TW201433250A - Cooling module - Google Patents
Cooling module Download PDFInfo
- Publication number
- TW201433250A TW201433250A TW102104096A TW102104096A TW201433250A TW 201433250 A TW201433250 A TW 201433250A TW 102104096 A TW102104096 A TW 102104096A TW 102104096 A TW102104096 A TW 102104096A TW 201433250 A TW201433250 A TW 201433250A
- Authority
- TW
- Taiwan
- Prior art keywords
- hollow tube
- heat
- tube
- outlet
- inlet
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 46
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 230000017525 heat dissipation Effects 0.000 claims description 68
- 238000001802 infusion Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明係關於一種散熱模組，特別是一種用於電子元件的散熱模組。 The invention relates to a heat dissipation module, in particular to a heat dissipation module for an electronic component.
電腦主機中的各種電子裝置在運作時，需要考慮到將電子裝置所產生的熱能導出，以避免電子裝置因過熱而損壞。 When various electronic devices in the computer mainframe are in operation, it is necessary to take into consideration the heat energy generated by the electronic device to prevent the electronic device from being damaged due to overheating.
傳統之散熱模組主要包括一散熱器、一風扇以及一水冷管，並且散熱器設有一導熱基板，導熱基板上又設有複數個散熱鰭片，其中，導熱基板是用來接觸熱源，例如晶片、中央處理單元(central processing unit，CPU)或圖形處理器(graphic processing unit，GPU)等運作時會產生熱能的電子元件，因此，熱源的熱能就可以經由熱傳導的方式傳輸到導熱基板以及各個散熱鰭片上，藉以降低熱源的溫度。 The conventional heat dissipation module mainly comprises a heat sink, a fan and a water-cooling tube, and the heat sink is provided with a heat-conducting substrate, and the heat-conducting substrate is further provided with a plurality of heat-dissipating fins, wherein the heat-conducting substrate is used for contacting a heat source, such as a wafer. A central processing unit (CPU) or a graphics processing unit (GPU) that generates thermal energy when operating, so that the heat of the heat source can be transferred to the thermally conductive substrate and the heat dissipation through heat conduction. On the fins, to reduce the temperature of the heat source.
然而，傳統的散熱模組的水冷管並不會直接接觸到熱源，而是透過導熱基板與熱源接觸，接著才將熱能傳導致水冷管或散熱鰭片，因此無法有效提升散熱效果。 However, the water-cooling tube of the conventional heat-dissipating module does not directly contact the heat source, but is in contact with the heat source through the heat-conducting substrate, and then the heat energy is transmitted to the water-cooling tube or the heat-dissipating fin, so that the heat-dissipating effect cannot be effectively improved.
此外，通常散熱模組都固設於熱源的一側，因此無法依照散熱需求替換適合的散熱組件。 In addition, usually the heat dissipation module is fixed on one side of the heat source, so it is not possible to replace the suitable heat dissipation component according to the heat dissipation requirement.
鑒於以上的問題，本發明提供一種散熱模組，藉以解決傳統的散熱模組的散熱效果不足，以及無法依照散熱需求替換適合的散熱組件的問題。 In view of the above problems, the present invention provides a heat dissipation module, which solves the problem that the heat dissipation effect of the conventional heat dissipation module is insufficient, and the suitable heat dissipation component cannot be replaced according to the heat dissipation requirement.
