M354784 八、新型說明： 【新型所屬之技術領域】 本創作係有關於-種記憶體散熱裝置之連結平台 尤指一種可與記憶贿熱裝置緊密結合，且能藉由賴平台 1播 上之散熱單兀，來以增加記憶體散熱功效者。 【先前技術】 按’現行電腦的應用程面越來越廣，除了原有的 用多媒體影音娛樂上，致此使得對電腦中的記憶體容量 能也大巾I提高’但由於記憶體中的晶片在二 _盛下容減生高溫，若不適時散齡容㈣溫度過高= 二=目㈣憶，_方式’是由兩相對稱的散熱片其間夾 作時所產生耐观 承上所述，f知雜體散糾雜_散敵掀 下列缺失：^ -、在現今日新月異科技τ，電腦處理效能大幅提高，相對 的溫度越來越高’上述此種散熱構造，雖能達 ΡΜ二2ί熱之功效’但並不具有較大散^"面積，故散熱效果有 執隨因溫度過高而概，若想提昇習知記憶體散 勒:功效’最快速的辦法就是在習知記憶體散熱壯加裝其 .、、、、置，但疋電腦記憶體上的空間有限，要進行這樣的加裝 當困難，所以如何能方便的在習知記憶體散熱片上加 二玉政熱裝置’且加裝散熱裝置能有效的增進習知記憶體散熱 、政熱效能，成為當今業界急需解決之難題。 爰是’本創作人有鑑於此，逐利用本身的學理知識及多年的 5 M354784 實務經驗，積赌事研纽反覆職，終於研料— 且應用範圍更廣且符合產業利用價值之本創作。 只 【新型内容】 △本創叙主要目的，在於提供—觀憶體散絲置之連結平 。結構，該連結平台結構可與記髓散齡置緊密結合，且 由連結平台結構上之散鮮元，來明加記憶體散熱功效者。曰 為了達到上述目的，補作記健散錄置之連結平台結構 )’係肋與記賴散歸置緊密結合，包括有：-基座，係 麵賴裝置上部，且财—與記憶體散絲置上部契 “了 &面，二扣具’係具有與基座二側樞接之-連結部，以及 向Γ延伸出的二側板，雌等側板之自由端上分別具 、、” &部，减使連結平台結構所組成之賴單元，可盘該吃 3政録置緊密結合，明加記憶體散熱功效，進而達到上述 【實施方式】 ，隹ir吏魅委員能對本創作之目的、特徵、及功能，有更 進一步瞭解，兹舉-較佳實施例並配合圖式詳細說明如下： 置之閱第1圖，係為本創作第一實施例與記憶體散熱裝 ^播圖，本創作係為—種記憶體散熱裝置之連結平 ^=(1) ’係用以與記憶體散歸置緊密結合，其包括有一基 瓜丄及二扣具2，其中： 底部^座1 ’係為—矩形體結合於記憶體散熱裝置3上部，且 =;、=射己體餘裝置3上部契合之結合面η，並於該 另者氣孔12及在纽12周沿設複數狐13， 基座1亦可為本創作第二實施例之立體分解示意圖，該 為-平整面不開任何氣孔i 2，且該_丄可依記憶 M354784 體散熱裝置3之形狀大小作適當調整。 、^ °亥扣具2，係具有與基座1二側樞接之一連結部21，以及 =連結部21向下延伸出的二側板2 2，且該對側板2 2之自 =上刀別具有—結合部2 3，其中本實施例中該結合部2 3係 為一勾板型態’爾記憶體散餘置3二側分職有勾槽3 等扣具2之結合部2 3分別卡扣於勾槽3 1内，藉此使連 、=j構1Q所組成之散熱單元4，可與該記憶體散熱裝置3 冢岔、纟°合，以增加記憶體5散熱功效者。 ，前述本創作實施射，該扣具2之連結部2丄係為折邊， 扣具2—體成型，並可過螺鎖、鉚接或黏合之固定方式與 土座1穩固結合，在本實施例中該基座工二側各設有一穿孔 4 ’ =該連結部2工上則設有對應穿孔丄4之鎖孔24，以螺鎖 之固定方式而穩固結合該扣具2於該基座1。 ’、 立^者，在本創作之連結平台結構更包括至少-散熱單元4， 基座1上或在本解之第六實施例枝置在結合平台 =1 0與記憶體散熱裝置3之間（如第9圖），而該散熱單元 、水冷式散熱11、轉魏熱11或其他相似功能 請參閱第1圖至第5圖在本創作第—實施例中該 風扇’及在第二實施例中該散熱單元4係為 ^式政熱器，贿散熱單元4之各端角上設有圓孔41，而該 設有對應圓孔41之螺孔13，以螺鎖之固定方式‘ 熱單元4於該基座1上；同理，請參閱第5圖為本 =第二心麵，在第三實_愧散鮮元4 於該基^上設有麵形成之複數散熱鰭片，且該基座^ 二？ί ΐ合面ΐ1 ’該結合面11恰可契合於記憶體散熱裝 和藉以將記憶體運作所產生之熱量傳導至散熱單元4 7 M354784 上，再經由對流效應而散發至外面，故能藉由連結平台結構1 〇 上之散熱單元4，來增加記憶體散熱功效。 續上所述，請參閱第2圖、第4圖及配合前圖所示，係為本 創作之使用狀態示意圖，其中本創作使用時，先將該扣具2樞接 於該基座1二側，再後將散熱單元4固設於基座i上，最後將該 扣具2之結合部2 3卡扣於記憶體散熱裝置3二側之勾槽31， 即元成組裝，因此該連結平台結構1◦可與記憶體散熱裝置3緊 密結合，且能藉由連結平台結構i 〇上之散熱單元4，來以增加 記憶體散熱功效。 承上所述，請參閱前圖及第6圖至第8圖所示，係為本創作 第四實施例與記憶體散熱裝置之立體分解示意圖、本創作第四實 鈀例與記憶體散熱裝置之使用狀態示意圖及本創作第五實施例與 記憶體散熱裝置之立體分解示意圖，其中第6圖所示，該扣具2' 係與基座1之二側一體成型，該基座;L之二側向下延伸出的二側 板2 2，且該對側板2 2之自由端上分別具有一結合部23 ,其 中該結合部2 3係為一勾板型態，可扣合於記憶體散熱裝置3二 側之勾槽31上，另§亥基座1上固設至少一散熱單元4，而該散 熱單元4係可散熱風扇（如第6圖）、水冷式散熱器（如第8 之型態。 請參閱前圖及第9圖所示，係為本創作第六實施例與記憶體 散熱裝置之立體分解示意圖，其中第9圖所示，該扣具2係與式 座1之二側一體成型，且於該基座i上開設有一開口 i 5，/而^ 連結平台結構1〇與記憶體散熱裝置3之間可夾置至少一散熱單 兀4，在本實施例中該散熱單元4係為鋁擠型散熱器之型態，係 於該基座1上設有壓擠形成之複數散熱鰭片，且該散熱單元4之 散熱鰭片於夾置時可經由該基座i之開口 i 5顯露於外部，使謗 8 M354784 元柯以將熱·發至外部，另該基幻底部具有一結人 ’該結合面11恰可契合於記憶體散熱裝置3上 : 靖w由散= =而，發至外部，故麟由連結平台結射Q上之賴單元4、: 進一步增加記憶體散熱功效。 ^ 综上所陳，本創作實為不可多得之新型創作產品，其確 ，預期之功效，崎決習知之缺失，極具實祕及經濟性之價值， 使】具^穎性與進步性之功效，对請前未見於刊物亦未公開 =^合新料利讀穎、妙料件，纽 予賜准，實感德便。 心 上述實施例僅例示性說明本創作之原理及 神及㈣下’對上述倾规行修倾改變。因此，本創作之權 利保護範圍’應如後狀_請翻範圍所列。 【圖式簡單說明】 第1圖係為本創作第—實施例與記㈣散餘置之立體分解示意 圖0 一 態示意 第2圖係為本創料-實麵與記，散齡置之使用狀 圖。 第 圖 第二實施例與記憶體散熱裝置之立體分解示意 第4圖係為本創作第二實施例與記憶體散齡置之使用狀態示竟 圖。 第5圖係為本解第三實施顺纖體散熱裝置之立體分解示意 圖。 ^ 9 M354784 ΐ 6圖係為本創作細實施顺賴體散熱敍之立體分解示意 ^圖係林創作細實施例與記憶體散絲置之使用狀態示意 Ξ 8圖係為本_第五實_與記賴散絲置之續分解示意 =9圖係為摘作第六實_與記爐散齡置之立體分解示音 【主要元件符號說明】 基座.· 結合面. 螺孔· · 開口 ·. 扣具.· 側板.· 鎖孔·· S己憶體散熱裝置 散熱單元·.. 記憶體.... 1 連結平台結構·.. 11 $L^L· *···... 13 15 穿孔··..... 2 連結部·..... 2 2 24 結合部...... 3 勾槽···.... 