TWI896261B - Optical detection apparatus - Google Patents
Optical detection apparatusInfo
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- TWI896261B TWI896261B TW113128641A TW113128641A TWI896261B TW I896261 B TWI896261 B TW I896261B TW 113128641 A TW113128641 A TW 113128641A TW 113128641 A TW113128641 A TW 113128641A TW I896261 B TWI896261 B TW I896261B
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Abstract
Description
本發明涉及一種檢測設備,尤其涉及一種光學檢測設備。 The present invention relates to a detection device, and in particular to an optical detection device.
現有光學檢測設備須採用至少六個檢查站,方能對一電子構件的外表面進行檢測。其中,現有光學檢測設備在對所述電子構件的環側面進行檢測時,須將單個所述電子構件置入反射件的內側,方能實現所述環側面的檢測。然而,現有光學檢測設備的架構造成其檢測較為耗時、且需佔用較大的廠房空間。 Existing optical inspection equipment requires at least six inspection stations to inspect the outer surface of an electronic component. Specifically, to inspect the circumferential side of an electronic component, the existing optical inspection equipment must place the individual electronic component inside a reflector to achieve circumferential inspection. However, the structure of existing optical inspection equipment makes the inspection process time-consuming and requires a large amount of factory space.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。 Therefore, the inventors believed that the above-mentioned defects could be improved. Therefore, they conducted intensive research and applied scientific principles, and finally proposed the present invention, which has a rational design and effectively improves the above-mentioned defects.
本發明實施例在於提供一種光學檢測設備,其能有效地改善現有光學檢測設備所可能產生的缺陷。 An embodiment of the present invention provides an optical inspection device that can effectively improve the defects that may occur in existing optical inspection devices.
本發明實施例公開一種光學檢測設備,其包括:一工作台;一料件傳送帶,安裝於所述工作台且用以沿一第一方向傳輸承載有多個電子構件的一料盤,以使所述料盤能於一第一位置、一第二位置、及一第三位置之間移動;一第一移載機構,安裝於所述工作台且用以沿垂直所述第一方向的一第二方向自位於所述第一位置的所述料盤擷取並傳輸多個所述電子構件; 一下視覺檢測機構,安裝於所述工作台,並且所述第一移載機構位於所述下視覺檢測機構的一側;其中,所述下視覺檢測機構用以接收自所述第一移載機構所傳輸的多個所述電子構件、並檢測多個所述電子構件的下表面;一第二移載機構,安裝於所述工作台,並且所述第二移載機構位於所述下視覺檢測機構的另一側;其中,所述第二移載機構用以將完成所述下視覺檢測機構檢測的多個所述電子構件傳輸至位於所述第二位置的所述料盤;以及一複合式裝置,安裝於所述工作台且位於遠離所述第一移載機構的所述第二移載機構一側;其中,所述複合式裝置包含:一上視覺檢測機構,能用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的上表面;及一環側面檢測機構,包含:一殼體;一攝像器,安裝於所述殼體之內;一錐狀反射件,位於所述殼體之內且位於所述攝像器的下方;及一環狀反射件,位於所述殼體之內且對應於所述錐狀反射件配置;其中,所述攝像器的取像光路徑通過所述錐狀反射件與所述環狀反射件的反射而定義有位於所述殼體之外的一取像空間,其用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的環側面;其中,當所述料盤之內承載多個所述電子構件且位於所述第三位置時,所述複合式裝置能相對於所述料件傳送帶移動,以使所述上視覺檢測機構與所述環側面檢測機構能夠用以檢測多個所述電子構件的所述上表面與所述環側面。 The present invention discloses an optical inspection device comprising: a workbench; a material conveyor belt mounted on the workbench and configured to transport a tray carrying a plurality of electronic components along a first direction, so that the tray can be moved between a first position, a second position, and a third position; a first transfer mechanism mounted on the workbench and configured to pick up and transport the plurality of electronic components from the tray at the first position along a second direction perpendicular to the first direction; and a visual inspection mechanism mounted on the workbench and configured to: The first transfer mechanism is located on one side of the lower visual detection mechanism; wherein the lower visual detection mechanism is used to receive the plurality of electronic components transmitted from the first transfer mechanism and detect the lower surfaces of the plurality of electronic components; a second transfer mechanism is installed on the workbench, and the second transfer mechanism is located on the other side of the lower visual detection mechanism; wherein the second transfer mechanism is used to transfer the plurality of electronic components that have completed the detection by the lower visual detection mechanism to the material tray located at the second position; and a composite device is installed The composite device is mounted on the workbench and is located on a side of the second transfer mechanism far away from the first transfer mechanism; wherein the composite device includes: an upper visual detection mechanism, which can be used to detect the upper surface of the plurality of electronic components in the tray located at the third position; and a circular side detection mechanism, including: a housing; a camera installed in the housing; a conical reflector located in the housing and below the camera; and an annular reflector located in the housing and corresponding to the conical reflector configuration; wherein the The imaging optical path of the camera, through reflection from the conical reflector and the annular reflector, defines an imaging space outside the housing, which is used to detect the annular side surfaces of the plurality of electronic components in the tray at the third position. When the tray carries the plurality of electronic components and is at the third position, the hybrid device can move relative to the component conveyor, enabling the upper visual inspection mechanism and the annular side surface inspection mechanism to inspect the upper surfaces and annular side surfaces of the plurality of electronic components.
