CN109004405A - Inserting terminal, grafting pin processing technology and electronic equipment - Google Patents

Abstract

The disclosure relates to a plug terminal, a processing technology for plug pins and electronic equipment. The plug-in terminal includes a plug-in pin, and the plug-in pin includes: a base material; a base layer, the base layer is attached to the surface of the base material; a palladium-nickel layer, and the palladium-nickel layer is attached to the surface of the base material. The side of the primer layer away from the base material; the metal layer, the metal layer is attached to the side of the palladium nickel layer away from the primer layer. In this disclosure, the base material of the plug pins is sequentially wrapped with a primer layer, a palladium-nickel layer and a metal layer. The anti-corrosion effect of the palladium-nickel layer is due to the traditional gold-plated effect, and the production cost is lower than that of the rhodium-ruthenium coating, which can meet the requirements of plug-in While meeting the anti-corrosion requirements of the terminal, the cost is reduced, the service life is extended, and the aging speed of the anti-corrosion layer on the plug-in pin is delayed.

Description

Plug-in terminal, plug-in pin processing technology and electronic equipment

technical field

The present disclosure relates to the technical field of terminals, in particular to a plug terminal, a processing technology of plug pins and electronic equipment.

Background technique

Currently, electronic devices are usually provided with one or more functional interfaces, such as a charging interface, earphone interface or transmission interface, etc., and each interface can be connected to an external device through a data cable, thereby further realizing the correspondence of the electronic device. Function.

Contents of the invention

The disclosure provides a plug terminal, a processing technology of plug pins and electronic equipment to solve the deficiencies in related technologies.

According to a first aspect of an embodiment of the present disclosure, a plug terminal is provided, including a plug pin, and the plug pin includes:

Substrate;

A base layer, the base layer is attached to the surface of the base material;

A palladium-nickel layer, the palladium-nickel layer is attached to the side away from the base material on the primer layer;

A metal layer, the metal layer is attached to the side of the palladium-nickel layer away from the underlying layer.

Optionally, the base material includes a conductive part at an end, and the primer layer, the palladium-nickel layer and the metal layer wrap the conductive part in sequence.

Optionally, the base material further includes a welding part connected to the conductive part, and the surface of the welding part is sequentially pasted with the primer layer, the palladium-nickel layer and the metal layer;

Alternatively, the metal nickel layer and the metal layer formed of other metals different from the metal nickel are sequentially pasted on the surface of the welding portion.

Optionally, the conductive part includes a conductive surface that is in contact with the opposite terminal, and the total thickness of the primer layer, the palladium-nickel layer and the metal layer attached to the conductive surface is greater than the The thickness of other surfaces on the conductive part.

Optionally, the primer layer includes metal nickel and metal tungsten.

Optionally, the metal layer includes metal gold.

Optionally, the plug-in terminal includes a type-c terminal and/or a Micro USB terminal.

According to the second aspect of the embodiments of the present disclosure, there is provided a processing technology for inserting pins, including:

molding substrate;

Electroplating a bottom layer on the base material;

Electroplating a palladium-nickel layer on the surface of the primer layer away from the substrate;

A metal layer is electroplated on the surface of the palladium-nickel layer away from the base material to obtain the insertion pins.

Optionally, the insertion pin includes a conductive part, and the primer layer, the palladium-nickel layer and the metal layer are sequentially electroplated on the conductive part.

Optionally, the insertion pin also includes a welding portion connected to the conductive portion, and the processing process further includes:

electroplating metallic nickel on the surface of the welding portion;

The metal layer is electroplated on the surface of the metal nickel.

According to a third aspect of the embodiments of the present disclosure, there is provided a plug-in terminal, which is a plug-in pin manufactured by the process described in any one of the above-mentioned embodiments.

According to a fourth aspect of the embodiments of the present disclosure, there is provided an electronic device, including:

The plug-in terminal as described in any one of the above-mentioned embodiments.

