TWM646248U - Motherboard assembly - Google Patents
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- TWM646248U TWM646248U TW112206948U TW112206948U TWM646248U TW M646248 U TWM646248 U TW M646248U TW 112206948 U TW112206948 U TW 112206948U TW 112206948 U TW112206948 U TW 112206948U TW M646248 U TWM646248 U TW M646248U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/659—Shield structure with plural ports for distinct connectors
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
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- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
- Detergent Compositions (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
一種主機板組件包含一電路板、至少一連接器、一擋板以及一第一限位件。至少一連接器設置於電路板並具有一連接埠。擋板具有至少一開口。至少一連接器的連接埠暴露於至少一開口。第一限位件的相異兩側分別固定於至少一連接器及擋板。A motherboard assembly includes a circuit board, at least one connector, a baffle and a first limiting component. At least one connector is disposed on the circuit board and has a connection port. The baffle has at least one opening. The connection port of at least one connector is exposed to at least one opening. Different two sides of the first limiting member are respectively fixed to at least one connector and the baffle.
Description
本新型關於一種主機板組件,特別係一種包含擋板的主機板組件。The present invention relates to a motherboard assembly, particularly a motherboard assembly including a baffle.
一般來說,在組裝電腦時,會需要先將I/O擋板組裝至機殼,才能將主機板安裝至機殼中。為了簡化電腦的組裝流程,部分廠商會將I/O擋板先安裝至主機板上的散熱鰭片組。如此一來,便能將I/O擋板及主機板的安裝整合成一個步驟。Generally speaking, when assembling a computer, you need to assemble the I/O baffle to the chassis before installing the motherboard into the chassis. In order to simplify the computer assembly process, some manufacturers will first install the I/O baffle to the cooling fin set on the motherboard. In this way, the installation of the I/O shield and motherboard can be integrated into one step.
然,不同規格的主機板上所設置的散熱鰭片組在尺寸及設置位置方面皆有可能有不同的設計。因此,某些規格的主機板上的散熱鰭片組有可能會距離I/O擋板很遠,或因尺寸過小而沒有鄰近於I/O擋板。在這樣的情況中,I/O擋板便難以透過散熱鰭片組安裝至主機板。如此一來,便會難以在簡化電腦的組裝流程之同時,使I/O擋板能安裝於不同規格的主機板。However, the heat dissipation fin groups provided on motherboards of different specifications may have different designs in terms of size and placement location. Therefore, the cooling fin set on some motherboards may be far away from the I/O shield, or may be too small to be adjacent to the I/O shield. In such a situation, it is difficult to install the I/O shield to the motherboard through the heat sink fin set. As a result, it will be difficult to simplify the assembly process of the computer while allowing the I/O shield to be installed on motherboards of different specifications.
本新型在於提供一種主機板組件,以在簡化電腦的組裝流程之同時,使擋板能安裝於不同規格的電路板。The invention provides a motherboard assembly that simplifies the computer assembly process and allows the baffle to be installed on circuit boards of different specifications.
本新型一實施例揭露之主機板組件包含一電路板、至少一連接器、一擋板以及一第一限位件。至少一連接器設置於電路板並具有一連接埠。擋板具有至少一開口。至少一連接器的連接埠暴露於至少一開口。第一限位件的相異兩側分別固定於至少一連接器及擋板。A motherboard assembly disclosed in an embodiment of the present invention includes a circuit board, at least one connector, a baffle and a first limiting member. At least one connector is disposed on the circuit board and has a connection port. The baffle has at least one opening. The connection port of at least one connector is exposed to at least one opening. Different two sides of the first limiting member are respectively fixed to at least one connector and the baffle.
根據上述實施例揭露之主機板組件,第一限位件的相異兩側分別固定於連接器及擋板。此外,連接器的連接埠會暴露於擋板的開口,而使得連接器會位於擋板的附近。因此,無論電路板具有何種規格,擋板皆能透過第一限位件固定於連接器,而不會受到散熱鰭片組的限制。如此一來,便能在簡化電腦的組裝流程之同時,使擋板能安裝於不同規格的電路板。According to the motherboard assembly disclosed in the above embodiment, two different sides of the first limiting member are fixed to the connector and the baffle respectively. In addition, the connection port of the connector is exposed to the opening of the baffle, so that the connector is located near the baffle. Therefore, no matter what specifications the circuit board has, the baffle can be fixed to the connector through the first limiting member without being restricted by the heat dissipation fin set. In this way, the baffle can be installed on circuit boards of different specifications while simplifying the assembly process of the computer.