本發明實施例也公開一種光學檢測設備,其包括:一工作台;一料件傳送帶,安裝於所述工作台且用以沿一第一方向傳輸承載有多個電子構件的一料盤,以使所述料盤能於一第一位置、一第二位置、及一第三位置之間移動;一第一移載機構,安裝於所述工作台且用以沿垂直所述第一方向的一第二方向自位於所述第一位置的所述料盤擷取並傳輸多個所述電子構件;一下視覺檢測機構,安裝於所述工作台,並且所述第一移載機構位於所 述下視覺檢測機構的一側;其中,所述下視覺檢測機構用以接收自所述第一移載機構所傳輸的多個所述電子構件、並檢測多個所述電子構件的下表面;一第二移載機構,安裝於所述工作台,並且所述第二移載機構位於所述下視覺檢測機構的另一側;其中,所述第二移載機構用以將完成所述下視覺檢測機構檢測的多個所述電子構件傳輸至位於所述第二位置的所述料盤;以及一複合式裝置,安裝於所述工作台且位於遠離所述第一移載機構的所述第二移載機構一側;其中,所述複合式裝置包含:一上視覺檢測機構,能用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的上表面;及一環側面檢測機構,定義有位於其之外的一取像空間,用以檢測位於所述第三位置的所述料盤之中的多個所述電子構件的環側面;其中,當所述料盤之內承載多個所述電子構件且位於所述第三位置時,所述複合式裝置能相對於所述料件傳送帶移動,以使所述上視覺檢測機構與所述環側面檢測機構能夠用以檢測多個所述電子構件的所述上表面與所述環側面。 The present invention also discloses an optical inspection device, which includes: a workbench; a material conveyor belt mounted on the workbench and used to transport a material tray carrying multiple electronic components along a first direction so that the material tray can move between a first position, a second position, and a third position; a first transfer mechanism mounted on the workbench and used to pick up and transport multiple electronic components from the material tray at the first position along a second direction perpendicular to the first direction. The electronic components are mounted on the workbench, and the first transfer mechanism is located on one side of the lower visual detection mechanism. The lower visual detection mechanism is configured to receive the plurality of electronic components transmitted from the first transfer mechanism and detect the bottom surfaces of the plurality of electronic components. A second transfer mechanism is mounted on the workbench, and the second transfer mechanism is located on the other side of the lower visual detection mechanism. The second transfer mechanism is used to transfer the plurality of electronic components that have completed the inspection of the lower visual inspection mechanism to the material tray located at the second position; and a composite device installed on the workbench and located on a side of the second transfer mechanism far away from the first transfer mechanism; wherein the composite device includes: an upper visual inspection mechanism that can be used to detect the upper surface of the plurality of electronic components in the material tray located at the third position; and a side ring The inspection mechanism defines an imaging space located outside the inspection mechanism for inspecting the circumferential side surfaces of the plurality of electronic components in the tray located at the third position. When the tray carries the plurality of electronic components and is located at the third position, the composite device is movable relative to the component conveyor belt so that the upper visual inspection mechanism and the circumferential side surface inspection mechanism can inspect the upper surface and circumferential side surfaces of the plurality of electronic components.
綜上所述,本發明實施例所公開的光學檢測設備,其通過所述複合式檢測裝置整合所述上視覺檢測機構與所述環側面檢測機構於相同軸向,據以利於提升所述光學檢測設備的檢測效能、並能縮小所述光學檢測設備的整體體積。 In summary, the optical inspection device disclosed in the embodiments of the present invention integrates the upper visual inspection mechanism and the circumferential side inspection mechanism in the same axial direction through the composite inspection device, thereby improving the inspection performance of the optical inspection device and reducing the overall size of the optical inspection device.
再者,本發明實施例所公開的光學檢測設備,其所採用的所述環側面檢測機構夠通過所述取像空間直接對位於所述環側面檢測機構外側的多個所述電子構件的所述環側面進行取像,因而無須受限於逐個檢測所述電子構件的所述環側面,據以有效地提升檢測效能。 Furthermore, the optical inspection device disclosed in the embodiments of the present invention employs a circumferential side surface inspection mechanism that can directly image the circumferential side surfaces of multiple electronic components located outside the circumferential side surface inspection mechanism through the imaging space. This eliminates the need to inspect the circumferential side surfaces of the electronic components one by one, thereby effectively improving inspection performance.
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention.
100:光學檢測設備 100: Optical testing equipment
1:料件傳送帶 1: Material conveyor belt
11:料盤 11: Feeding tray
2:第一移載機構 2: First transfer mechanism
21:軌道 21: Track
22:擷取器 22: Extractor
3:第二移載機構 3: Second transfer mechanism
31:軌道 31: Track
32:擷取器 32: Extractor
4:下視覺檢測機構 4: Lower visual detection mechanism
41:治具 41:Jig
42:光投射器 42: Light Projector
43:光接收器 43: Optical Receiver
44:處理模組 44: Processing Module
5:複合式裝置 5: Composite device
51:第三移載機構 51: Third transfer mechanism
511:軌道 511: Track
512:擷取器 512: Extractor
52:上視覺檢測機構 52: Upper visual detection mechanism
53:環側面檢測機構 53: Circumferential side detection mechanism
531:殼體 531: Shell
532:攝像器 532: Camera
533:錐狀反射件 533: Conical reflector
5331:第一反射鏡 5331: First Reflector
534:環狀反射件 534: Ring reflector
5341:第二反射鏡 5341: Second reflector
6:分料單元 6: Material separation unit
7:料盤傳送帶 7: Tray conveyor belt
8:工作台 8: Workbench
D1:第一方向 D1: First Direction
D2:第二方向 D2: Second Direction
H:高度方向 H: Height direction
P1:第一位置 P1: First position
P2:第二位置 P2: Second position
P3:第三位置 P3: Third position
L:結構光 L: Structured Light
S:取像空間 S: Imaging space
P:取像光路徑 P: Imaging optical path
C:中心軸線 C: Center axis
σ:反射角 σ: Reflection angle
200:電子構件 200: Electronic components
200a:已檢測構件 200a: Components tested
201:下表面 201: Lower surface
202:上表面 202: Upper surface
203:環側面 203: Circumferential side
圖1為本發明實施例的光學檢測設備的側視示意圖。 Figure 1 is a side view schematic diagram of an optical detection device according to an embodiment of the present invention.
