[go: up one dir, main page]

TWM663298U - Optical testing equipment - Google Patents

Optical testing equipment Download PDF

Info

Publication number
TWM663298U
TWM663298U TW113208240U TW113208240U TWM663298U TW M663298 U TWM663298 U TW M663298U TW 113208240 U TW113208240 U TW 113208240U TW 113208240 U TW113208240 U TW 113208240U TW M663298 U TWM663298 U TW M663298U
Authority
TW
Taiwan
Prior art keywords
electronic components
transfer mechanism
workbench
detection mechanism
transfer
Prior art date
Application number
TW113208240U
Other languages
Chinese (zh)
Inventor
王偉杰
郭温良
高軍峰
林至善
Original Assignee
海華科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海華科技股份有限公司 filed Critical 海華科技股份有限公司
Publication of TWM663298U publication Critical patent/TWM663298U/en

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

本創作公開一種光學檢測設備,其包含一料件傳送帶、一下視覺檢測機構、於所述料件傳送帶及所述下視覺檢測機構之間傳輸多個電子構件的兩個移載機構、及位於兩個所述移載機構一側的一複合式裝置。所述複合式檢測裝置包含一上視覺檢測機構與一環側面檢測機構。多個所述電子構件能在完成所述下視覺檢測機構的下表面檢測之後、由所述料件傳送帶傳輸至所述複合式裝置,並且所述複合式檢測裝置能相對於所述檢測傳送帶移動,以使所述上視覺檢測機構與所述環側面檢測機構能夠用以檢測多個所述電子構件的上表面與環側面。The present invention discloses an optical inspection device, which includes a material conveyor belt, a lower visual inspection mechanism, two transfer mechanisms for transferring multiple electronic components between the material conveyor belt and the lower visual inspection mechanism, and a composite device located on one side of the two transfer mechanisms. The composite inspection device includes an upper visual inspection mechanism and a circular side inspection mechanism. After the lower surface inspection of the lower visual inspection mechanism is completed, the multiple electronic components can be transferred from the material conveyor belt to the composite device, and the composite inspection device can move relative to the inspection conveyor belt so that the upper visual inspection mechanism and the circular side inspection mechanism can be used to inspect the upper surface and circular side of the multiple electronic components.

Description

光學檢測設備Optical testing equipment

本創作涉及一種檢測設備,尤其涉及一種光學檢測設備。The invention relates to a detection device, and more particularly to an optical detection device.

現有光學檢測設備須採用至少六個檢查站,方能對一電子構件的外表面進行檢測。其中,現有光學檢測設備在對所述電子構件的環側面進行檢測時,須將單個所述電子構件置入反射件的內側,方能實現所述環側面的檢測。然而,現有光學檢測設備的架構造成其檢測較為耗時、且需佔用較大的廠房空間。The existing optical inspection equipment must use at least six inspection stations to inspect the outer surface of an electronic component. When the existing optical inspection equipment inspects the circumferential side of the electronic component, the single electronic component must be placed inside the reflector to achieve the circumferential side inspection. However, the structure of the existing optical inspection equipment makes the inspection time-consuming and requires a large factory space.

於是,本創作人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本創作。Therefore, the author of the present invention believes that the above defects can be improved, and has conducted intensive research and applied scientific principles to finally propose a creation that is reasonably designed and effectively improves the above defects.

本創作實施例在於提供一種光學檢測設備,其能有效地改善現有光學檢測設備所可能產生的缺陷。The present invention provides an optical detection device that can effectively improve the defects that may occur in existing optical detection devices.

本創作實施例公開一種光學檢測設備,其包括:一工作台;一料件傳送帶,安裝於所述工作台且用以沿一第一方向傳輸承載有多個電子構件的一料盤,以使所述料盤能於一第一位置、一第二位置、及一第三位置之間移動;一第一移載機構,安裝於所述工作台且用以沿垂直所述第一方向的一第二方向自位於所述第一位置的所述料盤擷取並傳輸多個所述電子構件;一下視覺檢測機構,安裝於所述工作台,並且所述第一移載機構位於所述下視覺檢測機構的一側;其中,所述下視覺檢測機構用以接收自所述第一移載機構所傳輸的多個所述電子構件、並檢測多個所述電子構件的下表面;一第二移載機構,安裝於所述工作台,並且所述第二移載機構位於所述下視覺檢測機構的另一側;其中,所述第二移載機構用以將完成所述下視覺檢測機構檢測的多個所述電子構件傳輸至位於所述第二位置的所述料盤;以及一複合式裝置,安裝於所述工作台且位於遠離所述第一移載機構的所述第二移載機構一側;其中,所述複合式裝置包含:一上視覺檢測機構,能用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的上表面;及一環側面檢測機構,包含:一殼體;一攝像器,安裝於所述殼體之內;一錐狀反射件,位於所述殼體之內且位於所述攝像器的下方;及一環狀反射件,位於所述殼體之內且對應於所述錐狀反射件配置;其中,所述攝像器的取像光路徑通過所述錐狀反射件與所述環狀反射件的反射而定義有位於所述殼體之外的一取像空間,其用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的環側面;其中,當所述料盤之內承載多個所述電子構件且位於所述第三位置時,所述複合式裝置能相對於所述料件傳送帶移動,以使所述上視覺檢測機構與所述環側面檢測機構能夠用以檢測多個所述電子構件的所述上表面與所述環側面。The present invention discloses an optical inspection device, which includes: a workbench; a material conveyor belt mounted on the workbench and used to transport a material tray carrying a plurality of electronic components along a first direction, so that the material tray can move between a first position, a second position, and a third position; a first transfer mechanism mounted on the workbench and used to pick up and transport a plurality of electronic components from the material tray located at the first position along a second direction perpendicular to the first direction; a visual inspection mechanism mounted on the workbench and used to transfer the plurality of electronic components to the material tray; A first transfer mechanism is located on one side of the lower visual detection mechanism; wherein the lower visual detection mechanism is used to receive the plurality of electronic components transmitted from the first transfer mechanism and detect the lower surfaces of the plurality of electronic components; a second transfer mechanism is installed on the workbench, and the second transfer mechanism is located on the other side of the lower visual detection mechanism; wherein the second transfer mechanism is used to transfer the plurality of electronic components detected by the lower visual detection mechanism to the material tray located at the second position; and a composite device is installed The composite device is located on the workbench and on a side of the second transfer mechanism far from the first transfer mechanism; wherein the composite device includes: an upper visual detection mechanism, which can be used to detect the upper surfaces of the plurality of electronic components in the tray located at the third position; and an annular side detection mechanism, including: a housing; a camera installed in the housing; a conical reflector located in the housing and below the camera; and an annular reflector located in the housing and corresponding to the conical reflector configuration; wherein the The imaging light path of the camera defines an imaging space outside the housing through reflections from the conical reflector and the annular reflector, which is used to detect the annular side surfaces of the plurality of electronic components in the material tray located at the third position; wherein, when the material tray carries a plurality of the electronic components and is located at the third position, the composite device can move relative to the material conveyor belt so that the upper visual detection mechanism and the annular side surface detection mechanism can be used to detect the upper surfaces and the annular side surfaces of the plurality of electronic components.

