TWI900971B - Photoresist management system - Google Patents

Abstract

A photoresist management system including a control module, a photoresist usage module, and a photoresist storage module is provided. The control module is signally connected to the photoresist using module and the photoresist storage module. The photoresist management system stores corresponding material information, machine process parameters, machine periodic maintenance parameters and/or product measurement information. The control module feeds back or adjusts material information, machine process parameters, machine periodic maintenance parameters and/or product measurement information based on information obtained from the photoresist usage module and photoresist storage module.

Description

Photoresist management system

The present invention relates to a management system suitable for semiconductor manufacturing processes, and in particular to a photoresist management system.

In advanced semiconductor manufacturing processes, a single wafer or chip may undergo hundreds of photolithography steps, each requiring a corresponding photoresist. Consequently, the amount of photoresist used and the corresponding cost are staggering. Consequently, effective photoresist management—optimizing inventory, reducing waste, and/or improving tool utilization efficiency—has become a research topic.

The present invention provides a photoresist management system that can plan photoresist usage in real time based on various production information (such as material information, process parameters, and machine maintenance plans), thereby reducing photoresist waste and improving machine utilization.

The photoresist management system of the present invention includes a control module, a photoresist usage module, and a photoresist inventory module. The control module is signal-connected to the photoresist usage module and the photoresist inventory module. The photoresist management system stores corresponding material information, machine process parameters, machine cycle maintenance parameters, and/or product measurement information. The control module provides feedback or adjusts the material information, machine process parameters, machine cycle maintenance parameters, and/or product measurement information based on the information obtained from the photoresist usage module and the photoresist inventory module.

In one embodiment of the present invention, there are multiple photoresist use modules, and the photoresist coating parameters stored in at least two photoresist use modules are different from each other.

In one embodiment of the present invention, there are multiple photoresist inventory modules, and the photoresists stored in at least two photoresist inventory modules have different service lives or storage quantities.

In one embodiment of the present invention, there are multiple photoresist usage modules and multiple photoresist inventory modules. The control module provides feedback or adjusts material information, machine process parameters, machine cycle maintenance parameters, and/or product measurement information based on information obtained from all photoresist usage modules and all photoresist inventory modules.

In one embodiment of the present invention, the control module provides feedback or adjusts material information, machine process parameters, machine cycle maintenance parameters, and/or product measurement information based on at least the photoresist inventory quantity, photoresist usable quantity, or photoresist effective lifespan obtained from the photoresist inventory module.

In one embodiment of the present invention, the control module feeds back or adjusts material information, machine process parameters, machine cycle maintenance parameters, and/or product measurement information based on at least the machine parameters obtained after the photoresist module performs machine testing.

In one embodiment of the present invention, the control module feeds back or adjusts material information, tool process parameters, tool cycle maintenance parameters, and/or product measurement information based on at least the parameters of the photoresist utilization module for cycle maintenance.

In one embodiment of the present invention, the control module feeds back or adjusts material information, tool process parameters, tool cycle maintenance parameters, and/or product measurement information based on at least the parameters of the product transfer through the photoresist utilization module.

In one embodiment of the present invention, the control module compares and determines at least the test parameters of the photoresist module after testing the machine and the parameters of the goods passed through the photoresist module to feedback or adjust material information, machine process parameters, machine cycle maintenance parameters and/or product measurement information.

In one embodiment of the present invention, the control module at least compares and determines the parameters of the goods passed through the photoresist-using module with the parameters of the periodic maintenance of the photoresist-using module to feedback or adjust material information, machine process parameters, machine periodic maintenance parameters and/or product measurement information.

Based on the above, the photoresist management system can achieve continuous and/or real-time dynamic management of photoresist usage, thereby dynamically optimizing photoresist inventory, reducing photoresist waste, and/or improving the efficiency of corresponding equipment.

FIG1 is a schematic diagram of a photoresist management system according to an embodiment of the present invention.

1 , the photoresist management system 100 may include a control module 110 , at least one photoresist use module 120 , and at least one photoresist inventory module 130 .

In this embodiment, the control module 110 may include corresponding hardware or software.

In one embodiment, the control module 110 includes, for example, an input unit 115, an output unit 116, a computing unit 117, and/or a storage unit 118. The input unit 115 may include, for example, a keyboard, a mouse, a touch screen, a signal receiving terminal (e.g., a corresponding data port or antenna), and/or other similar units suitable for data input. The output unit 116 may include, for example, a screen, a printer, a signal output terminal (e.g., a corresponding data port or antenna), and/or other similar units suitable for data output. The computing unit 117 may include, for example, a central processing unit (CPU), a graphics processing unit (GPU), a physical processing unit (PPU), or other similar units suitable for performing calculations, logical judgments, and/or data processing. The storage unit 118 may include, for example, a memory, a hard drive, a disk array, a database, and/or other similar units suitable for permanent or temporary data storage.