The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects:

As can be seen from the foregoing embodiments, the base material of the plug-in pins in the present disclosure is wrapped with a bottom layer, a palladium-nickel layer and a metal layer in sequence, and the anti-corrosion effect of the palladium-nickel layer is due to the traditional gold-plating effect, and the production cost is lower than that of the rhodium-ruthenium coating , can reduce the cost while meeting the anti-corrosion requirements of the plug-in terminals, prolong the service life, and delay the aging speed of the anti-corrosion layer on the plug-in pins.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural diagram of a plug-in terminal according to an exemplary embodiment.

Fig. 2 is a schematic structural diagram of an insertion pin according to an exemplary embodiment.

Fig. 3 is a schematic structural diagram of another insertion pin according to an exemplary embodiment.

Fig. 4 is a schematic structural diagram of another insertion pin according to an exemplary embodiment.

Fig. 5 is a schematic structural diagram of another plug pin according to an exemplary embodiment.

Fig. 6 is a flowchart of a process for processing plug pins according to an exemplary embodiment.

Fig. 7 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

Detailed ways

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.

The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term "and/or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, the information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of the present application, first information may also be called second information, and similarly, second information may also be called first information. Depending on the context, the word "if" as used herein may be interpreted as "at" or "when" or "in response to a determination."

Fig. 1 is a schematic structural diagram of a plug-in terminal according to an exemplary embodiment. As shown in FIG. 1 , the plug-in terminal 100 may include a plug-in pin 1 , and the subsequent plug-in terminal 100 may realize communication through the connection between the plug-in pin 1 and the opposite terminal. Wherein, the plug terminal 100 may include a plurality of plug pins, such as shown in FIG. 12 plug-in pins 1 in a row; or, when the plug-in terminal 100 is a Micro USB terminal, it can include 5 plug-in pins 1; or the plug-in terminal 100 can also be Type-a, Type-b and other interface types, which will not be described here one by one. The plug terminal 100 may be a male plug or a female plug, which is not limited in the present disclosure.

Based on the anti-corrosion requirements for the plug-in pins 1 in the above-mentioned plug-in terminal 100 , an anti-corrosion layer can be formed on the surface of the plug-in pins 1 by electroplating. Specifically, as shown in Figure 2, the plug pin 1 can include a base material 11, a base layer 12 attached to the surface of the base material 11, a palladium-nickel layer attached to the base layer 12 away from the side of the base material 11 13, and the metal layer 14 attached to the palladium-nickel layer 13 on the side away from the primer layer 12. In other words, the primer layer 12, the palladium-nickel layer 13 and the metal layer 14 can be attached to the base material 11 in turn, thereby utilizing the primer layer 12 to isolate the palladium-nickel layer 13 and the base material 11, and the corrosion resistance of the palladium-nickel layer 13 can be improved. The metal layer 14 is located on the surface of the plug pin 1, which can improve the wear resistance and electrical conductivity of the plug pin 1, and can protect the palladium-nickel layer 13, avoiding the nickel layer 12 from being worn, causing the plug pin The corrosion resistance of pin 1 is reduced. Wherein, the thickness of the palladium-nickel layer 13 may be about 30 microinches.

For example, the primer layer 12 may include metal nickel and metal tungsten, for example, may be a nickel-tungsten alloy, of course, may also include metal nickel and metal tungsten other materials, the present disclosure is not limited thereto. The thickness of the primer layer comprising metal nickel and metal tungsten can be 60-80 microinches. On the one hand, the characteristics of low voids of the nickel-tungsten mixture can be used to protect the substrate 11 and to fill up the existing microscopic pores on the substrate 11. On the other hand, a mixture of nickel and tungsten is used for priming, which can improve the corrosion resistance of the palladium-nickel layer 13 .

Wherein, the metal layer 14 may include some metals with relatively low activity, such as metallic gold and/or metallic silver, etc., so as to prevent the metal molecules from being oxidized due to active activity, and metallic gold has high hardness and good wear resistance and electrical conductivity. , which is conducive to improving the electrical conductivity and wear resistance of the plug pin 1. The thickness of the metal layer may be about 2 microinches, for example, 1.5 microinches, 2.5 microinches, etc., and the present disclosure is not limited thereto.

