TWM519740U - Testing station with upgrading function - Google Patents
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- TWM519740U TWM519740U TW104218842U TW104218842U TWM519740U TW M519740 U TWM519740 U TW M519740U TW 104218842 U TW104218842 U TW 104218842U TW 104218842 U TW104218842 U TW 104218842U TW M519740 U TWM519740 U TW M519740U
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- 238000012360 testing method Methods 0.000 title claims abstract description 86
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 3
- 238000012546 transfer Methods 0.000 claims description 32
- 239000000523 sample Substances 0.000 claims description 8
- 239000003381 stabilizer Substances 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 4
- 230000009466 transformation Effects 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 7
- 230000006641 stabilisation Effects 0.000 description 4
- 238000011105 stabilization Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
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- Microelectronics & Electronic Packaging (AREA)
Abstract
Description
本創作係指一種具升級功能之測試機台,尤指一種利用一升級轉板來進行不同環針數量待測物之測試操作的測試機台。This creation refers to a test machine with an upgrade function, especially a test machine that uses an upgraded transfer plate to perform test operations on different number of loop pins.
隨著一般通用電子產品之推陳出新,常伴隨最新之功能研發與更優化之系統設計,使得通用電子產品之硬體規格將對應提升與進階。據此,為了適應通用電子產品升級後之硬體規格,製造商用來生產與測試的對應機台將隨進行相關更新操作,或額外添購其他機台來符合已升級的硬體規格,致相對應的生產成本與研發訓練費用可能大幅提高。With the development of general-purpose electronic products, often with the latest functional development and more optimized system design, the hardware specifications of general-purpose electronic products will be upgraded and advanced. Accordingly, in order to adapt to the upgraded hardware specifications of general electronic products, the corresponding machine used by the manufacturer for production and testing will be updated with the relevant equipment, or additional machines will be added to meet the upgraded hardware specifications. Corresponding production costs and R&D training costs may increase significantly.
在此情況下,若一般晶片製造商能對應加入相關之改良方法或可對應升級之零組件模組至既有的生產與測試機台,而不需全部汰換既有的生產與測試機台,此將提升既有生產或測試機台的使用壽命與生產效能,同時,對於原本可能增加之經營成本或耗材費用亦能有效地減免與遞延,據此,製造商能將節省之成本/費用再投入進階之生產研發與開發計畫,以提高市場競爭力,並形成良性之生產/研發的循環過程。In this case, if the general wafer manufacturer can add the relevant improved method or the corresponding upgraded component module to the existing production and testing machine, it is not necessary to replace the existing production and testing machine. This will increase the service life and production efficiency of existing production or test machines. At the same time, it can effectively reduce and deduct the operating costs or consumables costs that may have been added. According to this, manufacturers can save the cost / The cost is invested in an advanced production R&D and development program to increase market competitiveness and form a benign production/development cycle.
因此,提供具升級功能之測試機台與其升級方法,而無須淘汰既有的生產或測試機台,同時提升其使用壽命與生產效能,已成為本領域之重要課題。Therefore, it has become an important issue in the field to provide a test machine with an upgrade function and an upgrade method thereof without eliminating the existing production or test machine while improving its service life and production efficiency.
因此,本創作之主要目的即在於提供一種具升級功能之測試機台,來適性延長既有生產或測試機台之使用壽命與生產效能。Therefore, the main purpose of this creation is to provide a test machine with an upgrade function to appropriately extend the service life and production efficiency of existing production or test machines.
本創作揭露一種一種具升級功能之測試機台,包含有一升級轉板,包含有一轉板;以及一組裝套件模組,包含有一測試塔座(POGO Tower),用來連接及穩固該轉板;以及一機台本體,用來提供一容置空間來設置該升級轉板,以讓該測試機台進行不同環測針數量之待測物之一測試操作。The present invention discloses a test machine with an upgrade function, including an upgrade transfer plate, including a rotary plate, and an assembly kit module including a test tower (POGO Tower) for connecting and stabilizing the rotary plate; And a machine body for providing an accommodation space for setting the upgrade transfer plate, so that the test machine performs one test operation of the number of different test objects of the ring stylus.
