M3 3 8948 八、新型說明： 【新型所屬之技術領域】M3 3 8948 VIII. New description: [New technology field]
本創作關於-觀絲置，軸 I 環狀體和底座等料件進行沖壓鉚^ 、將各政”…、、、曰片、 狀散熱裝置。 4結—騎形成之環 【先前技術】This creation is about the stamping, the shaft I ring body and the base and other parts of the stamping riveting ^, will be the political ....,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,
隨著電子產品、電器用品功能曰益強大，所消耗 之電功率越來越高，相對所產生的熱能也越來越大， 如何有效移除甚至消除熱“維⑽統處在一個穩定 狀態’已成為產品設計製造上的重要技術議題。 散熱技術在電子產品、電！^品之製作過程中是 非常重要的-環，隨著消費產品市場的領域日新月 異，散熱需求與挑戰也隨之增加。舉說，常_ 二極體逐步取代， 燈具如：鶴絲燈、白幟燈已經被發光 發光二極體具有耗電量低、元件壽命長、甚至高功率 等多項優點，其體積小，又目前的製程曰趨成熟，發 展出可以發出不同波長的光，除了適用於各種電器操 作面板、資訊看板、通訊產品等之發光元件，進一步 可應用於枱燈、路燈等照明燈具上。雖然一般發光二 極體在工作時產生的熱能較習用的燈具低，不過若在 同一區域使用的數量高，或使用高功率的發光二極體 時，由於其普遍設於基板上且散熱環境不佳，仍應該 5 M338948 特別注意散熱問題。 如同本國專利公開第200716911號「發光二極體 燈之散熱裂置」中，主要是利用將南功率發光二極體 燈連接於一均熱器的底面，使發光二極體燈導出的熱 昼傳導至平板式熱管或嵌入金屬板之熱管的蒸發器區 域’使熱量被熱管内部流動的蒸氣散佈至均熱器的士 區域，透過對流自動散熱，惟其裝置複雜，並不實用。 另外，則可以參考本國專利公告第M317539號 「發光二極體燈具」之較佳實施例圖，該案之散熱主 要疋透過導熱柱及複數個散熱鰭片所組合成的散熱模 、且々該政熱鰭片壤繞於該導熱柱之一頂端形成同該 導熱柱軸心之一凹階，放置發光二極體之底座即可放 入凹h中。只不過該散熱器的成型方式係利用焊接方 式進行，生產速度慢且容易發生產品接合瑕疵，並卫， 焊接時將產生有害廢氣，對於人體、環境均有危害。 故，本案創作人遂根據對於散熱器結構進行研 究，藉解決上述一體或分離式之散熱結構缺失持續研 究加以改良，完成本創作之開發設計。 【新型内容】 =作之目的在於提供一種環狀設計的散熱裝置，並 且，該裱狀散熱裝置係透過模具沖壓即可成型。 本創作之次-目的在於預備料件係透過模具沖壓即可 6 M338948 狀散熱裝置，提昇生產速度。而沖m將 卜私職生的廢氣產生，有助於環保及人體安全 之散目的在於作為發光二鐘燈具或發光體 之月文”、、杈、、且時，由於進給料件、定位、沖壓一 具較佳雜縣和賴财 迷、70 的散熱並且再加以提昇。 戚…，，月陕迷、千均 本創作解決問題之技術手段： ^ 士本創作揭露-種環狀散熱裝置之㈣緊結結構， :、口構係透過成形模具對預備料件進行衝壓緊結而成 里該¥狀散熱裝置包括有一組環型體（Rjng)，該環 型體之外緣部份分佈有複數導溝以及凹槽，並且該導 冓”凹槽為相鄰互錯順序排列，該組環型體中設有— f座’該底座將作為提供燈具置放之位置，相對應之 散熱鰭片將導引插置在環型體之凹槽中；藉一成形模 具沖壓導溝，令耗麵受力產生變形，在同一時間 使:槽壓制形變、該組環型體壓摯底座，使環型體爽 制散熱鰭片，並使環型體、底座及散熱㈣緊結為一 ^在％型體内部之底座作為承載發光二極體、燈具 承載$路基板之用’該底絲可被選擇的設置在 :型體之上、下環㈣間’通過沖壓程序鱗底座而 M338948 以下將配合圖式說明本創作的較佳實施例，下述 所列舉的實施例係用以闡明本創作，並非用以限定本 創作之範圍，任何熟習此技藝者，當可做些許更動與 潤飾，因此本創作之保護範if當視後附之申請專利範 圍所界定者為準。 【實施方式】 請參閱第一圖為本創作較佳實施例之立體分解 圖。在本較佳實施例中，環型體1包含上環型體10以 及下環型體20兩部份上、下環型體10、20對合成環 型體1，其形狀可以為圓形、橢圓形、扁圓形或其他具 封口之環形體，各環型體10、20之外緣12、22部份 分佈有複數導溝14、24以及凹槽16、26，在此可同 時參閱第二圖較為清楚（以上環型體10為代表），並 且該導溝14、24與凹槽16、26為相鄰互錯順序排列 (參考第二圖），内緣18、28部份則具有至少一可供 與底座嵌卡定位之固定位置30，導溝14、24與凹槽 16、26的數量與相鄰距離將可依照散熱需求程度不同 或是環型體1規格、空間規劃的需求進行變化設計。 在上環型體10與下環型體20的結合處設有一底座 40,藉由該底座40及環型體1的位置可以規劃出一個 空間50,由該空間50和底座40作為提供熱源置放之 M338948 4，職源-般可騎職光二極體或發光二極體模 址（LED Module)及其電路板或其他電子發熱元件（如 曰曰片）等谷置。一組具有複數單位之散熱鰭片6〇將沿 著環型體1外侧排列，各散熱鰭片60將預對準凹槽 16、26,以纟進行組裂及沖壓時結合處能夠毫無偏差。 • 環型體1内部之底座40將作為承載發光二極體、 • 電子發熱元件或是承载電路基板之用，該底座40可被 選擇設計在環型體1之上環型體10、下環型體20之 間，並透過沖壓程序失持底座4〇而定位緊結一體。 請繼續參閱第三圖，各散熱鰭片60將順序排列在 5袠型體1外圍，各散熱鰭片60具有上折座62、下折 I 64 ’故在各散熱鰭片6Q組合後可形成—排列定位 之組合面’透過該排耻合面可提供各散_片帥之 • 冑距和便於成龍具7(3沖壓進人，透過散熱縛片 •與空氣接觸的大面積進行散熱，而熱源則是設置在 '型體1内部。在第四圖中，相對應之散熱鰭片60將^ 引插置在上環型體10、下環型體2〇之凹槽16、26中 此時上環型體1Q、下環型體2Q、底座^及散熱轉片 60尚未經過沖壓程序。 請參閱第五圖，為藉—成形模具7Q沖壓導溝之動 作示意圖’令該環型體彳受力產生變形，該底座 9 M338948 受到環型體1的夾持而定位，在同一時間各散熱鰭Η 又受到環型體的兩侧導溝推擠，緊密的鉚合於凹槽中 (參考第五Α圖），並使環型體1、底座40及散熱鰭 片60緊結為一體。沖壓成型之後的散熱鰭片60與環 型體1之組合狀態第六〜七圖所示。 本創作環型散熱裝置之特點主要在於透過模具沖 壓隨即成型，省去習知需要焊接等容易造成失誤等人 為因素。第七圖為本創作環型散熱裝置之成品外觀立 體圖，從圖面上可知各散熱鰭片60已經緊密與上環型 體10、下環型體20之相對應凹槽16、26鉚合緊結成 一體，該空間50將裝配燈具或電子元件等熱源，以及 通過多數散熱鰭片60作高效率散熱。 M338948 【圖式簡單說明】 第一圖為本創作之立體分解圖； 第二圖為本創作之上環型體俯視圖； 第三圖為本創作之散熱鰭片外觀圖； 第四圖為待沖壓之本創作環型散熱裝置平視圖； 第五圖為本創作環型散熱裝置進行沖壓之動作示意 圖； 第五A圖為本創作環型散熱裝置進行沖壓之緊結示意 圖， 第六圖為沖壓後本創作環型散熱裝置之仰視圖； 第七圖為本創作環型散熱裝置之成品外觀立體圖。 