TW201806019A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The substrate processing apparatus includes: a processing chamber; a substrate holding unit configured to hold the substrate in the processing chamber; a first nozzle having a main surface for ejecting toward the main surface of the substrate held by the substrate holding unit; A fluid outlet of the fluid; a first medicine fluid supply unit connected to the first nozzle and having a medicine fluid piping connected to the discharge port inside, for supplying the first medicine fluid to the first nozzle through the medicine fluid piping ; The first water supply unit is a water pipe having a branch connection to the medicine fluid pipe to supply water to the medicine fluid pipe through the water pipe; the second medicine fluid supply unit is used to supply the substrate holding unit The main surface of the held substrate supplies a second chemical fluid, which is a fluid different from the first chemical fluid; and a control device that controls the first chemical fluid supply unit and the second chemical fluid supply Unit and the aforementioned first water supply unit; the aforementioned control device performs: a first processing step, The first medicinal fluid is supplied to the medicinal fluid pipe, whereby the first medicinal fluid is ejected from the first nozzle toward the main surface of the substrate, and the substrate is treated with the first medicinal fluid; The second processing step is to supply the second chemical fluid to the main surface of the substrate, and to apply a treatment using the second chemical fluid to the substrate; and the water replacement step is performed before the first processing step is performed. And / or after execution and / or before Before and / or after the execution of the second processing step, water from the first water supply unit is supplied to the medicinal fluid pipe, and the inside of the medicinal fluid pipe is replaced with water.

Description

Substrate processing device and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate using a first chemical fluid and a second chemical fluid. Examples of the substrate include a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for an optical magnetic disk, A substrate for a photomask, a ceramic substrate, a substrate for a solar cell, and the like.

A blade type substrate processing device may be used in the manufacturing steps of a semiconductor device or a liquid crystal display device. The blade type substrate processing device is used to process a substrate one by one, and is used for a semiconductor wafer or a glass substrate for a liquid crystal display panel. The surface of the substrate is treated with a chemical solution. The blade-type substrate processing apparatus is provided with a spin chuck, which is held inside a processing chamber partitioned by a partition wall to keep the substrate substantially horizontal and rotate the substrate; a first chemical liquid nozzle, A first chemical liquid is supplied to the upper surface of the substrate held by the rotation jig; and a second chemical liquid nozzle is supplied to the upper surface of the substrate held by the rotation jig. The first chemical liquid nozzle has a spray outlet, and a chemical liquid pipe is connected to the first chemical liquid nozzle, and the chemical liquid pipe is used to supply a chemical liquid from a chemical liquid supply source to the first chemical liquid nozzle.

In such a substrate processing apparatus, a first chemical solution is connected to a second chemical solution. A situation that is accompanied by a dangerous combination (that is, a combination that is not suitable for exposure). In the case where a treatment chamber uses such a combination of unsuitable chemical liquids for treatment, the proposal proposes the execution of an interlock process in a manner that does not make contact with the inside of the treatment chamber. When one chemical solution is supplied, it is prohibited to newly open the valve for the other chemical solution, or when the detected value of the rotation speed of the substrate is outside the range of the number of rotations, the valve for the chemical solution is prohibited to be opened (see, for example, Patent Documents 1 and 2). ).

[Prior technical literature]

[Patent Literature]

Patent Document 1: Japanese Patent No. 4917469.

Patent Document 2: Japanese Patent No. 4917470.

However, when the first nozzle is arranged around the rotation jig during processing using the second chemical fluid (second chemical fluid), an atmosphere containing the second chemical fluid enters the chemical fluid pipe (medicine) through the ejection port. Liquid piping). The entry of the atmosphere containing the second medicinal fluid into the inside of the medicinal fluid pipe may cause the first medicinal fluid to contact the second medicinal fluid.

Therefore, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of preventing the occurrence of these chemical fluids in the interior of the chemical fluid piping even if a combination of a plurality of chemical fluids used for substrate processing is a combination that is not suitable for contact. Contact, and can complete the treatment using the plurality of pharmaceutical fluids in a processing chamber.

The present invention provides a substrate processing apparatus including: a processing chamber; a substrate holding unit configured to hold the substrate in the processing chamber; and a first nozzle having a structure to be held toward the substrate holding unit. The main surface of the substrate is a nozzle for ejecting fluid; a medicament fluid pipe is connected to the first nozzle and is internally connected to the ejection outlet; a first medicinal fluid supply unit is configured to supply the first medicinal fluid to the medicinal fluid pipe A first water supply unit for supplying water to the medicine fluid piping; a second medicine fluid supply unit for supplying a second medicine fluid to the main surface of the substrate held by the substrate holding unit, the second The medicinal fluid is a fluid different from the first medicinal fluid; and a control device that controls the first medicinal fluid supply unit, the second medicinal fluid supply unit, and the first water supply unit; the control device executes: A processing step is to supply the first medicinal fluid to the medicinal fluid piping, thereby The nozzle ejects the first chemical fluid toward the main surface of the substrate, and applies a treatment using the first chemical fluid to the substrate. The second processing step is to supply the second chemical fluid to the main surface of the substrate. And applying a treatment using the second chemical fluid to the substrate; and a water replacement step before and / or after the execution of the first processing step and / or before and / or the execution of the second processing step After the execution, water from the first water supply unit is supplied to the medicine fluid pipe, and the inside of the medicine fluid pipe is replaced with the water.

According to this configuration, the first processing step using the first chemical fluid and the second chemical liquid supplying step using the second chemical fluid are performed in a common processing chamber. In a first processing step, a first medicament fluid is supplied to the medicament The fluid pipe discharges the first medical fluid from the first nozzle toward the main surface of the substrate.

In addition, before and / or after execution of the first processing step and / or before and / or after execution of the aforementioned second processing step, a water replacement step is performed to replace the inside of the pharmaceutical fluid pipe with water.

In some cases, the first chemical fluid may remain inside the chemical fluid piping after the first processing step is completed and / or before the second processing step is started. In this case, the first medicinal fluid can be removed from the medicinal fluid piping by replacing the inside of the medicinal fluid piping with water after the end of the first processing step and / or before the start of the second processing step. Therefore, the first medical fluid does not remain inside the medical fluid piping at the beginning of the second processing step. Therefore, even if the second medical fluid enters the medical fluid pipe in the second processing step, the second medical fluid does not come into contact with the first medical fluid. Thereby, it is possible to prevent the first medicine fluid from coming into contact with the second medicine fluid in the inside of the medicine fluid pipe.

In addition, the second medical fluid may be attached to the inside of the medical fluid piping before the first processing step starts and / or after the second processing step ends. In this case, before the first processing step is started and / or after the second processing step is finished, the inside of the medicinal fluid pipe is replaced with water, whereby the second medicinal fluid can be removed from the medicinal fluid pipe. Therefore, the second medicinal fluid does not remain inside the medicinal fluid piping at the beginning of the first processing step. Therefore, even if the first medicinal fluid is supplied into the medicinal fluid pipe in the first processing step, the first medicinal fluid does not come into contact with the second medicinal fluid. Thereby, the first medicine fluid and the second medicine in the medicine fluid piping can be prevented. Fluid contact.

As described above, the present invention can provide a substrate processing apparatus, which can prevent the problem of The contact of these pharmaceutical fluids occurs in the interior, and the processing using the plurality of pharmaceutical fluids can be completed in one processing chamber.

In addition, in this specification, "a combination that is not suitable for contact" means not only "a combination that is accompanied by danger", but also means "a combination that produces a product by contact". "Combination of products formed by contact" also includes a combination of acid and base.

In one embodiment of the present invention, it further includes a facing member having a substrate facing surface facing the main surface of the substrate held by the substrate holding unit, and the ejection port system of the first nozzle. An opening is formed on the opposite surface of the substrate.

According to this configuration, a facing member facing the main surface of the substrate is provided, and the ejection port of the first nozzle is opened at the substrate facing surface of the facing member. Therefore, in the second processing step, the second chemical fluid may enter the inside of the chemical fluid pipe from the ejection port as the second chemical fluid is supplied to the main surface of the substrate. The entry of the atmosphere containing the second medicinal fluid into the inside of the medicinal fluid pipe may cause the first medicinal fluid to contact the second medicinal fluid.

However, before the execution of the first processing step and / or after the execution and / or before the execution of the second processing step, the inside of the medicine fluid pipe is replaced with water. Therefore, even if it is disposed facing the main surface of the substrate, In the case where the opposing member and the ejection opening of the first nozzle are opened on the opposing surface of the substrate of the opposing member, it is possible to prevent the first medicine fluid from contacting the second medicine fluid in the inside of the medicine fluid pipe.

In addition, the substrate processing apparatus may further include: a suction unit for sucking the inside of the medicine fluid pipe. The control device may further control the suction unit, and further perform a first suction step for suctioning the inside of the medicine fluid pipe after the water replacement step is completed.

According to this configuration, the inside of the medicine fluid pipe is sucked after the completion of the water replacement step. Water is removed from the inside of the medicine fluid pipe by this suction, and after the suction, no water remains in the inside of the medicine fluid pipe, or the amount of water remaining inside the medicine fluid pipe is small. Thereby, it is possible to suppress or prevent water from falling from the first nozzle after the completion of the water replacement step, and thus it is possible to suppress or prevent particle contamination of the main surface of the substrate.

The control device may also start the first processing step after the second processing step ends. The control device may also execute a first water replacement step performed before the second processing step as the water replacement step.

According to this configuration, the first water replacement step is performed before the second processing step. There is a possibility that the first chemical fluid used in the previous process before the second processing step starts may remain inside the chemical fluid pipe. However, the inside of the medicinal fluid pipe is replaced with water before the second processing step, so that the first medicinal fluid does not remain inside the medicinal fluid pipe at the beginning of the second processing step. Therefore, even if the second medical fluid enters the medical fluid piping in the second processing step, the second medical fluid does not interact with the first medical fluid inside the medical fluid piping. Agent fluid contact. Thereby, it is possible to prevent the first chemical fluid from coming into contact with the second chemical fluid in the interior of the chemical fluid pipe in the second processing step.

In addition, the control device may also start the first processing step after the second processing step ends. The control device may also execute a second water replacement step performed after the second processing step and before the first processing step as the water replacement step.

According to this configuration, the second water replacement step is performed after the second processing step and before the first processing step. After the second processing step ends and before the first processing step starts, there is a possibility that the second medical fluid used in the second processing step may enter the medical fluid piping and remain inside the medical fluid piping. However, the inside of the medicinal fluid pipe is replaced with water before the first processing step, so that the second medicinal fluid does not remain inside the medicinal fluid pipe at the beginning of the first processing step. Therefore, even if the first medical fluid is supplied to the medical fluid piping in this first processing step, it will not come into contact with the second medical fluid. This can prevent the first chemical fluid from coming into contact with the second chemical fluid in the interior of the chemical fluid pipe in the first processing step.

In addition, the control device may further perform a first water supply step for supplying water to the main surface of the substrate before the first processing step, and rinse the water from the main surface of the substrate after the second processing step The aforementioned second medicinal fluid. The control device may also perform the second water replacement step in the first water supply step.

According to this configuration, in parallel with the first water supply step for flushing the second medical fluid with water from the main surface of the substrate after the second processing step, the second water replacement step for replacing the inside of the medical fluid pipe with water is performed in parallel. . With this, Compared with the case where the first water supply step is performed at a timing coordinated with the second water replacement step, the overall processing time can be shortened.

In addition, the substrate processing apparatus may further include: a second nozzle, which is a nozzle different from the first nozzle, for ejecting a fluid toward a main surface of the substrate held by the substrate holding unit; and a second water supply. The unit is used to supply water to the second nozzle. The control device may further control the second water supply unit. The control device may also start the first processing step after the end of the second processing step, and execute the second water supply step after the second processing step and before the start of the first processing step. By supplying water to the second nozzle, water is sprayed from the second nozzle toward the main surface of the substrate. The control device may start supplying the first medical fluid to the medical fluid piping in the first processing step before the second water supply step ends.

According to this configuration, the first chemical fluid can be ejected from the ejection port immediately after the second water supply is completed. That is, the first processing step can be started immediately after the end of the second water supply step. This can shorten the overall processing time.

In addition, the control device may start the first processing step before the second water supply step ends.

According to this configuration, the first chemical fluid can be ejected from the ejection port before the end of the second water supply step. This can further shorten the overall processing time.

In addition, the control device may further perform a second suction step for suctioning the inside of the medicament fluid pipe after the ejection of the first medicament fluid from the first nozzle in the first processing step.

In addition, the cleaning solution may include carbonated water.

In addition, the first chemical fluid may include a sulfuric acid-containing liquid, and the second chemical fluid may also include an organic solvent.

The present invention provides a substrate processing method including: a substrate holding step for holding a substrate in a processing chamber; and a first processing step for supplying a first medical fluid to a medical fluid pipe connected to a first nozzle, whereby The first chemical fluid is ejected from the first nozzle toward the main surface of the substrate, and a treatment using the first chemical fluid is applied to the substrate. The second processing step is to use a different type of fluid than the first chemical fluid. The fluid second chemical fluid is supplied to the main surface of the substrate, and the substrate is treated with the second chemical fluid; and the water replacement step is performed before and / or after the first processing step is performed, and The water from the first water supply unit is supplied to the medicinal fluid pipe before and / or after the second processing step is performed, and the inside of the medicinal fluid pipe is replaced with the water.

According to this method, a first processing step using a first chemical fluid and a second chemical liquid supplying step using a second chemical fluid are performed in a common processing chamber. In the first processing step, the first medical fluid is supplied to the medical fluid piping, whereby the first medical fluid is ejected from the first nozzle toward the main surface of the substrate.

