TWI907008B - Gas-liquid dual cooling three-dimensional heat dissipation device - Google Patents

Abstract

A gas-liquid dual cooling three-dimensional heat dissipation device includes a vapor chamber module and a water-cooling head. The vapor chamber module includes a vapor chamber. The vapor chamber includes a first cover plate, a second cover plate and a side wall surrounding the first cover plate and the second cover plate to form a hollow chamber therein. The first cover plate is used to contact a heat source, and the water-cooling head is fixed on the second cover plate of the vapor chamber.

Description

Gas-liquid dual-cooling three-dimensional heat dissipation device

This invention relates to a heat dissipation device. In particular, it relates to a gas-liquid dual-cooling three-dimensional heat dissipation device.

With the advancement of technology, electronic products have become increasingly widespread, gradually changing the lifestyles and work patterns of many people. As computer computing power continues to increase, temperature control of electronic components such as central processing units and graphics chips has become increasingly important.

Electronic components such as central processing units (CPUs) and graphics chips generate heat during operation and require proper cooling to achieve optimal performance. A suitable air-liquid dual-cooling system configuration will significantly impact the performance of electronic devices, ensuring that these components operate at ideal temperatures.

Furthermore, as electronic devices become smaller and smaller while the number of cores in their computing chips continues to increase, the amount of heat generated is also increasing.

Therefore, effectively improving the heat dissipation efficiency of the heat dissipation device to reduce the operating temperature of the computing chip will help improve the overall operating efficiency of the electronic device.

This invention is intended to provide a simplified summary of the disclosure to enable the reader to have a basic understanding of it. This invention is not a complete overview of the disclosure and is not intended to identify important/key elements of the embodiments of the invention or to define the scope of the invention.

One of the objectives of this invention is to provide a gas-liquid dual-cooling three-dimensional heat dissipation device, which can improve heat dissipation efficiency and thus improve the overall working efficiency of electronic devices.

To achieve the above objectives, one embodiment of this disclosure provides a gas-liquid dual-cooling three-dimensional heat dissipation device comprising a vapor chamber module and a water cooling head. The vapor chamber module includes a vapor chamber plate, which includes a first cover plate, a second cover plate, and a side wall surrounding the first cover plate and the second cover plate to form a hollow cavity. The first cover plate is used to contact a heat source, and the water cooling head is fixed to the second cover plate of the vapor chamber plate.

In some embodiments, the vapor chamber module further includes a plurality of first heat pipes extending outward from the sidewall of the vapor chamber.

In some embodiments, the vapor chamber module further includes a plurality of second heat pipes connected to a second cover plate of the vapor chamber, and the second heat pipes are in fluid communication with the hollow chamber.

In some embodiments, each second heat pipe includes a connecting portion and a heat dissipation portion. The connecting portion is connected to the second cover plate of the heat spreader, and the heat dissipation portion is connected to the connecting portion and is parallel to the first heat pipe.

In some embodiments, the heat spreader module further includes a heat dissipation fin module, and the first heat pipe and the second heat pipe pass through the heat dissipation fin module.

In some embodiments, the water block further includes a plurality of heat dissipation fins and a cover, the heat dissipation fins being formed on a second cover of a heat spreader, and the heat dissipation liquid of the water block flowing through the heat dissipation fins, while the cover is disposed on the heat dissipation fins.

In some embodiments, the water block further includes a fixing part formed between the second cover of the vapor chamber and the heat dissipation fins.

In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device further includes a plurality of first fans mounted on the water block and the heat dissipation fin module.

In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device further includes a second fan installed below the heat dissipation fin module.

In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device further includes a top cover and a back cover. The top cover includes a plurality of openings, and the vapor chamber module and the water cooling head are installed between the top cover and the back cover, with the first fan preferably aligned with each opening.

In some embodiments, the air-liquid dual-cooling three-dimensional heat dissipation device further includes a radiator, a hot water pipe, and a cold water pipe. The hot water pipe and the cold water pipe are respectively connected between the water cooling head and the radiator.

In some embodiments, the water block further includes a baffle and an impeller. The baffle is installed between the heat sink and the cover, while the impeller is installed above the baffle.

In some embodiments, the baffle includes two inlets and one outlet. The two inlets are located on opposite sides of the baffle, while the outlet is located in the middle of the baffle and aligned with the impeller.

In some embodiments, the cover includes an arcuate groove, with the two ends of the arcuate groove aligned with the water inlet.

