TWM568268U - The cladding material for terminal - Google Patents
The cladding material for terminal Download PDFInfo
- Publication number
- TWM568268U TWM568268U TW107208020U TW107208020U TWM568268U TW M568268 U TWM568268 U TW M568268U TW 107208020 U TW107208020 U TW 107208020U TW 107208020 U TW107208020 U TW 107208020U TW M568268 U TWM568268 U TW M568268U
- Authority
- TW
- Taiwan
- Prior art keywords
- plating layer
- terminal
- layer
- nickel
- plating
- Prior art date
Links
- 239000000463 material Substances 0.000 title description 2
- 238000005253 cladding Methods 0.000 title 1
- 238000007747 plating Methods 0.000 claims abstract description 73
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052737 gold Inorganic materials 0.000 claims abstract description 18
- 239000010931 gold Substances 0.000 claims abstract description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 13
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 7
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 9
- 230000007797 corrosion Effects 0.000 abstract description 9
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 229910001080 W alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
本創作公開一種用於端子之電鍍鍍層，所述電鍍鍍層包括電鍍於端子表面的銅鍍層，銅鍍層表面依次電鍍有鎳鍍層、鎳鎢鍍層、內金鍍層、鈀鍍層、外金鍍層以及銠釕鍍層。本創作用於端子之電鍍鍍層藉由設置鎳鎢鍍層、鈀鍍層以及銠釕鍍層可以有效提高端子的耐磨性、防腐蝕性以及硬度和電接觸性能，使得端子使用壽命長。The present invention discloses an electroplating coating for a terminal, the electroplating layer comprising a copper plating layer plated on a surface of the terminal, the surface of the copper plating layer being sequentially plated with a nickel plating layer, a nickel tungsten plating layer, an inner gold plating layer, a palladium plating layer, an outer gold plating layer and a crucible layer. Plating. The electroplating coating for the terminal can effectively improve the wear resistance, corrosion resistance, hardness and electrical contact performance of the terminal by providing nickel-tungsten plating, palladium plating and ruthenium plating, so that the terminal has a long service life.
Description
本創作涉及一種用於端子之電鍍鍍層，尤其是涉及一種能使端子具有耐磨擦性及耐腐蝕性的電鍍鍍層。The present invention relates to an electroplated coating for a terminal, and more particularly to an electroplated coating capable of providing a terminal with abrasion resistance and corrosion resistance.
隨著電子設備不斷普及，其使用的頻率越來越高，如手機、平板電腦等，在使用的過程中，其接口線路的功能將由單純的充電或數據傳輸轉為二合一的狀況，且隨著快充技術將繼續普及，高頻次、耐高壓及強電流的連接器元件接口對接觸端子的性能要求逐漸提高，並且該接口經常與數據線之間進行插拔，故經常會被手觸摸到，長時間使用後，容易造成接口內的端子受到環境腐蝕、電腐蝕以及磨損，進而影響電子設備的使用壽命。With the increasing popularity of electronic devices, the frequency of their use is increasing, such as mobile phones, tablet computers, etc., in the process of use, the function of the interface line will be changed from simple charging or data transmission to two-in-one, and As the fast charging technology will continue to be popularized, the high-frequency, high-voltage and high-current connector component interfaces gradually improve the performance requirements of the contact terminals, and the interface is often plugged and unplugged with the data lines, so it is often handed When touched, after long-term use, it is easy to cause the terminals in the interface to be corroded by the environment, electrical corrosion and wear, thereby affecting the service life of the electronic device.
因此，有必要提供一種用於端子之電鍍鍍層，使得搭載該端子的電子設備，得以具有耐腐蝕性及耐磨損性，能以增加端子的使用壽命，進而延長電子設備的使用時間。Therefore, it is necessary to provide an electroplating layer for a terminal, so that an electronic device equipped with the terminal can have corrosion resistance and wear resistance, and can increase the service life of the terminal, thereby prolonging the use time of the electronic device.
