TWI881859B - Busbar assembly and server device - Google Patents

Abstract

A server device includes a casing, power supply module, at least one server and a busbar assembly. The power supply module, the server and the busbar assembly are disposed in the casing. The busbar assembly includes a vertical busbar, a horizontal busbar and two conductive connecting plates. The vertical busbar is electrically connected to the power supply module. The horizontal busbar is connected to the vertical bus, and is electrically connected to the at least one server. The two conductive connecting plates are electrically connected to the vertical busbar and the horizontal busbar. The vertical busbar is perpendicular to the horizontal busbar.

Description

Bus assemblies and server devices

The present invention relates to a bus assembly and a server device, in particular to a bus assembly and a server device having a plurality of mutually perpendicular buses.

Modern society is in an era of rapid development of information technology. Most companies use servers to assist in business processing, such as storing programs, files and data, to improve work efficiency.

Generally speaking, the higher the performance of a server, the higher the heat it generates. Therefore, high-performance servers need to be cooled by a high-efficiency cooling system such as an immersion cooling system. Among them, the immersion cooling system cools the server through direct convection of liquid, so the server generally uses a blade server. However, the blade server is directly installed in the server cabinet. In other words, the installation direction of the blade server is different from the installation direction of the power supply. In the server cabinet, the power supply will supply power to the server through a bus, so the server and power supply with different installation directions will cause inconvenience in installing the bus. Therefore, how to improve the convenience of the configuration in the server cabinet is one of the problems that researchers should solve.

The present invention provides a bus assembly and a server device, which are convenient for configuration in a server cabinet.

The bus assembly disclosed in one embodiment of the present invention is used to electrically connect a power supply module and at least one server, and includes a vertical bus and a transverse bus. The vertical bus includes a first positive plate, a first negative plate and a first insulating plate. The first insulating plate is at least partially disposed between the first positive plate and the first negative plate. The first positive plate and the first negative plate are used to electrically connect the power supply module. The transverse bus is connected to the vertical bus, and includes a second positive plate, a second negative plate and a second insulating plate. The second insulating plate is at least partially disposed between the second positive plate and the second negative plate. The second positive plate and the second negative plate are used to electrically connect at least one server. The two conductive connecting plates are electrically connected to the first positive plate and the second positive plate, and are electrically connected to the first negative plate and the second negative plate, respectively. The first positive plate and the first negative plate are perpendicular to the second positive plate and the second negative plate.

Another embodiment of the present invention discloses a server device including a power supply module, at least one server and a bus assembly. The power supply module is disposed in a housing. At least one server is disposed in a housing. The bus assembly is disposed in the housing and includes a vertical bus and a horizontal bus. The vertical bus includes a first positive plate, a first negative plate and a first insulating plate. The first insulating plate is at least partially disposed between the first positive plate and the first negative plate. The first positive plate and the first negative plate are electrically connected to the power supply module. The horizontal busbar is connected to the vertical busbar and includes a second positive plate, a second negative plate and a second insulating plate. The second insulating plate is at least partially disposed between the second positive plate and the second negative plate. The second positive plate and the second negative plate are electrically connected to at least one server. The two conductive connecting plates are electrically connected to the first positive plate and the second positive plate, and are electrically connected to the first negative plate and the second negative plate, respectively. The first positive plate and the first negative plate are perpendicular to the second positive plate and the second negative plate.

According to the busbar assembly and server device of the above-mentioned embodiment, since the first positive plate and the first negative plate of the vertical busbar are respectively perpendicular to the second positive plate and the second negative plate of the horizontal busbar, the busbar assembly is configured to be horizontally and vertically converted, so it can match the power supply module and the server with perpendicular installation directions. In this way, when the immersion cooling system is used to dissipate heat from the server vertically installed in the case, there is no need to install other assembly components, and the power supply module and the server can be electrically connected through the horizontally and vertically converted busbar assembly, thereby improving the convenience of the configuration in the case.

