TWM563654U - Substrate processing system - Google Patents

Abstract

The present invention discloses a substrate processing system including a substrate processing device, a first control module, and a second control module. The first control module includes a first control unit and a first monitoring unit. The first control unit controls the operation of the substrate processing apparatus. The first monitoring unit transmits a first determination signal every one first predetermined time interval. The second control module includes a second control unit and a second monitoring unit. The second monitoring unit is coupled to the first monitoring unit and the second control unit. When the second monitoring unit does not receive the first determining signal at the first preset time, the abnormal signal is transmitted to the second control unit. The second control unit controls the operation of the substrate processing device according to the abnormal signal to avoid a situation in which the substrate in the process is damaged when the first control module is faulty.

Description

Substrate processing system

This creation relates to a substrate processing system, and more particularly to a substrate processing system with a control device.

In the semiconductor manufacturing process, multiple cleaning processes are performed on a substrate (such as a wafer) to remove impurities on the substrate surface. Or, after lithographic etching is used to form a pattern on a substrate (such as a wafer), multiple cleaning processes must also be performed to remove the photo resist (PR) or metal film (Metal Film). Generally speaking, the substrate processing system includes multiple substrate processing devices that perform different functions, such as an immersion tank, a spray cleaning tank, or a rotary abutment. The substrate can be immersed in a chemical solution, and the substrate can be cleaned by spray cleaning. The substrate is dried in a rotating manner.

However, in the conventional substrate processing system, the operation of the entire substrate processing system is controlled by a single control unit, that is, the operations of multiple substrate processing apparatuses are controlled by one control unit. When an abnormality occurs in the control unit, the processing procedure of the substrate will be completely stopped, and half of the substrate processing procedure will be suspended, which will cause almost all of the substrates being processed to be discarded. For example, if the substrate is being processed or immersed in a chemical solution (such as an acid solution), if the entire system is abruptly stopped due to a control unit failure, the substrate and the chemical solution will take longer to process than the preset processing time. The substrate is damaged and scrapped, which increases the cost of the process. It is necessary to improve it.

In view of the above problems, the main purpose of this creation is to provide a substrate processing system, which includes a substrate processing device, a first control module, and a second control module. After receiving the first judgment signal transmitted by the first control module, the operation of the substrate processing device can be controlled according to the abnormal signal, so as to solve the problem that the substrate of the processing substrate is damaged if the control unit of the conventional substrate processing system fails. .

To achieve the above object, the present invention provides a substrate processing system, which includes at least one substrate processing device, a first control module, and a second control module. The first control module includes a first control unit and a first monitoring unit. The first control unit is coupled to the substrate processing apparatus and controls the operation of the substrate processing apparatus. The first monitoring unit transmits a first determination signal every first preset time interval. The second control module includes a second control unit and a second monitoring unit. The second control unit is coupled to the substrate processing apparatus. The second monitoring unit is coupled to the first monitoring unit and the second control unit, and receives a first determination signal from the first monitoring unit. When the second monitoring unit does not receive the first judgment signal within the first preset time, an abnormal signal is transmitted to the second control unit, and the second control unit controls the operation of the substrate processing device according to the abnormal signal.

According to an embodiment of the present invention, the second monitoring unit sends a second judgment signal to the first monitoring unit every second preset time interval. When the first monitoring unit does not receive the second judgment signal within the second preset time, The first monitoring unit sends a warning signal.

According to an embodiment of the present invention, the first control module further includes a first warning unit, which is coupled to the first monitoring unit. When the first warning unit receives a warning signal from the first monitoring unit, a warning program is executed.

According to an embodiment of the present invention, the substrate processing apparatus includes a carrier, and the second control unit executes a judgment based on the abnormal signal to determine whether the carrier carries a substrate, and when the carrier carries the substrate, a rescue procedure is performed.

According to an embodiment of the present invention, the substrate processing apparatus further includes a detection unit that detects a gas pressure of the carrier to determine whether the carrier carries the substrate.

According to an embodiment of the present invention, the substrate processing apparatus further includes a fluid nozzle, and the second control unit controls the fluid nozzle to provide a fluid to the substrate.

According to an embodiment of the present invention, the substrate processing apparatus further includes at least one fluid collection tank, which is disposed outside the carrier. The second control unit controls the fluid collection tank to move to a fluid collection position, and controls the fluid nozzle to provide fluid to the substrate. .