本發明之散熱模組包括有一散熱座，其具有一頂面、一底面以及貫穿頂面及底面的二穿孔；一中空管，設置於散熱座之底面，中空管具有一入口端及一出口端，入口端及出口端分別設置於二穿孔內，並且露出於頂面；一氣體輸送組件，於一氣體熱交換模式下自散熱座之頂面連 接於中空管之入口端及出口端，並且於中空管之入口端及出口端分別形成一開放式管路，用以導引氣流自入口端進入中空管以及自出口端排出；以及一液體輸送組件，於一液體熱交換模式下連接於中空管之入口端及出口端，並且與中空管形成一封閉式管路，用以導引液體於中空管內循環流動。 The heat dissipation module of the present invention comprises a heat dissipation seat having a top surface, a bottom surface and two through holes penetrating the top surface and the bottom surface; a hollow tube disposed on the bottom surface of the heat dissipation seat, the hollow tube having an inlet end and a The outlet end, the inlet end and the outlet end are respectively disposed in the two perforations and exposed on the top surface; a gas delivery assembly is connected to the top surface of the heat sink in a gas heat exchange mode Connecting to the inlet end and the outlet end of the hollow tube, and forming an open conduit at the inlet end and the outlet end of the hollow tube for guiding the airflow from the inlet end into the hollow tube and discharging from the outlet end; A liquid delivery assembly is coupled to the inlet and outlet ends of the hollow tube in a liquid heat exchange mode and forms a closed conduit with the hollow tube for directing fluid circulation within the hollow tube.
本發明之散熱模組中，氣體輸送組件更可以包括有一入風管、連接於入風管之一入風扇、一出風管以及連接於出風管之一出風扇，並且於氣體熱交換模式下，入風管連接於中空管之入口端，出風管連接於中空管之出口端。另外，入風扇及出風扇更可分別包括一導風罩，且各導風罩的尺寸係以漸縮的方式分別自入風扇及出風扇的一側連接至入風管及出風管。 In the heat dissipation module of the present invention, the gas delivery assembly may further include an inlet duct, an inlet fan connected to the inlet duct, an outlet duct, and a fan connected to the outlet duct, and in the gas heat exchange mode. Next, the inlet duct is connected to the inlet end of the hollow tube, and the outlet duct is connected to the outlet end of the hollow tube. In addition, the inlet fan and the outlet fan may respectively include an air guiding cover, and the sizes of the air guiding covers are respectively connected to the air inlet pipe and the air outlet pipe from one side of the fan and the fan in a tapered manner.
本發明之散熱模組中，液體輸送組件更可包括有一入液管、一出液管以及一泵浦，泵浦連接於入液管及出液管之間，並且於液體熱交換模式下，入液管及出液管分別連接於中空管之入口端及出口端。 In the heat dissipation module of the present invention, the liquid delivery assembly may further comprise an infusion tube, an outlet tube and a pump, the pump being connected between the infusion tube and the outlet tube, and in the liquid heat exchange mode, The liquid inlet pipe and the liquid outlet pipe are respectively connected to the inlet end and the outlet end of the hollow pipe.
本發明之散熱模組中，散熱座之頂面更可設有複數個散熱鰭片。 In the heat dissipation module of the present invention, the top surface of the heat sink can be provided with a plurality of heat dissipation fins.
本發明之散熱模組中，散熱座之底面上形成有一溝槽，溝槽介於二穿孔之間，並且連通於二穿孔，中空管更具有一導熱段，連接於入口端及出口端之間，並且卡合於溝槽內。較佳地，前述的散熱模組中，中空管之導熱段具有一接觸面，接觸面露出於溝槽並且與散熱座之底面為共平面。 In the heat dissipation module of the present invention, a groove is formed on the bottom surface of the heat dissipation seat, the groove is interposed between the two perforations, and communicates with the two perforations, and the hollow tube further has a heat conducting portion connected to the inlet end and the outlet end. And fit into the groove. Preferably, in the heat dissipation module, the heat conducting section of the hollow tube has a contact surface, and the contact surface is exposed in the groove and is coplanar with the bottom surface of the heat sink.
本發明之散熱模組之其中一功效在於，中空管係設置在散熱座的底面，因此，中空管可以與熱源直接接觸而與中空管內的氣體或液體產生熱交換效果，因此不需如傳統的散熱模組還須經過散熱基板才能將熱能傳導至中空管。 One of the effects of the heat dissipation module of the present invention is that the hollow tube is disposed on the bottom surface of the heat sink. Therefore, the hollow tube can directly contact the heat source to generate heat exchange effect with the gas or liquid in the hollow tube, so For example, a conventional heat dissipation module must pass through a heat dissipation substrate to conduct heat energy to the hollow tube.
