TWI898395B - Micro multi-purpose I/O computer chip module based on OSM-L standard - Google Patents

Abstract

The present invention proposes a micro-multiple I/O computer chip (MIOC/Multiple I/O Chip) module based on the OSM-L standard, which includes: an I/O circuit carrier, wherein the I/O circuit carrier has a first carrier layer and a second carrier layer electrically connected on both sides, wherein the first carrier layer is provided with a highly integrated I/O line design, and the second carrier layer has an OSM-L interface defined by SGeT; a composite I/O interface module electrically connected and provided on the first carrier layer, wherein the composite I/O interface module is provided with I/O interface lines, I/O processors and/or chips on a circuit board; and a plurality of electrical connectors electrically connected and provided on the first carrier layer. A housing is provided on the first layer of the carrier board. One side of the housing is perforated, creating a space within the housing for mounting the I/O circuit carrier board. The gaps between the housing interior, the I/O circuit carrier board, and the composite I/O interface module are filled with a thermally conductive interface material. This creates a fully functional micro-input/output (I/O) chip module that can be integrated with an All-in-One Computer (AIOC) in the future, making this micro-computer chip module system a common industry standard.

Description

Micro multi-purpose I/O computer chip module based on the OSM-L standard

This invention relates to a micro-complex I/O computer chip structure, particularly a chip module that integrates I/O circuits and hardware, enabling it to be used in a micro-all-in-one computer chip system architecture based on the OSM-L standard.

Computers are now a commonplace in modern life and work, including personal computers, industrial computers, and other specialized computers. Computer hardware can be divided into four major components: the central processing unit (CPU), memory, input/output (I/O) ports, and power supply (PSU). The evolution of computers has been centered around the CPU, which determines the computer's computing power. All software and I/O ports are designed based on its capabilities for various applications and devices. Therefore, motherboard manufacturers of all types base their wiring design, memory, and power supply integration around the CPU. Therefore, the CPU is the mainstream computer chip and determines the future development of the information and communications technology (ICT) industry.

The integration of CPUs, memory, and power supplies is typically coordinated. Any changes in their placement and routing within a limited space require balancing electromagnetic effects to avoid mutual interference. I/O devices often vary significantly depending on the customer's application. Wired devices rely on connectors of varying sizes for transmission, while wireless devices rely on chips with varying frequency bands to transmit information. Since I/O devices must be compatible with customer application requirements and the operation of the device's physical components, such as the CPU, memory, and power supply, as CPUs, memory, and power supplies/power supply circuits are better integrated in current computers, I/O device systems must also be integrated. This makes the application of computer microchips feasible and can become a common standard used across the industry. This significantly reduces the complexity of computer system design, saves significant development time, and increases system stability, making it the ideal direction for computer chip system design.

Furthermore, in recent years, the industrial computing sector has widely adopted system-on-module standards such as SMARC, Qseven, COMe, and PC/104 to achieve high integration and flexibility in embedded computing. To further promote development in this area, the Group for Standardization of Embedded Technologies (SGeT) launched the Open Standard Module (OSM) in 2020. The OSM-L standard adopts a 45*45mm stamp-like size for embedded systems in industrial computers. In recent years, the OSM-L module has become the preferred component for many manufacturers in the IoT and edge computing fields due to its performance, cost, and space efficiency. Therefore, how to effectively utilize this OSM-L modular architecture and integrate it with the main components of computer equipment to form an overall computer chip integrated design, and promote its application in industrial computer systems, should be a key direction for research and development and breakthroughs in the industry.

Therefore, in response to the fact that existing computer chip system architectures lack a modular I/O device system for integrated and compatible applications, the inventors of this case immediately began developing a solution, hoping to develop a micro-complex I/O device based on the OSM-L standard that would be more computer chip-based, standardized, and have optimized performance. This would serve the public and promote the development of this industry. This resulted in the present invention after much deliberation.

The purpose of this invention is to provide a micro-complex I/O computer chip module based on the OSM-L standard. This module offers a highly integrated circuit design, integrating various IO interface circuits and associated micro-connectors within the footprint of a micro-computer chip module. This makes it a fully functional micro-computer I/O interface chip module, which in turn forms the I/O expansion chip (MIOC) for an All-in-One Computer (AIOC). These two chip modules can be combined into an ultra-microcomputer chip system, becoming a standard for common use across the industry. This will reduce the complexity of future computer application designs, shorten development time, and increase system stability.