The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figures 1 to 6. Figure 1 is a plan view schematic diagram of a server device according to the first embodiment of the present invention. Figure 2 is a plan view schematic diagram of an exploded view of the server device of Figure 1. Figure 3 is a three-dimensional schematic diagram of a bus assembly of the server device of Figure 1. Figure 4 is another three-dimensional schematic diagram of the bus assembly of the server device of Figure 1. Figure 5 is a three-dimensional schematic diagram of a part of the server device of Figure 1, which is enlarged. Figure 6 is a three-dimensional schematic diagram of a part of the server device of Figure 1, which is enlarged.

The server device 10 of the present embodiment includes a housing 11, a power supply module 12, a server 13, and a bus assembly 14. The power supply module 12, the server 13, and the bus assembly 14 are disposed in the housing 11, and the arrangement direction of the power supply module 12 is, for example, perpendicular to the arrangement direction of the server 13. Specifically, the power supply module 12 is, for example, horizontally disposed in the housing 11, and the server 13 is, for example, vertically disposed in the housing 11, and the power supply module 12 and the server 13 are, for example, arranged in layers. For example, the power supply module 12 is located at the upper layer in the housing 11, and the server 13 is located at the lower layer in the housing 11. That is, the server 13 is located at the bottom side of the power supply module 12. The server 13 is, for example, a blade server and is used to dissipate heat through an immersion cooling system (not shown). Since the immersion cooling system dissipates heat from the server 13 through vertical convection of liquid, the efficiency of the immersion cooling system in dissipating heat from the server 13 can be improved by vertically placing the server 13 in the housing 11.

The bus assembly 14 is disposed on the housing 11 and is located on one side of the power supply module 12 and the server 13. The bus assembly 14 includes a first housing 141, a connecting housing 142, a second housing 143, a vertical bus 144, a horizontal bus 145 and two conductive connecting plates 149. The first housing 141 accommodates the vertical bus 144. The second housing 143 accommodates the horizontal bus 145. The connecting housing 142 connects the first housing 141 and the second housing 143 and accommodates the two conductive connecting plates 149.

The vertical busbar 144 includes a first positive plate 1441, a first negative plate 1442 and a first insulating plate 1443. The first insulating plate 1443 is at least partially disposed between the first positive plate 1441 and the first negative plate 1442. The first positive plate 1441 and the first negative plate 1442 are electrically connected to the power supply module 12. The horizontal busbar 145 is connected to the vertical busbar 144 and includes a second positive plate 1451, a second negative plate 1452 and a second insulating plate 1453. The second insulating plate 1453 is at least partially disposed between the second positive plate 1451 and the second negative plate 1452. The two conductive connecting plates 149 are electrically connected to the first positive plate 1441 and the second positive plate 1451, and are electrically connected to the first negative plate 1442 and the second negative plate 1452. The server 13 includes an electrical connector 131. The second positive plate 1451 and the second negative plate 1452 are electrically connected to the electrical connector 131. In this way, the power supply module 12 can supply power to the server 13 through the vertical bus 144 and the horizontal bus 145. The first positive plate 1441 and the first negative plate 1442 are, for example, perpendicular to the second positive plate 1451 and the second negative plate 1452, respectively. That is, the bus assembly 14 is in a configuration that is switched horizontally and vertically.

In this embodiment, since the first positive plate 1441 and the first negative plate 1442 of the vertical bus 144 are respectively perpendicular to the second positive plate 1451 and the second negative plate 1452 of the horizontal bus 145, the bus assembly 14 is configured to be horizontally and vertically converted, so it can match the power supply module 12 and the server 13 that are arranged in perpendicular directions. In this way, when the immersion cooling system is used to dissipate heat from the server 13 vertically arranged in the case 11, there is no need to install other assembly components, and the power supply module 12 and the server 13 can be electrically connected through the horizontally and vertically converted bus assembly 14, thereby improving the convenience of the configuration in the case 11.

In this embodiment, the busbar assembly 14 may further include an assembly frame 146. The assembly frame 146 includes a bottom plate 1461, a connecting plate 1462, two upper assembly side plates 1463, two lower assembly side plates 1464 and a plurality of connecting pieces 1465. The bottom plate 1461 is disposed on the second housing 143. The connecting plate 1462 is vertically connected to the bottom plate 1461 through the connecting pieces 1465. In this way, the structural strength of the connection between the connecting plate 1462 and the bottom plate 1461 can be increased through the connecting pieces 1465. The two upper assembly side plates 1463 are vertically connected to opposite sides of the bottom plate 1461 and the connecting plate 1462. The two lower assembly side plates 1464 are vertically connected to a side of the second housing 143 away from the two upper assembly side plates 1463 , and the two upper assembly side plates 1463 and the two lower assembly side plates 1464 are fixed to the housing 11 .

