TWI906781B - Antenna module and manufacturing method thereof - Google Patents

Abstract

An antenna module includes a circuit board and a radio frequency integrated circuit. The circuit board has a first surface and a second surface opposite to the first surface, and includes a slot antenna, a ridge waveguide, and a groove. The slot antenna is disposed on the first surface. The ridge waveguide is connected to the slot antenna and has an inner wall. The groove is recessed from the second surface toward the first surface. The radio frequency integrated circuit is disposed in the groove.

Description

Antenna Module and its Manufacturing Method

This invention relates to an antenna module and its manufacturing method, and more particularly to an antenna module and its manufacturing method that integrates an antenna, a ridge waveguide, and an RF integrated circuit in a circuit board.

In wireless networks, the connection and communication between devices are achieved through antennas connected to receivers or transmitters to receive or transmit signals. In wireless communication systems, antenna modules typically use rectangular waveguides or ridge waveguides to connect the chip and the antenna. However, rectangular waveguides have a larger waveguide width, requiring a larger area if installed on a circuit board, while ridge waveguides have a smaller waveguide width, making it difficult for radio signals to be fed vertically from the outside, resulting in problems such as excessive antenna module size or poor electrical performance.

At least one embodiment of the present invention provides an antenna module that integrates an antenna, a ridge waveguide, and an RF integrated circuit into a circuit board, which can reduce size and improve electrical performance.

At least one other embodiment of the present invention provides a method for manufacturing the antenna module described above, in order to help reduce the size of the antenna module and improve its electrical performance.

At least one embodiment of the present invention provides an antenna module comprising a circuit board and an RF integrated circuit. The circuit board has a first surface and a second surface opposite to the first surface, and includes a slotted antenna, a ridge waveguide, and a recess. The slotted antenna is disposed on the first surface. The ridge waveguide is connected to the slotted antenna and has an inner wall. The recess is recessed from the second surface toward the first surface. The RF integrated circuit is disposed in the recess.

In at least one embodiment of the present invention, the circuit board includes a circuit structure, a lower core board, a lower adhesive layer, an upper core board, and an upper adhesive layer. The circuit structure has a second surface and includes a groove. The lower core board is disposed on the circuit structure. The lower adhesive layer is disposed between the circuit structure and the lower core board and adheres to the circuit structure and the lower core board. The upper core board is disposed on the lower core board and has a first surface. The upper adhesive layer is disposed between the lower core board and the upper core board and adheres to the lower core board and the upper core board.

In at least one embodiment of the present invention, the ridge waveguide further includes a metal layer disposed on the inner wall, and the circuit board further includes metal paste, which is disposed between the adhesive layer and the ridge waveguide and electrically connects the metal layer.

In at least one embodiment of the present invention, the slot antenna has an opening, and the ridge waveguide includes an upper cavity that communicates with the opening to extend through the upper core plate.

In at least one embodiment of the present invention, the ridge waveguide further includes a first lower cavity and a second lower cavity extending through the lower core plate, and the first lower cavity and the second lower cavity are spaced apart in the lower core plate along a first direction parallel to the first surface.

In at least one embodiment of the present invention, the ridge waveguide further includes an upper connecting groove extending through the upper adhesive layer and corresponding to the upper cavity, the upper cavity being connected to the first lower cavity and the second lower cavity via the upper connecting groove, the orthographic projection range of the upper connecting groove on the upper core plate being larger than the upper cavity, and the upper cavity being located within the orthographic projection range.

In at least one embodiment of the present invention, the ridge waveguide further includes a first lower connecting groove and a second lower connecting groove extending through the lower adhesive layer, the first lower connecting groove and the second lower connecting groove respectively corresponding to and connecting the first lower cavity and the second lower cavity.

In at least one embodiment of the present invention, the second lower connection slot is disposed in the first direction between the first lower connection slot and the RF integrated circuit. The circuit structure further includes a top-level circuit, the first lower connection slot and the second lower connection slot respectively exposing a first portion and a second portion of the top-level circuit, the second portion of the top-level circuit having a slot, and the RF integrated circuit feeding radio wave signals to the ridge waveguide through the slot.