In addition, the water replacement step for replacing the inside of the medicine fluid pipe with water is performed before and / or after execution of the first processing step and / or before and / or after execution of the aforementioned second processing step.

After the end of the first processing step and / or before the start of the second processing step The first medicine fluid may remain in the medicine fluid piping. In this case, the first medicinal fluid can be removed from the medicinal fluid piping by replacing the inside of the medicinal fluid piping with water after the end of the first processing step and / or before the start of the second processing step. Therefore, the first medical fluid does not remain inside the medical fluid piping at the beginning of the second processing step. Therefore, even if the second medical fluid enters the medical fluid pipe in the second processing step, the second medical fluid does not come into contact with the first medical fluid. Thereby, it is possible to prevent the first medicine fluid from coming into contact with the second medicine fluid in the inside of the medicine fluid pipe.

In addition, the second medical fluid may be attached to the inside of the medical fluid piping before the first processing step starts and / or after the second processing step ends. In this case, before the first processing step is started and / or after the second processing step is finished, the inside of the medicinal fluid pipe is replaced with water, whereby the second medicinal fluid can be removed from the medicinal fluid pipe. Therefore, the second medicinal fluid does not remain inside the medicinal fluid piping at the beginning of the first processing step. Therefore, even if the first medicinal fluid is supplied into the medicinal fluid pipe in the first processing step, the first medicinal fluid does not come into contact with the second medicinal fluid. Thereby, it is possible to prevent the first medicine fluid from coming into contact with the second medicine fluid in the inside of the medicine fluid pipe.

As described above, the present invention can provide a substrate processing method, which can prevent the chemical fluid piping from being used even if the combination of a plurality of chemical fluids (the first chemical fluid and the second chemical fluid) used in the substrate processing is not suitable for contact. The contact of these pharmaceutical fluids occurs in the interior, and the processing using the plurality of pharmaceutical fluids can be completed in one processing chamber.

In addition, in this specification, "a combination that is not suitable for contact" means not only "a combination that is accompanied by danger", but also means "a combination that produces a product by contact". "Combination of products formed by contact" also includes a combination of acid and base.

In one embodiment of the present invention, the substrate processing method further includes a first suction step for suctioning the inside of the medicine fluid pipe after the water replacement step is completed.

According to this method, the inside of the medicament fluid pipe is sucked after the water replacement step is completed. Water is removed from the inside of the medicine fluid pipe by this suction, and after the suction, no water remains in the inside of the medicine fluid pipe, or the amount of water remaining in the inside of the medicine fluid pipe is small. Thereby, it is possible to suppress or prevent water from falling from the first nozzle after the completion of the water replacement step, and thus it is possible to suppress or prevent particulate contamination of the main surface of the substrate.

In addition, the first processing step may include a step that starts after the second processing step ends. The water replacement step may include a first water replacement step performed before the second processing step.

According to this method, the first water replacement step is performed before the second processing step. There is a possibility that the first chemical fluid used in the previous process before the second processing step starts may remain inside the chemical fluid pipe. However, the inside of the medicinal fluid pipe is replaced with water before the second processing step, so that the first medicinal fluid does not remain inside the medicinal fluid pipe at the beginning of the second processing step. Therefore, even if the second medicinal fluid enters the medicinal fluid pipe in this second processing step, the first medicinal fluid does not come into contact with the inside of the medicinal fluid pipe. Thereby, the medicine fluid can be prevented from being dispensed in the second processing step. The first medicament fluid in the interior of the tube is in contact with the second medicament fluid.

In addition, the first processing step may include a step that starts after the second processing step ends. The water replacement step may include a second water replacement step performed after the second processing step and before the first processing step.

According to this method, a second water replacement step is performed after the second processing step and before the first processing step. After the second processing step ends and before the first processing step starts, there is a possibility that the second medical fluid used in the second processing step may enter the medical fluid piping and remain inside the medical fluid piping. However, the inside of the medicinal fluid pipe is replaced with water before the first processing step, so that the second medicinal fluid does not remain inside the medicinal fluid pipe at the beginning of the first processing step. Therefore, even if the first medical fluid is supplied to the medical fluid piping in this first processing step, it will not come into contact with the second medical fluid. This can prevent the first chemical fluid from coming into contact with the second chemical fluid in the interior of the chemical fluid pipe in the first processing step.

In addition, the substrate processing method may further include a first water supplying step for supplying water to a main surface of the substrate before the first processing step, and water may be supplied from the main surface of the substrate after the second processing step. Rinse the aforementioned second medicinal fluid. The first water supply step may include the second water replacement step.

According to this method, in parallel with the first water supply step for flushing the second medical fluid with water from the main surface of the substrate after the second processing step, the second water replacement step for replacing the inside of the medical fluid pipe with water is performed. . Thereby, the timing of the first water supply step is performed in accordance with the timing matched with the second water replacement step Compared with the situation, the overall processing time can be shortened.

In addition, the first processing step may include a step that starts after the second processing step ends. The substrate processing method may further include a second water supply step after the second processing step and before the start of the first processing step. The second water supply step is from a second nozzle different from the first nozzle. The nozzle sprays water toward the main surface of the substrate. The first processing step may start to supply the first medical fluid to the medical fluid pipe before the second water supply step ends.

According to this method, the first medical fluid can be ejected from the ejection port immediately after the second water supply step is completed. That is, the first processing step can be started immediately after the end of the second water supply step. This can shorten the overall processing time.

In addition, the substrate processing method may further include a second water supply step for supplying water from the second nozzle to a main surface of the substrate after the second processing step. The substrate processing method may also execute the first processing step in parallel with the second water supply step.

According to this method, the first medical fluid can be ejected from the ejection port before the end of the second water supply step. This can further shorten the overall processing time.

In addition, the substrate processing method may further perform a second suction step for suctioning the inside of the medicine fluid pipe after the first medicine fluid from the first nozzle is discharged in the first processing step.

In addition, the cleaning solution may include carbonated water.

In addition, the first chemical fluid may include a sulfuric acid-containing liquid, and the second chemical fluid may also include an organic solvent.

The above-mentioned objects, features, and effects of the present invention and other objects, features The effect and effect can be made clear by referring to the drawings and the following description of the embodiment.

1‧‧‧ substrate processing device

2‧‧‧ processing unit

3‧‧‧control device

4‧‧‧ treatment chamber

5‧‧‧rotation fixture

6‧‧‧ Opposite side of substrate

7‧‧‧ Opposing member

8‧‧‧ the first spray outlet

9‧‧‧ the first nozzle

10‧‧‧Second spray outlet

11‧‧‧Second Nozzle

12‧‧‧Organic solvent supply unit

13‧‧‧washing water supply unit

14‧‧‧ Sulfuric acid containing liquid supply unit

15‧‧‧washing liquid supply unit

16‧‧‧Handling cover

18‧‧‧ next door

19‧‧‧FFU

21‧‧‧First valve opening sensor

22‧‧‧rotation motor

23‧‧‧bottom rotation shaft

24‧‧‧rotation base

25‧‧‧ clamping member

26‧‧‧Barrier

27‧‧‧up rotation axis

28‧‧‧through hole

29‧‧‧ central axis nozzle

30‧‧‧Cover

31‧‧‧Baffle rotating unit

32‧‧‧Baffle lift unit

33‧‧‧Barrier Proximity Position Sensor

34‧‧‧Organic solvent piping

35‧‧‧The first organic solvent valve

36‧‧‧Second Organic Solvent Valve

37‧‧‧valve closing sensor

38‧‧‧ first divergence

39‧‧‧First water piping

40‧‧‧ Downstream side of organic solvent

41‧‧‧upstream side of organic solvent

42‧‧‧First detection position

43‧‧‧The first liquid detection sensor

44‧‧‧Second detection position

45‧‧‧Second liquid detection sensor

46‧‧‧The first water valve

48‧‧‧ second divergence

49‧‧‧ suction pipe

50‧‧‧ downstream side of water

51‧‧‧ Suction valve

52‧‧‧ Attraction device

53‧‧‧Vacuum generator

54‧‧‧Drive valve

55‧‧‧Attraction unit

56‧‧‧Second water piping

57‧‧‧Second Water Valve

58‧‧‧Inert gas piping

59‧‧‧Inert gas valve

60‧‧‧Sulfuric acid containing liquid nozzle

61‧‧‧Sulfuric acid containing liquid pipe

62‧‧‧Sulfuric acid containing liquid valve

63‧‧‧The first nozzle moving unit

64‧‧‧Nozzle Retreat Sensor

65‧‧‧washing liquid nozzle

66‧‧‧washing liquid pipe

67‧‧‧wash medicine valve

68‧‧‧Second nozzle moving unit

71‧‧‧First protective cover

72‧‧‧Second protective cover

73‧‧‧Protective cover lifting unit

74‧‧‧ bottom

75‧‧‧Inner wall

76‧‧‧ Outer wall

77‧‧‧Guide

78‧‧‧Body

79, 88‧‧‧ upper end

80‧‧‧ first row of liquid tank

81‧‧‧ exhaust pipe

82‧‧‧ branch pipe for sulfuric acid containing liquid

83‧‧‧ Branch piping for washing liquid

84‧‧‧Water branch piping

85‧‧‧Draining diverter valve

86‧‧‧Second Row Liquid Tank

87, 100‧‧‧ exhaust pipe

89‧‧‧ opening

90‧‧‧ upper end

91‧‧‧ lower end

92‧‧‧Return Department

93‧‧‧Position sensor on protective cover

94‧‧‧Position sensor under protective cover

95‧‧‧Second valve closing sensor

97‧‧‧Gas-liquid separator

101‧‧‧ exhaust valve

A1, A2‧‧‧‧Axis of rotation

C‧‧‧Carrier

CR‧‧‧ substrate handling robot

H‧‧‧hand

IR‧‧‧handling robot

LP‧‧‧ Loading port

W‧‧‧ substrate

FIG. 1 is a schematic plan view for explaining an internal layout of a substrate processing apparatus according to an embodiment of the present invention.

2A is a schematic cross-sectional view illustrating a configuration example of a processing unit provided in the substrate processing apparatus.

FIG. 2B is a diagram for specifically explaining the structure of the periphery of the facing member included in the processing unit.

FIG. 2C is a schematic cross-sectional view showing a configuration example of a lower portion of the processing unit in an enlarged manner.

FIG. 3 is a block diagram illustrating the electrical configuration of the main part of the substrate processing apparatus.

FIG. 4 is a flowchart illustrating a first substrate processing example for the aforementioned processing unit.

5A to 5B are schematic diagrams for explaining the aforementioned first substrate processing example.

5C to 5D are schematic diagrams for explaining steps following FIG. 5B.

5E to 5F are schematic diagrams for explaining steps following FIG. 5D.

5G to 5H are schematic diagrams for explaining steps following FIG. 5F.

FIG. 6 illustrates the main steps of the first substrate processing example. A schematic diagram of the monitoring conditions for the first liquid detection sensor and the second liquid detection sensor.

FIG. 7 is a schematic diagram for explaining a second substrate processing example in which the processing unit is used.

FIG. 8 is a schematic diagram for explaining a third substrate processing example in which the processing unit is used.

FIG. 1 is a schematic plan view for explaining the layout inside the substrate processing apparatus 1 according to the first embodiment of the present invention. The substrate processing apparatus 1 is a blade-type apparatus for processing a substrate W such as a silicon wafer one by one. In this embodiment, the substrate W is a disc-shaped substrate. The substrate processing apparatus 1 includes: a plurality of processing units 2 for processing a substrate W with a processing liquid; and a load port LP for carrying a carrier C, which is used for accommodating A plurality of substrates W processed in the processing unit 2; a transfer robot IR and a transfer robot CR are used to transfer the substrate W between the loading port LP and the processing unit 2; and a control device 3 is used to control the substrate processing device 1. The transfer robot IR transfers the substrate W between the carrier C and the substrate transfer robot CR. The substrate transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 2. The plurality of processing units 2 have the same configuration, for example.

FIG. 2A is a schematic cross-sectional view for explaining a configuration example of the processing unit 2.

The processing unit 2 includes: a box-shaped processing chamber 4; and a rotation fixture (substrate holding unit) 5 that holds a substrate W in a horizontal posture in the processing chamber 4 and passes the substrate W around the substrate W The center vertical axis of rotation A1 rotates; and the facing member 7 includes a substrate facing surface 6 that faces the upper surface (main surface) of the substrate W held by the rotation jig 5. The opposing member 7 includes a first nozzle 9 having a first ejection port (ejection port) 8 which is directed toward the center of the upper surface of the substrate W held by the rotation jig 5. A fluid is ejected; a second nozzle 11 is provided with a second ejection port 10 for ejecting a fluid toward a center portion of the upper surface of the substrate W held by the rotation jig 5; an organic solvent supply unit (the first A pharmaceutical fluid supply unit) 12 is used to supply an isopropyl alcohol (IPA), which is an example of an organic solvent (organic solvent having a low surface tension) as a liquid of the first pharmaceutical fluid, to the first nozzle 9; A rinse water supply unit (second water supply unit) 13 is used to supply water (for example, carbonated water) as a cleaning liquid to the second nozzle 11; a sulfuric acid-containing liquid supply unit (second chemical fluid supply unit) 14. It is used to supply a sulfuric acid / hydrogen peroxide mixture (SPM), which is an example of a sulfuric acid-containing liquid as a second pharmaceutical fluid, to the upper surface of the substrate W held by the rotation jig 5; washing Net medicinal solution supply unit 15 SC1 (ammonia-hydrogen peroxide mixture) (a liquid containing NH ₄ OH and H ₂ O ₂ ), which is an example of a cleaning solution, is supplied to the substrate W held by the rotation jig 5 And a cylindrical processing cup 16 surrounding the rotation jig 5.

