TWI883808B - Production management system - Google Patents
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Abstract
Description
本發明是有關於一種生產管理系統,且特別是有關於一種適用於半導體製程的生產管理系統。The present invention relates to a production management system, and in particular to a production management system applicable to semiconductor manufacturing processes.
對於半導體製程控制而言,現有的製程控制方法往往著重於機台內部的控制以及機台本身的監控。並且,在有需要進行執行產品生產或對應製程時,才由對應的單位或人員進行排貨規畫或檢視負載狀況,並進行對應的處理。For semiconductor process control, existing process control methods often focus on the control inside the machine and the monitoring of the machine itself. In addition, when there is a need to execute product production or corresponding processes, the corresponding units or personnel will carry out scheduling planning or check the load status and perform corresponding processing.
然而,隨著半導體製程的發展、生產機台的數量增加及/或廠區的擴大,現有的製程控制方法勢必面臨相當的瓶頸或效率低落。因此,如何提升生產管理且/或提升對應產品機台的使用效率,實已成為研究的議題。However, with the development of semiconductor manufacturing processes, the increase in the number of production machines and/or the expansion of factory areas, existing process control methods are bound to face considerable bottlenecks or inefficiencies. Therefore, how to improve production management and/or improve the efficiency of the corresponding product machines has become a research topic.
本發明提供一種生產管理系統,其適於對多個產品機台進行排派貨或檢視負載狀況。The present invention provides a production management system, which is suitable for scheduling shipments or checking load status of multiple product machines.
本發明的生產管理系統包括控制模組。控制模組適於訊號連接於多個產品機台。控制模組根據生產資訊進行迴圈演算以對多個產品機台進行排貨或檢視負載狀況。The production management system of the present invention includes a control module. The control module is suitable for signal connection to multiple product machines. The control module performs loop calculations based on production information to arrange goods for multiple product machines or check the load status.
在本發明的一實施例中,生產資訊包括可生產機台資訊、在製品資訊、生產時間資訊、產品資訊及/或可稼動時間資訊。In one embodiment of the present invention, the production information includes production machine information, work-in-progress information, production time information, product information and/or available time information.
在本發明的一實施例中,生產資訊為動態調整,其包括:控制模組依據迴圈演算中第N次迴圈的結果調整迴圈演算中第N+1次迴圈所需的生產資訊,其中N為正整數。In one embodiment of the present invention, the production information is dynamically adjusted, which includes: the control module adjusts the production information required for the N+1th loop in the loop calculation according to the result of the Nth loop in the loop calculation, where N is a positive integer.
在本發明的一實施例中,迴圈演算中至少包括由生產資訊中的稼動批次數(run lot數)、產品機台的標準工作時間(TC)及產品機台的可稼動時間(UpTime)所構成之函式。在一實施例中,前述的函式包括實施方式中所述的[式1]。In one embodiment of the present invention, the loop calculation includes at least a function composed of the number of run lots in the production information, the standard working time (TC) of the product machine, and the uptime (UpTime) of the product machine. In one embodiment, the aforementioned function includes [Formula 1] described in the implementation method.
在本發明的一實施例中,迴圈演算中至少包括由在製品資訊中的在製品數(WIP數)、多個產品機台的機台計算產能(Cap.)及各個產品機台的可稼動時間(UpTime)所構成之函式。在一實施例中,前述的函式包括實施方式中所述的[式2]。在一實施例中,前述的函式更包括實施方式中所述的[式3]。In one embodiment of the present invention, the loop calculation includes at least a function composed of the number of work-in-progress (WIP number) in the work-in-progress information, the machine capacity (Cap.) of multiple product machines, and the available operation time (UpTime) of each product machine. In one embodiment, the aforementioned function includes [Formula 2] described in the implementation method. In one embodiment, the aforementioned function further includes [Formula 3] described in the implementation method.
在本發明的一實施例中,迴圈演算中至少包括由各個產品機台的稼動時間比例、多個產品機台的標準工作時間(TC)及各個產品機台的可稼動時間(UpTime)所構成之函式。在一實施例中,前述的函式包括實施方式中所述的[式4]。In one embodiment of the present invention, the loop calculation includes at least a function composed of the operating time ratio of each product machine, the standard working time (TC) of multiple product machines, and the uptime (UpTime) of each product machine. In one embodiment, the aforementioned function includes [Formula 4] described in the implementation method.
在本發明的一實施例中,多個產品機台中的一些構成對應的同質機台群;且迴圈演算為至少使同質機台群中不同的產品機台的執行產品生產及/或對應製程的數量/比例的差異降低。In one embodiment of the present invention, some of the plurality of product tools form a corresponding homogeneous tool group; and the loop calculation is to at least reduce the difference in quantity/ratio of executing product production and/or corresponding process of different product tools in the homogeneous tool group.
