TWM676005U - Electronic device - Google Patents

Abstract

An electronic device including a main body, a heat dissipation body and a rectification component is provided. The main body includes at least one heat source. The heat dissipation body includes a heat dissipation fan. A rectification space is provided between the heat dissipation body and the main body, the heat dissipation fan faces the rectification space, and the rectification space includes at least one first air inlet surface. The rectification component is connected to the main body and is located in the rectification space. The rectification component includes at least one guide surface, and an airflow enters the rectification space from the first air inlet surface and is guided to the heat dissipation fan by the guide surface.

Description

electronic devices

This case relates to a device, and in particular to an electronic device.

With technological advancements, chip performance continues to improve, necessitating increased heat dissipation efficiency in electronic devices. In today's electronic devices, the heat sink used to dissipate heat from the chip (heat source) can be located above the main unit. This heat sink includes a fan and a water cooler. The water cooler is thermally connected to the heat source, and the fan draws in cooler external air to dissipate heat from the water cooler. However, electronic devices often lack a sound airflow design, allowing external air flows to interfere with each other, resulting in insufficient air intake for the fan and poor heat dissipation efficiency.

This invention provides an electronic device with better heat dissipation efficiency.

The electronic device of this invention includes a main body, a heat sink, and a rectifier assembly. The main body includes at least one heat source. The heat sink includes a heat dissipation fan. A rectifier space is defined between the heat sink and the main body. The heat dissipation fan faces the rectifier space, and the rectifier space includes at least one first air inlet surface. The rectifier assembly is connected to the main body and located within the rectifier space. The rectifier assembly includes at least one guide surface. Airflow enters the rectifier space from the first air inlet surface and is guided by the guide surface to the heat dissipation fan.

Based on the above, the heat source in this case exchanges heat with the heat sink. The heat sink fan, through a rectifier assembly, directs low-calorie external airflow for heat exchange. The heat source dissipates heat through the heat sink. The electronic device, through the rectifier assembly, directs the airflow entering the rectifier space, ensuring smooth, loss-free flow to the heat sink. This increases the airflow rate to the heat sink fan, improving the heat dissipation efficiency of the electronic device. The rectifier assembly further isolates the main unit (heat source) from the heat sink fan, preventing the heat sink from absorbing waste heat generated by the heat source and affecting heat dissipation efficiency.

FIG1 is a schematic diagram of an electronic device according to an embodiment of the present invention. FIG2 is a simple block diagram of the electronic device of FIG1 . FIG3 is a cross-sectional view of the electronic device of FIG1 . FIG4 is another cross-sectional view of the electronic device of FIG1 . Some components are omitted here, and three directions N1, N2, and N3 perpendicular to each other are provided to facilitate component description. Please refer to FIG1 to FIG4 simultaneously. The electronic device 100 includes a main body 110, a heat sink 120, and a rectifying assembly 130. The main body 110 includes at least one heat source 111. The heat sink 120 also includes a heat dissipation fan 121. A rectifying space P is provided between the heat sink 120 and the main body 110. The heat dissipation fan 121 faces the rectifying space P. The rectifying space P includes at least one first air inlet surface P1. The rectifying assembly 130 is connected to the main body 110 and is located in the rectifying space P. The rectifying assembly 130 includes at least one guiding surface 131 . An airflow A1 enters the rectifying space P from at least one first air inlet surface P1 and is guided to the heat dissipation fan 121 by the at least one guiding surface 131 .

The heat sink 120 is thermally connected to the heat source 111. Heat is exchanged between the heat source 111 of the main body 110 and the heat sink 120. The heat sink's fan 121 directs low-calorific value external airflow A1 through the rectifier assembly 130 to facilitate heat exchange. Consequently, heat energy emitted by the heat source 111 is transferred to the heat sink 120, where it is dissipated by the low-calorific value airflow A1 of the heat sink 121. The electronic device 100 directs the airflow A1 flowing into the rectifier space P through the rectifier assembly 130, allowing it to flow smoothly to the heat sink 120 without loss. This increases the airflow rate flowing into the heat sink 121, thereby improving the heat dissipation efficiency of the electronic device 100. The rectifier assembly 130 can further separate the main body 110 (heat source 111) and the heat dissipation fan 121 to prevent the heat dissipation fan 121 from absorbing waste heat generated by the heat source 111 and affecting the heat dissipation efficiency. The electronic device 100 of this embodiment is, for example, a mainframe of a desktop computer, and the heat source 111 is, for example, a central processing unit, but is not limited thereto.

