way, the problem caused by high laser temperature in the prior art can be eliminated, thereby greatly improving the shortcomings of the light-emitting element 120 falling off the flexible circuit substrate 110 or causing electrical abnormalities, so as to effectively improve the yield of the lamp panel assembly 100.

Figure 5 is a cross-sectional schematic view of a lamp panel assembly according to another embodiment of the present invention. Figure 6 is a top view of the lamp panel assembly of Figure 5. Figure 7 is a partial top view of the lamp panel assembly according to another embodiment of the present invention. Figure 8 is a partial enlarged schematic view of the lamp panel assembly of Figure 5. The structure and advantages of the lamp panel assembly 100a of this embodiment are similar to those of the embodiment of Figure 1; the differences will be explained below. Referring first to Figures 5 and 6, the flexible circuit substrate 110 includes, for example, a reflective layer R. The reflective layer R covers the first side surface S1 and surrounds each light-emitting element 120 to improve light utilization. Specifically, the reflective layer R may cover the insulating portion 111 and the circuit layer 112 exposed by the insulating portion 111; for example, the reflective layer R may cover the electrical connection portion 1121 and the first side surface S1 of the block without circuit layer 112 traces between two adjacent electrical connection portions 1121 to expose the light-emitting element 120. Furthermore, the reflective layer R may include a first reflective portion R1 and a second reflective portion R2. The first reflective portion R1 covers the insulating portion 111, and the second reflective portion R2 covers the circuit layer 112 exposed by the first reflective portion R1; for example, the second reflective portion R2 may cover the electrical connection portion 1121 and the block without circuit layer 112 traces between two adjacent electrical connection portions 1121. Furthermore, the first reflective portion R1 can extend from the insulating portion 111 to the circuit layer 112 to cover the electrical connection portion 1121 exposed by the insulating portion 111 and the portion of the non-circuit layer 112 traces between adjacent electrical connection portions 1121. Another portion of the electrical connection portion 1121 and another portion of the non-circuit layer 112 traces between adjacent electrical connection portions 1121 are covered by the second reflective portion R2. In one embodiment, the second reflective portion R2 can be spaced apart from each light-emitting element 120 by a distance of approximately 20 μm, but this invention is not limited to this. Incidentally, Figure 6 clearly shows the first reflective portion R1 and the second reflective portion R2, and the electrical connection portion 1121 is shown in a simplified shape, but the specific shape of the electrical connection portion 1121 is not limited to that shown in Figure 6. For example, referring to Figure 7, the electrical connection portion 1121a may be irregular in shape and extend outward from near the light-emitting element 120.

Referring to Figures 5, 6, and 8, the first reflective portion R1 and the second reflective portion R2 may be made of different materials. Specifically, the first reflective portion R1 and the second reflective portion R2 may be formed through different processes, therefore, the first reflective portion R1 and the second reflective portion R2 may use different materials. For example, the material of the first reflective portion R1 may include solder resist ink, and it may be formed by printing on the insulating portion 111 and the portion exposed by the insulating portion 111, wherein the portion exposed by the insulating portion 111 may include the electrical connection portion 1121 and the area between two adjacent electrical connection portions 1121 where there is no circuit layer 112 trace. The solder resist ink includes, for example, a two-component imaging type solder resist ink, but is not limited to this. On the other hand, the material of the second reflective portion R2 may include ink, and it may be formed by inkjet printing on another portion of the electrical connection portion 1121 exposed by the insulation portion 111 and on another portion of the area between two adjacent electrical connection portions 1121 without circuit layer 112 traces. The ink may include, for example, water-based environmentally friendly latex ink, but is not limited thereto. Incidentally, because the second reflective portion R2 is formed by inkjet printing, it may cover a portion of the first reflective portion R1, but this invention does not impose further limitations on this detail. In one embodiment, the reflectivity of the first reflective portion R1 may be greater than 70%, while the second reflective portion R2 may have a different reflectivity than the first reflective portion R1. The reasons for the different reflectivities of the first reflective portion R1 and the second reflective portion R2 include material differences or thickness differences, and this invention does not impose further limitations on these. Furthermore, this work does not impose any restrictions on the specific numerical values of the aforementioned reflectivity.

Incidentally, referring to Figure 8, the flexible circuit substrate 110 of this embodiment is, for example, a double-layer circuit substrate, meaning that the flexible circuit substrate 110 may have circuit layer 112a and circuit layer 112b. In one embodiment, circuit layer 112a is the column control lines and power supply (VCC), and circuit layer 112b is the row control lines and ground (GND), but this is not a limitation. The flexible circuit substrate 110 in other embodiments of this invention can also be the aforementioned double-layer circuit substrate.