In one embodiment, the control module 110 can be connected to a cloud system via a signal. The cloud system can perform input, output, calculation, storage, monitoring, data collection, statistics, and/or other appropriate operations through the control module 110 via remote control. The aforementioned cloud system includes, for example, a Fault Detection and Classification System (FDC system), a Facility Monitoring Control System (FMCS), a Computer-Integrated Manufacturing System (CIM system), or other appropriate industrial control system (ICS), but the present invention is not limited thereto.

In one embodiment, the control module 110 includes, for example, software suitable for performing logical judgment or a platform suitable for performing Advanced Process Control (APC) and/or a programmable logic controller (PLC).

The photoresist application module 120 may include a corresponding photoresist coating machine 122 and a corresponding photoresist coating control unit 121. The photoresist coating control unit 121 may be similar to the control module 110. The photoresist coating control unit 121 may control the photoresist coating machine 122 to perform appropriate photoresist coating steps on a substrate (e.g., a wafer) according to a set parameter (recipe). In one embodiment, parameters applicable to photoresist coating may include substrate size, photoresist type, photoresist coating time (units may be: seconds/time or other similar units), photoresist flow rate (units may be: milliliters/second or other similar units), photoresist coating time, and other possible parameters. The photoresist coating time and photoresist flow rate may affect the amount of photoresist used in each process. For example, for each process, the product of the photoresist coating time and the photoresist flow rate roughly corresponds to the amount of photoresist used. It is also worth noting that in an exemplary control method, not all parameters need to be set every time. For example, during routine periodic maintenance (Periodic Maintenance) or production maintenance (Productive Maintenance), the photoresist flow rate of the corresponding machine can be measured, adjusted, set and/or calibrated based on the measurement results of the corresponding photoresist layer thickness, so that there is a corresponding relationship between the photoresist flow rate of the machine and the formed photoresist layer. This method can be simply referred to as "machine testing." Therefore, during each photoresist coating process, the photoresist thickness can be directly set, and the corresponding photoresist coating time can be calculated automatically or semi-automatically based on appropriate preset parameters (such as substrate size, photoresist flow rate, and/or photoresist spillage rate during spin coating). In this way, the corresponding amount of photoresist required for each parameter (recipe) can be calculated. It is also worth noting that during the photoresist coating process, due to corresponding parameters (such as rotation speed, rotation speed, or type of photoresist), some photoresist on the substrate will spill due to rotation. Therefore, the relationship between photoresist flow rate and photoresist layer thickness does not necessarily show a perfect linear relationship. Therefore, for different processes (such as forming photoresist layers of different types and/or thicknesses), corresponding test machines are often required to understand the corresponding status.

The photoresist inventory module 130 may include corresponding photoresist storage tanks 133. Photoresist can be transported from the corresponding photoresist storage tanks 133 to the corresponding photoresist coating machine 122 through appropriate pipelines. Different photoresist storage tanks 133 may be interconnected through appropriate pipelines. The photoresist inventory module 130 may have a corresponding photoresist inventory control unit 131. The photoresist coating control unit 121 may be similar to the control module 110. The photoresist inventory control unit 131 can detect or evaluate the inventory quantity, usable quantity or quality of the photoresist in an appropriate manner. In an exemplary control method, since the photoresist has a corresponding effective service life, the control module 110 can obtain or judge the corresponding photoresist inventory quantity, usable quantity or quality based on each photoresist inventory control unit 131. Furthermore, under the principle of preserving the new and using the old, photoresists with shorter effective lifespans can be used first to achieve dynamic optimization of photoresist inventory quality.

In one embodiment, the photoresist processing module 120 and the photoresist storage module 130 can be separate devices. For example, the photoresist processing module 120 can be located in a corresponding clean room, while the photoresist storage module 130 can be located in another factory building. Furthermore, when photoresist is needed, the corresponding photoresist can be transferred from the photoresist storage tank 133 of the photoresist storage module 130 to the photoresist coating machine 122 of the photoresist processing module 120 via corresponding pipelines.

In one embodiment, the photoresist application module 120 and the photoresist inventory module 130 can be integrated into corresponding equipment. For example, a single photoresist spin coater can include the corresponding photoresist application module 120 and photoresist inventory module 130, and the corresponding photoresist application control unit and the corresponding photoresist inventory control unit 131 can be substantially the same control unit, but the present invention is not limited to this.