圖2為本發明實施例的光學檢測設備的俯視示意圖。 Figure 2 is a schematic top view of an optical detection device according to an embodiment of the present invention.
圖3為圖2的後續作動示意圖。 Figure 3 is a schematic diagram of the subsequent operation of Figure 2.
圖4為圖3的後續作動示意圖。 Figure 4 is a schematic diagram of the subsequent operation of Figure 3.
圖5為圖4的局部放大剖視示意圖。 Figure 5 is a partially enlarged cross-sectional schematic diagram of Figure 4.
圖6為圖4的後續作動示意圖。 Figure 6 is a schematic diagram of the subsequent operation of Figure 4.
圖7為圖6的後續作動示意圖。 Figure 7 is a schematic diagram of the subsequent operation of Figure 6.
圖8為圖7的後續作動示意圖。 Figure 8 is a schematic diagram of the subsequent operation of Figure 7.
圖9為圖8的局部放大剖視示意圖。 Figure 9 is a partially enlarged cross-sectional view of Figure 8.
圖10為圖8的後續作動示意圖。 Figure 10 is a schematic diagram of the subsequent operation of Figure 8.
以下是通過特定的具體實施例來說明本發明所公開有關「光學檢測設備」的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following describes the implementation of the "optical detection device" disclosed in this invention through specific embodiments. Those skilled in the art will appreciate the advantages and benefits of this invention from the disclosure herein. This invention may be implemented or applied through various other specific embodiments, and the details herein may be modified and altered based on different perspectives and applications without departing from the spirit of this invention. Furthermore, the accompanying figures are for schematic illustration only and are not intended to be drawn to actual size. This is to be noted in advance. The following embodiments further illustrate the relevant technical aspects of this invention, but the disclosure is not intended to limit the scope of protection of this invention.
應當可以理解的是,雖然本文中可能會使用到「第一」、「第二」、「第三」等術語來描述各種元件或者特徵,但這些元件或者特徵不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一特 徵與另一特徵。另外,本文中所使用的術語「或」,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that while terms such as "first," "second," and "third" may be used herein to describe various elements or features, these elements or features should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one feature from another. Furthermore, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.
請參閱圖1至圖10所示,其為本發明的實施例。本實施例公開一種如圖1和圖2所示,本實施例公開一種光學檢測設備100,其包含一料件傳送帶1、橫跨所述料件傳送帶1的一第一移載機構2、平行所述第一移載機構2的一第二移載機構3、位於所述第一移載機構2與所述第二移載機構3之間的一下視覺檢測機構4、橫跨所述料件傳送帶1的一複合式裝置5、平行且位於所述料件傳送帶1一側的多個分料單元6、平行且位於所述料件傳送帶1另一側的一料盤傳送帶7、及用以供上述元件安裝的一工作台8。 Please refer to Figures 1 to 10 , which illustrate an embodiment of the present invention. As shown in Figures 1 and 2 , this embodiment discloses an optical inspection device 100 comprising a material conveyor belt 1, a first transfer mechanism 2 spanning the material conveyor belt 1, a second transfer mechanism 3 parallel to the first transfer mechanism 2, a visual inspection mechanism 4 located between the first transfer mechanism 2 and the second transfer mechanism 3, a composite device 5 spanning the material conveyor belt 1, a plurality of material separation units 6 parallel to and located on one side of the material conveyor belt 1, a tray conveyor belt 7 parallel to and located on the other side of the material conveyor belt 1, and a workbench 8 for mounting the aforementioned components.
也就是說,所述料件傳送帶1、所述第一移載機構2、所述第二移載機構3、所述下視覺檢測機構4、所述複合式裝置5、多個所述分料單元6、及所述料盤傳送帶7皆安裝於所述工作台8,但本發明不受限於此。舉例來說,於本發明未繪示的其他實施例中,所述光學檢測設備100可依據實際需求而省略多個所述分料單元6與所述料盤傳送帶7。 In other words, the material conveyor belt 1, the first transfer mechanism 2, the second transfer mechanism 3, the lower visual inspection mechanism 4, the composite device 5, the plurality of material separation units 6, and the tray conveyor belt 7 are all mounted on the workbench 8, but the present invention is not limited thereto. For example, in other embodiments not shown, the optical inspection apparatus 100 may omit the plurality of material separation units 6 and the tray conveyor belt 7 based on actual needs.