【主要元件符號說明】 1 環型體 30 固定位置 10 上環型體 40 底座 20 下環型體 50 空間 12、22 外緣 60 散熱鰭片 14、24 導溝 62 上折座 16、26 凹槽 64 下折座 18、28 内緣 70 模具 11With the powerful functions of electronic products and electrical appliances, the electric power consumed is getting higher and higher, and the relative thermal energy generated is also getting larger and larger. How to effectively remove or even eliminate the heat “dimensionality (10) is in a stable state” It has become an important technical issue in product design and manufacturing. Thermal technology is very important in the production process of electronic products and electric products. With the rapid development of the consumer product market, heat dissipation requirements and challenges have also increased. Said, often _ diode is gradually replaced, lamps such as: crane lamp, white flag lamp has been illuminated by the light-emitting diode has a number of advantages such as low power consumption, long component life, and even high power, its small size, and currently The process has matured and developed light that can emit different wavelengths. In addition to light-emitting components suitable for various electrical operation panels, information boards, communication products, etc., it can be further applied to lighting fixtures such as desk lamps and street lamps. The heat generated by the body during operation is lower than that of conventional lamps, but if the amount used in the same area is high, or the use of high-powered hair In the case of a diode, because it is generally placed on a substrate and the heat dissipation environment is not good, 5 M338948 should be paid special attention to the heat dissipation problem. As in the national patent publication No. 200716911, "The heat sinking of the LED lamp", the main use is The south power LED lamp is connected to the bottom surface of a heat spreader, so that the heat extracted by the LED lamp is transmitted to the flat heat pipe or the evaporator region of the heat pipe embedded in the metal plate to make the heat flow inside the heat pipe. The vapor is distributed to the taxi zone of the heat spreader and is automatically dissipated by convection. However, the device is complicated and not practical. In addition, reference may be made to the preferred embodiment of the "Light Emitting Diode Lamp" of the National Patent Publication No. M317539, which is mainly composed of a heat dissipating module formed by a heat conducting column and a plurality of heat dissipating fins, and The heat fin surface is formed on one of the top ends of the heat conducting column to form a concave step with the axis of the heat conducting column, and the base of the light emitting diode is placed in the concave h. However, the forming method of the heat sink is performed by means of welding, and the production speed is slow and the product is prone to joints, and the harmful exhaust gas is generated during welding, which is harmful to the human body and the environment. Therefore, the creator of the case completed the research and development of the design based on the research on the structure of the radiator and the improvement of the above-mentioned integrated or separate heat dissipation structure. [New content] = The purpose of this is to provide a heat sink with a ring design, and the heat sink can be molded by stamping. The second of this creation - the purpose is to prepare the material through the die stamping 6 M338948 heat sink to increase production speed. The rushing m will generate the exhaust gas of the private students, which contributes to the environmental protection and human safety. The purpose of the scatter is to use the moonlight as the illuminating two-lamp luminaire or illuminator, 杈, 且, and, at the same time, due to the feed material, positioning, Stamping a better miscellaneous county and Lai Cai fans, 70 heat dissipation and then enhance it. 