以下在實施方式中詳細敘述本新型之實施例之詳細特徵以及優點,其內容足以使任何本領域中具通常知識者了解本新型之實施例之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何本領域中具通常知識者可輕易地理解本新型相關之目的及優點。以下之實施例係進一步詳細說明本新型之觀點,但非以任何觀點限制本新型之範疇。The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation mode. The content is sufficient to enable anyone with ordinary knowledge in the art to understand the technical content of the embodiments of the present invention and implement them accordingly, and based on the disclosure in this specification With the content, patent scope and drawings, anyone with ordinary knowledge in the art can easily understand the relevant purposes and advantages of the present invention. The following examples are intended to further illustrate the concepts of the present invention in detail, but are not intended to limit the scope of the present invention in any way.
請參閱圖1至圖3,圖1為根據本新型第一實施例的主機板組件之立體圖的局部放大圖。圖2為圖1中的主機板組件於另一視角之立體圖的局部放大圖。圖3為圖1中的主機板組件的分解圖。於本實施例中,主機板組件10包含一電路板100、多個連接器210、220、230、一擋板300、多個第一限位件410、420、430、二定位件500、多個墊塊550及二第二限位件600。Please refer to FIGS. 1 to 3 . FIG. 1 is a partially enlarged perspective view of a motherboard assembly according to the first embodiment of the present invention. FIG. 2 is a partially enlarged perspective view of the motherboard assembly in FIG. 1 from another perspective. FIG. 3 is an exploded view of the motherboard assembly in FIG. 1 . In this embodiment, the
連接器210、220、230設置並電性連接於電路板100。連接器210、220、230分別具有多個連接埠211、221、231。
於本實施例中,擋板300例如為I/O擋板,並包含一本體部310、一第一安裝凸部320及二第二安裝凸部330。本體部310具有多個開口311。連接器210、220、230的連接埠211、221、231分別暴露於這些開口311。第一安裝凸部320凸出於本體部310。並且,連接器210、220、230介於第一安裝凸部320及電路板100之間。第一安裝凸部320具有一安裝槽321及一卡槽322。二第二安裝凸部330凸出於本體部310且彼此分離。此外,二第二安裝凸部330分離於第一安裝凸部320。In this embodiment, the
請參閱圖3及圖4,圖4為呈現圖1中的主機板組件的其中一個第一限位件之剖面示意圖。第一限位件410的相異兩側分別固定於連接器210及擋板300,且連接器210介於至少部分的第一限位件410及電路板100之間。詳細來說,於本實施例中,第一限位件410包含一銜接板部411、一延伸凸部412、一推抵板部413及一凸舌部414。銜接板部411位於連接器210遠離電路板100之一側。延伸凸部412及推抵板部413立於銜接板部411靠近連接器210的一側且彼此分離。推抵板部413抵靠於連接器210遠離擋板300的本體部310的一側。延伸凸部412位於安裝槽321中而受第一安裝凸部320中形成安裝槽321的一壁面323止擋。凸舌部414立於延伸凸部412遠離銜接板部411的一側。也就是說,延伸凸部412及凸舌部414例如共同形成一段差。此外,凸舌部414固定於第一安裝凸部320及連接器210之間。Please refer to FIGS. 3 and 4 . FIG. 4 is a schematic cross-sectional view showing one of the first limiting members of the motherboard assembly in FIG. 1 . Different sides of the first limiting
此外,如圖4所示,銜接板部411及推抵板部413之間的夾角θ例如介於30度至60度之間,如45度,而使得推抵板部413能牢固地抵靠於連接器210。In addition, as shown in FIG. 4 , the included angle θ between the connecting