在本發明的一實施例中,多個產品機台中的一些構成對應的同質機台群;且控制模組更根據迴圈演算的演算結果模擬調整對同質機台群中不同的產品機台的執行產品生產及/或對應製程的數量/比例。In one embodiment of the present invention, some of the multiple product machines constitute a corresponding homogeneous machine group; and the control module further simulates and adjusts the quantity/ratio of executing product production and/or corresponding processes of different product machines in the homogeneous machine group according to the calculation results of the loop calculation.
在本發明的一實施例中,多個產品機台中的一些構成第一同質機台群;多個產品機台中的另一些構成第二同質機台群,其中第一同質機台群與第二同質機台群分屬不同半導體製程;且控制模組根據生產資訊進行迴圈演算,以對第一同質機台群中不同的產品機台進行排貨或檢視負載狀況,且對第二同質機台群中不同的產品機台進行排貨或檢視負載狀況。In one embodiment of the present invention, some of the multiple product machines constitute a first homogeneous machine group; other of the multiple product machines constitute a second homogeneous machine group, wherein the first homogeneous machine group and the second homogeneous machine group belong to different semiconductor processes; and the control module performs loop calculations based on production information to schedule or check the load status of different product machines in the first homogeneous machine group, and to schedule or check the load status of different product machines in the second homogeneous machine group.
在本發明的一實施例中,控制模組更依據對多個產品機台進行排貨或檢視負載狀況的結果判斷是否有瓶頸機台。In one embodiment of the present invention, the control module further determines whether there is a bottle neck machine based on the result of scheduling or checking the load status of multiple product machines.
基於上述,生產管理系統可以根據生產資訊進行迴圈演算。並且,藉由對應的迴圈演算,可以對多個產品機台進行適當的評估以進行對應的排派貨或檢視負載狀況,以達到最佳化的生產管理。Based on the above, the production management system can perform loop calculations based on production information. Moreover, through the corresponding loop calculations, appropriate evaluations can be performed on multiple product machines to perform corresponding dispatch or check load conditions to achieve optimal production management.
圖1是依照本發明的一實施例的一種生產管理系統的系統示意圖。FIG1 is a system schematic diagram of a production management system according to an embodiment of the present invention.
請參照圖1,生產管理系統100可以包括控制模組110。控制模組110可以包含對應的硬體或軟體。1 , the production management system 100 may include a control module 110. The control module 110 may include corresponding hardware or software.
在一實施例中,控制模組110例如包括輸入單元115、輸出單元116、運算單元117及/或儲存單元118。輸入單元115例如包括鍵盤、滑鼠、觸控螢幕、訊號接收端(如:對應的資料埠(data port)或天線)及/或其他適於資料輸入的類似單元。輸出單元116例如包括螢幕、印表機、訊號輸出端(如:對應的資料埠(data port)或天線)及/或其他適於資料輸出的類似單元。運算單元117例如包括中央處理器(Central Processing Unit;CPU)、圖形處理器(Graphics Processing Unit)、物理處理器(Physics Processing Unit;PPU)或其他適於進行運算、邏輯判斷及/或資料處理的類似單元。儲存單元118例如包括記憶體、硬碟、磁碟陣列、資料庫及/或其他適於進行永久性或暫時性資料儲存的類似單元。In one embodiment, the control module 110 includes, for example, an input unit 115, an output unit 116, a computing unit 117, and/or a storage unit 118. The input unit 115 includes, for example, a keyboard, a mouse, a touch screen, a signal receiving end (such as a corresponding data port or an antenna), and/or other similar units suitable for data input. The output unit 116 includes, for example, a screen, a printer, a signal output end (such as a corresponding data port or an antenna), and/or other similar units suitable for data output. The computing unit 117 includes, for example, a central processing unit (CPU), a graphics processing unit (GPU), a physical processing unit (PPU), or other similar units suitable for performing calculations, logical judgments, and/or data processing. The storage unit 118 includes, for example, a memory, a hard disk, a disk array, a database, and/or other similar units suitable for permanent or temporary data storage.
就硬體上而言,控制模組110可以為單一的實體或為多個實體的相連或整合。舉例而言,控制模組110可以為多台電腦或伺服器的整合。In terms of hardware, the control module 110 can be a single entity or a connection or integration of multiple entities. For example, the control module 110 can be an integration of multiple computers or servers.
