TWM651288U - Micro ALL IN ONE computer chip system based on OSM-L standard - Google Patents

Abstract

This creation proposes a micro ALL IN ONE computer chip system based on the OSM-L standard, which includes: a system circuit carrier board, which is a carrier board with a length and width of 45mm*45mm. The system circuit carrier board has a top layer of the carrier board and the bottom layer of the carrier board. The top layer of the carrier board is equipped with an integrated circuit with a high degree of circuit integration design. The bottom layer of the carrier board has an OSM-L interface defined by SGeT; a processor system chip (SoC) is electrically connected. is provided on the top layer of the carrier board; a memory system is electrically connected and provided on the top layer of the carrier board; a power circuit module is electrically connected and provided on the top layer of the carrier board; a cover is provided on the cover. The bottom of the cover is hollow and has an accommodation space inside. The accommodation space is used to install the system circuit carrier board. The accommodation gap in the enclosure cover is coated and filled with thermal paste; in this way In the future, it will become a micro ALL IN ONE computer chip with complete functions, and the micro ALL IN ONE computer chip can be widely used in industrial computers, Internet of Things, edge computing, etc. in the form of a chip (Chip/IC). The computing center for artificial intelligence and various forms of applications has become the standard for joint development and operation among industries.

Description

Micro ALL IN ONE computer chip system based on OSM-L standard

This creation is about a micro ALL IN ONE computer chip, specifically a micro ALL IN based on the OSM-L standard that can integrate at least three key computer components such as processor, memory, and power supply into a micro computer chip system. ONE computer chip system.

Press, the use of computer equipment has become a common equipment used by modern people in work or life, including personal computers, industrial computers or other special-purpose computers. The computer hardware device can be divided into four major units, namely central processing unit (CPU), memory (Memory), input/output interface (I/O ports) and power supply (PSU). The evolution of computers is dominated by the central processing unit (CPU), which determines the computing power of the computer. All software and input/output interfaces (I/O) must be designed according to its capabilities to design various applications and devices. Therefore, each Computer-like motherboard manufacturers all use central processing unit (CPU) planning for wiring design, memory and power integration. Therefore, it can also be said that CPU is the mainstream of computer chips and determines the future information and communication technology industry/ICT ( Information and Communication Technology) development.

As for the integration of CPU, memory and power supply, they are usually matched, that is, the changes between them are placed and wired in a limited space, and the electromagnetic effects are balanced to avoid mutual interference. I/O devices often vary greatly depending on the customer's application field. Wired devices rely on connectors of different sizes to transmit information, while wireless devices rely on chips with different band frequencies to transmit information. However, because the CPU, memory and power supply/power lines have not been well integrated in the current computer industry, computers cannot be microchip-based and become a common standard among industries, so the design of computer systems is still complicated. It is not conducive to shortening the development time and increasing the stability of the computer system, and is an unideal computer system design.

Furthermore, in recent years, the industrial computer field has widely adopted system module standards such as SMARC, Qseven, COMe and PC/104 to achieve a high degree of integration and flexibility in embedded computing. In order to further promote the development of this field, the Standardization Organization for Embedded Technology (SGeT) launched the Open Standard Module (OSM/Open Standard Module) in 2020. The OSM-L standard adopts a stamp-like size of 45*45mm. Used in embedded systems of industrial computers, in recent years, OSM-L modules have become the preferred component of many manufacturers in the Internet of Things and edge computing fields due to their performance, cost and space efficiency. Therefore, how to effectively utilize this OSM-L module architecture and form an overall computer chip integrated design with the main components of computer equipment, and promote it in industrial computer systems, is something that the industry should jointly develop and break through. Key directions.

Therefore, in view of the shortcomings in the research and development design of the existing computer system architecture and the fact that the structural design is not ideal, the creator of this case began to develop its solution, hoping to develop a more microcomputer chip-based, standardized and The micro ALL IN ONE computer chip system based on the OSM-L standard is optimized for its related performance in order to serve the public and promote the development of this industry. This creation was born after a long period of conceiving.