Figure 9 is a top view of a lamp panel assembly according to another embodiment of the present invention. Figure 10 is a bottom view of the lamp panel assembly of Figure 9. Figure 11 is a top view of a lamp panel assembly according to another embodiment of the present invention. Figure 12 is a bottom view of the lamp panel assembly of Figure 11. The structures and advantages of lamp panel assemblies 100b and 100c are similar to those of the embodiment of Figure 1; the differences are explained below. Referring first to Figures 9 and 10, the first side surface S1 may have a first region A1 and a second region A2 spaced apart from each other, and multiple light-emitting elements 120 are respectively disposed in the first region A1 and the second region A2. The reinforcing plate 130 has a first portion 132 and a second portion 133. The first portion 132 overlaps with the first region A1, and the second portion 133 overlaps with the second region A2. The first part 132 and the second part 133 are, for example, an integral structure. That is, in this embodiment, a reinforcing plate 130 supports multiple light-emitting elements 120 located in the first region A1 and the second region A2 from the second side surface S2 of the flexible circuit substrate 110, thereby simplifying the assembly steps of the lamp panel assembly 100b. Incidentally, the lamp panel assembly 100b of this embodiment can be applied to virtual reality headsets, but the invention is not limited thereto.

In one embodiment, as shown in Figures 11 and 12, the first portion 132c and the second portion 133c of the reinforcing plate 130c can be separate from each other. For example, the first portion 132c supports the light-emitting element 120 located in the first region A1, while the second portion 133c supports the light-emitting element 120 located in the second region A2. In this way, the area of the flexible circuit board 110 overlapping the reinforcing plate 130c can be reduced, thereby reserving more leeway for the flexible circuit board 110 to bend, making the lamp assembly 100c more easily adaptable to different installation spaces. Incidentally, in another embodiment, such as shown in FIG13, the difference between FIG13 and FIG11 is that the first region A1 and the second region A2 can be located on different flexible circuit substrates 110c1 and 110c2 respectively, and the first part 132d of the reinforcing plate 130d can be disposed on the flexible circuit substrate 110c1, while the second part 133d can be disposed on the flexible circuit substrate 110c2.

Figure 14 is a cross-sectional schematic diagram of a lamp panel assembly according to another embodiment of the present invention. The structure and advantages of the lamp panel assembly 100d of this embodiment are similar to those of the embodiment in Figure 1; the differences will be explained below. Referring to Figure 14, each light-emitting element 120d may have a light-emitting section 121d and a driving section 122d, with the driving section 122d electrically connected to the flexible circuit substrate 110. The light-emitting section 121d is electrically connected to the driving section 122d and is located on the side of the driving section 122d opposite to the flexible circuit substrate 110. Therefore, each light-emitting section 121d can be individually controlled by each driving section 122d to increase the number of dimming zones in the lamp panel assembly 100d, and also has the advantage of low power consumption. In detail, within the same light-emitting element 120d, the driving unit 122d can control the emitted light brightness of the light-emitting unit 121d according to the received signal, enabling each light-emitting element 120d to form its own dimming zone. The driving unit 122d may include a driving circuit, and the light-emitting unit 121d may include a light-emitting chip. Furthermore, in one embodiment, the driving unit 122d may include a complementary metal-oxide-semiconductor driving circuit, but the invention is not limited thereto. In another embodiment, an optical cover may be provided on the side of the light-emitting unit 121d opposite to the driving unit 122d to change the light emission path of the light-emitting unit 121d, but the invention does not impose further limitations on this.

Figure 15 is a top view schematic diagram of a lamp panel assembly according to another embodiment of the present invention. The structure and advantages of the lamp panel assembly 100e of this embodiment are similar to those of the embodiment in Figure 1; the differences are described below. Referring to Figure 15, the lamp panel assembly 100e may further include a protective electronic component 140. The flexible circuit board 110e has an external connection C. The light-emitting element 120 is electrically connected to the flexible circuit board 110e, and the protective electronic component 140 is electrically connected to the external connection C and the light-emitting element 120 to prevent damage to each light-emitting element 120 from excessive instantaneous voltage. Specifically, the protective electronic component 140 may be connected in parallel between the external connection C and the light-emitting element 120, and may cut off power when the instantaneous voltage is too high, wherein the instantaneous voltage may be caused by static electricity. In this embodiment, the protective electronic component 140 includes an ESD diode, and the external portion C may include the bonding fingers of the flexible circuit substrate 110e. The light-emitting elements 120 in Figure 15 are arranged in a 5x5 array. Each row of light-emitting elements 120 is connected to the same row control line, and each column of light-emitting elements 120 is also connected to the same column control line. Therefore, in this embodiment, there are five row control lines and five column control lines. The five row control lines converge to a single flexible flat panel cable and are divided into five bonding fingers (i.e., external portions C). The five column control lines converge to another flexible flat panel cable and form five bonding fingers. Therefore, the number of external portions C is ten, and they are located on the two flexible flat panel cables respectively. Each row control line and each column control line must have a corresponding parallel protection electronic component 140. Therefore, the number of protection electronic components 140 is ten, but this invention does not impose any restrictions on the number of protection electronic components 140 and external parts C.