在一實施例中,控制模組110可以訊號連接於雲端系統。雲端系統可以藉由遠端控制(remote control)的方式,而經由控制模組110進行輸入、輸出、運算、儲存、監控、資料蒐集、統計及/或其他適宜的操控。前述的雲端系統例如包括失效偵測與分類系統(Fault Detection and Classification system;FDC system)、廠務監控系統(Facility Monitoring Control System;FMCS)、電腦整合製造系統(Computer-Integrated Manufacturing Syetem;CIM system)或其他適宜的工業控制系統(Industrial control system;ICS),但本發明不限於此。In one embodiment, the control module 110 can be connected to the cloud system by signal. The cloud system can perform input, output, calculation, storage, monitoring, data collection, statistics and/or other appropriate operations through the control module 110 by remote control. The aforementioned cloud system includes, for example, a Fault Detection and Classification System (FDC system), a Facility Monitoring Control System (FMCS), a Computer-Integrated Manufacturing Syetem (CIM system) or other appropriate industrial control systems (ICS), but the present invention is not limited thereto.
在一實施例中,控制模組110例如包括適於進行邏輯判斷的軟體或適於進行先進製程控制(Advanced Process Control;APC)的平台(platform)及/或可程式化邏輯控制器(programmable logic controller;PLC)。In one embodiment, the control module 110 includes, for example, software suitable for performing logic judgment or a platform suitable for performing advanced process control (APC) and/or a programmable logic controller (PLC).
控制模組110適於訊號連接於多個產品機台(可直接簡稱為:機台)。前述的訊號連接可以泛指有線訊號傳輸(wired signal transmission)連接方式、無線訊號傳輸(wireless signal transmission)連接方式或上述之混合。每個產品機台可以將對應的資訊(如:模組中對應的參數、對應原材(如:製程氣體、靶材、光阻等)的種類等;但不限)傳送至控制模組110。控制模組110可以將對應的資訊傳送至每個產品機台,或進行直接或間接的控制。另外,本發明並未限定所有的訊號連接方式需為相同或不同。另外,前述的傳送可以包括直接地傳送;或是,硬體上經由對應的中繼器,軟體上經由對應的編碼(encoding)、解碼(decoding)或其他適宜的方式傳送。The control module 110 is suitable for signal connection to multiple product machines (which can be directly referred to as: machines). The aforementioned signal connection can generally refer to a wired signal transmission connection method, a wireless signal transmission connection method, or a combination of the above. Each product machine can transmit corresponding information (such as: corresponding parameters in the module, corresponding raw material (such as: process gas, target material, photoresist, etc.) type, etc.; but not limited) to the control module 110. The control module 110 can transmit the corresponding information to each product machine, or perform direct or indirect control. In addition, the present invention does not limit all signal connection methods to be the same or different. In addition, the aforementioned transmission may include direct transmission; or, transmission via a corresponding repeater in hardware, via corresponding encoding, decoding or other appropriate methods in software.
在一實施例中,在不同的產品機台之間,可進行相同製程的一群產品機台可以被稱為同質機台。也就是說,在進行生產時,屬於同群的同質機台之間可以依據對應的生產管理進行交替使用。舉例而言,機台01、機台02、機台03、機台04、機台05彼此之間為一種同質機台(如:可用於相同薄膜製程的CVD機台);而機台11、機台12、機台13、機台14彼此之間為另一種同質機台(如:可用於相同微影製程的曝光顯影機台)。也因此,機台01、機台02、機台03、機台04、機台05可以構成第一同質機台群;而機台11、機台12、機台13、機台14可以構成第二同質機台群。In one embodiment, among different product machines, a group of product machines that can perform the same process can be called homogeneous machines. That is to say, during production, homogeneous machines belonging to the same group can be used alternately according to corresponding production management. For example, machine 01, machine 02, machine 03, machine 04, and machine 05 are homogeneous machines of one kind (such as CVD machines that can be used for the same thin film process); and machine 11, machine 12, machine 13, and machine 14 are homogeneous machines of another kind (such as exposure and development machines that can be used for the same lithography process). Therefore, machine 01, machine 02, machine 03, machine 04, and machine 05 can constitute a first homogeneous machine group; and machine 11, machine 12, machine 13, and machine 14 can constitute a second homogeneous machine group.
圖2是依照本發明的一實施例的一種生產管理的部分流程示意圖。具體而言,圖2可以是依據圖1中的生產管理系統100進行生產管理的部分流程示意圖。Fig. 2 is a schematic diagram of a partial process of production management according to an embodiment of the present invention. Specifically, Fig. 2 may be a schematic diagram of a partial process of production management performed according to the production management system 100 in Fig. 1 .
