TWM539763U - Interface card fluid heat dissipation fixing device - Google Patents
Interface card fluid heat dissipation fixing device Download PDFInfo
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- TWM539763U TWM539763U TW105218085U TW105218085U TWM539763U TW M539763 U TWM539763 U TW M539763U TW 105218085 U TW105218085 U TW 105218085U TW 105218085 U TW105218085 U TW 105218085U TW M539763 U TWM539763 U TW M539763U
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- interface card
- heat
- water
- cooling device
- water cooling
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H10W40/43—
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- H10W40/47—
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Description
本新型為提供一種介面卡流體散熱之固定裝置,尤指一種可方便組裝於介面卡上而不會使管路鬆脫造成漏水,且可快速連接其他冷卻裝置的介面卡流體散熱之固定裝置。 The utility model provides a fixing device for fluid cooling of an interface card, in particular to a fixing device which can be easily assembled on an interface card without loosening the pipeline to cause water leakage, and can quickly connect the other card to the cooling device.
按,電子裝置之介面卡等電子元件,在工作時會產生大量之熱量,如果不及時散熱就會造成電子元件的溫度過高,而由於電子元件於高溫下工作時,其工作效率會降低、甚至燒毀,故,為降低電子元件之溫度,通常會在電子元件上設有散熱裝置,以加快散熱。惟,電子裝置的體積不斷縮小,想要在狹窄的空間中設置多組散熱裝置,以冷熱空氣對流的方式達成散熱之目的,其實並不容易,因此,改以水冷式散熱裝置對電子元件進行散熱,為目前散熱系統的趨勢,此裝置會包含有進水管及排水管,該水冷式散熱裝置工作時,係透過馬達或幫浦的作動,將冷卻液體從進水管導入,同時將吸收電子元件熱量後的冷卻液體從排水管導出,而吸收電子元件熱量後的冷卻液體經過散熱排的降溫後,再流回水冷式散熱裝置對電子元件進行散熱,從而達到快速進行熱交換之冷卻循環目的。 According to the electronic components such as the interface card of the electronic device, a large amount of heat is generated during operation. If the heat is not dissipated in time, the temperature of the electronic component is too high, and the working efficiency of the electronic component is lowered when the electronic component is operated at a high temperature. Even burning, therefore, in order to reduce the temperature of the electronic components, a heat sink is usually provided on the electronic components to accelerate heat dissipation. However, the volume of electronic devices is shrinking. It is not easy to set up multiple sets of heat sinks in a narrow space to achieve heat dissipation by means of convection of hot and cold air. Therefore, the electronic components are replaced by water-cooled heat sinks. The heat dissipation is the trend of the current heat dissipation system. The device will include an inlet pipe and a drain pipe. When the water-cooling heat sink works, the cooling liquid is introduced from the inlet pipe through the operation of the motor or the pump, and the electronic component is absorbed. The cooling liquid after the heat is discharged from the drain pipe, and the cooling liquid after absorbing the heat of the electronic component is cooled by the heat dissipation row, and then flows back to the water-cooling heat dissipating device to dissipate heat of the electronic component, thereby achieving the purpose of rapid heat exchange cooling cycle.
然上述習用之水冷式散熱裝置,在安裝於介面卡上時,可能會因為拉扯到管路或是管路接合不完全而使管路鬆脫造成漏水,然而電子元件碰到水通常會有漏電或是損壞的危險,並且需要同時使用多個水冷式散熱裝置時,由於需要更多管路連接,更增加了管路漏水的風險,在使用上實為不便。 However, the above-mentioned conventional water-cooled heat dissipating device may be leaking due to looseness of the pipe due to incomplete pipe jointing or incomplete pipe connection when installed on the interface card, but the electronic component often leaks when it hits the water. Or the danger of damage, and when multiple water-cooled heat sinks need to be used at the same time, the need for more pipeline connections increases the risk of water leakage in the pipeline, which is inconvenient to use.
是以,要如何解決上述習用之問題與缺失,即為本新型之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and problems in the past, that is, the creators of the new type and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
故,本新型之申請人有鑑於上述缺失,乃蒐集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種可方便組裝於介面卡上而不會使管路鬆脫造成漏水,且可快速連接其他冷卻裝置的介面卡流體散熱之固定裝置的新型專利者。 Therefore, in view of the above-mentioned shortcomings, the applicants of this new type have collected relevant information, evaluated and considered by many parties, and have accumulated many years of experience in the industry, and through continuous trial and modification, they have been designed to be easily assembled into the interface. A new type of patented device that can be used to secure a device that can quickly connect to other cooling devices.
