CN2857088Y - heat sink - Google Patents

Abstract

The utility model discloses a heat abstractor for in the computer system, include: a heat absorbing module contacting a heating element on a circuit board; the first heat conduction pipe is provided with a first end and a second end, and the first end is connected with the heat absorption module; the first heat radiator is connected with the second end of the first heat conducting pipe, and comprises a plurality of heat radiating fins and a positioning structure, wherein the heat radiating body is positioned in the computer system by the positioning structure, and part of the heat radiating fins extends out of the computer system. The design enlarges the heat dissipation area, increases the heat dissipation force, and has simple and firm fixing mode and convenient disassembly.

Description

heat sink

technical field

The utility model relates to a cooling device, in particular to a cooling device for electronic products.

Background technique

At present, modern technological products, especially electronic products with many sophisticated electronic parts, such as computers, DVD players, digital video players (DVR), loudspeakers, etc., the engine, the computer's central processing unit (CPU) Components such as DVD players, display cards, and computer casings will generate a lot of heat. In order to ensure the stable operation of the above machines, the heat dissipation function of electronic components becomes extremely important.

It has become an important equipment to use a radiator to remove heat to prevent mechanical devices or electronic products from being damaged due to overheating. At present, the common heat dissipation device used for various electronic parts is a heat dissipation device using the principle of heat conduction, which mainly includes a heat sink directly in contact with the heating components in the computer, a heat pipe connected to the heat sink, and a heat sink connected to the heat pipe. The outer surface of the heat sink is fin-shaped, which can increase the contact area with the air to improve the heat dissipation performance, and the condensate is sealed inside, and the condensate can be introduced into the heat-absorbing sheet through the heat-conducting pipe connected with it. The sheet absorbs the heat of the heat-generating component, and a temperature difference occurs at both ends of the heat-conducting tube. The condensate at the evaporation end of the heat-conducting tube connected to one end of the heat-absorbing sheet will quickly vaporize, and the heat will be brought to the condensation end connected to the radiator. The speed is very fast. After the liquid is condensed and liquefied by the heat sink, it flows back to the evaporation end through capillary action, and the heat sink transmits heat to the air through the heat dissipation of the fin-shaped surface, reducing the temperature of the condensate, and so on, continuously dissipating heat Tape to the colder end for heat dissipation. This heat dissipation method can effectively prevent heat-generating components from overheating to reduce work efficiency or even damage them.

As we all know, the larger the heat dissipation area, the better the heat dissipation effect. However, the heat dissipation device of the prior art uses fasteners to fix the heat absorbing sheet on the heating component, and the heat sink is directly fixed on the heat absorbing sheet. The radiator is relatively close, and the heat of the radiator cannot be fully dissipated into the air, which is not conducive to heat dissipation, and the existing fixing method is too cumbersome and inconvenient to disassemble, which causes inconvenience to use. Therefore, a heat dissipation device that can be safely and detachably fixed and can increase heat dissipation is a better choice.

Utility model content

The main purpose of the utility model is to provide a heat dissipation device that can be safely and detachably fixed and can increase heat dissipation.

Therefore, in order to achieve the above object, the utility model discloses a heat dissipation device used in a computer system, comprising: a heat absorbing module contacting a heating component on a circuit board; a first heat pipe having a first end and the second end, the first end is connected to the heat-absorbing module; a first radiator is connected to the second end of the first heat pipe, wherein the first radiator further includes a plurality of cooling fins and a positioning structure, by The positioning structure positions the cooling body in the computer system, and extends some cooling fins out of the computer system.

The utility model has the advantage of adding a series of positioning fins to the first cooling body, which not only enlarges the cooling area and increases the cooling force, but also uses a simple and firm fixing method, which is easy to disassemble. The arrangement of two heat sinks ensures sufficient heat dissipation, and the two heat sinks are respectively located on both sides of the circuit board, making reasonable use of the space.

Description of drawings

Below in conjunction with accompanying drawing and specific embodiment the utility model is described in further detail.

Fig. 1 is an exploded schematic diagram of the heat dissipation device of the present invention.

Fig. 2 is a front view of the assembled heat sink of the present invention.

Fig. 3 is a rear view of the assembled heat sink of the present invention.

Detailed ways

Fig. 1 to Fig. 3 are the disassembled schematic diagram, the assembled front view and the assembled rear view of the heat dissipation device of the present invention respectively, wherein the heat dissipation device is fixed on the computer circuit board, including: a heat dissipation module 11, two heat pipes 12 And heat-absorbing module 13. Wherein, the heat-absorbing module 13 is in contact with the heat-generating component 100 on the circuit board to absorb the heat emitted by it, and it includes two symmetrical heat-absorbing sheets 131, 133, two of which are located between the heat-absorbing sheets 131, 133 and respectively connected to The symmetrical heat pipe housings 135 , 137 and the cooling fins 20 are in contact with each other. Wherein, the heat-absorbing fins 131, 133 and the heat-conducting pipe housings 135, 137 are used to absorb the heat emitted by the heating component 100, and are made of high thermal conductivity materials, such as metal copper, and the tails of the heat-absorbing fins 131, 133 are respectively upwardly warped. To contact the heat sink 20, so as to conduct heat to the heat sink 20, the heat pipe housing 135, 137 seals the heat pipe 12 and the condensate therein, and the heat pipe housing 135, 137 slightly protrudes from the heat absorbing fin 131, 133 to facilitate the connection of the heat pipe 12, the heat sink 20 covers the heat absorbing fins 131, 133 and the heat pipe receivers 135, 137, and fixes the two to the circuit board, and the outer surface of the heat sink 20 includes some outwardly protruding fins , used for heat dissipation, there is also a housing protruding from the outer surface at the top, the housing is integrated with the heat sink 20, and can accommodate the heat pipe 12 and the heat pipe housing 135, 137 protruding from the heat absorbing fins 131, 133 The connection part plays a protective role, and the heat sink 20 is in contact with the raised parts of the heat absorbing fins 131, 133 to absorb the heat on the heat absorbing fins 131, 133 and dissipate the heat through several fins.