In some embodiments, the heat sink includes a water collection groove.

In some embodiments, the water collection groove includes an elongated recessed area and a central circular recessed area. The elongated recessed area extends through the heat dissipation fin, while the central circular recessed area is formed in the middle of the elongated recessed area and aligned with the outlet of the baffle.

In some embodiments, the heat sink further includes two baffles located on the outermost side of the heat sink to guide the heat dissipation liquid to move to both ends of the heat sink.

Therefore, the aforementioned gas-liquid dual-cooling three-dimensional heat dissipation device can utilize a heat spreader to directly contact the heat source and a water cooling head to directly reduce the operating temperature of the heat spreader. Furthermore, the cooling liquid in the water cooling head can directly contact the surface of the heat spreader, effectively improving the heat dissipation efficiency of the device. In addition, the gas-liquid dual-cooling three-dimensional heat dissipation device disclosed in this invention utilizes heat pipes connected to the heat spreader via fluid, effectively improving the heat dissipation efficiency and capacity of the device, reducing the operating temperature of the computing chip, and thereby improving the overall operating efficiency of the electronic device.

The following detailed description uses examples and accompanying drawings. However, these examples are not intended to limit the scope of this disclosure, and the description of the structural operation is not intended to limit the order of execution. Any device with equivalent functionality produced by the recombination of components falls within the scope of this disclosure. Furthermore, the drawings are for illustrative purposes only and are not drawn to scale. For ease of understanding, the same or similar components will be indicated by the same symbols in the following description.

Furthermore, the terms used throughout this specification and the scope of the patent application, unless otherwise specified, generally have their ordinary meaning in the context of this art, the content of this disclosure, and the specific content. Certain terms used to describe this disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing this disclosure.

In the implementation method and scope of the patent application, unless otherwise specified in the text, "a" and "the" may refer to a single or multiple entities. The numbers used in the steps are only used to indicate the steps for illustrative purposes, and are not used to restrict the order or implementation method.

Secondly, the terms used in this article, such as "contains," "includes," "has," and "contains," are all open-ended terms, meaning that they include but are not limited to.

Figure 1 is a three-dimensional schematic diagram of a gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present invention, and Figure 2 is an exploded schematic diagram of some of its components. Figure 3 is a three-dimensional schematic diagram of the vapor chamber and heat pipes connected to the vapor chamber by fluid in the gas-liquid dual-cooling three-dimensional heat dissipation device. Furthermore, Figure 4 is an exploded schematic diagram of the water cooling head of the gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present invention, and Figure 5 is a schematic diagram of some components of the water cooling head from another angle.

Referring to Figures 2 and 3, as shown, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 includes a heat spreader module 110 and a water cooling head 120. The heat spreader module 110 includes a heat spreader 112, which includes a first cover plate 316, a second cover plate 312, and a side wall 314. The side wall 314 surrounds the first cover plate 316 and the second cover plate 312 to form a hollow cavity 318, and the first cover plate 316 is used to contact a heat source 134. The water cooling head 120 is fixed to the second cover plate 312 of the heat spreader 112.

In some embodiments, the heat source 134 may be a central processing unit chip, a graphics chip and/or any electronic component that may be mounted on the circuit board 132 to form an electronic device 130, such as a motherboard, graphics card or other electronic device, all of which are within the spirit and scope of protection of the present invention.

In some embodiments, the sidewall 314 preferably surrounds vertically between the first cover plate 316 and the second cover plate 312.

In addition, the first heat pipe 114 is connected to the side wall 314 of the heat spreader 112 and extends outward, and the first heat pipe 114 is in fluid communication with the hollow cavity 318.

In some embodiments, the first heat pipe 114 is connected to the side wall 314 of the heat spreader 112 and extends horizontally outward.

In some embodiments, the first cover plate 316 is a heat-absorbing metal plate, such as a copper plate, aluminum plate, stainless steel plate or other metal plate, to directly or indirectly contact a heat source 134. The second cover plate 312 is preferably a heat-dissipating metal plate, such as a copper plate, aluminum plate, stainless steel plate or other metal plate, to cool the heat dissipation fluid in the heat spreader 112, but the invention is not limited thereto.