在說明書及後續的申請專利範圍當中使用了某些詞彙來指稱特定的元件。所屬領域中具有通常知識者應可理解,製造商可能會用不同的名詞來稱呼同樣的元件。本說明書及後續的申請專利範圍並不以名稱的差異來作為區別元件的方式,而是以元件在功能上的差異來作為區別的基準。在通篇說明書及後續的請求項當中所提及的「包含」係為一開放式的用語,故應解釋成「包含但不限定於」。Certain terms are used throughout the description and following claims to refer to particular elements. It should be understood by those of ordinary skill in the art that manufacturers may refer to the same elements by different nouns. The scope of this specification and the subsequent patent application do not use the difference of the names as the means for distinguishing the elements, but the differences in the functions of the elements as the basis for the distinction. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to".
請參考第1圖,第1圖為本創作實施例之一測試機台1之示意圖。如第1圖所示,測試機台1包含有一升級轉板10以及一機台本體12,其中升級轉板10包含有一轉板100與一組裝套件模組102,而機台本體12包含有一基座120以及一測試頭座模組122。據此,一待測物OB可放置於基座120之一容置空間SD,以對應進行待測物OB之測試操作,至於本實施例中的待測物OB可為一平面顯示器之一驅動器,且對應包含有不同的針數,而測試機台1所對應之操作規格可為ND1(包含1280針數)、ND2(包含1536針數)或ND3(包含2304針數),相關操作將於以下段落詳述。Please refer to FIG. 1 , which is a schematic diagram of a test machine 1 according to one embodiment of the present invention. As shown in FIG. 1, the test machine 1 includes an upgrade flap 10 and a machine body 12, wherein the upgrade flap 10 includes a rotary plate 100 and an assembly kit module 102, and the base body 12 includes a base. The seat 120 and a test head block module 122. According to this, an object to be tested OB can be placed in the accommodating space SD of the susceptor 120 to perform the test operation of the object to be tested OB. The object to be tested OB in the embodiment can be a driver of a flat display. And the corresponding number of needles is included, and the operation specifications of the test machine 1 can be ND1 (including 1280 stitches), ND2 (including 1536 stitches) or ND3 (including 2304 stitches), and the related operations will be The following paragraphs are detailed.
請繼續參考第2圖,第2圖為本創作實施例之一升級轉板20之拆解示意圖。較佳地,如第1圖所示,本實施例的升級轉板20已包含轉板100、組裝套件模組102以及一基底1024,同時再參考第2圖,本實施例中的組裝套件模組102還包含有一測試塔座(POGO Tower)1020與一加固環單元1022。其中加固環單元1022用來連接至升級轉板20之一上表面,使得轉板100可透過加固環單元1022之緊密結構設置方式,來固定於加固環單元1022與測試塔座1020之間,以避免轉板100於使用或測試之過程中因外力發生,而導致轉板100發生形變,至於基底1024則用來承載轉板100與加固環單元1022。Please refer to FIG. 2 again. FIG. 2 is a schematic diagram of the disassembly of the upgrade transfer plate 20 according to one embodiment of the present invention. Preferably, as shown in FIG. 1 , the upgrade flap 20 of the embodiment includes the rotary plate 100 , the assembly kit module 102 , and a base 1024 , and referring to FIG. 2 , the assembly kit of the embodiment The group 102 also includes a test tower (POGO Tower) 1020 and a reinforcement ring unit 1022. The reinforcing ring unit 1022 is configured to be connected to the upper surface of the upgraded rotating plate 20 so that the rotating plate 100 can be fixed between the reinforcing ring unit 1022 and the test tower 1020 through the tight structure of the reinforcing ring unit 1022. The transfer plate 100 is prevented from being deformed due to an external force during use or testing, and the substrate 1024 is used to carry the rotating plate 100 and the reinforcing ring unit 1022.