本新型之主要目的在於:透過水冷裝置、熱引流管、及冷引流管的設計得以利用流體快速地冷卻介面卡,使介面卡穩定運作。 The main purpose of the present invention is to enable the interface card to be stably operated by rapidly cooling the interface card through the design of the water cooling device, the heat drainage tube, and the cold drainage tube.
本新型之再一主要目的在於:透過固定結構的設計得以固定熱引流管及冷引流管,避免因為人為組裝疏失而使管路脫落造成漏水。 Another main object of the present invention is to fix the heat drainage tube and the cold drainage tube through the design of the fixed structure, so as to avoid leakage of the pipeline due to the loss of artificial assembly.
本新型之又一主要目的在於:透過第一快速接頭及第二快速接頭的設計得以快速連接其他水冷裝置或散熱排,在使用上相當方便。 Another main purpose of the present invention is to quickly connect other water-cooling devices or heat-dissipating rows through the design of the first quick connector and the second quick connector, which is quite convenient in use.
本新型能夠達成上述目的之主要結構包括有一設於介面卡上之水冷裝置,係供冷卻介面卡,而水冷裝置上設有一冷引流管,係供溫度較低之水流進水冷裝置,並水冷裝置上設有一熱引流管,係供進行熱交換後之溫度高的水流出,更重要的是,冷引流管及熱引流管上背離該水冷裝置之一端分別設有一第一快速接頭及第二快速接頭,可快速連接其他水冷裝置或散熱排,再者,介面卡一側設有一固定裝置,係供固定該熱引流管及該冷引流管;如此,當使用者裝設水冷裝置或是連接複數個水冷裝置時,管路被固定而不會因為拉扯而鬆脫,並利用快速接頭連接,達到方便及安全的功效,實為具有進步性。 The main structure of the present invention capable of achieving the above object includes a water cooling device disposed on the interface card for cooling the interface card, and a water cooling device is provided with a cold drainage tube for supplying water with a lower temperature into the water cooling device, and the water cooling device The utility model is provided with a heat drainage tube for discharging water with high temperature after heat exchange, more importantly, a first quick joint and a second fast are respectively arranged on one end of the cold drainage tube and the heat drainage tube facing away from the water cooling device. The connector can be quickly connected to other water-cooling devices or heat-dissipating pipes. Further, a fixing device is arranged on one side of the interface card for fixing the heat-draining pipe and the cold-draining pipe; thus, when the user installs the water-cooling device or connects the plurality of In a water-cooling device, the pipeline is fixed without loosening due to pulling, and the quick joint connection is used to achieve convenient and safe effects, which is indeed progressive.
藉由上述技術,可針對習用之水冷式散熱裝置之可能會因為拉扯到管路或是接合不完全而使管路鬆脫造成漏水,造成電子元件漏電或是損壞,及需要同時使用多個水冷式散熱裝置時,增加了管路漏水的風險問題加以突破,達到本新型如上述優點之實用進步性。 With the above technology, the water-cooled heat sink of the conventional device may be leaky due to looseness of the pipeline due to pulling to the pipeline or incomplete connection, causing leakage or damage of the electronic component, and requiring multiple water cooling at the same time. In the case of the heat dissipating device, the risk of leakage of the pipeline is increased to break through, and the practical advancement of the present invention as described above is achieved.
1、1a‧‧‧水冷裝置 1, 1a‧‧‧ water cooling device
11、11a‧‧‧冷引流管 11, 11a‧‧‧ cold drainage tube
111、111a‧‧‧第一快速接頭 111, 111a‧‧‧ first quick connector
112、112a‧‧‧第二快速接頭 112, 112a‧‧‧Second quick connector
12、12a‧‧‧熱引流管 12, 12a‧‧‧heat drainage tube
13‧‧‧結合部 13‧‧‧Combination Department
14‧‧‧導熱片 14‧‧‧ Thermal sheet
15‧‧‧密合部 15‧‧‧ Closed Department
2‧‧‧固定結構 2‧‧‧Fixed structure
3‧‧‧散熱風扇 3‧‧‧ cooling fan
31‧‧‧散熱鰭片 31‧‧‧ Heat sink fins
4‧‧‧外殼體 4‧‧‧Outer casing
5‧‧‧介面卡 5‧‧‧Interface card
6、6a‧‧‧散熱排 6, 6a‧‧‧ heat dissipation row
第一圖 係為本新型較佳實施例之立體圖。 The first figure is a perspective view of a preferred embodiment of the present invention.