本發明之散熱模組之另一功效在於，可以依照散熱需求而替換氣體輸送組件或液體輸送組件，藉此，使用者就可以針對熱源的不同而選擇對熱源最適合的熱交換模式。 Another effect of the heat dissipation module of the present invention is that the gas delivery assembly or the liquid delivery assembly can be replaced in accordance with the heat dissipation requirement, whereby the user can select the heat exchange mode that is most suitable for the heat source for the difference in heat source.
有關本發明的特徵、實作與功效，茲配合圖式作最佳實施例詳細說明如下。 The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.
200‧‧‧散熱座 200‧‧‧ Heat sink
201‧‧‧頂面 201‧‧‧ top surface
202‧‧‧底面 202‧‧‧ bottom
210‧‧‧散熱鰭片 210‧‧‧Heat fins
220、230‧‧‧穿孔 220, 230‧‧‧ perforation
240‧‧‧溝槽 240‧‧‧ trench
300‧‧‧中空管 300‧‧‧ hollow tube
301‧‧‧入口端 301‧‧‧ entrance end
302‧‧‧出口端 302‧‧‧export end
303‧‧‧導熱段 303‧‧‧thermal section
310‧‧‧接觸面 310‧‧‧Contact surface
400‧‧‧氣體輸送組件 400‧‧‧ gas delivery components
410‧‧‧入風扇 410‧‧‧Into the fan
411‧‧‧導風罩 411‧‧‧wind hood
420‧‧‧入風管 420‧‧‧Into the air duct
430‧‧‧出風扇 430‧‧‧fan
431‧‧‧導風罩 431‧‧‧wind hood
440‧‧‧出風管 440‧‧‧Air duct
500‧‧‧液體輸送組件 500‧‧‧Liquid transport components
510‧‧‧泵浦 510‧‧‧ pump
520‧‧‧入液管 520‧‧‧Inlet tube
530‧‧‧出液管 530‧‧‧Draining tube
600‧‧‧電路板 600‧‧‧ boards
第1圖為本發明之散熱模組在氣體熱交換模式下的爆炸圖。 Figure 1 is an exploded view of the heat dissipation module of the present invention in a gas heat exchange mode.
第2及3圖為本發明之散熱模組在氣體熱交換模式下不同視角的立體示意圖。 2 and 3 are schematic perspective views of the heat dissipation module of the present invention at different viewing angles in a gas heat exchange mode.
第4圖為本發明之散熱模組在氣體熱交換模式下的使用狀態示意圖。 Figure 4 is a schematic view showing the state of use of the heat dissipation module of the present invention in a gas heat exchange mode.
第5圖為本發明之散熱模組在液體熱交換模式下的爆炸圖。 Figure 5 is an exploded view of the heat dissipation module of the present invention in a liquid heat exchange mode.
第6及7圖為本發明之散熱模組在液體熱交換模式下不同視角的立體示意圖。 6 and 7 are schematic perspective views of the heat dissipation module of the present invention at different viewing angles in a liquid heat exchange mode.
第8圖為本發明之散熱模組在液體熱交換模式下的使用狀態示意圖。 Figure 8 is a schematic view showing the state of use of the heat dissipation module of the present invention in a liquid heat exchange mode.