請參考第3圖,第3圖為本創作實施例之一升級轉板20與另一組裝套件模組30之拆解示意圖。如第3圖所示,本實施例中的組裝套件模組30還包含有一上方穩固套件模組300與一下方穩固套件模組302,其中上方穩固套件模組300與下方穩固套件模組302可對應為一環型設計之多個套件組合體,即本實施例中上方穩固套件模組300還包含有上方配件單元3000〜3010,而下方穩固套件模組302還包含有下方配件單元3020〜3022,且上方配件單元3000〜3010與下方配件單元3020〜3022將依序疊設來連接升級轉板20,以下將逐一說明本實施例中上方配件單元3000〜3010與下方配件單元3020〜3022所對應之不同之名稱及其相關的設置順序。Please refer to FIG. 3 , which is a schematic diagram of the disassembly of the upgrade transfer plate 20 and another assembly kit module 30 according to one embodiment of the present invention. As shown in FIG. 3, the assembly kit module 30 of the present embodiment further includes an upper stabilization kit module 300 and a lower stability kit module 302, wherein the upper stabilization kit module 300 and the lower stabilization kit module 302 are In the embodiment, the upper stability kit module 300 further includes an upper accessory unit 3000~3010, and the lower stability kit module 302 further includes a lower accessory unit 3020~3022. The upper accessory units 3000 to 3010 and the lower accessory units 3020 to 3022 are sequentially stacked to connect the upgrade flap 20, and the upper fitting units 3000 to 3010 and the lower fitting units 3020 to 3022 in the present embodiment will be described one by one. Different names and their associated order of settings.
先從上方穩固套件模組300來說,其中上方配件單元3000為一夾鉗座台蓋板,且設置於升級轉板20上;上方配件單元3001為一夾鉗座台固定環,且設置於上方配件單元3000上;上方配件單元3002為一座台旋轉座軸承,且設置於上方配件單元3001上;上方配件單元3003為一座台旋轉座,包含有上方配件單元3002;上方配件單元3004為一夾鉗座台蓋板軸承,且設置於上方配件單元3000上;上方配件單元3005為一座台旋轉座把手,且設置於上方配件單元3003上;上方配件單元3006為一定位塊,且設置於上方配件單元3000上形成固定方式;上方配件單元3007為一測試塔座引導栓,且設置於上方配件單元3000上;上方配件單元3008為一感應器遮斷片,且設置於上方配件單元3003上;上方配件單元3009為一夾鉗座台蓋板軸承,且設置於上方配件單元3000上;上方配件單元3010為一感應器外蓋,且設置來對應上方配件單元3008。再從下方穩固套件模組302來說,下方配件單元3022為一夾鉗座台基座,且設置於升級轉板20下;下方配件單元3021為一升級轉板專屬座台,且設置於下方配件單元3022下;下方配件單元3020為一底盤,且設置於下方配件單元3021下。For example, the upper accessory unit 3000 is a clamp base cover and is disposed on the upgrade rotary plate 20; the upper accessory unit 3001 is a clamp base fixing ring, and is disposed on the upper assembly module 300. The upper accessory unit 3002 is a table rotating seat bearing and is disposed on the upper accessory unit 3001; the upper accessory unit 3003 is a table rotating seat, including the upper accessory unit 3002; the upper accessory unit 3004 is a clip The upper table cover bearing is disposed on the upper accessory unit 3000; the upper accessory unit 3005 is a table rotating seat handle and is disposed on the upper accessory unit 3003; the upper accessory unit 3006 is a positioning block and is disposed on the upper accessory The upper fitting unit 3007 is a test tower guiding bolt and is disposed on the upper fitting unit 3000; the upper fitting unit 3008 is a sensor blocking piece and is disposed on the upper fitting unit 3003; the upper fitting The unit 3009 is a clamp seat cover bearing and is disposed on the upper accessory unit 3000; the upper accessory unit 3010 is an inductor cover. And arranged to correspond to the upper accessory unit 3008. The lower accessory unit 3022 is a clamp base base and is disposed under the upgrade rotary plate 20; the lower accessory unit 3021 is an upgraded transfer plate dedicated platform and is disposed below. The accessory unit 3022 is lower; the lower accessory unit 3020 is a chassis and is disposed under the lower accessory unit 3021.