本創作之目的提供一種用於端子之電鍍鍍層，該用於端子之電鍍鍍層具有耐磨性、防腐蝕性以及硬度和電接觸性能。The purpose of the present invention is to provide an electroplated coating for terminals having an abrasion resistance, corrosion resistance, and hardness and electrical contact properties.
為了實現以上目的，本創作公開一種用於端子之電鍍鍍層，包括電鍍於端子表面的銅鍍層，銅鍍層表面依次電鍍有鎳鍍層、鎳鎢鍍層、內金鍍層、鈀鍍層、外金鍍層以及銠釕鍍層。In order to achieve the above object, the present invention discloses an electroplating coating for a terminal, comprising a copper plating layer plated on a surface of a terminal, wherein the surface of the copper plating layer is sequentially plated with a nickel plating layer, a nickel tungsten plating layer, an inner gold plating layer, a palladium plating layer, an outer gold plating layer, and a crucible.钌 plating.
承上所述，本創作用於端子之電鍍鍍層俾藉由設置鎳鎢鍍層、鈀鍍層以及銠釕鍍層可以有效提高端子的耐磨性、防腐蝕性以及硬度和電接觸性能，使得端子使用壽命長。As mentioned above, the electroplating coating used for the terminal can effectively improve the wear resistance, corrosion resistance, hardness and electrical contact performance of the terminal by setting nickel-tungsten plating, palladium plating and ruthenium plating, so that the service life of the terminal long.
為詳細說明本創作之技術內容、構造特徵、所達成的目的及功效，以下茲例舉實施例並配合圖式詳予說明。To clarify the technical content, structural features, objectives, and effects of the present invention, the embodiments are described in detail below with reference to the drawings.
請參閱第一圖，一種用於端子１之電鍍鍍層，其包括電鍍於端子１表面的銅鍍層２，銅鍍層２表面依次電鍍有鎳鍍層３、鎳鎢鍍層４、內金鍍層５、鈀鍍層６、外金鍍層７以及銠釕鍍層８。Referring to the first figure, an electroplating coating for the terminal 1 includes a copper plating layer 2 plated on the surface of the terminal 1. The surface of the copper plating layer 2 is sequentially plated with a nickel plating layer 3, a nickel tungsten plating layer 4, an inner gold plating layer 5, and a palladium plating layer. 6. The outer gold plating layer 7 and the ruthenium plating layer 8.
由於端子１一般來說採用銅材料，以提供端子１的信號傳輸性能和導電性能；在端子１表面電鍍一層銅鍍層２，與端子１可以緊密結合，同時在端子１表面形成較為平整的電鍍層，避免尖端效應。鎳鍍層３用於提高鹽霧及作為鎳鎢鍍層４及銅鍍層２的過渡層。鎳鎢鍍層４為奈米鍍層，具有較好的耐磨性能和防腐蝕，尤其是耐硝酸性能，用於提高硝酸測試能力並增加耐磨性；鈀鍍層６的硬度較大，可以提高端子１的硬度，防止其彎曲延伸，耐插拔；銠釕鍍層８可以提高端子１的電接觸性能，其硬度高且接觸電阻小，用以提高端子的耐硝酸、耐磨性、耐鹽霧等特性；同時還具有較高的硬度和良好的抗腐蝕性、耐插拔以及耐手汗電解；鎳鎢合金鍍層５、鈀鍍層６以及銠釕鍍層８可以有效提高端子１的耐磨性、防腐蝕性以及硬度和電接觸性能；而在這三種鍍層間採用金鍍層作為過渡層，金具有較好的延展性，可以緩衝或消減上述三種鍍層的內應力，防止鍍層出現裂縫，從而使得電鍍鍍層具有較好的性能，具體地，內金鍍層５用於提高導電性能及降低鎳鎢合金鍍層５及鈀鍍層６間的內應力以提高與後續鍍層的結合力；外金鍍層７用於提高鈀鍍層６及銠釕鍍層８之間的結合力並可用於端子焊錫。Since the terminal 1 is generally made of a copper material to provide signal transmission performance and electrical conductivity of the terminal 1, a copper plating layer 2 is plated on the surface of the terminal 1, and can be tightly bonded to the terminal 1, and a relatively flat plating layer is formed on the surface of the terminal 1. To avoid cutting-edge effects. The nickel plating layer 3 serves to enhance the salt spray and the transition layer as the nickel-tungsten plating layer 4 and the copper plating layer 2. Nickel-tungsten coating 4 is a nano-plated layer with good wear resistance and corrosion resistance, especially