第二圖 係為本新型較佳實施例之透視圖。 The second drawing is a perspective view of a preferred embodiment of the present invention.
第三圖 係為本新型較佳實施例之作動示意圖。 The third diagram is a schematic diagram of the operation of the preferred embodiment of the present invention.
第四圖 係為本新型再一較佳實施例之串聯示意圖。 The fourth figure is a series diagram of another preferred embodiment of the present invention.
為達成上述目的及功效,本新型所採用之技術手段及構造,茲繪圖就本新型較佳實施例詳加說明其特徵與功能如下,俾利完全了解。 In order to achieve the above objects and effects, the technical means and structure adopted by the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions thereof are as follows.
請參閱第一圖及第二圖所示,係為本新型較佳實施例之立體圖及透視圖,由圖中可清楚看出本新型係包括:一設於介面卡5上之水冷裝置1,係供冷卻介面卡5,而水冷裝置1與介面卡5之間設有至少一導熱片14,且水冷裝置1上設有複數個結合部13,係供結合介面卡5;一設於該水冷裝置1上之冷引流管11,於冷引流管11上且背離該水冷裝置1一端設有一第一快速接頭111;一設於該水冷裝置1上且位於該冷引流管11一側之熱引流管12,熱引流管12上且背離該水冷裝置1一端設有一第二快速接頭112;複數個設於該水冷裝置1上之密合部15,係供結合該熱引流管12及該冷引流管11;一設於於該介面卡5一側之固定結構2,係供固定該熱引流管12及該冷引流管11;一設於該水冷裝置1一側之散熱風扇3,該散熱風扇3上設有至少一散熱鰭片31;及一設於該水冷裝置1及該散熱風扇3上之外殼體4。 Please refer to the first and second figures, which are perspective views and perspective views of a preferred embodiment of the present invention. It is clear from the drawings that the present invention comprises: a water cooling device 1 disposed on the interface card 5, The cooling interface card 5 is provided, and at least one heat conducting sheet 14 is disposed between the water cooling device 1 and the interface card 5, and the water cooling device 1 is provided with a plurality of joint portions 13 for combining the interface cards 5; The cold draft tube 11 on the device 1 is provided with a first quick joint 111 on the cold draft tube 11 and away from the end of the water cooling device 1; a hot drain disposed on the water cooling device 1 and located on the side of the cold drain tube 11 a tube 12, a second quick joint 112 disposed on one end of the heat drain tube 12 and facing away from the water cooling device 1; a plurality of closely fitting portions 15 disposed on the water cooling device 1 for combining the heat drain tube 12 and the cold drainage tube a fixing structure 2 disposed on one side of the interface card 5 for fixing the heat drainage tube 12 and the cold drainage tube 11; a cooling fan 3 disposed on one side of the water cooling device 1, the cooling fan 3 is provided with at least one heat dissipation fin 31; and one is disposed on the water cooling device 1 and the heat dissipation fan 3 4.
請同時配合參閱第一圖至第三圖所示,係為本新型較佳實施例之立體圖至作動示意圖,由圖中可清楚看出,水冷裝置1透過結合部13結合於介面卡5上,而水冷裝置1與介面卡5之間設有導熱片14,可將介面卡5上的熱量快速地傳導至水冷裝置1,水冷裝置1係為一水冷幫浦,利用冷卻液體吸收介面卡5的熱量,而因為水擁有比熱大、成本低、及容易取得的特性,所以冷卻液體通常為水;溫度較低的水由冷引流管11流進水冷裝置1,吸收介面卡5的熱量後由熱引流管12流出,而流出水冷裝置1溫度較高的水會經過散熱排6的降溫後,再流回水冷裝置1對介面卡5進行散熱,達到快速進行熱交換之冷卻循環目的;再者,透過固定結構2的設計,固定冷引流管11及熱引流管12,讓使用者在裝設水冷裝置1時,不會因為人為組裝疏失造成管路鬆脫而漏水,產生介面卡5等電子元件的損壞或發生漏電的危險,而密合部15使冷引 流管11及熱引流管12緊密結合於水冷裝置1上,更減低漏水的風險,並且冷引流管11及熱引流管12上分別設有第一快速接頭111及第二快速接頭112,可方便快速地結合於散熱排6或其他水冷裝置1,另外,在水冷裝置1一側設有散熱風扇3及散熱鰭片31,可強化對介面卡5的降溫效果,使介面卡5能正常運作,而不會因為過熱而故障,而外殼體4可保護水冷裝置1及散熱風扇3的管路。 Please refer to the first to third figures, which are schematic views of the preferred embodiment of the present invention. It is clear from the figure that the water cooling device 1 is coupled to the interface card 5 through the joint portion 13, The heat-dissipating sheet 14 is disposed between the water-cooling device 1 and the interface card 5, and the heat on the interface card 5 can be quickly transmitted to the water-cooling device 1. The water-cooling device 1 is a water-cooled pump, and the interface card 5 is absorbed by the cooling liquid. Heat, and because water has characteristics that are larger than heat, low in cost, and easy to