Figure 16 is a cross-sectional schematic diagram of a backlight module according to an embodiment of the present invention. Referring to Figure 16, the backlight module 200 includes a lamp panel assembly 100 and a back plate 210. The back plate 210 supports the lamp panel assembly 100.

The backplate 210 may have a bottom plate portion 211 and a side plate portion 212. The bottom plate portion 211 supports the second side surface S2 of the flexible circuit substrate 110. The side plate portion 212 connects to the bottom plate portion 211 and surrounds the lamp panel assembly 100. The backplate 210 may have, for example, a clearance structure 213, wherein the clearance structure 213 is located in the bottom plate portion 211, and the reinforcing plate 130 is located within the clearance structure 213, so as to reduce the thickness and weight of the backlight module 200 by means of the clearance structure 213. In addition, the lamp panel assembly 100 can also be fixed to the backplate 210 by means of the clearance structure 213. For example, in this embodiment, the clearance structure 213 may be a through hole penetrating the bottom plate portion 211 to facilitate processing. In the normal direction N, the thickness T1 of the base plate 211 can be greater than the thickness T of the reinforcing plate 130, so that the reinforcing plate 130 will not protrude from the through hole, thereby maintaining the surface flatness of the base plate 211. Incidentally, the opening width of the through hole can be slightly larger than the width of the reinforcing plate 130 to facilitate the installation and alignment of the reinforcing plate 130 to the back plate 210. In one embodiment, the clearance structure 213 can be a groove, and the invention is not limited to this.

In this embodiment, the backlight module 200 may further include a wavelength conversion layer 220 and a filter layer 230, with the lamp panel assembly 100 and the wavelength conversion layer 220 located on opposite sides of the filter layer 230. Specifically, the filter layer 230 is located on the beam path of the light-emitting element 120. The filter layer 230 allows the light beam emitted by the light-emitting element 120 to pass through and reflects the light beam after its wavelength has been converted by the wavelength conversion layer 220, so as to prevent the light beam converted by the wavelength conversion layer 220 from being incident on the lamp panel assembly 100 and absorbed or scattered by the lamp panel assembly 100. For example, in one embodiment, the light-emitting element 120 can generate a blue light beam, and the filter layer 230 allows the blue light beam within a specific wavelength range to pass through and be incident on the wavelength conversion layer 220. The wavelength conversion layer 220 can then convert the blue light beam into a green light beam and a red light beam. The filter layer 230 can further reflect the green light beam and red light beam converted by the wavelength conversion layer 220. The wavelength conversion layer 220 in this embodiment may include a quantum dot film or a fluorescent film, and other embodiments are not limited to this.

Compared to the prior art, the backlight module 200 of this embodiment uses the aforementioned lamp panel assembly 100, thus effectively improving the yield. In other embodiments, the backlight module 200 may use lamp panel assemblies 100a, 100b, 100c, 100d, or 100e.

Incidentally, the backlight module 200 of this embodiment may also include a frame 240. The frame 240 is disposed between the side panel portion 212 and the lamp panel assembly 100. For example, the frame 240 may be located inside the side panel portion 212 and surround the lamp panel assembly 100. The frame 240 may include a plastic frame, but the invention is not limited thereto.

Figure 17 is a cross-sectional schematic diagram of a backlight module according to another embodiment of the present invention. The structure and advantages of the backlight module 200a are similar to those of the embodiment in Figure 17; the differences are explained below. Referring to Figure 17, the backlight module 200a, for example, also includes a diffuser 250, with the lamp assembly 100 located between the diffuser 250 and the backplate 210 to improve light uniformity. For example, the diffuser 250 may be located on the side of the wavelength conversion layer 220 opposite to the lamp assembly 100, while in one embodiment, the diffuser 250 may be located between the filter layer 230 and the lamp assembly 100. In this embodiment, the diffuser 250 may have multiple light-scattering particles 251 inside to scatter incident light.