Another object of this invention is to provide a micro-complex I/O computer-on-a-chip module based on the OSM-L standard. This module integrates various input/output devices through a specific, industry-recognized interface, enabling communication with various functional All-in-One Computers (AIOCs) to achieve optimal transmission and control efficiency.

Another object of the present invention is to provide a micro-complex I/O computer chip module based on the OSM-L standard. This module, through its heat conduction and packaging heat dissipation design, effectively eliminates the heat generated by the circuits of various highly integrated input and output devices, significantly reducing the temperature.

Another objective of this invention is to provide a miniature, multi-purpose I/O chip module based on the OSM-L standard for various input/output devices. This module utilizes the OSM-L standard to provide a vibration-resistant, PCB-solderable module and a compact form factor with a maximum pin-to-area ratio. This allows for both technological scalability and meets the integration requirements of high performance and miniaturization, promoting applications in fields such as the Internet of Things, edge computing, and artificial intelligence.

The technical means adopted by the present invention to achieve the above-mentioned purpose include: an I/O circuit carrier, which is a circuit carrier with a length and width of 45mm*45mm. The two sides of the I/O circuit carrier are respectively a first layer and a second layer of the carrier for electrical connection. The first layer of the carrier is provided with a highly integrated I/O line design, and the second layer of the carrier is provided with an open standard module (OSM) defined by SGeT. The invention also includes an OSM-L interface module (OSM-L interface module) electrically connected to the first layer of the carrier board. A composite I/O interface module is a circuit board equipped with I/O interface lines, an I/O processor, and/or a chip. A plurality of electrical connectors are electrically connected to the first layer of the carrier board. A housing has a housing for accommodating the I/O circuit carrier board after the composite I/O interface module and the connector assembly are assembled.

In this embodiment, the OSM-L interface on the second layer of the carrier defines 662 pins/nodes as an interface for external connections.

In this embodiment, the OSM-L interface uses a symmetrical LGA package, and the contact technology adopts LGA or BGA.

In this embodiment, the housing is provided with a plurality of connector openings, which are arranged relative to the plurality of electrical connectors, and the plurality of electrical connectors are exposed in the plurality of connector openings.

In this embodiment, the space between the interior of the housing and the I/O circuit carrier and the composite I/O interface module is filled with a thermally conductive interface material, such as thermal paste or a heat sink.

In this embodiment, the I/O circuit carrier is electrically connected to a micro all-in-one computer chip module. The micro all-in-one computer chip module includes a system circuit carrier having an electrically connected carrier top layer and carrier bottom layer. The carrier top layer is provided with integrated circuits with a highly integrated circuit design, and the carrier bottom layer has an OSM-L interface, an open standard module (OSM) defined by SGeT. The OSM-L interface of the system circuit carrier is electrically connected to the OSM-L interface of the I/O circuit carrier.

In this embodiment, the top layer of the carrier board is provided with a processor system on a chip (SoC), a memory system, and a power supply circuit module that are electrically connected to operate computer functions.

In this embodiment, the I/O circuit carrier is electrically connected to a system motherboard. The system motherboard has multiple OSM-L interfaces for embedded computing. The OSM-L interface of the system motherboard is electrically connected to the OSM-L interface of the I/O circuit carrier and the OSM-L interface of the system circuit carrier.

In order to help you, the Review Committee, gain a deeper understanding of the technical features and effects achieved by this invention, we would like to provide you with a diagram of a preferred embodiment and a detailed description as follows:

1: Micro multi-purpose I/O computer chip module

10: I/O circuit board

11: First layer of carrier board

12: Second layer of carrier board

13: OSM-L interface

20: Composite I/O interface module

30: Connector assembly

31: Electrical connector

40: Chassis

41: Storage Space

42: Connector port

51: System motherboard

80: Micro All-in-One Computer Chip Module

80A: System circuit board

81: Carrier board top layer

82: Carrier bottom layer

821: OSM-L interface

83: Processor System Chip

84:Memory System

85: Power line module

86: Enclosure cover

861: Storage Space

Figure 1 is an exploded schematic diagram of a micro all-in-one computer chip module;

Figure 2 is a schematic diagram of the structural breakdown of the present invention.