A method for manufacturing an antenna module according to at least one embodiment of the present invention includes providing an initial wiring structure, including an initial top-layer wiring. An initial lower adhesive layer is disposed between the initial wiring structure and an initial lower core board. The initial lower adhesive layer, the initial wiring structure, and the initial lower core board are pressed together. After pressing the initial lower adhesive layer, the initial wiring structure, and the initial lower core board, a portion of the initial lower core board and a portion of the initial lower adhesive layer are removed to form a lower core board, a first lower cavity and a second lower cavity extending through the lower core board, a lower adhesive layer, and a first lower connecting groove and a second lower connecting groove extending through the lower adhesive layer, wherein the first lower connecting groove and the second lower connecting groove respectively expose a first portion and a second portion of the initial top-layer wiring. After removing a portion of the initial lower core plate and a portion of the initial lower adhesive layer, a first metal layer is formed on the lower core plate, the inner wall of the first lower cavity, the inner wall of the second lower cavity, the inner wall of the first lower connecting groove, the inner wall of the second lower connecting groove, and the first and second portions of the initial top layer wiring. A portion of the first metal layer located on the second portion of the initial top layer wiring is removed to form the top layer wiring. A portion of the initial wiring structure is removed to form a groove. An initial upper core plate is provided. A portion of the initial upper core plate is removed to form an upper core plate, a slot antenna, and an upper cavity. The slot antenna has an opening, and the upper cavity connects to the opening to extend through the upper core plate. After forming the upper core plate, the slot antenna, and the upper cavity, a second metal layer is formed on the upper core plate, the slot antenna, the inner wall of the opening, and the inner wall of the upper cavity. An initial adhesive layer is provided. A portion of the initial adhesive layer is removed to form an adhesive layer and an upper connecting groove, which extends through the adhesive layer and corresponds to the upper cavity. Metal paste is formed on the first metal layer located on the lower core plate. The adhesive layer is placed between the lower and upper core plates. After forming the metal paste, the adhesive layer, lower core plate, and upper core plate are pressed together, electrically connecting the first and second metal layers to form a metal layer. The RF integrated circuit is fixed in the recess.

In at least one embodiment of the present invention, the upper cavity, the upper connecting slot, the first lower cavity, the second lower cavity, the first lower connecting slot, and the second lower connecting slot form a ridge waveguide, and the ridge waveguide is connected to the slot antenna.

In at least one embodiment of the present invention, after the top layer is formed by removing a portion of the first metal layer located on the second portion of the initial top layer, the first lower connection slot and the second lower connection slot respectively expose the first portion and the second portion of the top layer, the second portion of the top layer having a slot, and the RF integrated circuit feeding radio wave signals to the ridge waveguide through the slot.

In the following text, to clearly illustrate the technical features of the invention, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and areas) in the drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings or the dimensions and shapes presented by the elements, but should cover dimensions, shapes, and deviations from both due to actual manufacturing processes and/or tolerances. For example, a flat surface shown in the drawings may have rough and/or nonlinear characteristics, and sharp angles shown in the drawings may be rounded. Therefore, the elements presented in the drawings of the invention are mainly for illustration and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the scope of the claims of the invention.

Secondly, the terms "approximately," "about," or "substantially" used in this invention not only cover explicitly stated numerical values and ranges, but also the permissible deviation range understandable to a person of ordinary skill in the art to which this invention pertains. This deviation range can be determined by the error generated during measurement, which may be caused by limitations of the measurement system or process conditions, for example. For instance, two objects (such as the planes or traces of a substrate) are "substantially parallel" or "substantially perpendicular." "Substantially parallel" and "substantially perpendicular" respectively mean that the parallelism and perpendicularity between the two objects can include non-parallelism and non-perpendicularity caused by the permissible deviation range.