本創作實施例也公開一種光學檢測設備,其包括:一工作台;一料件傳送帶,安裝於所述工作台且用以沿一第一方向傳輸承載有多個電子構件的一料盤,以使所述料盤能於一第一位置、一第二位置、及一第三位置之間移動;一第一移載機構,安裝於所述工作台且用以沿垂直所述第一方向的一第二方向自位於所述第一位置的所述料盤擷取並傳輸多個所述電子構件;一下視覺檢測機構,安裝於所述工作台,並且所述第一移載機構位於所述下視覺檢測機構的一側;其中,所述下視覺檢測機構用以接收自所述第一移載機構所傳輸的多個所述電子構件、並檢測多個所述電子構件的下表面;一第二移載機構,安裝於所述工作台,並且所述第二移載機構位於所述下視覺檢測機構的另一側;其中,所述第二移載機構用以將完成所述下視覺檢測機構檢測的多個所述電子構件傳輸至位於所述第二位置的所述料盤;以及一複合式裝置,安裝於所述工作台且位於遠離所述第一移載機構的所述第二移載機構一側;其中,所述複合式裝置包含:一上視覺檢測機構,能用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的上表面;及一環側面檢測機構,定義有位於其之外的一取像空間,用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的環側面;其中,當所述料盤之內承載多個所述電子構件且位於所述第三位置時,所述複合式裝置能相對於所述料件傳送帶移動,以使所述上視覺檢測機構與所述環側面檢測機構能夠用以檢測多個所述電子構件的所述上表面與所述環側面。The present invention also discloses an optical inspection device, which includes: a workbench; a material conveyor belt mounted on the workbench and used to transport a material tray carrying a plurality of electronic components along a first direction so that the material tray can move between a first position, a second position, and a third position; a first transfer mechanism mounted on the workbench and used to pick up and transfer a plurality of electronic components from the material tray at the first position along a second direction perpendicular to the first direction. The electronic components are mounted on the workbench; a lower visual detection mechanism is mounted on the workbench, and the first transfer mechanism is located on one side of the lower visual detection mechanism; wherein the lower visual detection mechanism is used to receive the plurality of electronic components transmitted from the first transfer mechanism and detect the lower surfaces of the plurality of electronic components; a second transfer mechanism is mounted on the workbench, and the second transfer mechanism is located on the other side of the lower visual detection mechanism; wherein the The second transfer mechanism is used to transfer the plurality of electronic components that have completed the inspection by the lower visual inspection mechanism to the tray located at the second position; and a composite device installed on the workbench and located on a side of the second transfer mechanism far away from the first transfer mechanism; wherein the composite device includes: an upper visual inspection mechanism that can be used to detect the upper surface of the plurality of electronic components in the tray located at the third position; and a ring side The detection mechanism defines an imaging space outside the detection mechanism for detecting the circumferential side surfaces of the plurality of electronic components in the material tray located at the third position; wherein, when the material tray carries the plurality of electronic components and is located at the third position, the composite device can move relative to the material conveyor belt so that the upper visual detection mechanism and the circumferential side surface detection mechanism can be used to detect the upper surfaces and the circumferential side surfaces of the plurality of electronic components.

綜上所述,本創作實施例所公開的光學檢測設備,其通過所述複合式檢測裝置整合所述上視覺檢測機構與所述環側面檢測機構於相同軸向,據以利於提升所述光學檢測設備的檢測效能、並能縮小所述光學檢測設備的整體體積。In summary, the optical detection device disclosed in the present inventive embodiment integrates the upper visual detection mechanism and the circumferential side detection mechanism in the same axial direction through the composite detection device, thereby improving the detection performance of the optical detection device and reducing the overall size of the optical detection device.

再者,本創作實施例所公開的光學檢測設備,其所採用的所述環側面檢測機構夠通過所述取像空間直接對位於所述環側面檢測機構外側的多個所述電子構件的所述環側面進行取像,因而無須受限於逐個檢測所述電子構件的所述環側面,據以有效地提升檢測效能。Furthermore, the optical detection equipment disclosed in the present inventive embodiment uses an annular side surface detection mechanism which can directly image the annular side surfaces of the multiple electronic components located outside the annular side surface detection mechanism through the imaging space, and therefore does not need to be limited to detecting the annular side surfaces of the electronic components one by one, thereby effectively improving the detection performance.

為能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與附圖,但是此等說明與附圖僅用來說明本創作,而非對本創作的保護範圍作任何的限制。To further understand the features and technical content of this creation, please refer to the following detailed description and illustrations of this creation. However, such description and illustrations are only used to illustrate this creation and do not limit the scope of protection of this creation.

以下是通過特定的具體實施例來說明本創作所公開有關「光學檢測設備」的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本創作的構思下進行各種修改與變更。另外,本創作的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的保護範圍。The following is an explanation of the implementation method of the "optical detection equipment" disclosed in this creation through specific concrete embodiments. Technical personnel in this field can understand the advantages and effects of this creation from the content disclosed in this manual. This creation can be implemented or applied through other different specific embodiments, and the details in this manual can also be modified and changed in various ways based on different viewpoints and applications without deviating from the concept of this creation. In addition, the drawings of this creation are only simple schematic illustrations and are not depicted according to actual size. Please note in advance. The following implementation method will further explain the relevant technical content of this creation in detail, but the disclosed content is not used to limit the scope of protection of this creation.

應當可以理解的是,雖然本文中可能會使用到「第一」、「第二」、「第三」等術語來描述各種元件或者特徵,但這些元件或者特徵不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一特徵與另一特徵。另外,本文中所使用的術語「或」,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements or features, these elements or features should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one feature from another feature. In addition, the term "or" used herein may include any one or more combinations of the related listed items depending on the actual situation.

請參閱圖1至圖10所示,其為本創作的實施例。本實施例公開一種如圖1和圖2所示,本實施例公開一種光學檢測設備100,其包含一料件傳送帶1、橫跨所述料件傳送帶1的一第一移載機構2、平行所述第一移載機構2的一第二移載機構3、位於所述第一移載機構2與所述第二移載機構3之間的一下視覺檢測機構4、橫跨所述料件傳送帶1的一複合式裝置5、平行且位於所述料件傳送帶1一側的多個分料單元6、平行且位於所述料件傳送帶1另一側的一料盤傳送帶7、及用以供上述元件安裝的一工作台8。Please refer to Figures 1 to 10, which are embodiments of the present invention. As shown in Figures 1 and 2, the present embodiment discloses an optical detection device 100, which includes a material conveyor belt 1, a first transfer mechanism 2 across the material conveyor belt 1, a second transfer mechanism 3 parallel to the first transfer mechanism 2, a visual detection mechanism 4 located between the first transfer mechanism 2 and the second transfer mechanism 3, a composite device 5 across the material conveyor belt 1, a plurality of material distribution units 6 parallel to and located on one side of the material conveyor belt 1, a tray conveyor belt 7 parallel to and located on the other side of the material conveyor belt 1, and a workbench 8 for mounting the above components.

