TWM665748U - Substrate for a reflective film structure with heat-resistant bending crack resistance - Google Patents

Abstract

A substrate with a reflective film structure that resists thermal bending and cracking includes: a substrate, an auxiliary layer and a reflective layer, wherein the substrate has a supporting function, an auxiliary layer is disposed on the substrate, and a reflective film is disposed on the auxiliary layer to form a reflective layer structure, wherein the outer side of the reflective film is a light incident surface. Thus, the auxiliary layer structure can be used to improve the reflective film's resistance to cracking during thermal bending, and the reflective film structure of the substrate can also be used to increase the reflection effect of light entering the substrate from the light incident surface.

Description

Substrate with reflective film structure resistant to thermal bending and cracking

This invention relates to a substrate, and in particular to a substrate having a reflective film structure that is resistant to thermal bending and cracking.

In various optical devices, optical components and solar cell devices, the reflection effect within the interface will greatly affect the performance. In order to fully retain and utilize the light entering the above-mentioned optoelectronic devices, a reflective film (92) is coated on the light-incident interface of the device, such as a glass substrate (91), using a high-temperature process, as shown in the cross-sectional view of the substrate with a reflective film and a substrate in Figure 1.

Due to the difference in heat energy and stress growth between the substrate (91) and the reflective film (92), the reflective film coating will produce residual stress. When the thin film is deposited on the glass substrate (91), the difference in thermal expansion between the substrate (91) and the thin film will generate the origin of thermal stress. Due to the generation of residual stress, the growing thin film will have destructive cracks. During the high-temperature deposition process, the thermal tension caused by the temperature is greater than the tensile stress of the thin film, causing the cracks to grow. The method used to solve the above problem can reduce the growth of cracks by adjusting the process parameter range, but this solution will limit the selection of reflective mold materials.

In addition, the glass substrate (91) of the above-mentioned optoelectronic device is often installed on a curved surface, so it is necessary to bend the substrate (91) into a curved surface or directly produce a curved substrate (91). As for the bent substrate (91), the substrate (91) with the reflective film (92) is subjected to a heat bending process. Since the glass substrate (91) is heat-bent, after the heat bending curvature is less than a certain radius, the coating layer of the reflective film (92) does not stretch when the substrate (91) is bent, and thus obvious tension cracks will be generated in the coating layer of the reflective film (92) on the outer side of the curved surface of the substrate reflective film (91), which can easily cause the reflective film (92) to rupture.

In view of this, the prior art still needs to be improved.

The purpose of this invention is to provide a substrate with a reflective film structure that is resistant to thermal bending and cracking, so as to improve the shortcomings of the prior art.

Another purpose of the present invention is to provide a substrate with a reflective film structure that is resistant to thermal bending and cracking, which can improve the reflective film's ability to resist cracking during thermal bending.

Another purpose of this invention is to provide a substrate with a reflective film structure that is resistant to thermal bending and cracking, which can increase the reflective effect of the reflective film structure by performing a thermal process after forming the structure.

To achieve the above and other purposes, the present invention provides a substrate having a reflective film structure that is resistant to thermal bending and cracking.

To achieve the above and other purposes, the present invention provides a substrate with a reflective film structure that is resistant to thermal bending and cracking, comprising: a substrate; a buffer layer disposed on the substrate; and a reflective layer disposed on the buffer layer to form a reflective film, wherein the outer side of the reflective film is a light incident surface.

In one embodiment, the reflective layer is a multi-layer reflective film.

In one embodiment, the multi-layer reflective film is a base number layer or an even number layer.

In one embodiment, the multi-layer reflective film includes a plurality of high refractive index layers and a plurality of low refractive index layers that are repeatedly and alternately stacked.

In one embodiment, the high refractive index layer or the low refractive index layer is first formed on the auxiliary layer.

The directions or similar terms described throughout the present invention, such as front, back, left, right, top, bottom, inside, outside, side, etc., are mainly with reference to the directions of the drawings. Each direction or similar terms are only used to assist in explaining and understanding the various embodiments of the present invention, and are not used to limit the present invention.