於本實施例中,所述料件傳送帶1用以沿一第一方向D1傳輸至少一個料盤11,其承載有多個電子構件200並能(沿所述料件傳送帶1)於一第一位置P1、一第二位置P2、及一第三位置P3之間移動。其中,所述料件傳送帶1於本實施例中是沿所述第一方向D1大致跨越整個所述工作台8。需額外說明的是,為便於理解本實施例,位於所述料件傳送帶1的所述料盤11的數量於下述內容之中是以一個來介紹,但本發明不受限於此。 In this embodiment, the material conveyor belt 1 is used to transport at least one material tray 11 along a first direction D1. The material tray 11 carries a plurality of electronic components 200 and is movable (along the material conveyor belt 1) between a first position P1, a second position P2, and a third position P3. In this embodiment, the material conveyor belt 1 substantially spans the entire workbench 8 along the first direction D1. It should be noted that, to facilitate understanding of this embodiment, the number of material trays 11 on the material conveyor belt 1 is described below as one, but the present invention is not limited thereto.
此外,為便於理解所述光學檢測設備100於本實施例之中的移載架構佈局,此處先行簡要介紹所述複合式裝置5所包含的多個機構。於本實施例中,所述複合式裝置5包含一第三移載機構51、安裝於所述第三移載機構51的一上視覺檢測機構52、及安裝於所述第三移載機構51的一環側面檢測機構 53;也就是說,所述複合式裝置5於本實施例中是包含有移載功能與多重檢測功能,但本發明不以此為限。 To facilitate understanding of the transfer structure layout of the optical inspection apparatus 100 in this embodiment, a brief description of the various mechanisms included in the composite device 5 is provided. In this embodiment, the composite device 5 includes a third transfer mechanism 51, an upper visual inspection mechanism 52 mounted on the third transfer mechanism 51, and a circumferential side inspection mechanism 53 mounted on the third transfer mechanism 51. In other words, the composite device 5 in this embodiment includes both transfer and multiple inspection functions, but the present invention is not limited to this.
所述第一移載機構2、所述第二移載機構3、及所述複合式裝置5(如:所述第三移載機構51)彼此平行設置並且各自沿著垂直所述第一方向D1的一第二方向D2架設於所述工作台8。其中,所述複合式裝置5位於遠離所述第一移載機構2的所述第二移載機構3一側(也就是,所述第二移載機構3位於所述第一移載機構2與所述複合式裝置5之間),並且所述複合式裝置5(如:所述第三移載機構51)橫跨所述料件傳送帶1、多個所述分料單元6、及所述料盤傳送帶7。 The first transfer mechanism 2, the second transfer mechanism 3, and the composite device 5 (e.g., the third transfer mechanism 51) are arranged parallel to each other and are each mounted on the workbench 8 along a second direction D2 perpendicular to the first direction D1. The composite device 5 is located on the side of the second transfer mechanism 3 that is farther from the first transfer mechanism 2 (i.e., the second transfer mechanism 3 is located between the first transfer mechanism 2 and the composite device 5). The composite device 5 (e.g., the third transfer mechanism 51) spans the material conveyor belt 1, the plurality of material distribution units 6, and the tray conveyor belt 7.
進一步地說,所述第一移載機構2、所述第二移載機構3、及所述第三移載機構51於本實施例中各包含有一軌道21、31、511、及可移動地安裝於所述軌道21、31、511的一擷取器22、32、512。其中,所述軌道21、31、511安裝於所述工作台8且沿所述第二方向D2配置,而所述擷取器22、32、512用以擷取多個所述電子構件200。再者,所述第一移載機構2的所述擷取器22的移動路徑沿經所述料件傳送帶1的所述第一位置P1,所述第二移載機構3的所述擷取器32的移動路徑沿經所述料件傳送帶1的所述第二位置P2,所述第三移載機構51的所述擷取器512的移動路徑沿經所述料件傳送帶1的所述第三位置P3。 Furthermore, in this embodiment, the first transfer mechanism 2, the second transfer mechanism 3, and the third transfer mechanism 51 each include a rail 21, 31, 511 and a grabber 22, 32, 512 movably mounted on the rail 21, 31, 511. The rails 21, 31, 511 are mounted on the workbench 8 and arranged along the second direction D2, and the grabbers 22, 32, 512 are used to grab a plurality of the electronic components 200. Furthermore, the movement path of the grabber 22 of the first transfer mechanism 2 passes through the first position P1 of the material conveyor 1, the movement path of the grabber 32 of the second transfer mechanism 3 passes through the second position P2 of the material conveyor 1, and the movement path of the grabber 512 of the third transfer mechanism 51 passes through the third position P3 of the material conveyor 1.
其中,所述上視覺檢測機構52與所述環側面檢測機構53較佳是沿所述第二方向D2排列並安裝於所述第三移載機構51的所述擷取器512,據以能相對於所述料件傳送帶1移動,但本發明不以此為限。舉例來說,於本發明未繪示的其他實施例中,所述上視覺檢測機構52及/或所述環側面檢測機構53也可依據實際需求而可移動地安裝於所述所述第三移載機構51的所述軌道511,據以能獨立地相對於所述料件傳送帶1移動;或者,所述上視覺檢測機 構52與所述環側面檢測機構53也能各自配置有單獨的移載機構。 The upper visual inspection mechanism 52 and the circumferential side inspection mechanism 53 are preferably arranged along the second direction D2 and mounted on the grabber 512 of the third transfer mechanism 51, thereby enabling movement relative to the material conveyor belt 1. However, the present invention is not limited to this. For example, in other embodiments not shown, the upper visual inspection mechanism 52 and/or the circumferential side inspection mechanism 53 may also be movably mounted on the track 511 of the third transfer mechanism 51, enabling independent movement relative to the material conveyor belt 1, as required. Alternatively, the upper visual inspection mechanism 52 and the circumferential side inspection mechanism 53 may each be equipped with a separate transfer mechanism.