The processing chamber 4 includes: a box-shaped partition wall 18 for containing the rotation fixture 5 or a nozzle; and a FFU (fan filter unit) 19 as a blower unit for purifying clean air (by filtering The air filtered by the device is delivered from the upper part of the partition wall 18 into the partition wall 18.

The FFU19 is arranged above the partition wall 18 and is mounted on the top plate of the partition wall 18. The FFU 19 sends clean air downward from the top plate of the partition wall 18 into the processing chamber 4. In addition, an exhaust liquid discharge pipe 81 is connected to the bottom of the processing cover 16. The exhaust liquid discharge pipe 81 is used to discharge the gas in the processing chamber 4 to an exhaust treatment provided in a factory where the substrate processing apparatus 1 is installed. device. Therefore, the downflow (downflow) flowing downward in the processing chamber 4 is formed by the FFU 19 and the exhaust liquid discharge pipe 81. The processing of the substrate W is performed in a state where a downflow is formed in the processing chamber 4.

As the rotation jig 5, a clamp type jig for holding the substrate W in a horizontal direction and holding the substrate W horizontally is used. Specifically, the rotation fixture 5 includes: a spin motor 22; a lower rotation shaft 23 integrated with a driving shaft of the rotation motor 22; and a disc-shaped spin base 24, The system is mounted to the upper end of the lower rotation shaft 23 almost horizontally.

A plurality of (three or more, for example, six) clamping members 25 are arranged on a peripheral edge portion of the upper surface of the rotation base 24. The plurality of clamping members 25 are arranged on the peripheral edge portion of the upper surface of the rotation base 24 and are arranged at appropriate intervals on the circumference corresponding to the outer peripheral shape of the substrate W.

In addition, the rotation jig 5 is not limited to a clamping type rotation jig. For example, a vacuum suction type rotation jig (vacuum jig) may be used. The vacuum suction type rotation jig vacuum-adsorbs the back surface of the substrate W, and In this state, the substrate W is held in a horizontal posture, and in this state, the substrate W is further rotated around a vertical rotation axis, thereby rotating the substrate W held by the rotation jig 5.

FIG. 2B is a diagram for specifically explaining the configuration of the periphery of the facing member 7 included in the processing unit 2.

As shown in FIGS. 2A and 2B, the opposing member 7 includes a barrier plate 26 and a rotation shaft 27 coaxially disposed on the barrier plate 26. The barrier plate 26 has a disk shape having a diameter substantially the same as or larger than that of the substrate W. The substrate-opposing surface 6 forms a lower surface of the barrier plate 26, and has a circular shape facing the entire area of the upper surface of the substrate W.

A cylindrical through hole 28 is formed in the central portion of the substrate facing surface 6. The through hole 28 penetrates the blocking plate 26 and the upper rotation shaft 27 vertically. The inner peripheral wall system of the through hole 28 is partitioned by a cylindrical surface. A first nozzle 9 and a second nozzle 11 are inserted into the through hole 28. The first nozzle 9 and the second nozzle 11 extend in the vertical direction along the rotation axis A2 (coaxial with the rotation axis A1) of the upper rotation shaft 27, respectively.

Specifically, a central axis nozzle 29 is inserted into the through hole 28, and the central axis nozzle 29 extends up and down along the rotation axis A2 of the barrier plate 26. As shown in FIG. 2B, the central axis nozzle 29 includes a first nozzle 9, a second nozzle 11, and a cylindrical casing 30 surrounding the first nozzle 9 and the second nozzle 11. In this embodiment, each of the first nozzle 9 and the second nozzle 11 is an inner tube. The first discharge port 8 is formed at the lower end of the first nozzle 9. The second discharge port 10 is formed at the lower end of the second nozzle 11. The cover 30 extends in the vertical direction along the rotation axis A2. The cover 30 is inserted into the through hole 28 in a non-contact state. Therefore, the inner periphery of the barrier plate 26 surrounds the outer periphery of the cover 30 in the radial direction at intervals.

As shown in FIG. 2A, a barrier rotation unit 31 is coupled to the upper rotation shaft 27. The barrier rotation unit 31 rotates the upper rotation shaft 27 about the rotation axis A2 for each barrier 26. An electric motor, a roller A barrier lift unit 32 constituted by a bead screw or the like. The barrier lifting unit 32 lifts and lowers the barrier 26 in the vertical direction for each central axis nozzle 29. The barrier lift unit 32 lifts and lowers the barrier 26 and the central axis nozzle 29 between the approach position (refer to FIG. 5A and the like) and a retracted position (refer to FIG. 2A or FIG. 5G and the like) provided above the proximity position. The substrate facing surface 6 of the blocking spacer 26 is close to the upper surface of the substrate W held by the rotation jig 5. The barrier lift unit 32 can hold the barrier 26 at various positions between the approach position and the retracted position.

In addition, a barrier close proximity sensor 33 (not shown in FIGS. 2A to 2C) is provided. The barrier close proximity sensor 33 is connected to the barrier 26 to detect the barrier 26 toward the approach position. Configuration.

As shown in FIG. 2B, the organic solvent supply unit 12 includes: an organic solvent pipe (medicine fluid pipe) 34 connected to the first nozzle 9 and internally connected to the first ejection port 8; a first organic solvent valve 35, The second organic solvent valve 36 is clipped to the organic solvent pipe 34 on the downstream side of the organic solvent pipe 34 and opens and closes the organic solvent; And the valve closing sensor 37 detects that the first organic solvent valve 35 is in a closed state.

As shown in FIG. 2B, in the organic solvent pipe 34, a first water pipe 39 is connected to a first branch position 38 set between the first organic solvent valve 35 and the second organic solvent valve 36. In the following description, the downstream portion 40 in the organic solvent piping 34 that is further downstream than the first branching position 38 is referred to as an "organic solvent downstream portion 40". The upstream portion 41 in the organic solvent piping 34 that is upstream from the first branching position 38 is referred to as an "organic solvent upstream side." Section 41. " In this embodiment, the first branch position 38 is set to a position close to the upper end of the organic solvent pipe 34. Therefore, in a state where the organic solvent is not present in the organic solvent downstream side portion 40, the time from when the first organic solvent valve 35 is opened until the organic solvent reaches the second nozzle 11 (the second discharge port 10) becomes longer (for example, about 3 seconds).

When the first organic solvent valve 35 is opened, an organic solvent from an organic solvent supply source is supplied to the second organic solvent valve 36. When the second organic solvent valve 36 is opened in this state, the organic solvent supplied to the second organic solvent valve 36 is discharged from the first discharge port 8 toward the center portion of the upper surface of the substrate W.

As shown in FIG. 2B, in the organic solvent downstream portion 40, a predetermined first detection position 42 located upstream from the sandwiched position of the second organic solvent valve 36 is arranged to detect the inside of the organic solvent downstream portion 40. Whether there is a liquid first liquid detection sensor 43. The first liquid detection sensor 43 detects whether a liquid exists in the organic solvent pipe 34 in the first detection position 42 and sends a signal corresponding to the detection result to the control device 3. When the front end of the liquid inside the organic solvent pipe 34 advances beyond the first detection position 42 (located on the side of the first nozzle 9), the liquid is detected by the first liquid detection sensor 43. When the front end of the liquid inside the organic solvent pipe 34 recedes beyond the first detection position 42 (located on the organic solvent supply source side), the liquid is not detected by the first liquid detection sensor 43.

As shown in FIG. 2B, in the organic solvent downstream side portion 40, a predetermined second detection position 44 located downstream from the sandwiched position of the second organic solvent valve 36 is arranged to detect the inside of the organic solvent downstream side portion 40. Whether there is a liquid second liquid detection sensor 45. The second liquid detection sensor 45 series It is detected whether a liquid is present inside the organic solvent pipe 34 in the second detection position 44 and a signal corresponding to the detection result is transmitted to the control device 3. When the tip of the liquid inside the organic solvent pipe 34 advances beyond the second detection position 44 (located on the side of the first nozzle 9), the liquid is detected by the second liquid detection sensor 45. When the front end of the liquid inside the organic solvent pipe 34 recedes beyond the second detection position 44 (on the side of the organic solvent supply source), the liquid is not detected by the second liquid detection sensor 45.

The first liquid detection sensor 43 and the second liquid detection sensor 45 are, for example, optical fiber sensors for liquid detection (such as FU95S manufactured by Japan Keyence Corporation), and are directly installed or configured near The outer peripheral wall of the organic solvent pipe 34. The first liquid detection sensor 43 and / or the second liquid detection sensor 45 can also be configured by, for example, a capacitance type sensor.

As shown in FIG. 2B, water (for example, carbonated water) that is from a water supply source is supplied to the first water pipe 39. A first water valve 46 is provided in the middle of the first water pipe 39 to open and close the first water pipe 39. When the first water valve 46 is opened, it is supplied from the first water pipe 39 to the organic solvent downstream side portion 40. In addition, when the first water valve 46 is closed, the supply of water from the first water pipe 39 to the organic solvent downstream side portion 40 is stopped. The water system supplied from the first water pipe 39 to the organic solvent pipe 34 is, for example, carbonated water. The first water pipe 39 and the first water valve 46 are included in a replacement water supply unit (first water supply unit) 47.

As shown in FIG. 2B, a suction pipe 49 is branchedly connected to a second branched position 48 set in the middle of the first water pipe 39 (that is, between the first branched position 38 and the first water valve 46). In the following description, the first water pipe 39 The downstream portion 50 that is further downstream than the second branching position 48 is referred to as a "water downstream portion 50".

As shown in FIG. 2B, a suction valve 51 for opening and closing the suction pipe 49 is provided in the middle of the suction pipe 49. A suction device 52 is connected to the front end of the suction pipe 49. As shown in FIG. 2A, the suction device 52 includes, for example, a vacuum generator 53 and a driving valve 54 for operating the vacuum generator 53. The suction device 52 is not limited to a suction device that generates a suction force by vacuum generation, and may be, for example, an aspirator.

As shown in FIG. 2B, in the operating state of the suction device 52 (vacuum generator 53), when the first organic solvent valve 35 and the first water valve 46 are closed and the second organic solvent valve 36 is opened, the suction When the valve 51 is opened, the operation of the suction device 52 is activated, the inside of the organic solvent downstream portion 40 and the water downstream portion 50 is exhausted, and the liquid contained in the organic solvent downstream portion 40 and the water downstream portion 50 ( Water or organic solvent) is sucked into the suction pipe 49. The suction device 52 and the suction valve 51 are included in the suction unit 55.

As shown in FIG. 2B, the cleaning water supply unit 13 includes: a second water pipe 56 connected to the second nozzle 11 and internally connected to the second discharge port 10; and a second water valve 57 which connects the second water valve 57 The water pipe 56 is opened and closed to switch the supply of water from the second water pipe 56 to the second nozzle 11 and stop the water supply. When the second water valve 57 is opened, the water system from the water supply source is supplied to the second water pipe 56 and is discharged from the second discharge port 10 toward the center of the upper surface of the substrate W.

As shown in FIG. 2A, the processing unit 2 further includes an inert gas pipe 58 for supplying an inert gas to the outer periphery of the cover 30 and the barrier plate 26. A cylindrical space between the inner circumferences; and an inert gas valve 59 interposed between the inert gas pipes 58. When the inert gas valve 59 is opened, the inert gas system from the inert gas supply source passes between the outer periphery of the casing 30 and the inner periphery of the barrier plate 26 and is sprayed downward from the central portion of the lower surface of the barrier plate 26. Therefore, when the inert gas valve 59 is opened in a state where the barrier plate 26 is disposed at the close position, the inert gas system ejected from the center portion of the lower surface of the barrier plate 26 faces the substrate of the barrier plate 26 on the upper surface of the substrate W The space between the surfaces 6 extends outward (in a direction away from the rotation axis A1), and the air system between the substrate W and the barrier plate 26 is replaced with an inert gas. The inert gas system flowing through the inert gas pipe 58 is, for example, nitrogen. The inert gas is not limited to nitrogen, and may be other inert gas such as helium or argon.

As shown in FIG. 2A, the sulfuric acid-containing liquid supply unit 14 includes: a sulfuric acid-containing liquid nozzle 60; a sulfuric acid-containing liquid pipe 61 connected to the sulfuric acid-containing liquid nozzle 60; and a sulfuric acid-containing liquid valve 62 sandwiched between the sulfuric acid-containing liquid The piping 61 and the first nozzle moving unit 63 move the sulfuric acid-containing liquid nozzle 60. The first nozzle moving unit 63 includes a motor and the like. A nozzle retreat sensor 64 is coupled to the first nozzle moving unit 63, and the nozzle retreat sensor 64 is used to detect a situation where the sulfuric acid-containing liquid nozzle 60 is located at the retreat position.

In the case where the first nozzle moving unit 63 is constituted by, for example, a stepping motor, the nozzle avoidance sensor 64 can refer to the output from the motor control unit to control the stepping motor and has responded to sulfuric acid. The encoder signal of the movement amount (arm swing angle) of the liquid containing nozzle 60 is used to detect whether the sulfuric acid containing liquid nozzle 60 is located at the retreat position.