The spatial relative terms used in this invention, such as "below," "under," "above," and "above," are for the convenience of describing the relative relationship between one element or feature and another, as illustrated in the figure. The true meaning of these spatial relative terms includes other orientations. For example, when the figure is rotated 180 degrees vertically, the relationship between one element and another may change from "below" or "under" to "above" or "above." Furthermore, the spatial relative descriptions used in this invention should be interpreted in the same way.

It should be understood that although the present invention may use terms such as "first," "second," and "third" to describe various elements or features, these elements or features should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one feature from another. Furthermore, the term "or" used in the present invention may, as the case may, include any one or more of the related listed items.

Although the present invention uses a series of operations or steps to illustrate the manufacturing method, the order in which these operations or steps are shown should not be construed as a limitation of the present invention. For example, some operations or steps may be performed in a different order and/or simultaneously with other steps. Furthermore, each operation or step described herein may comprise several sub-steps or actions.

Furthermore, the present invention can be implemented or applied through other different specific embodiments, and various details of the present invention can also be combined, modified and changed based on different viewpoints and applications without departing from the concept of the present invention.

Figure 1 is a partial cross-sectional schematic diagram of an antenna module according to at least one embodiment of the present invention. Referring to Figure 1, the antenna module 1 includes a circuit board 10 and an RF integrated circuit 20. The circuit board 10 has a first surface S1 and a second surface S2 opposite to the first surface S1, and includes a slot antenna 11, a ridge waveguide 12, and a groove 13. The slot antenna 11 is disposed on the first surface S1. The ridge waveguide 12 is connected to the slot antenna 11 and has an inner wall 12W. The groove 13 is recessed from the second surface S2 toward the first surface S1. The RF integrated circuit 20 is disposed in the groove 13, and the RF integrated circuit 20 feeds radio wave signals to the ridge waveguide 12.

By placing the ridge waveguide 12 in the circuit board 10 and connecting it to the slot antenna 11, and placing the RF integrated circuit 20 in the recess 13 of the circuit board 10, the electromagnetic wave transmission path from the chip end (RF integrated circuit 20) to the antenna end (slot antenna 11) can be shortened, thereby improving electrical performance. Furthermore, since the waveguide width of the ridge waveguide 12 is smaller, the size of the antenna module can be reduced, and the densest design can be carried out for multiple channels. When applied to multi-transmitter and multi-receiver antenna modules, the size can be further reduced.

As shown in Figure 1, the circuit board 10 includes a circuit structure 110, a lower core board 120, a lower adhesive layer 130, an upper core board 140, and an upper adhesive layer 150. The circuit structure 110 has a second surface S2 and includes a groove 13. The lower core board 120 is disposed on the circuit structure 110. The lower adhesive layer 130 is disposed between the circuit structure 110 and the lower core board 120, and adheres to the circuit structure 110 and the lower core board 120. The upper core board 140 is disposed on the lower core board 120 and has a first surface S1. The upper adhesive layer 150 is disposed between the lower core board 120 and the upper core board 140, and adheres to the lower core board 120 and the upper core board 140.

The slotted antenna 11 has an opening 110, and the ridge waveguide 12 includes an upper cavity 121 that connects to the opening 110 and extends through the core plate 140. Specifically, on the normal of the upper core plate 140, the upper cavity 121 overlaps with and connects to the opening 110 to extend through the core plate 140. The ridge waveguide 12 further includes a first lower cavity 122 and a second lower cavity 123 extending through the lower core plate 120, and the first lower cavity 122 and the second lower cavity 123 are spaced apart in the lower core plate 120 along a first direction D1, where the first direction D1 is parallel to the first surface S1.

The ridge waveguide 12 further includes an upper connecting groove 124 extending through the adhesive layer 150 and corresponding to the upper cavity 121. The upper cavity 121 is connected to the first lower cavity 122 and the second lower cavity 123 via the upper connecting groove 124. Specifically, on the normal of the upper core plate 140, the upper cavity 121 overlaps with and is connected to the upper connecting groove 124, while the upper connecting groove 124 overlaps with and is connected to the first lower cavity 122 and the second lower cavity 123. The orthographic projection range P of the upper connecting groove 124 on the upper core plate 140 is larger than that of the upper cavity 121, and the upper cavity 121 is located within the orthographic projection range P.