4 5 圓孔....... 024 2 4 10M354784 VIII. New Description: [New Technology Field] This creation department has a connection platform for memory heat sinks, especially a kind of memory that can be closely integrated with the memory bribe device, and can be cooled by the platform 1 Single, come to increase the memory cooling effect. [Prior Art] According to the application of the current computer, the application is becoming more and more extensive, in addition to the original use of multimedia audio and video entertainment, so that the memory capacity of the computer can also be improved, but due to the memory The wafer is reduced in temperature at the second level, if it is not suitable, the temperature is too high (4) the temperature is too high = 2 = the head (four) recall, the _ way 'is formed by the two relative heat sinks Said, f knows the miscellaneous body to eliminate the miscellaneous _ scattered enemy 掀 the following missing: ^ -, in today's new moon technology τ, the computer processing efficiency is greatly improved, the relative temperature is getting higher and higher 'the above heat dissipation structure, although it can reach two 2 热 heat effect 'but does not have a large scattered ^ " area, so the heat dissipation effect is dependent on the temperature is too high, if you want to improve the conventional memory scatter: the most effective way is to use the memory The heat dissipation is strong, and it is installed, but the space on the computer memory is limited. It is difficult to carry out such installation, so how to conveniently add the two jade political heat device to the conventional memory heat sink. And the installation of heat sink can effectively improve The knowledge of memory heat dissipation and political efficiency has become an urgent problem in the industry today. This is the creator of this creator, in view of the use of his own academic knowledge and years of 5 M354784 practical experience, gambling research and research, and repeated research, and finally research - and a wider range of applications and in line with the value of industrial use. Only [new content] △ The main purpose of this creation is to provide a connection between the body and the body. The structure, the structure of the joint platform can be closely combined with the memory of the core, and the light-emitting element on the structure of the joint is used to express the heat dissipation effect of the memory. In order to achieve the above objectives, the structure of the link platform for the record of the record of the record is based on the combination of the ribs and the vestiges, including: the pedestal, the upper part of the device, and the memory and memory. The upper part has a & face, the two buckles have a joint portion that is pivotally connected to the two sides of the base, and two side plates that extend toward the raft, and the free ends of the female side plates respectively have a &,; In order to reduce the structure of the connected platform structure, it can be combined with the three government records, and the heat dissipation effect of the memory can be achieved, and then the above-mentioned [implementation] can be achieved. The features and functions are further understood. The preferred embodiment is described in detail below with reference to the following drawings: FIG. 1 is a first embodiment of the present invention and a memory heat dissipation device, The creation department is a kind of memory heat sink connection ^^(1) ' is used to closely combine with the memory bulk placement, which includes a base melon and two buckles 2, wherein: the bottom seat 1 ' a rectangular body is coupled to the upper portion of the memory heat sink 3, and =; And the combination surface η of the upper portion of the device 3 is disposed, and the plurality of foxes 13 are disposed on the other of the air holes 12 and the periphery of the button 12, and the pedestal 1 can also