The sulfuric acid-containing liquid nozzle 60 is used, for example, in a state of continuous flow. A straight nozzle that ejects liquid. The sulfuric acid-containing liquid pipe 61 is supplied with a sulfuric acid-containing liquid from a sulfuric acid-containing liquid supply source. In this embodiment, a sulfuric acid-containing liquid pipe 61 is supplied with a sulfuric acid-containing liquid at a high temperature (for example, about 170 ° C. to about 200 ° C.) as a sulfuric acid-hydrogen peroxide mixed liquid (SPM). The SPM system heated up to the aforementioned high temperature by the reaction heat of sulfuric acid and hydrogen peroxide water is supplied to the sulfuric acid-containing liquid pipe 61.

When the sulfuric acid-containing liquid valve 62 is opened, the high-temperature SPM supplied from the sulfuric acid-containing liquid pipe 61 to the sulfuric acid-containing liquid nozzle 60 is sprayed downward from the sulfuric acid-containing liquid nozzle 60. When the sulfuric acid-containing liquid valve 62 is closed, the ejection of high-temperature SPM from the sulfuric acid-containing liquid nozzle 60 is stopped. The first nozzle moving unit 63 moves the sulfuric acid-containing liquid nozzle 60 between a processing position and a retreat position. The processing position is a position where the high-temperature SPM ejected from the sulfuric acid-containing liquid nozzle 60 is supplied to the upper surface of the substrate W. The retreat position is a position where the sulfuric acid-containing liquid nozzle 60 has retreated to the side of the rotation jig 5 when viewed from above.

As shown in FIG. 2A, the cleaning solution supply unit 15 includes: a cleaning solution nozzle 65; a cleaning solution pipe 66 connected to the cleaning solution nozzle 65; a cleaning solution valve 67; The cleaning chemical liquid pipe 66 is provided, and the second nozzle moving unit 68 moves the cleaning chemical liquid nozzle 65. The cleaning chemical nozzle 65 is, for example, a straight nozzle for ejecting a liquid in a continuous flow state. A cleaning solution (for example, SC1) from a cleaning solution supply source is supplied to the cleaning solution pipe 66.

When the cleaning liquid medicine valve 67 is opened, the SC1 supplied from the cleaning liquid pipe 66 to the cleaning liquid nozzle 65 is ejected downward from the cleaning liquid nozzle 65. When the cleaning chemical liquid valve 67 is closed, the spray from the cleaning chemical liquid nozzle 65 is stopped. Net medicine solution. The second nozzle moving unit 68 moves the cleaning chemical liquid nozzle 65 between the processing position and the retreat position. The processing position is a position where SC1 ejected from the cleaning chemical liquid nozzle 65 is supplied to the upper surface of the substrate W. The retreat position is a position where the cleaning solution nozzle 65 has retracted to the side of the rotation jig 5 when viewed from above. In addition, the second nozzle moving unit 68 moves the cleaning chemical liquid nozzle 65 horizontally between a central position and a peripheral position, and the central position is that the cleaning chemical liquid ejected from the cleaning chemical liquid nozzle 65 is deposited on the substrate. The position of the center portion of the upper surface of W, and the peripheral position is the position where the cleaning solution sprayed from the cleaning solution nozzle 65 is deposited on the peripheral portion of the upper surface of the substrate W. Both the central position and the peripheral position are processing positions.

FIG. 2C is a schematic cross-sectional view showing a configuration example of a lower portion of the processing unit 2 in an enlarged manner.

As shown in FIG. 2A and FIG. 2C, the processing cover 16 is a first guard including a processing liquid (cleaning liquid and cleaning liquid) that surrounds the rotation jig 5 and is used to catch the surroundings of the substrate W. 71 and the second protective cover 72, and a protective cover lifting unit 73 for independently lifting and lowering each of the first protective cover 71 and the second protective cover 72. The shield lifting unit 73 lifts and lowers each of the first shield 71 and the second shield 72 independently. In addition, the hood raising and lowering unit 73 has a structure including a ball screw mechanism, for example.

The processing cover 16 can be accommodated in an overlapping manner in the up-down direction, and at least one of the two first protective covers 71 and the second protective cover 72 can be raised and lowered by the protective cover lifting unit 73 to unfold and store the processing cover 16.

The first protective cover 71 on the inner side surrounds the circumference of the rotation jig 5 and has a rotation substantially relative to the rotation axis A1 of the substrate W caused by the rotation jig 5. Symmetrical shape. As shown in FIG. 2C, the first protective cover 71 is integrally provided with a bottom portion 74 that is annular in a plan view, and a cylindrical inner wall portion 75 that rises upward from the inner periphery of the bottom portion 74. A cylindrical outer wall portion 76 standing upward from the outer peripheral edge of the bottom portion 74; and a cylindrical guide portion 77 tied between the inner peripheral edge and the outer peripheral edge from a portion of the corresponding bottom portion 74 upward Stand up.

The guide portion 77 includes a cylindrical body portion 78 standing up from the bottom 74, and a cylindrical upper end portion 79 that draws a smooth arc from the upper end of the body portion 78 and faces the center side. (Direction close to the rotation axis A1) extends diagonally upward.

The inner wall portion 75 and the guide portion 77 are partitioned by a first liquid discharge tank 80, which is used to collect a processing liquid (sulfuric acid-containing liquid, cleaning agent) used for processing of the substrate W. Liquid and water) and drained. An exhaust liquid discharge pipe 81 extending from a negative pressure source (not shown) is connected to the lowest portion of the bottom of the first liquid discharge tank 80. Thereby, the inside of the first liquid discharge tank 80 is forcibly exhausted, and the processing liquid collected in the first liquid discharge tank 80 and the atmosphere in the first liquid discharge tank 80 are discharged through the exhaust liquid discharge pipe 81 . The treatment liquid discharged together with the atmosphere is separated from the atmosphere by a gas-liquid separator 97 sandwiched in the middle of the exhaust liquid discharge pipe 81. A plurality of discharge branch pipes (a branch pipe 82 for a sulfuric acid-containing liquid, a branch pipe 83 for a cleaning chemical liquid, and a branch for water) are connected to the exhaust liquid discharge pipe 81 via a gas-liquid separator 97 and each through a discharge branch valve 85 Piping 84). Each of the liquid discharge branch valves 85 includes a second valve closing sensor 95 for detecting a state in which the liquid discharge branch valve 85 is closed.

In the sulfuric acid-containing liquid step described later (step S3 in FIG. 4), only the liquid The drain branch valve 85 for the branch pipe 82 for the sulfuric acid-containing liquid in the branch valve 85 is opened, and the processing liquid flowing through the exhaust drain pipe 81 is supplied to the branch pipe 82 for the sulfuric acid-containing liquid, and is sent to A processing device (not shown) for treating a sulfuric acid-containing liquid by draining the liquid.

In the first and second cleaning steps (steps S4 and S6 in FIG. 4) described below, only the drain branch valve 85 for the branch branch pipe 84 for water in the drain branch valve 85 is opened and circulated. The processing liquid in the exhaust liquid discharge pipe 81 is supplied to the water branching pipe 84 and then sent to a processing device (not shown) for draining water.

In the cleaning chemical solution step described later (step S5 in FIG. 4), only the liquid drainage branch valve 85 for the cleaning chemical liquid branch pipe 83 in the liquid drainage branch valve 85 is opened and circulates through the exhaust gas discharge valve. The processing liquid of the liquid piping 81 is supplied to the cleaning chemical liquid branch piping 83 and is then transferred to a processing device (not shown) for draining the cleaning chemical liquid.

In addition, a space between the guide portion 77 and the outer wall portion 76 is a second liquid discharge tank 86 for collecting and recovering the organic solvent used in the processing of the substrate W. In the second liquid discharge tank 86, for example, one end of an exhaust pipe 87 is connected to the bottom. Thereby, the inside of the second liquid discharge tank 86 is forcibly exhausted, and the atmosphere in the second liquid discharge tank 86 is discharged through the exhaust pipe 87.

The other end of the exhaust pipe 87 is connected to a negative pressure source (not shown). An exhaust valve 101 for opening and closing the exhaust pipe 87 is interposed between the exhaust pipe 87. A valve opening sensor 21 is provided on the exhaust valve 101 to detect that the exhaust valve 101 is in an open state.

The second protective cover 72 on the outer side has a substantially rotating position with respect to the rotation axis A1. Symmetrical shape. The second protective cover 72 surrounds the periphery of the rotation jig 5 in the outer side of the guide portion 77 of the first protective cover 71. An opening 89 having a diameter larger than that of the substrate W held by the rotation jig 5 is formed in the upper end portion 88 of the second protective cover 72. The upper end 90 of the second protective cover 72 is an open end for distinguishing the opening 89.

The second protective cover 72 has a lower end portion 91 which is formed in a cylindrical shape coaxial with the guide portion 77, and a cylindrical upper end portion 88 which draws a smooth arc from the upper end of the lower end portion 91 and faces the center side ( The direction close to the rotation axis A1) extends obliquely upward, and the folded-back portion 92 is formed by folding the front end portion of the upper end portion 88 downward.

The lower end portion 91 is located on the second liquid discharge tank 86 and is formed to be accommodated in the second liquid discharge tank 86 in a state where the first protective cover 71 and the second protective cover 72 are closest to each other. In addition, the upper end portion 88 is provided so as to overlap the upper end portion 79 of the guide portion 77 of the first protective cover 71 in the vertical direction, and faces the first protective cover 71 and the second protective cover 72 closest to each other. The upper end portion 79 of the guide portion 77 is formed so as to approach it with a very small gap. The folded-back portion 92 is formed so as to overlap the upper end portion 79 of the guide portion 77 in the horizontal direction in a state where the first protective cover 71 and the second protective cover 72 are closest to each other.

As shown in FIG. 2A, the protective cover lifting unit 73 lifts each of the first protective cover 71 and the second protective cover 72 between an upper position and a lower position. The upper end of the protective cover is located above the substrate W. The lower position is a position where the upper end portion of the protective cover is located below the substrate W. The shield lifting unit 73 can hold each of the first shield 71 and the second shield 72 at any position between the upper position and the lower position. Supplying a processing liquid and a substrate to the substrate W The drying of the plate W is performed in a state where any one of the first protective cover 71 and the second protective cover 72 faces the peripheral end surface of the substrate W.

As shown in FIG. 5A and the like, in a case where the inner first protective cover 71 and the peripheral end surface of the substrate W face each other, both the first protective cover 71 and the second protective cover 72 are arranged at the upper positions. In this state, the folded-back portion 92 overlaps the upper end portion 79 of the guide portion 77 in the horizontal direction.

Associated with the first protective cover 71 are provided: a position sensor 93 on the protective cover, which is used to detect the configuration toward the upper position of the first protective cover 71; and a position sensor 94 on the protective cover, which is used to detect Arrangement toward the upper position of the first protective cover 71.

On the other hand, as shown in FIG. 2A, FIG. 5G, and the like, in a case where the outer second protective cover 72 and the peripheral end surface of the substrate W face each other, the second protective cover 72 is disposed at an upper position, and the first protective The cover 71 is arranged in a lower position.

FIG. 3 is a block diagram illustrating the electrical configuration of the main parts of the substrate processing apparatus 1.

The control device 3 is configured using, for example, a microcomputer. The control device 3 is provided with a computing unit such as a CPU (Central Processing Unit), a memory unit such as a solid-state memory device, a hard disk drive, and an input-output unit. The memory unit is used to memorize the program for the arithmetic unit to execute.

The operations of the second nozzle moving units 63 and 68, the baffle blocking rotation unit 31, the baffle lifting unit 32, the shield lifting unit 73, and the like are controlled. The control device 3 includes a first organic solvent valve 35, a second organic solvent valve 36, a first water valve 46, a suction valve 51, a drive valve 54, a second water valve 57, and an inert gas. The valve 59, the sulfuric acid-containing liquid valve 62, the cleaning chemical liquid valve 67, and the liquid discharge branch valve 85 are opened and closed. Furthermore, the control device 3 is input with the detection output of the first valve opening sensor 21, the detection output of the barrier proximity position sensor 33, the detection output of the valve closing sensor 37, and the first liquid detection sensor. Detection output of the sensor 43, detection output of the second liquid detection sensor 45, detection output of the nozzle retreat sensor 64, detection output of the position sensor 93 on the hood, and position sensor 94 of the under hood The detection output and the detection output of the second valve closing sensor 95 and the like.

FIG. 4 is a flowchart illustrating a first substrate processing example performed by the processing unit 2. 5A to 5H are schematic diagrams for explaining a first substrate processing example.

Hereinafter, a first substrate processing example will be described with reference to FIGS. 2A to 4. 5A to 5H are appropriately referred to. The first substrate processing example is a resist removal process for removing a resist formed on the upper surface of the substrate W. As described below, the first substrate processing example includes: a sulfuric acid-containing liquid step S3, which uses a sulfuric acid-containing liquid such as SPM to process the substrate W; and an organic solvent step S7, which uses a liquid organic solvent such as IPA to process the substrate W . Sulfuric acid-containing liquid comes in contact with an organic solvent, and is a combination of a pharmaceutical fluid (medicine liquid or a gas containing a pharmaceutical component) which is dangerous (a sudden reaction in this case).

When the substrate W is subjected to a resist removal treatment by the processing unit 2, the substrate W subjected to the ion implantation processing at a high dose is carried into the processing chamber 4 (step S1 in FIG. 4). The carried-in substrate W is a substrate that has not been subjected to a treatment for ashing the resist. In addition, a fine pattern with a high aspect ratio is formed on the surface of the substrate W.