As shown in Figure 1, the ridge waveguide 12 further includes a metal layer 12M disposed on the inner wall 12W, and the circuit board 10 further includes a metal paste 160. The metal paste 160 is disposed in the first direction D1 between the upper adhesive layer 150 and the ridge waveguide 12 and electrically connected to the metal layer 12M. In other words, the metal paste 160 is disposed on the periphery of the ridge waveguide 12 and is located between the lower core plate 120 and the upper core plate 140 on the normal of the upper core plate 140.

By applying the metal paste 160, the metal layer 12M of the upper cavity 121 can be electrically connected to the metal layers 12M of the first lower cavity 122 and the second lower cavity 123, thus preventing radio signal leakage. In addition, since the ridge waveguide 12 is an air-filled substrate integrated waveguide (AFSIW) and its inner wall 12W is provided with a metal layer 12M, the generation of losses can be greatly reduced when combined with the slot antenna 11.

Please continue referring to Figure 1. The ridge waveguide 12 further includes a first lower connecting groove 125 and a second lower connecting groove 126 extending through the lower adhesive layer 130. The first lower connecting groove 125 and the second lower connecting groove 126 correspond to and connect to the first lower cavity 122 and the second lower cavity 123, respectively. Specifically, on the normal of the upper core plate 140, the first lower connecting groove 125 and the second lower connecting groove 126 overlap with and connect to the first lower cavity 122 and the second lower cavity 123, respectively.

The second lower connector 126 is disposed in the first direction D1 between the first lower connector 125 and the RF integrated circuit 20. The circuit structure 110 further includes a top-layer circuit 111. The first lower connector 125 and the second lower connector 126 expose a first portion and a second portion of the top-layer circuit 111, respectively. The second portion of the top-layer circuit 111 has a slot 111S, through which the RF integrated circuit 20 feeds radio wave signals to the ridge waveguide 12. By designing the aforementioned slot 111S, the channel for feeding radio wave signals can be increased, thereby improving electrical performance. In other embodiments, the first lower connector 125 may not extend through the lower adhesive layer 130, that is, the first portion of the top-layer circuit 111 may not be exposed.

Furthermore, as shown in Figure 1, the circuit structure 110 further includes an inner layer circuit 112, and the RF integrated circuit 20 includes a pad 20P, which is disposed in an opening (not labeled) in the groove 13 and electrically connected to the inner layer circuit 112.

Figures 2A to 2F are partial cross-sectional views of an antenna module of at least one embodiment of the present invention at different process stages. Referring to Figure 2A, an initial circuit structure 110' is provided, including an initial top layer circuit 111' and an inner layer circuit 112. Referring to Figure 2B, an initial lower adhesive layer 130' is disposed between the initial circuit structure 110' and the initial lower core board 120'.

Referring to Figure 2C, firstly, the initial lower adhesive layer 130', the initial wiring structure 110', and the initial lower core plate 120' are pressed together. After pressing the initial lower adhesive layer 130', the initial wiring structure 110', and the initial lower core plate 120', a portion of the initial lower core plate 120' and a portion of the initial lower adhesive layer 130' are removed to form the lower core plate 120, the first lower cavity 122 and the second lower cavity 123 extending through the lower core plate 120, the lower adhesive layer 130, and the first lower connecting groove 125 and the second lower connecting groove 126 extending through the lower adhesive layer 130. The first lower connecting groove 125 and the second lower connecting groove 126 respectively expose the first and second portions of the initial top layer wiring 111'.