在此情況下,本實施例中的夾鉗座台固定環(即上方配件單元3000)與升級轉板專屬座台(即下方配件單元3021)之環型設計,可用來上下結構鎖固或環狀固定升級轉板20,同時,感應器遮斷片(即上方配件單元3008)可用來驗證上方穩固套件模組300與下方穩固套件模組302間是否已完成鎖固升級轉板20所對應之操作,以讓測試機台1可對應進行待測物OB之測試操作。換言之,於本實施例中,使用者僅需利用上方配件單元3000〜3010與下方配件單元3020〜3022之環形結構設計,依序設置且連接鎖固至升級轉板20,即可完成上方穩固套件模組300與下方穩固套件模組302之組裝操作,至於上方配件單元3000〜3010與下方配件單元3020〜3022間之鎖固關係,例如可透過常見之機構配件組裝與公、母螺紋的緊密咬合,非用以限制本創作的範疇。In this case, the ring type design of the clamp base fixing ring (ie, the upper fitting unit 3000) and the upgraded rotating plate exclusive seat (ie, the lower fitting unit 3021) in the embodiment can be used for the upper and lower structure locking or ring. The upgrade flap 20 is fixed, and the sensor shutter (ie, the upper accessory unit 3008) can be used to verify whether the operation of the lock adapter 20 is completed between the upper stabilizer kit 300 and the lower stabilizer kit 302. In order to allow the test machine 1 to perform the test operation of the object to be tested OB. In other words, in this embodiment, the user only needs to utilize the ring structure design of the upper accessory unit 3000~3010 and the lower accessory unit 3020~3022, and sequentially install and connect the lock to the upgrade flap 20 to complete the upper stability kit. The assembly operation of the module 300 and the lower stability kit module 302, as for the locking relationship between the upper accessory units 3000~3010 and the lower accessory units 3020~3022, for example, can be assembled with the male and female threads through common mechanism fittings. It is not intended to limit the scope of this creation.
較佳地,由於本實施例中上方配件單元3005形成座台旋轉座把手,其可對應提供使用者施力的槓桿支點,同時搭配上方穩固套件模組300與下方穩固套件模組302的環型設計,使用者可直接推拉上方配件單元3005,即可讓上方穩固套件模組300與下方穩固套件模組302進行一順時針旋轉操作或一逆時針旋轉操作,以將上方穩固套件模組300旋轉連接/脫離升級轉板20之上表面,或將下方穩固套件模組302旋轉連接/脫離升級轉板20之下表面,進而讓上方穩固套件模組300與下方穩固套件模組302上下鎖固且包覆升級轉板20,據此,使用者可依據不同待測物之產品規格,適性地進行轉板之升級操作,大幅提高產品的操作便利性與實用可擴充性。Preferably, in the embodiment, the upper accessory unit 3005 forms a seat swivel handle, which can correspondingly provide a lever fulcrum for the user to apply force, and is matched with the ring shape of the upper stable kit module 300 and the lower stabilizer kit module 302. The user can directly push and pull the upper accessory unit 3005, so that the upper stability kit module 300 and the lower stability kit module 302 perform a clockwise rotation operation or a counterclockwise rotation operation to rotate the upper stability kit module 300. Connecting/disengaging the upper surface of the upgrade flap 20, or rotating the lower stabilizer kit 302 off/off the lower surface of the upgrade flap 20, thereby locking the upper stabilizer kit 300 and the lower stabilizer kit 302 up and down and The upgraded transfer plate 20 is coated, and accordingly, the user can appropriately perform the upgrade operation of the transfer plate according to the product specifications of the different objects to be tested, thereby greatly improving the operation convenience and practical expandability of the product.