In detail, the housing 11 includes a housing 111 and two limiting posts 112. The power supply module 12, the server 13, the bus assembly 14 and the two limiting posts 112 are disposed in the housing 111, and the two upper assembly side panels 1463 and the two lower assembly side panels 1464 are fixed to the housing 111. Each upper assembly side panel 1463 has a limiting groove 14631. The server 13 includes a positioning post 132. The docking plate 1462 has a plurality of positioning holes 14621. These positioning holes 14621 are arranged along the extension direction of the docking plate 1462. That is, these positioning holes 14621 are arranged horizontally. The assembly frame 146 moves along the direction A so that the two limiting posts 112 are respectively disposed in the two limiting grooves 14631 , and the positioning holes 14621 are provided for the positioning posts 132 to be selectively inserted, so as to position the housing 11 , the bus assembly 14 and the server 13 .

In this embodiment, the connecting housing 142 and the second housing 143 may each have a plurality of heat dissipation holes H on one side away from the first housing 141 . In this way, a heat sink (not shown) disposed in the server device 10 may dissipate heat from the bus assembly 14 through these heat dissipation holes H.

In this embodiment, the busbar assembly 14 may further include two first guide plates 1495 and two second guide plates 1496. The two first guide plates 1495 are disposed on the vertical busbar 144, and the first positive plate 1441, the first negative plate 1442, and the first insulating plate 1443 are at least partially located between the two first guide plates 1495. The two second guide plates 1496 are disposed on the horizontal busbar 145, and the second positive plate 1451, the second negative plate 1452, and the second insulating plate 1453 are at least partially located between the two second guide plates 1496. By providing two first guide plates 1495 and two second guide plates 1496, the electrical connection between the power supply module 12 and the vertical bus 144 and the electrical connection between the electrical connector 131 of the server 13 and the horizontal bus 145 can be guided, and the vertical bus 144 and the horizontal bus 145 can be protected respectively. In addition, since the two first guide plates 1495 and the two second guide plates 1496 are non-electrodes, the two first guide plates 1495 and the two second guide plates 1496 can also be used for grounding.

In this embodiment, the number of the positioning column 132 of the server 13 is only one, but not limited to this. In other embodiments, the number of the positioning column of the server can also be multiple.

Please refer to FIG. 7. FIG. 7 is a schematic plan view of the assembly of the power supply module, the server, and the bus assembly in the server device of FIG. 1. When the user wants to assemble the server device 10, the power supply module 12, the server 13, and the bus assembly 14 can be assembled along the direction B so that the power supply module 12 and the server 13 are electrically connected through the bus assembly 14. In other words, the power provided by the power supply module 12 is transmitted to the server 13 through the horizontally and vertically converted bus assembly 14. In this way, the assembly of the server device 10 can be completed.

Please refer to Figure 8. Figure 8 is a three-dimensional schematic diagram of a server device according to the second embodiment of the present invention. The server device 10A of this embodiment is similar to the server device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated.

In the server device 10A of the present embodiment, the housing 11A may further include a layer 113. The layer 113 is disposed on the housing 111 as shown in FIGS. 1 to 6. The bus assembly 14A further includes a fixing member 147 and a supporting member 148. The fixing member 147 fixes the connecting housing 142 to the layer 113. The supporting member 148 is disposed on the first housing 141 and the fixing member 147 and provides support for the first housing 141. In this way, the bus assembly 14A can be more stably disposed in the housing 11A through the support of the fixing member 147 and the supporting member 148.

In the above-mentioned embodiment, the number of the server 13 is single, but not limited thereto. In other embodiments, please refer to FIG. 9 and FIG. 10. FIG. 9 is a plan view schematic diagram of a server device according to the third embodiment of the present invention. FIG. 10 is a partially enlarged three-dimensional schematic diagram of the server device of FIG. 9. The server device 10B of this embodiment is similar to the server device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated.

In the server device 10B of the present embodiment, there are multiple servers 13. These servers 13 and these positioning holes 14621 are arranged along the extension direction of the docking plate 1462. In other words, these servers 13 and these positioning holes 14621 are arranged horizontally. These servers 13 are respectively inserted into these positioning holes 14621 through these positioning columns 132 to be positioned on the bus assembly 14. In addition, the power supply module 12 can supply power to these servers 13 through the bus assembly 14.

According to the busbar assembly and server device of the above-mentioned embodiment, since the first positive plate and the first negative plate of the vertical busbar are respectively perpendicular to the second positive plate and the second negative plate of the horizontal busbar, the busbar assembly is configured to be horizontally and vertically converted, so it can match the power supply module and the server with perpendicular installation directions. In this way, when the immersion cooling system is used to dissipate heat from the server vertically installed in the case, there is no need to install other assembly components, and the power supply module and the server can be electrically connected through the horizontally and vertically converted busbar assembly, thereby improving the convenience of the configuration in the case.

Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone skilled in similar techniques may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

10,10A,10B: Server device 11,11A: Casing 111: Casing 112: Limiting column 113: Shelf 12: Power supply module 13: Server 131: Electrical connector 132: Positioning column 14,14A: Busbar assembly 141: First housing 142: Connecting housing 143: Second housing 144: Vertical busbar 1441: First positive plate 1442: First negative plate 1443: First insulating plate 145: Horizontal busbar 1451: Second positive plate 1452: Second negative plate 1453: Second insulating plate 146: Assembly frame 1461: Bottom plate 1462: Anchor plate 14621: Positioning hole 1463: Upper assembly side plate 14631: Limiting groove 1464: Lower assembly side plate 1465: Anchor 147: Fixing piece 148: Support piece 149: Conductive connection plate 1495: First guide plate 1496: Second guide plate A, B: Direction H: Heat dissipation hole

FIG. 1 is a schematic plan view of a server device according to the first embodiment of the present invention. FIG. 2 is a schematic plan view of a server device in FIG. 1 in exploded form. FIG. 3 is a schematic three-dimensional view of a bus assembly of the server device in FIG. 1. FIG. 4 is another schematic three-dimensional view of a bus assembly of the server device in FIG. 1. FIG. 5 is a schematic three-dimensional perspective view of a bus assembly of the server device in FIG. 1. FIG. 6 is a partially enlarged three-dimensional view of the server device in FIG. 1. FIG. 7 is a schematic plan view of the power supply module, the server, and the bus assembly in the server device in FIG. 1. FIG. 8 is a schematic three-dimensional view of a server device according to the second embodiment of the present invention. FIG. 9 is a schematic plan view of a server device according to the third embodiment of the present invention. FIG10 is a partially enlarged three-dimensional schematic diagram of the server device in FIG9 .

14: Bus assembly

141: First shell

142: Connecting shell

143: Second shell

144: Vertical busbar

1441: First positive plate

1442: First negative plate

1443: First insulation board

145: Horizontal bus

1451: Second positive plate

1452: Second negative plate

1453: Second insulation board

146:Assembly frame

149: Conductive connecting plate

Claims (11)