The articles used in the elements and components described in the present invention, such as a or the, are only for the convenience of use or simplified description and should be interpreted as including one or at least one, and a single concept also includes a plural concept unless it is obvious that there is a different meaning.

In order to make the above and other purposes, effects, and features more clearly understood, some preferred embodiments are specifically cited below, and detailed descriptions are made with reference to the attached drawings. Without departing from the creative spirit, this case has a variety of implementation methods, and is not limited to the details specifically described in the implementation methods below, and the drawings may not be drawn according to the actual scale, but are provided only for illustrating the embodiments.

FIG2 is a cross-sectional view of a substrate with a reflective film structure that resists thermal bending and cracking according to an embodiment of the present invention. Referring to FIG2 , the substrate with a reflective film structure that resists thermal bending and cracking according to the present embodiment comprises: a substrate (10), an auxiliary layer (20) and a reflective layer (30), wherein the substrate (10) can provide a supporting structure for the auxiliary layer (20); the auxiliary layer (20) is disposed on the substrate (10) and can support the arrangement of the reflective layer (30); the reflective layer (30) is disposed on the auxiliary layer (20) to form a reflective film, and the outer side of the reflective film is a light incident surface (301), and the light incident surface (301) allows light (L) to enter. By means of the structure and process of the reflective film (such as a multi-layer reflective film structure and a plasma sputtering process), the light (L) entering the reflective layer (30) can be more easily reflected on the substrate having the reflective film structure, thereby improving its reflection effect.

Fig. 3 is a cross-sectional view of a substrate of a multi-layer reflective film structure with heat-resistant bending and cracking according to an embodiment of the present invention. Referring to Fig. 3, preferably, the reflective layer (30) is a multi-layer reflective film, and the multi-layer reflective film can be a base number layer or an even number layer.

FIG4 is a cross-sectional view of a substrate of a multi-layer reflective film structure with heat-resistant bending and cracking according to another embodiment of the invention. Referring to FIG3 and FIG4, the multi-layer reflective film comprises a plurality of high refractive index layers (31) and a plurality of low refractive index layers (32) stacked repeatedly and staggered, and the high refractive index layer (31) or the low refractive index layer (32) can be formed on the auxiliary layer (20) first.

FIG5 is a flow chart of a method for manufacturing a substrate with a reflective film structure that resists thermal bending and cracking according to an embodiment of the present invention. Referring to FIG5, the method for manufacturing a substrate with a reflective film structure that resists thermal bending and cracking according to the present embodiment comprises: providing a substrate step (S10), forming an auxiliary layer step (S20), and forming a reflective layer step (S30), wherein the providing a substrate step (S10) is to provide a substrate that can be used as a support; the forming auxiliary layer step (S20) is to form an auxiliary layer on the upper surface of the substrate; and the forming reflective layer step (S30) is to form one or more layers of reflective film on the upper surface of the auxiliary layer.

Through the above steps and the structure formed, a material with certain flexibility and adhesion properties (many of which are used for soft and flexible substrates) can be selected as the auxiliary layer. By utilizing the design and manufacturing method of the auxiliary layer, the cracking and stress offset of the reflective layer of the multi-layer film during the bending process can be overcome, and the performance of the reflective film in resisting cracking during thermal bending can be improved.

As shown in FIG. 5 , further, after the step of forming a reflective layer ( S30 ), a thermal process step ( S40 ) is further included. The thermal process step ( S40 ) is to perform a thermal process on the substrate, the auxiliary layer and the reflective layer to increase the reflective effect of the reflective film structure.

FIG6 is a line graph comparing the reflectivity before and after the thermal process of the invention. Referring to FIG6, before the thermal process (i.e., heat treatment), the average reflectivity of the infrared wavelength band of the substrate with the reflective film structure is about 50%. After the thermal process step (S40), the average reflectivity of the infrared wavelength band of the substrate with the reflective film structure is about 58.9%, an increase of 17%. In addition, the thermal process step (S40) can not only optimize the interface between the auxiliary layer and the reflective layer, but also make the auxiliary layer and the reflective layer materials recrystallize, so that the optical reflection effect is improved.