請參照圖2及圖1,步驟S11為一程序,其在於取得對應的生產資訊。在一實施例中,初始的生產資訊可以藉由直接地或間接地人為建立、其他資料庫中已存有資訊的輸入(import)、複製(copy)或上傳(update)、或其他適宜的方式而建立。Please refer to FIG2 and FIG1 , step S11 is a procedure for obtaining corresponding production information. In one embodiment, the initial production information can be created by directly or indirectly creating it manually, importing, copying or uploading information already stored in other databases, or other appropriate methods.
生產資訊可以包括但不限於:可生產機台(product path)資訊、在製品(Work In Process,WIP)資訊、生產時間(TC)資訊、產品資訊(product info.)及/或可稼動時間(Up Time)資訊。可生產機台例如可為某一個站點中已被認證(包括但不限於:客戶的認證、公正第三方的認證)的機台。前述的生產資訊詳述如下。Production information may include, but is not limited to: information on production path, work in process (WIP), production time (TC), product information, and/or up time. Production path may be, for example, a certified (including but not limited to, certification by the customer, certification by an impartial third party) machine at a site. The aforementioned production information is described in detail below.
可生產機台(product path)資訊可以包括晶片的每批次(lot)產品及/或所對應的基板(如:晶圓)在進行生產時,所需進行的半導體製程站點及/或流程的對應機台資訊。晶片生產所需的主要半導體製程例如包括擴散(diffusion)製程、薄膜(thin film)製程、微影(lithography)製程及/或蝕刻(etching)製程。擴散製程可包括但不限於:氧化(oxidation)、退火(anneal)、植入(implan)。薄膜製程可包括但不限於:物理氣相沉積(PVD)、化學氣相沉積(CVD)。微影製程可包括但不限於:塗佈(coating)、曝光(exposing)、顯影(development)。蝕刻製程可包括但不限於:乾蝕刻(dry etching)、濕蝕刻(wet etching)、灰化(ashing)、研磨(polish)。因此,可生產機台資訊可以包括該批次(lot)產品或基板(如:晶圓)的產品機台使用流程及/或順序。值得注意的是,對於晶片生產所需的半導體製程而言,可以在可進行相同製程的不同產品機台(可成為:同質機台)中進行。又值得注意的是,對於晶片生產所需的半導體製程站點而言,可能會在同一或類似的產品機台之間反覆地進行相同或相似的製程。以BEOL製程而言,可能反覆地進行對應的薄膜製程、微影製程及/或蝕刻製程,以形成多層的內連線層。The production tool (product path) information may include the corresponding tool information of the semiconductor process sites and/or processes required for the production of each batch (lot) of chips and/or the corresponding substrate (such as wafer). The main semiconductor processes required for chip production include, for example, diffusion processes, thin film processes, lithography processes and/or etching processes. Diffusion processes may include but are not limited to: oxidation, annealing, and implantation. Thin film processes may include but are not limited to: physical vapor deposition (PVD) and chemical vapor deposition (CVD). Lithography processes may include but are not limited to: coating, exposing, and development. The etching process may include but is not limited to: dry etching, wet etching, ashing, polishing. Therefore, the production tool information may include the product tool usage process and/or sequence of the lot of products or substrates (such as wafers). It is worth noting that for the semiconductor process required for chip production, it can be carried out in different product tools (which can be called homogeneous tools) that can perform the same process. It is also worth noting that for the semiconductor process sites required for chip production, the same or similar processes may be repeatedly performed between the same or similar product tools. In terms of BEOL processes, corresponding thin film processes, lithography processes and/or etching processes may be repeatedly performed to form multiple layers of interconnect layers.
在製品(Work In Process,WIP)資訊可以包括準備進行加工之原材(如:素晶圓(bare wafer)或控片晶圓(blanket wafer))及/或已進行加工的半成品(如:製程中晶圓(processing wafer))的相關資訊(如:數量)。對於半導體晶圓廠而言,在製品可以直接對應為在製晶圓(Wafer In Process,WIP)。舉例而言,在製品資訊可以包括對應產品批次或其他與產品製造可能有直接或間接相關之資訊。Work in Process (WIP) information may include information (e.g., quantity) related to raw materials (e.g., bare wafers or blanket wafers) ready for processing and/or semi-finished products (e.g., processing wafers) that have been processed. For semiconductor wafer factories, work in process can directly correspond to wafers in process (WIP). For example, work in process information may include corresponding product batches or other information that may be directly or indirectly related to product manufacturing.
