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TWI906008B - Memory testing method, memory testing device and non-transitory computer-readable storage medium - Google Patents

Memory testing method, memory testing device and non-transitory computer-readable storage medium

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Publication number
TWI906008B
TWI906008B TW113141347A TW113141347A TWI906008B TW I906008 B TWI906008 B TW I906008B TW 113141347 A TW113141347 A TW 113141347A TW 113141347 A TW113141347 A TW 113141347A TW I906008 B TWI906008 B TW I906008B
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memory
read
pll
transmitting
instruction
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TW113141347A
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TW202507741A (en
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楊書偉
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南亞科技股份有限公司
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Abstract

A memory testing method comprises following steps. A bank of the memory is switched from an idle state to an active state. A delay-locked loop reset instruction is transmitted to the memory which is at the active state. A read instruction is transmitted to the memory, wherein a time calculated from the transmitting of the delay-locked loop reset instruction to the transmitting of the read instruction is less than a specific time. A reading result of the read instruction is received. In response to the reading result is fail, the memory is determined not to meet a double data rate fifth-generation standard.

Description

記憶體測試方法、記憶體測試裝置及非暫態電腦可讀取儲存媒體Memory testing methods, memory testing devices, and nontransient computer-readable storage media

本揭露有關於一種記憶體測試方法,特別是有關於一種判斷記憶體是否符合第五代雙倍資料速率標準之記憶體測試方法。This disclosure relates to a memory testing method, and more particularly to a memory testing method for determining whether memory meets the fifth-generation double data rate standard.

隨著記憶體元件的技術發展,為了區別記憶體的儲存效率與速度,業者與學術單位訂定許多通用的標準。若產品符合一定的規格(例如單位面積的儲存容量)或表現(例如讀寫效率),便可以取得相應的認證標記。記憶體製造商為了宣傳或符合客戶要求,也通常會參考公定的標準進行硬體的設計。As memory component technology has advanced, manufacturers and academic institutions have established numerous universal standards to differentiate memory storage efficiency and speed. Products that meet certain specifications (such as storage capacity per unit area) or performance (such as read/write efficiency) can obtain corresponding certification marks. Memory manufacturers also typically refer to these established standards in their hardware design for promotional purposes and to meet customer requirements.

本揭露提供一種記憶體測試方法,適用於電子裝置,記憶體測試方法包含:將記憶體的第一庫由閒置狀態切換至啟用狀態;傳送延遲鎖相迴路重置指令至啟用狀態下的記憶體;自傳送延遲鎖相迴路重置指令起算的特定時間之內,傳送讀取指令至記憶體;接收關於讀取指令之讀取結果;以及響應於讀取結果為失敗,判斷記憶體未符合第五代雙倍資料速率標準。This disclosure provides a memory testing method applicable to electronic devices. The memory testing method includes: switching a first memory bank from an idle state to an enabled state; transmitting a delayed phase-locked loop (PLL) reset command to the enabled memory; transmitting a read command to the memory within a specific time period starting from the transmission of the PLL reset command; receiving a read result regarding the read command; and responding to a read failure by determining that the memory does not meet the fifth-generation double data rate standard.

本揭露還提供一種記憶體測試方法,適用於電子裝置,記憶體測試方法包含:傳送延遲鎖相迴路重置指令至記憶體;傳送啟用指令至記憶體,其中傳送延遲鎖相迴路重置指令與傳送啟用指令之第一時間間隔不小於延遲鎖相迴路週期;再次傳送延遲鎖相迴路重置指令至記憶體;傳送讀取指令至記憶體,其中再次傳送延遲鎖相迴路重置指令與傳送讀取指令之第二時間間隔小於延遲鎖相迴路週期;以及響應於讀取結果為失敗,判斷記憶體未符合第五代雙倍資料速率標準。This disclosure also provides a memory testing method applicable to electronic devices. The memory testing method includes: transmitting a delayed phase-locked loop (PLL) reset command to the memory; transmitting an enable command to the memory, wherein a first time interval between transmitting the delayed PLL reset command and transmitting the enable command is not less than the delayed PLL cycle; then... The system then transmits a delayed phase-locked loop (PLL) reset command to memory; transmits a read command to memory, wherein the second time interval between transmitting the delayed PLL reset command and transmitting the read command is less than the delayed PLL cycle; and responds if the read result fails, determining that the memory does not meet the fifth-generation double data rate standard.

本揭露還提供一種記憶體測試裝置,用以測試記憶體,記憶體測試裝置包含處理器,其中處理器用以執行以下運作:將記憶體的第一庫由閒置狀態切換至啟用狀態;傳送延遲鎖相迴路重置指令至啟用狀態下的記憶體;自傳送延遲鎖相迴路重置指令起算的特定時間之內,傳送讀取指令至記憶體;接收關於讀取指令之讀取結果;以及響應於讀取結果為失敗,判斷記憶體未符合第五代雙倍資料速率標準。This disclosure also provides a memory testing apparatus for testing memory, the memory testing apparatus including a processor, wherein the processor is configured to perform the following operations: switch a first library of memory from an idle state to an enabled state; transmit a delayed phase-locked loop reset instruction to the enabled memory; transmit a read instruction to the memory within a specific time period from the transmission of the delayed phase-locked loop reset instruction; receive a read result regarding the read instruction; and, in response to a read result failure, determine that the memory does not meet the fifth generation double data rate standard.

本揭露還提供一種非暫態電腦可讀取儲存媒體,其具有儲存於其上的至少一指令,當一處理單元執行該些指令時,該些指令執行該記憶體測試方法。This disclosure also provides a non-transient computer-readable storage medium having at least one set of instructions stored thereon, which, when executed by a processing unit, perform the memory testing method.

應該理解的是,前述的一般性描述和下列具體說明僅僅是示例性和解釋性的,並旨在提供所要求的本揭露的進一步說明。It should be understood that the foregoing general description and the following specific description are merely exemplary and illustrative, and are intended to provide further explanation of the claimed disclosure.