obtain, the cooling liquid is usually water; the lower temperature water flows into the water cooling device 1 from the cold drainage tube 11, and absorbs the heat of the interface card 5 by the heat. The drain pipe 12 flows out, and the water having a higher temperature flowing out of the water-cooling device 1 passes through the cooling pipe 6 and then flows back to the water-cooling device 1 to dissipate heat to the interface card 5, thereby achieving the purpose of rapid heat exchange cooling cycle; Through the design of the fixed structure 2, the cold draft tube 11 and the heat drain tube 12 are fixed, so that when the water-cooling device 1 is installed, the user does not leak water due to the looseness of the assembly due to human assembly, and the electronic components such as the interface card 5 are generated. of Bad or danger from leakage, and the adhesion of the cold lead section 15 The flow tube 11 and the heat drainage tube 12 are tightly coupled to the water-cooling device 1 to further reduce the risk of water leakage, and the first quick connector 111 and the second quick connector 112 are respectively disposed on the cold drainage tube 11 and the heat drainage tube 12, which is convenient. Quickly combined with the heat sink 6 or other water-cooling device 1 , and further provided with a heat-dissipating fan 3 and a heat-dissipating fin 31 on the side of the water-cooling device 1 , which can enhance the cooling effect on the interface card 5 and enable the interface card 5 to operate normally. The outer casing 4 can protect the piping of the water cooling device 1 and the cooling fan 3 without failure due to overheating.
請參閱第四圖所示,係為本新型再一較佳實施例之串聯示意圖,由圖中可清楚看出,若有複數個介面卡需要降溫,則可裝設複數個水冷裝置1a,並透過第一快速接頭111a及第二快速接頭112a的結合,使冷引流管11a及熱引流管12a連接,而達到水冷裝置1a及另一水冷裝置1a的串聯,並且再串聯一散熱排6a,如此,可節省水冷裝置1a的裝設空間,並兼具整體美觀性。 Please refer to the fourth figure, which is a series diagram of another preferred embodiment of the present invention. It can be clearly seen from the figure that if a plurality of interface cards need to be cooled, a plurality of water cooling devices 1a can be installed, and The cold draft tube 11a and the heat drain tube 12a are connected by the combination of the first quick joint 111a and the second quick joint 112a, and the water cooling device 1a and the other water cooling device 1a are connected in series, and a heat dissipation row 6a is connected in series. The installation space of the water-cooling device 1a can be saved, and the overall aesthetics can be achieved.
惟,以上所述僅為本新型之較佳實施例而已,非因此即侷限本新型之專利範圍,故舉凡運用本新型說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本新型之專利範圍內,合予陳明。 However, the above description is only the preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, all the simple modifications and equivalent structural changes that are made by using the present specification and the drawings are the same. It is included in the scope of this new patent and is given to Chen Ming.
故,請參閱全部附圖所示,本新型使用時,與習用技術相較,著實存在下列優點: Therefore, please refer to all the drawings, when compared with the conventional technology, the present invention has the following advantages:
一、透過水冷裝置1、熱引流管12、及冷引流管11的設計得以利用流體快速地冷卻介面卡5,使介面卡5穩定運作。 1. The design of the water-cooling device 1, the heat-draining tube 12, and the cold-draining tube 11 enables the interface card 5 to be quickly cooled by the fluid to stabilize the interface card 5.
二、透過固定結構2的設計得以固定熱引流管12及冷引流管11,避免因為人為組裝疏失而使管路脫落造成漏水。 Second, through the design of the fixed structure 2, the heat drainage tube 12 and the cold drainage tube 11 can be fixed to avoid water leakage due to the loss of the artificial assembly.