另外,本實施例中升級轉板20與組裝套件模組30之一側視剖面圖,還可參考第4圖所繪之內容來獲得相關說明,至於第5圖所繪之一組合完成圖,則為本實施例中組裝完成之升級轉板20與組裝套件模組30的示意圖。據此,組裝完成之升級轉板20與組裝套件模組30將可適性地鎖固於測試頭座模組122上來替代原本之轉板模組,以提供不同環測針數量之待測物之測試操作。In addition, in the embodiment, a side cross-sectional view of the upgraded rotating plate 20 and the assembly kit module 30 can be further described with reference to the contents depicted in FIG. 4, and a combined drawing is completed as shown in FIG. The schematic diagram of the assembled transfer plate 20 and the assembly kit module 30 assembled in this embodiment is shown. Accordingly, the assembled upgraded transfer plate 20 and the assembly kit module 30 can be appropriately locked to the test head block module 122 instead of the original transfer plate module to provide the number of different test pins of the ring. Test operation.
除此之外,請參考第6圖,第6圖為本創作實施例之一測試頭座模組122之剖面示意圖。如第6圖所示,測試頭座模組122包含有複數個探針,其中,設置於內側環狀圓盤且為同圓心排列的環測針OP,即為未升級前之一原始測試區域,設置於外側環狀圓盤且為同圓心排列的環測針AP,即為升級後之一新增測試區域。據此,本實施例僅需額外設置升級轉板20來與組裝套件模組30形成組裝,即可讓測試機台1進行不同環測針數量之平面顯示器驅動器的測試操作,例如本實施例的升級轉板20可讓測試機台1適用於規格為ND1、ND2或ND3等不同的探針數量。相較於習知技術,本實施例已可大幅增加測試機台用來測試平面顯示驅動器所對應之探針數量,而無須淘汰原本所使用的測試機台,進而提升其使用壽命與生產效能。In addition, please refer to FIG. 6 , which is a cross-sectional view of a test head block module 122 according to an embodiment of the present invention. As shown in FIG. 6 , the test head block module 122 includes a plurality of probes, wherein the ring stylus OP disposed on the inner annular disk and arranged in the same center is the original test area before the upgrade. The ring stylus AP, which is arranged on the outer annular disk and arranged in the same center, is a new test area for one of the upgrades. Accordingly, in this embodiment, only the upgrade transfer plate 20 needs to be additionally provided to form an assembly with the assembly kit module 30, so that the test machine 1 can perform the test operation of the flat display driver with different number of stylus pins, for example, the embodiment. Upgrading the transfer plate 20 allows the test machine 1 to be used with different probe sizes such as ND1, ND2 or ND3. Compared with the prior art, this embodiment can greatly increase the number of probes used by the test machine to test the flat display driver without eliminating the test machine originally used, thereby improving the service life and production efficiency.
請再參考第1圖,當使用者欲進行待測物OB之測試操作,使用者將於基座120之一容置空間SD放置一待測物OB,且待測物OB為包含有複數個對應針孔之一晶片單元。進一步,本實施例中機台本體12還包含有一控制器,且當使用者透過控制器產生一控制命令來對基座120進行一鉛直位移操作時,放置於容置空間SD內的待測物OB將隨著基座120之鉛直位移操作,對應電性連接至測試頭座模組122之複數個探針,並讓複數個探針適性地插入晶片單元中複數個對應針孔來進行待測物之測試操作,進而取得待測物之電路檢驗與產品特性等相關結果報告。Referring to FIG. 1 again, when the user wants to perform the test operation of the object to be tested OB, the user places an object to be tested OB in the receiving space SD of the base 120, and the object to be tested OB includes a plurality of objects. Corresponding to one of the pinhole wafer units. Further, in the embodiment, the machine body 12 further includes a controller, and when the user generates a control command through the controller to perform a vertical displacement operation on the susceptor 120, the object to be tested placed in the accommodating space SD The OB will operate with the vertical displacement of the susceptor 120, correspondingly connected to the plurality of probes of the test head block module 122, and the plurality of probes are appropriately inserted into the corresponding pinholes of the wafer unit for testing. The test operation of the object, and then obtain the relevant results report of the circuit inspection and product characteristics of the object to be tested.