Specifically, the control device 3 retracts the opposing member 7 (that is, the barrier plate 26 and the central axis nozzle 29) to the retracted position, and makes all the moving nozzles (that is, the sulfuric acid-containing liquid nozzle 60 and the cleaning chemical liquid nozzle) 65) Retreat from above the rotation jig 5 and lower the first protective cover 71 and the second protective cover 72 to the lower position. As a result, the upper ends of the first protective cover 71 and the second protective cover 72 are both arranged below the holding position of the substrate W. In this state, the hand H (see FIG. 1) of the substrate transfer robot CR (see FIG. 1) holding the substrate W is entered into the processing chamber 4, whereby the substrate W is attached to the surface of the substrate W ( The resist forming surface) is transferred to the rotation jig 5 in a state where it faces upward. After that, the substrate W is held by the rotation jig 5 (a substrate holding step).

After that, the control device 3 starts the rotation of the substrate W by the rotation motor 22. The substrate W is raised to a predetermined liquid processing speed (in the range of 1 rpm to 500 rpm, for example, about 100 rpm), and is maintained at the liquid processing speed. In addition, the control device 3 controls the shield lifting unit 73 and raises the first shield 71 and the second shield 72 to the upper positions, respectively, and makes the first shield 71 and the peripheral end surface of the substrate W face each other.

When the rotation speed of the substrate W reaches the liquid processing speed, a static elimination step (step S2 in FIG. 4) is performed. The static elimination step is to supply carbonated water to the upper surface of the substrate W and to remove the substrate W. Specifically, the control device 3 opens the second water valve 57. Thereby, as shown in FIG. 5A, carbonated water is sprayed from the second discharge port 10 of the second nozzle 11 toward the center portion of the upper surface of the substrate W. The carbonated water sprayed from the second nozzle 11 flows into the center portion of the upper surface of the substrate W, and receives centrifugal force caused by the rotation of the substrate W, and flows toward the peripheral edge portion of the substrate W on the upper surface of the substrate W.

In addition, in this embodiment, the static elimination step S2 is implemented by not only ejecting carbonated water from the second nozzle 11 but also ejecting carbonated water from the first ejection port 8 of the first nozzle 9. That is, the static elimination step S2 includes a first water replacement step T1, and the first water replacement step T1 is to replace the inside of the organic solvent pipe 34 with carbonated water. Specifically, the control device 3 opens the second organic solvent valve 36, closes the first organic solvent valve 35 and the suction valve 51, and opens the first water valve 46 in synchronization with the start of the neutralization step S2. Thereby, the carbonated water system from the first water pipe 39 is supplied to the organic solvent downstream side portion 40. In the case where droplets of the IPA used in the previous resist removal treatment are adhered to the inner wall of the organic solvent downstream portion 40, the droplets of the IPA are replaced with carbonated water. The carbonated water supplied to the downstream portion 40 of the organic solvent is ejected from the first nozzle 9 and impinges on the center of the upper surface of the substrate W, and receives centrifugal force caused by the rotation of the substrate W toward the substrate from the upper surface of the substrate W. The peripheral portion of W flows. In addition, in the case where the IPA atmosphere used in the previous resist removal treatment was mixed into the tube of the organic solvent downstream portion 40, it was also removed by carbonated water.

The carbonated water supplied to the upper surface of the substrate W is scattered from the peripheral edge portion of the substrate W toward the side of the substrate W, and is caught by the inner wall of the first protective cover 71. Next, the carbonated water system flowing and flowing down the inner wall of the first protective cover 71 is collected in the first liquid discharge tank 80 and then guided to the exhaust liquid discharge pipe 81. In the neutralization step S2, the drain branch valve 85 for the branch pipe for water 84 is opened, and the drain branch valve 85 for the branch pipe 82 for sulfuric acid-containing liquid and the branch pipe 83 for the cleaning liquid branch branch are opened. The valve 85 is closed, whereby the flow destination of the liquid through the exhaust liquid discharge pipe 81 is set to the water branch pipe 84. therefore, In the static elimination step S2, the carbonated water guided to the exhaust liquid discharge pipe 81 passes through the water branch pipe 84 and is guided to a processing device (not shown) for draining the carbonated water. In the case where the droplets of IPA used in the previous resist removal process are attached to the inner wall of the first protective cover 71, the first drain tank 80, and / or the tube wall of the exhaust drain pipe 81, The droplets of this IPA were washed with carbonated water.

By supplying carbonated water to the upper surface of the substrate W, a liquid film of carbonated water is formed on the upper surface of the substrate W. The liquid film of carbonated water is connected to the upper surface of the substrate W, thereby removing the substrate W held by the rotation jig 5. In this embodiment, since the static elimination step S2 includes the first water replacement step T1, the overall process of the resist removal process can be shortened compared with the case where the first water replacement step T1 is performed at a timing different from that of the static elimination step S2. time.

Next, when a predetermined time has elapsed from the start of the carbonated water spray, as shown in FIG. 5B, the control device 3 closes the first water valve 46 while maintaining the second water valve 57 in an open state, and maintains the second water valve 57 from the second When the nozzle 11 ejects carbonated water, the first nozzle 9 stops ejecting carbonated water.

After stopping the ejection of carbonated water from the first nozzle 9, the first water suction step T2 (first suction step) for sucking carbonated water in the organic solvent pipe 34 is performed. The first water suction step T2 is used to suck carbonated water existing in the organic solvent pipe 34 after the first water replacement step T1 by the suction unit 55.

Specifically, after the first water replacement step T1 is completed, the control device 3 opens the second organic solvent valve 36 and closes the first organic solvent valve 35 and the first water valve 46, and opens the suction valve 51. Thereby, as shown in FIG. 5B, the insides of the organic solvent downstream portion 40 and the water downstream portion 50 are exhausted, The carbonated water system existing in the organic solvent downstream portion 40 and the water downstream portion 50 is sucked (sucked) into the suction pipe 49. The carbonated water is sucked until the front end surface of the carbonated water is retracted to a predetermined standby position in the pipe (for example, it is set to the suction pipe 49 or the water downstream side portion 50). When the front end surface of the carbonated water is retracted to the standby position, the control device 3 closes the suction valve 51. This completes the first water replacement step T1.

The first water suction step T2 is performed after the first water replacement step T1 is completed, so that there is no carbonated water inside the organic solvent pipe 34 after the first water suction step T2 is performed. This can suppress or prevent the carbonated water from falling from the first nozzle 9 after the first water replacement step T1 is completed.

When a predetermined period of time has elapsed since the carbonated water started to be sprayed, the control device 3 closes the first water valve 46 to stop the carbonated water from being sprayed from the second nozzle 11. Thereby, the static elimination step S2 is completed.

In addition, in this embodiment, since the first water suction step T2 and a part of the electricity removal step S2 are performed in parallel (the carbonated water is ejected from the second nozzle 9), the first water suction step T2 is additionally performed after the electricity removal step S2 ends. Compared with the case, the overall processing time of the resist removal process can be shortened. Next, the control device 3 performs a sulfuric acid-containing liquid step (a second processing step, step S3 of FIG. 4). This sulfuric acid-containing liquid step is to supply high-temperature SPM to the upper surface of the substrate W. In the sulfuric acid-containing liquid step S3, the control device 3 supplies the high-temperature SPM from the sulfuric acid-containing liquid nozzle 60 to the center portion of the upper surface of the substrate W, and peels off the resist from the surface of the substrate W.

Specifically, in the sulfuric acid-containing liquid step S3, the control device 3 controls the first nozzle moving unit 63, thereby moving the sulfuric acid-containing liquid nozzle 60 from the retreat position. Move to the center position. Thereby, the sulfuric acid containing liquid nozzle 60 is arrange | positioned above the center part of the board | substrate W. After that, the control device 3 opens the sulfuric acid-containing liquid valve 62. Thereby, high-temperature (for example, about 170 ° C. to about 200 ° C.) SPM is supplied from the sulfuric acid-containing liquid pipe 61 to the sulfuric acid-containing liquid nozzle 60, and high-temperature SPM is ejected from the ejection port of the sulfuric acid-containing liquid nozzle 60. The high-temperature SPM sprayed from the sulfuric acid-containing liquid nozzle 60 flows to the center of the upper surface of the substrate W, is subjected to centrifugal force due to the rotation of the substrate W, and flows outward along the upper surface of the substrate W. Thereby, as shown in FIG. 5C, the entire upper surface of the substrate W is covered with the liquid film of the SPM. With the high-temperature SPM, the resist is peeled from the surface of the substrate W and removed from the surface of the substrate W.

The SPM supplied to the upper surface of the substrate W is scattered from the peripheral edge portion of the substrate W toward the side of the substrate W, and is received by the inner wall of the first protective cover 71. Next, the SPM system flowing and flowing down on the inner wall of the first protective cover 71 is collected in the first liquid discharge tank 80 and then guided to the exhaust liquid discharge pipe 81. In the sulfuric acid-containing liquid step S3, the drainage branch valve 85 for the branch pipe 82 for the sulfuric acid-containing solution is opened, and the drain branch valve 85 for the branch pipe 83 for cleaning the chemical liquid and the branch pipe 84 for water are opened. The liquid discharge branch valve 85 is closed, whereby the flow destination of the liquid through the exhaust liquid discharge pipe 81 is set to the sulfuric acid-containing liquid branch pipe 82. Therefore, in the neutralization step S2, the SPM guided to the exhaust liquid discharge pipe 81 passes through the branch pipe 82 for sulfuric acid-containing liquid, and is guided to a processing device (not Icon). Therefore, after the sulfuric acid-containing liquid step S3, droplets of SPM are attached to the inner wall of the first protective cover 71, the first liquid discharge tank 80, and / or the pipe wall of the exhaust liquid discharge pipe 81.

In the sulfuric acid-containing liquid step S3, a large amount of SPM fog is generated around the upper surface of the substrate W by supplying high-temperature SPM to the substrate W. In the sulfuric acid-containing liquid step S3, the barrier plate 26 and the central axis nozzle 29 are spaced apart from each other (for example, the substrate-opposing surface 6 of the barrier plate 26 is spaced from the upper surface of the rotation base 24 at a sufficient interval (a row such as about 150 mm). ) Is located above), but since the SPM used in the sulfuric acid-containing liquid step S3 is very high temperature (for example, about 170 ° C to about 200 ° C), a large amount of mist of the SPM is generated in the sulfuric acid-containing liquid step S3, and as a result, the SPM The mist from the first injection port 8 enters the inside of the organic solvent piping 34, and enters the inside of the organic solvent piping 34 (to the depth).

In this case, when the IPA used in the previous resist removal treatment remained in the organic solvent pipe 34 (including the droplets of IPA attached to the organic solvent pipe 34), the sulfuric acid-containing liquid step In S3, the mist of the SPM that has entered the organic solvent pipe 34 may come into contact with the IPA inside the organic solvent pipe 34. When the mist of the SPM comes into contact with the IPA in the inside of the organic solvent piping 34, particles may be generated and the inside of the organic solvent piping 34 may be a source of particle generation.

However, in this embodiment, since the first water replacement step T1 is performed before the sulfuric acid-containing liquid step S3, IPA does not remain in the organic solvent pipe 34 when the sulfuric acid-containing liquid step S3 starts. Therefore, in the sulfuric acid-containing liquid step S3, even if the mist of the SPM enters the organic solvent pipe 34, the organic solvent pipe 34 does not come into contact with the IPA. Therefore, it is possible to prevent the IPA from contacting the SPM in the sulfuric acid-containing liquid step S3, thereby suppressing or preventing the inside of the organic solvent piping 34 from being a particle generation source.

In the sulfuric acid-containing liquid step S3, when the high-temperature-starting SPM starts to elapse, the sulfuric acid-containing liquid step S3 ends. Specifically, the control device 3 closes the sulfuric acid-containing liquid valve 62 to stop the sulfuric acid-containing liquid nozzle 60 from ejecting high-temperature SPM, and then controls the first nozzle moving unit 63 to retreat the sulfuric acid-containing liquid nozzle 60 to the retreat position.

Next, a first cleaning step for supplying carbonated water as a cleaning solution to the upper surface of the substrate W is performed (step S4 in FIG. 4). Specifically, the control device 3 opens the second water valve 57. Thereby, as shown in FIG. 5D, carbonated water is ejected from the second ejection port 10 of the second nozzle 11 toward the center portion of the upper surface of the substrate W. The carbonated water sprayed from the second nozzle 11 penetrates the liquid to the center of the upper surface of the substrate W, and receives the centrifugal force caused by the rotation of the substrate W, and flows toward the peripheral edge of the substrate W on the upper surface of the substrate W.

In addition, in this embodiment, the first cleaning step S4 is realized by spraying carbonated water not only from the second nozzle 11 but also from the first spray port 8 of the first nozzle 9. That is, the first cleaning step S4 includes a second water replacement step T3. The second water replacement step T3 replaces the inside of the organic solvent pipe 34 with carbonated water in parallel with the discharge of carbonated water from the second nozzle 11. Specifically, the control device 3 opens the second organic solvent valve 36, closes the first organic solvent valve 35 and the suction valve 51, and opens the first water valve 46 in the same part as the start of the first cleaning step S4. Thereby, the carbonated water system from the first water pipe 39 is supplied to the organic solvent downstream side portion 40, and the droplet system of the SPM attached to the inner wall of the organic solvent downstream side portion 40 is replaced with the carbonated water. The carbonated water supplied to the downstream portion 40 of the organic solvent is ejected from the first nozzle 9 and impinges on the central portion of the upper surface of the substrate W, and receives the rotation of the substrate W. The centrifugal force caused by the rotation flows on the upper surface of the substrate W toward the peripheral edge portion of the substrate W.