為了使本揭露之敘述更加詳盡與完備,可參照所附之圖式及以下所述各種實施例,圖式中相同之號碼代表相同或相似之元件。To make the description of this disclosure more detailed and complete, reference can be made to the accompanying figures and the various embodiments described below, in which the same numbers represent the same or similar elements.

請參考第1圖,其為本揭露部分實施例中記憶體測試裝置12及記憶體14的示意圖。如第1圖所示,記憶體測試裝置12包含處理器122,並且耦接記憶體14。記憶體測試裝置12用以判斷記憶體14是否符合第五代雙倍資料速率標準。Please refer to Figure 1, which is a schematic diagram of the memory testing device 12 and memory 14 in a partial embodiment of this disclosure. As shown in Figure 1, the memory testing device 12 includes a processor 122 and is coupled to the memory 14. The memory testing device 12 is used to determine whether the memory 14 conforms to the fifth generation double data rate standard.

目前記憶體的標準,例如:聯合電子設備工程委員會(Joint Electron Devices Engineering Council,JEDEC)所制定的第五代雙倍資料速率(double data rate fifth-generation,DDR5)標準,並不允許特定的操作方式。Current memory standards, such as the double data rate fifth-generation (DDR5) standard set by the Joint Electron Devices Engineering Council (JEDEC), do not allow for specific operating methods.

舉例而言,符合第五代雙倍資料速率標準的記憶體在啟用狀態(activate state)和閒置狀態(idle state)下,僅能夠分別執行特定的指令,像是在啟用狀態下,不能執行延遲鎖相迴路重置(delay-locked loop reset,DLL Reset)指令。For example, memory that meets the fifth generation double data rate standard can only execute specific instructions in the activated state and the idle state. For instance, the delayed-locked loop reset (DLL Reset) instruction cannot be executed in the activated state.

然而,市面上有部分記憶體產品未符合第五代雙倍資料速率標準而支援特定操作方式,如此一來將增加記憶體產品設計上的彈性,並進一步提升其效能。而為了判斷記憶體產品是否遵循相關標準之操作限制,競品廠商需要對其進行測試,然而目前的習知技術缺乏有效且快速的記憶體檢測方式,以測試記憶體產品是否未符合第五代雙倍資料速率標準,而支援特定操作方式。於本揭示文件中記憶體測試裝置12可以提供便利且高效率方式檢測記憶體14是否符合第五代雙倍資料速率標準。However, some memory products on the market do not meet the Double Data Rate 5 (DDR) standard and support specific operating modes. This would increase the flexibility in memory product design and further improve its performance. To determine whether a memory product complies with the relevant standard's operating limitations, competing manufacturers need to test it. However, current prior art lacks an effective and rapid memory testing method to test whether a memory product supports specific operating modes while not meeting the DDR standard. The memory testing device 12 disclosed herein provides a convenient and efficient way to test whether memory 14 meets the DDR standard.

在一些實施例中,處理器 122可包含中央處理單元(central processing unit,CPU)、多重處理器、分散式處理系統、特殊應用積體電路(application specific integrated circuit,ASIC)和/或合適的運算單元。In some embodiments, processor 122 may include a central processing unit (CPU), a multiprocessor, a distributed processing system, an application-specific integrated circuit (ASIC), and/or a suitable computing unit.

請參考第2圖,其為本揭露部分實施例中記憶體14的示意圖。記憶體14包含延遲鎖相迴路(delay-locked loop,DLL)電路1402、儲存陣列1404、行解碼器1406、列解碼器1408以及輸入/輸出單元1410。在一實施例中,記憶體14可為一種同步動態隨機存取記憶體(synchronous dynamic random access memory,SDRAM)。Please refer to Figure 2, which is a schematic diagram of memory 14 in a partial embodiment of this disclosure. Memory 14 includes a delay-locked loop (DLL) circuit 1402, a storage array 1404, a row decoder 1406, a column decoder 1408, and an input/output unit 1410. In one embodiment, memory 14 may be a synchronous dynamic random access memory (SDRAM).

延遲鎖相迴路電路1402用於校準記憶體14中資料輸出及輸入的時脈訊號,以穩定記憶體14的時脈,並與讀取及寫入記憶體的外部裝置(例如:記憶體測試裝置12)之時脈同步。The delayed phase-locked loop circuit 1402 is used to calibrate the clock signals for data output and input in memory 14 to stabilize the clock of memory 14 and synchronize it with the clock of external devices (e.g., memory testing device 12) that read and write memory.

儲存陣列1404包含至少一庫(Bank),並且用以儲存資料。行解碼器1406及列解碼器1408則為當記憶體14接收讀取和/或寫入指令時,分別用以確認讀取和/或寫入指令所對應資料所位於的行及列,並進行讀取和/或寫入。The storage array 1404 includes at least one bank for storing data. The row decoder 1406 and column decoder 1408 are used to identify the row and column where the data corresponding to the read and/or write instruction is located when the memory 14 receives read and/or write instructions, and to perform read and/or write operations.

輸入/輸出單元1410則用以提供資料選通信號(data strobe signal,DQS),當記憶體14自外部裝置接收讀取指令時,資料選通信號將對應的資料自記憶體14傳輸至外部裝置;相對地,當記憶體14自外部裝置接收寫入指令時,資料選通信號將對應的資料自外部裝置傳輸至記憶體14。The input/output unit 1410 provides a data strobe signal (DQS). When memory 14 receives a read command from an external device, the data strobe signal transmits the corresponding data from memory 14 to the external device. Conversely, when memory 14 receives a write command from an external device, the data strobe signal transmits the corresponding data from the external device to memory 14.

