TWM660063U - Temperature equalizing device with heat pipe - Google Patents
Temperature equalizing device with heat pipe Download PDFInfo
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- TWM660063U TWM660063U TW113205194U TW113205194U TWM660063U TW M660063 U TWM660063 U TW M660063U TW 113205194 U TW113205194 U TW 113205194U TW 113205194 U TW113205194 U TW 113205194U TW M660063 U TWM660063 U TW M660063U
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- plate
- tube body
- open end
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- 238000012935 Averaging Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 12
- 239000012530 fluid Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
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Abstract
一種具熱管之均溫裝置,包括一均溫板與至少一熱管;均溫板包含一下板件與一上板件並以上、下疊置相蓋合,且於下板件與上板件之間內形成中空狀,下板件內設有一毛細層,而上板件上則設有至少一穿孔;熱管包含通過穿孔的一管體、以及設於管體的一毛細組織,管體一端具有位於均溫板外的一封閉端、另一端則具有位於均溫板內的一開口端,且毛細組織具有一延伸部與一擴張部,延伸部貼附於管體內,擴張部則由管體之開口端向外並呈徑向的擴張狀;其中,熱管之管體的開口端係以毛細組織之擴張部而抵接於均溫板內的毛細層上,以使擴張部介於管體之開口端與毛細層之間處。A temperature equalizing device with a heat pipe includes a temperature equalizing plate and at least one heat pipe; the temperature equalizing plate includes a lower plate and an upper plate which are overlapped and covered with each other, and a hollow is formed between the lower plate and the upper plate, a capillary layer is provided in the lower plate, and at least one through hole is provided on the upper plate; the heat pipe includes a tube body passing through the through hole, and a capillary structure provided on the tube body, and one end of the tube body has a capillary structure located outside the temperature equalizing plate. The heat pipe has a closed end at one end and an open end located in the temperature equalizing plate at the other end, and the capillary structure has an extension portion and an expansion portion, the extension portion is attached to the inside of the tube body, and the expansion portion is radially expanded outward from the open end of the tube body; wherein the open end of the tube body of the heat pipe is in contact with the capillary layer in the temperature equalizing plate by the expansion portion of the capillary structure, so that the expansion portion is between the open end of the tube body and the capillary layer.
Description
本創作係有關於一種熱傳導元件,尤指一種將熱管與均溫板連通的具熱管之均溫裝置。This invention relates to a heat transfer element, in particular to a temperature equalizing device with a heat pipe that connects a heat pipe with a temperature equalizing plate.
現在如應用均溫板與熱管作整合的散熱或均溫等熱交換器上,主要係藉由均溫板與熱管彼此內部相連通後,透過封存其內部的工作流體進行汽、液相變化來達到快速熱傳導之目的。而在工作流體進行汽、液相變化及其循環的過程中,工作流體在經由降溫而由汽相變回液相時,回復成液態的工作流體需透過如毛細組織等結構進行迴流,如此方可達到前述循環的效果。At present, when a heat exchanger such as a heat spreader and a heat pipe is used for heat dissipation or temperature equalization, the purpose of rapid heat conduction is achieved by connecting the heat spreader and the heat pipe internally and then performing a vapor-liquid phase change of the sealed working fluid inside. During the process of the vapor-liquid phase change and its circulation of the working fluid, when the working fluid is cooled and changes from the vapor phase back to the liquid phase, the working fluid that has returned to the liquid state needs to circulate through structures such as capillary tissues, so as to achieve the aforementioned circulation effect.
然而,現有應用於上述均溫板與熱管作整合的熱交換器上,通常為了維持熱管的設置,使其管體在伸入均溫板內後抵壓在均溫板內的殼體或毛細結構上,因此熱管內部的毛細組織與均溫板內的毛細結構間,所能接觸的面積極小,是而難以提供較佳的回流效果。However, in the existing heat exchangers that integrate the above-mentioned temperature evaporating plate and heat pipe, in order to maintain the setting of the heat pipe, the tube body is usually pressed against the shell or capillary structure in the temperature evaporating plate after being inserted into the temperature evaporating plate. Therefore, the contact area between the capillary structure inside the heat pipe and the capillary structure inside the temperature evaporating plate is extremely small, making it difficult to provide a better reflux effect.
有鑑於此,本創作人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本創作。In view of this, the author of this invention has devoted himself to research and applied theory in order to improve and solve the above-mentioned deficiencies, and finally proposed a creation that is reasonably designed and effectively improves the above-mentioned deficiencies.
本創作之主要目的,在於可提供一種具熱管之均溫裝置,其係可增加均溫板與熱管內部毛細間的接觸面積,並可維持均溫板與熱管內部的連通狀態,以確保液態的工作流體能有良好的回流效果。The main purpose of this invention is to provide a temperature equalizing device with a heat pipe, which can increase the contact area between the temperature equalizing plate and the capillaries inside the heat pipe, and maintain the connection between the temperature equalizing plate and the inside of the heat pipe to ensure that the liquid working fluid can have a good reflux effect.
