TWM598589U - Heat dissipation mechanism - Google Patents

Abstract

A heat dissipation mechanism is provided, to dissipate heat from a heating element, including a circuit board assembly, a heat-dissipating plate and a support structure. The circuit board assembly includes a first circuit board and a second circuit board. The second circuit board is located on the first circuit board. The heat-dissipating plate is located between the first circuit board and the second circuit board and is connected to the heating element which is on the first circuit board. The support structure extends along a first direction, and supports the first circuit board, the heat-dissipating plate, and the second circuit board. The first circuit board, the heat-dissipating plate, and the second circuit board are sequentially arranged along the first direction.

Description

Cooling mechanism

This creation is about a heat dissipation mechanism, especially a heat dissipation mechanism with a heat dissipation plate.

With the development of technology, people's pursuit of high-performance and high-standard visual enjoyment of electronic products is getting higher and higher in order to enrich and better product experience. Nowadays, there are large-scale data centers that are used to house computer systems and related components, such as telecommunications and storage systems. In existing power supply products, heat dissipation is an important issue, and fan components are often used for heat dissipation. However, in the backup battery unit (BBU) of the data center, it is an instantaneous discharge, which takes about three minutes to supply power. If only cooling by fan thermal convection is used, the effect is not good, and the fan assembly will occupy a certain space, which is not easy. Configuration and arrangement.

An embodiment of the present invention provides a heat dissipation mechanism for dissipating heat from a heating element, and includes a circuit board assembly, a heat dissipation plate and a supporting structure. The circuit board assembly includes a first circuit board and a second circuit board. The second circuit board is located on the first circuit board. The heat sink is located between the first circuit board and the second circuit board and connected to the first circuit board. The heating element on the The supporting structure extends along a first direction and supports the first circuit board, the heat dissipation plate and the second circuit board. Wherein, the first circuit board, the heat dissipation plate and the second circuit board are arranged in sequence along the first direction.

In one embodiment, the aforementioned heat sink has a substantially rectangular structure, and the heat sink has a heat transfer and heat dissipation surface, and the heat dissipation surface is parallel to the first circuit board and the second circuit board.

In one embodiment, the aforementioned heat sink is made of aluminum or copper.

In one embodiment, there is a gap between the aforementioned heat sink and the second circuit board.

In one embodiment, the aforementioned supporting structure has an elongated structure extending along the first direction, and the supporting structure sequentially passes through the first circuit board, the heat dissipation plate and the second circuit board.

In an embodiment, the aforementioned supporting structure has a plurality of supporting columns, which are arranged at a plurality of corners of the heat dissipation plate.

In one embodiment, each of the aforementioned supporting columns includes: a base member that passes through the first circuit board; an extension member that is detachably connected to the base member and passes through the heat dissipation plate; and an upper member that can pass through The extension piece is connected in a detachable manner and passes through the second circuit board.

In one embodiment, the aforementioned extension member has an extension groove, and a base protrusion of the base member is coupled to the extension groove.

In an embodiment, the aforementioned upper member has an upper groove, and an extension protrusion of the extension piece is coupled to the upper groove.

In one embodiment, each of the aforementioned supporting posts further includes a fixing member, and the second circuit board is fixed to the upper component by the fixing member.

The other scopes applicable to the organization or device of this creation will be clear and easy to see in the details provided below. It must be understood that the following detailed description and specific embodiments are only for the purpose of description and are not intended to limit the scope of this creation when the exemplary embodiments of the heat dissipation mechanism are presented.

Unless otherwise defined, all terms used here (including technical and scientific terms) have the same meanings commonly understood by the general artisans to whom the disclosures belong here. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant technology and the background or context of this disclosure, and should not be interpreted as an ideal or overly formal Way of interpretation, unless specifically defined here.

Please refer to FIGS. 1 and 2 together. FIG. 1 is a schematic diagram showing the heat dissipation mechanism 100 according to an embodiment of the invention, and FIG. 2 is an exploded schematic view of the heat dissipation mechanism 100. The heat dissipation mechanism 100 may be disposed inside a data center (Data Center), such as a telecommunication or storage system. In some embodiments, the heat dissipation mechanism 100 may be used as a heat dissipation device for a backup power supply or a backup battery in the data center. In some embodiments, it may be referred to as a circuit board heat dissipation mechanism or a power module heat dissipation mechanism. The detailed structure of the aforementioned heat dissipation mechanism 100 will be described below.