As shown in Figures 1 to 3, the main body 110 includes a housing 112 and a main fan 113. The heat source 111 is disposed within the housing 112. The electronic device 100 further includes a connecting body 140. The connecting body 140 is connected to the housing 112 and the heat sink 120 of the main body 110. The connecting body 140, the main body 110 (housing 112), and the heat sink 120 surround a rectifying space P. The heat sink 120 is located above the main body 110 in the direction N2. The main fan 113 is connected to a side of the housing 112 to blow an airflow A' into the housing 112. The main fan 113 includes an air outlet OP. In this embodiment, the air outlet OP is offset from the rectifying space P along one axis of the heat dissipation fan 121. The axial direction of the heat dissipation fan 121 is parallel to the direction N2. This means that the entire external airflow A' introduced by the main unit fan 113 enters the housing 112 to dissipate heat from the heat source 111 within the housing 112. This allows the heat source 111 to still dissipate heat through the main unit fan 113 even when the heat dissipation fan 121 rotates at a low speed. The housing 112 includes a top housing 114. The rectifying space P is located between the top housing 114 of the main unit 110 and the heat dissipation fan 121.

The heat sink 120 includes a heat sink assembly 122, which is thermally connected to the heat source 111. A heat sink fan 121 is located between the heat sink assembly 122 and the main body 110, with an air outlet surface S1 of the heat sink 121 facing the heat sink assembly 122. The heat sink assembly 122 can exchange heat with the heat source 111. External airflow A1, guided by the rectifying assembly 130, enters the heat sink 120 through multiple openings 124, allowing the heat sink 121 to dissipate heat from the heat sink assembly 122. The high-heat airflow is then discharged from the electronic device 100 through multiple heat dissipation holes 123 in the heat sink 120. In this embodiment, the heat dissipation component 122 is, for example, a water radiator. A pipe (not shown) of the water radiator extends through the connecting body 140 into the housing 112 of the main body 110 and contacts the heat source 111. However, the present invention is not limited to this embodiment. The type and type of the heat dissipation component 122 and the thermal connection method between the heat dissipation component 122 and the heat source 111 are not limited in this embodiment.

As shown in Figures 3 and 4, a normal to the first air inlet surface P1 of the rectifying space P is parallel to the direction N1 and perpendicular to the axial direction (direction N2) of the heat dissipation fan 121. The axial direction of the heat dissipation fan 121 of this embodiment is parallel to the direction of gravity. In other words, the external airflow A1 enters the rectifying space P from the side of the electronic device 100. The rectifying assembly 130 has two at least one guide surface 131, and the rectifying space P has two at least one first air inlet surface P1. The two guide surfaces 131 face the two first air inlet surfaces P1, respectively. The rectifying assembly 130 of this embodiment is disposed in the center of the rectifying space P, dividing the rectifying space P into two parts. Two airflows A1 flowing in from either side of the rectifying space P (i.e., the two first air inlet surfaces P1) are guided by two guide surfaces 131 to the heat sink 120. The electronic device 100 uses the rectifying assembly 130 to separate the two airflows A1 entering from either side of the rectifying space P to prevent interference between the two airflows A1 and the resulting impact on the air intake efficiency of the heat dissipation fan 121.

The rectifier assembly 130 of this embodiment includes a rectifier main plate 132 and two guide plates 133. The rectifier main plate 132 extends along the axis (direction N2) of the heat sink fan 121. One end E1 of the rectifier main plate 132 of the rectifier assembly 130 is connected to the top housing 114 of the main body 110, and the other end E2 is connected to the heat sink 120. One end E3 of the guide plate 133 is connected to the top housing 114, and the other end E4 is connected to the rectifier main plate 132. The guide plate 133 has a streamlined outer surface S2. The guide surface 131 is composed of the outer surface S2 of the guide plate 133 and a portion of an outer surface of the rectifier main plate 132. The streamlined guide plate 133 can better guide the airflow A1 to prevent the airflow A1 from generating vortices during its flow and thus affecting the air intake efficiency of the heat dissipation fan 121 .