In one embodiment, as shown in FIG. 2, the substrate 11 can include a conductive portion 111 at the end, and the primer layer 12, the palladium-nickel layer 13 and the metal layer 14 can also wrap the conductive portion 111 in order to save energy. material, simplify the process and reduce the cost.

In another embodiment, as shown in FIG. 3 , the base material 11 may further include a welding portion 112 connected to the conductive portion 111 , and the welding portion 112 may be used for mounting the plug terminal 100 .

In one case, the primer layer 12 , the palladium-nickel layer 13 and the metal layer 14 may also be pasted on the surface of the welding portion 112 in sequence. In other words, as shown in FIG. 3 , the primer layer 12 , the palladium-nickel layer 13 and the metal layer 14 can completely cover the entire substrate 11 in order to completely protect the substrate 11 and simplify the process.

In another case, since the conductive part 111 is mainly used for plugging with the opposite terminal, and the welding part 112 is mainly used for installation, it will be worn less frequently during subsequent use and exposed on the plug terminal 100. Therefore, in order to save materials and reduce costs, as shown in FIG. The corrosion resistance of the nickel and the wear resistance of the metal layer protect the weld 112 .

In each of the above-mentioned embodiments, the length of the conductive portion 111 can be determined according to the length of the contact area on the plug pin 1 that is in contact with the opposite terminal. As shown in FIG. 5, the conductive part 111 may also include a conductive surface 1111 that contacts the opposite terminal, and since the conductive surface 111 is mainly in contact with the opposite terminal during the insertion process of the opposite terminal, thus This makes the conductive surface 111 have higher requirements on anti-wear and anti-corrosion capabilities than other areas. Therefore, the thickness of the primer layer 12, the palladium-nickel layer 13 and the metal layer 14 on the conductive surface 1111 is greater than the thickness of other surfaces on the conductive part 111, that is, the thickness H of the coating on the conductive surface 1111 is greater than other surfaces as shown in Figure 4 The thickness of the plating layer on the surface can ensure the corrosion resistance and wear resistance of the plug pin 1 while saving materials.

Based on the technical solution of the present disclosure, a processing technology for inserting pins is also provided. As shown in FIG. 6, the processing technology may include the following steps:

In step 601, the substrate 11 is formed.

In this embodiment, the material constituting the base material 11 may include metallic copper or metallic copper alloy, which is not limited in the present disclosure. The shape of the base material 11 can be shaped according to the shape of the plug terminal 100 .

In step 602 , the primer layer 12 is electroplated on the substrate 11 .

In this embodiment, the primer layer 12 may include metal tungsten and metal nickel, or may also be a nickel-tungsten alloy. The primer layer 12 can be electroplated on the surface of the substrate by sputtering or deposition, or the primer layer 12 can be formed on the substrate 11 by other processes, which will not be repeated here. The thickness of the primer layer 12 may be 60-80 microinches, for example, 65 microinches, 70 microinches, 72 microinches, etc., and no more examples are given here.

In step 603 , the palladium-nickel layer 13 is electroplated on the surface of the primer layer 12 away from the substrate 11 .

In this embodiment, the palladium-nickel layer 13 may include a mixture of metal palladium and metal nickel, and of course, a small amount of other materials may also be included in the modified palladium-nickel layer 13 .

In step 604, the metal layer 14 is electroplated on the surface of the nickel layer 13 away from the substrate to obtain the plug pin 1 .

In this embodiment, the metal layer 13 may include metallic gold. Since metallic gold has relatively low activity, good wear resistance and good electrical conductivity, it is beneficial to improve the service life and conductive effect of the plug pin 1 .

In each of the above-mentioned embodiments, when carrying out the electroplating process for the base material 11, it may be for the entire surface of the base material 11 to electroplate the primer layer 12, then for the entire surface of the primer layer 12, the palladium-nickel layer 13 is electroplated, and then for the nickel layer The entire surface of 13 is electroplated with a metal layer, thereby forming a complete protection for the base material 11. Or, the plug pin 1 can conduct the conductive part 111, and the process of electroplating the primer layer 12, the nickel layer 13 and the metal layer 14 is only carried out for the conductive part 111, so that the primer layer 12, the nickel layer 13 and the metal layer 14 are sequentially included. Conductive part 111.