生產時間資訊可以包括產品進行生產的標準工作時間(Standard Time,TC)。標準工作時間可以包括人員作業時間(Ts)、產品間的生產之間差距(Tc)、單一作業下之產品加工時間(Tm)、單一作業下之產品工期(Tl)或上述之整合進行估算。而上述之估算基礎可藉由暨有之記錄檔(log file)或一般生產管理之方法(如:標準人力計算、設備產能計算、成本分攤計算等)所獲得。Production time information can include the standard working time (TC) for product production. Standard working time can include personnel working time (Ts), production gap between products (Tc), product processing time under a single operation (Tm), product duration under a single operation (Tl), or the above-mentioned integration for estimation. The above-mentioned estimation basis can be obtained through existing log files or general production management methods (such as: standard manpower calculation, equipment capacity calculation, cost allocation calculation, etc.).
產品資訊(product information,product info.)可以包括每批次(lot)產品所對應的基板(如:晶圓)片數、產品特徵值、產品價格、產品交期或其他與最終產品可能有直接或間接相關之資訊。Product information (product info.) may include the number of substrates (e.g., wafers) corresponding to each batch (lot), product feature values, product prices, product delivery dates, or other information that may be directly or indirectly related to the final product.
可稼動時間(Up Time)可以包括稼動時間(Run Time)、等待時間(Ready Time)、工程時間(Engineering Time)及/或前述之整合,其主要是從對應產品機台的角度進行時間的考量。稼動時間可以包括正常生產(Regular Production) 時間及/或重工(rework)時間。等待時間包括無作業(No operator)、無在製品(No WIP)或其他造成產品機台不須運作的可能原因之時間。工程時間(Engineering Time)可以包括測機需求、研發需求或其他工程需求(Engineering requirement)所需之時間。Up Time can include Run Time, Ready Time, Engineering Time and/or the integration of the above, which is mainly considered from the perspective of the corresponding product machine. Up Time can include Regular Production time and/or rework time. Waiting Time includes time when there is no operation (No operator), no work in progress (No WIP) or other possible reasons that cause the product machine not to operate. Engineering Time can include the time required for machine testing requirements, R&D requirements or other engineering requirements (Engineering requirement).
請參照圖2及圖1,步驟S12為一程序,其在於計算及/或估算各產品機台每單位時間中實際稼動時間。Please refer to FIG. 2 and FIG. 1 , step S12 is a procedure for calculating and/or estimating the actual operating time per unit time of each product machine.
在一實施例中,各產品機台每單位時間中實際稼動時間的計算及/或估算包括由每單位時間(如:每天)稼動批次數(run lot數)、標準工作時間(TC)及可稼動時間(Up Time)所構成之函式,上述之函式以[式1]示例表示如下: [式1] In one embodiment, the calculation and/or estimation of the actual operating time of each product machine per unit time includes a function composed of the number of run lots per unit time (e.g., per day), the standard working time (TC), and the up time. The above function is represented by [Formula 1] as follows: [Formula 1]
在一實施例中,考量多個產品及/或整體之半導體製程所涉及之不同站點或產品機台,因此前述之實際稼動時間可以更依據對應的可生產機台資訊、在製品資訊及/或產品資訊的基礎上進行各產品機台的對應值計算及/或估算。In one embodiment, considering multiple products and/or different sites or product tools involved in the overall semiconductor process, the aforementioned actual utilization time can be further calculated and/or estimated based on the corresponding manufacturable tool information, work-in-progress information and/or product information for each product tool.
請參照圖2及圖1,步驟S13為一程序,其在於計算及/或估算各產品機台的執行產品生產或對應製程(如:Run貨)時間比例。Please refer to FIG. 2 and FIG. 1 , step S13 is a procedure for calculating and/or estimating the time ratio of each product machine to execute product production or corresponding process (such as Run goods).