戚...,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The tight-fitting structure, the mouth structure is stamped and tightly formed by the forming die, and the heat-dissipating device comprises a set of ring-shaped bodies (Rjng), and the outer edge portion of the ring-shaped body is distributed with a plurality of guiding grooves. And the groove, and the guide groove" is arranged in an adjacent mutual error sequence, and the set of the ring body is provided with a -f seat", the base will serve as a position for providing the lamp, and the corresponding heat sink fin will guide The lead insert is placed in the groove of the ring body; the guide groove is punched by a forming die to deform the load surface, and at the same time: the groove is pressed and deformed, and the ring body is pressed against the base to make the ring body Cool fins and make the ring body, base and loose The heat (4) is tightly connected to the base of the % body as the base for carrying the light-emitting diode, and the lamp carries the road substrate. The bottom wire can be selected to be set between: the upper body and the lower ring (four). </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; Make some changes and refinements, so the protection of this creation should be determined by the scope of the patent application. [Embodiment] Please refer to the first figure for a perspective exploded view of a preferred embodiment of the present invention. In the preferred embodiment, the ring-shaped body 1 comprises an upper ring-shaped body 10 and a lower ring-shaped body 20, two parts of the upper and lower ring-shaped bodies 10, 20, and a synthetic ring-shaped body 1, which may have a circular shape or an elliptical shape. Shaped, oblate or other sealed annular body, the outer edges 12, 22 of each annular body 10, 20 are partially distributed with a plurality of guide grooves 14, 24 and grooves 16, 26, which can be referred to at the same time The figure is clearer (the above ring body 10 is representative), and the guide grooves 14, 24 and the grooves 16, 26 are arranged adjacent to each other in the wrong order (refer to the second figure), and the inner edges 18 and 28 have at least A fixed position 30 for positioning with the base insert card, the number and adjacent distance of the guide grooves 14, 24 and the grooves 16, 26 may be different according to the degree of heat dissipation requirement or the requirements of the ring body 1 specification and space planning. Change design. A base 40 is disposed at a joint of the upper ring body 10 and the lower ring body 20, and a space 50 can be planned by the position of the base 40 and the ring body 1, and the space 50 and the base 40 are used as a heat source for placement. M338948 4, the source of the general-purpose riding light diode or LED module (LED Module) and its circuit board or other electronic heating elements (such as cymbals) and other valleys. A set of heat-dissipating fins 6〇 having a plurality of units will be arranged along the outer side of the annular body 1, and each of the heat-dissipating fins 60 will be pre-aligned