According to an embodiment of the present invention, the substrate processing apparatus includes a plurality of fluid collection grooves respectively disposed on the outer side of the carrier, and the second control unit controls the plurality of fluid collection grooves to move to their respective fluid collection positions, and controls the fluid nozzle to provide fluid To the substrate.

According to an embodiment of the present invention, the substrate processing apparatus further includes at least one fluid collection tank, which is disposed outside the carrier. The second control unit determines that the fluid collection tank cannot move to one of the fluid collection positions, and the second control unit controls The fluid nozzle stops supplying fluid to the substrate.

According to an embodiment of the present invention, the carrier includes a rotating part, and the second control unit controls the rotating part to rotate and control the fluid nozzle to supply fluid to the substrate during a first supply time. After the first supply time, the second control unit The unit controls the fluid nozzle to stop supplying fluid and controls the rotating part to continuously rotate during a drying time.

According to an embodiment of the present invention, the second control unit determines that the rotating part is in a non-controllable state, the second control unit controls the rotating part to stop rotating, and controls the fluid nozzle to supply fluid to the substrate within a second supply time.

According to an embodiment of the present invention, the substrate processing apparatus further includes at least one fluid collection tank, which is disposed outside the carrier. The second control unit determines that the fluid collection tank cannot move to one of the fluid collection positions and the rotating part is non-possible. When in the controlled state, the second control unit controls the rotation section to stop rotating and the fluid nozzle to provide fluid to the substrate during the second supply time.

According to an embodiment of the present invention, the substrate processing apparatus includes a first processing tank and a fluid supply unit. The carrier is movably disposed in the first processing tank, and the fluid supply unit is in communication with the first processing tank.

According to an embodiment of the present invention, the substrate processing apparatus includes a moving member, and the second control unit controls the moving member to take out the substrate from the first processing tank.

According to an embodiment of the present invention, the substrate processing apparatus includes a second processing tank having a fluid therein, and the second control unit controls the moving member to take out the substrate from the first processing tank and move to the second processing tank.

According to an embodiment of the present invention, the second control unit controls the fluid supply unit to provide a fluid to the first processing tank.

According to an embodiment of the present invention, the second control unit controls the substrate processing apparatus to continue executing a substrate processing program according to the abnormal signal.

As mentioned above, the substrate processing system according to the present invention includes a substrate processing device, a first control module and a second control module. The first control module has a first monitoring unit, and transmits a first judgment signal every first preset time interval. The second control module includes a second control unit and a second monitoring unit that are coupled to each other, and the second monitoring unit is coupled to the first monitoring unit. When the second monitoring unit does not receive the first judgment signal within the first preset time, it can control the operation of the substrate processing device according to the abnormal signal to perform emergency processing on the substrate to avoid damage to the substrate being processed.

In order to allow your review committee to better understand the technical content of this creation, the preferred specific embodiments are described below.

FIG. 1 is a block diagram of a substrate processing system 1 according to an embodiment of the present invention. Please refer to FIG. 1. The substrate processing system 1 of this embodiment includes a first control module 10, a second control module 20, and at least one substrate processing apparatus 30, 40. The substrate processing apparatus 30, 40 is a substrate wet processing system, respectively. The single wafer rotary processing machine and batch wafer processing tank are taken as examples. The first control module 10 in this embodiment includes a first control unit 11 and a first monitoring unit 12. The first control unit 11 is coupled to the substrate processing apparatuses 30 and 40 and can control the substrate processing apparatuses 30 and 40. 40 operations. The second control module 20 includes a second control unit 21 and a second monitoring unit 22. The second control unit 21 is coupled to the substrate processing apparatuses 30 and 40 and can be used as an emergency when the first control unit 11 is abnormal. The rescue control module controls the operations of the substrate processing apparatuses 30 and 40.

