TWM478198U - Touch panel for enhancing press bonding yield with flexible printed circuit board - Google Patents

Description

A touch panel that can improve the yield of a flexible circuit board

The present invention relates to a touch panel, and more particularly to a touch panel capable of reducing the pressing process with a flexible circuit board (FPC) and improving the pressing yield.

With the advancement of the times, touch-type electronic products have become more and more extensive. In order to make consumers more convenient to use, the size of touch-type electronic products is also mainly demanded by thin and light, and can be carried with them in addition to households. A touch panel is provided on the display screen of the electronic product, and the thin product is also mainly produced.

As shown in FIG. 5, a thin touch panel is known, which includes a substrate 90, a film layer 91 and a flexible circuit board 92 (FPC); the substrate 90 is made of glass and is on the substrate. A first electrode layer 901 is formed on a surface of the film. The film layer 91 forms a second electrode layer 911 on a surface. The first electrode layer 901 and the second electrode layer 911 are disposed in opposite directions, and are transparent to each other. The glue 93 is configured to be bonded together, and the flexible circuit board 92 is respectively pressed into the first electrode layer 901 and the second electrode layer 911 by a pressing process to form an electrical connection, so that the first and second electrode layers 901 are connected. The sensing signal of 911 can be outwardly derived via the flexible circuit board 92.

Another example is the capacitive touch panel of M464747, the main purpose of which is to provide a touch panel which is easy to assemble and has a low manufacturing cost, and includes a transparent cover plate, a transparent substrate, and a first a transparent electrode layer, a second transparent electrode layer, and a transparent adhesive layer; the cover plate is disposed in parallel with the substrate, and the first transparent electrode layer and the second transparent electrode layer are respectively disposed on one side of the cover plate and the substrate, and The adhesive layer is used for bonding the first transparent electrode layer and the second transparent electrode layer to achieve the purpose of combining the transparent cover plate and the substrate.

It can be seen from the above prior art that the current process of the touch panel has been more and more streamlined, but the following problems still exist in the yield of the production: due to the known capacitive touch panel, the resistance of the touch IC The ability of the noise is different. Therefore, most of the processes have a ground plane on the back of the touch panel, and the ground plane is electrically connected to a ground end of the flexible circuit board to achieve noise. For the purpose of filtering, in the process, the flexible circuit board is pressed on the back side of the touch panel, so that the grounding surface of the back surface of the touch panel is formed with the grounding end of the touch IC provided on the flexible circuit board. Turning on, but adding a procedure to the process of pressing the process increases the risk of damage to the touch panel. Therefore, with the current touch panel manufacturing yield, there is indeed a need to propose a better solution.

In view of the deficiencies of the prior art, the main purpose of the present invention is to provide a touch panel capable of improving the yield of a flexible circuit board, which can reduce the process of the touch panel in the process of pressing, and is equipped with a flexible circuit. The touch panel product of the board has better yield.

In order to achieve the foregoing objective, the touch panel of the present invention capable of improving the yield of the flexible circuit board comprises: a substrate having two opposite surfaces and one or more via holes; and a first electrode layer disposed on the substrate On the surface, and further comprising a circuit board connection port at a side of the substrate, the circuit board is connected to the 埠 and electrically connected to the via hole; a second electrode layer is disposed on the other surface of the substrate, And electrically connected to the via hole.

When the touch panel is subjected to a pressing process, the first electrode layer is electrically connected to the flexible circuit board through the connection between the circuit board, and one end of the connection port of the circuit board is electrically connected to the via hole, and at the same time on the other surface of the substrate The second electrode layer is also electrically connected to the via hole. When the second electrode layer is grounded, the flexible circuit board can be pressed on the substrate only by a single-sided pressing process, thereby reducing the touch panel. Pressing the process in the process and improving the job yield when pressed with the touch panel. In addition, when the second electrode layer is provided with other signal lines, the structure of the double-sided conduction through the substrate can further increase the convenience of the touch panel in use, and at the same time increase the flexibility of the touch panel in the exterior design.