Furthermore, it is worth noting that the heat dissipation fluid in the heat spreader 112 can be guided to the outer side of the heat spreader 112 via the first heat pipe 114, through the hollow cavity 318 of the heat spreader 112, thereby effectively improving the cooling efficiency and heat dissipation capacity of the gas-liquid dual-cooling three-dimensional heat dissipation device 100.

In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a second heat pipe 116 connected to the second cover plate 312 of the heat spreader 112, and the second heat pipe 116 is also fluid-connected to the hollow cavity 318.

In some embodiments, the second heat pipe 116 includes a connection portion 322 and a heat dissipation portion 324. The connection portion 322 is directly connected to the second cover plate 312 of the heat spreader 112, while the heat dissipation portion 324 is connected to the connection portion 322 and extends outward from the heat spreader 112, for example, horizontally outward.

In some embodiments, the heat dissipation section 324 is preferably parallel to the first heat pipe 114.

In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a heat dissipation fin module 118, which is disposed on the outer side of the heat spreader 112, and the heat dissipation part 324 of the second heat pipe 116 and the first heat pipe 114 pass through the heat dissipation fin module 118. In other words, the first heat pipe 114 extends outward from the side wall 314 of the heat spreader 112 and is disposed in the heat dissipation fin module 118, while the second heat pipe 116 extends vertically outward from the second cover plate 312 of the heat spreader 112 and then forms a bend of about 90 degrees so that the heat dissipation part 324 of the second heat pipe 116 is also disposed in the heat dissipation fin module 118. Preferably, the heat dissipation part 324 of the second heat pipe 116 is parallel to the first heat pipe 114 to improve the cooling efficiency and heat dissipation capacity of the gas-liquid dual-cooling three-dimensional heat dissipation device 100.

Therefore, the first heat pipe 114 and the second heat pipe 116 of the gas-liquid dual-cooling three-dimensional heat dissipation device 100 of the present invention are fluidly connected to the heat spreader 112.

In some embodiments, the water block 120 further includes a fixing portion 121 and a plurality of heat dissipation fins 123. The fixing portion 121 is formed on or fixed to the second cover plate 312 of the heat spreader 112, and the heat dissipation fins 123 are formed on the fixing portion 121. In some embodiments, the fixing portion 121 includes a recessed cavity 125, and the heat dissipation fins 123 are formed in the recessed cavity 125 of the fixing portion 121. It is worth noting that there is a hollow groove 124 below the cover body 122 of the water block 120, and fluid is connected to the hot water outlet 126 and the cold water inlet 128, so that the heat dissipation liquid can enter the hollow groove 124 below the cover body 122 through the cold water inlet 128, and flow through the heat dissipation fins 123 to cool the heat spreader 112, and then the heat dissipation liquid flows out from the hot water outlet 126.

Referring also to Figure 1, in some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a heat sink 600, which is connected to the hot water outlet 126 of the water cooling head 120 via a hot water pipe 610 and to the cold water inlet 128 of the water cooling head 120 via a cold water pipe 620. The heat sink 600 is used to further reduce the operating temperature of the heat spreader 112, so that the heat dissipation liquid circulates on the surfaces of the heat sink 600, the water cooling head 120 and the heat spreader 112, thereby reducing the operating temperature of the heat source 134.

Referring to Figures 4 and 5, as shown in the figures, the water block 120 further includes a baffle 420 and an impeller 410. The baffle 420 is installed between the heat dissipation fins 123 and the cover 122, while the impeller 410 is installed on one side of the baffle 420, for example, on the top. When the heat dissipation liquid of the water cooling head 120 enters the arc-shaped groove 127 through the cold water inlet 128, the heat dissipation liquid flows along the arc-shaped groove 127 to both ends of the arc-shaped groove 127, and passes through the water inlets 422 on both sides of the partition 420 in the direction of arrow 401, and enters the two sides of the heat dissipation fin 123, for example, the two sides of the recessed cavity 125. Then, from both ends of the heat dissipation fin 123, it flows towards the middle of the heat dissipation fin 123 through arrow directions 501 and 502 respectively, to remove the heat on the heat dissipation fin 123. Then, it flows upward through arrow direction 402, through the water outlet 424 of the partition 420, is drawn by the impeller 410, and discharged through the hot water outlet 126 of the water cooling head 120.