請參照第1圖所示之本發明之散熱模組在氣體熱交換模式下的爆炸圖；第2及3圖所示之本發明之散熱模組在氣體熱交換模式下不同視角的立體示意圖；第4圖所示之本發明之散熱模組在氣體熱交換模式下的使用狀態示意圖；第5圖所示之本發明之散熱模組在液體熱交換模式下的爆炸圖；第6及7圖所示之本發明之散熱模組在液體熱交換模式下不同視角的立體示意圖以及第8圖所示之本發明之散熱模組在液體熱交換模式下的使用狀態示意圖。 Please refer to the exploded view of the heat dissipation module of the present invention shown in FIG. 1 in the gas heat exchange mode; and the perspective view of the heat dissipation module of the present invention shown in FIGS. 2 and 3 at different viewing angles in the gas heat exchange mode; FIG. 4 is a schematic view showing the state of use of the heat dissipation module of the present invention in a gas heat exchange mode; FIG. 5 is an exploded view of the heat dissipation module of the present invention in a liquid heat exchange mode; FIGS. 6 and 7 The schematic view of the heat dissipation module of the present invention shown in different views in the liquid heat exchange mode and the use state of the heat dissipation module of the present invention shown in FIG. 8 in the liquid heat exchange mode are shown.
本發明之散熱模組包括一散熱座200、一中空管300、一氣體輸送組件400以及一液體輸送組件500。散熱座200具有一頂面201、一底面202以及貫穿頂面201以及底面202的二穿孔220、230，其中，散熱座200的頂面201可以設有複數個散熱鰭片210，藉以增加散熱的效果。 The heat dissipation module of the present invention includes a heat sink 200, a hollow tube 300, a gas delivery assembly 400, and a liquid delivery assembly 500. The heat sink 200 has a top surface 201, a bottom surface 202, and two through holes 220 and 230 extending through the top surface 201 and the bottom surface 202. The top surface 201 of the heat sink 200 may be provided with a plurality of heat dissipation fins 210 to increase heat dissipation. effect.
中空管300設置在散熱座200的底面202，且中空管300具有一入口端301以及一出口端302，入口端301及出口端302分別設置在二穿孔220、230內，並且露出於散熱座200的頂面201。具體而言，中空管300設置在散熱座200的底面202主要是為了應用於電路板600時可以跟中央處理器或圖形處理器等熱源直接接觸，而使中空管中的液體或氣體與熱源產生熱交換，以產生直接的散熱效果。另外，中空管300可以是銅管或是其他具有高導熱性之管體，藉以增加導熱效果。 The hollow tube 300 is disposed on the bottom surface 202 of the heat sink 200, and the hollow tube 300 has an inlet end 301 and an outlet end 302. The inlet end 301 and the outlet end 302 are respectively disposed in the two through holes 220 and 230, and are exposed to heat dissipation. The top surface 201 of the seat 200. Specifically, the hollow tube 300 is disposed on the bottom surface 202 of the heat sink 200 mainly for direct application to the heat source such as a central processing unit or a graphics processor when applied to the circuit board 600, and the liquid or gas in the hollow tube is The heat source generates heat exchange to produce a direct heat dissipation effect. In addition, the hollow tube 300 may be a copper tube or other tube having high thermal conductivity, thereby increasing the heat conduction effect.
較佳地，散熱座200的底面202上可以形成一溝槽240，此 溝槽240介於二穿孔220、230之間，並且連通於二穿孔220、230，而中空管300更具有一導熱段303，其連接於入口端301及出口端302之間，且導熱段303的外徑可以略大於溝槽240的內徑。因此，當中空管300結合於散熱座200時，中空管300係以入口端301與出口端302分別穿入散熱座200的二穿孔220、230內，並且透過導熱段303以緊配合的方式鑲嵌在溝槽240內使中空管300穩固地結合於散熱座200上，其中中空管300的導熱段303具有一接觸面310，接觸面310設置於導熱段303相鄰於散熱座200之底面202的一側，並且露出於溝槽240。此外，接觸面310可以是與散熱座200之底面202位於同一水平面上，而呈共平面，使中空管300的導熱段303可以透過接觸面310對應貼合於電路板600之熱源的表面，藉以增加中空管300與熱源的接觸面積，進而增加導熱效果。 Preferably, a groove 240 can be formed on the bottom surface 202 of the heat sink 200. The trench 240 is interposed between the two through holes 220, 230 and communicates with the two through holes 220, 230, and the hollow tube 300 further has a heat conducting portion 303 connected between the inlet end 301 and the outlet end 302, and the heat conducting portion The outer diameter of 303 may be slightly larger than the inner diameter of the groove 240. Therefore, when the hollow tube 300 is coupled to the heat sink 200, the hollow tube 300 penetrates into the two through holes 220, 230 of the heat sink 200 through the inlet end 301 and the outlet end 302, respectively, and penetrates the heat conducting portion 303 in a tight fit manner. The heat-insulating section 303 of the hollow tube 300 has a contact surface 310. The contact surface 310 is disposed adjacent to the heat-dissipating block 200. One side of the bottom surface 202 is exposed to the trench 240. In addition, the contact surface 310 may be coplanar with the bottom surface 202 of the heat sink 200, so that the heat conducting portion 303 of the hollow tube 300 can pass through the contact surface 310 to conform to the surface of the heat source of the circuit board 600. Thereby, the contact area of the hollow tube 300 with the heat source is increased, thereby increasing the heat conduction effect.