在一實施例中,考量多個產品、整體之半導體製程所涉及之不同站點及/或半導體製程所涉及之產品機台,因此前述之各產品機台執行產品生產或對應製程(如:Run貨)的時間比例可以依據對應的可生產機台資訊、在製品資訊及/或產品資訊的基礎上進行各產品機台的對應值計算及/或估算,前述的計算及/或估算至少包括由在製品數(WIP數)、同質機台的機台計算產能(Cap.)及各產品機台及可稼動時間(Up Time)所構成之函式,上述之函式以[式2]示例表示如下: [式2] In one embodiment, considering multiple products, different sites involved in the overall semiconductor process and/or product machines involved in the semiconductor process, the time ratio of each of the aforementioned product machines to execute product production or corresponding processes (such as: Run goods) can be calculated and/or estimated based on the corresponding producible machine information, work-in-progress information and/or product information. The aforementioned calculation and/or estimation at least includes a function composed of the number of work-in-progress (WIP number), the machine calculation capacity (Cap.) of the same type of machine, and each product machine and the up time (Up Time). The above function is represented by [Formula 2] as an example as follows: [Formula 2]
在一實施例中,在暨有或對應的製品數(WIP數)前提下,可以更進一步地考量支援產能(如:跨廠區的支援)及/或其他產能(如:研發產能),以在前述[式2]的前提下進行進一步的調整。並且,在暨有或對應的可稼動時間(Up Time),可以更進一步地考量重工率(RWK)及/或其他變異率(UTIL),以在前述[式2]的前提下進行進一步的調整。因此,各產品機台Run貨時間比例更可以[式3]示例表示的函式進行計算及/或估算: [式3] In one embodiment, under the premise of the corresponding number of products (WIP number), the support capacity (such as cross-factory support) and/or other capacity (such as R&D capacity) can be further considered to make further adjustments under the premise of the aforementioned [Formula 2]. Moreover, under the premise of the corresponding available time (Up Time), the rework rate (RWK) and/or other variation rate (UTIL) can be further considered to make further adjustments under the premise of the aforementioned [Formula 2]. Therefore, the Run time ratio of each product machine can be further calculated and/or estimated by the function represented by the example of [Formula 3]: [Formula 3]
請參照圖2及圖1,步驟S14為一程序,其在於計算及/或估算各產品機台每單位時間可稼動批次數(Run Lot數)比例。值得注意的是,前述的比例為基於稼動時間比例(如:稼動小時比例)、同質機台的標準工作時間(TC)及各個產品機台的可稼動時間(Up Time),而對各別的之間進行每單位時間(如:每日)稼動批次數的比例進行計算及/或估算。標準工作時間(TC)也可以是產出一批貨所花的時間。標準工作時間(TC)也可能被簡稱為:工時。以每產品機台每天可稼動批次數比例為例,可以[式4]示例表示的函式進行計算及/或估算: [式4] Please refer to Figures 2 and 1. Step S14 is a procedure for calculating and/or estimating the ratio of the number of run lots (Run Lots) that can be operated per unit time for each product machine. It is worth noting that the aforementioned ratio is based on the operating time ratio (such as operating hour ratio), the standard working time (TC) of homogeneous machines and the up time (Up Time) of each product machine, and the ratio of the number of run lots per unit time (such as daily) between each is calculated and/or estimated. The standard working time (TC) can also be the time it takes to produce a batch of goods. The standard working time (TC) may also be referred to as working hours. Taking the ratio of the number of run lots that can be operated per day for each product machine as an example, it can be calculated and/or estimated by the function represented by [Formula 4]: [Formula 4]
藉由前述步驟S11、步驟S12、步驟S13和步驟S14的程序,可以大致上完成第一次的對應計算及/或估算。並且,可以藉由第N次(如:第一次)的結果,反饋至步驟S11中的生產資訊,以進行第N+1次(如:第二次)的對應計算及/或估算,以達成動態地迴圈演算,以達到最佳化的生產管理。Through the aforementioned procedures of step S11, step S12, step S13 and step S14, the first corresponding calculation and/or estimation can be substantially completed. Furthermore, the result of the Nth time (e.g., the first time) can be fed back to the production information in step S11 to perform the N+1th time (e.g., the second time) corresponding calculation and/or estimation, so as to achieve dynamic loop calculation and achieve optimal production management.
舉例而言,可以將第N次的結果進行適當的估算,以獲取第N+1次的調整方向。舉例而言,可以藉由適當的統計方法(如:平均值、標準差或變異系數的估算)計算或了解某一產品機台於其所述的同質機台之中的偏差值(deviation)或離群值(outlier),以作為調整方向的基礎。又舉例而言,可以藉由其他的數學方法(如:隨機漫步法(Random walk,RW)、蒙地卡羅法(Monte Carlo method)或牛頓法(Newton’s method)),評估對應的調整方向。在一實施例中,前述的調整方向可以為調整對應產品機台的Run貨數量或比例。另外,多次的迴圈演算可以使同質機台中不同的產品機台的Run貨數量/比例的差異降低(即,差值或差比收斂(convergence)),以達到最佳化的生產管理。For example, the Nth result can be properly estimated to obtain the N+1th adjustment direction. For example, the deviation or outlier of a certain product machine among the homogeneous machines described can be calculated or understood by appropriate statistical methods (such as: estimation of the mean, standard deviation or coefficient of variation) as the basis for the adjustment direction. For another example, the corresponding adjustment direction can be evaluated by other mathematical methods (such as: Random walk (RW), Monte Carlo method or Newton’s method). In one embodiment, the aforementioned adjustment direction can be to adjust the Run quantity or proportion of the corresponding product machine. In addition, multiple loop calculations can reduce the differences in the Run quantity/ratio of different product machines in the same machine (i.e., the difference or difference ratio converges) to achieve optimal production management.