Figure 3A is a schematic side view of the assembly of the present invention;

Figure 3B is a schematic top view of the assembly of the present invention;

Figure 4 is a schematic diagram of the first application embodiment of the present invention;

Figure 5 is a schematic diagram of the second application embodiment of the present invention;

Figure 6 is a schematic diagram of the circuit logic block operation of the present invention.

The figures disclosed herein are for illustrative purposes only and are not intended to limit the specific embodiments and scope of protection of the present invention. This invention discloses a micro-multiple I/O computer-on-chip (MIOC) module based on the OSM-L standard. It is primarily designed to be used in conjunction with a micro-all-in-one computer-on-chip (AIOC) module to form an ultra-micro computer system-on-a-chip (SoC), making it a standard commonly used across the industry.

As shown in FIG1 , the micro All-in-One computer chip module 80 includes: a system circuit board 80A, the system circuit board 80A having an electrically connected board top layer 81 and a board bottom layer 82, the board top layer 81 having an integrated circuit with a high degree of circuit integration design, the board bottom layer 82 having an OSM-L interface 821 of an open standard module (OSM/Open Standard Module) defined by SGeT; a processor system chip 83 (SoC/System on a chip) electrically connected to the board top layer 81. Chip), memory system 84, and power circuit module 85 for operating computer-related functions; and a cover 86. The bottom of the cover 86 is hollow, so that the cover 86 has a storage space 861 inside. The storage space 861 is used to place the system circuit board 80A after combining the processor system chip 83, memory system 84, and power circuit module 85, and allows the OSM-L interface 821 (carrier bottom layer 82) of the system circuit board 80A to be exposed downward.

Please refer to Figures 2, 3A and 3B, which illustrate an embodiment of a micro-complex I/O computer-on-a-chip (MIOC) module based on the OSM-L standard (I/O: input/output interface) of the present invention. As can be seen from the figures, the micro-complex I/O computer-on-a-chip module 1 of the present invention includes an I/O circuit carrier 10, a multiple I/O interface module 20 (Multiple I/O), a connector assembly 30 and a housing 40; wherein, the I/O circuit carrier 10 is a circuit carrier with a length and width of 45mm*45mm. The two sides of the I/O circuit carrier 10 are respectively an electrically connected carrier first layer 11 and a carrier second layer 12. The carrier first layer 11 is provided with an I/O integrated circuit design layout with a high degree of circuit integration. The second layer 12 of the I/O circuit carrier 10 has an OSM-L interface 13, an open standard module (OSM) defined by SGeT. This OSM-L interface 13 on the second layer 12 of the carrier enables embedded computing applications and defines 662 pinouts for external connections. Furthermore, the OSM-L interface 13 uses a symmetrical LGA (land grid array) package, and the contact technology can adopt LGA or BGA (ball grid array). The OSM-L interface 13 can be fully machined during soldering, assembly, and testing. It uses a pre-tinned LGA package and can be directly soldered without a connector. Furthermore, the OSM-L interface 13 is a pre-defined soft and hard interface.

Thus, the I/O circuit carrier 10's space, I/O integrated circuits, and OSM-L interface 13 are used to communicate with the input interfaces of system motherboards 51 (see Figure 4) of various sizes and shapes, achieving the purpose of I/O transmission and control. This can become a common I/O chip module standard used across the industry, thereby reducing the complexity of future computer designs, shortening development time, and increasing system stability.

The composite I/O interface module 20 is electrically connected to and disposed on the first carrier layer 11 of the I/O circuit carrier 10. The composite I/O interface module 20 can be configured on a circuit board with associated I/O processors, chips, and various I/O interface circuits (not shown) to facilitate the I/O interface functions of the aforementioned micro All-in-One Computer on a Chip (AIOC) module 80.

The connector assembly 30 is electrically connected and disposed on the first carrier layer 11 of the I/O circuit carrier 10. The connector assembly 30 includes a plurality of electrical connectors 31 of various types. These connectors 31 can be, but are not limited to, various micro I/O connectors such as USB, D-SUB, HDMI, and DVI. The multi-I/O interface modules 20 are each equipped with the processors, chips, and circuits required for the operation of each of the connector assemblies 30.