也就是說,所述料件傳送帶1、所述第一移載機構2、所述第二移載機構3、所述下視覺檢測機構4、所述複合式裝置5、多個所述分料單元6、及所述料盤傳送帶7皆安裝於所述工作台8,但本創作不受限於此。舉例來說,於本創作未繪示的其他實施例中,所述光學檢測設備100可依據實際需求而省略多個所述分料單元6與所述料盤傳送帶7。That is, the material conveyor belt 1, the first transfer mechanism 2, the second transfer mechanism 3, the lower visual detection mechanism 4, the composite device 5, the plurality of material dividing units 6, and the tray conveyor belt 7 are all installed on the workbench 8, but the invention is not limited thereto. For example, in other embodiments not shown in the invention, the optical detection device 100 may omit the plurality of material dividing units 6 and the tray conveyor belt 7 according to actual needs.

於本實施例中,所述料件傳送帶1用以沿一第一方向D1傳輸至少一個料盤11,其承載有多個電子構件200並能(沿所述料件傳送帶1)於一第一位置P1、一第二位置P2、及一第三位置P3之間移動。其中,所述料件傳送帶1於本實施例中是沿所述第一方向D1大致跨越整個所述工作台8。需額外說明的是,為便於理解本實施例,位於所述料件傳送帶1的所述料盤11的數量於下述內容之中是以一個來介紹,但本創作不受限於此。In this embodiment, the material conveyor belt 1 is used to convey at least one material tray 11 along a first direction D1, which carries a plurality of electronic components 200 and can move (along the material conveyor belt 1) between a first position P1, a second position P2, and a third position P3. In this embodiment, the material conveyor belt 1 roughly spans the entire workbench 8 along the first direction D1. It should be noted that, in order to facilitate understanding of this embodiment, the number of the material trays 11 located on the material conveyor belt 1 is introduced as one in the following content, but the present invention is not limited thereto.

此外,為便於理解所述光學檢測設備100於本實施例之中的移載架構佈局,此處先行簡要介紹所述複合式裝置5所包含的多個機構。於本實施例中,所述複合式裝置5包含一第三移載機構51、安裝於所述第三移載機構51的一上視覺檢測機構52、及安裝於所述第三移載機構51的一環側面檢測機構53;也就是說,所述複合式裝置5於本實施例中是包含有移載功能與多重檢測功能,但本創作不以此為限。In addition, in order to facilitate understanding of the transfer structure layout of the optical detection device 100 in this embodiment, the multiple mechanisms included in the composite device 5 are briefly introduced here. In this embodiment, the composite device 5 includes a third transfer mechanism 51, an upper visual detection mechanism 52 installed on the third transfer mechanism 51, and a ring side detection mechanism 53 installed on the third transfer mechanism 51; that is, the composite device 5 in this embodiment includes a transfer function and multiple detection functions, but the present invention is not limited to this.

所述第一移載機構2、所述第二移載機構3、及所述複合式裝置5(如:所述第三移載機構51)彼此平行設置並且各自沿著垂直所述第一方向D1的一第二方向D2架設於所述工作台8。其中,所述複合式裝置5位於遠離所述第一移載機構2的所述第二移載機構3一側(也就是,所述第二移載機構3位於所述第一移載機構2與所述複合式裝置5之間),並且所述複合式裝置5(如:所述第三移載機構51)橫跨所述料件傳送帶1、多個所述分料單元6、及所述料盤傳送帶7。The first transfer mechanism 2, the second transfer mechanism 3, and the composite device 5 (such as the third transfer mechanism 51) are arranged in parallel with each other and are respectively set up on the workbench 8 along a second direction D2 perpendicular to the first direction D1. The composite device 5 is located on the side of the second transfer mechanism 3 far from the first transfer mechanism 2 (that is, the second transfer mechanism 3 is located between the first transfer mechanism 2 and the composite device 5), and the composite device 5 (such as the third transfer mechanism 51) spans the material conveyor belt 1, the plurality of the material distribution units 6, and the tray conveyor belt 7.

進一步地說,所述第一移載機構2、所述第二移載機構3、及所述第三移載機構51於本實施例中各包含有一軌道21、31、511、及可移動地安裝於所述軌道21、31、511的一擷取器22、32、512。其中,所述軌道21、31、511安裝於所述工作台8且沿所述第二方向D2配置,而所述擷取器22、32、512用以擷取多個所述電子構件200。再者,所述第一移載機構2的所述擷取器22的移動路徑沿經所述料件傳送帶1的所述第一位置P1,所述第二移載機構3的所述擷取器32的移動路徑沿經所述料件傳送帶1的所述第二位置P2,所述第三移載機構51的所述擷取器512的移動路徑沿經所述料件傳送帶1的所述第三位置P3。Furthermore, in this embodiment, the first transfer mechanism 2, the second transfer mechanism 3, and the third transfer mechanism 51 each include a rail 21, 31, 511, and a grabber 22, 32, 512 movably mounted on the rail 21, 31, 511. The rail 21, 31, 511 is mounted on the workbench 8 and arranged along the second direction D2, and the grabber 22, 32, 512 is used to grab a plurality of the electronic components 200. Furthermore, the moving path of the grabber 22 of the first transfer mechanism 2 passes through the first position P1 of the material conveyor belt 1, the moving path of the grabber 32 of the second transfer mechanism 3 passes through the second position P2 of the material conveyor belt 1, and the moving path of the grabber 512 of the third transfer mechanism 51 passes through the third position P3 of the material conveyor belt 1.

其中,所述上視覺檢測機構52與所述環側面檢測機構53較佳是沿所述第二方向D2排列並安裝於所述第三移載機構51的所述擷取器512,據以能相對於所述料件傳送帶1移動,但本創作不以此為限。舉例來說,於本創作未繪示的其他實施例中,所述上視覺檢測機構52及/或所述環側面檢測機構53也可依據實際需求而可移動地安裝於所述所述第三移載機構51的所述軌道511,據以能獨立地相對於所述料件傳送帶1移動;或者,所述上視覺檢測機構52與所述環側面檢測機構53也能各自配置有單獨的移載機構。The upper visual detection mechanism 52 and the circumferential side detection mechanism 53 are preferably arranged along the second direction D2 and mounted on the grabber 512 of the third transfer mechanism 51, so as to be movable relative to the material conveyor belt 1, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the upper visual detection mechanism 52 and/or the circumferential side detection mechanism 53 may also be movably mounted on the track 511 of the third transfer mechanism 51 according to actual needs, so as to be independently movable relative to the material conveyor belt 1; or, the upper visual detection mechanism 52 and the circumferential side detection mechanism 53 may also be each configured with a separate transfer mechanism.