The control module 110 is signal-connected to the photoresist usage module 120 and the photoresist inventory module 130. The aforementioned signal connection can generally refer to a wired signal transmission connection method, a wireless signal transmission connection method, or a combination thereof. The photoresist usage module 120 or the photoresist inventory module 130 can transmit corresponding information (e.g., corresponding parameters within the module, photoresist usage, or photoresist inventory) to the control module 110. The control module 110 can transmit the corresponding information to the photoresist usage module 120 or the photoresist inventory module 130, or perform direct or indirect control. Furthermore, the present invention does not limit all signal connection methods to being the same or different.

FIG2 is a schematic diagram of a process flow of photoresist management according to an embodiment of the present invention. Specifically, FIG2 can be a schematic diagram of a process flow of photoresist management according to the photoresist management system 100 in FIG1 .

Referring to Figures 2 and 1 , step S10 is a process for obtaining material information, tool process parameters, tool cycle maintenance parameters, and/or product metrology information. In one embodiment, the initial material information, tool process parameters, tool cycle maintenance parameters, and/or product metrology information can be manually established directly or indirectly.

Material information may include, for example, the type of photoresist in the photoresist storage tank 133, the corresponding photoresist storage quantity, the corresponding photoresist's effective lifespan, and/or any other appropriate information related to the photoresist. Even for the same type of photoresist, the corresponding effective lifespan or photoresist storage quantity may vary slightly between different photoresist storage tanks 133. Therefore, at least some of the material information described above may be stored in the photoresist inventory control unit 131 of the corresponding photoresist inventory module 130.

Machine process parameters may include, for example, the number of substrates (e.g., wafers) per lot, photoresist coating parameters for each substrate, the wait time (Q-time) for each lot, and/or any other appropriate parameters related to the photoresist coating process and the object being coated (e.g., substrate). Different photoresist coating machines 122 may have slightly different corresponding photoresist coating parameters, even for the same process. Therefore, at least some of these machine process parameters may be stored in the photoresist coating control unit 121 of the corresponding photoresist application module 120.

The machine cycle maintenance parameters may include, for example, the frequency or number of cycle maintenance visits (e.g., weekly, monthly, quarterly, or annual), the time of the last or previous cycle maintenance visit, the items covered during the last or previous cycle maintenance visits, the content of the test run after the cycle maintenance visit, and/or any other appropriate parameters associated with the machine downtime for maintenance. The cycle maintenance parameters may vary slightly for different photoresist coating tools 122. Therefore, the above-mentioned machine cycle maintenance parameters can be partially stored in the photoresist coating control unit 121 of the corresponding photoresist use module 120, but this does not rule out the possibility of directly aggregating and storing the machine cycle maintenance parameters in the control module 110.

Product metrology information may include, for example, measurement information on photoresist coating results (e.g., photoresist thickness, photoresist uniformity, actual photoresist usage, or photoresist spillage) after performing a corresponding process or periodic maintenance. For different photoresist coating machines 122, even if they correspond to the same process, the corresponding product metrology information may vary slightly. Therefore, while some of this product metrology information can be stored in the photoresist coating control unit 121 of the corresponding photoresist application module 120, this does not preclude the possibility of directly aggregating and storing the machine periodic maintenance parameters in the control module 110.

2 and 1 , step S20 is a decision making process, which is to determine whether the photoresist is insufficient.

Because material information, machine process parameters, machine cycle maintenance parameters, and/or product measurement information are directly or indirectly related to photoresist usage, the aforementioned information or parameters can be aggregated to determine whether photoresist is insufficient. For example, this can be determined by the difference between the actual photoresist inventory and the estimated photoresist usage. In addition, considering that photoresist has a corresponding effective lifespan; and/or that the machine process or machine cycle maintenance has appropriate scheduling, it is possible to use corresponding time parameters (such as the effective lifespan of the photoresist, the waiting time for the product, or the time it takes for the machine to undergo cycle maintenance) to estimate whether photoresist will be insufficient at a later point in time.

In addition, the aforementioned information or parameters can be aggregated and then directly or indirectly judged by humans. For example, the aforementioned information or parameters can be aggregated to the control module 110 and outputted via its output unit 116 via an appropriate graphical user interface (GUI), allowing for direct human judgment. For another example, the judgment method can also be programmed via an appropriate method (such as coding) to allow for indirect human judgment. The judgment method can also integrate a programmed judgment method with a direct human judgment method. For another example, the result of the programmed judgment can be outputted via an appropriate graphical user interface, and the outputted information can then be manually selected, sorted, or filtered for judgment. Furthermore, the content and presentation of the graphical user interface can be adaptively adjusted based on needs. For example, it may include corresponding machine information (e.g., number, name, applicable photoresist type, owner, and periodic maintenance information), recipe information (e.g., number, name, corresponding value, photoresist type, and thickness), and product information (e.g., work-in-process (WIP) number, name, schedule, number of sheets, owner, and available waiting time). These details are not detailed here. Subsequent judgment and output methods can also be the same or similar, and are not further elaborated on.