In other embodiments (not shown), a gap may be provided between end E2 of the rectifier main plate 132 and the heat sink 120, and the rectifier assembly 130 may be integrally formed. In other embodiments (not shown), the rectifier assembly 130 may include only two guide plates 133. Ends E4 of the guide plates 133 may contact the heat sink 120 or have a gap therebetween. In other embodiments (not shown), the rectifier assembly 130 may include only the rectifier main plate 132. The guide surface 131 may be formed by the outer surface of the rectifier main plate 132 and an outer surface of the top housing 114. In other embodiments (not shown), the rectifier assembly 130 may include one rectifier main plate 132 and one guide plate 133 to form a guide surface 131. The rectifier main plate 132 and the guide plate 133 can be disposed on the left or right side of the rectifier space P (ie, disposed on the left or right first air inlet surface P1 in FIG. 3 ), so that the rectifier space P only includes one first air inlet surface P1 .

FIG5 is a schematic diagram of an electronic device according to another embodiment of the present invention. Referring to FIG4 and FIG5 , the electronic device 100a of this embodiment is similar to the aforementioned embodiment, the difference being that the rectifying space P' of this embodiment includes a second air inlet surface P2, the orthographic projection of the second air inlet surface P2 onto the main unit fan 113 being at least partially located at the air outlet OP of the main unit fan 113. In other words, a portion of the second air inlet surface P2 overlaps with the air outlet OP of the main unit fan 113 in a normal direction of the second air inlet surface P2, and a portion of the second air inlet surface P2 is aligned with the main unit fan 113. The normal direction of the second air inlet surface P2 is parallel to the direction N3. The ratio of the overlapping area of the second air inlet surface P2 and the air outlet OP to the area of the air outlet OP may be greater than or equal to one third, but is not limited thereto. The normal direction (direction N3) of the second air inlet surface P2 is perpendicular to the normal direction (direction N1) of the first air inlet surface P1 and the axial direction (direction N2) of the heat dissipation fan 121. The external airflow introduced by the main unit fan 113 (such as airflow A' in Figure 4) is divided by the top housing 114a of the main unit 110a into an auxiliary airflow A2 and airflow A''. The auxiliary airflow A2 flows from the second air inlet surface P2 into the rectifying space P' and toward the heat dissipation unit 120, while the airflow A'' flows into the main unit 110a. In this way, in addition to airflow A1 (Figure 3), the auxiliary airflow A2 can be introduced to further increase the air intake of the heat dissipation fan 121, thereby improving the heat dissipation efficiency of the electronic device 100a.

The second air inlet surface P2 is located between the two first air inlet surfaces P1 (Figure 3), and the auxiliary airflow A2 flows from the front into the rectifying space P'. The top housing 114a of this embodiment includes a first portion 1141 and a second portion 1142 connected to each other. The second portion 1142 is an inclined surface facing the second air inlet surface P2 and the air outlet OP of the rectifying space P'. The second portion 1142 and the first portion 1141 form an angle B1 greater than 90 degrees. The second portion 1142 of the top housing 114a forms an angle B2 with the second air inlet surface P2 (host fan 113), and the angle B2 is less than 90 degrees. The inclined second portion 1142 is used to guide the auxiliary airflow A2.

In other embodiments not shown, the top housing 114a can be a flat surface, and the angle between the top housing 114a and the second air inlet surface P2 can be 90 degrees. The distance between the outer surface of the top housing 114a and the heat sink 120 can be greater than the distance between the main unit fan 113 and the heat sink 120, allowing the auxiliary airflow A2 to enter the rectification space P' from the second air inlet surface P2. In other embodiments not shown, the top housing 114a can be an inclined surface. The electronic device 100a of this embodiment has similar functions to the aforementioned embodiments and will not be further described here.