Figure 18 is a cross-sectional schematic diagram of a backlight module according to another embodiment of the present invention. The structure and advantages of the backlight module 200b are similar to those of the embodiment in Figure 17; the differences are explained below. Referring to Figure 18, the diffuser 250b has opposing third surfaces S3 and fourth surfaces S4. The fourth surface S4 faces the lamp panel assembly 100. The third surface S3 and/or the fourth surface S4, for example, have multiple microstructures M to scatter incident light through the microstructures M. In this embodiment, the fourth surface S4 is exemplified by having multiple microstructures M. Specifically, the shape of the microstructures M may be approximately quadrangular pyramidal, but the present invention is not limited to this. In one embodiment, the diffuser 250b may contain multiple light-scattering particles 251 as shown in Figure 18.

In summary, the lamp panel assembly and backlight module of the present invention have at least one of the following advantages. In the present invention, the reinforcing plate of the lamp panel assembly is fixed to the second surface of the flexible circuit substrate and overlaps with the light-emitting element, so as to support the area of the flexible circuit substrate for fixing the light-emitting element by means of the reinforcing plate. In this way, the flexible circuit substrate can be more easily kept flat by means of the reinforcing plate, so as to greatly reduce the problem of the light-emitting element detaching from the flexible circuit substrate or causing electrical abnormalities during the manufacturing process. Therefore, the lamp panel assembly of the present invention can effectively improve the yield. The backlight module of the present invention adopts the above-described lamp panel assembly, so the yield can be effectively improved.

The above description is merely a preferred embodiment of this invention and should not be construed as limiting the scope of its implementation. Any simple equivalent changes and modifications made to the scope of the patent application and the description thereof shall still fall within the scope of this patent. Furthermore, no embodiment or patent application needs to achieve all the purposes, advantages, or features disclosed in this invention. In addition, the abstract and title are merely for assisting in patent document searches and are not intended to limit the scope of this invention. Moreover, the terms "first," "second," etc., used in this specification or patent application are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

100, 100a, 100b, 100c, 100d, 100e: Lamp board assembly 110, 110c, 110c1, 110c2, 110e: Flexible circuit board 111: Insulation portion 112, 112a, 112b: Electrical connection portion 113: Substrate 120, 120d: Light-emitting element 121: Peripheral light-emitting element 121d: Light-emitting part 122: Central light-emitting element 122d: Driver portion 130, 130c, 130d: Reinforcing plate 131: Support surface 132, 132c, 132d: First part 133, 133c, 133d: Second part 140: Protective electronic component 200, 200a, 200b: Backlight module; 210: Backplate; 211: Bottom plate; 212: Side plate; 213: Avoidance structure; 220: Wavelength conversion layer; 230: Filter layer; 240: Frame; 250, 250b: Diffuser; 251: Light scattering particles; 1110, 1120: Surface; 1121, 1121a: Electrical connection; A1: First region; A2: Second region; B: Distribution boundary; C: Outer part; E: Outer edge; G: Spacing; M: Microstructure; N: Normal direction; O: Opening; P: Orthographic projection; R: Reflective layer; R1: First reflective part; R2: Second reflective part; S: Side surface; S1: First side surface; S2: Second side surface; S3: Third surface; S4: Fourth surface; T, T1: Thickness.

Figure 1 is a cross-sectional schematic view of the light panel assembly of one embodiment of the present invention. Figure 2 is a top view of the light panel assembly of Figure 1. Figure 3 is an enlarged schematic view of region Z1 of the light panel assembly of Figure 2. Figure 4 is a bottom view of the light panel assembly of Figure 1. Figure 5 is a cross-sectional schematic view of the light panel assembly of another embodiment of the present invention. Figure 6 is a top view of the light panel assembly of Figure 5. Figure 7 is a partial top view of the light panel assembly of another embodiment of the present invention. Figure 8 is a partial enlarged schematic view of the light panel assembly of Figure 5. Figure 9 is a top view of the light panel assembly of another embodiment of the present invention. Figure 10 is a bottom view of the light panel assembly of Figure 9. Figure 11 is a top view of the light panel assembly of another embodiment of the present invention. Figure 12 is a bottom view of the light panel assembly of Figure 11. Figure 13 is a top view of the light panel assembly of another embodiment of the present invention. Figure 14 is a cross-sectional view of the light panel assembly of another embodiment of the present invention. Figure 15 is a top view of the light panel assembly of another embodiment of the present invention. Figure 16 is a cross-sectional view of the backlight module of one embodiment of the present invention. Figure 17 is a cross-sectional view of the backlight module of another embodiment of the present invention. Figure 18 is a cross-sectional view of the backlight module of another embodiment of the present invention.