在一些實施例中,處理器 122將記憶體14由閒置狀態切換至啟用狀態;接下來,處理器 122傳送延遲鎖相迴路重置指令至啟用狀態下的記憶體14;接著,處理器 122自傳送延遲鎖相迴路重置指令起算的特定時間之內,傳送讀取指令至記憶體14;其後,處理器 122判斷讀取記憶體14是否成功;最後,響應於讀取記憶體14失敗,處理器 122判斷記憶體14未符合第五代雙倍資料速率標準;相對地,響應於讀取記憶體14成功,處理器 122判斷記憶體14可能符合第五代雙倍資料速率標準。In some embodiments, processor 122 switches memory 14 from an idle state to an enabled state; next, processor 122 sends a delayed phase-locked loop (PLL) reset instruction to memory 14 in the enabled state; then, within a specific time period starting from the sending of the PLL reset instruction, processor 122 sends a read instruction to memory 14; subsequently, processor 122 determines whether reading memory 14 was successful; finally, in response to a failure to read memory 14, processor 122 determines that memory 14 does not meet the fifth-generation double data rate standard; conversely, in response to a successful read of memory 14, processor 122... 122 determines that memory 14 may meet the fifth generation double data rate standard.

在一些實施例中,處理器 122傳送延遲鎖相迴路重置指令至閒置狀態下的記憶體14;接下來,處理器 122將記憶體14的第一庫由閒置狀態切換至啟用狀態;接著,處理器 122傳送延遲鎖相迴路重置指令至啟用狀態下的記憶體14;其後,處理器 122將記憶體14的第二庫由閒置狀態切換至啟用狀態;接下來,處理器 122自傳送延遲鎖相迴路重置指令起算的特定時間之內,傳送讀取指令至記憶體14;接著,處理器 122判斷讀取記憶體14是否成功;最後,響應於讀取記憶體14失敗,處理器 122判斷記憶體14未符合第五代雙倍資料速率標準;相對地,響應於讀取記憶體14成功,處理器 122判斷記憶體14可能符合第五代雙倍資料速率標準。In some embodiments, processor 122 sends a delayed phase-locked loop (PLL) reset instruction to memory 14 in an idle state; next, processor 122 switches the first memory bank of memory 14 from an idle state to an enabled state; then, processor 122 sends a delayed PLL reset instruction to memory 14 in an enabled state; subsequently, processor 122 switches the second memory bank of memory 14 from an idle state to an enabled state; next, within a specific time period starting from the sending of the delayed PLL reset instruction, processor 122 sends a read instruction to memory 14; then, processor... 122 determines whether reading memory 14 was successful; finally, in response to a failure to read memory 14, processor 122 determines that memory 14 does not meet the fifth generation double data rate standard; conversely, in response to a successful read of memory 14, processor 122 determines that memory 14 may meet the fifth generation double data rate standard.

在一些實施例中,處理器 122傳送延遲鎖相迴路重置指令至記憶體14;接下來,處理器 122傳送啟用指令至記憶體14,其中傳送延遲鎖相迴路重置指令與傳送啟用指令之第一時間間隔不小於延遲鎖相迴路週期;接著,處理器 122再次傳送延遲鎖相迴路重置指令至記憶體14;其後,處理器 122傳送讀取指令至記憶體14,其中再次傳送延遲鎖相迴路重置指令與傳送讀取指令之第二時間間隔小於延遲鎖相迴路週期;最後,響應於讀取記憶體14失敗,處理器 122判斷記憶體14未符合第五代雙倍資料速率標準;相對地,響應於讀取記憶體14成功,處理器 122判斷記憶體14可能符合第五代雙倍資料速率標準。In some embodiments, processor 122 sends a delayed phase-locked loop (PLL) reset instruction to memory 14; next, processor 122 sends an enable instruction to memory 14, wherein the first time interval between sending the PLL reset instruction and sending the enable instruction is not less than the PLL cycle; then, processor 122 sends the PLL reset instruction to memory 14 again; subsequently, processor... 122 sends a read instruction to memory 14, wherein the second time interval between sending the delayed phase-locked loop reset instruction and sending the read instruction is less than the delayed phase-locked loop cycle; finally, if the read of memory 14 fails, processor 122 determines that memory 14 does not meet the fifth generation double data rate standard; conversely, if the read of memory 14 succeeds, processor 122 determines that memory 14 may meet the fifth generation double data rate standard.

請參考第3圖,其為本揭露部分實施例中記憶體測試方法20的示意圖。記憶體測試方法20包含步驟S202、S204、S206、S208、S210及S212,並且用以判斷記憶體(例如:記憶體14)是否符合第五代雙倍資料速率標準。在一些實施例中,記憶體測試方法20可被第1圖所繪示之記憶體測試裝置12執行。Please refer to Figure 3, which is a schematic diagram of the memory testing method 20 in some embodiments of this disclosure. The memory testing method 20 includes steps S202, S204, S206, S208, S210, and S212, and is used to determine whether the memory (e.g., memory 14) conforms to the fifth generation double data rate standard. In some embodiments, the memory testing method 20 can be performed by the memory testing device 12 shown in Figure 1.

具體而言,記憶體測試方法20透過在記憶體處於啟用狀態時,傳送延遲鎖相迴路重置指令至記憶體,並在一定的時間內讀取記憶體,判斷其是否符合第五代雙倍資料速率標準。Specifically, the memory testing method 20 determines whether the memory meets the fifth-generation double data rate standard by sending a delayed phase-locked loop reset command to the memory when the memory is in the enabled state and reading the memory within a certain period of time.

由於符合第五代雙倍資料速率標準的記憶體並不支援在啟用狀態下執行延遲鎖相迴路重置指令,因此若在傳送延遲鎖相迴路重置指令後讀取記憶體失敗,代表記憶體支援在啟用狀態下執行延遲鎖相迴路重置指令,記憶體測試方法20則進一步判斷記憶體不符合第五代雙倍資料速率標準。至於有關記憶體測試方法20如何進行測試的細節,請參考以下段落。Since memory conforming to the fifth-generation double data rate standard does not support executing delayed phase-locked loop (PLL) reset commands while enabled, if reading the memory fails after sending the LPL reset command, it means the memory supports executing LPL reset commands while enabled. Memory testing method 20 then further determines that the memory does not conform to the fifth-generation double data rate standard. For details on how memory testing method 20 is performed, please refer to the following paragraphs.