The purpose of this creation is to provide a micro ALL IN ONE computer chip system based on the OSM-L standard, which can provide a highly integrated circuit design and place the CPU, memory and power lines in a micro computer chip with a length and width of 45mm*45mm. space, turning it into a fully functional microcomputer chip, forming an All-in-One computer (AIOC), and making this microcomputer chip a common standard among industries to simplify the complexity of future computer design and enjoy The advantage of shortening development time and increasing system stability.

Another purpose of this creation is to provide a micro ALL IN ONE computer chip system based on the OSM-L standard, which can provide a specific interface recognized by the industry and integrate various input and output devices, so as to achieve various sizes and shapes. It communicates with the input interface of the motherboard to achieve excellent transmission and control functions.

Another purpose of this creation is to provide a micro-controller based on the OSM-L standard

ALL IN ONE computer chip system, through the design of heat conduction and packaging heat dissipation, can effectively eliminate the heat source problems caused by the circuits of various input and output devices in a three-in-one highly integrated system, thereby effectively eliminating the heat dissipation and greatly reducing the temperature.

Another purpose of this creation is to provide a micro ALL IN ONE computer chip system based on the OSM-L standard, which can provide an anti-vibration PCB solderable module through the OSM-L standard and has the largest pin area ratio. The streamlined appearance takes into account the scalability of the technology to meet the integration requirements of high performance and miniaturization, and can be widely used in the fields of Internet of Things, edge computing, artificial intelligence, and computing centers for various forms of applications.

The technical means adopted by this invention to achieve the above purpose include: a system circuit carrier board, which is a carrier board with a length and width of 45mm*45mm. The system circuit carrier board has a top layer of the carrier board and a bottom layer of the carrier board. The top layer of the board is equipped with an integrated circuit with a high degree of circuit integration design. The bottom layer of the carrier board has an OSM-L interface defined by SGeT; a processor system chip (SoC) is electrically connected and located on the top layer of the carrier board; A memory system is electrically connected and located on the top layer of the carrier board; a power line module is electrically connected and located on the top layer of the carrier board; a cover includes a top cover and four peripheral Side cover, the bottom of the enclosure cover is hollow, so that there is an accommodating space inside the enclosure cover, the accommodating space is used to install the system circuit carrier board, and allows the OSM-L interface to face As shown below, there is an accommodation gap between the enclosure cover and the system circuit carrier board, the processor system chip (SoC), the memory system and the power circuit module, and the accommodation gap is coated Fill with thermal paste.

In this embodiment, the OSM-L interface on the bottom layer of the carrier board defines 662 pins/nodes as an interface for external connection.

In this embodiment, the integrated circuit system at least includes: a first module area configured to the processor system chip (SoC), and a second module area configured to the memory system and a third module area configured to the power circuit module.

In this embodiment, the OSM-L interface uses a symmetrical LGA package, and the contact technology uses LGA or BGA.

In this embodiment, the longitudinal and transverse sections of the enclosure cover are in the shape of a U-shape. Cross-section heat sink design.

In this embodiment, the system circuit carrier board, the processor system chip (SoC), the memory system, the power circuit module and the enclosure cover are combined to form a micro ALL IN ONE computer chip. The micro ALL IN ONE computer chips are installed on a system motherboard of an industrial computer.

In this embodiment, the power circuit module includes a power supply and a control unit.

In this embodiment, the memory system includes an electrically connected memory substrate and a memory structure. The memory structure includes at least one main memory and other optional storage memories.