100: Light panel assembly

110: Flexible Circuit Board

111: Section on Severed Ties

112: Electrical Connection Section

113: Substrate

120: Light-emitting element

130: Reinforcement board

131: Support surface

1110, 1120: Surface

E: Outer edge

N: Normal direction

O: Open mouth

S1: First side surface

S2: Second side surface

T: Thickness

Claims (19)

A light panel assembly includes: a flexible circuit substrate having a first side surface and a second side surface opposite to each other; a plurality of light-emitting elements disposed on the first side surface; and a reinforcing plate disposed on the second side surface and overlapping the light-emitting elements. The lamp panel assembly as described in claim 1, wherein the flexible circuit substrate includes a reflective layer covering the first side surface and surrounding each of the light-emitting elements. The lamp panel assembly as described in claim 2, wherein the flexible circuit substrate has an insulating portion and a plurality of electrical connection portions, and the insulating portion exposes the electrical connection portions, the light-emitting elements are respectively electrically connected to the electrical connection portions, the reflective layer includes a first reflective portion and a second reflective portion, the first reflective portion covering the insulating portion, and the second reflective portion covering the electrical connection portions. The light panel assembly as described in claim 3, wherein the first reflective portion and the second reflective portion are made of different materials. The light panel assembly as described in claim 1, wherein the first side surface has a first region and a second region spaced apart from each other, the light-emitting elements are respectively disposed in the first region and the second region, the reinforcing plate has a first part and a second part, the first part overlapping the first region and the second part overlapping the second region, the first part and the second part being integral or separate from each other. The light panel assembly as described in claim 1, wherein the reinforcing plate has a support surface fixed to the second side surface, and the light-emitting elements are located at an outer edge of the support surface within the orthographic projection range of the first side surface. The light panel assembly as described in claim 6, wherein the light-emitting elements include a plurality of peripheral light-emitting elements and at least one central light-emitting element, and the peripheral light-emitting elements surround the at least one central light-emitting element, each of the peripheral light-emitting elements having a side facing away from the at least one central light-emitting element, and the sides are arranged to form a distribution boundary of the light-emitting elements, the distance between the outer edge and the distribution boundary being between 0.1 mm and 1 mm. The light panel assembly as described in claim 1, wherein the thickness of the reinforcing plate is between 0.1 mm and 2 mm. The light panel assembly as described in claim 1, wherein the reinforcing plate comprises a metal plate or a plastic plate. The light panel assembly as described in claim 1, wherein each of the light-emitting elements has a light-emitting portion and a driving portion, the driving portion being electrically connected to the flexible circuit substrate, the light-emitting portion being electrically connected to the driving portion and located on the side of the driving portion opposite to the flexible circuit substrate. The light panel assembly as described in claim 10, wherein the drive unit includes a complementary metal oxide semiconductor drive circuit. The lamp panel assembly as described in claim 1 further includes a protective electronic component, wherein the flexible circuit substrate has an external portion, the light-emitting elements are electrically connected to the flexible circuit substrate, and the protective electronic component is electrically connected to the external portion and the light-emitting elements. A backlight module includes: a lamp panel assembly, comprising: a flexible circuit substrate having a first side surface and a second side surface opposite to each other; a plurality of light-emitting elements disposed on the first side surface; a reinforcing plate disposed on the second side surface and overlapping the light-emitting elements; and a back plate supporting the lamp panel assembly. The backlight module as described in claim 13, wherein the back panel has a clearance structure and the reinforcing plate is located within the clearance structure. The backlight module as described in claim 13 further includes a wavelength conversion layer and a filter layer, wherein the lamp assembly and the wavelength conversion layer are located on opposite sides of the filter layer. The backlight module as described in claim 13 further includes a diffuser, wherein the lamp assembly is located between the diffuser and the backplate. The backlight module as described in claim 16, wherein the diffuser contains a plurality of light-scattering particles. The backlight module as described in claim 16, wherein the diffuser has a third surface and a fourth surface opposite to each other, the fourth surface facing the lamp assembly, and the third surface and/or the fourth surface having a plurality of microstructures. The backlight module as described in claim 13 further includes a frame, wherein the back panel has a bottom plate portion and a side plate portion, the bottom plate portion supports the second side surface, the side plate portion is connected to the bottom plate portion and surrounds the light panel assembly, and the frame is disposed between the side plate portion and the light panel assembly.