以上為所述光學檢測設備100於本實施例之中的移載架構佈局大致說明,以下接著介紹所述光學檢測設備100的其餘架構細節與運作功能。如圖3至圖6所示,所述下視覺檢測機構4設置於所述第一移載機構2與所述第二移載機構3的所述擷取器32的所述移動路徑之上;也就是說,所述第一移載機構2位於所述下視覺檢測機構4的一側,而所述第二移載機構3位於所述下視覺檢測機構4的另一側。The above is a general description of the transfer structure layout of the optical detection device 100 in this embodiment. The following is an introduction to the remaining structure details and operation functions of the optical detection device 100. As shown in Figures 3 to 6, the lower visual detection mechanism 4 is arranged on the moving path of the capturer 32 of the first transfer mechanism 2 and the second transfer mechanism 3; that is, the first transfer mechanism 2 is located on one side of the lower visual detection mechanism 4, and the second transfer mechanism 3 is located on the other side of the lower visual detection mechanism 4.

所述第一移載機構2(如:所述擷取器22)用以沿所述第二方向D2自位於所述第一位置P1的所述料盤11擷取並傳輸多個所述電子構件200。所述下視覺檢測機構4用以接收自所述第一移載機構2所傳輸的多個所述電子構件200、並檢測多個所述電子構件200的下表面201。所述第二移載機構3用以將完成所述下視覺檢測機構4檢測的多個所述電子構件200傳輸至位於所述第二位置P2的所述料盤11,據以通過所述料件傳送帶1將所述料盤11自所述第二位置P2傳輸至所述第三位置P3。The first transfer mechanism 2 (e.g., the grabber 22) is used to grab and transfer the plurality of electronic components 200 from the tray 11 located at the first position P1 along the second direction D2. The lower visual detection mechanism 4 is used to receive the plurality of electronic components 200 transferred from the first transfer mechanism 2 and detect the lower surfaces 201 of the plurality of electronic components 200. The second transfer mechanism 3 is used to transfer the plurality of electronic components 200 detected by the lower visual detection mechanism 4 to the tray 11 located at the second position P2, thereby transferring the tray 11 from the second position P2 to the third position P3 through the material conveyor belt 1.

需額外說明的是,所述下視覺檢測機構4的具體架構可依實際需求而加以調整變化,但為便於理解本實施例,下述內容將以所述下視覺檢測機構4的其中一種可行的架構來介紹,但本創作不以此為限。如圖5所示,所述下視覺檢測機構4於本實施例中包含有一治具41、面向所述治具41底側的一光投射器42、對應於所述光投射器42的多個光接收器43、及電性耦接於多個所述光接收器43的一處理模組44。It should be noted that the specific structure of the lower vision detection mechanism 4 can be adjusted and changed according to actual needs, but for the convenience of understanding this embodiment, the following content will be introduced based on one feasible structure of the lower vision detection mechanism 4, but the present invention is not limited to this. As shown in FIG. 5 , the lower vision detection mechanism 4 in this embodiment includes a fixture 41, a light projector 42 facing the bottom side of the fixture 41, a plurality of light receivers 43 corresponding to the light projector 42, and a processing module 44 electrically coupled to the plurality of light receivers 43.

更詳細地說,所述治具41用以承載多個所述電子構件200,並使多個所述電子構件200的所述下表面201裸露於所述治具41之外。所述光投射器42用以朝每個所述電子構件200的所述下表面201(如:多個觸點)發出基於干涉條紋的一結構光L。多個所述光接收器43用於接收由每個所述電子構件200所反射的所述結構光L,以得到一信號。所述處理模組44用以接收所述信號、以得到形狀對應於每個所述電子構件200的所述下表面201的一立體構面。再者,所述處理模組44於本實施例中可以是通過點雲數據(point cloud data)方式呈現所述立體構面,其能通過一螢幕(圖中未示出)顯示,但本創作不以上述為限。In more detail, the fixture 41 is used to carry the plurality of electronic components 200, and the lower surfaces 201 of the plurality of electronic components 200 are exposed outside the fixture 41. The light projector 42 is used to emit a structured light L based on interference fringes toward the lower surface 201 (e.g., multiple contacts) of each electronic component 200. The plurality of light receivers 43 are used to receive the structured light L reflected by each electronic component 200 to obtain a signal. The processing module 44 is used to receive the signal to obtain a three-dimensional structured surface having a shape corresponding to the lower surface 201 of each electronic component 200. Furthermore, the processing module 44 in this embodiment may present the three-dimensional surface in the form of point cloud data, which can be displayed on a screen (not shown in the figure), but the present invention is not limited to the above.

如圖7至圖9所示,所述上視覺檢測機構52於本實施例中能用以檢測位於所述第三位置P3的所述料盤11之中的多個所述電子構件200的上表面202,並且所述上視覺檢測機構52的具體架構也可依實際需求而加以調整變化。然而,為便於理解,所述上視覺檢測機構52於本實施例中所採用的架構如同所述下視覺檢測機構4於圖5所呈現的架構,因而以下內容不再加以贅述。As shown in FIGS. 7 to 9 , the upper visual detection mechanism 52 in this embodiment can be used to detect the upper surfaces 202 of the plurality of electronic components 200 in the tray 11 at the third position P3, and the specific structure of the upper visual detection mechanism 52 can also be adjusted and changed according to actual needs. However, for ease of understanding, the structure of the upper visual detection mechanism 52 in this embodiment is the same as the structure of the lower visual detection mechanism 4 shown in FIG. 5 , and thus will not be described in detail below.

所述環側面檢測機構53定義有位於其之外的一取像空間S,用以檢測位於所述第三位置P3的所述料盤11之中的多個所述電子構件200的環側面203。也就是說,所述環側面檢測機構53能夠通過所述取像空間S直接對位於所述環側面檢測機構53外側的多個所述電子構件200的所述環側面203進行取像,因而無須受限於逐個檢測所述電子構件200的所述環側面203,據以有效地提升檢測效能。換個角度來說,需要將電子構件置入反射件包圍空間的任何檢測機構,其不同於本實施例所提供的所述環側面檢測機構53。The annular side surface detection mechanism 53 defines an imaging space S outside the annular side surface 203 of the plurality of electronic components 200 in the tray 11 at the third position P3. In other words, the annular side surface detection mechanism 53 can directly image the annular side surfaces 203 of the plurality of electronic components 200 located outside the annular side surface detection mechanism 53 through the imaging space S, and thus is not limited to detecting the annular side surfaces 203 of the electronic components 200 one by one, thereby effectively improving the detection performance. In other words, any detection mechanism that requires placing the electronic components in a space surrounded by a reflector is different from the annular side surface detection mechanism 53 provided in this embodiment.

需額外說明的是,所述環側面檢測機構53的具體架構可依據實際需求而加以調整變化,但為便於理解本實施例,下述內容將以所述環側面檢測機構53的其中一種可行的架構來介紹,但本創作不以此為限。如圖9所示,所述環側面檢測機構53於本實施例中包含一殼體531、安裝於所述殼體531之內的一攝像器532、位於所述殼體531之內且位於所述攝像器532下方的一錐狀反射件533、及位於所述殼體531之內且對應於所述錐狀反射件533配置的一環狀反射件534。It should be noted that the specific structure of the annular side detection mechanism 53 can be adjusted and changed according to actual needs. However, in order to facilitate the understanding of this embodiment, the following content will be introduced based on one feasible structure of the annular side detection mechanism 53, but the present invention is not limited thereto. As shown in FIG. 9 , the annular side detection mechanism 53 in this embodiment includes a housing 531, a camera 532 installed in the housing 531, a cone-shaped reflector 533 located in the housing 531 and below the camera 532, and an annular reflector 534 located in the housing 531 and configured corresponding to the cone-shaped reflector 533.