綜上所述,本創作實施例係提供一種具備有升級方法之測試機台,其可透過一升級轉板與相關配件模組之組合操作,於未升級前之原始測試區域對應增設一新增測試區域,以用於不同環針數量之待測物的測試操作,使得相關製造或設備廠商無須淘汰既有測試機台,即可用來檢驗不同硬體規格之產品,同時提高既有測試機台之使用壽命與生產效能。In summary, the present invention provides a test machine having an upgrade method, which can be operated by a combination of an upgrade transfer plate and a related accessory module, and an additional test is added to the original test area before the upgrade. The test area is used for the test operation of the test object with different number of ring needles, so that the relevant manufacturing or equipment manufacturers can test the products of different hardware specifications without eliminating the existing test machine, and improve the existing test machine. Service life and production efficiency.
以上所述僅為本創作之較佳實施例,凡依本創作申請專利範圍所做之均等變化與修飾,皆應屬本創作之涵蓋範圍。The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made by the scope of the patent application of the present invention should be covered by the present invention.
1‧‧‧測試機台
10、20‧‧‧升級轉板
100‧‧‧轉板
102、30‧‧‧組裝套件模組
1020‧‧‧測試塔座
1022‧‧‧加固環單元
1024‧‧‧基底
12‧‧‧機台本體
120‧‧‧基座
122‧‧‧測式頭座模組
300‧‧‧上方穩固套件模組
3000〜3010‧‧‧上方配件單元
302‧‧‧下方穩固套件模組
3020〜3022‧‧‧下方配件單元
SD‧‧‧容置空間
OB‧‧‧待測物
AP、OP‧‧‧環測針1‧‧‧Testing machine
10, 20‧‧‧ upgrade transfer board
100‧‧‧Transfer
102, 30‧‧‧ Assembly kit module
1020‧‧‧Test tower
1022‧‧‧Reinforcement ring unit
1024‧‧‧Base
12‧‧‧ machine body
120‧‧‧Base
122‧‧‧Measurement head block module
300‧‧‧Top Stabilization Kit Module
3000~3010‧‧‧Upper accessory unit
302‧‧‧Under the stable kit module
3020~3022‧‧‧ below accessory unit
SD‧‧‧ accommodating space
OB‧‧‧ test object
AP, OP‧‧‧ ring stylus
第1圖為本創作實施例之一測試機台之示意圖。 第2圖為本創作實施例之一升級轉板之拆解示意圖。 第3圖為本創作實施例之一升級轉板與一組裝套件模組之拆解示意圖。 第4圖為本創作實施例一升級轉板與一組裝套件模組之側視剖面圖。 第5圖為本創作實施例一升級轉板與一組裝套件模組之組合完成圖。 第6圖為本創作實施例之一測試頭座模組之剖面示意圖。Figure 1 is a schematic diagram of a test machine of one of the creative embodiments. FIG. 2 is a schematic diagram of disassembly of an upgrade transfer board according to one embodiment of the present invention. FIG. 3 is a schematic diagram of disassembly of an upgraded transfer board and an assembly kit module according to an embodiment of the present invention. 4 is a side cross-sectional view of the upgraded transfer plate and an assembly kit module of the first embodiment of the present invention. Figure 5 is a combination of the upgraded transfer board and an assembly kit module of the first embodiment of the present invention. Figure 6 is a cross-sectional view showing a test head block module of one of the creative embodiments.