The housing 40 has a U-shaped cross-section with a front cover and four side covers. The other side of the housing 40 is hollow, providing an internal storage space 41 within the housing 40. The storage space 41 is used to accommodate the I/O circuit board 10 after the composite I/O interface module 20 and the connector assembly 30 are assembled, and the OSM-L interface 13 of the I/O circuit board 10 (the second layer 12 of the board) is exposed downward. The housing 40 is also provided with a plurality of connector openings 42. The plurality of connector openings 42 are arranged relative to the connector assembly 30, and the connector assembly 30 is correspondingly exposed in the plurality of connector openings 42 for convenient plugging and use. The gaps between the interior of the housing 40 (the housing space 41) and the I/O circuit carrier 10 and the multi-I/O interface module 20 can be filled with a thermally conductive interface material (not shown), such as thermal paste or a heat sink. This thermally conductive interface material acts as a heat conductor between the I/O circuit carrier 10, the multi-I/O interface module 20, and the housing 40, balancing the heat generated by all the module components, parts, and circuits of the micro multi-I/O computer-on-a-chip (MIOC) module 1. This heat is significantly reduced through the thermally conductive interface material and the conductive design of the housing 40.

Please refer to FIG4, which is an application example 1 of the micro multi-type I/O computer chip module based on the OSM-L standard of the present invention. It discloses a system motherboard 51 such as an industrial computer/network computer. The system motherboard 51 has multiple OSM-L interfaces for embedded computing. A plurality of micro All-in-One computer chip modules 80 (AIOC) and the micro multi-type I/O computer chip module 1 (MIOC) are arranged on the OSM-L interfaces corresponding to the system motherboard 51. The OSM-L interface 821 of the assembly 80 and the OSM-L interface 13 of the micro multi-type I/O computer chip module 1 are electrically connected to the respective OSM-L interfaces of the system motherboard 51, thereby completing the assembly of the industrial computer/network computer simply, quickly, and efficiently. Moreover, the industrial computer/network computer can select different quantities of micro all-in-one computer chip modules 80 (AIOC) and micro multi-type I/O computer chip modules 1 (MIOC) for assembly according to needs, or facilitate future expansion and improve its overall performance and efficiency. Thus, the micro-multi-I/O computer-on-a-chip module 1 (MIOC) of the present invention can be combined with multiple micro-all-in-one computer-on-a-chip modules 80 (AIOC), enabling chip (chip/IC)-like assembly and convenient promotion for application in industrial computers, the Internet of Things, edge computing, artificial intelligence, and computing centers for various applications, becoming a standard for joint development and operation across the industry.

Please also refer to Figure 5, which illustrates a second embodiment of the present invention's micro-combined I/O computer-on-a-chip module based on the OSM-L standard. As shown, the housing 40 of the micro-combined I/O computer-on-a-chip module 1 is in a transparent, upward-facing position, and the second carrier layer 12 of the I/O circuit carrier 10 is facing upward, exposing the OSM-L interface 13. The micro-all-in-one computer-on-a-chip module 80 is then assembled, electrically connecting the OSM-L interface 821 of the system circuit carrier 80A (carrier bottom layer 82) to the OSM-L interface 13, thereby completing the quick and easy assembly of a microcomputer.

Please also refer to Figure 6, which is a schematic diagram illustrating the operation of the circuit logic blocks of the present invention. As shown, the micro All-in-One Computer-on-Chip module 80 (AIOC) connects to the multi-I/O interface module 20 (micro multi-I/O Computer-on-Chip module 1) via the OSM-L interface, providing power, control, and input/output (I/O) signal connections. The multi-I/O interface module 20 (micro multi-I/O Computer-on-Chip module 1) can transmit these power, control, and input/output (I/O) signals to external devices via the connector assembly 30.