A bus assembly is provided for being arranged in a housing and electrically connecting a power supply module and at least one server, the bus assembly comprising: a vertical bus, comprising a first positive plate, a first negative plate and a first insulating plate, the first insulating plate being at least partially arranged between the first positive plate and the first negative plate, and the first positive plate and the first negative plate being used to electrically connect the power supply module; a horizontal bus, connected to the vertical bus, and comprising a second positive plate, a second negative electrode plate and a second insulating plate, wherein the second insulating plate is at least partially disposed between the second positive electrode plate and the second negative electrode plate, and the second positive electrode plate and the second negative electrode plate are used to electrically connect the at least one server; and two conductive connecting plates, electrically connecting the first positive electrode plate and the second positive electrode plate, and electrically connecting the first negative electrode plate and the first two negative plates; a first shell for accommodating the vertical busbar; a second shell for accommodating the horizontal busbar; a connecting shell for connecting the first shell and the second shell and accommodating the two conductive connecting plates; and an assembly frame, comprising a bottom plate, a connecting plate, at least one connecting member, two upper assembly side plates and two lower assembly side plates, the bottom plate being arranged on the first shell and the second shell. Two housings, the connecting plate is vertically connected to the bottom plate through the at least one connecting member, the two upper assembly side plates are vertically connected to the opposite sides of the bottom plate and the connecting plate, and the two lower assembly side plates are vertically connected to one side of the bottom plate away from the two upper assembly side plates; wherein the first positive electrode plate and the first negative electrode plate are perpendicular to the second positive electrode plate and the second negative electrode plate. The bus assembly as described in claim 1, wherein the docking plate has at least one positioning hole, and the at least one positioning hole is used for inserting at least one positioning post of the at least one server for positioning. The bus assembly as described in claim 1, wherein at least one of the two upper assembly side panels has a limiting groove, and the limiting groove is used to provide at least one limiting column of the casing to allow the bus assembly to be positioned in the casing. The bus assembly as described in claim 1 further includes a fixing member and a supporting member, wherein the fixing member is used to fix the connecting shell to a layer plate of a server cabinet, and the supporting member is arranged on the first shell and the fixing member to provide support for the first shell. A busbar assembly as described in claim 1, wherein a side of the connecting shell away from the first shell and a side of the second shell away from the first shell each have a plurality of heat dissipation holes. A server device comprises: a housing; a power supply module disposed in the housing; at least one server disposed in the housing; and a bus assembly disposed in the housing, the bus assembly comprising: a vertical bus comprising a first positive plate, a first negative plate and a first insulating plate, the first insulating plate being at least partially disposed between the first positive plate and the first negative plate, and the first positive plate and the first negative plate being electrically connected to the power supply module; a horizontal busbar connected to the vertical busbar and comprising a second positive plate, a second negative plate and a second insulating plate, the second insulating plate being at least partially disposed between the second positive plate and the second negative plate, and the second positive plate and the second negative plate being electrically connected to the at least one server; two conductive connecting plates, electrically connected to the first positive plate and the second positive plate, respectively, to and electrically connects the first negative plate and the second negative plate; a first shell accommodating the vertical bus bar; a second shell accommodating the horizontal bus bar; a connecting shell connecting the first shell and the second shell and accommodating the two conductive connecting plates; and an assembly frame, comprising a bottom plate, a connecting plate, at least one connecting member, two upper assembly side plates and two lower assembly side plates, the bottom plate being arranged on the second shell, The connecting plate is vertically connected to the bottom plate through the at least one connecting piece, the two upper assembly side plates are vertically connected to the bottom plate and the opposite sides of the connecting plate, the two lower assembly side plates are vertically connected to one side of the bottom plate away from the two upper assembly side plates, and the two upper assembly side plates and the two lower assembly side plates are fixed to the housing; wherein the first positive electrode plate and the first negative electrode plate are perpendicular to the second positive electrode plate and the second negative electrode plate. A server device as described in claim 6, wherein the at least one server includes at least one positioning post, and the docking plate has at least one positioning hole, and the at least one positioning hole is used for inserting the at least one positioning post, so that the bus assembly is positioned on the at least one server. A server device as described in claim 7, wherein the number of the at least one server and the number of the at least one positioning hole are multiple, the servers and the positioning holes are arranged along the extension direction of the docking plate, and the servers are located on the bottom side of the power supply module, and the bus assembly is located on one side of the power supply module and the servers. A server device as described in claim 8, wherein the casing includes a shell and at least one limiting column, the power supply module, the servers, the bus assembly and the at least one limiting column are arranged in the shell, at least one of the two upper assembly side panels has a limiting groove, and the at least one limiting column is arranged in the at least one limiting groove to position the bus assembly in the shell. A server device as described in claim 6, wherein the bus assembly includes a fixing member and a supporting member, the fixing member is used to fix the connecting shell to a layer plate of a server cabinet, and the supporting member is arranged on the first shell and the fixing member to provide support for the first shell. A server device as described in claim 6, wherein a side of the connecting shell away from the first shell and a side of the second shell away from the first shell each have a plurality of heat dissipation holes.

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