After removing a portion of the initial lower core plate 120' and a portion of the initial lower adhesive layer 130', a first metal layer M1 is formed on the lower core plate 120, the inner wall of the first lower cavity 122, the inner wall of the second lower cavity 123, the inner wall of the first lower connecting groove 125, the inner wall of the second lower connecting groove 126, and the first and second portions of the initial top layer circuit 111'. The first metal layer M1 located on the second portion of the initial top layer circuit 111' is removed to form the top layer circuit 111.

As shown in Figure 2C, after removing the first metal layer M1 located on the second part of the initial top layer circuit 111' to form the top layer circuit 111, the first lower connection groove 125 and the second lower connection groove 126 respectively expose the first part and the second part of the top layer circuit 111, and the second part of the top layer circuit 111 has a slot 111S.

However, in other embodiments, the first lower connector groove 125 may not extend through the lower adhesive layer 130, i.e., the first portion of the top layer circuit 111 is not exposed, and the first metal layer M1 is not formed on the first portion of the initial top layer circuit 111'.

Referring to Figure 2D, a portion of the initial wiring structure 110' is removed to form a groove 13. Referring to Figure 2E, an initial upper core plate (not shown) is provided. A portion of the initial upper core plate is removed to form an upper core plate 140, a slot antenna 11, and an upper cavity 121. The slot antenna 11 has an opening 110, and the upper cavity 121 extends through the opening 110 and through the upper core plate 140. After forming the upper core plate 140, the slot antenna 11, and the upper cavity 121, a second metal layer M2 is formed on the inner walls of the upper core plate 140, the slot antenna 11, the opening 110, and the upper cavity 121.

In some embodiments, machining processes can be used to remove portions of the initial lower core plate 120' and the initial lower adhesive layer 130', remove portions of the initial wiring structure 110' to form a groove 13, remove portions of the initial upper core plate to form an upper cavity 121, and remove a second portion of the initial top layer wiring 111' to form a slot 111S for the top layer wiring 111, such as milling. Alternatively, laser drilling processes can be used to form openings (not labeled) in the groove 13 to expose the inner layer wiring 112, providing the pad 20P electrical connection wiring structure 110, and to remove portions of the initial upper core plate to form openings 11O for the slot antenna 11.

By forming a second metal layer M2 on the inner wall of the upper core plate 140, the slot antenna 11, the opening 11O, and the inner wall of the upper cavity 121 in the same process, the subsequent misalignment caused by forming separate metal layers is avoided, thus providing a better radio wave transmission path and improving electrical performance.

As shown in Figure 2E, an initial adhesive layer (not shown) is provided. A portion of the initial adhesive layer is removed to form an adhesive layer 150 and an upper connecting groove 124, which extends through the adhesive layer 150 and corresponds to the upper cavity 121. Metal paste 160 is formed on a first metal layer M1 located on the lower core plate 120. The adhesive layer 150 is disposed between the lower core plate 120 and the upper core plate 140.

Please refer to Figure 2F. After forming the metal paste 160, the upper adhesive layer 150, the lower core plate 120, and the upper core plate 140 are pressed together. The first metal layer M1 and the second metal layer M2 are electrically connected to each other by the metal paste 160 to form the metal layer 12M. The upper cavity 121, the upper connecting groove 124, the first lower cavity 122, the second lower cavity 123, the first lower connecting groove 125, and the second lower connecting groove 126 form the ridge waveguide 12. The ridge waveguide 12 is connected to the slot antenna 11. Please refer to Figure 1. The RF integrated circuit 20 is fixed in the groove 13. The RF integrated circuit 20 feeds radio wave signals to the ridge waveguide 12 through the slot 111S.

In some embodiments, the lower core plate 120 and the upper core plate 140 may be made of FR-4 resin. Since the inner wall 12W of the ridge waveguide 12 is provided with a metal layer 12M, which forms a better radio wave transmission path with the slot antenna 11, the loss can be greatly reduced. Therefore, the lower core plate 120 and the upper core plate 140 can use a lower-priced resin, reducing manufacturing costs.