The carbonated water supplied to the upper surface of the substrate W is scattered from the peripheral edge portion of the substrate W toward the side of the substrate W, and is caught by the inner wall of the first protective cover 71. Next, the carbonated water system flowing and flowing down the inner wall of the first protective cover 71 is collected in the first liquid discharge tank 80 and then guided to the exhaust liquid discharge pipe 81. In the first cleaning step S4, the drain branch valve 85 for the branch pipe for water 84 is opened, and the branch branch valve 85 for the branch pipe 82 for sulfuric acid-containing liquid and the branch pipe 83 for the cleaning liquid are opened. The liquid discharge branch valve 85 is closed, whereby the flow destination of the liquid through the exhaust liquid discharge pipe 81 is set to the water branch pipe 84. Therefore, the carbonated water guided to the exhaust liquid discharge pipe 81 is guided to the processing device (not shown) for draining water through the water branch pipe 84. In the case where the droplets of the SPM used in the sulfuric acid-containing liquid step S3 are attached to the inner wall of the first protective cover 71, the first liquid discharge tank 80, and / or the pipe wall of the exhaust liquid discharge pipe 81, the The droplets of SPM are washed with carbonated water.

The SPM on the substrate W is pushed outward by the carbonated water supplied to the upper surface of the substrate W and discharged to the periphery of the substrate W, and the liquid film system of the SPM on the substrate W is replaced to cover the substrate W Liquid film of carbonated water on the entire surface. That is, the SPM is rinsed from the upper surface of the substrate W with carbonated water as a cleaning solution. Next, when a predetermined period of time has elapsed from the start of ejecting carbonated water, the control device 3 closes the first water valve 46 and the second water valve 57 respectively, and stops the ejection of carbonated water from the first nozzle 9 and the second nozzle 11. Thereby, the first cleaning step is ended.

In addition, in this embodiment, since the first cleaning step S4 includes The second water replacement step T3 can shorten the overall processing time of the resist removal process compared to a case where the first water replacement step T1 is performed at a timing different from that of the first cleaning step S4.

In addition, in the first cleaning step S4, it is not necessary to stop the first nozzle 9 from ejecting carbonated water and stop the second nozzle 11 from ejecting carbonated water simultaneously, and the first nozzle may be stopped before the second nozzle 11 stops ejecting carbonated water. 9 Stop spraying carbonated water.

After the first nozzle 9 and the second nozzle 11 stop ejecting carbonated water, the control device 3 performs a cleaning chemical solution step for supplying SC1 to the upper surface of the substrate W (first processing step, step S5 in FIG. 4). In the cleaning chemical solution step S5, the control device 3 supplies SC1 from the cleaning chemical solution nozzle 65 to the upper surface of the substrate W, and removes from the surface of the substrate W the components existing on the substrate W after the sulfuric acid-containing liquid step S3. Resistor residue on the surface.

Specifically, in step S5 of the cleaning chemical solution, the control device 3 controls the second nozzle moving unit 68 to move the cleaning chemical nozzle 65 from the retreated position to the processing position. After that, the control device 3 opens the cleaning chemical liquid valve 67. As a result, as shown in FIG. 5E, SC1 is supplied from the cleaning solution pipe 66 to the cleaning solution nozzle 65, and SC1 is discharged from the discharge port of the cleaning solution nozzle 65. In addition, the control device 3 controls the second nozzle moving unit 68 in parallel with the discharge of SC1 from the cleaning liquid medicine nozzle 65, so that the cleaning liquid medicine nozzle 65 reciprocates between the central position and the peripheral position (half scan) ). Thereby, the liquid injection position of SC1 from the cleaning liquid nozzle 65 can be moved back and forth between the central portion of the upper surface of the substrate W and the peripheral portion of the upper surface of the substrate W, and the substrate can be scanned by the liquid injection position of SC1. The whole surface of W's upper surface. By facing the upper surface of the substrate W Supplying SC1 can remove the resist residue from the surface of the substrate W.

The SC1 supplied to the upper surface of the substrate W is scattered from the peripheral edge portion of the substrate W toward the side of the substrate W, and is received by the inner wall of the first protective cover 71. Next, the SC1 system flowing and flowing down the inner wall of the first protective cover 71 is collected in the first liquid discharge tank 80 and then guided to the exhaust liquid discharge pipe 81. In the washing chemical solution step S5, the drainage branch valve 85 for the branch pipe 83 for the cleaning solution is opened, and the branch branch valve 85 for the branch pipe 82 for the sulfuric acid-containing liquid and the branch branch pipe 84 for water are opened. The liquid discharge branch valve 85 is closed, whereby the flow destination of the liquid through the exhaust liquid discharge pipe 81 is set to the cleaning liquid solution branch pipe 83. Therefore, the SC1 guided to the exhaust liquid discharge pipe 81 passes through the cleaning chemical liquid branch pipe 83 and is guided to a processing device (not shown) for draining the cleaning chemical liquid.

Further, a second water suction step T4 (first suction step) for sucking carbonated water in the organic solvent pipe 34 is performed in parallel with the washing chemical solution step S5. This second water suction step T4 is used to suck carbonated water existing in the organic solvent pipe 34 after the organic solvent step S7 by the suction unit 55.

Specifically, after the second water replacement step T3 is completed, the control device 3 opens the second organic solvent valve 36 and closes the first organic solvent valve 35 and the first water valve 46, and opens the suction valve 51. Thereby, as shown in FIG. 5E, the interior of the organic solvent downstream portion 40 and the water downstream portion 50 is exhausted, and the carbonated water system existing in the organic solvent downstream portion 40 and the water downstream portion 50 is sucked ( Suction) to suction pipe 49. The carbonated water is sucked until the front end surface of the carbonated water is retracted to a predetermined standby position in the pipe (for example, it is set to the suction pipe 49 or the water downstream side portion 50). When the front face of carbonated water When backing to the standby position, the control device 3 closes the suction valve 51. Thereby, the second water suction step T4 is ended.

After the second water replacement step T3 is completed, the second water suction step T4 is performed, so that after the second water suction step T4 is performed, carbonated water does not exist in the organic solvent pipe 34. This can suppress or prevent the carbonated water from falling out of the first nozzle 9 after the second water replacement step T3 is completed.

In addition, in this embodiment, the second water suction step T4 is performed in parallel with the washing liquid solution step S5, so it is in contrast to the case where the second water replacement step T4 is performed at a timing different from the washing liquid solution step S5. As a result, the entire processing time of the resist removal process can be shortened.

When a predetermined period has elapsed from the start of SC1, the washing solution step S5 ends. Specifically, the control device 3 closes the cleaning liquid medicine valve 67 to stop the cleaning liquid medicine nozzle 65 from ejecting SC1, and then controls the second nozzle moving unit 68 to retreat the cleaning liquid medicine nozzle 65 to the retreat position.

Next, a second cleaning step is performed to supply carbonated water as a cleaning solution to the upper surface of the substrate W (step S6 in FIG. 4). Specifically, the control device 3 opens the second water valve 57. Thereby, as shown in FIG. 5F, carbonated water is ejected from the second ejection port 10 of the second nozzle 11 toward the center portion of the upper surface of the substrate W. The carbonated water sprayed from the second nozzle 11 flows into the center portion of the upper surface of the substrate W, and receives centrifugal force caused by the rotation of the substrate W, and flows from the upper surface of the substrate W toward the peripheral edge portion of the substrate W.

The carbonated water supplied to the upper surface of the substrate W is scattered from the peripheral edge portion of the substrate W toward the side of the substrate W, and is caught by the inner wall of the first protective cover 71. Next, the carbonated water system flowing down the inner wall of the first protective cover 71 is collected to After the first liquid discharge tank 80, it is guided to an exhaust liquid discharge pipe 81. In the second cleaning step S6, the drain branch valve 85 for the branch pipe for water 84 is opened, and the branch branch valve 85 for the branch pipe 82 for sulfuric acid-containing liquid and the branch pipe 83 for the cleaning liquid are opened. The liquid discharge branch valve 85 is closed, whereby the flow destination of the liquid through the exhaust liquid discharge pipe 81 is set to the water branch pipe 84. Therefore, in the second cleaning step S6, the carbonated water guided to the exhaust liquid discharge pipe 81 passes through the water branch pipe 84 and is guided to a processing device (not shown) for draining water.示).

The SC1 on the substrate W is carbonated water supplied to the upper surface of the substrate W. The carbonated water is pushed outward and discharged to the periphery of the substrate W, and the liquid film system of SC1 on the substrate W is replaced to cover the substrate W. Liquid film of carbonated water on the entire surface. That is, the SC1 system is rinsed from the upper surface of the substrate W with carbonated water as a cleaning solution. Next, when the second water valve 57 is opened for a predetermined time, the control device 3 closes the second water valve 57 to stop the second nozzle 11 from ejecting carbonated water. Thereby, the second cleaning step S6 is ended.

Next, an organic solvent step for supplying IPA as an organic solvent to the upper surface of the substrate W is performed (step S7 in FIG. 4). Specifically, the control device 3 controls the baffle elevating unit 32 and arranges the baffle 26 at an approach position. When the barrier plate 26 is located at the close position, the barrier plate 26 blocks the upper surface of the substrate W from the space around the substrate W.

In addition, the control device 3 controls the shield lifting unit 73 to place the second shield 72 in the upper position in a state where the first shield 71 is arranged in the lower position, so that the second shield 72 and the peripheral end surface of the substrate W Opposite. In addition, the control device 3 reduces the rotation of the substrate W to a predetermined paddle speed. degree. The slurry coating speed means that the centrifugal force of the liquid acting on the upper surface of the substrate W when the substrate W is rotated at the slurry coating speed is smaller than the surface tension acting between the cleaning solution and the upper surface of the substrate W or the centrifugal force and the surface Tension roughly rivals speed.

Next, the control device 3 opens the second organic solvent valve 36, closes the first water valve 46 and the suction valve 51, and opens the first organic solvent valve 35. Thereby, as shown in FIG. 5G, the IPA system from the organic solvent supply source is supplied to the second nozzle 11, and the IPA system is ejected from the second nozzle 11 and is deposited onto the upper surface of the substrate W.

The mist of the SPM that has entered the organic solvent pipe 34 in the sulfuric acid-containing liquid step S3 is liquefied by condensation to form droplets of the SPM. If droplets of SPM exist in the organic solvent pipe 34 before the start of the organic solvent step S7, the IPA supplied to the organic solvent pipe 34 in the organic solvent step S7 may come into contact with the SPM inside the organic solvent pipe 34. . When the IPA comes into contact with the droplets of the SPM inside the organic solvent piping 34, particles may be generated, and the inside of the organic solvent piping 34 may become a source of particle generation.

However, in this embodiment, since the second water replacement step T3 is performed before the organic solvent step S7, no droplets of SPM remain in the organic solvent pipe 34 at the beginning of the organic solvent step S7. Therefore, even if IPA is supplied to the organic solvent piping 34 in this organic solvent step S7, the organic solvent piping 34 does not come into contact with the SPM. Therefore, it is possible to effectively suppress or prevent particles from being generated due to the contact between the IPA and the SPM, thereby suppressing or preventing the inside of the organic solvent pipe 34 from being a source of particle generation.

In the organic solvent step S7, by ejecting the IPA from the first nozzle 9, The carbonated water system contained in the liquid film on the upper surface of the plate W was sequentially replaced with IPA. Thereby, the liquid film of IPA for covering the entire area of the upper surface of the substrate W is kept in a paste-like state on the upper surface of the substrate W. After the liquid film over the entire area of the upper surface of the substrate W is replaced with the liquid film of the IPA, the IPA is continuously supplied to the upper surface of the substrate W. Therefore, the IPA is discharged from the peripheral edge portion of the substrate W.

The IPA discharged from the peripheral edge portion of the substrate W is received by the inner wall of the second protective cover 72. Next, the IPA system flowing and flowing down on the inner wall of the second protective cover 72 is collected in the second liquid discharge tank 86 and guided to the exhaust pipe 87. Therefore, after the organic solvent step S7, droplets of IPA are attached to the inner wall of the second protective cover 72, the second liquid discharge tank 86, and / or the pipe wall of the exhaust pipe 87.

When a predetermined period of time has passed from the start of the discharge from the IPA, the control device 3 closes the first organic solvent valve 35 to stop the first nozzle 9 from discharging the IPA. This completes the organic solvent step S7.

Next, a spin-drying step for drying the substrate W is performed (step S8 in FIG. 4). Specifically, the control device 3 controls the baffle elevating unit 32 and arranges the baffle 26 at an approach position. Further, in this state, the control device 3 controls the rotation motor 22, thereby accelerating the substrate W to a rotation speed in each step from the sulfuric acid-containing liquid step S3 to the organic solvent step S7, as shown in FIG. 5H. The drying rotation speed (for example, several thousand rpm) is also large, and the substrate W is rotated at the drying rotation speed. Thereby, a large centrifugal force is applied to the liquid on the substrate W, and the liquid system attached to the substrate W is thrown away from the periphery of the substrate W. In this manner, the liquid is removed from the substrate W, and the substrate W is dried. In addition, the control device 3 controls the baffle rotating unit 31, The barrier plate 26 is rotated at a high speed in the rotation direction of the substrate W.

Further, an organic solvent suction step T5 (second suction step) for sucking the organic solvent in the organic solvent pipe 34 is performed in parallel with the centrifugal dehydration method step S8. The organic solvent suction step T5 is used to suck the organic solvent existing in the organic solvent pipe 34 after the organic solvent step S7 by the suction unit 55.