The two heat pipes 12 are of the same type. One end is respectively connected to the heat pipe housings 135 and 137. This end is the evaporation end (heating end). The inside of the heat pipe 12 is vacuum-sealed with condensate, which quickly turns into gas when heated. The cooling module 11 includes two cooling bodies 111, 113, the cooling body 111 and the heat absorbing module 13 are located on the same side of the circuit board, the cooling body 113 is located on the other side of the circuit board, and the cooling body 111 and the heat absorbing module 13 are located on the same side. opposite side. As shown in Figure 3, wherein radiator 113 is cuboid, and it comprises the fin of some protrusions, is used for dissipating heat, accommodates the back side that heat pipe 12 is fixed on fin, to seal the other end of heat pipe 12 (condensing end or cooling The two sides of the cooling body 113 respectively include two fixing plates, which are fixed in the corresponding receiving parts on the circuit board, so as to realize the fixing of the cooling body 113 and the circuit board.

The radiator 111 is in the shape of a cuboid, and includes a protruding positioning portion 300 on one side thereof. The positioning portion 300 is parallel to the circuit board, and is composed of a plurality of heat dissipation fins of the same size arranged side by side to form a rectangular shape, which can realize heat dissipation. The opposite side also includes several fins embedded in the heat sink 111 , and the other end (condensing end or cooling end) of the heat pipe 12 is inserted into the heat sink to realize heat transfer. In order to securely position the radiator 111 on the circuit board, as shown in FIG. The buckle is designed corresponding to the positioning part 300, including a rectangular card hole 400 for accommodating the fins of the positioning part 300 and two elastic cards 500 located on both sides of the card hole 400. The elastic cards 500 are similar in shape to the fins of the positioning part 300 . When assembling, insert the positioning portion 300 of the heat sink 111 into the rectangular locking hole 400 for receiving buckles, and then the two elastic cards 500 clamp the fins to realize the movable positioning between the circuit board and the heat sink 111 .

The working principle of the heat dissipation device of the present utility model is: as the temperature of the heating component 100 rises, the heat absorbing fins 131 and 133 in the heat absorbing module 13 absorb the heat to themselves, and dissipate heat by virtue of the heat sink 20, and the heat pipe housing The condensate in 135 and 137 quickly absorbs heat after being heated, and becomes gas and evaporates into the radiators 111 and 113 of the heat dissipation module 11 through the heat pipe 12, and the gas contacts the condensed liquid in the radiator through the heat pipe 12 to release latent heat After completing the heat transfer task, it condenses again into a liquid state, then flows back to the heat source, and continuously reciprocates. At the same time, the fins of the positioning part 300 of the radiator 111 and the fins of the radiator 113 all utilize the external air to dissipate the internal condensate. The temperature is further reduced, thereby achieving a good heat dissipation effect.

The design between the positioning part 300 of the heat sink 111 of the heat dissipation device of the present invention and the buckle on the circuit board is not limited to the above-mentioned structure, and can also be connected through other elastic or screw positioning methods.

In the heat dissipation device described in the embodiment of the present invention, a series of fins for positioning are added to one of the heat dissipation bodies, which enlarges the heat dissipation area and increases the heat dissipation intensity. Moreover, the positioning method used is simple and firm, and is easy to disassemble. The heat dissipation device of the utility model adopts the setting of two heat sinks, which ensures sufficient heat dissipation. The two heat sinks are respectively located on both sides of the circuit board, which makes reasonable use of the space.

While the invention has been described in conjunction with specific embodiments thereof, other changes and modifications and other uses will be apparent to those skilled in the art. Therefore, the protection scope of the utility model is not limited by the above description, but only limited by the claims of the utility model.

Claims (6)

1. a heat abstractor is used for computer system, it is characterized in that, comprising:

One heat-absorbing model contacts with a heat generating component on the circuit board;

One first heat pipe has first end and second end, and this first end links to each other with this heat-absorbing model; And

One first radiator, link to each other with second end of this first heat pipe, wherein this first radiator more comprises some radiating fins and a location structure, relies on this location structure that this radiator is positioned in the computer system, and makes the some of these some radiating fins extend the computer system outside.

2. heat abstractor as claimed in claim 1 is characterized in that, wherein more comprises a heat radiator, and this heat radiator is arranged at this heat-absorbing model.

3. heat abstractor as claimed in claim 1 or 2, it is characterized in that, wherein more comprise one second radiator and one second heat pipe, this second heat pipe has the 3rd end and the 4th end, the 3rd end of this second heat pipe links to each other with this heat-absorbing model, and the opposite side that the 4th end extends to circuit board links to each other with this second radiator.

4. heat abstractor as claimed in claim 3 is characterized in that, wherein this second radiator comprises a fixed part, and the resettlement section that this fixed part sees through corresponding setting on this circuit board is fixed on this circuit board.

5. heat abstractor as claimed in claim 1 is characterized in that wherein this heat absorbing sheet is made by high conductivity material.

6. heat abstractor as claimed in claim 4 is characterized in that, wherein the resettlement section on this circuit board is divided into a buckle, and it comprises that the hole clipping and of this location structure of accommodating this first radiator clamps the elastic card of the fin of this location structure.

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