在步驟S202中,記憶體測試方法20將記憶體由閒置狀態切換至啟用狀態。在一些實施例中,記憶體測試方法20傳送啟用指令(例如:ACTIVE指令)至記憶體,將記憶體切換為啟用狀態。In step S202, memory testing method 20 switches the memory from an idle state to an enabled state. In some embodiments, memory testing method 20 sends an enable instruction (e.g., an ACTIVE instruction) to the memory to switch the memory to an enabled state.

需要說明的是,啟用指令係用於將記憶體中的至少一庫(Bank)切換為啟用狀態,以使被切換為啟用狀態的庫得以進一步被讀取和/或寫入。It should be noted that the enable instruction is used to switch at least one bank in memory to the enabled state so that the bank that has been switched to the enabled state can be further read and/or written.

在步驟S204中,記憶體測試方法20傳送延遲鎖相迴路重置指令至啟用狀態下的記憶體。In step S204, memory test method 20 sends a delayed phase-locked loop reset instruction to the memory in the enabled state.

需要說明的是,延遲鎖相迴路重置指令係用於同步記憶體的時脈與外部裝置(例如:記憶體測試裝置12)的時脈,使接下來記憶體被讀取和/或寫入時,記憶體的輸入/輸出單元(例如:輸入/輸出單元1410)所提供的資料選通信號得以在與外部裝置相同的時脈上正確地傳輸資料。It should be noted that the delayed phase-locked loop reset instruction is used to synchronize the clock of the memory with the clock of an external device (e.g., memory test device 12), so that when the memory is subsequently read and/or written, the data selection signal provided by the memory's input/output unit (e.g., input/output unit 1410) can correctly transmit data on the same clock as the external device.

因此,在步驟S204中,記憶體接收到延遲鎖相迴路重置指令後,重置延遲鎖相迴路電路(例如:延遲鎖相迴路電路1402),再次將記憶體的時脈與外部裝置(例如:記憶體測試裝置12)的時脈同步。Therefore, in step S204, after the memory receives the delay phase-locked loop reset command, it resets the delay phase-locked loop circuit (e.g., delay phase-locked loop circuit 1402) and synchronizes the clock of the memory with the clock of the external device (e.g., memory test device 12).

需要注意的是,在記憶體接收到延遲鎖相迴路重置指令後,至少需要經過對應記憶體規格的延遲鎖相迴路週期(tDLLK)之時間間隔,記憶體才能進一步執行需要延遲鎖相迴路電路參與之功能,例如:讀取及寫入,其中延遲鎖相迴路週期為記憶體完成重置延遲鎖相迴路所需之時間。It is important to note that after the memory receives the delayed phase-locked loop (PLL) reset command, at least the corresponding PLL cycle (tDLLK) interval for the memory specification is required before the memory can proceed with functions that require PLL circuitry participation, such as read and write operations. The PLL cycle is the time required for the memory to complete the PLL reset.

舉例而言,在第五代雙倍資料速率標準下,以記憶體資料傳輸速度為4800每秒百萬位元(megabits per second,Mbps)為例,記憶體的延遲鎖相迴路週期約為638.976奈秒。意即在記憶體接收到延遲鎖相迴路重置指令後,需要經過約數百奈秒後,才能執行特定功能。For example, under the fifth-generation double data rate standard, with a memory data transfer rate of 4800 megabits per second (Mbps), the memory's delay phase-locked loop (PLL) cycle is approximately 638.976 nanoseconds. This means that after the memory receives a PLL reset command, it takes several hundred nanoseconds before it can execute a specific function.

在步驟S206中,記憶體測試方法20自傳送延遲鎖相迴路重置指令起算的特定時間之內,傳送讀取指令至記憶體。在一些實施例中,特定時間不大於記憶體的延遲鎖相迴路週期。進一步地在步驟S208中,記憶體測試方法20判斷讀取是否成功。In step S206, memory testing method 20 sends a read instruction to the memory within a specific time period starting from the transmission of the delayed phase-locked loop reset instruction. In some embodiments, the specific time is no more than the memory's delayed phase-locked loop cycle. Further in step S208, memory testing method 20 determines whether the read was successful.

需要說明的是,讀取指令係用於讀取記憶體中至少一庫的資料,記憶體接收讀取指令後,記憶體的輸出/輸入單元提供資料選通信號以傳輸對應的資料。It should be noted that the read instruction is used to read data from at least one library in the memory. After the memory receives the read instruction, the memory's output/input unit provides a data selection signal to transmit the corresponding data.

在步驟S204記憶體接收到延遲鎖相迴路重置指令後,若記憶體支援在啟用狀態下執行延遲鎖相迴路重置指令,則會執行重置延遲鎖相迴路,但未經過足夠的時長(即,延遲鎖相迴路週期)即在步驟S206接收到讀取指令。此時輸出/輸入單元所提供的資料選通信號時脈並未與外部時脈同步,使得資料選通信號無法按照外部(例如:記憶體測試裝置12)的時脈被讀取,使記憶體測試方法20讀取記憶體失敗。After the memory receives the delayed phase-locked loop (PLL) reset command in step S204, if the memory supports executing the PLL reset command in the enabled state, the PLL will be reset. However, before a sufficient duration (i.e., the PLL cycle) has elapsed, a read command is received in step S206. At this time, the clock of the data selection signal provided by the output/input unit is not synchronized with the external clock, making it impossible for the data selection signal to be read according to the external clock (e.g., memory test device 12), causing memory test method 20 to fail to read the memory.

