TWM477760U - Heat sink module - Google Patents

Abstract

The disclosure discloses a heat sink module, which includes a first substrate, a flow path unit formed at the first substrate, and a second substrate corresponding to the first substrate. The flow path unit includes a heat absorption segment, a heat dissipation segment, a gas channel, and a liquid channel. The heat absorption segment is much closer to a center of the first substrate than the heat dissipation segment, and the gas channel and a liquid channel are connected between the heat absorption segment and the heat dissipation segment. The heat sink module is arranged such that a work fluid in the flow path unit is capable of flowing relative to the center of the first substrate so as to dissipate heat thereof.

Description

Thermal module

This creation is related to a heat exchange module, and in particular to a heat dissipation module.

Electronic components such as a central processing unit (CPU) or a graphic processing unit (GPU) are usually provided therein. When the CPU or GPU is running at high speed in the computer, its own temperature will rise. Therefore, a heat dissipation module needs to be further provided to enable the electronic components such as the CPU or the GPU to operate under normal operating temperature range to ensure the quality of the signal processing, storage or transmission.

The conventional heat dissipation module usually includes a heat pipe, and the evaporation end and the condensation end of the heat pipe are respectively located on opposite sides of the heat dissipation module. After the working fluid evaporates at the evaporation end, it absorbs latent heat and flows to the condensation end. After releasing the latent heat condensation at the condensation end, it is refluxed to the evaporation end. However, when the heat dissipation module is placed upside down or tilted, the flow of the working fluid in the heat pipe will be slowed or stagnated by the influence of gravity, and the heat dissipation module cannot be dissipated.

In view of this, one of the main purposes of the present invention is to provide a heat dissipation module having a radially distributed fluid unit to improve the shortcomings of the conventional heat dissipation module.

According to an embodiment of the present invention, the heat dissipation module includes a first substrate, a first flow path unit, a second substrate, and a working fluid disposed in the first flow path unit. The first flow path unit is formed on the first inner surface of the first substrate, and includes a first heat dissipation section, a first heat absorption section, a first gas passage, and a first liquid passage. The first heat dissipation section is located between a substantial center of the first substrate and an outer edge of the first substrate. The first heat absorption section is closer to a substantial center of the first substrate than the first heat dissipation section. The first gas passage and the first liquid passage are respectively fluidly connected between the first heat absorption section and the first heat dissipation section. In some embodiments, the width of the first liquid passage is less than the width of the first gas passage, thereby driving liquid flow. The second inner surface of the second substrate joins the first inner surface.

In some embodiments, the heat dissipation module further includes a second flow channel unit. The second flow path unit is formed on the second inner surface, and the working fluid flows simultaneously or selectively within the first and second flow path units. The second flow path unit includes a second gas passage and a second liquid passage. The second gas passage and the second liquid passage are respectively fluidly coupled between the first heat absorption section and the first heat dissipation section. In some embodiments, the width of the second liquid passage is less than the width of the second gas passage, thereby driving liquid flow.

In some embodiments, the second flow path unit further includes a second heat absorption section and a second heat dissipation section. The second heat absorption section is fluidly coupled to the first heat absorption section, and the second heat dissipation section is fluidly coupled to the first heat dissipation section.

In some embodiments, the second gas passage is fluidly coupled to the first gas passage and the second liquid passage is fluidly coupled to the first liquid passage.

In some embodiments, the second liquid passage includes an extension section and a joint section. The extension section is fluidly coupled to the first heat dissipation section and the connection section A fluid is coupled between the extension section and the first liquid passage. The width of the joining section tapers from the direction of the extension section toward the first liquid passage.

In some embodiments, the width of the first liquid passage tapers from the first heat dissipating section toward the first heat absorbing section.

In some embodiments, the outer edge of the first substrate and the outer edge of the second substrate are substantially circular, rectangular or any shape.

In some embodiments, the first heat dissipation section circumferentially surrounds the first heat absorption section, and the first flow channel unit includes a plurality of first gas channels and a plurality of first liquid channels, circumferentially arranged in the first heat dissipation zone Between the segment and the first heat absorption section.

In some embodiments, the heat dissipation module includes a plurality of first flow path units circumferentially formed on the first inner surface.

100, 100a, 100b‧‧‧ Thermal Module

110‧‧‧First substrate

111‧‧‧First inner surface

112‧‧‧Substantial centre

113‧‧‧First outer surface

115‧‧‧ outer edge

130‧‧‧second substrate

131‧‧‧First inner surface

132‧‧‧Substantial center

133‧‧‧Second outer surface

135‧‧‧ outer edge

150, 150b‧‧‧First runner unit

151, 151b‧‧‧ first heat dissipation section

152, 152b‧‧‧ first heat absorption section

153, 153b‧‧‧ first gas passage

154, 154b‧‧‧ first liquid passage

170‧‧‧Working fluid

190‧‧‧Second runner unit

191‧‧‧Second heat dissipation section

192‧‧‧second heat absorption section

193‧‧‧second gas passage

194‧‧‧Second liquid channel

1941‧‧‧Extended section

1943‧‧‧Link section

Figure 1 shows an exploded view of a thermal module of some embodiments of the present invention.

Figure 2 shows a top view of a thermal module of some embodiments of the present invention.

Figure 3 shows an exploded view of the thermal module of some embodiments of the present invention.

Figure 4 shows a top view of the thermal module of some embodiments of the present invention.

Fig. 5A is a cross-sectional view of the heat dissipation module of Fig. 4 taken along line A-A'.

Fig. 5B is a cross-sectional view of the heat dissipation module of Fig. 4 taken along line B-B'.

Fig. 6 is a cross-sectional view showing a part of the heat dissipation module of Fig. 3.

Figure 7 shows an exploded view of the thermal module of some embodiments of the present invention.

In order to make the purpose, features, and advantages of this creation more obvious It is to be understood that the following detailed description of the embodiments and the accompanying drawings. The configuration of each component in the embodiments is for illustrative purposes and is not intended to limit the present invention. The overlapping portions of the drawings in the embodiments are for the purpose of simplifying the description and are not intended to be related to the different embodiments.

Referring to Figures 1 and 2, the heat dissipation module 100 of some embodiments of the present invention includes a first substrate 110, a second substrate 130, a first flow channel unit 150, and a working fluid 170 (Fig. 2).

The first substrate 110 has a first inner surface 111, a first outer surface 113 opposite to the first inner surface 111, and an outer edge 115 coupled between the first inner surface 111 and the first outer surface 113. The second substrate 130 has a second inner surface 131, a second outer surface 133 opposite to the second inner surface 131, and an outer edge 135 coupled between the second inner surface 131 and the second outer surface 133. In some embodiments, the first substrate 110 and the second substrate 130 may be made of copper or other material having a high thermal conductivity to dissipate thermal energy from a heat source (not shown). In some embodiments, since the second substrate 130 does not need to form a runner unit, the thickness of the second substrate 130 is smaller than the thickness of the first substrate 110, and the thickness of the entire heat dissipation module 100 is reduced.

In some embodiments, the area of the first inner surface 111 of the first substrate 110 is opposite to the area of the second inner surface 131 of the second substrate 130. The first inner surface 111 of the first substrate 110 is coupled to the second inner surface 131 of the second substrate 130 , and the outer edge 115 of the first substrate 110 is aligned with the outer edge 135 of the second substrate 130 . In some embodiments, the outer edges 115, 135 of the first substrate 110 and the second substrate 130 are circular, but the creation is not limited thereto. The outer edges 115, 135 of the first substrate 110 and the second substrate 130 may be rectangular or of any other shape.

In some embodiments, the first flow channel unit 150 is formed on the first inner surface 111 of the first substrate 110. The first flow path unit 150 includes a first heat dissipation section 151 , a first heat absorption section 152 , a plurality of first gas passages 153 , and a plurality of first liquid passages 154 . The first heat dissipation section 151 is located between the substantial center 112 of the first substrate 110 and the outer edge 115 of the first substrate 110, and the first heat absorption section 152 is closer to the first substrate 110 than the first heat dissipation section 151. Center 112. For example, the first heat absorption section 152 is located at the substantial center 112 of the first substrate 110, and the first heat dissipation section 151 is an annular structure adjacent to the outer edge 115 of the first substrate 110, surrounding the first heat absorption section. 152 outside.

Referring to FIG. 2, the first gas passage 153 and the first liquid passage 154 are fluidly coupled between the first heat dissipation section 151 and the first heat absorption section 152, respectively. In some embodiments, the width of the first liquid passage 154 is less than the width of the first gas passage 153, and the number of the first liquid passages 154 is greater than the number of the first gas passages 153. In some embodiments, the first gas passage 153 and the first liquid passage 154 are radially arranged on the first inner surface 111. The first gas passages 153 have the same pitch in the circumferential direction, and at least two first liquid passages 154 are included between the adjacent two first gas passages 153. In some embodiments, the first gas passage 153 and the first liquid passage 154 are fabricated in an etched, sintered, or otherwise bonded configuration. In some embodiments, the width of the first liquid passage 154 is less than 100 μm, and the width of the first liquid passage 154 is gradually decreased from the outer edge 115 of the first substrate 110 toward the substantial center 112 of the first substrate 110.

Referring again to FIG. 1 , in some embodiments, the first flow channel unit 150 is exposed on the outer side of the first inner surface 111 , and the first inner surface of the first substrate 110 is assembled when the first substrate 110 and the second substrate 130 are assembled. 111 is coupled to the second substrate The second inner surface 131 of the 130 is such that the first flow path unit 150 is covered by the second inner surface 131 of the second substrate 130 to form a sealed space, and the working fluid 170 (Fig. 2) is accommodated therein. In some embodiments, the working fluid 170 can be water or other liquid having a low viscosity coefficient.

Referring to FIG. 2, in some embodiments, the operation mode of the heat dissipation module 100 is as follows: First, a heat source (for example, a central processing unit of an electronic device, not shown) directly or indirectly contacts the heat dissipation module 100. A substrate 110 or a second substrate 130. In some embodiments, the heat source is disposed outside the heat dissipation module 100 with respect to the first heat absorption section 152 of the first flow path unit 150. In some embodiments, the heat source is disposed outside the first substrate 110 or the second substrate 130 with respect to a substantial center of the heat dissipation module 100.

Then, when the heat energy of the heat source is transmitted to the heat dissipation module 100, the working fluid 170 located inside the first heat absorption section 152 is evaporated into a gaseous state due to heat. After the working fluid 170 evaporates, the gas pressure inside the first heat absorbing section 152 increases. The gaseous working fluid 170 is driven by the differential pressure of the first heat absorption section 152 and the first heat dissipation section 151 to begin flowing along the first gas passage 153 toward the first heat dissipation section 151 (as indicated by arrow f1). The gaseous working fluid 170 exchanges heat with the first substrate 110 and the second substrate 130 in the first gas passage 153 and the first heat dissipation portion 151, and condenses into a liquid state in the first heat dissipation portion 151. At the same time, the liquid working fluid 170 located in the first heat dissipating section 151 is driven by the surface tension generated by the capillary action, starts to flow along the first liquid passage 154 toward the first heat absorbing section 152, thereby replenishing the new liquid state. The fluid 170 is made to the first heat absorption section 152. Repeatedly, the heat from the heat source is effectively dissipated to the environment by the heat dissipation module 100.

Referring to Figures 3 and 4, Figure 3 shows some embodiments of the present creation. An exploded view of the heat dissipation module 100a, and FIG. 4 shows a top view of the heat dissipation module 100a of some embodiments of the present invention. The same or similar components of the heat dissipation module 100a and the heat dissipation module 100 will be given the same reference numerals, and their features will not be described again. The difference between the heat dissipation module 100a and the heat dissipation module 100 includes that the heat dissipation module 100a further includes a second flow path unit 190 formed on the second inner surface 131 of the second substrate 130.

Specifically, the second flow path unit 190 includes a second heat dissipation section 191 , a second heat absorption section 192 , a plurality of second gas passages 193 , and a plurality of second liquid passages 194 . The second heat dissipation section 191 is located between the substantial center 132 of the second substrate 130 and the outer edge 135 of the second substrate 110, and the second heat absorption section 192 is closer to the second substrate 110 than the second heat dissipation section 191. Center 132. For example, the second heat absorption section 192 is located at the substantial center 132 of the second substrate 110, and the second heat dissipation section 191 is an annular structure, and the outer edge 135 of the adjacent second substrate 110 surrounds the second heat absorption section. 192 outside. In some embodiments, the second heat dissipation section 191 is fluidly coupled to the first heat dissipation section 151 with respect to the first heat dissipation section 151. In some embodiments, the second heat absorption section 192 is fluidly coupled to the first heat absorption section 152 with respect to the first heat absorption section 152.

Referring to Fig. 5A, there is shown a cross-sectional view taken along line A-A' of Fig. 4. In some embodiments, the second gas passage 193 is fluidly coupled between the second heat dissipation section 191 and the second heat absorption section 192. The working fluid 170 entering the second heat dissipation section 191 via the second gas passage 193 may merge into the first heat dissipation section 151. That is, the second gas passage 193 is simultaneously fluidly coupled between the first heat dissipation section 151 and the first heat absorption section 152. In some embodiments, the second gas passage 193 is fluidly coupled to the first gas passage 153 with respect to the first gas passage 153. Therefore, a common gas passage is constructed by the first gas passage 153 and the second gas passage 193.

Referring to Fig. 5B, there is shown a cross-sectional view taken along line B-B' of Fig. 4. In some embodiments, the second liquid passage 194 is fluidly coupled to the second heat dissipation section 191 and fluidly coupled to the first heat absorption section 152 or the second heat absorption section 192 by the first liquid passage 154. Specifically, as shown in FIG. 3, each of the second liquid passages 194 includes an extended section 1941 and a joint section 1943. The extension section 1941 is fluidly coupled to the first heat dissipation section 151 or the second heat dissipation section 191, and extends from the outer edge 135 of the second substrate 130 toward the substantial center 132 of the first substrate 130, and extends the width of the section 1941. Gradually. As shown in FIG. 6, the connecting section 1943 is fluidly coupled between the extending section 1941 and the first liquid passage 154, and in the direction of the first liquid passage 154, the width of the joining section 1943 is tapered to facilitate The liquid working fluid 170 flows from the extended section 1941 to the first liquid passage 154 via the joining section 1943. In some embodiments, the second liquid passage 194 is directly fluidly coupled between the second heat dissipation section 191 and the second heat absorption section 192. The second liquid passage 194 is not coupled to the first liquid passage 154.

Referring to FIG. 4, when the heat dissipation module 100a is actuated, the working fluid 170 is heated in the first heat absorption section 152 and the second heat absorption section 192 to evaporate into a gaseous state, and passes through the first gas passage 153 and the second gas passage 193. The flow to the first heat dissipation section 151 and the second heat dissipation section 191. The gaseous working fluid 170 exchanges heat with the first substrate 110 and the second substrate 130, and condenses into a liquid state in the first heat dissipation section 151 and the second heat dissipation section 191. The liquid working fluid 170 is driven by the surface tension generated by the capillary action, flowing along the first liquid passage 154 and the second liquid passage 194 to the first heat absorption section 152 and the second heat absorption section 192. Repeatedly, the heat from the heat source is effectively dissipated to the environment by the heat dissipation module 100a.

Since the heat dissipation module 100a further includes the second flow path unit 190, heat dissipation The module 100a can accommodate more working fluid 170 than the heat dissipation module 100, thereby improving the heat dissipation efficiency of the heat dissipation module 100a.

Please refer to FIG. 7. FIG. 7 shows an exploded view of the heat dissipation module 100b of some embodiments of the present invention. The same or similar components of the heat dissipation module 100b and the heat dissipation module 100 will be given the same reference numerals, and their features will not be described again. The difference between the heat dissipation module 100b and the heat dissipation module 100 includes: the heat dissipation module 100b includes a plurality of first flow channel units 150b.

The first flow path unit 150b is circumferentially formed on the first inner surface 111 without being fluidly coupled to each other. Each of the first flow path units 150b includes a first heat dissipation section 151b, a first heat absorption section 152b, a plurality of first gas passages 153b, and a plurality of first liquid passages 154b. The first heat dissipation portion 151b is located between the substantial center 112 of the first substrate 110 and the outer edge 115 of the first substrate 110, and the first heat absorption portion 152b is closer to the first substrate 110 than the first heat dissipation portion 151b. Center 112.

For example, the first heat absorption sections 152b of each of the first flow path units 150b are circumferentially arranged with the substantial center 112 of the first substrate 110 as a center. The first heat dissipation portion 151b of each of the first flow path units 150b is located adjacent to the outer edge 115 of the first substrate 110 and extends circumferentially along the outer edge 115 of the first substrate 110 by a specific length. The first gas passage 153b and the first liquid passage 154b of each of the first flow path units 150b are fluidly coupled between the corresponding first heat dissipation portion 151b and the first heat absorption portion 152b, respectively.

When the heat dissipation module 100b is actuated, the working fluid (not shown in FIG. 7) is heated in each of the first heat absorption sections 152b to evaporate into a gaseous state, and flows to the corresponding first heat dissipation section via the first gas passage 153b. 151b. Gaseous work The fluid (not shown in FIG. 7) exchanges heat with the first substrate 110 and the second substrate 130, and condenses into a liquid state in the first heat radiation portion 151b. The liquid working stream (not shown in Figure 7) is driven by the surface tension generated by the capillary action and flows along the first liquid passage 154b to the first heat absorption section 152b. Repeatedly, the heat from the heat source is effectively dissipated to the environment by the heat dissipation module 100b.

Since each of the first flow path units 150b of the heat dissipation module 100b is not fluidly connected to each other. Each of the first flow channel units 150b accommodates a fixed working fluid (not shown in FIG. 7), and the heat dissipation effect of each region of the heat dissipation module 100b is maintained constant.

The heat dissipation module of the present invention has a radial flow channel design, and the heat absorption section of the flow channel is closer to the substantial center of the heat dissipation module than the heat dissipation section. Therefore, regardless of the operation of the heat dissipation module at any angle, the heat dissipation module will be unaffected by gravity and will continue to operate effectively.

Although the present invention has been disclosed in the preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of this creation is subject to the definition of the scope of the patent application attached.

100‧‧‧ Thermal Module

110‧‧‧First substrate

130‧‧‧second substrate

150‧‧‧First runner unit

151‧‧‧First heat dissipation section

152‧‧‧First heat absorption section

153‧‧‧First gas passage

154‧‧‧First liquid passage

170‧‧‧Working fluid

Claims (10)

A heat dissipation module includes: a first substrate having a first inner surface; a first flow channel unit formed on the first inner surface, and comprising: a first heat dissipation section located on the first substrate Between the substantial center and the outer edge of the first substrate; a first heat absorbing section adjacent to a substantial center of the first substrate; and a first gas channel and a first liquid channel Between the first heat absorption section and the first heat dissipation section, wherein the width of the first liquid passage is smaller than the width of the first gas passage; a working fluid is disposed in the first flow passage unit And a second substrate having a second inner surface joining the first inner surface. The heat dissipation module of claim 1, further comprising a second flow path unit formed on the second inner surface to allow the working fluid to flow simultaneously in the first and second flow path units, wherein The second flow channel unit includes: a second gas passage and a second liquid passage, respectively fluidly connected between the first heat absorption portion and the first heat dissipation portion, wherein the width of the second liquid passage is smaller than the first The width of the two gas channels. The heat dissipation module of claim 2, wherein the second flow channel unit further comprises: a second heat absorption section fluidly coupled to the first heat absorption section; A second heat dissipating section is fluidly coupled to the first heat dissipating section. The heat dissipation module of claim 2, wherein the second gas passage is fluidly coupled to the first gas passage. The heat dissipation module of claim 2, wherein the second liquid passage is fluidly coupled to the first liquid passage. The heat dissipation module of claim 5, wherein the second liquid passage comprises: an extension section fluidly coupled to the first heat dissipation section; and a coupling section fluidly coupled to the extension section Between the first liquid passage and the first liquid passage from the extending portion, the width of the joint portion is tapered. The heat dissipation module of claim 1, wherein the width of the first liquid passage is tapered from the first heat dissipation section toward the first heat absorption section. The heat dissipation module of claim 1, wherein the outer edge of the first substrate and the outer edge of the second substrate are substantially circular. The heat dissipation module of claim 1, wherein the first heat dissipation section circumferentially surrounds the first heat absorption section, and the first flow channel unit includes a plurality of first gas passages and a plurality of first The liquid passage is circumferentially arranged between the first heat dissipation section and the first heat absorption section. The heat dissipation module of claim 1, comprising a plurality of first flow channel units circumferentially formed on the first inner surface.