在一實施例中,前述的迴圈次數於本發明並不加以限定,其可為數十次、數百次或數千次。另外,迴圈結束的限定條件可以為次數限定及/或閾值(threshold)限定,於本發明並不加以限制。In one embodiment, the number of loops is not limited in the present invention, and can be tens, hundreds, or thousands of times. In addition, the limiting condition for the end of the loop can be a number limit and/or a threshold limit, which is not limited in the present invention.
圖3是依照本發明的一實施例的一種生產管理的結果示意圖。具體而言,圖3可以是依據圖1中的生產管理系統100進行如圖2所示的流程進行生產管理的部分結果示意圖。Fig. 3 is a schematic diagram of a result of production management according to an embodiment of the present invention. Specifically, Fig. 3 may be a schematic diagram of a part of the result of production management performed according to the process shown in Fig. 2 by the production management system 100 in Fig. 1 .
在圖3中,橫軸所代表的為各個對應的產品機台。舉例而言,機台01、機台02、機台03、機台04、機台05彼此之間為一種同質機台(如:可用於相同薄膜製程的CVD機台),且機台11、機台12、機台13、機台14彼此之間為另一種同質機台(如:可用於相同微影製程的曝光顯影機台)。In Figure 3, the horizontal axis represents the corresponding product machines. For example, machine 01, machine 02, machine 03, machine 04, and machine 05 are homogeneous machines (e.g., CVD machines that can be used for the same thin film process), and machine 11, machine 12, machine 13, and machine 14 are homogeneous machines (e.g., exposure and development machines that can be used for the same lithography process).
在圖3中,橫軸所代表的為每產品機台每天可稼動批次數比例。值得注意的是,圖3中僅示例性地繪示了二種不同的同質機台及/或九個不同的產品機台,而在半導體製程的實務上,可以對應地具有對應的數百、數千或更多的產品機台。並且,在表現的方式上,可以藉由適當的圖形使用者介面(Graphical User Interface,GUI)進行適當的選取及/或呈現。In Figure 3, the horizontal axis represents the ratio of the number of batches that can be operated per day for each product machine. It is worth noting that Figure 3 only illustrates two different homogeneous machines and/or nine different product machines, and in the practice of semiconductor manufacturing, there may be hundreds, thousands or more corresponding product machines. In addition, in terms of the way of presentation, appropriate selection and/or presentation can be performed through an appropriate graphical user interface (GUI).
在圖3中,以虛線表示的「數列1」為藉由圖2所式的流程進行第N次(如:第一次)的每產品機台每天可稼動批次數比例結果,以實線表示的「數列2」為藉由圖2所式的流程進行第N+1次(如:第二次)的每產品機台每天可稼動批次數比例結果。In FIG3 , “Series 1” represented by a dotted line is the ratio of the number of batches that can be operated per day for each product machine when the process shown in FIG2 is performed for the Nth time (e.g., the first time), and “Series 2” represented by a solid line is the ratio of the number of batches that can be operated per day for each product machine when the process shown in FIG2 is performed for the N+1th time (e.g., the second time).
如圖3所示,藉由多次的迴圈流程,可以使同質機台中的每產品機台的可稼動批次數比例及/或工作負載趨於一致,已提升對應的產能利用率。As shown in Figure 3, through multiple loop processes, the proportion of available batches and/or workload of each product machine in homogeneous machines can be made consistent, thereby improving the corresponding production capacity utilization.
圖4是依照本發明的一實施例的一種生產管理的部分流程示意圖。FIG. 4 is a partial flow diagram of production management according to an embodiment of the present invention.
請參照圖4,步驟S10為一程序,其為進行生產管理演算。在一實施例中,生產管理的演算可以如圖2及/或其對應的實施方式說明所述,於此不加以贅述。Please refer to FIG4 , step S10 is a procedure for performing a production management calculation. In one embodiment, the production management calculation can be as described in FIG2 and/or its corresponding implementation method, and will not be elaborated here.
請參照圖4,步驟S20為一程序,其為依據生產管理演算的結果調整實際的對應排貨方式或檢視負載狀況。Please refer to FIG. 4 , step S20 is a procedure for adjusting the actual corresponding scheduling method or checking the load status according to the result of the production management calculation.