The micro-complex I/O computer chip module of the present invention based on the OSM-L standard is constructed as described above. It can provide a highly integrated circuit design, placing various IO interface circuits and related micro connectors in a space the size of a micro-computer chip module, making it a fully functional micro-computer input and output interface chip module, and forming the input and output function expansion chip (MIOC) of the All-in-One Computer (AIOC). The two chip modules can be combined into an ultra-micro computer chip system, becoming a standard commonly used by the industry, so as to reduce the complexity of future computer application design and enjoy the advantages of shortening development time and increasing system stability. At the same time, the present invention can also provide This device integrates various I/O devices using a specific, industry-recognized interface, enabling communication with a diverse All-in-One Computer (AIOC) for optimal transmission and control. Furthermore, through thermal conductivity and package heat dissipation, this device effectively dissipates heat generated by the highly integrated circuits of various I/O devices, significantly reducing temperatures. Furthermore, this device provides a vibration-resistant, PCB-solderable module compliant with the OSM-L standard, while boasting a compact form factor with a maximum pin-to-area ratio. This design addresses both technological scalability and meets the integration requirements of high performance and miniaturization, promoting its application in fields such as the Internet of Things, edge computing, and artificial intelligence.

The above description, along with the accompanying drawings, has fully illustrated an embodiment of the present invention's micro-combined I/O computer-on-a-chip module based on the OSM-L standard, along with its technical features and functions. However, it must be emphasized that the above detailed description is a specific illustration of a feasible embodiment of the present invention and is not intended to limit the patent scope of the present invention. Any equivalent implementations or modifications that do not depart from the technical spirit of the present invention are intended to be included in the patent scope of the present invention.

1: Micro multi-purpose I/O computer chip module

10: I/O circuit board

11: First layer of carrier board

12: Second layer of carrier board

13: OSM-L interface

20: Composite I/O interface module

30: Connector assembly

31: Electrical connector

40: Chassis

41: Storage Space

42: Connector port

Claims (5)

A micro-complex I/O computer chip module based on the OSM-L standard includes: an I/O circuit carrier board, the I/O circuit carrier board is a circuit carrier board with a length and width of 45mm*45mm, and the two sides of the I/O circuit carrier board are respectively a first layer of the carrier board and a second layer of the carrier board for electrical connection. The first layer of the carrier board has a highly integrated I/O line design, and the second layer of the carrier board has an open standard module (OSM/Open Standard) defined by SGeT. The invention relates to an I/O circuit carrier board electrically connected to a system motherboard having multiple embedded computing OSM-L interfaces; a composite I/O interface module electrically connected to the first layer of the carrier board; the composite I/O interface module is provided on a circuit board with I/O interface lines, I/O processors and/or chips; a plurality of electrical connectors electrically connected to the first layer of the carrier board; and a housing having a housing space for arranging and assembling the composite I/O interface module. I/O interface module, the I/O circuit carrier behind the plurality of electrical connectors; a micro All-in-One computer chip module electrically connected to the I/O circuit carrier, the micro All-in-One computer chip module includes a system circuit carrier, the system circuit carrier has an electrically connected carrier top layer and a carrier bottom layer, the carrier top layer is provided with an integrated circuit with a high circuit integration design, and the carrier top layer is provided with an electrically connected processor system chip (SoC/System On a chip), memory system, and power line module are used to operate computer functions. The carrier board has an OSM-L interface, an open standard module (OSM) defined by SGeT, on the bottom layer. The OSM-L interface of the system circuit carrier board is electrically connected to the OSM-L interface of the I/O circuit carrier board. The OSM-L interface of the system motherboard is electrically connected to the OSM-L interface of the I/O circuit carrier board and the OSM-L interface of the system circuit carrier board. As described in Item 1 of the patent application, the micro multi-type I/O computer chip module based on the OSM-L standard, wherein the OSM-L interface on the second layer of the carrier board defines 662 pins/nodes as an interface for external connections. As described in Item 2 of the patent application, the micro-complex I/O computer-on-a-chip module based on the OSM-L standard, wherein the OSM-L interface utilizes a symmetrical LGA package and the contact technology adopts LGA or BGA. As described in Item 1 of the patent application, the micro multi-type I/O computer chip module based on the OSM-L standard, wherein the housing is provided with a plurality of connector openings, the plurality of connector openings being arranged relative to the plurality of electrical connectors, and the plurality of electrical connectors being correspondingly exposed in the plurality of connector openings. As described in Item 1 of the patent application, in the miniature multi-type I/O computer chip module based on the OSM-L standard, the space between the interior of the housing and the I/O circuit carrier and the multi-type I/O interface module is coated and filled with a thermally conductive interface material.