相對地,若記憶體不支援在啟用狀態下執行延遲鎖相迴路重置指令,則在步驟S204接收到延遲鎖相迴路重置指令後,並不會執行重置延遲鎖相迴路。進而在步驟S206接收到讀取指令後,輸出/輸入單元可以在正確的時脈上提供資料選通信號,使記憶體測試方法20成功讀取記憶體。Conversely, if the memory does not support executing the delayed phase-locked loop (PLL) reset command while enabled, the PLL will not be reset after receiving the PLL reset command in step S204. Then, after receiving the read command in step S206, the output/input unit can provide a data selection signal on the correct clock, enabling memory test method 20 to successfully read the memory.

因此,在步驟S210中,響應於記憶體測試方法20讀取失敗,記憶體測試方法20判斷記憶體未符合第五代雙倍資料速率標準;相對地,在步驟S212中,響應於記憶體測試方法20讀取成功,記憶體測試方法20判斷記憶體可能符合第五代雙倍資料速率標準。Therefore, in step S210, in response to the memory test method 20 failing to read, the memory test method 20 determines that the memory does not meet the fifth generation double data rate standard; conversely, in step S212, in response to the memory test method 20 successfully reading, the memory test method 20 determines that the memory may meet the fifth generation double data rate standard.

請參考第4圖,其為本揭露部分實施例中記憶體測試方法30的示意圖。記憶體測試方法30包含步驟S302、S304、S306、S308、S310、S312、S314及S316,並且用以判斷記憶體(例如:記憶體14)是否符合第五代雙倍資料速率標準。在一些實施例中,記憶體測試方法30可被第1圖所繪示之記憶體測試裝置12執行。Please refer to Figure 4, which is a schematic diagram of the memory testing method 30 in some embodiments of this disclosure. The memory testing method 30 includes steps S302, S304, S306, S308, S310, S312, S314, and S316, and is used to determine whether the memory (e.g., memory 14) conforms to the fifth generation double data rate standard. In some embodiments, the memory testing method 30 can be performed by the memory testing device 12 shown in Figure 1.

相同地,記憶體測試方法30透過在記憶體處於啟用狀態時,傳送延遲鎖相迴路重置指令至記憶體,並在一定的時間內讀取記憶體,判斷其是否符合第五代雙倍資料速率標準。Similarly, memory testing method 30 determines whether the memory meets the fifth-generation double data rate standard by sending a delayed phase-locked loop reset command to the memory when the memory is in the enabled state and reading the memory within a certain period of time.

由於符合第五代雙倍資料速率標準的記憶體並不支援在啟用狀態下執行延遲鎖相迴路重置指令,因此若在傳送延遲鎖相迴路重置指令後讀取記憶體失敗,代表記憶體支援在啟用狀態下執行延遲鎖相迴路重置指令,記憶體測試方法30則進一步判斷記憶體不符合第五代雙倍資料速率標準。至於有關記憶體測試方法30如何進行測試的細節,請參考以下段落。Since memory conforming to the fifth-generation double data rate standard does not support executing delayed phase-locked loop (PLL) reset commands while enabled, if reading the memory fails after sending the LPL reset command, it means the memory supports executing LPL reset commands while enabled. Memory testing method 30 then further determines that the memory does not conform to the fifth-generation double data rate standard. For details on how memory testing method 30 performs the test, please refer to the following paragraphs.

在步驟S302中,記憶體測試方法30傳送延遲鎖相迴路重置指令至閒置狀態下的記憶體。步驟S302係用於初始化記憶體,記憶體測試方法30先使記憶體在閒置狀態下重置延遲鎖相迴路電路(例如:延遲鎖相迴路電路1402),同步記憶體的時脈與外部裝置(例如:記憶體測試裝置12)的時脈,以排除其他因素(例如:記憶體時脈與外部裝置時脈不同步)使得後續步驟讀取記憶體失敗,進而影響記憶體測試方法30的測試結果。In step S302, the memory testing method 30 sends a delay phase-locked loop reset command to the memory in the idle state. Step S302 is used to initialize the memory. The memory testing method 30 first resets the delay phase-locked loop circuit (e.g., delay phase-locked loop circuit 1402) in the idle state of the memory to synchronize the clock of the memory with the clock of the external device (e.g., memory testing device 12) to eliminate other factors (e.g., the clock of the memory is not synchronized with the clock of the external device) that may cause subsequent steps to fail to read the memory, thereby affecting the test results of the memory testing method 30.

接下來,在步驟S304中,記憶體測試方法30將記憶體的第一庫由閒置狀態切換至啟用狀態。在一些實施例中,記憶體的儲存陣列(例如:儲存陣列1404)中包含複數個庫,在步驟S304中,記憶體測試方法30將記憶體的其中一庫(即,第一庫)由閒置狀態切換至啟用狀態。在一些實施例中,記憶體測試方法30傳送啟用記憶體中的其中一庫之指令(例如:ACTIVE BANK 1指令)至記憶體,將記憶體中的其中一庫(即,第一庫)切換為啟用狀態。在一些實施例中,記憶體測試方法30在步驟S302傳送延遲鎖相迴路重置指令與在步驟S304傳送啟用指令之時間間隔不小於延遲鎖相迴路週期。換句話說,記憶體測試方法30傳送延遲鎖相迴路重置指令後,至少經過延遲鎖相迴路週期的時長,才傳送啟用指令,以確保記憶體完成重置延遲鎖相迴路。Next, in step S304, the memory testing method 30 switches the first library of the memory from an idle state to an enabled state. In some embodiments, the memory storage array (e.g., storage array 1404) contains multiple libraries, and in step S304, the memory testing method 30 switches one of the libraries (i.e., the first library) of the memory from an idle state to an enabled state. In some embodiments, the memory testing method 30 transmits an instruction to enable one of the libraries in the memory (e.g., an ACTIVE BANK 1 instruction) to the memory, switching one of the libraries (i.e., the first library) of the memory to an enabled state. In some embodiments, the time interval between sending the delayed phase-locked loop (PLL) reset command in step S302 and sending the enable command in step S304 in memory testing method 30 is not less than the delayed PLL cycle. In other words, after sending the delayed PLL reset command, memory testing method 30 waits at least the duration of the delayed PLL cycle before sending the enable command to ensure that the memory completes the delayed PLL reset.

