TWM661505U - Heat pipe combined with temperature plate heat dissipation device - Google Patents

Abstract

A heat dissipation device combining a heat pipe and a temperature averaging plate comprises a temperature averaging plate and at least one heat pipe; the temperature averaging plate comprises a bottom plate and an upper plate, the bottom plate and the upper plate are covered to form a chamber, and a capillary layer covering the upper plate is arranged in the chamber, and at least one through hole is arranged on the upper plate; the heat pipe comprises a tube body and a capillary layer arranged in the tube body, and the tube body has a closed The capillary layer of the tube has an end and an open end far away from the closed end, the open end is fixed in the through hole, and the capillary layer of the tube has a connecting portion exposed at the open end; wherein the upper plate is protruded outwardly with at least one convex portion corresponding to the outside of the through hole, the convex portion has a concave receiving portion in the upper plate, and a capillary structure is provided in the receiving portion, and the capillary structure is in contact with the connecting portion and the capillary layer of the upper plate.

Description

Heat pipe combined with temperature plate heat dissipation device

This creation is related to a heat sink, especially a heat sink that combines a heat pipe with a vapor chamber.

The existing heat dissipation device composed of a heat pipe and a temperature averaging plate usually inserts one end of the heat pipe into the temperature averaging plate after opening, and the capillary structure in the heat pipe contacts the capillary structure in the temperature averaging plate, thereby providing a capillary continuity effect. At the same time, in order to increase the bonding between the heat pipe and the temperature averaging plate, the open end of the heat pipe is abutted against the bottom plate in the temperature averaging plate. On the one hand, as mentioned above, the capillary structure in the heat pipe can contact the capillary structure in the temperature averaging plate, and on the other hand, the bonding between the heat pipe and the temperature averaging plate can be better and more stable.

However, since the open end of the heat pipe is inserted into the vapor chamber and abuts against the bottom plate of the vapor chamber, it will affect the heat transfer in the vapor chamber, especially the opening must be added at the location where the heat pipe is inserted into the vapor chamber, and the setting of the opening actually reduces the internal connection area between the heat pipe and the vapor chamber. Therefore, as long as the continuity of the internal capillaries can be maintained, there will still be some obstruction in heat transfer.

In view of this, the author of this invention has devoted himself to research and applied theories to improve and solve the above-mentioned deficiencies, and finally proposed a work that is reasonably designed and effectively improves the above-mentioned deficiencies.

The main purpose of this invention is to provide a heat dissipation device that combines a heat pipe with a temperature averaging plate. By adding a capillary structure to the upper surface of the temperature averaging plate, the heat pipe can directly contact the capillary structure on the upper surface of the temperature averaging plate to maintain its continuity, and at the same time, it can also provide the strength of the connection between the heat pipe and the temperature averaging plate.

In order to achieve the above-mentioned purpose, the invention provides a heat dissipation device combining a heat pipe and a temperature averaging plate, comprising a temperature averaging plate and at least one heat pipe; the temperature averaging plate has a bottom plate and an upper plate, the bottom plate and the upper plate are covered to form a chamber, and an upper plate capillary layer covering the upper plate is provided in the chamber, and at least one through hole is provided on the upper plate; the heat pipe has a tube body and a tube capillary layer provided in the tube body, The tube body has a closed end and an open end far from the closed end, the open end is fixed in the through hole, and the tube capillary layer has a connection part exposed at the open end; wherein the upper plate is provided with at least one convex part protruding outward corresponding to the outside of the through hole, the convex part has a concave receiving part in the upper plate, and a capillary structure is provided in the receiving part, and the capillary structure is in contact with the connection part and the capillary layer of the upper plate.

1: Temperature equalization plate

10: Base plate

10a: Baseboard fine layer

100: Chamber

11: Boarding

11a: Upper board fine layer

11b: capillary structure

110:Through hole

111: convex part

111a: Accommodation section

112: abutment part

12: Support structure

2: Heat pipe

20: Tube body

200: Closed end

201: Open end

21: Tube capillary layer

210: Joint

3: Fins

Figure 1 is a three-dimensional exploded view of the first embodiment of this creation.

Figure 2 is a three-dimensional combination diagram of the first embodiment of this creation.

Figure 3 is a three-dimensional exploded view of the upper plate of the first embodiment of this invention.

Figure 4 is a partial cross-sectional diagram of the first embodiment of this invention.

Figure 5 is a schematic cross-sectional view of the assembly of the first embodiment of the present invention with the fins added.

Figure 6 is a three-dimensional exploded view of the second embodiment of this creation.

Figure 7 is a schematic cross-sectional view of the second embodiment of the present invention with the fins added.

Figure 8 is a schematic cross-sectional view of the third embodiment of the present invention with the fins added.

In order to enable the Review Committee to further understand the features and technical content of this work, please refer to the following detailed description and attached diagrams of this work. However, the attached diagrams are only for reference and explanation and are not used to limit this work.

Please refer to Figures 1 and 2, which are the three-dimensional exploded view and three-dimensional assembly view of the first embodiment of the present invention respectively. The present invention provides a heat dissipation device combining a heat pipe and a temperature averaging plate, comprising a temperature averaging plate 1 and at least one heat pipe 2; wherein: the temperature averaging plate 1 has a bottom plate 10 and an upper plate 11, and the bottom plate 10 and the upper plate 11 are covered to form a chamber 100, and a plurality of supporting structures 12 are arranged in the chamber 100; and in the present embodiment, each supporting structure 12 can be a columnar body and distributed in the chamber 100 to support between the bottom plate 10 and the upper plate 11. In addition, please refer to FIG. 3 , the chamber 100 is provided with a wool layer, which may include a bottom plate wool layer 10a coated on the bottom plate 10 and an upper plate wool layer 11a coated on the upper plate 11. The bottom plate wool layer 10a and the upper plate wool layer 11a may be connected at the junction where the bottom plate 10 and the upper plate 11 overlap. Moreover, the bottom plate wool layer 10a and the upper plate wool layer 11a may both be made of a woven net.

As shown in FIG. 4 and FIG. 5 , the heat pipe 2 has a tube body 20 and a capillary layer 21 disposed on the inner wall of the tube body 20, wherein the tube body 20 also has a closed end 200 and an open end 201 away from the closed end 200, the capillary layer 21 is attached to the tube body 20 and extends from the closed end 200 to the open end 201, and the capillary layer 21 has a joint 210 protruding from the open end 201. In addition, the capillary layer 21 can also be composed of a woven mesh.

Please refer to Figures 1, 2 and 4. The upper plate 11 of the above-mentioned temperature averaging plate 1 is provided with at least one through hole 110, so that the open end 201 of the tube body 20 of the above-mentioned heat pipe 2 is fixed in the through hole 110, and the heat pipe 2 and the chamber 100 of the temperature averaging plate 1 are connected to each other, as shown in Figure 5. As shown in Figures 1 to 5, the present invention mainly has a convex portion 111 protruding outward on the upper plate 11 of the above-mentioned temperature averaging plate 1, and the convex portion 111 forms a concave receiving portion 111a in the upper plate 11, and a capillary structure 11b is provided in the receiving portion 111a of each of the convex portions 111. The capillary structure 11b can be sintered powder, and the convex portion 111 corresponds to the through hole 110. The through hole 110 is connected to the tube capillary layer 21 so that the joint 210 can contact the capillary structure 11b by protruding from the opening 201 of the tube body 20, and the upper plate capillary layer 11a covered on the upper plate 11 covers the lower part of the capillary structure 11b, so that the tube capillary layer 21 in the heat pipe 2 and the upper plate capillary layer 11a in the temperature averaging plate 1 can be continuous in capillary transmission without interruption.

Therefore, through the above-mentioned structural composition, the heat dissipation device combining the heat pipe and the temperature equalizing plate of the invention can be obtained.

5 , since the upper plate 11 has the above-mentioned accommodating portion 111a corresponding to each through hole 110 and a capillary structure 11b is disposed in each accommodating portion 111a, the capillary structure 11b can contact the connecting portion 210 protruding from the opening end 201 through the arrangement of the capillary structure 11b. At the same time, the upper plate capillary layer 11a in the upper plate 11 covers the lower part of the capillary structure 11b, so the capillary layer 21 in the heat pipe 2 can be connected to the upper plate capillary layer 11a in the temperature averaging plate 1 continuously without interruption in capillary transmission, and the tube body 20 of the heat pipe 2 no longer needs to abut against the bottom plate 10 of the temperature averaging plate 1, so as to maintain good intercommunication between the heat pipe 2 and the temperature averaging plate 1 for heat transfer. Furthermore, the open end 201 of the tube body 20 of each heat pipe 2 can be abutted against the capillary structure 11b, so that the bonding strength between the tube body 20 and the through hole 110 is better, and a plurality of fins 3 can be provided on the tube body 20 of each heat pipe 2.

In addition, as shown in FIG. 6 and FIG. 7, in the second embodiment of the present invention, when the protrusion 111 corresponds to a plurality of through holes 110 (i.e., the number of heat pipes 2 is plural), the plurality of protrusions 111 can be connected together so that the receiving parts 111a therein are interconnected. In addition, the opening end 201 of the tube body 20 of each heat pipe 2 can also be formed into a sawtooth shape or a partial hole shape (not shown) so that the connection part 210 of the capillary layer 21 can partially protrude from the sawtooth-shaped opening end 201, and at the same time, the capillary structure 11b can still be in contact with the connection part 210 through the sawtooth-shaped recessed part.

Furthermore, as shown in FIG. 7 , in the third embodiment of the present invention, the upper plate 11 may be provided with a plurality of abutting portions 112 that abut against the bottom plate 10 to replace the aforementioned support structure 12 disposed in the chamber 100 .

In summary, this creation is indeed a rare new creation. It can indeed achieve the creation purpose described in the above description and solve the lack of knowledge. Because it is novel and progressive, it fully meets the requirements for new patent applications. Therefore, an application is filed in accordance with the Patent Law to protect the rights of the creator.

However, the above is only the best feasible implementation example of this creation, and it does not limit the patent scope of this creation. Therefore, all equivalent structural changes made by using the description and diagram content of this creation are also included in the scope of this creation and should be stated.

1: Temperature equalization plate

10: Base plate

10a: Baseboard fine layer

100: Chamber

11: Boarding

11a: Upper board fine layer

11b: capillary structure

110:Through hole

111: convex part

111a: Accommodation section

12: Support structure

2: Heat pipe

20: Tube body

200: Closed end

201: Open end

21: Tube capillary layer

210: Joint

3: Fins

Claims (10)

A heat dissipation device combining a heat pipe and a temperature averaging plate, comprising: a temperature averaging plate, having a bottom plate and an upper plate, the bottom plate and the upper plate are covered to form a chamber, and a capillary layer covering the upper plate is provided in the chamber, and the upper plate is provided with at least one through hole; and at least one heat pipe, having a tube body and a capillary layer provided in the tube body, the tube body having a closed end and an open end far away from the closed end, the open end is fixed in the through hole, and the capillary layer has a joint exposed at the open end; The upper plate is provided with at least one convex portion protruding outwards and corresponding to the outside of the through hole, the convex portion has a recessed receiving portion in the upper plate, and a capillary structure is provided in the receiving portion, and the capillary structure is in contact with the joint portion and the capillary layer of the upper plate. The heat dissipation device of the heat pipe combined with the temperature equalizing plate as described in claim 1, wherein the upper plate is recessed with a plurality of abutting portions that abut against the bottom plate. A heat dissipation device combining a heat pipe and a temperature equalizing plate as described in claim 1, wherein the upper plate capillary layer covers underneath the capillary structure. The heat dissipation device of the heat pipe combined with the temperature equalizing plate as described in claim 1, wherein the chamber is further provided with a bottom plate capillary layer covering the bottom plate, and the bottom plate capillary layer is connected to the upper plate capillary layer. A heat dissipation device combining a heat pipe and a temperature equalizing plate as described in claim 1, wherein a plurality of supporting structures are provided in the chamber. A heat dissipation device combining a heat pipe and a temperature equalizing plate as described in claim 5, wherein the supporting structures are columnar. As described in claim 1, the heat pipe combined with the heat spreader is a heat dissipation device, wherein the through holes are plural, and the protrusions are connected together corresponding to the through holes so that the accommodating portions corresponding to each of the through holes are interconnected. A heat dissipation device combining a heat pipe and a temperature equalizing plate as described in claim 1, wherein the capillary structure is sintered powder. A heat dissipation device combining a heat pipe and a temperature equalizing plate as described in claim 1, wherein the open end of the heat pipe body abuts against the capillary structure. A heat dissipation device combining a heat pipe and a temperature equalizing plate as described in claim 1, wherein the open end of the heat pipe body is formed into a sawtooth shape or a partially perforated shape.