更詳細地說,所述環側面檢測機構53通過所述殼體531安裝於所述第三移載機構51,並且所述攝像器532沿垂直所述第一方向D1與所述第二方向D2的一高度方向H設置於所述錐狀反射件533的正上方。再者,所述攝像器532的取像光路徑P通過所述錐狀反射件533與所述環狀反射件534的反射而定義有位於所述殼體531之外的所述取像空間S,其用以檢測位於所述第三位置P3的所述料盤11之中的多個所述電子構件200的所述環側面203。In more detail, the annular side surface detection mechanism 53 is mounted on the third transfer mechanism 51 through the housing 531, and the camera 532 is disposed directly above the conical reflector 533 along a height direction H perpendicular to the first direction D1 and the second direction D2. Furthermore, the imaging optical path P of the camera 532 is defined as the imaging space S outside the housing 531 through reflection of the conical reflector 533 and the annular reflector 534, which is used to detect the annular side surfaces 203 of the plurality of electronic components 200 in the tray 11 at the third position P3.

依上所述,當所述料盤11之內承載多個所述電子構件200且位於所述第三位置P3時,所述複合式裝置5能相對於所述料件傳送帶1(沿所述第二方向D2)移動,以使所述上視覺檢測機構52與所述環側面檢測機構53能夠用以檢測多個所述電子構件200的所述上表面202與所述環側面203。As described above, when the material tray 11 carries a plurality of the electronic components 200 and is located at the third position P3, the composite device 5 can move relative to the material conveyor belt 1 (along the second direction D2) so that the upper visual detection mechanism 52 and the circumferential side detection mechanism 53 can be used to detect the upper surfaces 202 and the circumferential side surfaces 203 of the plurality of the electronic components 200.

據此,所述光學檢測設備100於本實施例中能通過所述複合式裝置5整合所述上視覺檢測機構52與所述環側面檢測機構53於相同軸向,進而有利於提升所述光學檢測設備100的檢測效能、並能縮小所述光學檢測設備100的整體體積。Accordingly, in this embodiment, the optical detection device 100 can integrate the upper visual detection mechanism 52 and the circumferential side detection mechanism 53 in the same axial direction through the composite device 5, thereby helping to improve the detection performance of the optical detection device 100 and reduce the overall volume of the optical detection device 100.

進一步地說,為使所述環側面檢測機構53能夠具備有較佳的檢測效果,所述環側面檢測機構53較佳是具有下述至少部分特徵。其中,所述錐狀反射件533包含有N個第一反射鏡5331,所述環狀反射件534包含有N個第二反射鏡5341,並且N個所述第一反射鏡5331的位置分別對應於N個所述第二反射鏡5341的位置(如:所述取像光路徑P通過每個所述第一反射鏡5331與相對應所述第二反射鏡5341的兩次反射、而於所述殼體531之外彼此重疊形成有所述取像空間S),而N為大於5的正整數(如:N為8)。更詳細地說,所述取像光路徑P在經過所述環狀反射件534時,每個所述第二反射鏡5341能朝向所述取像空間S且相對於所述高度方向H形成有介於40度~50度的一反射角σ,但本創作不受限於此。Furthermore, in order to enable the annular side detection mechanism 53 to have a better detection effect, the annular side detection mechanism 53 preferably has at least some of the following features: wherein the conical reflector 533 includes N first reflectors 5331, the annular reflector 534 includes N second reflectors 5341, and the positions of the N first reflectors 5331 correspond to the positions of the N second reflectors 5341 (e.g., the imaging optical path P is reflected twice by each of the first reflectors 5331 and the corresponding second reflectors 5341, and overlaps with each other outside the housing 531 to form the imaging space S), and N is a positive integer greater than 5 (e.g., N is 8). In more detail, when the imaging light path P passes through the annular reflector 534, each of the second reflective mirrors 5341 can be directed toward the imaging space S and form a reflection angle σ between 40 degrees and 50 degrees relative to the height direction H, but the present invention is not limited thereto.

再者,所述殼體531定義有平行所述高度方向H的一中心軸線C,所述攝像器532設置於所述中心軸線C之上。所述錐狀反射件533相對於所述中心軸線C呈N重旋轉對稱(N-fold rotational symmetry),並且所述環狀反射件534相對於所述中心軸線C也呈N重旋轉對稱。更詳細地說,多個所述第一反射鏡5331所包圍的區域朝遠離所述攝像器532的方向逐漸地增加,並且遠離所述攝像器532的所述錐狀反射件533的底部包圍於所述環狀反射件534,但不受限於此。Furthermore, the housing 531 defines a central axis C parallel to the height direction H, and the camera 532 is disposed on the central axis C. The conical reflector 533 has N-fold rotational symmetry with respect to the central axis C, and the annular reflector 534 also has N-fold rotational symmetry with respect to the central axis C. In more detail, the area surrounded by the plurality of first reflectors 5331 gradually increases in a direction away from the camera 532, and the bottom of the conical reflector 533 away from the camera 532 is surrounded by the annular reflector 534, but is not limited thereto.

舉例來說,於本創作未繪示的其他實施例中,所述環狀反射件534也可以沿所述高度方向H與所述錐狀反射件533呈間隔配置;或者,所述環側面檢測機構53的所述取像光路徑P也可以通過兩次以上的反射而定義有位於所述殼體531之外的所述取像空間S 。For example, in other embodiments not shown in the present invention, the annular reflector 534 may be spaced apart from the conical reflector 533 along the height direction H; or, the imaging optical path P of the annular side detection mechanism 53 may be defined as the imaging space S outside the housing 531 through more than two reflections.

依上所述,如圖8至圖10所示,每個所述電子構件200在所述下表面201、所述上表面202、及所述環側面203於檢測之後定義為一已檢測構件200a,其位在所述第三位置P3的所述料盤11之內。再者,所述第三移載機構51(如:所述擷取器512)能於所述料件傳送帶1及多個所述分料單元6之間移動,並且所述第三移載機構51能用以選擇性地自位在所述第三位置P3的所述料盤11、將至少其中一個所述已檢測構件200a移動至多個所述分料單元6的其中之一。According to the above, as shown in Figures 8 to 10, each of the electronic components 200 is defined as a detected component 200a on the lower surface 201, the upper surface 202, and the annular side surface 203 after detection, and is located in the tray 11 at the third position P3. Furthermore, the third transfer mechanism 51 (such as the capturer 512) can move between the material conveyor belt 1 and the plurality of the material distribution units 6, and the third transfer mechanism 51 can be used to selectively move at least one of the detected components 200a from the tray 11 located at the third position P3 to one of the plurality of the material distribution units 6.