be a schematic exploded view of the second embodiment of the present invention. The flat surface does not open any air holes i 2 , and the _ 丄 can be appropriately adjusted according to the shape and size of the memory M354784 body heat sink 3 . And the hinge device 2 has a connecting portion 21 pivotally connected to the two sides of the base 1, and a two side plate 2 2 extending downward from the connecting portion 21, and the pair of side plates 2 2 are self-aligning In the embodiment, the joint portion 2 3 is a hook plate type, and the joint portion 2 3 is a joint portion 2 of the buckle 2 such as a hook groove 3 They are respectively fastened in the hook groove 3 1 , so that the heat dissipating unit 4 composed of the connection and the frame structure 1Q can be combined with the memory heat sink 3 to increase the heat dissipation effect of the memory 5 . In the present invention, the connecting portion 2 of the buckle 2 is a folded edge, and the buckle is formed in a 2-body shape, and can be stably combined with the soil seat 1 by a screwing, riveting or bonding fixing manner. In the example, the two sides of the pedestal are provided with a perforation 4'. The connecting portion 2 is provided with a locking hole 24 corresponding to the perforating cymbal 4, and the locking device 2 is firmly coupled to the pedestal by a screw locking manner. 1. ', 立 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , (As shown in Figure 9), and the heat dissipating unit, water-cooled heat dissipating 11, rotating heat 11 or other similar functions, please refer to Figures 1 to 5 in the present invention - in the second embodiment In the example, the heat dissipating unit 4 is a type of heat exchanger, and each of the end corners of the bribe heat dissipating unit 4 is provided with a circular hole 41, and the screw hole 13 corresponding to the circular hole 41 is fixed by a screw lock. The unit 4 is on the base 1; for the same reason, please refer to FIG. 5 for the second second core surface, and the third solid _ 愧 fresh element 4 is provided with a plurality of heat dissipation fins formed on the surface. And the pedestal ^ two? ί ΐ ΐ ' 1 'The joint surface 11 can fit into the memory heat sink and the heat generated by the operation of the memory is transmitted to the heat sink unit 4 7 M354784, and then radiated to the outside through the convection effect, so Connect the heat sink unit 4 on the platform structure 1 to increase the heat dissipation effect of the memory. Continued, please refer to Figure 2, Figure 4 and the previous figure. It is a schematic diagram of the use state of the creation. In the use of this creation, the buckle 2 is first pivoted to the base 1 On the side, the heat dissipating unit 4 is fixed on the base i, and finally the joint portion 2 3 of the clip 2 is fastened to the hook groove 31 on both sides of the memory heat sink 3, that is, the assembly is assembled, so the connection The platform structure 1 can be closely coupled with the memory heat sink 3, and can increase the heat dissipation effect of the memory by connecting the heat dissipation unit 4 on the platform structure i. As described above, please refer to the previous figure and the sixth figure to the eighth figure, which is a three-dimensional exploded view of the fourth embodiment and the memory heat sink of the present creation, the fourth real palladium example and the memory heat sink of the present invention. FIG. 6 is a schematic exploded view of the fifth embodiment of the present invention and the memory