In some embodiments, the materials of the top layer circuit 111, the first metal layer M1, and the second metal layer M2 of the metal layer 12M may include copper. The first metal layer M1 and the second metal layer M2 may be formed by an electroplating process. Furthermore, the material of the metal paste 160 may include silver paste or copper paste. The metal paste 160 may be formed by a printing process, a baking process, and a laminating process.

In summary, the antenna module and its manufacturing method according to at least one embodiment of the present invention, by placing a ridge waveguide in the circuit board and connecting it to the antenna, and by placing the chip in the circuit board, can shorten the radio wave transmission path from the chip end to the antenna end, thereby improving electrical performance. Furthermore, since the ridge waveguide has a smaller waveguide width, the size of the antenna module can be reduced, and the densest design can be carried out for multiple channels. When applied to multi-transmitter and multi-receiver antenna modules, the size can be further reduced.

Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Those skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended patent application.

1: Antenna Module

10: Circuit board

11: Slotted Antenna

11O: Opening

12: Ridge waveguide

12M: Metal Layer

12W: Inner wall

13: Groove

20: Radio Frequency Integrated Circuit

20P: Pads

110: Line structure

110’: Initial circuit structure

111: Top-level wiring

111’: Initial top-level routing

111S: Slotting

112: Inner layer wiring

120: Lower core board

120’: Initial lower core board

121: Upper cavity

122: First lower cavity

123: Second lower cavity

124: Upper connecting slot

125: First lower connecting slot

126: Second lower connecting slot

130: Undercoat

130’: Initial underlayer

140: Upgrade to core board

150: Top Coating

160: Metal Paste

D1: First Direction

M1: First metal layer

M2: Second metal layer

P: Orthographic projection range

S1: First surface

S2: Second surface

Figure 1 is a partial cross-sectional schematic diagram of an antenna module of at least one embodiment of the present invention. Figures 2A to 2F are partial cross-sectional views of the antenna module of at least one embodiment of the present invention at different manufacturing stages.

Domestic storage information (please record in the order of storage institution, date, and number): None. International storage information (please record in the order of storage country, institution, date, and number): None.

1: Antenna Module

10: Circuit Board

11: Slotted Antenna

11O: Opening

12: Ridge waveguide

12M: Metal Layer

12W: Inner Wall

13: Groove

20: Radio Frequency Integrated Circuits

20P: Pads

110: Line structure

111: Top Layer Wiring

111S: Slotting

112: Inner Layer Circuits

120: Lower core board

121: Upper cavity

122: First lower cavity

123: Second lower cavity

124: Upper connecting slot

125: First lower connecting slot

126: Second lower connecting slot

130: Undercoat

140: Upgrade to core board

150: Top Coating

160: Metal Paste

D1: First Direction

P: Orthographic projection range

S1: First surface

S2: Second surface

Claims (10)