2 and 1, if the decision in step S20 determines that the photoresist is insufficient, step S21 can be performed. Step S21 is a process that involves adjusting the machine photoresist configuration.

Adjustments to tool photoresist configurations may include, but are not limited to, adjustments to photoresist inventory or usage (e.g., initiating purchase requests, cross-tool (e.g., different photoresist coating tools 122) or cross-factory support or mixing), tool cycle maintenance adjustments, and/or adjustments to tool process parameters.

Taking photoresist inventory or usage adjustments as an example, if it is determined that the photoresist inventory on a certain machine or factory is insufficient at a certain point in time, a purchase request can be made based on the result; alternatively, photoresist from other machines or factories can be allocated to the corresponding machine or factory.

For example, when adjusting a tool's cycle maintenance, if it's determined that the photoresist inventory on a particular tool or factory floor is insufficient at a certain point in time, the tool's cycle maintenance schedule can be advanced or delayed based on the tool's cycle maintenance parameters. Alternatively, the tool's cycle maintenance content can be adjusted (e.g., the amount of photoresist used during the cycle maintenance).

For example, when adjusting machine process parameters, if it is determined that the light resistance at a certain point in time is insufficient on a particular machine or in a certain factory, the corresponding process can be relocated to another machine or in another factory. Alternatively, the process schedule can be advanced or delayed based on the machine process parameters (e.g., waiting time).

2 and 1 , if the decision in step S20 determines that the photoresist is sufficient, then step S30 can be performed. Step S30 is a process that involves performing a test parameter analysis.

Test parameters may include, for example, the number of tests performed, test time, test frequency, or test results corresponding to a recipe. Furthermore, different photoresist-using modules 120 may have different corresponding test parameters. Therefore, appropriate test parameters for each photoresist-using module 120 may be aggregated and sent to the control module 110 for subsequent determination.

Please refer to Figure 2 and Figure 1. After step S30, step S40 can be performed. Step S40 is a decision to determine whether the tester photoresist is available (i.e., has a corresponding product process).

The purpose of each test is to verify the relationship between each recipe and the resulting photoresist layer (e.g., thickness). This is because the photoresist coating process can cause the resist to spill due to rotation, resulting in a non-perfect linear relationship between the resist flow rate and the thickness of the photoresist layer. Furthermore, the photoresist coating control unit 121 in the photoresist application module 120 stores different recipes corresponding to different processes. Therefore, the decision in step S40 includes aggregating the corresponding test machine parameters and then comparing the corresponding test machine parameters with the process parameters of the machine used for actual product production (i.e., product transfer) for a specific photoresist to determine whether the photoresist should be used in actual product production; or, to determine the number of times, time, or frequency at which the photoresist should be used in actual product production.

Referring to Figures 2 and 1, if the decision in step S40 is that there is no overstock, then step S60 can be performed. Step S60 is a procedure for adjusting the machine's periodic maintenance parameters.

For example, if a recipe for a specific photoresist thickness isn't used in actual product production, the number of times or frequency of testing for that parameter can be reduced, or even the corresponding machine can be shut down, based on actual needs. Alternatively, the number or frequency of maintenance cycles can be reduced, based on actual needs. This can reduce photoresist waste and/or improve the uptime of the corresponding tool.

Referring to Figures 2 and 1, if the decision in step S40 is that there is overstock, then step S50 can be performed. Step S50 is a decision to determine whether the product parameters have all been maintained for the machine cycle.

For example, if a recipe for a photoresist layer of a specific thickness is used in actual product production, it can be compared with the corresponding tool cycle maintenance parameters to determine whether the corresponding product parameters have undergone tool cycle maintenance.

Referring to Figures 2 and 1, if the decision in step S50 is that the machine cycle maintenance is not performed, step S60 can be performed. Step S60 is a process that involves adjusting the machine cycle maintenance parameters.

For example, if actual product production data is compared but no corresponding machine testing parameters (recipes) exist, corresponding machine testing parameters can be established based on actual needs. This can be further improved by increasing the number or frequency of machine testing for that parameter, or by increasing the number or frequency of corresponding periodic maintenance. This can improve machine or process stability and/or reduce the risk of product production anomalies.