In this embodiment, the base material 11 may also include a soldering portion 112 connected to the conductive portion 111. When laying the layer 12 and electroplating the nickel layer 13 and the metal layer 14 only on the conductive portion 111, the processing may also include Metal nickel is electroplated on the surface of the welding part 112, and then the metal layer 14 is electroplated on the metal nickel. The material of the metal layer 14 on the welding part 112 is different from the metal nickel, for example, it can be metal gold or the like.

Based on the plug-in terminal 100 described in any one of the above-mentioned embodiments, the plug-in terminal 100 can be applied to an electronic device 200 as shown in FIG. The electrical connector 100 described in the example, the electrical connector 100 can be electrically connected to the main board, so as to realize the corresponding function of the electronic device 200 through the electrical connector 100, as shown in FIG. 7, the electrical connector 100 can be Located at the bottom of the electronic device 200 (that is, the end of the electronic device facing the ground when the user holds the electronic device in a normal state), it is used as a charging interface, an earphone interface, a data transmission interface, etc. of the electronic device 200; the electronic device 200 may include a mobile phone , tablet computer, e-reader, etc., the present disclosure is not limited thereto.

Other embodiments of the disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, and these modifications, uses or adaptations follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field not disclosed in the present disclosure . The specification and examples are to be considered exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It should be understood that the present disclosure is not limited to the precise constructions which have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (12)

1. A plug-in terminal, characterized in that it includes plug-in pins, and the plug-in pins include: Substrate; A base layer, the base layer is attached to the surface of the base material; A palladium-nickel layer, the palladium-nickel layer is attached to the side away from the base material on the primer layer; A metal layer, the metal layer is attached to the side of the palladium-nickel layer away from the underlying layer. 2. The plug terminal according to claim 1, wherein the base material includes a conductive part at the end, and the primer layer, the palladium-nickel layer and the metal layer wrap the conductive part in sequence . 3. The plug terminal according to claim 2, wherein the base material further includes a welding part connected to the conductive part, and the surface of the welding part is sequentially pasted with the primer layer, the palladium a nickel layer and said metal layer; Alternatively, the metal nickel layer and the metal layer formed of other metals different from the metal nickel are sequentially pasted on the surface of the welding portion. 4. The plug terminal according to claim 2, characterized in that, the conductive part includes a conductive surface in contact with the opposite terminal, the primer layer and the palladium layer attached to the conductive surface The total thickness of the nickel layer and the metal layer is greater than the thickness of other surfaces on the conductive portion. 5. The plug terminal according to claim 1, characterized in that, the primer layer comprises metal nickel and metal tungsten. 6. The plug terminal according to claim 1, wherein the metal layer comprises metallic gold. 7. The plug terminal according to claim 1, characterized in that, the plug terminal comprises a type-c terminal and/or a Micro USB terminal. 8. A processing technology for inserting pins, comprising: molding substrate; Electroplating a bottom layer on the base material; Electroplating a palladium-nickel layer on the surface of the primer layer away from the substrate; A metal layer is electroplated on the surface of the palladium-nickel layer away from the base material to obtain the insertion pins. 9 . The processing technology according to claim 8 , wherein the plug pin includes a conductive part, and the primer layer, the palladium-nickel layer and the metal layer are sequentially electroplated on the conductive part. 10 . 10. The processing technology according to claim 9, wherein the insertion pin further comprises a welding portion connected to the conductive portion, and the processing technology further comprises: electroplating metallic nickel on the surface of the welding portion; The metal layer is electroplated on the surface of the metal nickel. 11. A plug-in terminal, characterized in that it comprises a plug-in pin made by the process according to any one of claims 8-10. 12. An electronic device, characterized in that it comprises: The plug terminal according to any one of claims 1-7; Or, it includes the plug-in terminal as claimed in claim 11.