nitric acid resistance, used to improve nitric acid testing ability and increase wear resistance; palladium plating layer 6 has higher hardness and can improve terminal 1 The hardness is prevented from bending and extending, and the plugging is resistant; the coating 8 can improve the electrical contact performance of the terminal 1, the hardness is high and the contact resistance is small, and the terminal is resistant to nitric acid, abrasion resistance and salt spray resistance. At the same time, it has high hardness and good corrosion resistance, plugging resistance and hand sweat resistance. Nickel-tungsten alloy coating 5, palladium plating layer 6 and ruthenium plating layer 8 can effectively improve the wear resistance and corrosion resistance of terminal 1. Sex and hardness and electrical contact properties; and gold plating as a transition layer between the three coatings, gold has good ductility, can buffer or reduce the internal stress of the above three coatings, prevent cracks in the coating, so that the electroplated coating has Better performance, specifically, the inner gold plating layer 5 is used to improve the electrical conductivity and reduce the internal stress between the nickel-tungsten alloy plating layer 5 and the palladium plating layer 6 to improve the junction with the subsequent plating layer. Force; outer gold plating layer 7 for improving palladium and rhodium, ruthenium plating layer 6 bonding force between the coating 8 can be used to solder the terminal.
具體地，銅鍍層２的厚度為０．５～３．５µmSpecifically, the thickness of the copper plating layer 2 is 0.5 to 3.5 μm.
具體地，鎳鍍層３的厚度為０．５～２．５µmSpecifically, the thickness of the nickel plating layer 3 is 0.5 to 2.5 μm.
具體地，鎳鎢鍍層４的厚度為１～３．５µmSpecifically, the thickness of the nickel-tungsten plating layer 4 is 1 to 3.5 μm.
具體地，內金鍍層５的厚度為０．０７５～２．５µmSpecifically, the thickness of the inner gold plating layer 5 is 0.075 to 2.5 μm.
具體地，鈀鍍層６的厚度為０．１２５～２．０µmSpecifically, the thickness of the palladium plating layer 6 is 0.125 to 2.0 μm.
具體地，外金鍍層７的厚度為０．０７５～１．０µmSpecifically, the outer gold plating layer 7 has a thickness of 0.075 to 1.0 μm.
具體地，銠釕鍍層８的厚度為０．１２５～２．５µmSpecifically, the thickness of the ruthenium plating layer 8 is 0.125 to 2.5 μm.
承上所述，將本創作用於端子之電鍍鍍層鍍於一種端子１上，該端子１可以做為目前電子接口中的端子，並使該電子接口可以作為各種數據連接線的接口，如ＵＳＢ接口；也可以為電連接器的電子接口，或其他用於信號傳輸或導電的接口；更進一步地，該電連接器可設於各種電子設備中，如手機、筆記型電腦、平板電腦、相機、電腦等具有數據處理或具有存儲功能的設備。As described above, the electroplating coating for the terminal is plated on a terminal 1, which can be used as a terminal in the current electronic interface, and can be used as an interface of various data connectors, such as USB. Interface; can also be an electrical interface of an electrical connector, or other interface for signal transmission or conduction; further, the electrical connector can be installed in various electronic devices, such as a mobile phone, a notebook computer, a tablet computer, a camera A device such as a computer that has data processing or storage capabilities.