為了達成上述之目的,本創作係提供一種具熱管之均溫裝置,包括一均溫板與至少一熱管;均溫板包含一下板件與一上板件並以上、下疊置相蓋合,且於下板件與上板件之間內形成中空狀,下板件內設有一毛細層,而上板件上則設有至少一穿孔;熱管包含通過穿孔的一管體、以及設於管體的一毛細組織,管體一端具有位於均溫板外的一封閉端、另一端則具有位於均溫板內的一開口端,且毛細組織具有一延伸部與一擴張部,延伸部貼附於管體內,擴張部則由管體之開口端向外並呈徑向的擴張狀;其中,熱管之管體的開口端係以毛細組織之擴張部而抵接於均溫板內的毛細層上,以使擴張部介於管體之開口端與毛細層之間處。In order to achieve the above-mentioned purpose, the invention provides a temperature equalizing device with a heat pipe, including a temperature equalizing plate and at least one heat pipe; the temperature equalizing plate includes a lower plate and an upper plate which are overlapped and covered with each other, and a hollow is formed between the lower plate and the upper plate, a capillary layer is provided in the lower plate, and at least one through hole is provided on the upper plate; the heat pipe includes a tube body passing through the through hole, and a capillary structure provided on the tube body, and one end of the tube body The heat pipe has a closed end outside the temperature equalizing plate and an open end inside the temperature equalizing plate at the other end, and the capillary structure has an extension portion and an expansion portion, the extension portion is attached to the inside of the tube body, and the expansion portion is radially expanded outward from the open end of the tube body; wherein the open end of the tube body of the heat pipe is in contact with the capillary layer inside the temperature equalizing plate by the expansion portion of the capillary structure, so that the expansion portion is between the open end of the tube body and the capillary layer.
為了能更進一步揭露本創作之特徵及技術內容,請參閱以下有關本創作之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。In order to further reveal the features and technical content of this creation, please refer to the following detailed description and drawings of this creation. However, the attached drawings are only provided for reference and explanation, and are not used to limit this creation.
請參閱圖1及圖2,係分別為本創作之立體外觀示意圖及立體分解示意圖。本創作係提供一種具熱管之均溫裝置,包括一均溫板1、以及豎立設置於該均溫板1上的至少一熱管2;其中:Please refer to Figures 1 and 2, which are respectively a three-dimensional appearance schematic diagram and a three-dimensional exploded schematic diagram of the present invention. The present invention provides a temperature equalization device with a heat pipe, comprising a
該均溫板1係包含一下板件10與一上板件11並以上、下疊置的方式相蓋合,且於該下板件10與上板件11之間內形成中空狀。具體而言,如圖4或圖5所示,該下板件10與一上板件11只要其中一者形成內凹狀即可使其蓋合後的內部形成所述中空狀;舉例來說,本創作係以下板件10形成所述內凹狀,而上板件11則呈平板狀,當然亦可為相反設置、亦或使下板件10與上板件11皆形成所述內凹狀並相互對應而蓋合。此外,如圖4或圖5所示,該均溫板1至少於該下板件10內設有一毛細層100,所述毛細層100可由金屬網、粉末燒結或溝槽所構成。The temperature-
如圖3所示,上述各熱管2皆包含一管體20、以及設於該管體20內的一毛細組織21,該毛細組織21亦可由金屬網、粉末燒結、或前述材料組合所構成,且該管體20一端具有位於均溫板1外部的一封閉端200、另一端則為位於均溫板1內部的一開口端201,而該毛細組織21則具有至少一延伸部210與一擴張部211並相互接觸而連接、或為一體成型,所述延伸部210貼附於管體20內,而所述擴張部211則由管體20之開口端201向外並呈徑向的擴張狀。其中,當所述延伸部210與擴張部211為相同的毛細材料構成時,所述延伸部210與擴張部211可為一體成型(即為圖5或圖6所示);而為不相同(即「相異」)的毛細材料構成時,所述延伸部210與擴張部211可為相互接觸而連接(即如圖7所示)。As shown in FIG. 3 , each of the
再請參閱圖2所示,上述均溫板1之上板件11上係設有至少一穿孔110,所述穿孔110用以供上述熱管2穿入後固設,視所欲配置的熱管2數量而設置、或視熱管2穿入均溫板1的位置數量(即開口端201的數量)而設置;舉例來說,在本創作所舉之實施例中,於該均溫板1上所配置的熱管2之數量為「三」,故所述穿孔110的數量亦對應為「三」。Please refer to FIG. 2 , the
如圖4及圖5所示,各熱管2之管體20係以其開口端201通過所對應的穿孔110而伸入該均溫板1內部,以供其毛細組織21之擴張部211抵接於均溫板1內的毛細層100上,從而使該擴張部211能介於管體20的開口端201與毛細層100之間,並使毛細組織21的延伸部210可透過擴張部211而與毛細層100相疊置而接觸,尤其各熱管2可藉由其管體20的開口端201將毛細組織21的擴張部211予以壓制於毛細層100上,使得呈徑向擴張狀的擴張部211能以較大的接觸面積與毛細層100作接觸,如此不僅可以使得毛細層100與毛細組織21間在毛細傳輸上得以穩定維持接續且不中斷,以確保液態的工作流體能有良好的回流效果,並兼具各熱管2豎立設置於均溫板1上的穩固性。As shown in FIG. 4 and FIG. 5 , the
更進一步地,上述各熱管之管體20,於鄰近其開口端201處係設有一第一通孔部202,並於毛細組織21上設有對應該第一通孔部202的一第二通孔部212,以使管體20內部與均溫板1內部得以透過該第一通孔部202與第二通孔部212而相互連通。如圖5所示,在本創作一實施例中,所述第一通孔部202可由開口端201以局部凹陷而形成的一缺口,所述第二通孔部212亦為相對應的一缺口;而如圖6所示,在本創作另一實施例中,所述第一通孔部202為鄰近開口端201處的一破孔,所述第二通孔部212亦為相對應的一破孔。藉此,即可透過所述第一通孔部202與第二通孔部212,而使均溫板1內部與各熱管2內部得以維持連通狀態。再如圖8及圖9所示,在本創作再一實施例中,亦可由管體20之開口端201下緣201a牴接於毛細組織21的擴張部211上,以供該擴張部211由開口端201下緣201a延伸而出,並於該擴張部211上設有所述第二通孔部212以連通該開口端201,如此該管體20之開口端201上即可無須設置前述第一通孔部202,同時仍可供毛細組織21的擴張部211得以介於該管體20之開口端201與毛細層100之間處。Furthermore, the
是以,藉由上述之構造組成,即可得到本創作具熱管之均溫裝置。Therefore, through the above-mentioned structural composition, the temperature-averaging device with heat pipe of the present invention can be obtained.
綜上所述,本創作實為不可多得之新型創作,其確實可達到上述說明書所記載之創作目的,而解決習知之缺失,又因具有新穎性及進步性,完全符合新型專利申請要件,爰依專利法提出申請,以保障創作人之權利。In summary, this invention is a rare new invention that can indeed achieve the creation purpose described in the above description and solve the lack of knowledge. Moreover, due to its novelty and progress, it fully meets the requirements for new patent application. Therefore, an application is filed in accordance with the Patent Law to protect the rights of the creator.
惟以上所述僅為本創作之較佳可行實施例,非因此即拘限本創作之專利範圍,故舉凡運用本創作說明書及圖式內容所為之等效結構變化,均同理皆包含於本創作之範圍內,合予陳明。However, the above is only the preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent structural changes made by using the description and diagram content of the present invention are also included in the scope of the present invention and are appropriately stated.
1:均溫板
10:下板件
100:毛細層
11:上板件
110:穿孔
2:熱管
20:管體
200:封閉端
201:開口端
201a:下緣
202:第一通孔部
21:毛細組織
210:延伸部
211:擴張部
212:第二通孔部
1: Temperature plate
10: Lower plate
100: Capillary layer
11: Upper plate
110: Perforation
2: Heat pipe
20: Tube body
200: Closed end
201:
圖1 係本創作之立體外觀示意圖。Figure 1 is a schematic diagram of the three-dimensional appearance of this creation.
圖2 係本創作之立體分解示意圖。Figure 2 is a three-dimensional exploded diagram of this work.
圖3 係本創作熱管之立體分解示意圖。Figure 3 is a three-dimensional exploded diagram of the heat pipe of this invention.
圖4 係本創作內部構造之剖視示意圖。Figure 4 is a cross-sectional diagram of the internal structure of this creation.
圖5 係根據圖4之A部分放大示意圖。Figure 5 is an enlarged schematic diagram of part A of Figure 4.
圖6 係圖5另一實施例之示意圖。Figure 6 is a schematic diagram of another embodiment of Figure 5.
圖7 係圖5又一實施例之示意圖。Figure 7 is a schematic diagram of another embodiment of Figure 5.
圖8 係圖5再一實施例之示意圖。Figure 8 is a schematic diagram of another embodiment of Figure 5.
圖9 係圖8之再一實施例的局部立體圖。Figure 9 is a partial three-dimensional diagram of another embodiment of Figure 8.
1:均溫板 1: Temperature equalization plate
10:下板件 10: Lower panel
100:毛細層 100: capillary layer
11:上板件 11: Upper plate
110:穿孔 110: Perforation
2:熱管 2: Heat pipe
20:管體 20: Tube body
200:封閉端 200: Closed end
201:開口端 201: Open end
21:毛細組織 21: Capillary tissue
210:延伸部 210: Extension
211:擴張部 211: Expansion Department
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113205194U TWM660063U (en) | 2024-05-21 | 2024-05-21 | Temperature equalizing device with heat pipe |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113205194U TWM660063U (en) | 2024-05-21 | 2024-05-21 | Temperature equalizing device with heat pipe |
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| TWM660063U true TWM660063U (en) | 2024-09-01 |
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| TW (1) | TWM660063U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119309262A (en) * | 2024-11-18 | 2025-01-14 | 西南交通大学 | An air conditioning system based on photovoltaic thermal energy |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119309262A (en) * | 2024-11-18 | 2025-01-14 | 西南交通大学 | An air conditioning system based on photovoltaic thermal energy |
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