The aforementioned heat dissipation mechanism 100 can be used to dissipate heat for a heating element FV, and it includes a circuit board assembly 10, a heat dissipation plate 20, and a supporting structure 30. If the heating element FV is an electronic device, such as a processor, a memory, a storage unit, and other electronic components or components, the circuit board assembly 10 may be, for example, a printed circuit board (PCB) assembly, which can be used as a backup battery module The circuit board, or used to connect individual electronic components, includes a first circuit board 11 and a second circuit board 12, which are arranged in a vertical direction (first direction D1), and the heat sink 20 is aligned in the first direction D1 It is arranged between the first circuit board 11 and the second circuit board 12 to dissipate heat of the heating element FV, and the supporting structure 30 supports the first circuit board 11, the heat dissipation plate 20 and the second circuit board 12. The aforementioned first circuit board 11 can be used for a circuit board for battery DC voltage transformation, and the second circuit board 12 can be a circuit board for a battery management system (Battery Management System, BMS), but not limited to this.

Regarding the heat sink 20, for example, it is made of aluminum (Al) or copper (Copper, Cu) or a combination thereof, which can be used to dissipate heat from the heating element FV. In this embodiment, the heating element FV is arranged on the first circuit board 11 and between the first circuit board 11 and the second circuit board 12, and the heat sink 20 directly contacts the heating element FV, as in the first , As shown in Figure 3. The heat sink 20 has a substantially rectangular structure. In some embodiments, the heat sink 20 completely covers the heating element FV in the first direction D1, as shown in FIG. 4.

Regarding the support structure 30, it has a long structure, which includes a plurality of support columns 31 (four in this embodiment, but not limited to this). In this embodiment, these support columns 31 are respectively located at the corners of the heat dissipation plate 20 , Or located at the four corners of the circuit board assembly 10. Each support column 31 extends along the first direction D1 and includes a base member 311, an extension member 312 and an upper member 313. The base member 311 can be used as a support stand, and the extension member 312 and the upper member 313 are sequentially stacked on the base member 311 along the first direction D1.

The details of the supporting structure 30 supporting and combining the first circuit board 11, the heat dissipation plate 20, and the second circuit board 12 are shown in the exploded view of FIG. 2 and the combined cross-sectional view of FIG. 3. In this embodiment, the first circuit board 11 has a plurality of first perforations H1, the second circuit board 12 has a plurality of second perforations H2, and the heat sink 20 has a plurality of third perforations H3, which are arranged in the circuit board assembly 10. Or the four corners of the heat sink 20. The first, second, and third perforations H1, H2, and H3 at the same corner correspond to each other. In the first direction D1, these perforations H1, H2, H3 are located on the same axis, and the support column 31 penetrates the first ~The third perforation H1~H3.

The base member 311 of the supporting column 31 of the supporting structure 30 passes through the first circuit board 11 through the first through hole 11H, and the extension member 312 is disposed on the base member 311 and passes through the heat sink 20 through the second through hole 12H. The component 313 is disposed on the extension 312 and passes through the second circuit board 12 through the third through hole 13H, so as to support the first circuit board 11, the heat dissipation plate 20 and the second circuit board 12.

The bottom of the extension piece 312 has an extension groove 312R, and the base piece 311 has a base protrusion 311T. The base protrusion 311T and the extension groove 312R match each other, so that the base protrusion 311T can be combined and received in the extension groove Among the 312R, the extension member 312 is stably disposed on the base member 311.

An extension protrusion 312T of the extension piece 312 passes through the third through hole H3 of the heat sink 20, and the aperture of the third through hole H3 is smaller than the diameter of the body of the extension piece 312, so that the heat sink 20 can be erected on an extension boss of the extension piece 312 312S on.

The upper part 313 has an upper groove 313R, which is matched with the aforementioned extension protrusion 312T, so that the extension protrusion 312T can be combined and received in the upper groove 313R. An upper protrusion 313T of the upper part 313 passes through the second through hole H2 of the second circuit board 12, and the aperture of the second through hole H2 is smaller than the body diameter of the upper part 313, so that the second circuit board 12 can be erected on the upper part 313 On an upper boss 313S.