以上為所述光學檢測設備100於本實施例之中的移載架構佈局大致說明,以下接著介紹所述光學檢測設備100的其餘架構細節與運作功能。如圖3至圖6所示,所述下視覺檢測機構4設置於所述第一移載機構2與所述第二移載機構3的所述擷取器32的所述移動路徑之上;也就是說,所述第一移載機構2位於所述下視覺檢測機構4的一側,而所述第二移載機構3位於所述下視覺檢測機構4的另一側。 The above is a brief description of the transfer structure layout of the optical inspection device 100 in this embodiment. The following describes the remaining structural details and operational functions of the optical inspection device 100. As shown in Figures 3 to 6, the downward vision detection mechanism 4 is positioned above the movement path of the capturer 32 of the first transfer mechanism 2 and the second transfer mechanism 3. In other words, the first transfer mechanism 2 is located on one side of the downward vision detection mechanism 4, while the second transfer mechanism 3 is located on the other side of the downward vision detection mechanism 4.
所述第一移載機構2(如:所述擷取器22)用以沿所述第二方向D2自位於所述第一位置P1的所述料盤11擷取並傳輸多個所述電子構件200。所述下視覺檢測機構4用以接收自所述第一移載機構2所傳輸的多個所述電子構件200、並檢測多個所述電子構件200的下表面201(如:圖5)。所述第二移載機構3用以將完成所述下視覺檢測機構4檢測的多個所述電子構件200傳輸至位於所述第二位置P2的所述料盤11,據以通過所述料件傳送帶1將所述料盤11自所述第二位置P2傳輸至所述第三位置P3。 The first transfer mechanism 2 (e.g., the picker 22) is used to pick up and transfer the plurality of electronic components 200 from the tray 11 located at the first position P1 along the second direction D2. The lower vision inspection mechanism 4 is used to receive the plurality of electronic components 200 transferred from the first transfer mechanism 2 and inspect the lower surfaces 201 of the plurality of electronic components 200 (e.g., Figure 5). The second transfer mechanism 3 is used to transfer the plurality of electronic components 200 inspected by the lower vision inspection mechanism 4 to the tray 11 located at the second position P2, thereby transporting the tray 11 from the second position P2 to the third position P3 via the component conveyor belt 1.
需額外說明的是,所述下視覺檢測機構4的具體架構可依實際需求而加以調整變化,但為便於理解本實施例,下述內容將以所述下視覺檢測機構4的其中一種可行的架構來介紹,但本發明不以此為限。如圖5所示,所述下視覺檢測機構4於本實施例中包含有一治具41、面向所述治具41底側的一光投射器42、對應於所述光投射器42的多個光接收器43、及電性耦接於多個所述光接收器43的一處理模組44。 It should be noted that the specific architecture of the downward vision detection mechanism 4 can be adjusted and varied according to actual needs. However, to facilitate understanding of this embodiment, the following description will use one possible architecture of the downward vision detection mechanism 4, but the present invention is not limited to this. As shown in Figure 5, the downward vision detection mechanism 4 in this embodiment includes a fixture 41, a light projector 42 facing the bottom side of the fixture 41, multiple light receivers 43 corresponding to the light projector 42, and a processing module 44 electrically coupled to the multiple light receivers 43.
更詳細地說,所述治具41用以承載多個所述電子構件200,並使多個所述電子構件200的所述下表面201裸露於所述治具41之外。所述光投射器42用以朝每個所述電子構件200的所述下表面201(如:多個觸點)發出基於干涉條紋的一結構光L。多個所述光接收器43用於接收由每個所述電子構件 200所反射的所述結構光L,以得到一信號。所述處理模組44用以接收所述信號、以得到形狀對應於每個所述電子構件200的所述下表面201的一立體構面。再者,所述處理模組44於本實施例中可以是通過點雲數據(point cloud data)方式呈現所述立體構面,其能通過一螢幕(圖中未示出)顯示,但本發明不以上述為限。 More specifically, the jig 41 is used to support multiple electronic components 200, with the bottom surfaces 201 of the multiple electronic components 200 exposed outside the jig 41. The light projector 42 is used to emit structured light L based on interference fringes toward the bottom surface 201 (e.g., multiple contacts) of each electronic component 200. Multiple light receivers 43 are used to receive the structured light L reflected by each electronic component 200 to generate a signal. The processing module 44 receives the signal and generates a three-dimensional structure corresponding to the bottom surface 201 of each electronic component 200. Furthermore, in this embodiment, the processing module 44 may present the three-dimensional surface in the form of point cloud data, which can be displayed on a screen (not shown), but the present invention is not limited to the above.
如圖7至圖9所示,所述上視覺檢測機構52於本實施例中能用以檢測位於所述第三位置P3的所述料盤11之中的多個所述電子構件200的上表面202,並且所述上視覺檢測機構52的具體架構也可依實際需求而加以調整變化。然而,為便於理解,所述上視覺檢測機構52於本實施例中所採用的架構如同所述下視覺檢測機構4於圖5所呈現的架構,因而以下內容不再加以贅述。 As shown in Figures 7 to 9 , the upper visual detection mechanism 52 in this embodiment can be used to detect the upper surfaces 202 of the plurality of electronic components 200 within the tray 11 at the third position P3. The specific structure of the upper visual detection mechanism 52 can also be adjusted based on actual needs. However, for ease of understanding, the structure of the upper visual detection mechanism 52 in this embodiment is similar to that of the lower visual detection mechanism 4 shown in Figure 5 , and therefore will not be further described below.