heat sink, wherein the buckle 2' is integrally formed with the two sides of the base 1, the base; The two side plates 2 2 extending downward from the two sides, and the free ends of the pair of side plates 2 2 respectively have a joint portion 23, wherein the joint portion 23 is a hook plate type, which can be engaged with the heat dissipation of the memory. At least one heat dissipating unit 4 is fixed on the hook groove 31 on the two sides of the device 3, and the heat dissipating unit 4 is a heat dissipating fan (such as FIG. 6) and a water-cooled heat sink (such as the eighth Please refer to the previous figure and FIG. 9 , which is a three-dimensional exploded view of the sixth embodiment and the memory heat sink of the present invention, wherein the buckle 2 is the same as the seat 1 The side is integrally formed, and an opening i 5 is opened on the base i, and the connection platform structure 1〇 and memory At least one heat dissipating unit 4 can be interposed between the heat dissipating devices 3. In the embodiment, the heat dissipating unit 4 is in the form of an aluminum extruded heat sink, and the base 1 is provided with a plurality of heat sinks formed by pressing. a fin, and the heat dissipating fin of the heat dissipating unit 4 can be exposed to the outside through the opening i 5 of the susceptor i when being sandwiched, so that the 谤8 M354784 yuan Ke sends the heat to the outside, and the base bottom has A knotted person's joint surface 11 can fit on the memory heat sink 3: 靖 w by 散 = =, and sent to the outside, so the lining is connected by the joint platform Q on the unit 4,: further increase the memory The heat dissipation effect. ^ In summary, this creation is a rare new creation product. It is indeed the expected effect, the lack of good understanding, the value of the real secret and the economic value. And the effect of progress, not seen in the publication before the publication is not public = ^ new materials to read Ying, wonderful materials, New to give priority, real sense of virtue. The above examples are only illustrative of the principle of this creation and God and (4) under the 'change of the above-mentioned dumping rules. Therefore, the scope of protection of this creation It should be as follows: please refer to the range. [Simplified description of the drawing] The first picture is the three-dimensional decomposition diagram of the first embodiment and the fourth part of the creation. The first picture is the original material. - The solid surface and the record, the use of the scattered figure. The second embodiment of the second embodiment and the memory heat sink, the three-dimensional decomposition diagram 4 is the second embodiment of the creation and the use of the memory Fig. 5 is a three-dimensional exploded view of the third embodiment of the slimming body heat sink. ^ 9 M354784 ΐ 6 is a three-dimensional decomposition of the heat dissipation of the creation of the design. The state of use of the embodiment and the memory filament is shown in the figure Ξ 8 is the basis of the _ fifth real _ and the continuation of the decomposition of the 散 散 = = = = = = = = = = = = = = = = = = = = = = = The stereoscopic decomposition sound [main component symbol description] pedestal. · Joint surface. Screw hole · · Opening ·. Buckle. · Side plate. · Keyhole · · S memory body heat sink cooling unit ·.. Memory. ... 1 Linking platform structure·.. 11 $L^L· *···... 13 15 Piercing··..... 2 Connecting section·..... 2 2 24 Joints... 3 Hooks···.... 4 5 Round holes.... 024 2 4 10