Specifically, after the organic solvent step S7 is completed, the control device 3 opens the second organic solvent valve 36 and closes the first organic solvent valve 35 and the first water valve 46, and opens the suction valve 51. Thereby, the internal systems of the organic solvent downstream portion 40 and the water downstream portion 50 are exhausted, and as shown in FIG. 5H, the IPA systems existing in the organic solvent downstream portion 40 and the water downstream portion 50 are sucked in (attracted ) To suction pipe 49. The suction of the IPA is performed until the front end surface of the IPA is retracted to a predetermined standby position in the pipe (for example, it is set to the suction pipe 49 or the water downstream side portion 50). When the front end surface of the IPA is retracted to the standby position, the control device 3 closes the suction valve 51.

When a predetermined time has passed from the acceleration of the substrate W, the control device 3 controls the rotation motor 22 to stop the rotation jig 5 from rotating the substrate W, and controls the baffle plate rotation unit 31 to stop the baffle plate 26 from rotating.

After that, the substrate W is carried out from the processing chamber 4 (step S9 in FIG. 4). Specifically, the control device 3 arranges the barrier plate 26 in the retracted position and lowers the second protective cover 72 to a lower position, and places the first protective cover 71 and the second protective cover 72 below the holding position of the substrate W . After that, the control device 3 causes the hand H of the substrate transfer robot CR to enter the processing chamber 4. Next, the control device 3 maintains the rotation clamp of the hand of the substrate transfer robot CR. The substrate W on the fixture 5 retracts the hand H of the substrate transfer robot CR from the processing chamber 4. Thereby, the substrate W from which the resist has been removed from the surface is carried out from the processing chamber 4.

In addition, as shown by the two-dot chain line in FIG. 4, there is an organic solvent pre-dispense for replacing the organic solvent pipe 34 with a new IPA before the organic solvent attraction step T5 starts (FIG. 4 In the case of step S10). Before the start of the organic solvent suction step T5, the front end surface of the IPA of the organic solvent pipe 34 is located in the organic solvent upstream side portion 41. At this time, the IPA in the organic solvent piping 34 (in the organic solvent upstream portion 41) changes with time (temperature change or component change).

In the case of pre-dispensing the organic solvent, the control device 3 closes the second organic solvent valve 36 and the first water valve 46, opens the first organic solvent valve 35 and the suction valve 51, and IPA from the organic solvent supply source It is sucked (sucked) into the suction pipe 49 through the organic solvent upstream side portion 41 and the water downstream side portion 50. As a result, the IPA system that has undergone changes over time existing in the organic solvent upstream portion 41 is replaced with fresh IPA. When a predetermined period has elapsed since the first organic solvent valve 35 was opened, the control device 3 closes the first organic solvent valve 35 and the suction valve 51.

FIG. 6 is a schematic diagram illustrating the monitoring status of the first liquid detection sensor 43 and the second liquid detection sensor 45 in the main steps of the first substrate processing example.

As shown in FIG. 6, in the organic solvent step S7 (during organic solvent ejection), the control device 3 does not refer to the detection output of the first liquid detection sensor 43 disposed upstream of the second organic solvent valve 36. And placed in a second organic The solvent valve 36 also has both the detection outputs of the second liquid detection sensor 45 on the downstream side. In other words, in the organic solvent step S7, the control device 3 ignores the presence or absence of liquid in both the first detection position 42 and the second detection position 44.

As shown in FIG. 6, in the organic solvent suction step T5, the control device 3 refers to the detection output of the first liquid detection sensor 43 disposed on the upstream side of the second organic solvent valve 36 and the detection output of the first liquid detection sensor 43. The organic solvent valve 36 also has both the detection outputs of the second liquid detection sensor 45 on the downstream side. In other words, the control device 3 monitors whether liquid is present in both the first detection position 42 and the second detection position 44. In the organic solvent suction step T5, no detection is detected in both the first detection position 42 and the second detection position 44 based on the detection output of both the first liquid detection sensor 43 and the second liquid detection sensor 45. In the case of liquid (ie, IPA), the control device 3 detects that the suction of the IPA has ended.

Further, in the first substrate processing example, the control device 3 monitors the first detection not only in the organic solvent suction step T5 but also in other suction steps (for example, the first water suction step T2 or the second water suction step T4). Whether the liquid is present in both the position 42 and the second detection position 44.

In addition, in the organic solvent pre-dispensing step S10, the control device 3 only refers to the detection output of the second liquid detection sensor 45 disposed on the upstream side from the second organic solvent valve 36, and does not refer to the detection output disposed on the second liquid solvent sensor 45. The two organic solvent valves 36 also have a detection output from the first liquid detection sensor 43 on the downstream side. In other words, although the control device 3 monitors the presence of liquid in the second detection position 44, it ignores the presence of liquid in the first detection position 42. Regardless of whether the second organic solvent valve 36 has been controlled to be closed, it is detected by the second liquid detection sensor 45 In the case where a liquid (ie, IPA) is present in the second detection position 44, as shown in FIG. 6, the control device 3 can detect an outflow error of the organic solvent (ie, IPA) leaking from the second organic solvent valve 36 .

In addition, in the first substrate processing example, in addition to the steps specifically mentioned, the control device 3 refers only to the detection output of the second liquid detection sensor 45 disposed downstream of the second organic solvent valve 36. The detection output of the first liquid detection sensor 43 disposed on the upstream side from the second organic solvent valve 36 is not referred to. In other words, although the control device 3 monitors the presence of liquid in the second detection position 44, it ignores the presence of liquid in the first detection position 42. Regardless of whether the second organic solvent valve 36 has been controlled to be closed or not, in a case where the second liquid detection sensor 45 detects the presence of liquid (ie, IPA) in the second detection position 44, as shown in FIG. 6, The control device 3 can detect an outflow error of the organic solvent (ie, IPA) leaking from the second organic solvent valve 36.

Table 1 is a diagram for explaining the hard interlock in the first substrate processing example.

The hard interlock processing is performed at the beginning of each step in a series of substrate processing in accordance with a recipe stored in the memory of the control device 3.

At the beginning of the sulfuric acid-containing solution step S3, investigate whether (3), (5), and (6) are present respectively: (3) whether the detection output of the position sensor 94 under the protective cover is Is ON, that is, whether the first protective cover 71 is disposed at the lower position; (5) whether the detection outputs of the first liquid detection sensor 43 and the second liquid detection sensor 45 are OFF ), That is, whether the front end surface of the IPA recedes to the suction pipe 49 or the water downstream side portion 50; (6) whether the detection output of the valve closing sensor 37 is conductive, that is, whether the first organic solvent valve 35 is in a closed state. When all of the conditions (3), (5), and (6) are satisfied, the control device 3 allows the operation of the sulfuric acid-containing liquid valve 62 to be opened. That is, when one of the conditions (3), (5), and (6) is not satisfied, the control device 3 prohibits the opening operation of the sulfuric acid-containing liquid valve 62. With such a hard interlock, it is possible to reliably prevent the IPA from coming into contact with the SPM in the processing chamber 4 when the IPA is ejected from the first nozzle 9.

In addition, at the beginning of the organic solvent step S7, it is investigated whether there are cases (1), (2), (4), and (8): (1) whether the detection output of the barrier proximity position sensor 33 is on, That is, whether the blocking plate 26 is disposed at the close position; (2) whether the detection output of the nozzle retreat sensor 64 is on, that is, whether the sulfuric acid-containing liquid nozzle 60 is located at the retreat position; (4) the position sensor 93 on the protective cover Whether the detection output is conductive, that is, whether the first protective cover 71 is arranged in the upper position; (8) Whether the detection output of the first valve opening sensor 21 is conductive, that is, used to open and close the exhaust pipe 100 Whether the exhaust valve 101 is in an open state. When all of the conditions (1), (2), (4), and (8) are satisfied, the control device 3 allows the opening operation of the first organic solvent valve 35. That is, in a case where one of the conditions (1), (2), (4), and (8) is not satisfied, the control device 3 prohibits the opening operation of the first organic solvent valve 35. With such hard interlocking, it is possible to reliably prevent the contact between the SPM and the IPA in the processing chamber 4 when the SPM is ejected from the sulfuric acid-containing liquid nozzle 60.

In addition, it is investigated whether (7) is present at the beginning of the static elimination step S2, the sulfuric acid-containing liquid step S3, the first cleaning step S4, the cleaning chemical step S5, or the second cleaning step S6. : (7) Whether the detection output of the second valve closing sensor 95 corresponding to the processing liquid other than the processing liquid to be ejected is all on, that is, whether the liquid discharge branch valve 85 corresponding to the processing other than the processing liquid to be ejected is closed.

Specifically, in the neutralization step S2, the first cleaning step S4, and the second cleaning step S6, the second valve closing sensor 95 and the second valve closing sensor 95 corresponding to the drain branch valve 85 for the branch pipe 82 for the sulfuric acid-containing liquid are investigated, respectively. The second valve corresponding to the liquid discharge branch valve 85 for the cleaning solution branch pipe 83 closes the detection output of the sensor 95. In the sulfuric acid-containing liquid step S3, the second valve closing sensor 95 corresponding to the liquid discharge branch valve 85 for the cleaning chemical liquid branch pipe 83 and the water discharge branch valve 85 for the water branch pipe 84 are investigated. The corresponding second valve closes the detection output of the sensor 95. In step S5 of cleaning the chemical solution, the second valve closing sensor 95 corresponding to the liquid discharge branch valve 85 for the branch pipe 82 for sulfuric acid-containing liquid and the liquid branch branch valve 85 for the branch pipe 84 for water are investigated. The corresponding second valve closes the detection output of the sensor 95.

In the case where this condition (7) is satisfied, the control device 3 is a valve for opening and closing the discharge corresponding to the processing liquid to be discharged at the beginning of each step S2 to step S6 (that is, the first water valve 46 and the sulfuric acid-containing liquid Either the valve 62 or the cleaning chemical liquid valve 67) is opened. That is, when the condition (7) is not satisfied, the control device 3 prohibits the opening operation of the first water valve 46, the sulfuric acid-containing liquid valve 62, and the cleaning chemical liquid valve 67.

As described above, according to this embodiment, in step S3 of the sulfuric acid-containing liquid Before performing the first water replacement step T1. Before the sulfuric acid-containing liquid step S3 starts, the IPA used in the previous resist removal treatment remains in the organic solvent pipe 34, and the sulfuric acid-containing liquid step S3 may enter the organic solvent pipe 34. The mist of SPM may come into contact with the IPA inside the organic solvent pipe 34. However, by replacing the inside of the organic solvent pipe 34 with carbonated water before the sulfuric acid-containing liquid step S3, IPA does not remain in the organic solvent pipe 34 at the beginning of the sulfuric acid-containing liquid step S3. Therefore, even if the mist of the SPM in the sulfuric acid-containing liquid step S3 enters the organic solvent piping 34, it does not come into contact with the IPA inside the organic solvent piping 34. Therefore, it is possible to prevent the IPA from contacting the SPM in the sulfuric acid-containing liquid step S3, thereby suppressing or preventing the inside of the organic solvent piping 34 from being a particle generation source.

Further, the second water replacement step T3 is performed after the sulfuric acid-containing liquid step S3 and before the organic solvent step S7. In the sulfuric acid-containing liquid step S3, the droplets of SPM that have entered the organic solvent piping 34 and liquefied by condensation exist in the organic solvent piping 34 before the start of the organic solvent step S7. The IPA supplied to the organic solvent pipe 34 in S7 may come into contact with the SPM inside the organic solvent pipe 34. However, before the organic solvent step S7 is performed, the inside of the organic solvent pipe 34 is replaced with carbonated water, so that no droplets of SPM remain in the organic solvent pipe 34 at the beginning of the organic solvent step S7. Therefore, even if IPA is supplied to the organic solvent piping 34 in this organic solvent step S7, it does not come into contact with the SPM inside the organic solvent piping 34. Therefore, it is possible to effectively suppress or prevent the generation of particles due to the contact between the IPA and the SPM, thereby suppressing or preventing the inside of the organic solvent pipe 34 from being a source of particle generation.

FIG. 7 is a schematic diagram for explaining a second substrate processing example for the processing unit 2. FIG. 8 is a schematic diagram for explaining a third substrate processing example for the processing unit 2. The second substrate processing example and the third substrate processing example are different from the first substrate processing example shown in FIG. 4 and the like in that IPA is supplied to the first nozzle 9 before the end of the second cleaning step S6. In addition, the second substrate processing example and the third substrate processing example are not different from the first substrate processing example.

In the second substrate processing example shown in FIG. 7, the control device 3 opens the second organic solvent valve 36 and executes the first organic solvent during the second cleaning step S6 (in parallel with the second cleaning step S6). The valve 35 is opened. Thereby, the IPA from the organic solvent supply source is supplied to the first nozzle 9. However, at the timing before the IPA is ejected from the first ejection port 8, the control device 3 closes the second water valve 57. This prevents the IPA from being ejected from the first ejection port 8. That is, in the execution of the second cleaning step S6, the IPA is not ejected from the first ejection port 8, and the inside of the organic solvent downstream portion 40 and the interior of the nozzle pipe of the first nozzle 9 are filled with IPA.

After that, when the second cleaning step S6 ends and becomes the timing of the start of the organic solvent step S7, the control device 3 opens the first organic solvent valve 35, thereby starting to supply IPA from the organic solvent supply source to the first nozzle 9 again, IPA is ejected from the first ejection port 8.

According to this second substrate processing example, IPA can be ejected from the first ejection port 8 immediately after the second cleaning step S6 is completed. That is, the organic solvent step S7 can be started immediately after the end of the second cleaning step S6. Thereby, compared with the first substrate processing example, the processing time of the entire resist removal processing can be shortened.