另外，在散熱模組的應用上，其通常是設置於電路板600的熱源600的表面，且熱源600的表面通常會是一平面。因此，散熱模組可藉由中空管300的接觸面310與散熱座200之底面202為共平面的配置方式，就可以透過中空管300的接觸面310與散熱座200的底面202同時接觸到熱源600的表面，進而在彼此間形成較大的接觸面積，因此增加了導熱面積，從而使熱能可以迅速的從散熱座200的底面202與中空管300的導熱段303傳導至中空管300內，並且被填充於中空管300內的液體或氣體吸收，然後再經由液體或氣體與外界環境進行熱交換作用，而達到良好的散熱效果。 In addition, in the application of the heat dissipation module, it is usually disposed on the surface of the heat source 600 of the circuit board 600, and the surface of the heat source 600 is usually a plane. Therefore, the heat dissipating module can be simultaneously contacted with the bottom surface 202 of the heat sink 200 through the contact surface 310 of the hollow tube 300 by the coplanar arrangement of the contact surface 310 of the hollow tube 300 and the bottom surface 202 of the heat sink 200. The surface of the heat source 600 is further formed with a large contact area between each other, thereby increasing the heat transfer area, so that the heat energy can be quickly transferred from the bottom surface 202 of the heat sink 200 and the heat conducting portion 303 of the hollow tube 300 to the hollow tube. Within 300, and absorbed by the liquid or gas filled in the hollow tube 300, and then exchange heat with the external environment via liquid or gas, a good heat dissipation effect is achieved.
續言之，在本發明的散熱模組中，氣體輸送組件400與液體輸送組件500為可替換式的組裝於散熱座上，讓使用者可以依照不同的需求選擇使用氣體熱交換模式或是液體熱交換模式等散熱模式。首先，在氣體熱交換模式的情況下，氣體輸送組件400可自散熱座200之頂面201連接於中空管300之入口端301及出口端302，並且在中空管300的入口端301及出口端302分別形成開放式管路，用以導引氣流自入口端301進入中空管300以及自出口端302排出。詳細而言，氣體輸送組件400可以包括一入口管420、連接於入風管420之一入風扇410、一出風管440以及連接於出風管440之一出風扇430，其中，入風管420連接於中空管300之入口端301，並且出風管440連接於中空管300之出口端302。換言之，當本發明之散熱 模組在對電路板600上之熱源進行散熱的時候，入風扇410會自散熱模組的外部引導空氣進入到入風管420，並且空氣會經過中空管300的導熱段303，藉此熱源所產生的熱能就可以經由中空管300的傳導作用而與流通於中空管300內部的空氣進行熱交換，進而使熱源的溫度降低。接著，經過熱交換的空氣再往出風管440輸送，並透過出風扇430排放至外界環境。由此可見，空氣是自外界源源不斷補充，因此形成了開放式的流通路徑，並且外界的空氣可不斷的自入風扇410進入而與熱源進行熱交換，以降低熱源的溫度。 Continuingly, in the heat dissipation module of the present invention, the gas delivery assembly 400 and the liquid delivery assembly 500 are replaceably assembled on the heat sink, so that the user can select the gas heat exchange mode or the liquid according to different needs. Cooling mode such as hot swap mode. First, in the case of the gas heat exchange mode, the gas delivery assembly 400 can be coupled to the inlet end 301 and the outlet end 302 of the hollow tube 300 from the top surface 201 of the heat sink 200, and at the inlet end 301 of the hollow tube 300 and The outlet ends 302 each form an open conduit for directing airflow from the inlet end 