with the grooves 16, 26, and the joints can be unbiased when being split and punched. . • The base 40 inside the ring body 1 will serve as a light-emitting diode, an electronic heating element or a carrier circuit substrate. The base 40 can be selectively designed on the ring body 1 above the ring body 10 and the lower ring type. Between the bodies 20, and through the stamping program, the base 4 is lost and positioned to be tightly integrated. Referring to the third figure, each of the heat dissipation fins 60 will be sequentially arranged on the periphery of the 5袠 type body 1. Each of the heat dissipation fins 60 has an upper folding seat 62 and a lower folding I 64 ', so that the heat dissipation fins 6Q can be combined. - The combination of the positioning and positioning 'through the row of shame can provide a variety of _ 之 • • 和 和 和 和 和 和 和 和 和 和 和 和 和 和 和 和 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成The heat source is disposed inside the 'body 1. In the fourth figure, the corresponding heat sink fin 60 is inserted into the grooves 16 and 26 of the upper ring body 10 and the lower ring body 2 The upper ring body 1Q, the lower ring body 2Q, the base ^ and the heat dissipating rotor 60 have not been subjected to a stamping process. Please refer to the fifth figure for the action of punching the guide groove by the forming die 7Q to force the ring body. When the deformation occurs, the base 9 M338948 is positioned by the clamping of the ring body 1. At the same time, the heat dissipation fins are pushed by the guide grooves on both sides of the ring body, and are tightly riveted into the grooves (refer to the fifth Α图), and the ring body 1, the base 40 and the heat sink fins 60 are tightly integrated. The combination state of the fin 60 and the ring-shaped body 1 is shown in the sixth to seventh figures. The feature of the ring-shaped heat dissipating device of the present invention is mainly that the stamping is formed by the die, and the human factors such as the need for welding and the like are easily eliminated. The figure 7 is a perspective view of the finished product of the ring-shaped heat sink device. It can be seen from the drawing that each of the heat-dissipating fins 60 has been tightly integrated with the corresponding grooves 16 and 26 of the upper ring-shaped body 10 and the lower ring-shaped body 20 The space 50 will be equipped with a heat source such as a lamp or an electronic component, and heat-dissipated by a plurality of heat-dissipating fins 60. M338948 [Simple description of the drawing] The first figure is an exploded view of the creation; The top view of the upper ring body; the third picture is the appearance of the heat sink fin of the creation; the fourth picture is the flat view of the created ring heat sink to be stamped; the fifth figure is a schematic view of the punching action of the created ring type heat sink; The fifth A is a schematic diagram of the tight junction of the creative ring-shaped heat sink, and the sixth figure is the bottom view of the ring-shaped heat sink after stamping; Stereoscopic view of the finished product. [Main component symbol description] 1 Ring body 30 Fixed position 10 Upper ring body 40 Base 20 Lower ring body 50 Space 12, 22 Outer edge 60 Heat sink fins 14, 24 Guide groove 62 Upper fold seat 16, 26 groove 64 lower folding seat 18, 28 inner edge 70 mold 11