根據第五代雙倍資料速率標準的規範,只要記憶體中的其中一庫處於啟用狀態,即不能執行延遲鎖相迴路重置指令,因此在步驟S304中,記憶體測試方法30將記憶體的其中一庫切換至啟用狀態,以滿足測試環境的條件。According to the specifications of the fifth generation double data rate standard, the delayed phase-locked loop reset instruction cannot be executed as long as one of the libraries in the memory is in an enabled state. Therefore, in step S304, the memory test method 30 switches one of the libraries in the memory to an enabled state to meet the conditions of the test environment.

接著,在步驟S306中,記憶體測試方法30傳送延遲鎖相迴路重置指令至啟用狀態下的記憶體。需要注意的是,記憶體測試方法30的步驟S306與記憶體測試方法20的步驟S204相同,為求簡潔則不再贅述。Next, in step S306, memory testing method 30 sends a delayed phase-locked loop reset instruction to the memory in the enabled state. It should be noted that step S306 of memory testing method 30 is the same as step S204 of memory testing method 20, and will not be described again for the sake of simplicity.

其後,在步驟S308中,記憶體測試方法30將記憶體的第二庫由閒置狀態切換至啟用狀態。在一些實施例中,與步驟S304相似地,在步驟S308中,記憶體測試方法30將記憶體中不同於第一庫的另外一庫(即,第二庫)由閒置狀態切換至啟用狀態。在一些實施例中,記憶體測試方法30傳送啟用記憶體的第二庫之指令(例如:ACTIVE BANK 0指令)至記憶體,將記憶體中的第二庫切換為啟用狀態。Subsequently, in step S308, the memory testing method 30 switches the second library of the memory from an idle state to an enabled state. In some embodiments, similar to step S304, in step S308, the memory testing method 30 switches another library in the memory (i.e., the second library), which is different from the first library, from an idle state to an enabled state. In some embodiments, the memory testing method 30 sends an instruction to enable the second library of the memory (e.g., an ACTIVE BANK 0 instruction) to the memory, switching the second library in the memory to an enabled state.

步驟S308係記憶體測試方法30為了避免其他因素(例如:第一庫被切換為閒置狀態)影響測試結果,而將第二庫切換為啟用狀態,以使第二庫得以執行讀取指令。Step S308 is a memory testing method 30. In order to avoid other factors (such as the first library being switched to an idle state) affecting the test results, the second library is switched to an enabled state so that the second library can execute read instructions.

接下來,在步驟S310中,記憶體測試方法30自傳送延遲鎖相迴路重置指令起算的特定時間之內,傳送讀取指令至記憶體。進一步地在步驟S312中,記憶體測試方法30判斷讀取是否成功。在一些實施例中,特定時間小於記憶體的延遲鎖相迴路週期。需要注意的是,記憶體測試方法30的步驟S310與記憶體測試方法20的步驟S208相同,記憶體測試方法30的步驟S312與記憶體測試方法20的步驟S210相似,為求簡潔則以下段落將描述記憶體測試方法30和記憶體測試方法20不同之處。Next, in step S310, the memory testing method 30 sends a read instruction to the memory within a specific time period starting from the transmission of the delayed phase-locked loop reset instruction. Further, in step S312, the memory testing method 30 determines whether the read was successful. In some embodiments, the specific time is less than the memory's delayed phase-locked loop cycle. It should be noted that step S310 of memory testing method 30 is the same as step S208 of memory testing method 20, and step S312 of memory testing method 30 is similar to step S210 of memory testing method 20. For the sake of brevity, the following paragraphs will describe the differences between memory testing method 30 and memory testing method 20.

在一些實施例中,讀取指令係用以讀取第二庫資料之指令,由於在步驟S308中,第二庫已被切換為啟用狀態,因此記憶體測試方法30得以讀取第二庫以取得讀取結果。In some embodiments, the read instruction is used to read data from the second library. Since the second library has been switched to the enabled state in step S308, the memory test method 30 can read the second library to obtain the read result.

需要注意的是,在記憶體接收到啟用指令後,至少需要經過對應記憶體規格的行至列延遲時間(RAS to CAS delay,又稱為tRCD)之時間間隔,記憶體才能進一步被讀取和/或寫入,其中行至列延遲時間為使記憶體完成切換為啟用狀態所需之時間。It is important to note that after the memory receives the enable command, at least the row-to-column delay (RAS to CAS delay, also known as tRCD) of the corresponding memory specification must elapse before the memory can be read and/or written. The row-to-column delay is the time required for the memory to complete the transition to the enabled state.

舉例而言,在第五代雙倍資料速率標準下,以記憶體資料傳輸速度為4800每秒百萬位元(megabits per second,Mbps)為例,記憶體的行至列延遲時間約為14.166~17.5奈秒(遠小於延遲鎖相迴路週期所需之數百奈秒)。意即在記憶體接收到啟用指令後,需要經過約數十奈秒後,啟用指令所對應的庫才能被讀取和/或寫入。For example, under the fifth-generation double data rate standard, with a memory data transfer rate of 4800 megabits per second (Mbps), the row-to-column latency of memory is approximately 14.166~17.5 nanoseconds (far less than the hundreds of nanoseconds required to delay the phase-locked loop cycle). This means that after the memory receives an enable command, it takes approximately tens of nanoseconds before the corresponding library can be read and/or written.