301 into the hollow tube 300 and from the outlet end 302. In detail, the gas delivery assembly 400 can include an inlet tube 420, an inlet fan 410 coupled to the inlet duct 420, an outlet duct 440, and an outlet fan 430 coupled to the outlet duct 440, wherein the inlet duct 420 is coupled to the inlet end 301 of the hollow tube 300 and the outlet tube 440 is coupled to the outlet end 302 of the hollow tube 300. In other words, when the heat dissipation of the present invention When the module dissipates heat from the heat source on the circuit board 600, the inlet fan 410 directs air from the outside of the heat dissipation module into the air inlet pipe 420, and the air passes through the heat conduction section 303 of the hollow pipe 300, thereby using the heat source. The generated heat energy can exchange heat with the air flowing inside the hollow tube 300 via the conduction of the hollow tube 300, thereby lowering the temperature of the heat source. Then, the heat-exchanged air is sent to the air outlet pipe 440 and discharged to the external environment through the fan 430. It can be seen that the air is continuously replenished from external sources, thus forming an open flow path, and the outside air can continuously enter the fan 410 and exchange heat with the heat source to reduce the temperature of the heat source.
另外，入風扇410及出風扇430可分別包括有導風罩411、431，導風罩411、431分別連接於入風管420及出風管440，且導風罩411、431的內徑可以是但並不侷限於朝向入風管420與出風管440的方向漸縮，而呈現出類似於漏斗狀結構。具體而言，入風扇410或出風扇430的扇葉通常會比入風管420或出風管440的管徑大，因此在扇葉及入風管420、出風管440之間設有導風罩411、431可以有效的導引空氣在開放式管路中流進入風管以及自出風管中排出，可增進空氣的流通速率，以提升散熱模組的散熱效果。 In addition, the inlet fan 410 and the outlet fan 430 may respectively include air guiding hoods 411 and 431, and the air guiding hoods 411 and 431 are respectively connected to the air inlet pipe 420 and the air outlet pipe 440, and the inner diameters of the air guiding hoods 411 and 431 may be It is, but not limited to, tapered toward the direction of the inlet duct 420 and the outlet duct 440, and exhibits a funnel-like structure. Specifically, the fan blades of the fan 410 or the fan 430 are generally larger than the diameter of the air inlet pipe 420 or the air outlet pipe 440. Therefore, a guide is provided between the fan blade and the air inlet pipe 420 and the air outlet pipe 440. The windshields 411 and 431 can effectively guide the air to flow into the air duct in the open pipeline and discharge from the air duct, thereby increasing the air circulation rate and improving the heat dissipation effect of the heat dissipation module.