Referring to Figures 2 and 1 , if the decision in step S50 indicates that the machine cycle maintenance is required, step S10 can be performed. For example, information from any of the aforementioned steps (including the corresponding decision or procedure) can be uploaded or updated to the corresponding material information, machine process parameters, machine cycle maintenance parameters, and/or product measurement information to facilitate subsequent judgment and/or adjustment.

For example, the number and frequency of maintenance intervals can be increased based on actual needs. This can improve machine or process stability and/or reduce the risk of product anomalies.

In summary, the photoresist management system of the present invention enables appropriate photoresist management. Furthermore, the photoresist management method of the present invention aggregates, analyzes, and judges current data (e.g., material information, machine process parameters, machine cycle maintenance parameters, and/or product measurement information), dynamically adjusts based on current or future conditions (e.g., photoresist status, machine status), and provides feedback or adjustments to current data based on the results of these dynamic adjustments. In this way, the photoresist management system enables continuous and/or real-time dynamic management of photoresist usage, dynamically optimizing photoresist inventory, reducing photoresist waste, and/or improving the efficiency of corresponding tools.

100: Photoresist Management System 110: Control Module 115: Input Unit 116: Output Unit 117: Calculation Unit 118: Storage Unit 120: Photoresist Application Module 121: Photoresist Coating Control Unit 122: Photoresist Coating Machine 130: Photoresist Inventory Module 131: Photoresist Inventory Control Unit 133: Photoresist Storage Tank S10, S20, S21, S30, S40, S50, S60: Steps

Figure 1 is a schematic diagram of a photoresist management system according to an embodiment of the present invention. Figure 2 is a schematic diagram of a photoresist management process according to an embodiment of the present invention.

S10, S20, S21, S30, S40, S50, S60: Steps

Claims (10)

A photoresist management system includes: a control module; a photoresist use module; and a photoresist inventory module, wherein the control module is signal-connected to the photoresist use module and the photoresist inventory module, and wherein: the photoresist management system stores corresponding material information, machine process parameters, machine periodic maintenance parameters and product measurement information, wherein the machine periodic maintenance parameters include machine periodic maintenance parameters, The control module includes the frequency or number of periodic maintenance, the time for performing the periodic maintenance, the items for performing the periodic maintenance, and the test operation content of the machine after performing the periodic maintenance; and the control module feeds back or adjusts the material information, the machine process parameters, the machine periodic maintenance parameters, and the product measurement information based on the information obtained from the photoresist usage module and the photoresist inventory module. The photoresist management system as described in claim 1, wherein the number of the photoresist use modules is multiple, and the photoresist coating parameters stored in at least two of the photoresist use modules are different from each other. The photoresist management system as described in claim 1, wherein there are multiple photoresist inventory modules, and the service life or storage quantity of the photoresists stored in at least two of the photoresist inventory modules are different from each other. The photoresist management system of claim 1, wherein: there are a plurality of photoresist usage modules; there are a plurality of photoresist inventory modules; and the control module feeds back or adjusts the material information, the machine process parameters, the machine cycle maintenance parameters, and the product measurement information based on information obtained from all the photoresist usage modules and all the photoresist inventory modules. The photoresist management system of claim 1, wherein the control module provides feedback or adjusts the material information, the tool process parameters, the tool cycle maintenance parameters, and the product measurement information based on at least the photoresist inventory quantity, the photoresist usable quantity, or the photoresist effective service life obtained from the photoresist inventory module. The photoresist management system of claim 1, wherein the control module feeds back or adjusts the material information, the machine process parameters, the machine cycle maintenance parameters, and the product measurement information based on at least the machine parameters after the photoresist is tested by the machine using module. The photoresist management system of claim 1, wherein the control module feeds back or adjusts the material information, the tool process parameters, the tool cycle maintenance parameters, and the product measurement information based on at least the parameters of the photoresist usage module for cycle maintenance. The photoresist management system of claim 1, wherein the control module feeds back or adjusts the material information, the tool process parameters, the tool cycle maintenance parameters, and the product measurement information based on at least the parameters of the goods transferred by the photoresist usage module. The photoresist management system as described in claim 1, wherein the control module at least compares and judges the machine parameters after the photoresist use module is tested with the parameters of the goods passed through the photoresist use module to feedback or adjust the material information, the machine process parameters, the machine cycle maintenance parameters and the product measurement information. The photoresist management system of claim 1, wherein the control module at least compares and determines parameters for goods passing through the photoresist use module with parameters for periodic maintenance of the photoresist use module to feedback or adjust the material information, the tool process parameters, the tool periodic maintenance parameters, and the product measurement information.