Specifically, the first control module 10 in this embodiment is a main control module. In a normal operation state, the first control module 10 controls the operations of the substrate processing apparatuses 30 and 40. In addition, the first monitoring unit 12 and the second monitoring unit 22 are coupled to each other, and the first monitoring unit 11 transmits a first determination signal every interval of a first preset time and is received by the second monitoring unit 22. In other words, the first monitoring unit 12 transmits the first determination signal every first preset time interval, that is, the first determination signal can be continuously sent to the second monitoring unit 22 at a fixed frequency. Therefore, the second monitoring unit 22 can receive the first determination signal from the first monitoring unit 12 every first preset time interval. At this time, the second monitoring unit 22 determines that the first control module 10 is in a normal operating state. When the first control module 10 fails, the first monitoring unit 12 stops operating and cannot transmit the first judgment signal, or the first control unit 11 and the first monitoring unit 12 are coupled to each other. When the first control unit 11 fails, The first monitoring unit 12 detects that the first control unit 11 is unable to operate and stops transmitting the first determination signal. Therefore, when the second monitoring unit 22 does not receive the first determination signal within the first preset time, the second monitoring unit 22 can determine that the first control module 10 is in an abnormal state, so that the second control module 20 starts to control. Operation of the substrate processing apparatuses 30 and 40.

In detail, the second monitoring unit 22 is coupled to the second control unit 21, and when the second monitoring unit 22 does not receive the first judgment signal within the first preset time, an abnormal signal may be transmitted to the second control unit. 21, so that the second control unit 21 controls the operations of the substrate processing devices 30, 40 according to the abnormal signal, that is, executes a cargo rescue procedure. In this embodiment, the rescue procedure is an emergency treatment to avoid damage to the substrate being processed. For example, the substrate is exposed to acid for a long time. For different types of substrate processing devices 30 and 40, the processing method may be The differences are further illustrated later.

The second monitoring unit 22 of this embodiment receives the first determination signal from the first monitoring unit 12 to determine the operation of the first control module 10. Preferably, the first monitoring unit 12 of this embodiment can also Determine the operation situation of the second control module 20. Specifically, the second monitoring unit 22 in this embodiment may transmit a second judgment signal to the first monitoring unit 12 every second preset time interval. When the first monitoring unit 12 does not receive the second monitoring signal at the second preset time, The second judgment signal can judge whether the second control module 20 is in an abnormal or damaged state, and the first monitoring unit 12 can further transmit a warning signal to notify for confirmation and repair. In detail, the first control module 10 further includes a first warning unit 13, which is coupled to the first monitoring unit 12 to receive a warning signal. The first warning unit 13 may be, for example, but not limited to, a warning light, a speaker, or a display screen. When the first warning unit 13 receives a warning signal from the first monitoring unit 12, it may execute a warning program, such as a flashing light, a beep, or Is to display the warning signal and so on.

In other words, the first control unit 11 and the second control unit 21 can send a confirmation signal (a first judgment signal and a second judgment signal) to each other and monitor the operation status of each other. If the second control unit 21 does not receive the first judgment signal sent by the first monitoring unit 12 after the first preset time, it is determined that the first control module 10 has failed, and the second control module 20 immediately intervenes To perform the rescue procedure. In addition, if the first control unit 11 fails to receive the second judgment signal from the second monitoring unit 22 after the second preset time, it is determined that the second control module 20 is damaged, and a warning signal is issued to notify the early repair第二 控制 module20。 The second control module 20.

As mentioned above, the rescue procedure of this embodiment is an emergency treatment to avoid damage to the substrate being processed. For different types of substrate processing devices 30 and 40, the timing of the second control module 20 intervention control can be based on The design requirements are different, but it can be determined whether the substrate processing apparatuses 30 and 40 have a substrate S first, and if there is, then the substrate processing apparatuses 30 and 40 are involved to control the execution of the cargo rescue procedure. In addition, the control method of the second control module 20 for the substrate processing apparatuses 30 and 40 may also be different according to design requirements. This creation is not limited, and the following is only an example for illustration.

FIG. 2 is a schematic diagram of a substrate processing apparatus 30 according to the first embodiment of the creation, and please match it with FIG. 2. The substrate processing apparatus 30 in this embodiment is an example of a single wafer rotary processing machine. The substrate processing apparatus 30 includes a carrier 31, at least one fluid collection tank 32, and a fluid nozzle 33. The carrier 31 is used to carry the substrate S, and The substrate 31 can fix the substrate S by means of vacuum adsorption, air blowing suspension, and claw clamping. The carrier 31 shown in FIG. 2 is an example of the vacuum adsorption method, and the carrier 31 can be fixed or movable. This creation is not particularly limited. The fluid nozzle 33 of this embodiment is disposed above the carrier 31 and mainly performs wet processing on the substrate S.