In this way, with the support structure 30, the first circuit board 11, the heat dissipation plate 20, and the second circuit board 12 can be arranged in sequence along the first direction D1, and the heat dissipation plate 20 is located on the first circuit board 11 and the second circuit board. Between the plates 12. In some embodiments, the first circuit board 11, the heat dissipation plate 20 and the second circuit board 12 are parallel or substantially parallel, and the heat transfer and heat dissipation surface 20D of the heat dissipation plate 20 is also parallel or substantially parallel to the first circuit board 11 and the second circuit board 12.

In this embodiment, the supporting column 31 of the supporting structure 30 further includes a fixing member 314 sleeved on the upper member 313, which can be used to firmly fix the second circuit board 12 on the upper member 313, or in other words, the second The circuit board 12 is firmly sandwiched between the fixing member 314 and the upper boss 313S of the upper part 313.

In some embodiments, the inner wall of the aforementioned base protrusion 311T and the extension groove 312R has a matching thread structure, so that the combination of the two can be more stable. In some embodiments, the aforementioned extending protrusion 312T and the upper groove 313R have a matching thread structure, which also makes the combination of the two more stable. In some embodiments, the base member 311 may be a screw, and the fixing member 314 may be a nut. In some embodiments, the extension piece 312 may be made of plastic material; in other embodiments, the extension piece 312 may be made of copper material. The extension piece 312 passes through the heat dissipation plate 20 and is connected to the heat dissipation plate 20 to allow heat It can also escape through the extension 312.

FIG. 3 shows a schematic diagram of heat dissipation of the heating element FV through the heat sink 20. In the first space SP1, that is, between the first circuit board 11 and the heat dissipation plate 20, since the heat transfer and heat dissipation surface 20D of the heat dissipation plate 20 directly contacts the heating element FV, the heat generated by the heating element FV can contact the thermal conduction (thermal At the same time, thermal convection can also be generated in the first space SP1, which is more conducive to heat dissipation.

On the other hand, in the second space SP2, that is, between the heat sink 20 and the second circuit board 12, since the second circuit board 12 and the heat sink 20 do not touch each other, there is a gap G between them, so that heat dissipation After the board 20 absorbs the heat of the heating element FV (via thermal conduction), it can also generate heat convection in the second space SP2 to dissipate heat. In addition, the gap G between the second circuit board 12 and the heat sink 20 can be effectively The heat insulation prevents the heat dissipation plate 20 from quickly transferring to the upper second circuit board 12 due to absorbing excessive heat (high temperature). In this way, not only the bottom surface of the heat sink 20 (contacting the heating element FV) can dissipate heat by conduction and convection, but also the top surface of the heat sink 20 (near the second circuit board 12) can also perform effective convection, which greatly improves The heat dissipation effect of the heat dissipation mechanism 100.

In addition, since the base member 311, the extension member 312, the upper member 313 and the fixing member 314 of the support column 31 are combined in a detachable manner, for example, the extension member 312 is detachably connected to the base member 311 and passes through the heat dissipation plate 20. , The upper part 313 is detachably connected to the extension part 312 and passes through the second circuit board 12, and the fixing part 314 is detachably connected to the upper part 313 to clamp the second road board 12, which can be easily replaced The heat dissipation plate or reorganization of some parts of the heat dissipation mechanism greatly improves the quality and convenience of the product.

In some embodiments, the number of support columns 31 of the aforementioned support structure 30 can be different from the four support columns 31 of the aforementioned embodiment, and it can be five, six, or more than seven, or it can be combined with other supporting objects, such as By supporting or clamping the post circuit board assembly 10 and the heat sink 20 by a support frame, only one or two support posts 31 can be used to have the same circuit board assembly 10 and heat sink as the previous embodiment (Figure 1) 20 arrangement and interval.

In summary, the embodiment of the present invention provides a heat dissipation mechanism for dissipating heat from a heating element, which includes a circuit board assembly, a heat dissipation plate and a supporting structure. The circuit board assembly includes a first circuit board and a second circuit board. The second circuit board is located on the first circuit board. The heat sink is located between the first circuit board and the second circuit board and connected to the first circuit board. The heating element on the The supporting structure extends along a first direction and supports the first circuit board, the heat dissipation plate and the second circuit board. Wherein, the first circuit board, the heat dissipation plate and the second circuit board are arranged in sequence along the first direction.