三、透過第一快速接頭111及第二快速接頭112的設計得以快速連接其他水冷裝置1或散熱排6,在使用上相當方便。 Third, through the design of the first quick connector 111 and the second quick connector 112, the other water-cooling device 1 or the heat dissipation row 6 can be quickly connected, which is quite convenient in use.
綜上所述,本新型之介面卡流體散熱之固定裝置於使用時,為確實能達到其功效及目的,故本新型誠為一實用性優異之創作,為符合新型專利之申請要件,爰依法提出申請,盼 審委早日賜准本新型,以保障創作人之辛苦創作,倘若 鈞局審委有任何稽疑,請不吝來函指示,創作人定當竭力配合,實感德便。 In summary, the new type of interface card fluid heat dissipation fixing device can achieve its efficacy and purpose when used, so the novel is a practical and excellent creation, in order to meet the requirements of the new patent application, To file an application, I hope that the trial committee will grant this new type as soon as possible to protect the creators' hard work. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creators will try their best to cooperate and feel good.
1‧‧‧水冷裝置 1‧‧‧Water cooling unit
11‧‧‧冷引流管 11‧‧‧Cold drainage tube
111‧‧‧第一快速接頭 111‧‧‧First quick connector
112‧‧‧第二快速接頭 112‧‧‧Second quick connector
12‧‧‧熱引流管 12‧‧‧Hot drainage tube
13‧‧‧結合部 13‧‧‧Combination Department
14‧‧‧導熱片 14‧‧‧ Thermal sheet
15‧‧‧密合部 15‧‧‧ Closed Department
2‧‧‧固定結構 2‧‧‧Fixed structure
3‧‧‧散熱風扇 3‧‧‧ cooling fan
31‧‧‧散熱鰭片 31‧‧‧ Heat sink fins
5‧‧‧介面卡 5‧‧‧Interface card
Claims (8)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105218085U TWM539763U (en) | 2016-11-25 | 2016-11-25 | Interface card fluid heat dissipation fixing device |
| CN201721041994.7U CN207305229U (en) | 2016-11-25 | 2017-08-18 | Fixing device for interface card fluid cooling |
| JP2017003945U JP3213431U (en) | 2016-11-25 | 2017-08-29 | Interface card fluid heat radiation fixing device |
| KR2020170004886U KR200491304Y1 (en) | 2016-11-25 | 2017-09-15 | Fixing device for fluid heat dissipation of interface card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105218085U TWM539763U (en) | 2016-11-25 | 2016-11-25 | Interface card fluid heat dissipation fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM539763U true TWM539763U (en) | 2017-04-11 |
Family
ID=59255378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105218085U TWM539763U (en) | 2016-11-25 | 2016-11-25 | Interface card fluid heat dissipation fixing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3213431U (en) |
| KR (1) | KR200491304Y1 (en) |
| CN (1) | CN207305229U (en) |
| TW (1) | TWM539763U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD191875S (en) | 2017-11-10 | 2018-07-21 | 雙鴻科技股份有限公司 | A water cooling device |
| TWD193266S (en) | 2017-11-10 | 2018-10-01 | 雙鴻科技股份有限公司 | A water cooling device having two thin tanks |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06266474A (en) * | 1993-03-17 | 1994-09-22 | Hitachi Ltd | Electronic apparatus equipment and lap top electronic apparatus equipment |
| US6796370B1 (en) * | 2000-11-03 | 2004-09-28 | Cray Inc. | Semiconductor circular and radial flow cooler |
| KR100465088B1 (en) * | 2002-02-08 | 2005-01-06 | 쿨랜스코리아 주식회사 | The water cooling system for electronic device |
| JP2006210885A (en) * | 2004-12-27 | 2006-08-10 | Matsushita Electric Ind Co Ltd | Cooling system |
-
2016
- 2016-11-25 TW TW105218085U patent/TWM539763U/en unknown
-
2017
- 2017-08-18 CN CN201721041994.7U patent/CN207305229U/en not_active Expired - Fee Related
- 2017-08-29 JP JP2017003945U patent/JP3213431U/en not_active Expired - Fee Related
- 2017-09-15 KR KR2020170004886U patent/KR200491304Y1/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD191875S (en) | 2017-11-10 | 2018-07-21 | 雙鴻科技股份有限公司 | A water cooling device |
| TWD193266S (en) | 2017-11-10 | 2018-10-01 | 雙鴻科技股份有限公司 | A water cooling device having two thin tanks |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3213431U (en) | 2017-11-09 |
| KR200491304Y1 (en) | 2020-03-18 |
| CN207305229U (en) | 2018-05-01 |
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