In addition, the carrier 31 in this embodiment includes a rotating portion 311 that can drive the entire carrier 31 and the substrate S carried thereon to rotate to perform processes such as wet processing or drying of the substrate S. In addition, the fluid collection tank 32 of the present embodiment is disposed outside the carrier 31, is located on the outer periphery of the substrate S, and is movable to a fluid collection position. For example, the fluid collection tank 32 may be raised or lowered above the corresponding position of the carrier 31 and the substrate S carried by it to receive the chemical liquid or cleaning solution spun out from the substrate S, which is referred to as a fluid collection position herein. In other embodiments, the fluid nozzle 33 may also be disposed at other positions, such as below the substrate S. Correspondingly, the fluid collection position may also be disposed below the corresponding position of the substrate S, which is not limited in this creation. In addition, the creation does not limit the number of fluid collection tanks 32. For example, FIG. 2 uses two fluid collection tanks 32 and 32a as an example. The two fluid collection tanks 32 and 32a can also be moved to their respective fluid collection positions. In the following, only the fluid collection tank 32 is taken as an example to describe the operation of the rescue procedure.

When the second monitoring unit 22 does not receive the first determination signal and further transmits an abnormal signal to the second control unit 21, the second control unit 21 may first determine whether the carrier 31 carries a substrate S according to the abnormal signal. Specifically, the substrate processing apparatus 30 further includes a detection unit 34. If the carrier 31 is fixed by vacuum adsorption or air blowing suspension, the detection unit 34 can detect the gas pressure on the carrier 31 to determine Whether the carrier 31 carries the substrate S. In addition, the second control unit 21 may be coupled to the detection unit 34, and determine whether the carrier 31 carries the substrate S by the function of the detection unit 34. If the carrier 31 carries the substrate S, it means that there is a substrate S currently undergoing a wet processing procedure, and the second control unit 21 further controls the substrate processing apparatus 30 to execute a rescue procedure.

In one embodiment, the rescue procedure may be that the fluid nozzle 33 provides a fluid to the substrate S. Preferably, the fluid may be a cleaning liquid, such as deionized water. No matter the substrate S is stopped due to the failure of the first control module 10 when spraying the cleaning liquid or the cleaning liquid, the second control unit 21 can control the fluid nozzle 33 to provide the cleaning liquid to the substrate S according to the abnormal signal to prevent the substrate S from continuing Reacts with chemical fluids as an emergency remedy. It should be noted that this embodiment does not limit the number of fluid nozzles 33 and their installation positions. As shown in FIG. 2, a fluid nozzle 33 a may be additionally provided above the fluid collection tank 32 a. In one embodiment, during the normal wet processing procedure, the chemical nozzle or cleaning liquid can be provided to the substrate S through the fluid nozzle 33; during the rescue procedure, the fluid nozzle 33 can be provided to provide the cleaning liquid to the substrate S, or Instead, the cleaning liquid is supplied to the substrate S by the fluid nozzle 33a. Of course, during the cargo rescue procedure, the fluid nozzle 33 and the fluid nozzle 33a can also be controlled to provide the cleaning liquid to the substrate S at the same time. This creation is not limited.

In one embodiment, after the second control module 20 confirms that the carrier 31 has the substrate S, it can further determine whether the fluid collection tank 32 is movable, such as detecting the upper positioning detection switch or the upper positioning solenoid valve of the fluid collection tank 32. Wait. If the fluid collection tank 32 can move normally, the second control unit 21 can control the fluid collection tank 32 to move to the fluid collection position according to the abnormal signal. Of course, if there are a plurality of fluid collection tanks 32 and 32a, the second control unit 21 controls the fluid collection tanks 32 and 32a to move to their respective fluid collection positions. At the same time, the second control unit 21 also controls the fluid nozzle 33 to provide fluid to the substrate S. Similarly, the fluid is preferably a cleaning liquid, that is, when the fluid nozzle 33 sprays and cleans the substrate S on the substrate S, the outer fluid collection tank 32 can receive the cleaning liquid that is spun off from the substrate S.

If the second control unit 21 determines that one of the fluid collection tanks 32 and 32a cannot move to the fluid collection position to which it belongs, the second control unit 21 can control the other fluid collection tank 32 and 32a to move to the fluid collection position to which it belongs. For example, taking the fluid collection tank 32 as an example, when the fluid collection tank 32 cannot move, the second control unit 21 controls the fluid collection tank 32a to move to the fluid collection position.