接著，要說明在液體熱交換模式的情況下，使用者可以將液體輸送組件500連接至中空管300之入口端301及出口端302，並且與中空管300形成一封閉式管路，用以導引液體於中空管300內循環流動。詳細而言，液體輸送組件500可以包括有一入液管520、一出液管530以及一泵浦510，泵浦510連接於入液管520及出液管530之間，且入液管520及出液管530分別連接於中空管300之入口端301及出口端302，使泵浦510、入液管520、中空管300及出液管530循環連接以形成一封閉式管路，並且於封閉式管路中填充有液體，使液體可經由泵浦510的作動而在封閉式管路內循環移動，且當本發明之散熱模組在對電路板600上的熱源進行散熱的時候，液體可以經過中空管300與熱源的接觸而吸收熱源產生的熱能，以進行熱交換作用，藉以降低熱源的溫度。 Next, in the case of the liquid heat exchange mode, the user can connect the liquid delivery assembly 500 to the inlet end 301 and the outlet end 302 of the hollow tube 300, and form a closed tube with the hollow tube 300. The liquid is circulated in the hollow tube 300 by the guiding liquid. In detail, the liquid delivery assembly 500 can include an inlet tube 520, an outlet tube 530, and a pump 510. The pump 510 is coupled between the inlet tube 520 and the outlet tube 530, and the inlet tube 520 and The liquid outlet pipe 530 is respectively connected to the inlet end 301 and the outlet end 302 of the hollow pipe 300, so that the pump 510, the liquid inlet pipe 520, the hollow pipe 300 and the liquid outlet pipe 530 are cyclically connected to form a closed pipe, and The closed conduit is filled with liquid so that the liquid can be circulated and moved in the closed conduit via the operation of the pump 510, and when the heat dissipation module of the present invention dissipates heat from the heat source on the circuit board 600, The liquid can absorb the heat energy generated by the heat source through the contact of the hollow tube 300 with the heat source to perform heat exchange, thereby lowering the temperature of the heat source.
本發明之散熱模組，並不以本實施例所揭露的型態為限，熟悉此項技術者，可根據實際設計需求或是使用需求而對應改變本發明的散熱模組。 The heat dissipation module of the present invention is not limited to the type disclosed in the embodiment. Those skilled in the art can change the heat dissipation module of the present invention according to actual design requirements or usage requirements.
上述本發明之散熱模組，主要是利用中空管直接與熱源接觸，進而增加本發明之散熱模組的散熱效率。另外，使用者更可以依據實際的使用需求透過在散熱座上替換氣體輸送組件或液體輸送組件的方式，以便於依照不同的散熱需求而選擇不同的熱交換模式，從而避免了習知技術的問題。 The heat dissipation module of the present invention mainly uses a hollow tube to directly contact the heat source, thereby increasing the heat dissipation efficiency of the heat dissipation module of the present invention. In addition, the user can replace the gas delivery component or the liquid delivery component on the heat sink according to the actual use requirement, so as to select different heat exchange modes according to different heat dissipation requirements, thereby avoiding the problems of the prior art. .
雖然本發明之實施例揭露如上所述，然並非用以限定本發明，任何熟習相關技藝者，在不脫離本發明之精神和範圍內，舉凡依本發明申請範圍所述之形狀、構造、特徵及數量當可做些許之變更，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.
200‧‧‧散熱座 200‧‧‧ Heat sink
201‧‧‧頂面 201‧‧‧ top surface
210‧‧‧散熱鰭片 210‧‧‧Heat fins
220、230‧‧‧穿孔 220, 230‧‧‧ perforation
300‧‧‧中空管 300‧‧‧ hollow tube
301‧‧‧入口端 301‧‧‧ entrance end
302‧‧‧出口端 302‧‧‧export end
303‧‧‧導熱段 303‧‧‧thermal section
400‧‧‧氣體輸送組件 400‧‧‧ gas delivery components
410‧‧‧入風扇 410‧‧‧Into the fan
411‧‧‧導風罩 411‧‧‧wind hood
420‧‧‧入風管 420‧‧‧Into the air duct
430‧‧‧出風扇 430‧‧‧fan
431‧‧‧導風罩 431‧‧‧wind hood
440‧‧‧出風管 440‧‧‧Air duct
Claims (7)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102104096A TW201433250A (en) | 2013-02-01 | 2013-02-01 | Cooling module |
| CN201310116560.9A CN103970238B (en) | 2013-02-01 | 2013-04-07 | Heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102104096A TW201433250A (en) | 2013-02-01 | 2013-02-01 | Cooling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201433250A true TW201433250A (en) | 2014-08-16 |