A preferred embodiment of the touch panel capable of improving the yield of the flexible circuit board, as shown in FIG. 1 and FIG. 2, includes a substrate 10, a first electrode layer 20 and a second electrode. Layer 30.

The substrate 10 is made of a glass material and has an upper surface, a lower surface and one or more via holes 11; the via hole 11 is hollow and has an upper opening and a lower opening, respectively formed on the upper surface of the substrate 10. A conductive layer 12 is formed on the inner wall wall with the lower surface and between the openings.

The first electrode layer 20 is disposed on the upper surface of the substrate 10. In the embodiment, the first electrode layer 20 includes a plurality of sensing electrodes and a plurality of signal lines, and the plurality of signal lines extend to the side of the substrate 10. A circuit board connection port 21 is formed at the side; a signal line 40 extending from one end of the circuit board connection port 21 is electrically connected to the conductive layer 12 of the via hole 11.

In this embodiment, two conductive vias 11 are formed on the substrate 10, and the conductive vias 11 are respectively formed at opposite positions on opposite sides of the circuit board connecting port 21, and one side end of the circuit board connecting port 21 is further formed. An inverted T-shaped alignment mark 22 is provided to assist in proper alignment when connected to a flexible circuit board (FPC); and the conductive line 40 and the conductive via 11 are electrically conductive through the free end of the alignment mark 22 The layer 12 constitutes an electrical connection; the other side end of the circuit board connection port 21 extends another signal line 40 to form an electrical connection with the conductive layer 12 of the other via hole 11.

The second electrode layer 30 is electrically connected to the conductive layer 12 of the via hole 11 in the lower surface of the substrate 10; in this embodiment, the second electrode layer 30 includes a ground plane and a plurality of senses. a measuring electrode and a plurality of signal lines, the grounding surface is mainly used for filtering noise, and the plurality of sensing layers of the first electrode layer 20 and the second electrode layer 30 are further transmitted through the conductive layer 12 of the via hole 11 The electrode and the plurality of signal lines form an electrical connection.

It can be seen from the above that a specific application mode of the present invention indicates that the first electrode layer 20 of the substrate 10 has a circuit board connection port 21 for external connection to the flexible circuit board, when the touch is formed by the preferred embodiment of the present invention. When the control panel and the flexible circuit board are pressed together, the first electrode layer 20 is electrically connected to the flexible circuit board through the circuit board connection port 21, and the circuit board connection port 21 is electrically connected to the via hole 11, respectively. At the same time, the second electrode layer 30 on the other surface of the substrate 10 is also electrically connected to the via hole 11.

Providing the flexible circuit board in the above manner only needs to be pressed on the substrate 10 by the single-sided pressing process, thereby reducing the process of the touch panel in the pressing process and improving the work yield when the touch panel is pressed; In addition, when the second electrode layer 30 is provided with a grounding surface and other lines, the second electrode layer 30 and the first electrode are further increased through the via hole 11 of the substrate 10 for the purpose of double-sided conduction and grounding. The layer 20 constitutes a convenient use after electrical connection, and at the same time increases the flexibility of the touch panel in the exterior design.

Referring to FIG. 3, in the embodiment, the conductive layer 12 of the via hole 11 further extends toward the upper and lower openings of the via hole 11 at both ends in the axial direction; one end of the conductive layer 12 is bent to form a first chamfer. After forming a ring portion 14 at the upper opening, and connecting with the first electrode layer 20, the signal line 40 extending from one end of the circuit board connection port 21 is connected to the ring portion 14; the other end of the conductive layer 12 The lower opening of the through hole 11 extends, and after bending, a second chamfer 15 is formed, and the free end thereof is connected to the second electrode layer 30.

The structure of the via hole 11 and the conductive layer 12 of the substrate 10 can electrically connect the lines on the two electrode layers 20, 30 on both surfaces of the substrate 10 for integration purposes, and can be pressed on a single surface while remaining The function of one side of the grounding layer; and the design of the through hole 11 and the conductive layer 12 of the present embodiment must be specifically described, which can further form a first chamfer 13 and a first portion between the double-sided conductive layers 12 of the substrate 10, respectively. The second chamfer 15 is designed to prevent the conductive layer 12 from being easily conductive or easily brittle and reducing the yield due to the vertical angle during the formation of the conductive layer 12.

