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TWI913345B - 用於隨機性光阻厚度缺陷之預測之方法及系統及電腦程式產品 - Google Patents

用於隨機性光阻厚度缺陷之預測之方法及系統及電腦程式產品

Info

Publication number
TWI913345B
TWI913345B TW110139971A TW110139971A TWI913345B TW I913345 B TWI913345 B TW I913345B TW 110139971 A TW110139971 A TW 110139971A TW 110139971 A TW110139971 A TW 110139971A TW I913345 B TWI913345 B TW I913345B
Authority
TW
Taiwan
Prior art keywords
stochastic
prediction
computer program
program product
photoresist thickness
Prior art date
Application number
TW110139971A
Other languages
English (en)
Other versions
TW202232231A (zh
Inventor
安娜托利 布羅維
蓋 帕西
白昆倫
佩拉迪 悟卡達拉
張草
約翰 Ｓ 格維斯
李笑晗
克雷格 希金斯
Original Assignee
美商科磊股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/337,373 external-priority patent/US12406197B2/en
Application filed by 美商科磊股份有限公司 filed Critical 美商科磊股份有限公司
Publication of TW202232231A publication Critical patent/TW202232231A/zh
Application granted granted Critical
Publication of TWI913345B publication Critical patent/TWI913345B/zh

Links

TW110139971A 2020-10-28 2021-10-28 用於隨機性光阻厚度缺陷之預測之方法及系統及電腦程式產品 TWI913345B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202063106356P 2020-10-28 2020-10-28
US63/106,356 2020-10-28
US17/337,373 2021-06-02
US17/337,373 US12406197B2 (en) 2020-10-28 2021-06-02 Prediction and metrology of stochastic photoresist thickness defects

Publications (2)

Publication Number Publication Date
TW202232231A TW202232231A (zh) 2022-08-16
TWI913345B true TWI913345B (zh) 2026-02-01

Family

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200525674A (en) 2003-10-28 2005-08-01 Timbre Tech Inc Azimuthal scanning of a structure formed on a semiconductor wafer
US20060199286A1 (en) 2005-03-07 2006-09-07 Yoshiyuki Sato System for reviewing defects, a computer implemented method for reviewing defects, and a method for fabricating electronic devices
WO2019162346A1 (en) 2018-02-23 2019-08-29 Asml Netherlands B.V. Methods for training machine learning model for computation lithography
WO2019238372A1 (en) 2018-06-15 2019-12-19 Asml Netherlands B.V. Machine learning based inverse optical proximity correction and process model calibration

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200525674A (en) 2003-10-28 2005-08-01 Timbre Tech Inc Azimuthal scanning of a structure formed on a semiconductor wafer
US20060199286A1 (en) 2005-03-07 2006-09-07 Yoshiyuki Sato System for reviewing defects, a computer implemented method for reviewing defects, and a method for fabricating electronic devices
WO2019162346A1 (en) 2018-02-23 2019-08-29 Asml Netherlands B.V. Methods for training machine learning model for computation lithography
WO2019238372A1 (en) 2018-06-15 2019-12-19 Asml Netherlands B.V. Machine learning based inverse optical proximity correction and process model calibration

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