Family
ID=51239851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102104096A TW201433250A (en) | 2013-02-01 | 2013-02-01 | Cooling module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103970238B (en) |
| TW (1) | TW201433250A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106787471A (en) * | 2016-12-07 | 2017-05-31 | 中国北方车辆研究所 | A kind of motor drive controller of many radiating modes |
| CN109688760B (en) * | 2017-10-19 | 2020-06-26 | 讯凯国际股份有限公司 | Pumps, pump combinations and liquid cooling systems |
| CN111163200A (en) * | 2020-02-26 | 2020-05-15 | 努比亚技术有限公司 | Terminal heat dissipation tuber pipe and terminal |
| CN113412009A (en) * | 2021-06-17 | 2021-09-17 | 鄂尔多斯市普渡科技有限公司 | Bus driving control device and method with automatic scheduling function |
| TW202348116A (en) * | 2022-05-17 | 2023-12-01 | 建準電機工業股份有限公司 | Electronic device with heat dissipation system |
| CN118352881B (en) * | 2024-06-17 | 2024-11-01 | 度亘核芯光电技术(苏州)有限公司 | Heat dissipation seat and laser |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6760221B2 (en) * | 2002-10-23 | 2004-07-06 | International Business Machines Corporation | Evaporator with air cooling backup |
| TWM253211U (en) * | 2004-03-25 | 2004-12-11 | Thermaltake Technology Co Ltd | Heat dissipation system with multiple heat dissipation devices |
| CN2847531Y (en) * | 2005-11-24 | 2006-12-13 | 讯凯国际股份有限公司 | Water-cooled parallel channel heat dissipation structure |
| TW200721959A (en) * | 2005-11-30 | 2007-06-01 | Golden Sun News Tech Co Ltd | Manufacturing method of combining heat pipe and heat-dissipating device |
| TW201133204A (en) * | 2010-03-19 | 2011-10-01 | Hon Hai Prec Ind Co Ltd | Computer enclosure |
-
2013
- 2013-02-01 TW TW102104096A patent/TW201433250A/en unknown
- 2013-04-07 CN CN201310116560.9A patent/CN103970238B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103970238A (en) | 2014-08-06 |
| CN103970238B (en) | 2018-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI438388B (en) | Liquid cooled heat sink | |
| CN109673139B (en) | Heat dissipation system and aircraft with same | |
| TW201433250A (en) | Cooling module | |
| CN101902895A (en) | cooling system | |
| TWM512730U (en) | Water-cooled heat sink | |
| TWM517356U (en) | Liquid cooling heat dissipation structure and cooling circulation system thereof | |
| JP2019216192A (en) | Electronic apparatus | |
| TWI694325B (en) | Liquid cooling sink | |
| TWM545361U (en) | Air-cooling and liquid-cooling composite heat dissipator | |
| TW201913284A (en) | Multi-radiator liquid cooling system | |
| TWM477763U (en) | Electronic device | |
| TWM493087U (en) | Closed circulation heat dissipation module | |
| CN102036536B (en) | Heat sink device | |
| CN109860134B (en) | A kind of strengthening heat dissipation guide device and heat dissipation module | |
| TWM586876U (en) | Composite water-cooled drain structure | |
| CN104349648B (en) | Composite cooling components | |
| CN108387026A (en) | Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig | |
| JP3213431U (en) | Interface card fluid heat radiation fixing device | |
| CN206480615U (en) | Integrated liquid cooling device | |
| CN104105379A (en) | Heat radiation assembly and display card module | |
| TW201925974A (en) | Water-cooling radiator structure | |
| TWM576675U (en) | Water-cooling type interface card | |
| TWI530249B (en) | Hybrid heat sink assembly | |
| CN207587725U (en) | Water-cooling heat dissipation structure | |
| TWI507862B (en) | Electronic device and heat dissipation module thereof |