所述環側面檢測機構53定義有位於其之外的一取像空間S,用以檢測位於所述第三位置P3的所述料盤11之中的多個所述電子構件200的環側面203。也就是說,所述環側面檢測機構53能夠通過所述取像空間S直接對位於所述環側面檢測機構53外側的多個所述電子構件200的所述環側面203進行取像,因而無須受限於逐個檢測所述電子構件200的所述環側面203,據以有效地提升檢測效能。換個角度來說,需要將電子構件置入反射件包圍空間的任何檢測機構,其不同於本實施例所提供的所述環側面檢測機構53。 The circumferential side surface detection mechanism 53 defines an imaging space S outside of it for detecting the circumferential side surfaces 203 of the plurality of electronic components 200 within the tray 11 at the third position P3. In other words, the circumferential side surface detection mechanism 53 can directly image the circumferential side surfaces 203 of the plurality of electronic components 200 located outside the circumferential side surface detection mechanism 53 through the imaging space S, eliminating the need to inspect the circumferential side surfaces 203 of each electronic component 200 individually, thereby effectively improving detection performance. Alternatively, any detection mechanism that requires placing electronic components within a space enclosed by a reflector is different from the circumferential side surface detection mechanism 53 provided in this embodiment.
需額外說明的是,所述環側面檢測機構53的具體架構可依據實際需求而加以調整變化,但為便於理解本實施例,下述內容將以所述環側面檢測機構53的其中一種可行的架構來介紹,但本發明不以此為限。如圖9所示,所述環側面檢測機構53於本實施例中包含一殼體531、安裝於所述殼體531之內的一攝像器532、位於所述殼體531之內且位於所述攝像器532下方的一錐狀反射件533、及位於所述殼體531之內且對應於所述錐狀反射件533配置的一環狀反射件534。 It should be noted that the specific structure of the circumferential side detection mechanism 53 can be adjusted and varied based on actual needs. However, to facilitate understanding of this embodiment, the following description will use one possible structure of the circumferential side detection mechanism 53, but the present invention is not limited to this. As shown in Figure 9, the circumferential side detection mechanism 53 in this embodiment includes a housing 531, a camera 532 mounted within the housing 531, a conical reflector 533 located within the housing 531 and below the camera 532, and an annular reflector 534 located within the housing 531 and corresponding to the conical reflector 533.
更詳細地說,所述環側面檢測機構53通過所述殼體531安裝於所述第三移載機構51,並且所述攝像器532沿垂直所述第一方向D1與所述第二方向D2的一高度方向H設置於所述錐狀反射件533的正上方。再者,所述攝像器532的取像光路徑P通過所述錐狀反射件533與所述環狀反射件534的反射而定義有位於所述殼體531之外的所述取像空間S,其用以檢測位於所述第三位置P3的所述料盤11之中的多個所述電子構件200的所述環側面203。 More specifically, the circumferential side surface detection mechanism 53 is mounted on the third transfer mechanism 51 via the housing 531, and the camera 532 is positioned directly above the conical reflector 533 along a height direction H perpendicular to the first direction D1 and the second direction D2. Furthermore, the imaging optical path P of the camera 532, reflected by the conical reflector 533 and the annular reflector 534, defines an imaging space S outside the housing 531. This space is used to detect the circumferential side surfaces 203 of the plurality of electronic components 200 on the tray 11 at the third position P3.
依上所述,當所述料盤11之內承載多個所述電子構件200且位於所述第三位置P3時,所述複合式裝置5能相對於所述料件傳送帶1(沿所述第二方向D2)移動,以使所述上視覺檢測機構52與所述環側面檢測機構53能夠用以檢測多個所述電子構件200的所述上表面202與所述環側面203。 As described above, when the material tray 11 carries a plurality of the electronic components 200 and is located at the third position P3, the composite device 5 can move relative to the material conveyor belt 1 (along the second direction D2) so that the upper visual inspection mechanism 52 and the circumferential side surface inspection mechanism 53 can be used to inspect the upper surfaces 202 and the circumferential side surfaces 203 of the plurality of electronic components 200.
據此,所述光學檢測設備100於本實施例中能通過所述複合式裝置5整合所述上視覺檢測機構52與所述環側面檢測機構53於相同軸向,進而有利於提升所述光學檢測設備100的檢測效能、並能縮小所述光學檢測設備100的整體體積。 Accordingly, in this embodiment, the optical inspection device 100 can integrate the upper visual inspection mechanism 52 and the circumferential side inspection mechanism 53 in the same axial direction through the composite device 5, thereby improving the inspection performance of the optical inspection device 100 and reducing the overall size of the optical inspection device 100.