If the second control unit 21 determines that all of the fluid collection tanks 32 and 32a cannot move to the fluid collection position to which it belongs, the second control unit 21 may control the fluid nozzle 33 to stop supplying fluid to the substrate S according to the abnormal signal. That is, if the fluid collection tanks 32 and 32a are abnormal and cannot move, the chemical liquid or cleaning liquid (fluid) being sprayed can be stopped. In other words, if the first control module 10 is damaged, the substrate processing apparatus 30 is in the process of spraying a chemical liquid or a cleaning solution, and when the second control module 20 is involved in controlling the substrate processing apparatus 30, it is determined that the fluid collection tank 32 cannot be used. The movement can directly stop the fluid nozzle 33 from continuing to spray the chemical liquid or the cleaning liquid, which can prevent the chemical liquid or the cleaning liquid from being sprayed to other areas and cause damage to the substrate processing apparatus 30.

In an embodiment, after the second control module 20 confirms that the carrier 31 has the substrate S, it can further determine whether the rotation portion 311 of the carrier 31 can be controlled to rotate. It should be noted that if the rotating part 311 is abnormal, it may still rotate slowly. Therefore, the second control module 20 detects and determines whether the rotating part 311 can be controlled to rotate, for example, to reach a preset speed or speed control. If the rotating part 311 can be controlled to rotate, the second control unit 21 can further control the rotating part 311 according to the abnormal signal, and control the fluid nozzle 33 to provide fluid to the substrate S, and after a first supply time, control the fluid nozzle 33 Stop supplying fluid. In other words, the second control unit 21 controls the rotation of the rotating portion 311 and controls the fluid nozzle 33 to provide a chemical liquid or a cleaning liquid, preferably a cleaning liquid, for a first supply time. Among them, the first supply time can be adjusted according to process requirements, and this creation is not limited. Then, the second control unit 21 can further control the rotating portion 311 to continuously rotate within a drying time. That is, the second control unit 21 controls the fluid nozzle 33 to stop supplying the fluid, and controls the rotation portion 311 to rotate for the aforementioned drying time to dry the substrate S. Similarly, the drying time can be adjusted according to process requirements, and this creation is not limited.

If the second control unit 21 determines that the rotating portion 311 is in a non-controllable state, the second control unit 21 may further control the rotating portion 311 to stop rotating according to the abnormal signal, that is, forcibly stop the rotation of the rotating portion 311. At the same time, the second control unit 21 also controls the fluid nozzle 33 to provide fluid to the substrate S for a second supply time. Preferably, in this state, the fluid nozzle 33 can provide the cleaning liquid to the substrate S for 100 seconds to 140 seconds, that is, the second supply time in this embodiment may be between 100 seconds and 140 seconds. It is preferably 120 seconds. The substrate S is treated urgently by providing a cleaning solution for 120 seconds. In addition, the limitation of the second supply time (100 seconds to 140 seconds) is to prevent the cleaning liquid from being supplied for too long, and the cleaning liquid (or other fluid) may flow into other important parts of the substrate processing apparatus 30, such as a motor, which may cause Damage to other components.

If the second control unit 21 determines that the rotating part 311 is in a non-controllable state and the fluid collection tanks 32 and 32a cannot operate, the second control unit 21 can further control the rotating part 311 to stop rotating and control the fluid nozzle 33 based on the abnormal signal. The fluid is provided to the substrate S within a second supply time.

FIG. 3 is a schematic diagram of the substrate processing apparatus 40 of the second and third embodiments of the creation. The substrate processing apparatus 40 is an example of a batch wafer processing tank. Please refer to FIG. 1 and FIG. 3 at the same time. . The substrate processing apparatus 40 in this embodiment includes a carrier 41, a first processing tank 42, a fluid supply unit 43, and a moving member 44. The carrier 41 is a carrier for carrying the substrate S, and is disposed in the first processing tank 42. The supply unit 43 is in communication with the first processing tank 42 to provide a fluid such as a chemical liquid or a cleaning liquid to the first processing tank 42. The moving member 44 is used for holding the carrier 41 and can move the substrate S from each processing tank. In one embodiment, the substrate processing apparatus 40 further includes a second processing tank 45, which is in communication with another fluid supply unit 43 a.