據此,所述光學檢測設備100於本實施例中能通過所述第三移載機構51來將多個所述已檢測構件200a依據檢測結果進行分類、並移動至相對應的所述分料單元6。舉例來說:未有任何缺陷的所述已檢測構件200a、所述下表面201具有缺陷的所述已檢測構件200a、所述上表面202具有缺陷的所述已檢測構件200a、及所述環側面203具有缺陷的所述已檢測構件200a可以各由一個所述分料單元6所存放。Accordingly, the optical inspection device 100 in this embodiment can classify the plurality of inspected components 200a according to the inspection results and move them to the corresponding material separation units 6 through the third transfer mechanism 51. For example, the inspected components 200a without any defects, the inspected components 200a with defects on the lower surface 201, the inspected components 200a with defects on the upper surface 202, and the inspected components 200a with defects on the circumferential side surface 203 can each be stored in one of the material separation units 6.

需補充說明的是,所述光學檢測設備100於本實施例中所包含的所有元件可以是同步進行作業(如:所述下視覺檢測機構4在對一批電子構件200進行檢測時,所述上視覺檢測機構52與所述環側面檢測機構53可以同步對另一批電子構件200進行檢測),據以能夠有效地提高所述光學檢測設備100的運作效能。It should be noted that all components included in the optical inspection device 100 in this embodiment can operate synchronously (for example, when the lower visual inspection mechanism 4 is inspecting a batch of electronic components 200, the upper visual inspection mechanism 52 and the circumferential side inspection mechanism 53 can synchronously inspect another batch of electronic components 200), thereby effectively improving the operating performance of the optical inspection device 100.

[本創作實施例的技術效果][Technical effects of the present invention]

綜上所述,本創作實施例所公開的光學檢測設備,其通過所述複合式檢測裝置整合所述上視覺檢測機構與所述環側面檢測機構於相同軸向,據以利於提升所述光學檢測設備的檢測效能、並能縮小所述光學檢測設備的整體體積。In summary, the optical detection device disclosed in the present inventive embodiment integrates the upper visual detection mechanism and the circumferential side detection mechanism in the same axial direction through the composite detection device, thereby improving the detection performance of the optical detection device and reducing the overall size of the optical detection device.

再者,本創作實施例所公開的光學檢測設備,其所採用的所述環側面檢測機構夠通過所述取像空間直接對位於所述環側面檢測機構外側的多個所述電子構件的所述環側面進行取像,因而無須受限於逐個檢測所述電子構件的所述環側面,據以有效地提升檢測效能。Furthermore, the optical detection equipment disclosed in the present inventive embodiment uses an annular side surface detection mechanism which can directly image the annular side surfaces of the multiple electronic components located outside the annular side surface detection mechanism through the imaging space, and therefore does not need to be limited to detecting the annular side surfaces of the electronic components one by one, thereby effectively improving the detection performance.

以上所公開的內容僅為本創作的優選可行實施例,並非因此侷限本創作的專利範圍,所以凡是運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的專利範圍內。The above disclosed contents are only the preferred feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the instructions and diagrams of the present invention are included in the patent scope of the present invention.

100:光學檢測設備 1:料件傳送帶 11:料盤 2:第一移載機構 21:軌道 22:擷取器 3:第二移載機構 31:軌道 32:擷取器 4:下視覺檢測機構 41:治具 42:光投射器 43:光接收器 44:處理模組 5:複合式裝置 51:第三移載機構 511:軌道 512:擷取器 52:上視覺檢測機構 53:環側面檢測機構 531:殼體 532:攝像器 533:錐狀反射件 5331:第一反射鏡 534:環狀反射件 5341:第二反射鏡 6:分料單元 7:料盤傳送帶 8:工作台 D1:第一方向 D2:第二方向 H:高度方向 P1:第一位置 P2:第二位置 P3:第三位置 L:結構光 S:取像空間 P:取像光路徑 C:中心軸線 σ:反射角 200:電子構件 200a:已檢測構件 201:下表面 202:上表面 203:環側面100: Optical detection equipment 1: Material conveyor 11: Material tray 2: First transfer mechanism 21: Track 22: Capture 3: Second transfer mechanism 31: Track 32: Capture 4: Lower visual detection mechanism 41: Fixture 42: Light projector 43: Light receiver 44: Processing module 5: Composite device 51: Third transfer mechanism 511: Track 512: Capture 52: Upper visual detection mechanism 53: Circumferential side detection mechanism 531: Housing 532: Camera 533: Conical reflector 5331: First reflector 534: Annular reflector 5341: Second reflector 6: Material dividing unit 7: Material tray conveyor 8: Workbench D1: First direction D2: Second direction H: Height direction P1: First position P2: Second position P3: Third position L: Structured light S: Image space P: Image optical path C: Center axis σ: Reflection angle 200: Electronic component 200a: Detected component 201: Lower surface 202: Upper surface 203: Annular side

圖1為本創作實施例的光學檢測設備的側視示意圖。FIG1 is a side view schematic diagram of an optical detection device according to an embodiment of the present invention.

圖2為本創作實施例的光學檢測設備的俯視示意圖。FIG. 2 is a schematic top view of the optical detection device of an embodiment of the present invention.

圖3為圖2的後續作動示意圖。FIG. 3 is a schematic diagram of the subsequent operation of FIG. 2 .

圖4為圖3的後續作動示意圖。FIG. 4 is a schematic diagram of the subsequent operation of FIG. 3 .

圖5為圖4的局部放大剖視示意圖。FIG. 5 is a partially enlarged cross-sectional schematic diagram of FIG. 4 .

圖6為圖4的後續作動示意圖。FIG. 6 is a schematic diagram of the subsequent operation of FIG. 4 .

圖7為圖6的後續作動示意圖。FIG. 7 is a schematic diagram of the subsequent operation of FIG. 6 .

圖8為圖7的後續作動示意圖。FIG8 is a schematic diagram of the subsequent operation of FIG7.

圖9為圖8的局部放大剖視示意圖。FIG. 9 is a partially enlarged cross-sectional schematic diagram of FIG. 8 .

圖10為圖8的後續作動示意圖。FIG. 10 is a schematic diagram of the subsequent operation of FIG. 8 .