請參閱圖3及圖5,圖5為呈現圖1中的主機板組件的另一個第一限位件之剖面示意圖。第一限位件420的相異兩側分別固定於連接器220及擋板300,且連接器220介於至少部分的第一限位件420及電路板100之間。詳細來說,於本實施例中,第一限位件420包含一銜接板部421、一卡勾板部422及一推抵板部423。銜接板部421位於連接器220遠離電路板100之一側。卡勾板部422及推抵板部423立於銜接板部421靠近連接器220的一側且彼此分離。推抵板部423抵靠於連接器220遠離擋板300的本體部310一側。卡勾板部422位於卡槽322中而扣合於部分的第一安裝凸部320。Please refer to FIG. 3 and FIG. 5 . FIG. 5 is a schematic cross-sectional view showing another first limiting member of the motherboard assembly in FIG. 1 . Different sides of the first limiting
請參閱圖3、圖6及圖7,圖6為呈現圖1中的主機板組件的再另一個第一限位件之剖面示意圖。圖7為圖6中的第一限位件沿另一視角的剖面示意圖。第一限位件430的相異兩側分別固定於連接器230及擋板300,且連接器230介於至少部分的第一限位件430及電路板100之間。詳細來說,於本實施例中,第一限位件430包含一銜接板部431及一推抵板部432。銜接板部431位於這些連接器230遠離電路板100之一側,且可滑動地設置於第一安裝凸部320。定位件500定位銜接板部431及第一安裝凸部320。具體來說,於本實施例中,銜接板部431具有二滑槽4310,且定位件500例如為螺絲。二定位件500的身部510分別可滑動地設置於二滑槽4310中,並螺鎖於第一安裝凸部320。此外,如圖7所示,銜接板部431介於二定位件500的頭部520及第一安裝凸部320之間。推抵板部432立於銜接板部431靠近連接器230的一側,並位於這些連接器230遠離擋板300的本體部310之一側。這些墊塊550分別夾設於推抵板部432及這些連接器230之間。這些墊塊550例如由撓性材料製成,如橡膠。此外,製成墊塊550的橡膠例如為自黏式橡膠。Please refer to FIG. 3 , FIG. 6 and FIG. 7 . FIG. 6 is a schematic cross-sectional view showing yet another first limiting member of the motherboard assembly in FIG. 1 . FIG. 7 is a schematic cross-sectional view of the first limiting member in FIG. 6 taken from another perspective. Different sides of the first limiting
請參閱圖8,圖8為圖6中的第一限位件沿再另一視角的剖面示意圖。於本實施例中,這些連接器230分別以不同的最小距離D1、D2與推抵板部432相間隔。此外,其中一個連接器230與推抵板部432之間沒有設置墊塊。Please refer to FIG. 8 , which is a schematic cross-sectional view of the first limiting member in FIG. 6 taken from another perspective. In this embodiment, the
於其他實施例中,主機板組件亦可僅包含一個墊塊550。或者,於再其他實施例中,主機板組件亦可無需包含墊塊550,且圖6中的推抵板部亦可改為直接與連接器230相接觸。In other embodiments, the motherboard assembly may only include one
請再次參閱圖1及圖3,於本實施例中,主機板組件10可更包含一連接器240、一第一限位件440、一墊塊560及二螺絲570。連接器240設置於電路板100。並介於第一安裝凸部320及電路板100之間。第一限位件440例如透過二螺絲570固定於第一安裝凸部320,並呈板狀。墊塊560例如為自黏式橡膠,並夾設於第一限位件440及連接器240之間,以防止第一限位件440相對連接器240沿一前後方向移動。Please refer to FIG. 1 and FIG. 3 again. In this embodiment, the
須注意的是,根據本新型的主機板組件10並不限於同時包含不同形式的第一限位件410、420、430、440。於其他實施例中,主機板組件亦可僅包含第一限位件410、420、430、440其中至少一者,或是包含其他形式的限位件。此外,在主機板組件僅包含其中一個第一限位件410、420、430、440的實施例中,主機板組件亦可僅包含一個連接器。It should be noted that the
請參閱圖9,圖9為圖1中的主機板組件安裝於機殼的剖面示意圖。二第二限位件600例如為螺絲,且分別穿設於二第二安裝凸部330。此外,二第二限位件600穿設於電路板100。因此,二第二限位件600會對第二安裝凸部330及電路板100進行限位。二第二限位件600例如用以螺鎖於機殼20。Please refer to FIG. 9 , which is a schematic cross-sectional view of the motherboard assembly in FIG. 1 installed on the chassis. The two second limiting
以下將列舉其他實施例以作為說明。在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。Other examples will be listed below as illustrations. It must be noted here that the following embodiments follow the component numbers and part of the content of the previous embodiments, where the same numbers are used to represent the same or similar elements, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in the following embodiments.