In order to enable you, the review committee, to have a better understanding of the technical features and effects achieved by this creation, we would like to provide you with a diagram of a better embodiment and a detailed description, as follows:

1:Micro ALL IN ONE computer chip

10: System circuit carrier board

11:Top layer of carrier board

12:Bottom layer of carrier board

111:Integrated line

112: The first module area

113: Second module area

114: The third module area

121:OSM-L interface

20: Processor System on Chip (SoC)

21:CPU substrate

22:CPU

30:Memory system

31:Memory substrate

32: Memory composition

40:Power line module

50:Sealing cover

51:Top cover

52:Side cover

53: Accommodation space

54: Accommodation gap

61: Open standard module pin

62: System single chip

63:Control system

64:Core power IC

65: System power management IC

66:Dynamic Random Access Memory

67: Flash memory

70:Industrial computers

71:System motherboard

Picture 1 is an exploded diagram of this creation;

Picture 2 is a schematic top view of the combination of this creation;

Figure 3 is a schematic cross-sectional view of the combination of this creation;

Figure 4 is a schematic diagram of the combined application of this creation;

Figure 5 is a schematic diagram of the operation of the logic block of this creation.

Please refer to Figure 1, Figure 2 and Figure 3 to illustrate an embodiment of a micro ALL IN ONE computer chip system based on the OSM-L standard. However, the figures disclosed are for illustrative purposes only and are not intended to be used. To limit the scope of this creation. As can be seen from the figure, the micro ALL IN ONE computer chip 1 series of the present invention includes a system circuit carrier board 10, a processor system chip (SoC) 20, a memory system 30, a power circuit module 40 and an enclosure cover 50; Among them, the system circuit carrier board 10 is a carrier board with a length and width of 45mm*45mm. The system circuit carrier board 10 has a carrier board top layer 11 and a carrier board bottom layer. 12. The top layer 11 of the carrier board is provided with an integrated circuit 111 designed with a high degree of circuit integration. The integrated circuit 111 at least includes a first module area 112, a second module area 113 and a third module area 114 (such as 2), the first module area 112, the second module area 113 and the third module area 114 are used to respectively configure the processor system chip (SoC) 20 (System on a Chip), memory System 30 and power circuit module 40. The carrier board bottom layer 12 of the system circuit carrier board 10 has an OSM-L interface 121 of an open standard module (OSM/Open Standard Module) defined by SGeT. The OSM-L interface of the carrier board bottom layer 12 has an embedded The application of formula calculation, and defines 662 pins/nodes (pinout) as the interface with external connections; furthermore, the OSM-L interface 121 uses a symmetrical LGA (land grid array/planar grid array package) package. The contact technology can be LGA or BGA (ball grid array/ball grid array package), and the OSM-L interface 121 can be fully machined during soldering, assembly and testing, and uses a pre-tinned LGA package , it can be soldered directly without a connector. At the same time, the OSM-L interface 121 is a predefined soft and hard interface.

In this way, the space size of the system circuit carrier board 10, the integrated circuit 111, and the OSM-L interface 121 are used to communicate with the input interface of the system motherboard 71 (see Figure 4) of various sizes and shapes to achieve the purpose of transmission and control. , and can become a standard commonly used among industries to reduce the complexity of future computer design, and enjoy the advantages of shortening development time and increasing system stability.

The processor system chip (SoC) 20 includes a CPU substrate 21 and a CPU 22 that are electrically connected. The processor system chip (SoC) 20 is located in the first module area 112 and is electrically connected to the integrated circuit 111. sexual connection. The memory system 30 includes an electrically connected memory substrate 31 and a memory structure 32. The memory structure 32 includes at least one main memory and other optional storage memories. The memory system 30 It is located in the second module area 113 and is electrically connected to the integrated circuit 111 . The power circuit module 40 is located in the second module area 113 . The power circuit module 40 includes a power supply and a control unit, and is electrically connected to the integrated circuit 111 .