In some embodiments, the heat sink 123 further includes a water collection groove 510 formed in the middle of the heat sink 123. The water collection groove 510 includes an elongated recessed area 512 that runs through the middle of the heat sink 123 and extends to both sides. In the middle of the elongated recessed area 512, a central circular recessed area 514 is formed, which is preferably aligned with the outlet 424 of the baffle 420. The central circular recessed area 514 is used to collect the heat dissipation liquid, so that the heat dissipation liquid is drawn by the impeller 410 through the outlet 424 of the baffle 420 and then discharged through the hot water outlet 126 of the water cooling head 120.

In some embodiments, the impeller 410 is aligned with the outlet 424 of the baffle 420 and with the central circular recess 514.

In some embodiments, the heat sink 123 further includes baffles 129 on both sides, located on the outermost side of the heat sink 123, to guide the heat dissipation liquid to move to both ends of the heat sink 123, and then flow to the middle of the heat sink 123 via arrow directions 501 and 502.

In some embodiments, the elongated recessed area 512 extends to both sides of the heat dissipation fin 123 to the inner surface of the baffle 129, but the invention is not limited thereto.

In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 may omit the fixing part 121, and the heat dissipation fins 123 may be integrally formed on or fixed to the second cover plate 312 of the heat spreader 112. In this case, the cover body 122 of the water cooling head 120 is directly joined to the surface of the second cover plate 312, so that the heat dissipation liquid can flow not only through the heat dissipation fins 123, but also through the surface of the second cover plate 312 of the heat spreader 112.

Therefore, in some embodiments, the heat sink 123 and the baffle 129 can be directly formed on or fixed to the surface of the second cover plate 312 of the heat spreader 112, and the cover body 122 of the water cooling head 120 is directly joined to the surface of the second cover plate 312, so that the partition 420 is disposed in the hollow groove 124 above the heat sink 123 and below the cover body 122 of the water cooling head 120.

However, the present invention is not limited to this. The fixing part 121 and the heat dissipation plate 123 can also be made separately from the second cover plate 312 of the heat spreader 112, and then the fixing part 121 and the heat dissipation plate 123 can be fixed on the second cover plate 312 of the heat spreader 112.

In addition, in some embodiments, the water cooling head 120 may also have an independent heat dissipation liquid circulation, and fixing the water cooling head 120 to the second cover plate 312 of the heat spreader 112 is also within the spirit and scope of protection of the present invention.

In some embodiments, the heat sink 123 is a toothed heat sink formed on the second cover plate 312 of the heat spreader 112.

In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a plurality of first fans 160 mounted on the water cooling head 120 and the heat dissipation fin module 118 to increase the heat dissipation capacity of the gas-liquid dual-cooling three-dimensional heat dissipation device 100.

In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a second fan 170 installed below the heat dissipation fin module 118 to further increase the heat dissipation capacity of the gas-liquid dual-cooling three-dimensional heat dissipation device 100.

In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 further includes an upper cover 150 and a back cover 140. The upper cover 150 includes a plurality of openings 152, and the heat spreader module 110 and the water cooling head 120 are mounted between the upper cover 150 and the back cover 140, and the first fan 160 is preferably aligned with the openings 152 respectively.

In summary, the gas-liquid dual-cooling three-dimensional heat dissipation device disclosed in this invention allows the heat source to be directly contacted by the vapor chamber, and the operating temperature of the vapor chamber to be directly reduced by the water cooling head. Furthermore, the cooling liquid in the water cooling head can directly contact the surface of the vapor chamber, effectively improving the heat dissipation efficiency of the device. In addition, the gas-liquid dual-cooling three-dimensional heat dissipation device disclosed in this invention utilizes heat pipes connected to the vapor chamber, effectively improving the heat dissipation efficiency and capacity, reducing the operating temperature of the computing chip, and thereby improving the overall operating efficiency of the electronic device.

Although this disclosure has been made in practice as described above, it is not intended to limit this disclosure. Anyone skilled in the art may make various modifications and alterations without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the scope of the appended patent application.