The inventive embodiment has at least one of the following advantages or effects. The heat dissipation plate is arranged between the first circuit board and the second circuit board and directly contacts the heating element, and the supporting structure makes the circuit board assembly and the heat dissipation plate sufficient The use of space configuration can also greatly improve the heat dissipation effect of the heating element. In addition, there is a gap between the second circuit board and the heat dissipation plate, which can provide a better heat dissipation effect. In some cases where the backup power supply is enabled, the current change of the circuit of the lower circuit board (such as the first circuit board) is large, for example, the process of transforming from direct current (DC) 54 volts (V) to DC12V, which makes the inductor temperature Elevated, and through the large area and direct contact heat dissipation plate, and is arranged between the first circuit board and the second circuit board, the heating element can be more effectively dissipated.

The ordinal numbers in this specification and the scope of the patent application, such as "first", "second", etc., do not have a sequential relationship with each other, and they are only used to identify two different elements with the same name.

The above-mentioned embodiments are described in sufficient detail so that those with ordinary knowledge in the technical field can implement the device disclosed in this creation through the above description, and it must be understood that, without departing from the spirit and scope of this creation, Some changes and modifications can be made, so the scope of protection of this creation shall be subject to the scope of the attached patent application.

100: cooling mechanism 10: Circuit board components 11: The first circuit board 12: The second circuit board 20: Heat sink 20D: Heat transfer surface 30: Supporting structure 31: Support column 311: Base Parts 311T: Base convex 312: Extension 312R: Extension groove 312S: Extension boss 312T: Extension convex 313: Upper part 313R: upper groove 313S: Upper boss 313T: Upper convex part 314: fixed parts A’-A’: Line segment D1: First direction FV: heating element G: gap H1: First perforation H2: second piercing H3: Third piercing SP1: first space SP2: second space

Figure 1 is a schematic diagram showing the heat dissipation mechanism of an embodiment of the invention. Figure 2 is an exploded schematic diagram showing the heat dissipation mechanism in Figure 1. Figure 3 is a schematic cross-sectional view taken along the line A'-A' in Figure 1. FIG. 4 is a schematic diagram showing a top perspective view of the heat sink and the first circuit board.

100: cooling mechanism

10: Circuit board components

11: The first circuit board

12: The second circuit board

20: Heat sink

30: Supporting structure

31: Support column

A’-A’: Line segment

D1: First direction

FV: heating element

SP1: first space

SP2: second space

Claims (10)

A heat dissipation mechanism for dissipating heat from a heating element, including: A circuit board assembly, including: A first circuit board; and A second circuit board located on the first circuit board; A heat dissipation plate located between the first circuit board and the second circuit board and connected to the heating element on the first circuit board; and A supporting structure extending along a first direction to support the first circuit board, the heat dissipation plate and the second circuit board; Wherein, the first circuit board, the heat dissipation plate and the second circuit board are arranged in sequence along the first direction. The heat dissipation mechanism of claim 1, wherein the heat dissipation plate has a substantially rectangular structure, and the heat dissipation plate has a heat transfer and heat dissipation surface, and the heat dissipation surface is parallel to the first circuit board and the second circuit board. Such as the heat dissipation mechanism of claim 1, wherein the heat dissipation plate is made of aluminum or copper. Such as the heat dissipation mechanism of claim 1, wherein there is a gap between the heat dissipation plate and the second circuit board. Such as the heat dissipation mechanism of claim 1, wherein the support structure has an elongated structure extending in a first direction, and the support structure passes through the first circuit board, the heat dissipation plate and the second circuit board in sequence. For example, the heat dissipation mechanism of claim 5, wherein the support structure has a plurality of support columns arranged at a plurality of corners of the heat dissipation plate. For example, the heat dissipation mechanism of claim 6, wherein each support column includes: A base member passing through the first circuit board; An extension piece connected to the base piece in a detachable manner and passing through the heat dissipation plate; and An upper part is connected to the extension part in a detachable manner and passes through the second circuit board. Such as the heat dissipation mechanism of claim 7, wherein the extension member has an extension groove, and a base protrusion of the base member is coupled to the extension groove. Such as the heat dissipation mechanism of claim 7, wherein the upper component has an upper groove, and an extension protrusion of the extension piece is coupled to the upper groove. Such as the heat dissipation mechanism of claim 7, wherein each of the supporting columns further includes a fixing member, and the second circuit board is fixed to the upper component by the fixing member.

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