因此,在一些實施例中,自步驟S308中記憶體測試方法30傳送啟用第二庫指令起算,至步驟S310中記憶體測試方法30傳送該讀取指令之間至少間隔行至列延遲時間(RAS to CAS delay,tRCD),其中行至列延遲時間小於特定時間,即亦小於延遲鎖相迴路週期,因此在步驟S310中,記憶體測試方法30仍得以在特定時間內傳送讀取指令至記憶體。Therefore, in some embodiments, from the time the memory test method 30 sends the enable second library instruction in step S308 to the time the memory test method 30 sends the read instruction in step S310, there must be at least a row-to-column delay (RAS to CAS delay, tRCD), where the RAS to CAS delay is less than a specific time, i.e., less than the delay phase-locked loop cycle. Therefore, in step S310, the memory test method 30 can still send the read instruction to the memory within a specific time.

最後,與記憶體測試方法20的步驟S210相同地,在步驟S314中,當記憶體測試方法30讀取失敗時,判斷記憶體未符合第五代雙倍資料速率標準;相對地,與記憶體測試方法20的步驟S212相同地,在步驟S316中,當記憶體測試方法30讀取成功時,判斷記憶體可能符合第五代雙倍資料速率標準。Finally, similar to step S210 of memory testing method 20, in step S314, when memory testing method 30 fails to read, it is determined that the memory does not meet the fifth generation double data rate standard; conversely, similar to step S212 of memory testing method 20, in step S316, when memory testing method 30 successfully reads, it is determined that the memory may meet the fifth generation double data rate standard.

綜上所述,本揭露所提供的記憶體測試裝置12、記憶體測試方法20及30可透過傳送延遲鎖相迴路重置指令至啟用狀態下的記憶體,判斷記憶體是否符合第五代雙倍資料速率標準,提供有效且快速的記憶體檢測方式,以測試記憶體是否未符合第五代雙倍資料速率標準,而支援啟用狀態下重置延遲鎖相迴路。In summary, the memory testing device 12, memory testing methods 20 and 30 provided in this disclosure can determine whether the memory conforms to the fifth generation double data rate standard by sending a delay phase-locked loop reset command to the memory in the enabled state. This provides an effective and fast memory detection method to test whether the memory does not conform to the fifth generation double data rate standard, and supports resetting the delay phase-locked loop in the enabled state.

雖以數個實施例詳述如上作為示例,然本揭露所提出之記憶體測試方法、記憶體測試裝置及非暫態電腦可讀取儲存媒體亦得以其他系統、硬體、軟體、儲存媒體或其組合實現。因此,本揭露之保護範圍不應受限於本揭露實施例所描述之特定實現方式,當視後附之申請專利範圍所界定者為準。Although several embodiments have been detailed above as examples, the memory testing method, memory testing apparatus, and non-transient computer-readable storage medium disclosed herein can also be implemented by other systems, hardware, software, storage media, or combinations thereof. Therefore, the scope of protection of this disclosure should not be limited to the specific implementations described in the embodiments disclosed herein, but should be determined by the scope of the appended patent applications.

對於本揭露所屬技術領域中具有通常知識者顯而易見的是,在不脫離本揭露的範圍或精神的情況下,可以對本揭露的結構進行各種修改和變化。鑑於前述,本揭露之保護範圍亦涵蓋在後附之申請專利範圍內進行之修改和變化。It will be apparent to those skilled in the art to which this disclosure pertains that various modifications and variations can be made to the structure of this disclosure without departing from its scope or spirit. In view of the foregoing, the scope of protection of this disclosure also covers modifications and variations made within the scope of the appended patent applications.

12:記憶體測試裝置 122:處理器 14:記憶體 1402:延遲鎖相迴路電路 1404:儲存陣列 1406:行解碼器 1408:列解碼器 1410:輸入/輸出單元 20:記憶體測試方法 S202~S212:步驟 30:記憶體測試方法 S302~S316:步驟12: Memory Testing Device 122: Processor 14: Memory 1402: Delay Phase-Locked Loop Circuit 1404: Memory Array 1406: Row Decoder 1408: Column Decoder 1410: Input/Output Unit 20: Memory Testing Method S202~S212: Steps 30: Memory Testing Method S302~S316: Steps

為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為本揭露部分實施例中記憶體測試裝置及記憶體的示意圖; 第2圖為本揭露部分實施例中記憶體的示意圖; 第3圖為本揭露部分實施例中記憶體測試方法的流程圖;以及 第4圖為本揭露部分實施例中另一記憶體測試方法的流程圖。To make the above and other objects, features, advantages and embodiments of this disclosure more apparent, the accompanying drawings are explained as follows: Figure 1 is a schematic diagram of the memory testing apparatus and memory in some embodiments of this disclosure; Figure 2 is a schematic diagram of the memory in some embodiments of this disclosure; Figure 3 is a flowchart of the memory testing method in some embodiments of this disclosure; and Figure 4 is a flowchart of another memory testing method in some embodiments of this disclosure.

20:記憶體測試方法 20: Memory Testing Methods

S202~S212:步驟 S202~S212: Steps

Claims (10)