請參照圖4,步驟S30為一決策,其為判斷是否有瓶頸機台。舉例而言,可以依據對應的等待時間(Wait time)、run貨時間或其他適宜的方式,以判斷某一產品機台是否為瓶頸機台(Bottleneck Machine /Key Machine)。Please refer to FIG4 , step S30 is a decision, which is to determine whether there is a bottle neck machine. For example, it can be determined whether a product machine is a bottle neck machine (Bottleneck Machine / Key Machine) based on the corresponding wait time (Wait time), run time or other appropriate methods.
請參照圖4,若步驟S30的結果為判斷無瓶頸機台,則可對應地結束本次的生產管理流程。Please refer to FIG. 4 . If the result of step S30 is that there is no bottle neck machine, the current production management process can be terminated accordingly.
請參照圖4,若步驟S30的結果為判斷有瓶頸機台,則可對應地進行步驟S40。步驟S40為一決策,其為進行策略改善。策略改善的方式可以包括但不限於:瓶頸機台的確認、流程的改良、添購產品機台的評估等。Please refer to FIG. 4 . If the result of step S30 is that there is a bottle neck machine, then step S40 can be performed accordingly. Step S40 is a decision to improve the strategy. The strategy improvement method may include but is not limited to: confirmation of the bottle neck machine, improvement of the process, evaluation of the purchased product machine, etc.
綜上所述,本發明的生產管理系統可以根據生產資訊進行迴圈演算。並且,藉由對應的迴圈演算,可以對多個產品機台進行適當的評估以進行對應的排貨或檢視負載狀況,以達到最佳化的生產管理。In summary, the production management system of the present invention can perform loop calculations based on production information. Furthermore, through corresponding loop calculations, appropriate evaluations can be performed on multiple product machines to perform corresponding scheduling or check load conditions, thereby achieving optimal production management.
100:生產管理系統 110: 控制模組 115:輸入單元 116:輸出單元 117:運算單元 118:儲存單元 S11、S12、S13、S14:步驟 S10、S20、S30、S40:步驟 100: Production management system 110: Control module 115: Input unit 116: Output unit 117: Calculation unit 118: Storage unit S11, S12, S13, S14: Steps S10, S20, S30, S40: Steps
圖1是依照本發明的一實施例的一種生產管理系統的系統示意圖。 圖2是依照本發明的一實施例的一種生產管理的部分流程示意圖。 圖3是依照本發明的一實施例的一種生產管理的結果示意圖。 圖4是依照本發明的一實施例的一種生產管理的部分流程示意圖。 FIG. 1 is a system schematic diagram of a production management system according to an embodiment of the present invention. FIG. 2 is a partial process schematic diagram of a production management according to an embodiment of the present invention. FIG. 3 is a result schematic diagram of a production management according to an embodiment of the present invention. FIG. 4 is a partial process schematic diagram of a production management according to an embodiment of the present invention.
S11、S12、S13、S14:步驟 S11, S12, S13, S14: Steps
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| US5751580A (en) * | 1996-07-26 | 1998-05-12 | Chartered Semiconductor Manufacturing, Ltd. | Fuzzy logic method and system for adjustment of priority rating of work in process in a production line |
| TWI521628B (en) * | 2010-01-12 | 2016-02-11 | 荏原製作所股份有限公司 | Scheduler, substrate processing apparatus, and substrate transfer method of substrate processing apparatus |
| CN117291402A (en) * | 2023-11-24 | 2023-12-26 | 苏州盈数智能科技有限公司 | Production navigation visual display method and system in semiconductor industry |
| CN117332972A (en) * | 2023-10-12 | 2024-01-02 | 英业达(重庆)有限公司 | Raw material complete production management method, system, equipment and storage medium |
-
2024
- 2024-02-01 TW TW113103965A patent/TWI883808B/en active
- 2024-02-26 CN CN202410207786.8A patent/CN120410771A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5751580A (en) * | 1996-07-26 | 1998-05-12 | Chartered Semiconductor Manufacturing, Ltd. | Fuzzy logic method and system for adjustment of priority rating of work in process in a production line |
| TWI521628B (en) * | 2010-01-12 | 2016-02-11 | 荏原製作所股份有限公司 | Scheduler, substrate processing apparatus, and substrate transfer method of substrate processing apparatus |
| CN117332972A (en) * | 2023-10-12 | 2024-01-02 | 英业达(重庆)有限公司 | Raw material complete production management method, system, equipment and storage medium |
| CN117291402A (en) * | 2023-11-24 | 2023-12-26 | 苏州盈数智能科技有限公司 | Production navigation visual display method and system in semiconductor industry |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202533150A (en) | 2025-08-16 |
| CN120410771A (en) | 2025-08-01 |
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