In another embodiment of the present invention, as shown in FIG. 4, in the embodiment, a conductive material 50 is further filled in the via hole 11 of the substrate 10 to replace the conductive layer 12, so that the two electrodes on both surfaces of the substrate 10 are provided. The conductive layer 12 of the substrate 10 may be provided with the conductive layer 12 of the previous embodiment and then filled with the conductive material 50; in this embodiment, The conductive layer 12 and the conductive material 50 may be respectively provided in the via hole 11 by sputtering, and may be made of a material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

Therefore, the manner provided by the above embodiments of the present invention enables the flexible circuit board to be pressed on the substrate 10 only by a single-sided pressing process, thereby reducing the process of the touch panel in the pressing process and achieving improvement. The purpose of the job yield when pressing.

10‧‧‧Substrate
11‧‧‧Through hole
12‧‧‧ Conductive layer
13‧‧‧First chamfer
14‧‧‧ Ring Department
15‧‧‧second chamfer
20‧‧‧First electrode layer
21‧‧‧Circuit board connection埠
22‧‧‧ alignment mark
30‧‧‧Second electrode layer
40‧‧‧ signal line
50‧‧‧Electrical materials

1 is a top plan view of a preferred embodiment of the present invention. 2 is a schematic cross-sectional view of a preferred embodiment of the present invention. 3 is a partial cross-sectional view of a preferred embodiment of the present invention. 4 is a partial cross-sectional view showing another preferred embodiment of the present invention. FIG. 5 is a schematic plan view of a known touch panel.

10‧‧‧Substrate

11‧‧‧Through hole

12‧‧‧ Conductive layer

13‧‧‧First chamfer

14‧‧‧ Ring Department

15‧‧‧second chamfer

20‧‧‧First electrode layer

21‧‧‧Circuit board connection埠

30‧‧‧Second electrode layer

Claims (10)

A touch panel capable of improving the yield of a flexible circuit board, comprising: a substrate having two opposite surfaces and one or more via holes; a first electrode layer disposed on a surface of the substrate, and Further comprising a circuit board connection port at a side of the substrate, the circuit board is connected to and electrically connected to the via hole; a second electrode layer is disposed on the other surface of the substrate and is connected to the via hole Form an electrical connection. As shown in claim 1, the touch panel capable of improving the yield of the flexible circuit board has a conductive layer formed on the inner wall of the via hole. The touch panel of claim 1 or 2 can improve the adhesion of the flexible circuit board to the touch panel, and the conductive via is filled with a conductive material. The touch panel of claim 3 is capable of improving the yield of the flexible circuit board. The one end of the via hole constitutes a first chamfer and is connected to the first electrode layer. The touch panel of claim 4 is capable of improving the yield of the flexible circuit board. The other end of the via hole constitutes a second chamfer, and the free end thereof is connected to the second electrode layer. The touch panel of claim 5, wherein the first electrode layer comprises a plurality of sensing electrodes and a plurality of signal lines, and the plurality of signal lines extend to the side of the substrate. The board connection is formed at the edge. The touch panel of claim 6 is capable of improving the yield of the flexible circuit board, wherein the substrate has two via holes formed at opposite positions on the two sides of the board connection port. The touch panel of claim 7 is capable of improving the yield of the flexible circuit board, wherein an end of the circuit board is formed with an inverted T-shaped alignment mark, and is connected to a flexible circuit board. And extending a signal line through the alignment mark to form an electrical connection with the via hole. The touch panel of claim 8 is capable of improving the yield of the flexible circuit board, wherein the other side end of the circuit board connection extends another signal line to form an electrical connection with the other via hole. The touch panel of claim 9, wherein the second electrode layer comprises a ground plane, a plurality of sensing electrodes, and a plurality of signal lines, and the through holes can further The first electrode layer is electrically connected to the plurality of sensing electrodes and the plurality of signal lines of the second electrode layer.