本新型並不以第二限位件的形式為限。請參閱圖10及圖11,圖10為根據本新型第二實施例的主機板組件之分解圖。圖11為圖10中的主機板組件安裝於機殼的剖面示意圖。本實施例的主機板組件10a與第一實施例的主機板組件10之間的差異僅在於本實施例的第二限位件600a係採用固定柱形式。詳細來說,於本實施例中,第二限位件600a以緊配的方式穿設於第二安裝凸部330、電路板100及機殼20。The present invention is not limited to the form of the second limiting member. Please refer to FIG. 10 and FIG. 11 . FIG. 10 is an exploded view of the motherboard assembly according to the second embodiment of the present invention. FIG. 11 is a schematic cross-sectional view of the motherboard assembly in FIG. 10 installed on the chassis. The only difference between the
根據上述實施例揭露之主機板組件,第一限位件的相異兩側分別固定於連接器及擋板。此外,連接器的連接埠會暴露於擋板的開口,而使得連接器會位於擋板的附近。因此,無論電路板具有何種規格,擋板皆能透過第一限位件固定於連接器,而不會受到散熱鰭片組的限制。如此一來,便能在簡化電腦的組裝流程之同時,使擋板能安裝於不同規格的電路板。According to the motherboard assembly disclosed in the above embodiment, two different sides of the first limiting member are fixed to the connector and the baffle respectively. In addition, the connection port of the connector is exposed to the opening of the baffle, so that the connector is located near the baffle. Therefore, no matter what specifications the circuit board has, the baffle can be fixed to the connector through the first limiting member without being restricted by the heat dissipation fin set. In this way, the baffle can be installed on circuit boards of different specifications while simplifying the assembly process of the computer.
此外,連接器介於至少部分的第一限位件及電路板之間。也就是說,第一限位件是透過連接器的頂側進行固定。因此,無論電路板上的連接器之數量或尺寸為何,擋板皆能透過第一限位件固定至連接器。尤其是對低階電腦來說,即使連接器相對電路板的高度較低而難以透過連接器的側邊進行固定,透過連接器的頂側進行固定的第一限位件仍能穩固地將擋板固定至連接器。In addition, the connector is between at least part of the first limiting component and the circuit board. That is to say, the first limiting member is fixed through the top side of the connector. Therefore, regardless of the number or size of connectors on the circuit board, the baffle can be fixed to the connectors through the first limiting member. Especially for low-end computers, even if the height of the connector relative to the circuit board is low and it is difficult to fix it through the sides of the connector, the first stopper fixed through the top side of the connector can still firmly block the connector. The board is secured to the connector.
雖然本新型以前述之諸項實施例揭露如上,然其並非用以限定本新型,任何熟習相像技藝者,在不脫離本新型之精神和範圍內,當可作些許之更動與潤飾,因此本新型之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the foregoing embodiments, they are not intended to limit the present invention. Anyone skilled in the art of modeling can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention is The scope of patent protection for a new model shall be determined by the scope of the patent application attached to this specification.