When the second monitoring unit 22 does not receive the first determination signal, and then transmits an abnormal signal to the second control unit 21, the second control unit 21 may first determine whether the carrier S, 41a is carrying the substrate S according to the abnormal signal. First take the first processing tank 42 as an example. If the carrier 41 in the first processing tank 42 has a substrate S, the second control unit 21 intervenes to control the substrate processing apparatus 40. For example, first determine whether the moving part 44 is movable. The moving member 44 can move, and the second control unit 21 can control the moving member 44 to take out the substrate S from the first processing tank 42 according to the abnormal signal. Further, when there is a chemical liquid in the first processing tank 42, the second control unit 21 can directly control the moving member 44 to take out the substrate S from the first processing tank 42, and if the cleaning liquid is in the second processing tank 45, it can be further moved Go to the second processing tank 45. In addition, when the first processing tank 42 has a cleaning solution, the moving member 44 may be controlled to take out the substrate S from the first processing tank 42 after soaking for a period of time.

Conversely, if the moving member 44 is damaged and cannot be moved, the second control unit 21 may control the fluid supply unit 43 to provide a fluid to the first processing tank 42 according to the abnormal signal, and the fluid may preferably be a cleaning liquid. If the first processing tank 42 already has a fluid (which may be a chemical liquid or a cleaning liquid), it can be removed first and then the cleaning liquid can be injected, or the cleaning liquid can be directly injected for dilution, and the creation is not limited.

In addition, the second processing tank 45 is taken as an example for description, and the second processing tank 45 in this embodiment has a cleaning liquid therein. If the carrier 41a in the second processing tank 45 has a substrate S, similarly, the second control unit 21 intervenes to control the substrate processing device 40, and first determines whether the moving member 44 can be moved. If the moving member 44 can be moved, wait for the substrate S to soak After a period of time, the second control unit 21 further controls the moving member 44 to take out the substrate S from the second processing tank 45. Conversely, if the moving member 44 is damaged and cannot be moved, the second control unit 21 may control the fluid supply unit 43a to continuously provide the cleaning liquid to the second processing tank 45; or, after the fluid in the second processing tank 45 is removed first, Refilling with cleaning fluid is not a limitation of this creation.

It should also be noted that the first concept of the first processing tank 42 and the second processing tank 45 of the substrate processing apparatus 40 are the tanks for the substrate S to perform wet processing. The "first and second" are only for clear explanation. Is not used to limit the scope of this creation.

In the above embodiment, when the first control module 10 fails to operate normally, the second control module 20 intervenes in real time, and the second control unit 21 controls the substrate processing apparatuses 30 and 40 to perform the rescue procedure. example. In other embodiments, if the substrate processing apparatuses 30 and 40 are not damaged, the second control unit 21 controls the substrate processing apparatuses 30 and 40 to continue to execute the substrate processing program according to the abnormal signal. That is, it takes over control of the substrate processing program executed before the first control module 10 fails.

In summary, the substrate processing system according to the present invention includes a substrate processing device, a first control module, and a second control module. The first control module has a first monitoring unit, and transmits a first judgment signal every first preset time interval. The second control module includes a second control unit and a second monitoring unit that are coupled to each other, and the second monitoring unit is coupled to the first monitoring unit. When the second monitoring unit does not receive the first judgment signal within the first preset time, it can control the operation of the substrate processing device according to the abnormal signal to perform emergency processing on the substrate to avoid damage to the substrate being processed.

It should be noted that many of the above embodiments are examples for convenience of explanation, and the scope of the rights claimed by this Exchange shall be based on the scope of the patent application, rather than being limited to the above embodiments.

1‧‧‧ substrate processing system
10‧‧‧First Control Module
11‧‧‧First Control Unit
12‧‧‧ the first surveillance unit
13‧‧‧The first warning unit
20‧‧‧Second Control Module
21‧‧‧Second Control Unit
22‧‧‧Second Surveillance Unit
30, 40‧‧‧ substrate processing equipment
31, 41, 41a
311‧‧‧Rotating part
32, 32a‧‧‧fluid collection tank
33, 33a‧‧‧fluid nozzle
34‧‧‧ Detection Unit
42‧‧‧The first treatment tank
43, 43a‧‧‧fluid supply unit
44‧‧‧ moving parts
45‧‧‧Second treatment tank
S‧‧‧ substrate

FIG. 1 is a schematic block diagram of a substrate processing system according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a substrate processing apparatus according to a first embodiment of the creation. FIG. 3 is a schematic diagram of a substrate processing apparatus according to the second embodiment and the third embodiment of the creation.