Preferably, in one embodiment, the auxiliary layer is made of a transparent ceramic material, which has little effect on light transmittance.

Preferably, the material of the auxiliary layer includes silicon dioxide (SiO ₂ ), fluorine doped oxide (FTO), co-doped tin oxide (LFTO), aluminum doped zinc oxide (AZO), antimony tin oxide (ATO), indium tin oxide (ITO) or indium gallium zinc oxide (IGZO).

Preferably, in one embodiment, the thickness of the auxiliary layer is 150-250 nm.

Preferably, the auxiliary layer is formed by physical vapor deposition (PVD) and chemical vapor deposition (CVD). This invention uses plasma sputtering to make the auxiliary layer.

In summary, the features of this invention include: an auxiliary layer structure is applied between the substrate and the reflective layer. Through the auxiliary layer's better flexibility and adhesion material properties, coupled with the plasma sputtering forming process, the auxiliary layer can have a buffering property, which can offset the stress accumulated in the multi-layer film during the thermal bending process and overcome the cracking problem during the thermal bending process. This invention also designs a multi-layer reflective film structure with high and low refractive index staggered stacking, which can enhance its light reflection effect.

The present invention has been disclosed by using the above preferred embodiments, but they are not used to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can clearly understand that the present invention is not limited to the details of the above illustrative implementation methods. The implementation methods are only for explaining the present invention, not for limiting the present invention. The present invention is based on the scope of the patent application, not on the above description. The meaning of the scope of the patent application and its equivalent scope are all within the scope of the patent right of the present invention.

[Original work] (10): substrate (20): auxiliary layer (30): reflective layer (301): light incident surface (31): high refractive index layer (32): low refractive index layer (L): light (S10): substrate providing step (S20): auxiliary layer forming step (S30): reflective layer forming step (S40): thermal process step [Application] (91): substrate (92): reflective film

FIG1 is a cross-sectional view of a substrate with a reflective film and a substrate of a conventional technology. FIG2 is a cross-sectional view of a substrate with a reflective film structure resistant to thermal bending and cracking in an embodiment of the present invention. FIG3 is a cross-sectional view of a substrate with a multi-layer reflective film structure resistant to thermal bending and cracking in an embodiment of the present invention. FIG4 is a cross-sectional view of a substrate with a multi-layer reflective film structure resistant to thermal bending and cracking in another embodiment of the present invention. FIG5 is a flow chart of a manufacturing method of a substrate with a reflective film structure resistant to thermal bending and cracking in an embodiment of the present invention. FIG6 is a line graph comparing the reflectivity after and before the thermal process of the present invention.

(10): Base material

(20): Auxiliary layer

(30):Reflection layer

Claims (5)

A substrate with a reflective film structure that resists thermal bending and cracking comprises: a substrate (10); an auxiliary layer (20) disposed on the substrate (10); and a reflective layer (30) disposed on the auxiliary layer (20) to form a reflective film, wherein the outer side of the reflective film is a light incident surface (301). A substrate with a reflective film structure resistant to thermal bending and cracking as described in claim 1, wherein the reflective layer (30) is a multi-layer reflective film. A substrate with a reflective film structure resistant to thermal bending and cracking as described in claim 2, wherein the multi-layer reflective film is a base number layer or an even number layer. A substrate with a reflective film structure resistant to thermal bending and cracking as described in claim 2, wherein the multi-layer reflective film comprises a plurality of high refractive index layers (31) and a plurality of low refractive index layers (32) that are repeatedly and alternately stacked. The substrate with a reflective film structure resistant to thermal bending and cracking as described in claim 4, wherein the high refractive index layer (31) or the low refractive index layer (32) is first formed on the auxiliary layer (20).