以上內容僅為本創作的較佳實施例，對於本領域的普通技術人員，依據本創作的思想，在具體實施方式及應用範圍上均會有改變之處本說明書的內容不應理解為對本創作的限制。The above content is only a preferred embodiment of the present invention. For those skilled in the art, the content of the present specification and the scope of application may be changed according to the idea of the present invention. limits.
１‧‧‧端子1‧‧‧terminal
２‧‧‧銅鍍層 2‧‧‧ copper plating
３‧‧‧鎳鍍層 3‧‧‧ Nickel plating
４‧‧‧鎳鎢鍍層 4‧‧‧ Nickel-Tungsten Coating
５‧‧‧內金鍍層 5‧‧‧ Inner gold plating
６‧‧‧鈀鍍層 6‧‧‧Palladium plating
７‧‧‧外金鍍層 7‧‧‧Exposed gold plating
８‧‧‧銠釕鍍層。 8‧‧‧铑钌 plating.
第一圖係本創作用於端子之電鍍鍍層之一種結構示意圖。The first figure is a structural schematic diagram of the electroplating coating for the terminal.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107208020U TWM568268U (en) | 2018-06-14 | 2018-06-14 | The cladding material for terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107208020U TWM568268U (en) | 2018-06-14 | 2018-06-14 | The cladding material for terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM568268U true TWM568268U (en) | 2018-10-11 |
Family
ID=64871197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107208020U TWM568268U (en) | 2018-06-14 | 2018-06-14 | The cladding material for terminal |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM568268U (en) |
-
2018
- 2018-06-14 TW TW107208020U patent/TWM568268U/en not_active IP Right Cessation
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106714507B (en) | Middle frame part and production method thereof | |
| CN107146964A (en) | A kind of galvanization coating and terminal, electrical interface, electronic equipment for terminal | |
| KR20140034210A (en) | Corrosion resistant electrical conductor | |
| CN207632906U (en) | Electroplating layer and terminal for interface terminal of handheld electronic equipment | |
| CN102055101B (en) | Electrical connector terminal | |
| CN206850073U (en) | A kind of electroplating coating for terminal and terminal, electronic interface, electronic equipment | |
| CN109004405A (en) | Inserting terminal, grafting pin processing technology and electronic equipment | |
| CN207925727U (en) | A kind of electroplating coating with nickel, palladium and terminal, electronic equipment | |
| TWM568268U (en) | The cladding material for terminal | |
| US20190378632A1 (en) | Plated product and method of manufacturing the same | |
| CN102055099A (en) | Electric connector terminal and electroplating method thereof | |
| CN220767204U (en) | Plating layer for terminal, electronic interface and electronic device | |
| CN210886265U (en) | A kind of electroplating coating for hand-held electronic equipment interface terminal | |
| CN203553436U (en) | Electric connector, shell thereof and electronic device using electric connector | |
| CN110396708A (en) | Corrosion-resistant coating of silver combined coating | |
| CN202425199U (en) | Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) | |
| CN216427448U (en) | Plug-resistant anti-hand-sweat coating, terminal and electronic equipment | |
| CN210576587U (en) | A kind of electroplating layer for terminal surface, terminal and electronic interface | |
| CN108390176A (en) | The production method of connecting terminal, attachment device, electronic equipment and connecting terminal | |
| CN208939195U (en) | A kind of bonder terminal, connector and terminal device | |
| CN217823338U (en) | A kind of electrical connector, connecting component and terminal equipment | |
| CN211700652U (en) | Electric connector and electronic equipment | |
| CN110820024A (en) | A coating structure for enhancing corrosion resistance of mobile phone connectors | |
| CN217848381U (en) | Conductive terminal and electric connector | |
| CN217215176U (en) | Conductive terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |