TWM462948U - Package structure - Google Patents

Abstract

Disclosed is a package structure, comprising a substrate having a conductive pillar, an electronic component disposed on the substrate positing the conductive pillar at the peripheral thereof, and a metallic wall disposed on the substrate at the peripheral of the conductive pillar to control the range of forming an encasulant in the subsequent packaging process.

Description

Package structure

This creation relates to a package structure, in particular, to a package structure having a metal barrier.

With the rapid development of portable electronic products in recent years, various related products are gradually moving toward high density, high performance, light, thin, short, and small, and various package on package (PoP) Cooperate with innovation, in order to meet the requirements of light, short and high density.

As shown in FIG. 1, it is a schematic cross-sectional view of a conventional package stacking device 1. As shown in FIG. 1, the package stacking device 1 includes two stacked package structures 1a and another package structure 1b.

The package structure 1a includes a first substrate 11 having opposite first and second surfaces 11a, 11b, a first electronic component 10 that is flip-chip bonded to the first substrate 11, and a power provided on the first surface 11a. The first contact substrate 111 is formed on the first substrate 11 to cover the first encapsulant 13 of the first electronic component 10, and is formed on the electrical contact pad 111 in the opening 130 of the first encapsulant 13. The solder material 114 and the ball pad 112 disposed on the second surface 11b for bonding the solder balls 14 .

The other package structure 1b includes a second substrate 12, second electronic components 15a, 15b bonded to the second substrate 12 in a wire bonding manner, and formed on the second substrate 12 to cover the second electronic component 15a. The second encapsulant 16 of the 15b is stacked on the second substrate 12 by the solder material 114 and electrically connected to the electrical contact pad 111 of the first substrate 11.

However, in the conventional package stacking device shown in FIG. 1, the opening 130 of the exposed electrical contact pad 111 is formed in the first encapsulant 13 by laser technology, which is formed in the first A via in the dielectric layer of the build-up structure (not shown) in the substrate 11, the depth of the opening 130 is deep, resulting in an increase in laser time, thereby increasing the cost.

In addition, limited by the thickness of the semiconductor wafer (ie, the first electronic component 10), the height between the two package structures 1a, 1b is maintained, and as the package stacking device 1 is reduced in size, the openings are opened. The width of the hole 130 also needs to be reduced, and since the laser projected onto the package structure 1a is generally a beam having an upper width and a lower width, it is difficult to control the shape of the laser beam, so the high aspect ratio (ie, the hole) of the openings 130 The ratio of depth to width) makes laser processing difficult and costly.

Moreover, the conventional printing tin equipment is easy to generate a gap in the opening 130 for such a high aspect ratio hole type, and the current tin-pressing equipment usually only produces one solder ball at a time, and the amount of the tin is Not enough to fill the opening 130, resulting in an increase in the time during which the solder material 114 is formed in the opening 130.

In addition, in the conventional package stacking device 1, a gap d is formed between the two package structures 1a, 1b, so that the two package structures 1a, 1b have a concern of falling off.

Moreover, since the tolerance of the volume and height of the solder material 114 after reflow is large, not only the contacts are prone to defects, but the electrical connection quality is poor, and the solder material 114 is arranged in a grid array. The coplanarity is poor, resulting in an unbalanced bond stress, which tends to cause tilting between the two package structures 1a, 1b, and even a problem of contact offset.

Therefore, how to overcome various problems in the prior art has become a problem that is currently being solved.

In view of the above-mentioned deficiencies of the prior art, the present invention provides a package structure comprising: a substrate having a plurality of conductive metal posts on a surface thereof; an electronic component disposed on the surface of the substrate and electrically connected to the substrate, and The conductive metal pillars are located at the periphery of the electronic component; and the metal barrier wall is disposed on the edge of the substrate and surrounds the periphery of the conductive metal pillars.

In the above package structure, the height of the metal barrier is greater than the height of the conductive metal post, and the metal barrier is annular or L-shaped.

In the foregoing package structure, the auxiliary metal pillars disposed on the substrate have a height greater than a height of the conductive metal pillars. Also included is a solder material disposed on the conductive metal post.

In the foregoing package structure, another package structure is included on the lead metal posts, and the other package structure is stacked on the substrate and the electronic component. The metal barrier also abuts the other package structure. The encapsulant is formed between the other package structure and the substrate, and the encapsulant is adhered to the other package structure and the substrate, and the encapsulant encapsulates the lead metal posts and the electronic component .

It can be seen from the above that in the package structure of the present invention, the design of the metal barrier wall can control the forming range of the encapsulant, and the fluidity and the glue filling property of the encapsulant can be improved to avoid the encapsulation colloid overflow. The flow destroys the package structure, so the quality of the product can be improved.

Furthermore, the conductive metal pillars (non-solder materials) are stacked and electrically connected to the package structure, so that the size variation of the conductive metal pillars can be easily controlled after the stacking process, so that the laser can be overcome. It is not easy to process the tin, the tilting between the stacked structures and the offset of the contacts.

In addition, after stacking another package structure, the present invention further forms an encapsulant, so that the encapsulant is adhered to the other package structure and the substrate, thereby avoiding the gap between the two package structures in the prior art. Avoid the risk of falling off between the package structures and have better resistance to warping.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure of the present disclosure.

It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered. At the same time, the terms "upper", "lower", "left", "right", "first", "second" and "one" as used in this specification are also for convenience of description. It is not intended to limit the scope of the creation of the creation, and the change or adjustment of the relative relationship is considered to be within the scope of the creation of the creation without substantial changes in the technical content.

2A to 2E are schematic cross-sectional views showing the manufacturing method of the first embodiment of the package structure 2a and the package stacking device 2 thereof.
As shown in FIG. 2A, a first substrate 21 having a first surface 21a and a second surface 21b is formed. The first surface 21a of the first substrate 21 has a plurality of pads 211a and the pads 211a. The peripheral electrical contact pad 211b has a plurality of ball bump pads 212 on the second surface 21b of the first substrate 21. Further, the first and second surfaces 21a, 21b of the first substrate 21 have an insulating protective layer 213 such as a solder resist layer, and the insulating protective layer 213 is formed with a plurality of exposed pads 211a and electrical contact pads 211b. The opening 213a of the ball pad 212 is formed on the exposed surface of the electrical contact pad 211b, and the conductive pillar 200a is formed on the exposed surface of the pad 211a.

In this embodiment, a copper bump 200b is formed on the exposed surface of the pad 211a, and a solder bump 200c is formed on the copper bump 200b to form the conductive bump 200a.

As shown in FIG. 2B, a metal barrier wall 27 is formed on the edge of the first surface 21a of the first substrate 21, so that the metal barrier wall 27 surrounds the periphery of the conductive metal pillars 210, as shown in FIG. 2C'. Shown.

In this embodiment, the metal barrier wall 27 is made of copper and is located at the adjacent edges of the first substrate 21 (ie, the upper side and the right side of the second C' figure are in an "L" shape), and the metal The height h of the retaining wall 27 is higher than the height t of the guiding metal post 210.

As shown in FIG. 2C, at least one first electronic component 20 is disposed on the solder pad 211a by the conductive bumps 200a, so that the conductive metal pillars 210 are located on the periphery of the first electronic component 20, and then The primer 201 covers the conductive bumps 200a, that is, the electrode pads 200 of the first electronic component 20 are electrically connected to the first substrate 21 in a flip chip manner, and the solder balls are combined on the exposed surface of the ball bump pad 212. 24, to constitute the first embodiment of the package structure 2a of the present invention.

In this embodiment, the first electronic component 20 is an active component and/or a passive component, such as a wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.

As shown in FIG. 2D, a solder material 214 is formed on the exposed surface of the conductive metal pillars 210 to stack another package structure 2b on the conductive metal pillars 210 by reflowing the solder material 214.

In this embodiment, the other package structure 2b is provided with a second electronic component 25a, 25b on a second substrate 22, and the second electronic component 25a, 25b is electrically connected and electrically connected to the second electronic component 25a, 25b. The second substrate 22 (which may also be flip-chip connected and electrically connected to the second substrate 22) and encapsulates the second electronic components 25a, 25b with the encapsulant 26.

Moreover, the height h of the metal barrier wall 27 is equal to the total height L of the conductive metal pillars 210 and the solder material 214, so that the metal barrier wall 27 abuts against the other package structure 2b.

As shown in FIG. 2E, the encapsulant 23 is formed between the other package structure 2b and the first substrate 21 by the side of the two package structures 2a, 2b by, for example, a molding method. The encapsulant 23 covers the lead metal posts 210 and the solder material 214, and the encapsulant 23 adheres the other package structure 2b and the first substrate 21 to form a package stacking device 2.
In the present embodiment, the metal barrier wall 27 limits the forming range of the encapsulant 23 . Since the metal barrier wall 27 is located at the adjacent edges of the first substrate 21, the encapsulant 23 can be filled in by other sides of the first substrate 21 (such as the lower side and the left side shown in FIG. 2C'). Thus, the encapsulant 23 can cover the first electronic component 20.

Therefore, as shown in FIGS. 2E(a) to 2E(c), the metal retaining walls 27a, 27b, 27c are annularly located at the edge of the first substrate 21, and the metal retaining walls 27a, 27b, 27c are required to have At least one notch 270 is formed to fill the encapsulant 23 between the other encapsulation structure 2b and the first substrate 21.

The package structure 2a of the present invention can control the forming range of the encapsulant 23 by the design of the metal barrier wall 27, and can improve the fluidity and the glue filling property of the encapsulant 23 to prevent the encapsulant 23 from overflowing. The package structure 2a is destroyed, so that the quality of the product can be improved.

After the other package structure 2b is stacked, the package body 23 is formed, and the package body 23 is adhered to the other package structure 2b and the first substrate 21. Therefore, the two package structures 2a and 2b are not A gap is generated, so that the combination of the two package structures 2a, 2b can be improved to prevent the upper package structure 2b from falling off and having better warpage resistance.

On the other hand, after the metal pillars 210 are stacked and electrically connected to the two package structures 2a, 2b, since the height and volume of the conductive metal pillars 210 can be controlled, after the solder material 214 is reflowed, The contact between the conductive metal pillars 210 and the solder material 214 does not cause defects, thereby maintaining good electrical connection quality, and the conductive metal pillars 210 are arranged in a grid array. The coplanarity is good, so the contact stress is balanced without causing the two package structures 2a, 2b to be tilted to avoid the problem of joint offset.

3A to 3B are cross-sectional views showing a second embodiment of the package structure 3a of the present invention and its package stacking device 3. The difference between this embodiment and the first embodiment is that an auxiliary dummy post 37 such as a copper material is added, and other structures are substantially the same.
As shown in FIGS. 3A and 3A', a plurality of auxiliary metal pillars 37 are formed on the first surface 21a of the first substrate 21.

In the embodiment, the auxiliary metal pillars 37 are located between the guiding metal pillars 210 (such as the inner side, the outer side, and the like of the guiding metal pillars 210), and the guiding metal pillars 210 and the first electrons. Between the elements 20, a third embodiment of the package structure 3a of the present invention is constructed.

Furthermore, the height of the auxiliary metal pillars 37 is greater than the height of the guiding metal pillars 210, and the width of the auxiliary metal pillars 37 is smaller than the width of the guiding metal pillars 210, that is, compared to the guiding metal pillars 210. The auxiliary metal column 37 is an elongated cylinder.

As shown in FIG. 3B, another package structure 2b is stacked, the auxiliary metal posts 37 are abutted against the other package structure 2b, and a package is formed between the other package structure 2b and the first substrate 21. The colloid 23 is such that the encapsulant 23 covers the auxiliary metal posts 37 to form a package stacking device 5.

The design of the auxiliary metal pillar 37 not only improves the fluidity and the glue filling property of the encapsulant 23, but also directly abuts the other package structure 2b to provide better coplanarity. The upper package structure 2b is more balanced without tilting.

In summary, the package structure of the present invention can control the forming range of the encapsulant by the design of the metal retaining wall (and the auxiliary metal post), and can improve the fluidity and the filling property of the encapsulant. In order to avoid the overflow of the encapsulant and destroy the package structure, the quality of the product can be improved.

Moreover, the auxiliary metal post is directly abutted against the upper package structure to provide better coplanarity, so that the upper package structure can be more balanced without tilting.

Moreover, by the design of the guiding metal post, it is possible to overcome the problem that the laser and the tin-working are not easy, the tilting between the stacked structures, and the offset of the contacts.

In addition, the package structure adheres the other package structure and the substrate by the encapsulant, thereby effectively preventing the separation between the package structures and having better anti-warpage performance.

The above embodiments are intended to illustrate the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.

1,2,3‧‧‧ package stacking device

1a, 1b, 2a, 2b, 3a‧‧‧ package structure

10,20‧‧‧First electronic components

101,201‧‧‧Bottom glue

11, 21‧‧‧ first substrate

11a, 21a‧‧‧ first surface

11b, 21b‧‧‧ second surface

111,211b‧‧‧Electrical contact pads

112,212‧‧‧Ball mat

114,214‧‧‧ solder materials

12,22‧‧‧second substrate

120‧‧‧ solder balls

13‧‧‧First encapsulant

130‧‧‧Opening

14,24‧‧‧ solder balls

15a, 15b, 25a, 25b‧‧‧ second electronic components

16‧‧‧Second encapsulant

200‧‧‧electrode pads

200a‧‧‧conductive bumps

200b‧‧‧ copper bumps

200c‧‧‧ solder bumps

210‧‧‧Guided metal column

211a‧‧‧ pads

213‧‧‧Insulating protective layer

213a‧‧‧Opening

23,26‧‧‧Package colloid

27,27a,27b,27c‧‧Metal barrier

270‧‧ ‧ gap

37‧‧‧Auxiliary metal column

D‧‧‧ gap

h, t‧‧‧ height

L‧‧‧ height sum

Figure 1 is a schematic cross-sectional view of a conventional package stacking device;

2A to 2E are schematic cross-sectional views showing a method of fabricating a first embodiment of the package structure of the present invention and a package stacking device thereof; wherein the 2Cth image is the 2Cth image (before the first electronic component is not disposed) In the top view, the 2E(a) to 2E(c) diagrams are other embodiments of the 2C' diagram;

3A to 3B are cross-sectional views showing a second embodiment of the package structure of the present invention and a package stacking device thereof; wherein the 3A' figure is the 3A figure (before the first electronic component is not disposed) See the schematic.

2a‧‧‧Package structure

20‧‧‧First electronic components

200‧‧‧electrode pads

200a‧‧‧conductive bumps

201‧‧‧Bottom glue

21‧‧‧First substrate

21a‧‧‧ first surface

210‧‧‧Guided metal column

211a‧‧‧ pads

212‧‧‧Ball mat

24‧‧‧ solder balls

27‧‧‧Metal barrier

Claims (8)

A package structure includes a substrate having a plurality of conductive metal pillars on a surface thereof, and an electronic component disposed on the surface of the substrate and electrically connected to the substrate, wherein the conductive metal pillars are located on the periphery of the electronic component And a metal barrier wall disposed on an edge of the substrate and surrounding the periphery of the guiding metal posts. The package structure of claim 1, wherein the height of the metal barrier is greater than the height of the conductive metal post. The package structure of claim 1 or 2, wherein the metal barrier is annular or L-shaped. The package structure according to claim 1, further comprising an auxiliary metal column disposed on the substrate, the height of which is greater than the height of the guiding metal column. The package structure according to claim 1 or 4, further comprising a solder material disposed on the conductive metal pillar. The package structure of claim 1, further comprising another package structure coupled to the lead metal posts to stack the other package structure over the substrate and the electronic component. The package structure of claim 6, wherein the metal barrier wall abuts the other package structure. The package structure of claim 6, further comprising an encapsulant formed between the other package structure and the substrate, and the encapsulant is adhered to the other package structure and the substrate, the encapsulant And guiding the lead metal posts and the electronic component.