進一步地說,為使所述環側面檢測機構53能夠具備有較佳的檢測效果,所述環側面檢測機構53較佳是具有下述至少部分特徵。其中,所述錐狀反射件533包含有N個第一反射鏡5331,所述環狀反射件534包含有N個第二反射鏡5341,並且N個所述第一反射鏡5331的位置分別對應於N個所述第二反射鏡5341的位置(如:所述取像光路徑P通過每個所述第一反射鏡5331與相對應所述第二反射鏡5341的兩次反射、而於所述殼體531之外彼此重疊形成有所述取像空間S),而N為大於5的正整數(如:N為8)。更詳細地說,所述取像光路徑P在經過所述環狀反射件534時,每個所述第二反射鏡5341能朝向所述取像空間S且相對於所述高度方向H形成有介於40度~50度的一反射角σ,但本發明不受限於此。 Furthermore, to ensure that the annular side surface detection mechanism 53 has a better detection effect, the annular side surface detection mechanism 53 preferably has at least some of the following features: wherein the conical reflector 533 includes N first reflectors 5331, the annular reflector 534 includes N second reflectors 5341, and the positions of the N first reflectors 5331 correspond to the positions of the N second reflectors 5341 (e.g., the imaging optical path P is reflected twice by each first reflector 5331 and the corresponding second reflector 5341, overlapping to form the imaging space S outside the housing 531), and N is a positive integer greater than 5 (e.g., N is 8). More specifically, when the imaging light path P passes through the annular reflector 534 , each of the second reflective mirrors 5341 can face the imaging space S and form a reflection angle σ between 40 degrees and 50 degrees relative to the height direction H, but the present invention is not limited thereto.
再者,所述殼體531定義有平行所述高度方向H的一中心軸線C,所述攝像器532設置於所述中心軸線C之上。所述錐狀反射件533相對於所述中心軸線C呈N重旋轉對稱(N-fold rotational symmetry),並且所述環狀反射件534相對於所述中心軸線C也呈N重旋轉對稱。更詳細地說,多個所述第一反射鏡5331所包圍的區域朝遠離所述攝像器532的方向逐漸地增加,並且遠離所述攝像器532的所述錐狀反射件533的底部包圍於所述環狀反射件534,但不受限於此。 Furthermore, the housing 531 defines a central axis C parallel to the height direction H, and the camera 532 is disposed on the central axis C. The conical reflector 533 exhibits N-fold rotational symmetry with respect to the central axis C, and the annular reflector 534 also exhibits N-fold rotational symmetry with respect to the central axis C. More specifically, the area encompassed by the plurality of first reflectors 5331 gradually increases in size as it moves away from the camera 532, and the bottom portion of the conical reflector 533 distal to the camera 532 is encompassed by the annular reflector 534, but the present invention is not limited thereto.
舉例來說,於本發明未繪示的其他實施例中,所述環狀反射件534也可以沿所述高度方向H與所述錐狀反射件533呈間隔配置;或者,所述環側面檢測機構53的所述取像光路徑P也可以通過兩次以上的反射而定義有位於所述殼體531之外的所述取像空間S。 For example, in other embodiments not shown in the present invention, the annular reflector 534 may be spaced apart from the tapered reflector 533 along the height direction H; alternatively, the imaging optical path P of the annular side detection mechanism 53 may define the imaging space S outside the housing 531 through two or more reflections.
依上所述,如圖8至圖10所示,每個所述電子構件200在所述下表面201、所述上表面202、及所述環側面203於檢測之後定義為一已檢測構件200a,其位在所述第三位置P3的所述料盤11之內。再者,所述第三移載機構51(如:所述擷取器512)能於所述料件傳送帶1及多個所述分料單元6之間移動,並且所述第三移載機構51能用以選擇性地自位在所述第三位置P3的所述料盤11、將至少其中一個所述已檢測構件200a移動至多個所述分料單元6的其中之一。 As described above, as shown in Figures 8 to 10 , each electronic component 200 is defined as an inspected component 200a after inspection on the lower surface 201, the upper surface 202, and the circumferential side surface 203. This component is located within the tray 11 at the third position P3. Furthermore, the third transfer mechanism 51 (e.g., the grabber 512) is movable between the material conveyor 1 and the plurality of sorting units 6. The third transfer mechanism 51 can selectively move at least one inspected component 200a from the tray 11 at the third position P3 to one of the plurality of sorting units 6.
據此,所述光學檢測設備100於本實施例中能通過所述第三移載機構51來將多個所述已檢測構件200a依據檢測結果進行分類、並移動至相對應的所述分料單元6。舉例來說:未有任何缺陷的所述已檢測構件200a、所述下表面201具有缺陷的所述已檢測構件200a、所述上表面202具有缺陷的所述已檢測構件200a、及所述環側面203具有缺陷的所述已檢測構件200a可以各由一個所述分料單元6所存放。 Accordingly, in this embodiment, the optical inspection apparatus 100 can use the third transfer mechanism 51 to classify the plurality of inspected components 200a according to the inspection results and move them to corresponding sorting units 6. For example, inspected components 200a without defects, inspected components 200a with defects on the lower surface 201, inspected components 200a with defects on the upper surface 202, and inspected components 200a with defects on the circumferential side 203 can each be stored in a separate sorting unit 6.
需補充說明的是,所述光學檢測設備100於本實施例中所包含的所有元件可以是同步進行作業(如:所述下視覺檢測機構4在對一批電子構件200進行檢測時,所述上視覺檢測機構52與所述環側面檢測機構53可以同步對另一批電子構件200進行檢測),據以能夠有效地提高所述光學檢測設備100的運作效能。 It should be noted that all components of the optical inspection device 100 in this embodiment can operate synchronously (for example, while the lower visual inspection mechanism 4 is inspecting a batch of electronic components 200, the upper visual inspection mechanism 52 and the circumferential surface inspection mechanism 53 can simultaneously inspect another batch of electronic components 200). This effectively improves the operating efficiency of the optical inspection device 100.