1‧‧‧測試機台 1‧‧‧Testing machine
10‧‧‧升級轉板 10‧‧‧Upgrade transfer board
100‧‧‧轉板 100‧‧‧Transfer
102‧‧‧組裝套件模組 102‧‧‧Assembly kit module
12‧‧‧機台本體 12‧‧‧ machine body
120‧‧‧基座 120‧‧‧Base
122‧‧‧測式頭座模組 122‧‧‧Measurement head block module
SD‧‧‧容置空間 SD‧‧‧ accommodating space
OB‧‧‧待測物 OB‧‧‧ test object
Claims (9)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462097031P | 2014-12-27 | 2014-12-27 |
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| Publication Number | Publication Date |
|---|---|
| TWM519740U true TWM519740U (en) | 2016-04-01 |
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| TW104218842U TWM519740U (en) | 2014-12-27 | 2015-11-24 | Testing station with upgrading function |
| TW104138887A TWI593971B (en) | 2014-12-27 | 2015-11-24 | Testing station with upgrading function |
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| Application Number | Title | Priority Date | Filing Date |
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| TW104138887A TWI593971B (en) | 2014-12-27 | 2015-11-24 | Testing station with upgrading function |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101754175B1 (en) |
| CN (3) | CN105738658A (en) |
| TW (2) | TWM519740U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI748549B (en) * | 2019-07-08 | 2021-12-01 | 日商山葉汎提克股份有限公司 | Electrical inspection device and holding unit |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101754175B1 (en) * | 2014-12-27 | 2017-07-05 | 싱크-테크 시스템 코포레이션 | Testing station with upgrading function |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5489852A (en) * | 1992-11-06 | 1996-02-06 | Advanced Micro Devices, Inc. | System for interfacing wafer sort prober apparatus and packaged IC handler apparatus to a common test computer |
| US5546405A (en) * | 1995-07-17 | 1996-08-13 | Advanced Micro Devices, Inc. | Debug apparatus for an automated semiconductor testing system |
| JP2005265658A (en) * | 2004-03-19 | 2005-09-29 | Tokyo Electron Ltd | Probe device compatible with multiple types of testers |
| TWI269399B (en) * | 2005-11-24 | 2006-12-21 | Powerchip Semiconductor Corp | Probe apparatus and system |
| JP4823667B2 (en) | 2005-12-05 | 2011-11-24 | 日本発條株式会社 | Probe card |
| KR101242004B1 (en) * | 2007-03-19 | 2013-03-11 | (주) 미코티엔 | Probe card |
| TWI454708B (en) * | 2010-08-31 | 2014-10-01 | Can be adapted to different specifications of the test machine probe card structure | |
| KR101754175B1 (en) * | 2014-12-27 | 2017-07-05 | 싱크-테크 시스템 코포레이션 | Testing station with upgrading function |
-
2015
- 2015-11-23 KR KR1020150164092A patent/KR101754175B1/en active Active
- 2015-11-24 TW TW104218842U patent/TWM519740U/en unknown
- 2015-11-24 TW TW104138887A patent/TWI593971B/en active
- 2015-12-18 CN CN201510953861.6A patent/CN105738658A/en active Pending
- 2015-12-18 CN CN202210182013.XA patent/CN114740227A/en active Pending
- 2015-12-18 CN CN201521064036.2U patent/CN205229208U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI748549B (en) * | 2019-07-08 | 2021-12-01 | 日商山葉汎提克股份有限公司 | Electrical inspection device and holding unit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101754175B1 (en) | 2017-07-05 |
| TW201623975A (en) | 2016-07-01 |
| CN205229208U (en) | 2016-05-11 |
| CN105738658A (en) | 2016-07-06 |
| KR20160079643A (en) | 2016-07-06 |
| TWI593971B (en) | 2017-08-01 |
| CN114740227A (en) | 2022-07-12 |
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