100:光學檢測設備 100: Optical testing equipment

1:料件傳送帶 1: Material conveyor belt

11:料盤 11: Material tray

2:第一移載機構 2: The first transfer mechanism

21:軌道 21: Track

22:擷取器 22: Capturer

3:第二移載機構 3: Second transfer mechanism

31:軌道 31: Track

32:擷取器 32: Capturer

4:下視覺檢測機構 4: Lower visual detection mechanism

41:治具 41: Jig

5:複合式裝置 5:Combined device

51:第三移載機構 51: The third transfer mechanism

511:軌道 511:Track

512:擷取器 512: Capturer

52:上視覺檢測機構 52: Upper visual detection mechanism

53:環側面檢測機構 53: Ring side detection mechanism

6:分料單元 6: Material separation unit

7:料盤傳送帶 7: Tray conveyor belt

8:工作台 8: Workbench

D1:第一方向 D1: First direction

D2:第二方向 D2: Second direction

P1:第一位置 P1: First position

P2:第二位置 P2: Second position

P3:第三位置 P3: Third position

200:電子構件 200: Electronic components

Claims (10)

一種光學檢測設備,其包括: 一工作台; 一料件傳送帶,安裝於所述工作台且用以沿一第一方向傳輸承載有多個電子構件的一料盤,以使所述料盤能於一第一位置、一第二位置、及一第三位置之間移動; 一第一移載機構,安裝於所述工作台且用以沿垂直所述第一方向的一第二方向自位於所述第一位置的所述料盤擷取並傳輸多個所述電子構件; 一下視覺檢測機構,安裝於所述工作台,並且所述第一移載機構位於所述下視覺檢測機構的一側;其中,所述下視覺檢測機構用以接收自所述第一移載機構所傳輸的多個所述電子構件、並檢測多個所述電子構件的下表面; 一第二移載機構,安裝於所述工作台,並且所述第二移載機構位於所述下視覺檢測機構的另一側;其中,所述第二移載機構用以將完成所述下視覺檢測機構檢測的多個所述電子構件傳輸至位於所述第二位置的所述料盤;以及 一複合式裝置,安裝於所述工作台且位於遠離所述第一移載機構的所述第二移載機構一側;其中,所述複合式裝置包含: 一上視覺檢測機構,能用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的上表面;及 一環側面檢測機構,包含: 一殼體; 一攝像器,安裝於所述殼體之內; 一錐狀反射件,位於所述殼體之內且位於所述攝像器的下方;及 一環狀反射件,位於所述殼體之內且對應於所述錐狀反射件配置; 其中,所述攝像器的取像光路徑通過所述錐狀反射件與所述環狀反射件的反射而定義有位於所述殼體之外的一取像空間,其用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的環側面; 其中,當所述料盤之內承載多個所述電子構件且位於所述第三位置時,所述複合式裝置能相對於所述料件傳送帶移動,以使所述上視覺檢測機構與所述環側面檢測機構能夠用以檢測多個所述電子構件的所述上表面與所述環側面。 An optical detection device, comprising: A workbench; A material conveyor belt, mounted on the workbench and used to transfer a material tray carrying multiple electronic components along a first direction, so that the material tray can move between a first position, a second position, and a third position; A first transfer mechanism, mounted on the workbench and used to grab and transfer multiple electronic components from the material tray located at the first position along a second direction perpendicular to the first direction; A lower visual detection mechanism, mounted on the workbench, and the first transfer mechanism is located on one side of the lower visual detection mechanism; wherein the lower visual detection mechanism is used to receive multiple electronic components transferred from the first transfer mechanism and detect the lower surfaces of multiple electronic components; A second transfer mechanism, mounted on the workbench, and the second transfer mechanism is located on the other side of the lower visual detection mechanism; wherein the second transfer mechanism is used to transfer the plurality of electronic components detected by the lower visual detection mechanism to the tray located at the second position; and A composite device, mounted on the workbench and located on the side of the second transfer mechanism far from the first transfer mechanism; wherein the composite device comprises: An upper visual detection mechanism, which can be used to detect the upper surface of the plurality of electronic components in the tray located at the third position; and A circumferential side detection mechanism, comprising: A housing; A camera, mounted in the housing; A conical reflector is located inside the housing and below the camera; and An annular reflector is located inside the housing and is configured corresponding to the conical reflector; Wherein, the imaging optical path of the camera is defined by the reflection of the conical reflector and the annular reflector to have an imaging space outside the housing, which is used to detect the annular side surfaces of the plurality of electronic components in the tray located at the third position; Wherein, when the material tray carries a plurality of the electronic components and is located at the third position, the composite device can move relative to the material conveyor belt so that the upper visual detection mechanism and the circumferential side detection mechanism can be used to detect the upper surface and the circumferential side of the plurality of electronic components. 如請求項1所述的光學檢測設備,其中,所述複合式裝置進一步包含有安裝於所述工作台的一第三移載機構,並且所述上視覺檢測機構與所述環側面檢測機構安裝於所述第三移載機構,以能相對於所述料件傳送帶移動。An optical inspection device as described in claim 1, wherein the composite device further comprises a third transfer mechanism mounted on the workbench, and the upper visual inspection mechanism and the circumferential side inspection mechanism are mounted on the third transfer mechanism so as to be able to move relative to the material conveyor belt. 如請求項2所述的光學檢測設備,其中,所述第一移載機構、所述第二移載機構、及所述第三移載機構各包含有: 一軌道,安裝於所述工作台且沿所述第二方向配置;及 一擷取器,可移動地安裝於所述軌道,並且所述擷取器用以擷取多個所述電子構件。 The optical detection device as described in claim 2, wherein the first transfer mechanism, the second transfer mechanism, and the third transfer mechanism each include: a rail mounted on the workbench and arranged along the second direction; and a grabber movably mounted on the rail, and the grabber is used to grab a plurality of the electronic components. 如請求項2所述的光學檢測設備,其中,每個所述電子構件在所述下表面、所述上表面、及所述環側面於檢測之後定義為一已檢測構件,其位在所述第三位置的所述料盤之內;其中,所述光學檢測設備進一步包括有: 多個分料單元,安裝於所述工作台,並且多個所述分料單元位於所述料件傳送帶的一側; 其中,所述第三移載機構能於所述料件傳送帶及多個所述分料單元之間移動;其中,所述第三移載機構能用以選擇性地自位在所述第三位置的所述料盤、將至少其中一個所述已檢測構件移動至多個所述分料單元的其中之一。 The optical detection device as described in claim 2, wherein each of the electronic components is defined as a detected component on the lower surface, the upper surface, and the annular side surface after detection, and is located in the tray at the third position; wherein the optical detection device further comprises: A plurality of material separation units, mounted on the workbench, and the plurality of the material separation units are located on one side of the material conveyor belt; wherein the third transfer mechanism can move between the material conveyor belt and the plurality of the material separation units; wherein the third transfer mechanism can be used to selectively move at least one of the detected components from the tray at the third position to one of the plurality of the material separation units. 如請求項4所述的光學檢測設備,其中,所述光學檢測設備進一步包括有位於所述料件傳送帶另一側的一料盤傳送帶,其平行於所述料件傳送帶。An optical inspection device as described in claim 4, wherein the optical inspection device further includes a material tray conveyor belt located on the other side of the material conveyor belt and parallel to the material conveyor belt. 如請求項1所述的光學檢測設備,其中,所述上視覺檢測機構與所述環側面檢測機構沿所述第二方向排列,並且所述攝像器沿垂直所述第一方向與所述第二方向的一高度方向設置於所述錐狀反射件的正上方。An optical detection device as described in claim 1, wherein the upper visual detection mechanism and the circumferential side detection mechanism are arranged along the second direction, and the camera is arranged directly above the conical reflector along a height direction perpendicular to the first direction and the second direction. 如請求項6所述的光學檢測設備,其中,所述錐狀反射件包含有N個第一反射鏡,所述環狀反射件包含有N個第二反射鏡,並且N為大於5的正整數;其中,所述殼體定義有平行所述高度方向的一中心軸線,所述攝像器設置於所述中心軸線之上,所述錐狀反射件相對於所述中心軸線呈N重旋轉對稱(N-fold rotational symmetry),並且所述環狀反射件相對於所述中心軸線呈N重旋轉對稱。An optical detection device as described in claim 6, wherein the conical reflector includes N first reflectors, the annular reflector includes N second reflectors, and N is a positive integer greater than 5; wherein the housing defines a central axis parallel to the height direction, the camera is disposed on the central axis, the conical reflector has N-fold rotational symmetry with respect to the central axis, and the annular reflector has N-fold rotational symmetry with respect to the central axis. 如請求項7所述的光學檢測設備,其中,多個所述第一反射鏡所包圍的區域朝遠離所述攝像器的方向逐漸地增加,並且遠離所述攝像器的所述錐狀反射件的底部包圍於所述環狀反射件。An optical detection device as described in claim 7, wherein the area surrounded by the plurality of first reflectors gradually increases in a direction away from the camera, and the bottom of the conical reflector away from the camera is surrounded by the annular reflector. 如請求項7所述的光學檢測設備,其中,所述取像光路徑在經過所述環狀反射件時,每個所述第二反射鏡能朝向所述取像空間且相對於所述高度方向形成有介於40度~50度的一反射角。As described in claim 7, the optical detection device, wherein when the imaging light path passes through the annular reflector, each of the second reflective mirrors can be directed toward the imaging space and form a reflection angle between 40 degrees and 50 degrees relative to the height direction. 一種光學檢測設備,其包括: 一工作台; 一料件傳送帶,安裝於所述工作台且用以沿一第一方向傳輸承載有多個電子構件的一料盤,以使所述料盤能於一第一位置、一第二位置、及一第三位置之間移動; 一第一移載機構,安裝於所述工作台且用以沿垂直所述第一方向的一第二方向自位於所述第一位置的所述料盤擷取並傳輸多個所述電子構件; 一下視覺檢測機構,安裝於所述工作台,並且所述第一移載機構位於所述下視覺檢測機構的一側;其中,所述下視覺檢測機構用以接收自所述第一移載機構所傳輸的多個所述電子構件、並檢測多個所述電子構件的下表面; 一第二移載機構,安裝於所述工作台,並且所述第二移載機構位於所述下視覺檢測機構的另一側;其中,所述第二移載機構用以將完成所述下視覺檢測機構檢測的多個所述電子構件傳輸至位於所述第二位置的所述料盤;以及 一複合式裝置,安裝於所述工作台且位於遠離所述第一移載機構的所述第二移載機構一側;其中,所述複合式裝置包含: 一上視覺檢測機構,能用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的上表面;及 一環側面檢測機構,定義有位於其之外的一取像空間,用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的環側面; 其中,當所述料盤之內承載多個所述電子構件且位於所述第三位置時,所述複合式裝置能相對於所述料件傳送帶移動,以使所述上視覺檢測機構與所述環側面檢測機構能夠用以檢測多個所述電子構件的所述上表面與所述環側面。 An optical detection device, comprising: A workbench; A material conveyor belt, mounted on the workbench and used to transfer a material tray carrying multiple electronic components along a first direction, so that the material tray can move between a first position, a second position, and a third position; A first transfer mechanism, mounted on the workbench and used to grab and transfer multiple electronic components from the material tray located at the first position along a second direction perpendicular to the first direction; A lower visual detection mechanism, mounted on the workbench, and the first transfer mechanism is located on one side of the lower visual detection mechanism; wherein the lower visual detection mechanism is used to receive multiple electronic components transferred from the first transfer mechanism and detect the lower surfaces of multiple electronic components; A second transfer mechanism, mounted on the workbench, and the second transfer mechanism is located on the other side of the lower visual detection mechanism; wherein the second transfer mechanism is used to transfer the plurality of electronic components detected by the lower visual detection mechanism to the tray located at the second position; and A composite device, mounted on the workbench and located on one side of the second transfer mechanism away from the first transfer mechanism; wherein the composite device comprises: An upper visual detection mechanism, which can be used to detect the upper surface of the plurality of electronic components in the tray located at the third position; and An annular side detection mechanism, which defines an imaging space located outside it, and is used to detect the annular side of the plurality of electronic components in the tray located at the third position; Wherein, when the material tray carries a plurality of the electronic components and is located at the third position, the composite device can move relative to the material conveyor belt so that the upper visual detection mechanism and the circumferential side detection mechanism can be used to detect the upper surface and the circumferential side of the plurality of electronic components.
TW113208240U 2024-07-16 2024-08-01 Optical testing equipment TWM663298U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202421688370.4U CN223051154U (en) 2024-07-16 2024-07-16 Optical detection device
CN2024216883704 2024-07-16