In summary, the heat source in this case exchanges heat with the heat sink, and the heat sink fan directs low-calorie external airflow through a rectifier assembly to achieve heat exchange. The heat source dissipates heat through the heat sink. The electronic device uses the rectifier assembly to direct the airflow entering the rectifier space, ensuring smooth, loss-free flow to the heat sink. This increases the airflow rate to the heat sink fan, improving the heat dissipation efficiency of the electronic device. The rectifier assembly further isolates the main unit (heat source) from the heat sink, preventing the heat sink from absorbing waste heat generated by the heat source and affecting heat dissipation efficiency.

A1, A’, A’’: Airflow A2: Auxiliary airflow B1, B2: Angle E1, E2, E3, E4: End N1, N2, N3: Direction OP: Outlet P, P’: Rectification space P1: First air inlet surface P2: Second air inlet surface S1: Outlet surface S2: External surface 100, 100a: Electronic device 110, 110a: Main body 111: Heat source 112: Casing 113: Main body fan 114, 114a: Top housing 1141: First section 1142: Second section 120: Heat sink 121: Heat sink fan 122: Heat sink assembly 123: Heat dissipation hole 124: Opening 130: Rectifier assembly 131: Guide surface 132: Rectifier motherboard 133: Guide plate 140: Connecting body

FIG1 is a schematic diagram of an electronic device according to one embodiment of the present invention. FIG2 is a simplified block diagram of the electronic device of FIG1 . FIG3 is a cross-sectional view of the electronic device of FIG1 . FIG4 is another cross-sectional view of the electronic device of FIG1 . FIG5 is a schematic diagram of an electronic device according to another embodiment of the present invention.

A1: Airflow

E1, E2, E3, E4: terminals

N1, N2, N3: Direction

P: Rectification space

P1: First windward side

S1: Windward side

S2: External surface

100: Electronic devices

110: Main body

112: Chassis

114: Top shell

120: Heat dissipation unit

121: Cooling fan

122: Heat dissipation component

123: Heat dissipation holes

124: Opening

130: Rectifier assembly

131:Guiding surface

132: Rectifier Mainboard

133: Guide plate

140: Connecting to the body

Claims (10)

An electronic device comprises: a main body including at least one heat source; a heat sink including a heat dissipation fan, a flow-rectifying space defined between the heat sink and the main body, the heat dissipation fan facing the flow-rectifying space, the flow-rectifying space including at least one first air inlet surface; and a flow-rectifying assembly connected to the main body and located in the flow-rectifying space, the flow-rectifying assembly including at least one guide surface, airflow entering the flow-rectifying space from the at least one first air inlet surface and being guided by the at least one guide surface to the heat dissipation fan. An electronic device as described in claim 1, wherein the main body includes a top shell, the rectification space is located between the top shell and the heat dissipation fan, and one end of the rectification assembly is connected to the top shell. An electronic device as described in claim 2, wherein the other end of the rectifier component is connected to the heat sink. The electronic device as described in claim 1, wherein the number of the at least one guiding surface is two, the number of the at least one first air inlet surface is two, and the two guiding surfaces face the two first air inlet surfaces respectively. The electronic device as described in claim 1, wherein a normal direction of the at least one first air inlet surface is perpendicular to an axial direction of the heat dissipation fan. An electronic device as described in claim 1, wherein the main body includes a main unit fan, the main unit fan includes an air outlet, the rectification space includes a second air inlet surface, and the orthographic projection of the second air inlet surface onto the main unit fan is at least partially located at the air outlet of the main unit fan. The electronic device as described in claim 6, wherein a normal direction of the second air inlet surface is perpendicular to a normal direction of the at least one first air inlet surface and an axial direction of the heat dissipation fan. The electronic device as described in claim 6, wherein the main body includes a top shell, and an angle between the top shell and the second air inlet surface is less than 90 degrees. The electronic device as described in claim 1, wherein the heat dissipation body includes a heat dissipation component, the heat dissipation fan is located between the heat dissipation component and the main body, and an air outlet surface of the heat dissipation fan faces the heat dissipation component. The electronic device as described in claim 1 further includes a connecting body connected to the main body and the heat dissipation body, and the connecting body, the main body and the heat dissipation body surround the rectification space.