Unlike the second substrate processing example shown in FIG. 7, the third substrate processing example shown in FIG. 8 In the substrate processing example, the control device 3 ejects the IPA from the first ejection port 8 during the execution of the second cleaning step S6 (parallel to the second cleaning step S6).

Specifically, the control device 3 opens the second organic solvent valve 36 and opens the first organic solvent valve 35 during the execution of the second cleaning step S6. Thereby, the IPA from the organic solvent supply source is supplied to the first nozzle 9 and is ejected from the first ejection port 8. That is, the control device 3 starts the organic solvent step S7 before the end of the second cleaning step S6.

In the third substrate processing example, the discharge flow rate of the IPA from the first discharge port 8 is smaller than the discharge flow rate of the carbonated water from the second discharge port 10 (for example, about 1/10). Therefore, there is almost no adverse effect on the cleaning process for the substrate W. As in the second substrate processing example, in the third substrate processing example, since there is no interval between the end of the second cleaning step S6 and the start of the organic solvent step S7, it is compared with the first substrate processing example. , Can shorten the overall processing time of the resist removal process.

Although one of the embodiments of the present invention has been described above, the present invention can be implemented in other forms.

For example, although it has been described that the carbonated water is sucked in the first water suction step T2 and the second water suction step T4 of the first substrate processing example to the third substrate processing example until the front end surface of the carbonated water recedes to the suction pipe 49 or the water downstream The side portion 50, but the front end surface of the carbonated water after suction may be located inside the organic solvent pipe 34.

In the first substrate processing example to the third substrate processing example, the first water replacement step T1 may be performed at a timing different from that of the static elimination step S2. In addition, the second water replacement step T3 may be performed at a different timing from the first cleaning step S4. also The first water suction step T2 may be performed after the end of the static elimination step S2. The second water suction step T4 may be performed at a different timing from the cleaning chemical solution step S5.

In addition, in the first substrate processing example to the third substrate processing example, as the water replacement step, the first water replacement step T1 performed before the sulfuric acid containing liquid step S3 and the organic solvent after the sulfuric acid containing liquid step S3 are performed. The second water replacement step T3 performed before step S7. However, the water replacement step may be performed at least once before and / or after the execution of the organic solvent step S7 and / or before and / or after the execution of the sulfuric acid-containing liquid step S3.

In addition, in the first substrate processing example to the third substrate processing example, the hydrogen peroxide water (H ₂₎ may be performed before the execution of the chemical cleaning step S5 or after the execution of the chemical cleaning step S5. O ₂ ) a step of supplying hydrogen peroxide water to the upper surface (surface) of the substrate W.

In the foregoing embodiment, although SPM was exemplified as the sulfuric acid-containing liquid used as an example of the first drug fluid, sulfuric acid or SOM (Sulfuric acid Ozone Mixture) may be used as sulfuric acid. liquid.

In the foregoing embodiment, it has been described that the processing cover 16 of the following type is used as the processing cover: the gas-liquid separation of the atmosphere and the processing liquid is not performed inside, but the external gas-liquid separator (gas-liquid separator 97) The atmosphere is separated from the gas-liquid of the treatment liquid. However, it is also possible to use a processing cover of a type capable of performing gas-liquid separation of the atmosphere from the processing liquid inside.

This type of processing cover includes: one or a plurality of covers configured to surround the rotation jig 5; and a drain pipe connected to each cover. In addition, In the processing chamber 4 having a processing cover of this type, an exhaust port is opened at the lower part of the side wall of the partition wall 18 or the bottom of the partition wall 18, and the inside of the exhaust port is connected to an exhaust duct of the exhaust port By suction, the atmosphere in the lower space of the processing chamber 4 is exhausted.

In addition, in the foregoing embodiment, a common drainage tank (drainage tank 80) is provided for draining a plurality of types of processing liquids (sulfuric acid-containing liquid, cleaning solution, and water), and the corresponding drainage liquids are drained accordingly. The type of (treatment liquid) is switched between a plurality of branched pipes 82 for sulfuric acid-containing liquid, a branched pipe 83 for cleaning chemicals, and a branched pipe 84 for water.

However, a drain tank may be provided in the processing cover 16 in a one-to-one correspondence with various types of processing liquids. That is, a drainage tank for a sulfuric acid-containing liquid, a drainage tank for washing a chemical solution, and a drainage tank for water may be separately provided. In this case, it is not necessary to switch the circulation destination of the discharged liquid (treatment liquid) between the plurality of discharged branch pipes.

In the foregoing embodiment, although an example of an organic solvent used as an example of IPA as the second pharmaceutical fluid has been exemplified, methanol, ethanol, HFE (hydrofluoroether), acetone, etc. may also be exemplified. As an organic solvent. In addition, the organic solvent is not limited to a case where it is composed of only a monomer component, and the organic solvent may be a liquid mixed with other components. For example, it may be a mixed solution of IPA and acetone, or a mixed solution of IPA and methanol.

In the foregoing embodiment, although a combination of a sulfuric acid-containing liquid such as SPM and an organic solvent such as IPA was exemplified as a combination of dangerous medicinal liquids, a combination of aqua regia and sulfuric acid may be exemplified as contact. Accompany A dangerous combination.

In addition, the present invention can also be widely applied to the combination of products (for example, salts) formed by contact, such as the aforementioned combination of acid and base, that is, it can also be widely applied to the combination of pharmaceutical fluids that are not suitable for contact.

In the foregoing description, although the first pharmaceutical fluid (fluid containing a pharmaceutical component) has been described as a liquid (ie, a liquid containing a pharmaceutical component), a gas (that is, a gas containing a pharmaceutical component) may also be used as the first pharmaceutical fluid .

In addition, although it has been described that the second medical fluid is a liquid, a gas may be used as the second medical fluid. In addition, although carbonated water has been exemplified as a water for replacing the inside of a pharmaceutical fluid pipe (organic solvent pipe 34), the water is not limited to carbonated water, and may also be deionized water (DIW; deionized water) or electrolytic ions. Any of water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 ppm to 100 ppmm).

Although the embodiments of the present invention have been described in detail, these embodiments are only specific examples for clarifying the technical content of the present invention, and the present invention should not be construed as being limited to these specific examples, and the scope of the present invention is only applied for Defined by patent scope.

This application corresponds to Japanese Patent Application No. 2016-104600 filed by the Japan Patent Office on May 25, 2016, and the entire disclosure of this application is cited and incorporated in this application.

4‧‧‧ treatment chamber

6‧‧‧ Opposite side of substrate

7‧‧‧ Opposing member

8‧‧‧ the first spray outlet

9‧‧‧ the first nozzle

10‧‧‧Second spray outlet

11‧‧‧Second Nozzle

16‧‧‧Handling cover

26‧‧‧Barrier

35‧‧‧The first organic solvent valve

36‧‧‧Second Organic Solvent Valve

39‧‧‧First water piping

40‧‧‧ Downstream side of organic solvent

46‧‧‧The first water valve

49‧‧‧ suction pipe

50‧‧‧ downstream side of water

51‧‧‧ Suction valve

56‧‧‧Second water piping

57‧‧‧Second Water Valve

71‧‧‧First protective cover

72‧‧‧Second protective cover

A1‧‧‧axis of rotation

W‧‧‧ substrate

Claims (21)

A substrate processing device includes: a processing chamber; a substrate holding unit disposed in the processing chamber to hold a substrate; and a first nozzle having a main body for facing a substrate held by the substrate holding unit. A first medicine fluid supply unit, which is connected to the first nozzle, and has a medicine fluid pipe connected to the discharge port, for supplying the first nozzle to the first nozzle through the medicine fluid pipe; Medicine fluid; a first water supply unit is a water pipe having a branch connection to the medicine fluid piping for supplying water to the medicine fluid piping through the water pipe; a second medicine fluid supply unit is for supplying the substrate The main surface of the substrate held by the holding unit supplies a second chemical fluid, which is a fluid different from the first chemical fluid; and a control device that controls the first chemical fluid supply unit and the second chemical The fluid supply unit and the first water supply unit; the control device executes: a first process Step, the Department of the first agent to the fluid supply pipe fluid medicament, whereby from the main nozzle toward the first substrate The first chemical fluid is ejected from the surface, and the substrate is treated with the first chemical fluid. The second processing step is to supply the second chemical fluid to the main surface of the substrate, and to apply the same to the substrate. The treatment using the aforementioned second pharmaceutical fluid; and the water replacement step, which will come from the aforementioned before and / or after the execution of the aforementioned first processing step and / or before and / or after the execution of the aforementioned second processing step The water of the first water supply unit is supplied to the medicine fluid pipe, and the inside of the medicine fluid pipe is replaced with water. The substrate processing apparatus according to claim 1, further comprising a facing member having a substrate facing surface facing the main surface of the substrate held by the substrate holding unit; the first nozzle The above-mentioned ejection port is provided on the opposite surface of the substrate. The substrate processing apparatus according to claim 1 or 2, further comprising: a suction unit for sucking the inside of the pharmaceutical fluid piping; the control device further controls the suction unit; and the control device replaces the water After the step is completed, a first suction step for suctioning the inside of the medicine fluid pipe is further performed. The substrate processing apparatus according to claim 1 or 2, wherein the control device starts the first processing step after the second processing step ends; the control device executes the first processing step performed before the second processing step. The water replacement step is referred to as the aforementioned water replacement step. The substrate processing apparatus according to claim 1 or 2, wherein the control device starts the first processing step after the second processing step ends; the control device executes after the second processing step and before the first processing step The second water replacement step performed before the processing step is referred to as the aforementioned water replacement step. The substrate processing apparatus according to claim 5, wherein the control device further executes a first water supply step for supplying water to a main surface of the substrate before the first processing step, and after the second processing step The second medicinal fluid is rinsed with water from the main surface of the substrate; the control device executes the second water replacement step as the first water supply step. The substrate processing apparatus according to claim 1 or 2, further comprising: a second nozzle, which is a nozzle different from the first nozzle, and is configured to eject a fluid toward a main surface of the substrate held by the substrate holding unit. ;as well as The second water supply unit is configured to supply water to the second nozzle; the control device further controls the second water supply unit; the control device starts the first processing step after the second processing step ends, and A second water supply step is performed after the aforementioned second processing step and before the aforementioned first processing step is started, the second water supplying step is to supply water to the second nozzle, whereby the second nozzle is directed toward the main of the substrate. The control device starts to supply the first chemical fluid to the chemical fluid pipe in the first processing step before the second water supply step ends. The substrate processing apparatus according to claim 1 or 2, wherein the control device starts the first processing step before the end of the second water supply step. The substrate processing apparatus according to claim 1 or 2, wherein the control device is further configured to execute the suction of the pharmaceutical fluid piping after the ejection of the first pharmaceutical fluid from the first nozzle in the first processing step. Internal second attraction step. The substrate processing apparatus according to claim 1 or 2, wherein the cleaning solution contains carbonated water. The substrate processing apparatus according to claim 1 or 2, wherein the first chemical flow system includes a sulfuric acid-containing liquid, and the second chemical flow system includes an organic solvent. A substrate processing method includes: a substrate holding step for holding a substrate in a processing chamber; a first processing step for supplying a first drug fluid to the first nozzle via a drug fluid pipe connected to the first nozzle, and This ejects the first chemical fluid from the first nozzle toward the main surface of the substrate, and applies a treatment using the first chemical fluid to the substrate. The second processing step is a different type from the first chemical fluid. The second chemical fluid of the fluid is supplied to the main surface of the substrate, and the substrate is treated with the second chemical fluid; and the water replacement step is performed before and / or after the first processing step is performed. And / or before and / or after the execution of the second processing step, water is supplied to the medicine fluid piping via a water pipe connected to the medicine fluid piping branched, and the inside of the medicine fluid piping is replaced with water. The substrate processing method according to claim 12, further comprising a first suction step for suctioning the inside of the pharmaceutical fluid pipe after the water replacement step is completed. The substrate processing method according to claim 12 or 13, wherein the first processing step includes a step that starts after the second processing step ends; the water replacement step includes a step that is performed before the second processing step. First water replacement step. The substrate processing method according to claim 12 or 13, wherein the first processing step includes a step that starts after the second processing step ends; the water replacement step includes a step after the second processing step and The second water replacement step performed before the aforementioned first processing step. The substrate processing method according to claim 15, further comprising a first water supply step for supplying water to a main surface of the substrate before the first processing step, and after the second processing step from the substrate, The main surface flushes the second pharmaceutical fluid with water; the first water supply step includes the second water replacement step. The substrate processing method according to claim 12 or 13, wherein the first processing step includes a step that starts after the end of the second processing step; further after the second processing step and before the first processing step The second water supply step includes supplying water to a second nozzle of a nozzle different from the first nozzle, thereby spraying water from the second nozzle toward a main surface of the substrate; the first The processing step is to execute the supply of the first medical fluid to the medical fluid pipe before the end of the second water supply step. The substrate processing method according to claim 12 or 13, further comprising a second water supply step for supplying water from the second nozzle to a main surface of the substrate after the second processing step; and the second The water supply step performs the aforementioned first processing step in parallel. The substrate processing method according to claim 12 or 13, further comprising, after the completion of the ejection of the first medical fluid from the first nozzle in the first processing step, a second process for attracting an inside of the medical fluid pipe. Two attraction steps. The substrate processing method according to claim 12 or 13, wherein the cleaning solution contains carbonated water. The substrate processing method according to claim 12 or 13, wherein the first chemical flow system includes a sulfuric acid-containing liquid; and the second chemical flow system includes an organic solvent.