Claims (17)

A substrate processing system includes: at least one substrate processing device; a first control module including: a first control unit coupled to the substrate processing device and controlling the operation of the substrate processing device; and a first monitoring A unit for transmitting a first judgment signal at a first preset time interval; and a second control module including: a second control unit coupled to the substrate processing device; and a second monitoring unit coupled to The first monitoring unit and the second control unit receive the first determination signal from the first monitoring unit, and when the second monitoring unit does not receive the first determination signal at the first preset time, a An abnormal signal is sent to the second control unit, and the second control unit controls the operation of the substrate processing device according to the abnormal signal. The substrate processing system according to item 1 of the scope of patent application, wherein the second monitoring unit transmits a second judgment signal to the first monitoring unit every second preset time interval, and when the first monitoring unit is in the first If the second judgment signal is not received for a preset time, the first monitoring unit transmits a warning signal. The substrate processing system according to item 2 of the scope of patent application, wherein the first control module further includes a first warning unit, which is coupled to the first monitoring unit. When the first warning unit starts from the first monitoring unit, The unit receives the warning signal and executes a warning procedure. According to the substrate processing system described in item 1 of the patent application scope, wherein the substrate processing device includes a carrier, the second control unit executes a judgment based on the abnormal signal to determine whether the carrier carries a substrate, and when the carrier carries the substrate The base board performs a rescue procedure. The substrate processing system according to item 4 of the scope of patent application, wherein the substrate processing device further includes a detection unit that detects a gas pressure of the carrier to determine whether the carrier carries the substrate. The substrate processing system according to item 4 of the patent application scope, wherein the substrate processing apparatus further includes a fluid nozzle, and the second control unit controls the fluid nozzle to provide a fluid to the substrate. The substrate processing system according to item 6 of the scope of patent application, wherein the substrate processing apparatus further includes at least one fluid collection tank disposed outside the carrier, and the second control unit controls the fluid collection tank to move to a fluid A collection position, and controlling the fluid nozzle to provide the fluid to the substrate. The substrate processing system according to item 6 of the scope of patent application, wherein the substrate processing device includes a plurality of fluid collection tanks, which are respectively disposed on the outer side of the carrier, and the second control unit controls the plurality of fluid collection tanks to move to their respective locations. The fluid collecting position, and controlling the fluid nozzle to provide the fluid to the substrate. The substrate processing system according to item 6 of the scope of patent application, wherein the substrate processing device further includes at least one fluid collection tank disposed outside the carrier, and the second control unit determines that the fluid collection tank cannot be moved to its own location. A fluid collection position, the second control unit controls the fluid nozzle to stop supplying the fluid to the substrate. The substrate processing system according to item 6 of the patent application scope, wherein the carrier includes a rotating part, the second control unit controls the rotating part to rotate and controls the fluid nozzle to supply the fluid to the first supply time. After the substrate has passed the first supply time, the second control unit controls the fluid nozzle to stop supplying the fluid and controls the rotating portion to continuously rotate within a drying time. The substrate processing system according to item 6 of the patent application scope, wherein the carrier includes a rotating part, the second control unit determines that the rotating part is in an uncontrollable state, and the second control unit controls the rotating part to stop Rotating, and controlling the fluid nozzle to supply the fluid to the substrate during a second supply time. The substrate processing system according to item 11 of the scope of patent application, wherein the substrate processing device further includes at least one fluid collection tank disposed outside the carrier, and the second control unit determines that the fluid collection tank cannot be moved to its own location. When a fluid collection position and the rotating part are in the uncontrollable state, the second control unit controls the rotating part to stop rotating and the fluid nozzle provides the fluid to the substrate within the second supply time. The substrate processing system according to item 4 of the scope of patent application, wherein the substrate processing device includes a first processing tank and a fluid supply unit, and the carrier is movably disposed in the first processing tank. The fluid supply unit and The first processing tank is communicated. The substrate processing system according to item 13 of the patent application scope, wherein the substrate processing apparatus includes a moving member, and the second control unit controls the moving member to take out the substrate from the first processing tank. The substrate processing system according to item 14 of the scope of patent application, wherein the substrate processing apparatus includes a second processing tank having a fluid therein, and the second control unit controls the moving member to take out the substrate from the first processing tank. And move to the second processing tank. The substrate processing system according to item 13 of the application, wherein the second control unit controls the fluid supply unit to provide a fluid to the first processing tank. The substrate processing system according to item 4 of the scope of patent application, wherein the second control unit controls the substrate processing apparatus to continue executing a substrate processing program according to the abnormal signal.