The enclosure cover 50 includes a top cover 51 and side covers 52 on all sides, so that the vertical/transverse cross-section of the enclosure cover 50 is a heat sink design with a U-shaped cross-section. The bottom of 50 is hollow, so that there is an accommodating space 53 inside the enclosure cover 50. The accommodating space 53 is used to install the combined processor system chip (SoC) 20, the memory system 30, and the power supply circuit. After Mod 40 The system circuit carrier board 10 is exposed downward, and the OSM-L interface 121 (carrier board bottom layer 12 ) of the system circuit carrier board 10 is exposed downward, and the enclosure cover 50 is connected with the system circuit carrier board 10 and the processor system chip. There is an accommodating gap 54 between the (SoC) 20, the memory system 30, and the power circuit module 40. The accommodating gap 54 is used to coat and fill the thermal dissipation paste (not shown), and the thermal dissipation paste serves as the The heat conduction between the system circuit carrier board 10, the processor system chip (SoC) 20, the memory system 30, the power circuit module 40 and the enclosure cover 50 is used to balance the heat generated by all module components and components. , so that the heat generated by the integrated circuit 111 of the highly integrated design of the three-in-one (that is, including the processor system chip (SoC) 20, the memory system 30, and the power circuit module 40) can pass through the thermal paste and the encapsulation cover 50The design of its heat sink has been greatly reduced.

Please refer to Figure 4, which is an application example of the micro ALL IN ONE computer chip system based on the OSM-L standard. An industrial computer 70 includes a system motherboard 71, and the system motherboard 71 is an OSM-based embedded computing system. L interface, and a plurality (at least one) of micro ALL IN ONE computer chips 1 series are arranged on the system motherboard 71, so that the industrial computer can be assembled simply, quickly and efficiently, and the industrial computer can be assembled according to the Different quantities of micro ALL IN ONE computer chips 1 can be selected for assembly according to the needs, or it can be convenient to add micro ALL IN ONE computer chips 1 in the future to expand and improve its overall performance and efficiency. In this way, the micro ALL IN ONE computer chip 1 of this invention can be easily promoted as a computing center for industrial computers, Internet of Things, edge computing, artificial intelligence and various forms of applications in the form of a chip (Chip/IC), and become an industrial jointly develop and operate standards.

Please refer to Figure 5, which is a schematic diagram of the operation of the logic block of this invention. As shown in the figure, the open standard module pin 61 (OSM Pinout) of the embodiment of this invention is electrically connected to a system single chip 62 (SoC/System on a Chip) and a control system 63 (EC/MCU), the open standard module pin 61 is the pin of the OSM-L interface 121, and the system single chip 62 (SoC) is the processor system Chip (SoC) 20, and the control system 63 (EC/MCU) includes an application combination of a control unit (Electronic Control Unit, ECU) and a microcontroller (MCU/microcontroller). Furthermore, a core power IC 64 (Core PMIC) is electrically connected to the system single chip 62 (SoC) and the control system 63 (EC/MCU). In addition, the system on chip 62 (SoC) is electrically connected to a system power management IC65 (SYS PMIC), the system power management IC 65 (SYS PMIC) and the core power IC 64 (Core PMIC) belong to the composition of the power line module 40, and the system power management IC 65 (SYS PMIC) are electrically connected in parallel A dynamic random access memory 66 (DRAM/Dynamic random-access memory) and a flash memory 67 (eMMC/Embedded Multi Media Card), the dynamic random access memory 66 (DRAM) and the flash memory 67 (eMMC) is a component of the memory component 32 (memory system 30), so that the related operations of circuit transmission and control of this embodiment can be completed.