一種記憶體測試方法,適用於一電子裝置,該記憶體測試方法包含: 傳送一延遲鎖相迴路重置指令至一啟用狀態下的一記憶體; 自傳送該延遲鎖相迴路重置指令起算的一特定時間之內,傳送一讀取指令至該記憶體;以及 響應於對應該讀取指令的一讀取結果為失敗,判斷該記憶體未符合一第五代雙倍資料速率標準。 A memory testing method, applicable to an electronic device, comprising: transmitting a delayed phase-locked loop (PLL) reset command to a memory in an enabled state; transmitting a read command to the memory within a specific time period from the date of sending the PLL reset command; and determining that the memory does not meet a fifth-generation double data rate (DFR) standard if a read result corresponding to the read command fails. 如請求項1所述之記憶體測試方法,其中在將該記憶體切換至該啟用狀態之前,該記憶體測試方法更包含: 傳送該延遲鎖相迴路重置指令至一閒置狀態下的該記憶體,其中自傳送該延遲鎖相迴路重置指令至該閒置狀態下的該記憶體起算經過該特定時間後,才將該記憶體由該閒置狀態切換至該啟用狀態。 The memory testing method as described in claim 1, further comprising, before switching the memory to the enabled state: transmitting the delayed phase-locked loop (PLL) reset command to the memory in an idle state, wherein the memory is switched from the idle state to the enabled state only after a specific time has elapsed since the PLL reset command was sent to the memory in the idle state. 如請求項1所述之記憶體測試方法,其中該讀取指令用以讀取該記憶體的一庫,並且於傳送該讀取指令至該記憶體之前,該記憶體測試方法更包含: 將該記憶體的該庫由一閒置狀態切換至該啟用狀態。 The memory testing method as described in claim 1, wherein the read instruction is used to read a library of the memory, and the memory testing method further includes, before sending the read instruction to the memory: switching the library of the memory from an idle state to an enabled state. 如請求項3所述之記憶體測試方法,其中將該記憶體的該庫切換至該啟用狀態係透過傳送一啟用庫指令至該記憶體完成,並且自傳送該啟用庫指令起算,至傳送該讀取指令之間至少間隔一行至列延遲時間,該行至列延遲時間小於該特定時間。The memory testing method as described in claim 3, wherein switching the library of the memory to the enabled state is accomplished by sending an enable library instruction to the memory, and at least one row-to-column delay time, less than the specified time, is elapsed between the sending of the enable library instruction and the sending of the read instruction. 如請求項1所述之記憶體測試方法,其中該特定時間為一延遲鎖相迴路週期。The memory testing method as described in claim 1, wherein the specific time is a delayed phase-locked loop cycle. 一種記憶體測試方法,適用於一電子裝置,該記憶體測試方法包含: 傳送一延遲鎖相迴路重置指令至一記憶體; 傳送一啟用指令至該記憶體,其中傳送該延遲鎖相迴路重置指令與傳送該啟用指令之一第一時間間隔不小於一延遲鎖相迴路週期; 再次傳送該延遲鎖相迴路重置指令至該記憶體; 傳送一讀取指令至該記憶體,其中再次傳送該延遲鎖相迴路重置指令與傳送該讀取指令之一第二時間間隔小於該延遲鎖相迴路週期;以及 響應於對應該讀取指令的一讀取結果為失敗,判斷該記憶體未符合一第五代雙倍資料速率標準。 A memory testing method, applicable to an electronic device, comprising: transmitting a delayed phase-locked loop (PLL) reset command to a memory; transmitting an enable command to the memory, wherein a first time interval between transmitting the delayed PLL reset command and transmitting the enable command is not less than a delayed PLL cycle; transmitting the delayed PLL reset command to the memory again; transmitting a read command to the memory, wherein a second time interval between transmitting the delayed PLL reset command and transmitting the read command is less than the delayed PLL cycle; and If a read operation corresponding to the read instruction fails, it is determined that the memory does not meet a fifth-generation double data rate standard. 一種記憶體測試裝置,用以測試一記憶體,包含: 一處理器,用以執行以下運作: 傳送一延遲鎖相迴路重置指令至一啟用狀態下的該記憶體; 自傳送該延遲鎖相迴路重置指令起算的一特定時間之內,傳送一讀取指令至該記憶體;以及 響應於對應該讀取指令的一讀取結果為失敗,判斷該記憶體未符合一第五代雙倍資料速率標準。 A memory testing apparatus for testing a memory includes: a processor for performing the following operations: transmitting a delayed phase-locked loop (PLL) reset command to the memory in an enabled state; transmitting a read command to the memory within a specific time period from the date of sending the PLL reset command; and determining that the memory does not meet a fifth-generation double data rate (DFR) standard if a read operation corresponding to the read command fails. 如請求項7所述之記憶體測試裝置,其中在將該記憶體切換至該啟用狀態之前,該處理器更執行以下運作: 傳送該延遲鎖相迴路重置指令至一閒置狀態下的該記憶體,其中自傳送該延遲鎖相迴路重置指令至該閒置狀態下的該記憶體起算經過該特定時間後,才將該記憶體由該閒置狀態切換至該啟用狀態。 The memory testing apparatus as described in claim 7, wherein before switching the memory to the enabled state, the processor further performs the following operations: Sends the delayed phase-locked loop (PLL) reset command to the memory in an idle state, wherein the memory is switched from the idle state to the enabled state only after a specific time has elapsed since the PLL reset command was sent to the memory in the idle state. 如請求項7所述之記憶體測試裝置,其中該讀取指令用以讀取該記憶體的一庫,並且於傳送該讀取指令至該記憶體之前,該處理器更執行以下運作: 將該記憶體的該庫由一閒置狀態切換至該啟用狀態。 The memory testing apparatus as described in claim 7, wherein the read instruction is used to read a library of the memory, and before sending the read instruction to the memory, the processor further performs the following operations: Switching the library of the memory from an idle state to an enabled state. 一種非暫態電腦可讀取儲存媒體,其具有儲存於其上的至少一指令,當一處理單元執行該至少一指令時,該至少一指令執行一記憶體測試方法,該記憶體測試方法包含以下步驟: 傳送一延遲鎖相迴路重置指令至一啟用狀態下的一記憶體; 自傳送該延遲鎖相迴路重置指令起算的一特定時間之內,傳送一讀取指令至該記憶體;以及 響應於對應該讀取指令的一讀取結果為失敗,判斷該記憶體未符合一第五代雙倍資料速率標準。 A non-transient computer-readable storage medium having at least one instruction stored thereon, which, when executed by a processing unit, performs a memory testing method comprising the steps of: transmitting a delayed phase-locked loop (PLL) reset instruction to a memory in an enabled state; transmitting a read instruction to the memory within a specific time period from the date of sending the PLL reset instruction; and determining that a read result corresponding to the read instruction fails, determining that the memory does not conform to a fifth-generation double data rate standard.
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