An antenna module includes: a circuit board having a first surface and a second surface opposite to the first surface, and comprising: a slot antenna disposed on the first surface; a ridge waveguide connected to the slot antenna, wherein the ridge waveguide has an inner wall; a groove recessed from the second surface toward the first surface; a wiring structure having the second surface and including the groove; a lower core plate disposed on the wiring structure; a lower adhesive layer disposed between the wiring structure and the lower core plate, and bonded to the wiring structure and the lower core plate; an upper core plate disposed on the lower core plate and having the first surface; and an upper adhesive layer disposed between the lower core plate and the upper core plate, and bonded to the lower core plate and the upper core plate; and an RF integrated circuit disposed in the groove. The antenna module as described in claim 1, wherein the ridge waveguide further includes a metal layer disposed on the inner wall, and the circuit board further includes a metal paste disposed between the upper adhesive layer and the ridge waveguide and electrically connecting the metal layer. The antenna module as described in claim 1, wherein the slot antenna has an opening, and the ridge waveguide includes an upper cavity, wherein the upper cavity communicates with the opening to extend through the upper core plate. The antenna module as described in claim 3, wherein the ridge waveguide further includes a first lower cavity and a second lower cavity extending through the lower core plate, and the first lower cavity and the second lower cavity are spaced apart in the lower core plate along a first direction, wherein the first direction is parallel to the first surface. As described in claim 4, the antenna module further includes an upper connecting groove extending through the upper adhesive layer and corresponding to the upper cavity, the upper cavity connecting the first lower cavity and the second lower cavity via the upper connecting groove, the upper connecting groove having a projection range on the upper core plate larger than the upper cavity, and the upper cavity being located within the projection range. The antenna module as described in claim 4, wherein the ridge waveguide further includes a first lower connecting groove and a second lower connecting groove extending through the lower adhesive layer, the first lower connecting groove and the second lower connecting groove respectively corresponding to and connecting the first lower cavity and the second lower cavity. As described in claim 6, the antenna module wherein the second lower connection slot is disposed in the first direction between the first lower connection slot and the RF integrated circuit, the circuit structure further including a top-level circuit, wherein the first lower connection slot and the second lower connection slot respectively expose a first portion and a second portion of the top-level circuit, the second portion of the top-level circuit having a slot, wherein the RF integrated circuit feeds radio wave signals to the ridge waveguide through the slot. A method for manufacturing an antenna module includes: providing an initial wiring structure, including an initial top layer wiring; disposing an initial lower adhesive layer between the initial wiring structure and an initial lower core board; pressing the initial lower adhesive layer, the initial wiring structure, and the initial lower core board together; after pressing the initial lower adhesive layer, the initial wiring structure, and the initial lower core board together, removing a portion of the initial lower core board and a portion of the initial lower adhesive layer to form a lower core board, a first lower cavity and a second lower cavity extending through the lower core board, a lower adhesive layer, and a first lower connecting groove and a second lower connecting groove extending through the lower adhesive layer, wherein the first lower connecting groove and the second lower connecting groove respectively expose a first portion and a second portion of the initial top layer wiring; After removing a portion of the initial lower core plate and a portion of the initial lower adhesive layer, a first metal layer is formed on the lower core plate, the inner wall of the first lower cavity, the inner wall of the second lower cavity, the inner wall of the first lower connecting groove, the inner wall of the second lower connecting groove, and the first and second portions of the initial top layer circuit; a portion of the first metal layer located on the second portion of the initial top layer circuit is removed to form a top layer circuit; a portion of the initial circuit structure is removed to form a groove; an initial upper core plate is provided; a portion of the initial upper core plate is removed to form an upper core plate, a slot antenna, and an upper cavity, wherein the slot antenna has an opening, and the upper cavity communicates with the opening to extend through the upper core plate; After forming the upper core plate, the slot antenna, and the upper cavity, a second metal layer is formed on the upper core plate, the slot antenna, the inner wall of the opening, and the inner wall of the upper cavity; an initial adhesive layer is provided; a portion of the initial adhesive layer is removed to form an adhesive layer and an upper connecting groove, wherein the upper connecting groove extends through the adhesive layer and corresponds to the upper cavity; a metal paste is formed on the first metal layer located on the lower core plate; the adhesive layer is disposed between the lower core plate and the upper core plate; after forming the metal paste, the adhesive layer, the lower core plate, and the upper core plate are pressed together, wherein the first metal layer and the second metal layer are electrically connected to each other by the metal paste to form a metal layer; and An integrated radio frequency circuit is fixed in the groove. The method of manufacturing an antenna module as described in claim 8, wherein the upper cavity, the upper connecting slot, the first lower cavity, the second lower cavity, the first lower connecting slot, and the second lower connecting slot form a ridge waveguide, and the ridge waveguide is connected to the slot antenna. The method of manufacturing an antenna module as described in claim 9, wherein after removing a portion of the first metal layer located on the second portion of the initial top layer circuit to form the top layer circuit, the first lower connection slot and the second lower connection slot respectively expose a first portion and a second portion of the top layer circuit, the second portion of the top layer circuit having a slot, wherein the RF integrated circuit feeds a radio wave signal to the ridge waveguide through the slot.