This creation is based on the OSM-L standard micro ALL IN ONE computer chip system. With the above composition, it can provide a highly integrated circuit design, placing the CPU, memory and power lines in a micro computer chip with a length and width of 45mm*45mm. Space, turning it into a fully functional microcomputer chip, forming an All-in-One computer (AIOC), and making this microcomputer chip a common standard among industries to simplify the complexity of future computer design and enjoy shortening The advantages of development time and increased system stability; at the same time, this creation can provide a specific interface recognized by the industry and integrate various input and output devices, so as to communicate with the input interfaces of motherboards of various sizes and shapes to achieve transmission and For the purpose of controlling the excellent performance; moreover, this creation can also use the design of heat conduction and heat dissipation to enable the three-in-one highly integrated circuit of various input and output devices to effectively eliminate the problem of heat sources generated by the circuits of various input and output devices, and effectively eliminate the problem of heat dissipation and temperature rise. It is greatly reduced, and it can also provide anti-vibration PCB solderable modules through the OSM-L standard, and has a streamlined appearance with the largest pin area ratio, thus taking into account the scalability of the technology, achieving high performance and miniaturization. the integration needs.

In this way, the above description has been combined with the drawings to explain in detail the embodiment of the micro ALL IN ONE computer chip system based on the OSM-L standard and its technical features and functions. However, it must be emphasized that the above detailed description is a specific description of possible embodiments of this invention. However, these embodiments are not used to limit the patent scope of this invention. Any equivalent implementation or implementation that does not deviate from the technical spirit of this invention or Any changes shall be included in the patent scope of this creation.

10: System circuit carrier board

121:OSM-L interface

20: Processor System on Chip (SoC)

22:CPU

40:Power line module

50:Sealing cover

51:Top cover

52:Side cover

54: Accommodation gap

Claims (8)

A micro ALL IN ONE computer chip system based on the OSM-L standard, including: A system circuit carrier board is a carrier board with a length and width of 45mm*45mm. The system circuit carrier board has a top layer of the carrier board and a bottom layer of the carrier board. The top layer of the carrier board is equipped with an integrated circuit with a high degree of circuit integration design. The bottom layer of the board has an OSM-L interface defined by SGeT; A processor system chip (SoC) is electrically connected and located on the top layer of the carrier board; A memory system is electrically connected and located on the top layer of the carrier board; A power circuit module is electrically connected and located on the top layer of the carrier board; A cover includes a top cover and surrounding side covers. The bottom of the cover is hollow, so that there is an accommodating space inside the cover. The accommodating space is used for The system circuit carrier board is set up and the OSM-L interface is exposed downward. The enclosure cover and the system circuit carrier board, the processor system chip (SoC), the memory system and the power line module There is an accommodating gap between them, and the accommodating gap is coated and filled with a heat dissipation paste. As described in item 1 of the patent application, the micro ALL IN ONE computer chip system based on the OSM-L standard, in which the OSM-L interface on the bottom layer of the carrier board defines 662 pins/nodes as the interface for external connection . As for the micro ALL IN ONE computer chip system based on the OSM-L standard described in item 2 of the patent application, the integrated circuit system at least includes: a first module for setting up the processor system chip (SoC). A group area, a second module area for connecting to the memory system, and a third module area for connecting to the power line module. As described in item 1 of the patent application, the micro ALL IN ONE computer chip system based on the OSM-L standard, in which the OSM-L interface uses a symmetrical LGA package, and the contact technology uses LGA or BGA. As described in item 1 of the patent application, the micro ALL IN ONE computer chip system based on the OSM-L standard, wherein the longitudinal/transverse section of the enclosure cover is a U-shaped cross-section for heat dissipation film design. The micro ALL IN ONE computer chip system based on the OSM-L standard as described in item 1 of the patent application, wherein the system circuit carrier board, the processor system chip (SoC), the memory system, and the power line module After being combined with the cover, a micro ALL IN ONE computer chip is formed. The plurality of micro ALL IN ONE computer chips are installed on a system motherboard of an industrial computer. As described in item 1 of the patent application, the micro ALL IN ONE computer chip system based on the OSM-L standard, wherein the power line module includes a power supply and a control unit. As described in item 1 of the patent application, the micro ALL IN ONE computer chip system based on the OSM-L standard, wherein the memory system includes an electrically connected memory substrate and a memory structure, and the memory structure includes There is at least one main memory and other optional storage memories.

Images