Publications (1)

Publication Number Publication Date
TWM663298U true TWM663298U (en) 2024-11-21

Family

ID=94379452

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113208240U TWM663298U (en) 2024-07-16 2024-08-01 Optical testing equipment

Country Status (2)

Country Link
CN (1) CN223051154U (en)
TW (1) TWM663298U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI896261B (en) * 2024-07-16 2025-09-01 海華科技股份有限公司 Optical detection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI896261B (en) * 2024-07-16 2025-09-01 海華科技股份有限公司 Optical detection apparatus

Also Published As

Publication number Publication date
CN223051154U (en) 2025-07-01

Similar Documents

Publication Publication Date Title
US6954268B2 (en) Defect inspection apparatus
TWI524064B (en) An optical inspection apparatus for multi-defect detection
JP5109633B2 (en) Measuring method and inspection method, measuring device and inspection device
KR20160004099A (en) Defect inspecting apparatus
JPH10186462A (en) Device for picking up image of internal surface
TWM663298U (en) Optical testing equipment
CN111044524A (en) Optical detection device and method for realizing equal optical path imaging of semiconductor crystal grains relative to two surfaces
JP2014517914A (en) Inspection device
JPH0587744A (en) Method for inspecting surface of article and device used therefor
US20090073426A1 (en) Multiple Surface Inspection System and Method
TWM467872U (en) Image pickup system of optical inspection apparatus
CN114235684A (en) Macroscopic and microscopic detection equipment and detection method
TWI745645B (en) Single-sided and double-sided sidewall inspection system and paired mirror assembly device
TWI896261B (en) Optical detection apparatus
TWI887066B (en) Optical detection apparatus
TWM663296U (en) Optical testing equipment
JP2012181114A (en) Appearance inspection device
JP2017227537A (en) Visual inspection device, visual inspection method and surface inspection device
CN115015275A (en) Defect detection device
JP2004325285A (en) Appearance image deployment mirror device and appearance image automatic inspection system
JP2004205743A (en) Appearance image deployment mirror device and appearance image automatic inspection system
TW202210820A (en) Macro and micro inspection apparatus and inspection method
JP3398754B2 (en) Integrated circuit chip lift inspection system
KR20060056698A (en) Semiconductor device inspection device and inspection method
TWI377341B (en) Optical inspection device for inspecting article surface