100: Gas-liquid dual-cooling three-dimensional heat dissipation device 110: Heat spreader module 112: Heat spreader 114: First heat pipe 116: Second heat pipe 118: Heat dissipation fin module 120: Water cooling head 121: Fixing part 122: Cover body 123: Heat dissipation fin 124: Hollow groove 125: Recessed cavity 126: Hot water outlet 127: Arc-shaped groove 128: Cold water inlet 129: Baffle plate 130: Electronic device 132: Circuit board 134: Heat source 140: Back cover 150: Top cover 152: Opening 160: First fan 170: Second fan 312: Second cover plate 314: Side wall 316: First cover plate 318: Hollow chamber 322: Connecting part 324: Heat dissipation part 401: Arrow direction 402: Arrow direction 410: Impeller 420: Baffle plate 422: Water inlet 424: Water outlet 501: Arrow direction 502: Arrow direction 510: Water collection groove 512: Long strip recessed area 514: Central circular recessed area 600: Radiator 610: Hot water pipe 620: Cold water pipe

To make the above and other objects, features, advantages, and embodiments of this disclosure more apparent and understandable, the accompanying drawings are explained as follows: Figure 1 is a perspective schematic diagram of a gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present invention. Figure 2 is an exploded schematic diagram of some components of the gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present invention. Figure 3 is a perspective schematic diagram of the vapor chamber and heat pipes connected thereto in the gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present invention. Figure 4 is an exploded schematic diagram of the water cooling head of the gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present invention. Figure 5 is a perspective schematic diagram of some components of the water cooling head of the gas-liquid dual-cooling three-dimensional heat dissipation device in Figure 4.

100: Gas-liquid dual-cooling three-dimensional heat dissipation device

110: Heat spreader module

112: Heat spreader

114: First heat pipe

116: Second heat pipe

118: Heatsink fin module

120: Water cooling block

121: Fixing Part

122: Cover Body

123: Heat dissipation plate

124: Hollow Groove

125: Recessed cavity

126: Hot water outlet

128: Cold water inlet

130: Electronic Devices

132: Circuit Board

134: Heat source

140: Back Cover

150: Top Cover

152: Opening

160: First Fan

170: Second fan

Claims (15)

A gas-liquid dual-cooling three-dimensional heat dissipation device includes: a heat spreader module, including a heat spreader plate, the heat spreader plate including a first cover plate, a second cover plate and a side wall surrounding the first cover plate and the second cover plate to form a hollow cavity, the first cover plate being used to contact a heat source; and a water cooling head fixed on the second cover plate of the heat spreader plate, wherein the water cooling head further includes: a plurality of heat dissipation fins formed on the second cover plate of the heat spreader plate, and the heat dissipation liquid of the water cooling head flowing through the heat dissipation fins; a cover body disposed on the heat dissipation fins; a partition plate installed between the heat dissipation fins and the cover body; and an impeller installed above the partition plate. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 1, wherein the heat spreader module further includes: a plurality of first heat pipes extending outward from the side wall of the heat spreader. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 2, wherein the heat spreader module further includes: a plurality of second heat pipes connected to the second cover plate of the heat spreader, and the second heat pipes being in fluid communication with the hollow cavity. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 3, wherein each of the second heat pipes includes: a connecting portion connected to the second cover plate of the heat spreader; and a heat dissipation portion connected to the connecting portion, and the heat dissipation portion being parallel to the first heat pipes. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 4, wherein the heat spreader module further includes: a heat dissipation fin module, and the first heat pipes and the second heat pipes are disposed in the heat dissipation fin module. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 5, wherein the water cooling head further includes: a fixing portion formed between the second cover plate of the heat spreader and the heat dissipation fins. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 6 further includes: a plurality of first fans mounted on the water cooling head and the heat dissipation fin module. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 7 further includes: a second fan installed below the heat dissipation fin module. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 8 further comprises: an upper cover having a plurality of openings; and a back cover, wherein the heat spreader module and the water cooling head are mounted between the upper cover and the back cover, and the first fans are aligned with the openings. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 1 further comprises: a heat sink; a hot water pipe connected between the water cooling head and the heat sink; and a cold water pipe connected between the water cooling head and the heat sink. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 1, wherein the baffle includes: two water inlets located on both sides of the baffle; and a water outlet located in the middle of the baffle and aligned with the impeller. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 11, wherein the cover includes: an arc-shaped groove, and the two ends of the arc-shaped groove are respectively aligned with each of the water inlets. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 12, wherein the heat dissipation plates include a water collection groove. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 13, wherein the water collection groove includes: an elongated recessed area extending through the heat dissipation fins; and a central circular recessed area formed in the middle of the elongated recessed area and aligned with the water outlet of the partition. The gas-liquid dual-cooling three-dimensional heat dissipation device as described in claim 14, wherein the heat dissipation plates further include: two baffles, respectively located on the outermost side of the heat dissipation plates, to guide the heat dissipation liquid to move to both ends of the heat dissipation plates.