10, 10a:主機板組件
100:電路板
210, 220, 230, 240:連接器
211, 221, 231:連接埠
300:擋板
310:本體部
311:開口
320:第一安裝凸部
321:安裝槽
322:卡槽
323:壁面
330:第二安裝凸部
410, 420, 430, 440:第一限位件
411:銜接板部
412:延伸凸部
413:推抵板部
414:凸舌部
421:銜接板部
422:卡勾板部
423:推抵板部
431:銜接板部
4310:滑槽
432:推抵板部
500:定位件
510:身部
520:頭部
550:墊塊
560:墊塊
570:螺絲
600, 600a:第二限位件
20:機殼
θ:夾角
D1, D2:最小距離
10, 10a: Motherboard components
100:
圖1為根據本新型第一實施例的主機板組件之立體圖的局部放大圖。 圖2為圖1中的主機板組件於另一視角之立體圖的局部放大圖。 圖3為圖1中的主機板組件的分解圖。 圖4為呈現圖1中的主機板組件的其中一個第一限位件之剖面示意圖。 圖5為呈現圖1中的主機板組件的另一個第一限位件之剖面示意圖。 圖6為呈現圖1中的主機板組件的再另一個第一限位件之剖面示意圖。 圖7為圖6中的第一限位件沿另一視角的剖面示意圖。 圖8為圖6中的第一限位件沿再另一視角的剖面示意圖。 圖9為圖1中的主機板組件安裝於機殼的剖面示意圖。 圖10為根據本新型第二實施例的主機板組件之分解圖。 圖11為圖10中的主機板組件安裝於機殼的剖面示意圖。 FIG. 1 is a partially enlarged perspective view of a motherboard assembly according to the first embodiment of the present invention. FIG. 2 is a partially enlarged perspective view of the motherboard assembly in FIG. 1 from another perspective. FIG. 3 is an exploded view of the motherboard assembly in FIG. 1 . FIG. 4 is a schematic cross-sectional view showing one of the first limiting members of the motherboard assembly in FIG. 1 . FIG. 5 is a schematic cross-sectional view of another first limiting member of the motherboard assembly in FIG. 1 . FIG. 6 is a schematic cross-sectional view of yet another first limiting member of the motherboard assembly in FIG. 1 . FIG. 7 is a schematic cross-sectional view of the first limiting member in FIG. 6 taken from another perspective. FIG. 8 is a schematic cross-sectional view of the first limiting member in FIG. 6 taken from another perspective. FIG. 9 is a schematic cross-sectional view of the motherboard assembly in FIG. 1 installed on the chassis. FIG. 10 is an exploded view of the motherboard assembly according to the second embodiment of the present invention. FIG. 11 is a schematic cross-sectional view of the motherboard assembly in FIG. 10 installed on the chassis.
10:主機板組件 10: Motherboard components
100:電路板 100:Circuit board
210,220,230,240:連接器 210,220,230,240: Connector
300:擋板 300:Baffle
310:本體部 310: Ontology Department
311:開口 311:Open your mouth
320:第一安裝凸部 320: First installation convex part
321:安裝槽 321:Installation slot
322:卡槽 322:Card slot
330:第二安裝凸部 330: Second installation convex part
410,420,430,440:第一限位件 410,420,430,440: first limiter
411:銜接板部 411:Connecting board part
412:延伸凸部 412: Extended convex part
413:推抵板部 413: Push against the board
414:凸舌部 414: Tongue part
421:銜接板部 421:Connecting board part
422:卡勾板部 422: Hook plate part
423:推抵板部 423: Push against the board
431:銜接板部 431:Connecting board part
432:推抵板部 432: Push against the board
500:定位件 500: Positioning parts
510:身部 510:Body
520:頭部 520:Head
550:墊塊 550: spacer
560:墊塊 560: spacer
570:螺絲 570:Screw
600:第二限位件 600: Second limiter
Claims (11)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112206948U TWM646248U (en) | 2023-07-05 | 2023-07-05 | Motherboard assembly |
| DE202023104566.9U DE202023104566U1 (en) | 2023-07-05 | 2023-08-11 | Motherboard arrangement |
| JP2023002948U JP3244135U (en) | 2023-07-05 | 2023-08-16 | motherboard assembly |
| CN202322496364.0U CN221058488U (en) | 2023-07-05 | 2023-09-13 | Motherboard assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112206948U TWM646248U (en) | 2023-07-05 | 2023-07-05 | Motherboard assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM646248U true TWM646248U (en) | 2023-09-11 |
Family
ID=88241571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112206948U TWM646248U (en) | 2023-07-05 | 2023-07-05 | Motherboard assembly |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3244135U (en) |
| CN (1) | CN221058488U (en) |
| DE (1) | DE202023104566U1 (en) |
| TW (1) | TWM646248U (en) |
-
2023
- 2023-07-05 TW TW112206948U patent/TWM646248U/en unknown
- 2023-08-11 DE DE202023104566.9U patent/DE202023104566U1/en active Active
- 2023-08-16 JP JP2023002948U patent/JP3244135U/en active Active
- 2023-09-13 CN CN202322496364.0U patent/CN221058488U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN221058488U (en) | 2024-05-31 |
| DE202023104566U1 (en) | 2023-12-21 |
| JP3244135U (en) | 2023-10-13 |
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