[本發明實施例的技術效果] [Technical effects of the embodiments of the present invention]
綜上所述,本發明實施例所公開的光學檢測設備,其通過所述複合式檢測裝置整合所述上視覺檢測機構與所述環側面檢測機構於相同軸向,據以利於提升所述光學檢測設備的檢測效能、並能縮小所述光學檢測設備的整體體積。 In summary, the optical inspection device disclosed in the embodiments of the present invention integrates the upper visual inspection mechanism and the circumferential side inspection mechanism in the same axial direction through the composite inspection device, thereby improving the inspection performance of the optical inspection device and reducing the overall size of the optical inspection device.
再者,本發明實施例所公開的光學檢測設備,其所採用的所述環側面檢測機構夠通過所述取像空間直接對位於所述環側面檢測機構外側的多個所述電子構件的所述環側面進行取像,因而無須受限於逐個檢測所述電子構件的所述環側面,據以有效地提升檢測效能。 Furthermore, the optical inspection device disclosed in the embodiments of the present invention employs a circumferential side surface inspection mechanism that can directly image the circumferential side surfaces of multiple electronic components located outside the circumferential side surface inspection mechanism through the imaging space. This eliminates the need to inspect the circumferential side surfaces of the electronic components one by one, thereby effectively improving inspection performance.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。 The contents disclosed above are merely preferred feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, any equivalent technical variations made using the contents of the description and drawings of the present invention are included in the patent scope of the present invention.
100:光學檢測設備 100: Optical testing equipment
1:料件傳送帶 1: Material conveyor belt
11:料盤 11: Feeding tray
2:第一移載機構 2: First transfer mechanism
21:軌道 21: Track
22:擷取器 22: Extractor
3:第二移載機構 3: Second transfer mechanism
31:軌道 31: Track
32:擷取器 32: Extractor
4:下視覺檢測機構 4: Lower visual detection mechanism
41:治具 41:Jig
5:複合式裝置 5: Composite device
51:第三移載機構 51: Third transfer mechanism
511:軌道 511: Track
512:擷取器 512: Extractor
52:上視覺檢測機構 52: Upper visual detection mechanism
53:環側面檢測機構 53: Circumferential side detection mechanism
6:分料單元 6: Material separation unit
7:料盤傳送帶 7: Tray conveyor belt
8:工作台 8: Workbench
D1:第一方向 D1: First Direction
D2:第二方向 D2: Second Direction
P1:第一位置 P1: First position
P2:第二位置 P2: Second position
P3:第三位置 P3: Third position
200:電子構件 200: Electronic components
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410956174.9A CN121347387A (en) | 2024-07-16 | 2024-07-16 | Optical detection device |
| CN2024109561749 | 2024-07-16 |
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| TWI896261B true TWI896261B (en) | 2025-09-01 |
| TW202605306A TW202605306A (en) | 2026-02-01 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002005211A1 (en) * | 2000-07-07 | 2002-01-17 | Matsushita Electric Industrial Co., Ltd. | Part recognition data creation method and apparatus, electronic part mounting apparatus, and recorded medium |
| TW201000885A (en) * | 2008-03-04 | 2010-01-01 | Kyodo Design & Planning Corp | Electronic component inspection method and device used therein |
| TW201827838A (en) * | 2017-01-30 | 2018-08-01 | 日商精工愛普生股份有限公司 | Electronic component conveying device and electronic component inspection device comprising a first carrying member with a first recessed portion, a second carrying member with a second recessed portion, and a conveying portion |
| TW202013556A (en) * | 2018-06-08 | 2020-04-01 | 瑞士商Vat控股股份有限公司 | Wafer transfer unit and wafer transfer system |
| WO2022012815A1 (en) * | 2020-07-17 | 2022-01-20 | Dehkordi Karim | Method and device for testing printed circuit boards |
| TWM663298U (en) * | 2024-07-16 | 2024-11-21 | 海華科技股份有限公司 | Optical testing equipment |
-
2024
- 2024-07-16 CN CN202410956174.9A patent/CN121347387A/en active Pending
- 2024-08-01 TW TW113128641A patent/TWI896261B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002005211A1 (en) * | 2000-07-07 | 2002-01-17 | Matsushita Electric Industrial Co., Ltd. | Part recognition data creation method and apparatus, electronic part mounting apparatus, and recorded medium |
| TW201000885A (en) * | 2008-03-04 | 2010-01-01 | Kyodo Design & Planning Corp | Electronic component inspection method and device used therein |
| TW201827838A (en) * | 2017-01-30 | 2018-08-01 | 日商精工愛普生股份有限公司 | Electronic component conveying device and electronic component inspection device comprising a first carrying member with a first recessed portion, a second carrying member with a second recessed portion, and a conveying portion |
| TW202013556A (en) * | 2018-06-08 | 2020-04-01 | 瑞士商Vat控股股份有限公司 | Wafer transfer unit and wafer transfer system |
| WO2022012815A1 (en) * | 2020-07-17 | 2022-01-20 | Dehkordi Karim | Method and device for testing printed circuit boards |
| TWM663298U (en) * | 2024-07-16 | 2024-11-21 | 海華科技股份有限公司 | Optical testing equipment |
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